Optical integrated device and method for manufacturing the same

Abstract

The application relates to an optical integrated device and a preparation method thereof. The preparation method of the optical integrated device comprises the following steps: providing a first substrate, and mounting an optical chip on the first substrate, the optical chip being used for emitting a light beam; providing a second substrate, and mounting a modulation chip on the second substrate, the modulation chip being used for modulating the light beam emitted by the optical chip; providing a connecting assembly, the connecting assembly comprising a first connector and a second connector, the first connector and the second connector being matched with each other; fixing the second connector on the second substrate; connecting the first connector and the second connector; adjusting the position of the second substrate relative to the first substrate until the modulation chip and the optical chip achieve optimal optical coupling; and fixing the first connector on the first substrate. The application can greatly reduce the preparation process difficulty of the optical integrated device and improve the production yield of the optical integrated device.

Description

Technical Field

[0001] This application relates to the field of optoelectronic technology, and in particular to an optical integrated device and its fabrication method. Background Technology

[0002] With the development of communication technology, optical integrated devices are widely used. Currently, most optical integrated devices are fabricated by growing structures on the same substrate. That is, the active layer for optical gain and the modulation absorption layer are epitaxially grown separately on the same substrate, thus achieving monolithic integration. For example, when an electro-absorption modulated laser (EML) is integrated from a distributed feedback (DFB) laser and an electro-absorption (EA) modulator, the quantum well structures of the active layer of the DFB laser and the absorption layer of the EA modulator are epitaxially grown separately.

[0003] Separate epitaxy of the optical gain active layer and the modulation absorption layer involves multiple etching and epitaxy processes, which are complex, result in low integration yield, and affect device cost. Summary of the Invention

[0004] Therefore, it is necessary to provide an optical integrated device and its fabrication method.

[0005] A method for fabricating an optical integrated device, comprising:

[0006] A first substrate is provided, and an optical chip is mounted on the first substrate, the optical chip being used to emit a light beam;

[0007] A second substrate is provided, and a modulation chip is mounted on the second substrate, the modulation chip being used to modulate the light beam emitted by the optical chip;

[0008] A connection component is provided, the connection component including a first connector and a second connector, the first connector and the second connector being mated to each other;

[0009] Fix the second connector to the second substrate;

[0010] Connect the first connector to the second connector;

[0011] Adjust the position of the second substrate relative to the first substrate until the modulation chip and the optical chip achieve optimal optical coupling, and then fix the first connector to the first substrate.

[0012] In one embodiment, the optical chip includes a laser chip, and the modulation chip includes an electro-absorption modulator chip, a silicon-based modulator chip, or a micro-ring modulator chip.

[0013] In one embodiment, after providing the first substrate and mounting the optical chip on the first substrate, the method further includes:

[0014] A first lens structure is mounted on the first substrate, and the first lens structure is located on one side of the optical chip.

[0015] In one embodiment, mounting the first lens structure on the first substrate includes:

[0016] Adjust the position of the first lens structure relative to the optical chip;

[0017] The first lens structure is mounted on the first substrate.

[0018] In one embodiment, before securing the second connector to the second substrate, the method further includes:

[0019] The second connector is connected and assembled with the second lens structure.

[0020] In one embodiment, after assembling the second connector with the second lens structure, the method further includes:

[0021] The external collimated beam is focused and coupled to the modulation chip through the second lens structure;

[0022] Adjust the position of the second lens structure relative to the modulation chip until the modulation chip achieves optimal coupling with the external collimated beam.

[0023] In one embodiment, focusing and coupling the external collimated beam through the second lens structure to the modulation chip includes:

[0024] A fiber optic collimator assembly is provided, the fiber optic collimator assembly including a third connector that is mated with a second connector;

[0025] Connect the third connector to the second connector;

[0026] The external collimated beam is emitted through the fiber collimator assembly.

[0027] An optical integrated device, comprising:

[0028] A first substrate, on which an optical chip is mounted, the optical chip being used to emit a light beam;

[0029] A second substrate is provided, on which a modulation chip is mounted, the modulation chip being used to modulate the light beam emitted by the optical chip;

[0030] A connection assembly, comprising a first connector and a second connector, wherein the first connector and the second connector are mated to each other, the second connector is fixed to the second substrate, and the first connector is fixed to the first substrate.

[0031] In one embodiment, the optical integrated device further includes a first lens structure located on the first substrate and on the side of the optical chip closer to the modulation chip.

[0032] In one embodiment, the optical integrated device further includes a second lens structure located on the second substrate and on the side of the modulation chip closer to the optical chip.

[0033] In one embodiment, the second lens structure is assembled onto the second connector.

[0034] In one embodiment,

[0035] The first connector includes a first guide pin and a first guide hole;

[0036] The second connector includes a second guide pin and a second guide hole;

[0037] The first guide pin is provided corresponding to the second guide hole, and the second guide pin is provided corresponding to the first guide hole.

[0038] In one embodiment, the optical integrated device further includes a heat dissipation assembly, which includes a first heat sink and a second heat sink. The first heat sink is connected to the side of the first substrate where the optical chip is not mounted, and the second heat sink is connected to the side of the second substrate where the modulation chip is not mounted.

[0039] The aforementioned optical integrated device and its fabrication method involve mounting the optical chip and modulation chip on separate substrates, and then connecting them via a first connector and a second connector in a connecting assembly. The high-quality mating of the outer surfaces of the first and second connectors ensures that the beam directions on both sides are consistent. Simultaneously, this effectively avoids the need to separately epitaxially generate the optical gain active layer and modulation absorption layer on the same substrate (i.e., a monolithic wafer), thus mitigating the reliability risks associated with multiple epitaxial production processes in monolithic integration. Furthermore, the optical chip and modulation chip are formed independently, allowing for independent parameter optimization and process fabrication, significantly reducing manufacturing complexity and improving the production yield of the optical integrated device. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a flowchart of a method for fabricating an optical integrated device provided in one embodiment;

[0042] Figures 2 to 8 This is a cross-sectional structural diagram of the fabrication process of the optical integrated device provided in one embodiment;

[0043] Figure 9 This is a schematic cross-sectional view of an optical integrated device provided in one embodiment;

[0044] Figure 10 This is a cross-sectional structural diagram of an optical integrated device provided in another embodiment. Detailed Implementation

[0045] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0047] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this application, the first element, part, region, layer, doping type, or portion discussed below may be referred to as a second element, part, region, layer, or portion.

[0048] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0049] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0050] In one embodiment, see Figure 1 A method for fabricating an optical integrated device is provided, comprising:

[0051] Step S100: A first substrate 100 is provided, and an optical chip 200 is mounted on the first substrate 100. The optical chip 200 is used to emit a light beam. (See also...) Figure 2 ;

[0052] Step S300: A second substrate 300 is provided, and a modulation chip 400 is mounted on the second substrate 300. The modulation chip 400 is used to modulate the light beam emitted by the optical chip 200. Please refer to [link to relevant documentation]. Figure 4 ;

[0053] Step S400: A connection component 500 is provided, comprising a first connector 510 and a second connector 520, which are mated to each other. (See also...) Figure 5 ;

[0054] Step S800: Fix the second connector 520 to the second substrate 300. (See also...) Figure 7 ;

[0055] Step S900: Connect the first connector 510 to the second connector 520. Please refer to [link / reference]. Figure 8 ;

[0056] Step S1000: Adjust the position of the second substrate 300 relative to the first substrate 100 until the modulation chip 200 and the optical chip 100 achieve optimal optical coupling, and fix the first connector 510 to the first substrate 100. Please refer to [link to relevant documentation]. Figure 9 .

[0057] In step S100, the first substrate 100 is the carrier substrate of the optical chip 200, and it can be a heat sink or other substrate material. Specifically, the optical chip 200 can be mounted on the first substrate 100.

[0058] In addition to the optical chip, other chips and / or other circuit structures may also be provided on the substrate 100. The optical chip 200 can be electrically connected to the relevant circuits of the first substrate 100 by gold wire bonding, so that the circuits can supply power to the optical chip 200.

[0059] As an example, optical chip 200 may include a laser chip. More specifically, optical chip 200 may include a distributed feedback (DFB) laser chip, etc.

[0060] In step S300, the second substrate 300 serves as the carrier substrate for the modulation chip 400. It can be made of the same material as the first substrate or a different material. Specifically, the modulation chip 400 can be mounted on top of the first substrate.

[0061] In addition to the modulation chip 400, other chips and / or other circuit structures may also be provided on the second substrate 300. The modulation chip 400 can be electrically connected to the relevant circuits of the second substrate 200 by gold wire bonding, so that the second substrate 200 applies reverse bias and high-frequency modulation signals to the modulation chip 400, thereby modulating the light output by the optical chip 200 at high speed.

[0062] As an example, modulation chip 400 may include an electro-absorption modulator chip. Of course, modulation chip 400 is not limited to an electro-absorption modulator chip; it may also include a silicon-based modulator chip or a micro-ring modulator chip, etc.

[0063] In step S400, the first connector 510 and the second connector 520 of the connecting assembly 500 may be provided with mutually cooperating positioning structures, so that the two can be detachably connected.

[0064] As an example, the first connector 510 and the second connector 520 may be provided with mutually cooperating guide pins and guide holes, so as to achieve a detachable connection through the cooperation of the guide pins and guide holes.

[0065] In step S800, the second connector 520 can be fixed to the second substrate 300 by means of adhesive bonding, laser welding, eutectic bonding, etc.

[0066] In step S900, the first connector 510 and the second connector 520 can be connected by their mutually cooperating positioning structures (such as guide pins and guide holes).

[0067] In step S1000, the direction from the optical chip 100 toward the adjustment chip 400 can be set as the z-axis direction, and the two directions perpendicular to the z-axis are the x-axis direction and the y-axis direction, with the y-axis direction perpendicular to the upper surface of the substrate.

[0068] At this time, the first substrate 100 and its structural components can be fixed in place, while the position of the second substrate 300 and its structural components can be adjusted in the x, y, and z directions by a high-precision mounting device, thereby adjusting the distance and spatial angle between the first substrate 100 and its structural components and the second substrate 300 and its structural components.

[0069] Of course, in some embodiments, the second substrate 300 and its structural components can be fixed in place, while the positions of the first substrate 100 and its structural components are adjusted in the x, y, and z directions using a high-precision mounting device, thereby adjusting the distance and spatial angle between the first substrate 100 and its structural components and the second substrate 300 and its structural components. This application does not limit this.

[0070] Furthermore, during the adjustment of the position of the second substrate 300 relative to the first substrate 100, the optical power emitted from the optical chip 200 on the first substrate 100 to the modulation chip 400 on the second substrate 300 can be monitored simultaneously.

[0071] When the optical power emitted from the optical chip 200 on the first substrate 100 to the modulation chip 400 on the second substrate 300 is at its maximum, the modulation chip 400 and the optical chip 200 achieve optimal optical coupling. At this time, the first connector 510 can be fixed to the first substrate 100 by means of adhesive bonding, laser welding, eutectic bonding, etc., thereby forming an optical integrated device.

[0072] Therefore, in the fabrication process of optical integrated devices, the second connector 520 serves both as a connector and as a coupling alignment tool.

[0073] In this embodiment, the optical chip 100 and the modulation chip 400 are mounted on different substrates and then connected via the first connector 510 and the second connector 520 of the connecting assembly 500. The high-quality mating of the outer surfaces of the first connector 510 and the second connector 520 ensures that the beam directions on both sides are consistent. Simultaneously, this effectively avoids the separate epitaxial formation of the optical gain active layer and the modulation absorption layer on the same substrate (i.e., a single wafer), thus avoiding the reliability risks associated with multiple epitaxial production in monolithic integration. Furthermore, since the optical chip 100 and the modulation chip 400 are formed independently, they can be optimized for parameters and processes independently, significantly reducing process complexity and improving the production yield of optical integrated devices.

[0074] In one embodiment, after step S100, the method further includes:

[0075] Step S200: A first lens structure 600 is mounted on the substrate 100. The first lens structure 600 is located on one side of the optical chip 200. (See also...) Figure 3 .

[0076] The first lens structure 600 is located on one side of the optical chip 200, thereby enabling collimation and beam expansion of the small-mode field beam emitted by the optical chip 200. The first lens structure 600 can be a micro-optical lens.

[0077] For example, please refer to Figure 3 The first substrate 100 may include a first mounting portion 110 and a second mounting portion 120 that are connected to each other. The thickness of the first mounting portion 110 may be greater than the thickness of the second mounting portion 120, thereby creating a step between them.

[0078] The thinner optical chip 200 can be mounted on the thicker first mounting portion 110, and its light emission direction can be controlled along the direction from the first mounting portion 110 to the second mounting portion 120. The thicker first lens structure 600 can be mounted on the thinner second mounting portion 120. In this case, since the thickness of the first mounting portion 110 is greater than that of the second mounting portion 120, it is advantageous for the optical chip 200 on the first mounting portion 110 to emit light towards the central portion of the first lens structure 600, thereby facilitating effective collimation and beam expansion of the small-mode-field beam emitted by the first lens structure 600.

[0079] Of course, the shape of the substrate 100 is not limited to this and can be set according to the actual situation.

[0080] In this embodiment, the small-mode field beam emitted by the optical chip 200 can be collimated and expanded by the first lens structure 600, so that the small-mode field is converted into a large-mode field, thereby effectively reducing the accuracy of the alignment and coupling between the optical chip 200 and the modulation chip.

[0081] Of course, in other embodiments, the small-mode beam emitted by the optical chip 200 can also be collimated and expanded in other ways, and this application does not limit this.

[0082] In one embodiment, step S200 includes:

[0083] Step S210: Adjust the distance between the first lens structure 600 and the optical chip 200;

[0084] Step S220: The first lens structure 600 is mounted on the first substrate 100.

[0085] In step S210, specifically, as an example, when the direction from the optical chip toward the adjustment chip 400 is set as the z-axis direction, and the two directions perpendicular to the z-axis are the x-axis direction and the y-axis direction, with the y-axis direction being perpendicular to the upper surface of the substrate, the position of the first lens structure 600 in the z-axis and x-axis directions can be adjusted by relevant instruments and equipment, so that the light beam emitted by the optical chip 200 can form a light beam with high collimation after passing through the first lens structure 600, thereby facilitating effective optical coupling with the optical fiber.

[0086] It is understandable that the position of the first lens structure 600 in the y-axis direction can be reasonably controlled through manufacturing processes.

[0087] In step S220, the first lens structure 600, after being positioned, is mounted on the first substrate 100.

[0088] In one embodiment, prior to step S800, the method further includes:

[0089] Step S500: Connect and assemble the second connector 520 with the second lens structure 700. Please refer to [link / reference]. Figure 6 .

[0090] Specifically, the second lens structure 700 can be integrated and mounted on the second connector 520 via a precision patch. The second lens structure 700 can be a micro-optical lens.

[0091] In this embodiment, the second lens structure 700 has a collimation and beam expansion function, which can realize the conversion between large mode field and small mode field, thereby greatly reducing the accuracy requirements for the alignment and coupling of the optical chip 200 and the adjustment chip 400.

[0092] Meanwhile, the second lens structure 700 is assembled on the second connector 520, so that it can be fixed to the second substrate 300 at the same time as the second connector 520, thereby simplifying the process.

[0093] Of course, in other embodiments, the second lens structure 700 and the second connector 520 may also be fixed at different positions on the second substrate 300, and this application does not limit this.

[0094] Specifically, in some embodiments, during the fabrication of optical integrated devices, a light beam can be emitted through an optical chip 200, and then the light beam emitted by the optical chip 200 can be collimated and expanded through a first lens structure 600 to achieve the conversion of a small mode field to a large mode field. Then, the large mode field light beam can be converted into a small mode field light beam through a second lens structure 700 and emitted to the waveguide of the adjustment chip 400.

[0095] In one embodiment, after step S500, the method further includes:

[0096] In step S600, the external collimated beam is focused and coupled to the modulation chip 400 through the second lens structure 700;

[0097] Step S700: Adjust the position of the second lens structure 700 relative to the modulation chip 400 until the modulation chip 400 achieves optimal coupling with the external collimated beam.

[0098] In step S600, the external collimated beam can be coupled from one side of the second lens structure 700 through the second lens structure 700 to the waveguide of the modulation chip 400 located on the other side of the second lens structure 700.

[0099] In step S700, it can be understood that since the second lens structure 700 is assembled on the second connector 520, the position of the second lens structure 700 relative to the modulation chip 400 is adjusted, that is, the position of the second connector 520 relative to the modulation chip 400 is modulated.

[0100] Specifically, as an example, when the direction from the optical chip 200 toward the adjustment chip 400 is set as the z-axis direction, and the two directions perpendicular to the z-axis are the x-axis direction and the y-axis direction, with the y-axis direction being perpendicular to the upper surface of the substrate, the position of the second lens structure 700 in the z-axis and x-axis directions can be adjusted by relevant instruments and equipment, thereby facilitating effective optical coupling between the modulation chip 400 and the optical chip 200.

[0101] It is understandable that the position of the second lens structure 700 in the y-axis direction can be reasonably controlled through manufacturing processes.

[0102] At this time, in step S800, the second lens structure 700, which has been positioned and adjusted, is fixed to the second substrate 300 along with the second connector 520.

[0103] In one embodiment, see Figure 6 Step S600 includes:

[0104] Step S610: Provide fiber optic collimator assembly 800, which includes a third connector 810 that is mated with the second connector 520.

[0105] Step S620: Connect the third connector 810 to the second connector 520;

[0106] In step S630, an external collimated beam is emitted through the fiber optic collimator assembly 800.

[0107] In step S610, the third connector 810 may have a positioning structure (such as a guide pin and a guide hole) that cooperates with the second connector 520, so that the two can be detachably connected.

[0108] In step S620, the third connector 810 and the second connector 520 are connected by a positioning structure that allows them to cooperate with each other.

[0109] In step S630, the external collimated beam can be emitted by the fiber collimator assembly 800 into the waveguide of the modulation chip 400 on the other side of the second lens structure 700.

[0110] Then, in step S700, the fiber optic collimator assembly 800 is used to move the position of the second connector 520 where the second lens structure 700 is located, thereby adjusting the position of the second lens structure 700 relative to the modulation chip 400 until the modulation chip 400 achieves optimal coupling with the external collimated beam.

[0111] In step S800, the second lens structure 700 is fixed to the second substrate 300 along with the second connector 520. Then, the second connector 520 and the third connector 810 are detached, thereby removing the fiber optic collimator assembly 800.

[0112] In this embodiment, by providing a third connector 810 (which matches the second connector 520) in the fiber optic collimator assembly 800, the fiber optic collimator assembly 800 can stably and reliably emit an external collimated beam when the third connector 810 is connected to the second connector 520.

[0113] In one embodiment, see Figure 5 The first connector 510 includes a first guide pin 511 and a first guide hole 512. The second connector 520 includes a second guide pin 521 and a second guide hole 522.

[0114] The first guide pin 511 is correspondingly provided with the second guide hole 522, so that they can cooperate with each other to connect the first connector 510 and the second connector 520. At the same time, the second guide pin 521 is correspondingly provided with the first guide hole 512, so that they can cooperate with each other to connect the first connector 510 and the second connector 520.

[0115] In this embodiment, both the first connector 510 and the second connector 520 have guide pins and guide holes, which makes the connection between the two more stable.

[0116] Specifically, the first connector 510 may also include a first light-transmitting portion 513. The first light-transmitting portion 513 is located in the center of the second connector 520, so that when the first connector 510 is fixed to the first substrate 100, the light from the optical chip 200 can pass through the first light-transmitting portion 513.

[0117] Similarly, the second connector 520 may also include a second light-transmitting portion 523. The second light-transmitting portion 523 is located in the center of the second connector 520, so that when the second connector 520 is fixed to the second substrate 300, the second light-transmitting portion 523 is opposite to the modulation chip 400, allowing light to pass through.

[0118] It is understood that the specific form of the first connector 510 is not limited to this. For example, the first connector 510 may only have a guide pin, while the second connector 520 may only have a guide hole that mates with it.

[0119] It should be understood that, although Figure 1The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 1 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0120] In one embodiment, an optical integrated device is also provided; please refer to [link to relevant documentation]. Figure 9 It includes: a first substrate 100, an optical chip 200, a second substrate 300, a modulation chip 400, and a connection component 500.

[0121] An optical chip 200 is mounted on the first substrate 100. The optical chip 200 is used to emit a light beam.

[0122] A modulation chip 400 is mounted on the second substrate 300. The modulation chip 400 is used to modulate the light beam emitted by the optical chip 200.

[0123] The connection component 500 includes a first connector 510 and a second connector 520, which are mated to each other. The second connector 520 is fixed to the second substrate 300, and the first connector 510 is fixed to the first substrate 100.

[0124] In one embodiment, the optical integrated device further includes a first lens structure 600. The first lens structure 600 is located on the first substrate 100 and on the side of the optical chip 200 closer to the modulation chip 400.

[0125] In one embodiment, the optical integrated device further includes a second lens structure 700. The second lens structure 700 is located on the second substrate 300 and on the side of the modulation chip closer to the optical chip 200.

[0126] In one embodiment, the first connector 510 includes a first guide pin 511 and a first guide hole 512. The second connector 520 includes a second guide pin 521 and a second guide hole 522.

[0127] The first guide pin 511 is correspondingly set with the second guide hole 522, and the second guide pin 521 is correspondingly set with the first guide hole 512.

[0128] In one embodiment, see Figure 10The optical integrated device also includes a heat dissipation assembly 900. The heat dissipation assembly 900 includes a first heat sink 910 and a second heat sink 920. The first heat sink 910 is connected to the side of the first substrate 100 where the optical chip 200 is not mounted. The second heat sink 920 is connected to the side of the second substrate 300 where the modulation chip 400 is not mounted.

[0129] The first heat sink 910 and the second heat sink 920 can effectively dissipate heat from the optical integrated device. Specifically, the first heat sink 910 and the second heat sink 920 can be made of metal, and the materials of the two can be the same or different; there is no restriction on this.

[0130] Meanwhile, the first heat sink 910 can be mounted on the first substrate 100 before components such as the optical chip 200 are mounted on it, or it can be mounted on the first substrate 100 after components such as the optical chip 200 are mounted on it. The second heat sink 920 can be mounted on the second substrate 300 before components such as the modulation chip 400 are mounted on it, or it can be mounted on the second substrate 300 after components such as the modulation chip 400 are mounted on it.

[0131] For specific limitations regarding optical integrated devices, please refer to the limitations on the fabrication methods of optical integrated devices mentioned above, which will not be elaborated further here.

[0132] In the description of this specification, references to terms such as "one embodiment," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0133] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0134] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for fabricating an optical integrated device, characterized in that, include: A first substrate is provided, and an optical chip is mounted on the first substrate, the optical chip being used to emit a light beam; A second substrate is provided, and a modulation chip is mounted on the second substrate, the modulation chip being used to modulate the light beam emitted by the optical chip; A connection component is provided, the connection component including a first connector and a second connector, the first connector and the second connector being mated to each other; Fix the second connector to the second substrate; Connect the first connector to the second connector, wherein the first connector and the second connector are mated and connected to the guide hole via guide pins; Adjust the position of the second substrate relative to the first substrate until the modulation chip and the optical chip achieve optimal optical coupling, and then fix the first connector to the first substrate.

2. The method for fabricating an optical integrated device according to claim 1, characterized in that, The optical chip includes a laser chip, and the modulation chip includes an electro-absorption modulator chip, a silicon-based modulator chip, or a micro-ring modulator chip.

3. The method for fabricating an optical integrated device according to claim 1, characterized in that, After providing the first substrate and mounting the optical chip on the first substrate, the method further includes: A first lens structure is mounted on the first substrate, and the first lens structure is located on one side of the optical chip.

4. The method for fabricating an optical integrated device according to claim 3, characterized in that, The mounting of the first lens structure on the first substrate includes: Adjust the position of the first lens structure relative to the optical chip; The first lens structure is mounted on the first substrate.

5. The method for fabricating an optical integrated device according to claim 1, characterized in that, Before fixing the second connector to the second substrate, the method further includes: The second connector is connected and assembled with the second lens structure.

6. The method for fabricating an optical integrated device according to claim 5, characterized in that, After assembling the second connector with the second lens structure, the process further includes: The external collimated beam is focused and coupled to the modulation chip through the second lens structure; Adjust the position of the second lens structure relative to the modulation chip until the modulation chip achieves optimal coupling with the external collimated beam.

7. The method for fabricating an optical integrated device according to claim 6, characterized in that, The step of focusing and coupling the external collimated beam through the second lens structure to the modulation chip includes: A fiber optic collimator assembly is provided, the fiber optic collimator assembly including a third connector that is mated with a second connector; Connect the third connector to the second connector; The external collimated beam is emitted through the fiber collimator assembly.

8. An optical integrated device, characterized in that, include: A first substrate, on which an optical chip is mounted, the optical chip being used to emit a light beam; A second substrate is provided, on which a modulation chip is mounted, the modulation chip being used to modulate the light beam emitted by the optical chip; A connecting component, comprising a first connector and a second connector, wherein the first connector and the second connector are mated to each other, the second connector is fixed to the second substrate, the first connector is fixed to the first substrate, and the first connector and the second connector are mated and connected to a guide hole via a guide pin.

9. The optical integrated device according to claim 8, characterized in that, The optical integrated device further includes a first lens structure, which is located on the first substrate and on the side of the optical chip closer to the modulation chip.

10. The optical integrated device according to claim 8, characterized in that, The optical integrated device further includes a second lens structure, which is located on the second substrate and on the side of the modulation chip closer to the optical chip.

11. The optical integrated device according to claim 10, characterized in that, The second lens structure is assembled onto the second connector.

12. The optical integrated device according to claim 8, characterized in that, The first connector includes a first guide pin and a first guide hole; The second connector includes a second guide pin and a second guide hole; The first guide pin is provided corresponding to the second guide hole, and the second guide pin is provided corresponding to the first guide hole.

13. The optical integrated device according to claim 8, characterized in that, The optical integrated device further includes a heat dissipation component, which includes a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate is connected to the side of the first substrate where the optical chip is not installed, and the second heat dissipation plate is connected to the side of the second substrate where the modulation chip is not installed.

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