Acoustic mesh for electronic devices

Abstract

This disclosure relates to acoustic meshes for electronic devices. An electronic device may include a housing defining an internal volume, an orifice defined by the housing, electronic components disposed within the internal volume and blocking the orifice, and a mesh component disposed abutting against the electronic components. One example of an electronic device may include a housing defining an internal volume, a port defined by the housing, a speaker module disposed within the internal volume and oriented to allow airflow through the port, and an acoustically transparent mesh covering the port. The mesh may include a protrusion extending at least partially through the port and a flange extending from the protrusion, the flange being fixed against an inner surface of the housing.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 261,147, filed September 13, 2021, entitled “ACOUSTIC MESH FOR ELECTRONIC DEVICES,” the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The described implementation scheme relates generally to electronic devices and their components. More specifically, this implementation scheme relates to mesh components and assemblies of electronic devices. Background Technology

[0004] Many electronic devices include internal components that communicate, interact, or communicate with the external environment in some way. These internal components often do so through one or more openings or ports formed in the housing of the electronic device. To protect the internal components from debris such as dust and water entering these openings or ports, one or more mesh components and assemblies can be provided that block the openings or ports to protect the internal components, but still allow the internal components to interact with the external environment through the mesh components when needed.

[0005] However, existing mesh components are often not adequately designed to withstand external forces to protect the mesh or internal components from damage. Furthermore, current mesh designs make it difficult to drain water or other debris that may have entered through the mesh from the external environment from the internal volume of electronic devices. In addition, current mesh designs often lack aesthetically and tactilely pleasing design features. Summary of the Invention

[0006] In a specific example of this disclosure, an electronic device includes a housing defining an internal volume, an opening defined by the housing, an electronic component disposed within the internal volume and blocking the opening, and a mesh component disposed against the electronic component.

[0007] In one example, the electronic device may further include an adhesive disposed between the electronic component and the mesh component. In one example, the electronic component includes a speaker module. In one example, the electronic device further includes a resilient barrier disposed between the mesh component and the inner surface of the housing. In one example, the resilient barrier is disposed against the inner surface of the housing around the periphery of the opening. In one example, the resilient barrier includes a foam material. In one example, the foam material is elastically compressed between the mesh component and the housing. In one example, the electronic device further includes an adhesive disposed between the resilient barrier and the mesh component.

[0008] In another specific example, an electronic device includes a housing defining an internal volume, a port defined by the housing, a speaker module disposed within the internal volume and oriented to allow airflow through the port, and an acoustically transparent mesh covering the port. The mesh may include a protrusion extending at least partially through the port and a flange extending from or along the protrusion, the flange being secured against an inner surface of the housing.

[0009] In one example, the electronic device may further include a support bracket disposed against a flange, such that the flange is disposed between the support bracket and an inner surface. In one example, the support bracket includes a flanged support flange against a mesh and a compliant mechanism that pushes the mesh against the inner surface. In one example, the compliant mechanism includes a resilient protrusion that presses against a speaker module. In one example, the resilient protrusion extends outward and away from the support flange. In one example, the electronic device further includes an adhesive layer disposed between the flange and the inner surface of the housing. The adhesive layer secures the flange to the inner surface of the housing. In one example, the protrusion defines an outer surface flush with the outer surface of the housing.

[0010] In another example of this disclosure, an electronic device may include a housing defining an opening, a mesh member blocking the opening, and an elastic member disposed against the mesh member and biased toward an inner surface of the housing.

[0011] In one example, the mesh component is disposed between the elastic member and the housing. In another example, the elastic member is disposed between the mesh component and the housing. In some examples, the electronic device may also include internal electronic components. In such examples, the mesh component may be disposed between the internal electronic components and the elastic member. In one example, the mesh component may be disposed directly against the internal electronic components, and the elastic member may be elastically compressed between the housing and the mesh component. Attached Figure Description

[0012] This disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar structural elements, and wherein:

[0013] Figure 1A A perspective view showing an example of an electronic device;

[0014] Figure 1B A top perspective view of a portion of it is shown;

[0015] Figure 1C A bottom perspective view of a portion of it is shown;

[0016] Figure 1D Its exploded diagram is shown;

[0017] Figure 2A A perspective view of the casing of the electronic device is shown;

[0018] Figure 2B Its cross-sectional view is shown;

[0019] Figure 2C A partial exploded view is shown;

[0020] Figure 2D Another partial exploded view is shown;

[0021] Figure 2E A partial sectional view is shown;

[0022] Figure 3 A top plan view of an example of a mesh component is shown;

[0023] Figure 4A A perspective view of the casing of the electronic device is shown;

[0024] Figure 4B Its cross-sectional view is shown;

[0025] Figure 4C A perspective view of a portion of it is shown;

[0026] Figure 5 An example of a support bracket for a grid component is shown;

[0027] Figure 6 An example of a support bracket for a grid component is shown;

[0028] Figure 7 An example of a support bracket for a grid component is shown;

[0029] Figure 8 An example of a support bracket for a grid component is shown;

[0030] Figure 9A A perspective view of the housing of the electronic component is shown;

[0031] Figure 9B Its cross-sectional view is shown;

[0032] Figure 10A A perspective view of the housing of the electronic components is shown; and

[0033] Figure 10B Its cross-sectional view is shown. Detailed Implementation

[0034] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, it is intended to cover alternative forms, modifications, and equivalents that may be included within the substance and scope of the embodiments defined by the appended claims.

[0035] The following disclosure relates to mesh components and assemblies for electronic devices. In one particular example, an electronic device includes a housing defining an internal volume, an opening defined by the housing, an electronic component disposed within the internal volume and blocking the opening, and a mesh component disposed abutting against the electronic component.

[0036] In another specific example, an electronic device includes a housing defining an internal volume, a port defined by the housing, a speaker module disposed within the internal volume and oriented to allow airflow through the port, and an acoustically transparent mesh covering the port. The mesh may include a protrusion extending at least partially through the port and a flange extending from or along the protrusion, the flange being secured against an inner surface of the housing.

[0037] The mesh components and assemblies described herein offer improved water and debris drainage features compared to existing meshes. The mesh components described herein are also robust, durable, and resistant to damage. Furthermore, the mesh components and assemblies described herein can be uniquely designed, colored, and arranged to form aesthetically pleasing meshes above speakers or other internal components of electronic devices.

[0038] For example, the mesh component described herein may comprise one or more rigid metallic materials, including stainless steel and / or titanium, which minimize or substantially eliminate deflection in the mesh caused by water or debris moving through one or more through-holes in the mesh. Furthermore, for example, when positioned above an internal speaker in an electronic device, the mesh described herein may be constructed of a rigid metal to reduce or substantially eliminate vibrations or deflection that may be caused by air and sound waves generated by the speaker and traveling through the mesh component. Therefore, the rigid construction of the mesh component described herein improves sound quality and water drainage when subjected to high pressure due to water or other debris entering through the mesh from the external environment.

[0039] Additionally, one or more biasing members or support brackets may be disposed against the mesh component described herein to support the mesh component and maintain its correct position within or across the port of the electronic device. For example, a support bracket including a compliant mechanism may generate a reaction force against the mesh component described herein to bias the mesh component toward and against the inner surface of the electronic device's housing. The reaction force of the compliant mechanism of the support bracket resists forces that may act on the mesh component during use, forces that would otherwise cause the mesh component to fall into or toward the internal volume of the device or otherwise fall out of its proper position.

[0040] Furthermore, the mesh component of this disclosure may be formed with raised features or an outer surface that is flush with the outer surface of the electronic device's housing. This flush surface is aesthetically and tactilely pleasing. Additionally, the metallic material of the mesh component described herein may be anodized or have an additive layer formed by a physical vapor deposition method to customize and tune the mesh's color for aesthetic appeal.

[0041] In addition to the advantages described above, the mesh component of this disclosure ensures that internal components can fully interact with the external environment of the electronic device as needed without the risk of damaging the internal components. Such internal components interacting with the external environment may include, but are not limited to, speakers, microphones, pressure sensors, and other sensors. These and other internal components may be positioned adjacent to or aligned below one or more openings / ports of the electronic device, wherein the mesh component blocks the opening / port and is positioned between the opening / port and the internal electronic components. In this way, the mesh component described herein acts as a barrier between the internal components and the external environment, while also enabling the proper operation of the internal components.

[0042] The following text is for reference only. Figures 1A to 10B These embodiments and other embodiments are discussed. However, those skilled in the art will readily understand that the detailed descriptions given herein with respect to the accompanying drawings are for illustrative purposes only and should not be construed as limiting. Furthermore, as used herein, a system, method, article, component, feature, or sub-feature including at least one of the first, second, or third options should be understood to mean a system, method, article, component, feature, or sub-feature that may include one of each listed option (e.g., only one first option, only one second option, only one third option), multiple of a single listed option (e.g., two or more first options), two options simultaneously (e.g., one first option and one second option), or combinations thereof (e.g., two first options and one second option).

[0043] In this disclosure, a wearable smartwatch is used as an example of an electronic device incorporating the grids, grid components, and grid configurations described herein. This smartwatch is used for illustrative purposes only to show an example specific implementation of the grids and grid configurations of this disclosure; however, the grids, grid components, and grid configurations can be implemented in any number of electronic devices other than the wearable smartwatch, including internal components that interact with the environment outside the device, such as speakers and sensors. Examples of the grids, grid components, and grid configurations disclosed herein can be included in any number of electronic devices, including but not limited to desktop computers, laptop computers, tablets, smartphones, smart speakers, wearable electronic devices such as fitness trackers, smartwatches, head-mounted displays, or other alternating / virtual reality devices.

[0044] Along these lines, Figure 1A An example of electronic device 100 is shown. Figure 1A The electronic device shown is a watch, such as a smartwatch. Figure 1A The smartwatch is merely a representative example of a device that can be used in conjunction with the systems and methods disclosed herein. Electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant (“PDA”), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. Electronic device 100 may be referred to as an electronic device or consumer device. In some examples, electronic device 100 may include a housing 102 that may, for example, carry operating components within an internal volume at least partially defined by the housing. Electronic device 100 may also include a strap 103 or other retaining components that may, if desired, secure device 100 to a user's body. References below. Figure 1B Further details about the electronic device are provided.

[0045] Figure 1B A smartwatch 200 is shown, which may be substantially similar to a device such as electronic device 100 described herein and may include some or all of the features of the device described herein. Device 200 may include a housing 202 and a display assembly 204 attached to the housing. Housing 202 may substantially define at least a portion of the outer surface of device 200.

[0046] Display assembly 204 may include glass, plastic, or any other substantially transparent outer layer, material, part, or component. Display assembly 204 may include multiple layers, each providing a unique function as described herein. Therefore, display assembly 204 may be an interface component or may be part of an interface component. Display assembly 204 may define a front outer surface of device 200, and as described herein, this outer surface may be considered an interface surface. In some examples, the interface surface defined by display assembly 204 may receive input from a user, such as touch input.

[0047] In some examples, housing 202 may be a substantially continuous or integral component and may define one or more openings to receive components of electronic device 200. In some examples, device 200 may include input components, such as one or more buttons 206 and / or crowns 208 that may be disposed in the openings. In some examples, material may be disposed between buttons 206 and / or crowns 208 and housing 202 to provide an airtight and / or waterproof seal at the location of the openings. Housing 202 may also define one or more openings or apertures, such as aperture 210, which may allow sound to enter or exit the internal volume defined by housing 202. For example, aperture 210 may communicate with a microphone component disposed in the internal volume. In some examples, housing 202 may define or include features such as recesses to removably couple housing 202 and strips or retaining components.

[0048] Figure 1C A bottom perspective view of an electronic device 200 is shown. Device 200 may include a rear cover 212, which may be attached to a housing 202, for example, opposite a display assembly 204. The rear cover 212 may include ceramic, plastic, metal, or a combination thereof. In some examples, the rear cover 212 may include at least partially electromagnetically transparent components 214. Electromagnetically transparent components 214 may be transparent to electromagnetic radiation of any desired wavelength, such as visible light, infrared light, radio waves, or combinations thereof. In some examples, electromagnetically transparent components 214 may allow sensors and / or transmitters disposed in the housing 202 to communicate with the external environment. The housing 202, display assembly 204, and rear cover 212 together substantially define the internal volume and external surface of device 200.

[0049] Figure 1D An exploded view of a smartwatch 300 is shown, which may be substantially similar to devices described herein, such as electronic devices 100 and 200, and may include some or all of the features of the devices described herein. Device 300 may include a housing 302, a display assembly 304, and a back cover 312. The housing 302, display assembly 304, and back cover 312 together define the outer surface and internal volume of device 300.

[0050] The housing 302 may be a substantially continuous or integral component and may define one or more openings 316, 338 to receive components of the electronic device 300 and / or provide access to internal portions of the electronic device 300. In some examples, the device 300 may include input components, such as one or more buttons 306 and / or crowns 308 that may be disposed in openings 318, 320. Additionally, at least one example of the housing 302 defines one or more openings 318, 320, 338 that provide access for internal components to the environment outside the device 300 and the housing 302.

[0051] Display assembly 304 may be received by and attached to housing 302. The display assembly may include a cover comprising a transparent material such as plastic, glass, and / or ceramic. Display assembly 304 may also include a display stack or display component that may include multiple layers and components, each performing one or more desired functions. For example, the display stack may include display layer 324, which may include a touch detection layer or component, a pressure-sensitive layer or component, and one or more display layers or components that may include one or more pixels and / or light-emitting portions for displaying visual content and / or information to a user. In some examples, display layer or component 324 may include a liquid crystal display (LCD), a light-emitting diode (LED) display, an organic light-emitting diode (OLED) display, and / or any other form of display. Display layer 324 may also include one or more electrical connectors for providing signals and / or power from other components of device 300 to display layer 324.

[0052] In some examples, device 300 may include a gasket or seal 326 disposed between display assembly 304 and housing 302 to generally define a barrier against liquid or moisture from the external environment entering the internal volume at the location of seal 326. As described herein, seal 326 may include polymer, metallic, and / or ceramic materials. Device 300 may also include a seal 334 disposed between housing 302 and rear cover 312 to generally define a barrier against liquid or moisture from the external environment entering the internal volume at the location of seal 334. As described herein, seal 334 may include polymer, metallic, and / or ceramic materials. Seal 334 may be substantially similar to seal 326 and may include some or all of the features of seal 326.

[0053] Device 300 may also include internal components such as a haptic engine 328, a battery 330, an audio module 336, and a logic board 332 (also referred to as a main logic board 332), which may include a system-in-package (SiP) disposed thereon, the SiP including one or more integrated circuits such as a processor, a sensor, and a memory. The SiP may also include a package.

[0054] In some examples, device 300 may include one or more wireless antennas that are electrically connected to one or more other components of device 300. In some examples, the one or more antennas are capable of receiving and / or transmitting wireless signals at one or more frequencies, and may be one or more of, for example, cellular antennas such as LTE antennas, Wi-Fi antennas, Bluetooth antennas, GPS antennas, multi-frequency antennas, etc. The one or more antennas may be communicatively coupled to one or more additional components of electronic device 300. In some examples, one or more other components of device 300 may include a portion of the antenna, such as its radiating element.

[0055] The internal component may be disposed within an internal volume at least partially defined by the housing 302, and may be attached to the housing 302 via adhesives, inner surfaces, attachment features, threaded connectors, studs, columnar members or other features formed in, defined by or otherwise becoming part of the housing 302 and / or the cover 322 and / or the rear cover 312.

[0056] In addition to Figure 1D In addition to the components and features inside and outside the housing 302 of the illustrated device 300, examples of the device may also include one or more electronic components disposed within an internal volume of the device 300, communicating with the external environment (i.e., the environment outside / outside the housing 302) through one or more openings 318, 320, 338 defined by the housing 302. In one example, such internal electronic components may include one or more sensors that transmit and receive light or other electromagnetic signals through one or more openings 318, 320, 338. In one example, such internal electronic components may include one or more speakers or speaker modules positioned and oriented to move air through one or more openings 318, 320, 338 defined by the housing 302. In at least one example, the openings defined by the housing 302 that allow access to one or more internal electronic components for interaction, communication, or otherwise access to the external environment may be referred to as ports. That is, the openings 318, 320, 338 defined by the housing 302 may be referred to herein as ports.

[0057] Figure 2AAn example of an electronic device housing 402 is shown, wherein the housing defines a port 318. To prevent dirt, dust, water, or other debris from the external environment from entering the internal volume defined by the housing 402, a mesh component 440 may be disposed above or across the port 418. As used herein, the term "mesh" may include a barrier or portion of material that allows air to pass through but prevents or substantially prevents other debris such as water, dirt, and dust from passing through into the internal volume of the device. In one example, the mesh component 440 may include a perforated material. The size, location, and number of perforations extending through such a mesh may vary from example to example. Such perforations may include machined, laser-cut, or otherwise manufactured openings defined by and extending through the material. Such openings may be sized and arranged to prevent particles of a certain size from the external environment from passing through the mesh component 440. Such openings may also be sized to prevent water from passing through the mesh component 440 under certain pressures.

[0058] Some examples of materials that can be perforated to form mesh component 440 and other mesh components described herein include rubber, plastics, and other polymers. Other examples of mesh 440 may include metals such as steel, stainless steel, aluminum, etc. Ceramic may also be used to form mesh component 440 and other meshes described herein. In at least one example, mesh component 440 may be a porous material, allowing air to pass through but preventing or substantially preventing dust and other debris particles from the external environment from passing through mesh component 440 into the internal volume of the device. Some examples of such materials may include foam, knitted fabrics, other textiles, or other porous materials. In one example, mesh component 440 may be formed as a square woven mesh or wire mesh. Other materials may include fibers, such as synthetic monofilament fibers, etc. The density of polymer meshes and other types of meshes (including porous and perforated meshes) can be tuned to resist the ingress of water under high pressure. Generally, the higher the density, the higher the resistance.

[0059] In some examples, Figures 2A to 3 The mesh component 440 shown, as well as other meshes described herein with reference to other figures, can be formed of a metal such as stainless steel. In the example where the mesh component 440 is positioned above a speaker through which moving air passes or above a port 418 adjacent to the speaker, the stainless steel and other metals forming the mesh component 440 can increase the stiffness of the mesh component 440. For example, compared to a polymer mesh or a mesh made of a more flexible material, the stainless steel mesh component 440 may be less prone to flexing and vibration caused by air from the speaker passing through the through-holes 448 of the mesh component 440. The stiffness of the stainless steel mesh component 440, i.e., its resistance to flexing and vibration, prevents the mesh component 440 from acting as an additional diaphragm for the speaker as air moves through it.

[0060] The size and spacing of the through-holes 448 of the mesh component 440 or any other mesh component described herein can be tuned and adjusted to achieve an optimal balance between residual sound transmission and / or air permeability and acting as a barrier against water and debris from the external environment. Generally, it has been found that larger and more densely arranged through-holes result in better water drainage performance of the mesh. However, removing too much material to form the through-holes may potentially weaken the mesh component 440 and reduce its stiffness. Therefore, in at least one example, the size of each through-hole 448 may be at least about 100 micrometers in diameter or between about 100 micrometers and about 500 micrometers, for example, at least about 140 micrometers or at least about 280 micrometers.

[0061] It should be noted that while at least some of the figures described in this application include mesh components with through holes, such as through hole 448, the same principles discussed with reference to through hole 448 (such as the drainage and expulsion of water and debris through the mesh component) can be applied to porous features of non-perforated meshes. For example, woven meshes or porous materials may include features similar to through holes, such as spaces between woven fibers and filaments or pores present in porous materials that allow water and debris to pass through the mesh component. That is, the examples of meshes with through holes are not intended to be limiting. Rather, they are merely exemplary, and the same advantages and principles discussed with reference to the size and spacing of through holes can be applied to the size and spacing of holes and other spaces and features of non-perforated meshes.

[0062] In addition to the material, size, number, and configuration of the through holes described herein, any of the mesh components described herein may include a hydrophobic coating disposed on its outer surface to improve water repulsion and drainage.

[0063] Additionally, a rigid mesh 440 (including a mesh 440 made of metal, such as stainless steel) can more effectively handle high pressures, including those resulting from the device being submerged in water. The rigid metal mesh component 440 remains structurally intact under high pressure without deforming or flexing. Furthermore, the stainless steel mesh component 440 or other rigid metal mesh components 440 improve the drainage of water that may enter through the through-holes 448. That is, because the stainless steel mesh component 440 is less prone to bending and deformation, water passing through the through-holes 448 is more easily broken into smaller droplets, which are more easily expelled by air from the speaker or other movement and forces caused by movement of the device during use.

[0064] In any case, the mesh component 440 (including its through-holes or apertures) allows at least some air to pass through it, such as air moved by the internal speaker, while substantially preventing dust and other debris from the external environment from passing through it. In at least one example, the mesh component 440 is acoustically transparent, allowing sound waves from the speaker in the internal volume of the device to propagate through the mesh component 440 and exit into the external environment.

[0065] The housing 402 includes an outer surface 442 and an inner surface 444, the thickness of which extends between the outer surface 442 and the inner surface 444. In at least one example, the mesh member 440 may be sealed, adhered, or pressed against the inner surface 444 of the housing 402 around the periphery of the port 418. In one example, such as Figure 2B As shown in the close-up view, the mesh component 440 can be positioned to block the port 418, wherein a resilient barrier 446 is disposed between the mesh component 440 and the inner surface 444 of the housing 402. In one example, the resilient barrier 446 is a resilient member disposed around the periphery of the port 418 and elastically compressed between the housing 402 and the mesh component 440. In this way, the resilient barrier 446 can maintain consistent or uninterrupted contact between the mesh component 440 and the housing 402 to effectively seal the space between the mesh component 440 and the inner surface 444 of the housing 402.

[0066] In at least one example, the resilient barrier 446 may comprise a resilient member or material, such as rubber, plastic, or other polymers. In one example, the resilient barrier 446 may comprise a foam material that is elastically compressible and resilient. Other resilient materials may also be used. In at least one example, the resilient barrier 446 is held in place by pressure between the mesh member 440 and the housing 402. In at least one example, the resilient barrier 446 may be attached to the mesh member 440 via an adhesive. The adhesive may comprise glue, pressure-sensitive adhesive, or other adhesives. In at least one example, the resilient barrier 446 may be molded or chemically bonded to the mesh member 440.

[0067] In at least one example, the resilient barrier 446 may be fixed to the housing 402, particularly the inner surface 444 of the housing 402, via an adhesive. The adhesive may include glue, pressure-sensitive adhesive, or other adhesives. In at least one example, the resilient barrier 446 may be molded or chemically bonded to the housing 402.

[0068] Figure 2C It shows Figure 2B An exploded view of an example of the housing 402, the elastic barrier 446, and the mesh component 440. Additionally, Figure 2CThe exploded view illustrates a speaker module 450, which may be disposed below the port 418 defined by the housing 402, and thus below or adjacent to the mesh member 440. In at least one example, the mesh member 440 may be disposed directly abutting or contacting the speaker module 450. For example, the mesh member 440 may be directly adhered to the speaker module 450 via one or more adhesives (including pressure-sensitive adhesives) surrounding the periphery of the mesh member 440 and disposed between the mesh member 440 and the speaker module 450. In at least one example, the mesh member 440 may be welded to, molded to, or bonded to the speaker module 450.

[0069] In at least one example, the speaker module 450 includes a bracket or bracket assembly 452 that abuts against internal components of the electronic device to secure the speaker module 450. For example, the bracket assembly 452 may be attached to a portion of the device's housing, bracket, or other component. In this manner, the speaker module 450, which may include one or more speakers having one or more diaphragms, may be supported against a mesh member 440 and an elastic barrier 446, as described above, with the elastic barrier pressed against the housing 402. Additionally, in at least one example where the mesh member 440 is adhered to the speaker module 450, the mesh member 440 may be adhered around the periphery of the speaker module 450 and the mesh member 440 using an adhesive (such as a pressure-sensitive adhesive) to avoid direct adhesion to any speaker diaphragms or other speaker components. For example, the mesh member 440 may be adhered around the periphery of the speaker diaphragm of the speaker module 450, including other speaker components adhered to the housing or surrounding the diaphragm.

[0070] As described above, the examples shown in the accompanying drawings and described herein may include mesh components including through holes 448, such as mesh component 440, but the mesh components of this disclosure are not limited thereto. For example, Figure 2D It shows Figure 2B The exploded view shows an example of the housing 402, the resilient barrier 446, and the mesh component 440, but the mesh component 440 includes a woven mesh component. The woven mesh component 440 may be disposed directly against the speaker module 450, wherein air travels through the spaces between the individual strands of the woven mesh component 440.

[0071] Figure 2E It shows Figures 2A to 2C The image shows a cross-sectional perspective view of the mesh component 440, housing 402, and speaker module 450 assembly. Figure 2EAs shown, the housing 402, mesh component 440, resilient barrier 446, and speaker module 450 can be stacked and arranged as shown, such that the mesh component 440 blocks the port 418. The through-hole 448 defined by the mesh component 440 allows air moving by the speaker module 450 to pass through the mesh component 440 and exit the port 418. Again, as described above, in the example of a non-perforated mesh component, such as... Figure 2D The woven wire mesh component 440 shown herein, or other porous materials and meshes described elsewhere herein, Figure 2D The through-hole 448 shown may represent a channel provided by the space between woven fibers or filaments or through the pores of a porous material mesh, such as Figure 2D The woven mesh 440 allows air from the speaker module 450 to pass through port 418.

[0072] Moreover, as described above, the speaker module 450 can be secured within the device such that the speaker module 450 is pressed upward against the resilient barrier 446 to elastically compress the resilient barrier 446 against the housing 402. In at least one example, the resilient barrier 446 is not adhered to, bonded to, or otherwise secured to the housing 402. Instead, the resilient barrier 446 is held against the housing in a resiliently compressed configuration due to the upward pressing force exerted on it by the speaker module 450 and the mesh component 440.

[0073] In at least one example, the mesh component 440 is disposed in a plane parallel to the plane on which the upper surface of the speaker module 450 is disposed. That is, the mesh component 440 is parallel to the speaker or speaker diaphragm of the speaker module 450, such that there is no angular mismatch between the mesh component 440 and the speaker of the speaker module. This improves the transmission of speaker sound through the mesh 440 by air and sound waves. Furthermore, as mentioned above, the mesh component 440 may be formed of one or more rigid materials, such as metals, including stainless steel or titanium, which also improves the sound quality produced by the speaker module 450 because the rigid mesh material resists deflection from the movement of sound waves and air through the through-hole 442 compared to smaller rigid materials such as polymers and fiber materials.

[0074] Additionally, using one or more metals to form the mesh component 440, such as stainless steel or titanium, allows for the application of additional metal layers to the mesh component 440, for example, via physical vapor deposition (PVD). This PVD layer can be used to impart a desired color for aesthetic reasons, such as a color matching the casing or other desired colors. In one example, titanium can be used to form the mesh component 440 described herein. The titanium mesh can be anodized to achieve a desired color.

[0075] Although reference Figures 2A to 2ESpeaker module 450 is shown and described herein, but one or more other components are also contemplated herein as being positioned below or adjacent to the mesh component 440 and the port 418 defined by the housing. For example, one or more microphones may be positioned below the mesh component 440. In another example, one or more sensors (including a pressure sensor configured to detect external ambient pressure outside the housing 402) may be associated with speaker module 450 as shown. Figures 2A to 2E The same configuration is shown below the mesh component 440. Generally, electronic devices are housed internally, but any component that interacts with the external environment through one or more ports of the device can be configured as follows: Figures 2A to 2E The speaker module 450 is positioned relative to the mesh component 440 and the elastic barrier 446.

[0076] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figures 2A to 2E Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figures 2A to 2E The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0077] Figure 3 A plan view of another example of a mesh assembly 500 is shown, which includes a mesh member 540 disposed above a speaker module 550 and a resilient barrier 546 disposed above and around at least a portion of the periphery of the mesh member 540. The resilient barrier 546 is pressable against or positioned against an inner surface of the housing of an electronic device, as shown in reference. Figures 2B to 2E The elastic barrier 446 shown is similarly described. Figure 3 The various components shown (including speaker module 550, bracket assembly 552, mesh component 540, and resilient barrier 546) can be connected via a means relative to... Figures 2A to 2E The various components shown and described use adhesive layers and fixing methods (including welding, bonding and molding) that fix one or more similar adhesive layers to each other.

[0078] in addition, Figure 3 An example is shown where the elastic barrier 546 does not extend completely around the entire perimeter of the mesh component 540. Instead, Figure 3 The resilient barrier 546 includes interruptions. Additionally, Figure 3 An additional component 554 is shown, which can be configured to be adjacent to the grid component 540 and fixed against the resilient barrier 546, similar to the grid 554. This additional component 554 may include one or more of another grid, a sensor, a microphone, etc.

[0079] Figure 3 Any feature, component, or part (including its arrangement and configuration) shown may be included individually or in any combination in any other example of the device, feature, component, and part shown in the other figures. Similarly, in Figure 3 The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0080] Figure 4A An example of an electronic device housing 602 is shown, wherein the housing defines a port 618. To prevent dirt, dust, water, or other debris from the external environment from entering the internal volume defined by the housing 602, a mesh member 640 may be disposed above or across the port 618 to cover the port 618. In at least one example, the mesh member 640 extends upward and at least partially into the port 618 defined by the housing 602, such that at least a portion of the mesh member 640 is flush with the outer surface 642 of the housing 602.

[0081] In one example, the mesh component 640 may include a perforated material. The size, location, and number of perforations extending through this mesh may vary from example to example. Such perforations may include openings defined by and extending through the material by machining, laser cutting, or other means. Such openings may be sized and arranged to prevent particles of a certain size from the external environment from passing through the mesh component 640. Such openings may also be sized to prevent water from passing through the mesh component 640 under certain pressures.

[0082] Some examples of materials that can be perforated to form the mesh component 640 described herein include rubber, plastics, and other polymers. Other examples of mesh 640 may include metals such as steel, stainless steel, aluminum, etc. Ceramic may also be used to form mesh component 640 and other meshes described herein. In at least one example, mesh component 640 may be a porous material, allowing air to pass through but preventing or substantially preventing dust and other debris particles from the external environment from passing through mesh component 640 into the internal volume of the device. Some examples of such materials may include foam, knitted fabrics, other textiles, or other porous materials. Other materials may include fibers, such as synthetic monofilament fibers, etc. The density of polymer meshes and other types of meshes (including porous and perforated meshes) can be tuned to resist the ingress of water under high pressure. Generally, the higher the density, the higher the resistance.

[0083] Additionally, using one or more metals to form the mesh component 640, such as stainless steel or titanium, allows for the application of additional metal layers to the mesh component 640, for example, via a PVD method. This PVD layer can be used to impart a desired color for aesthetic reasons, such as a color matching the casing or other desired colors. In one example, titanium can be used to form the mesh component 640 described herein. The titanium mesh can be anodized to achieve a desired color.

[0084] In some examples, Figures 4A to 4C The mesh component 640 shown, as well as other meshes described herein with reference to other figures, can be formed of a metal such as stainless steel. In the example where the mesh component 640 is positioned above a speaker through which moving air passes or above a port 618 adjacent to the speaker, the stainless steel and other metals forming the mesh component 640 can increase the stiffness of the mesh component 640. For example, compared to a polymer mesh or a mesh made of a more flexible material, the stainless steel mesh component 640 may be less prone to flexing and vibration caused by air from the speaker passing through the through-holes 648 of the mesh component 640. The stiffness of the stainless steel mesh component 640, i.e., its resistance to flexing and vibration, prevents the mesh component 440 from acting as an additional diaphragm for the speaker as air moves through it.

[0085] Additionally, a rigid mesh 640 (including a mesh 640 made of metal, such as stainless steel) can more effectively handle high pressures, including those resulting from the device being submerged in water. The rigid metal mesh component 640 remains structurally intact under high pressure without deforming or flexing. Furthermore, the stainless steel mesh component 640 or other rigid metal mesh components 640 improve the drainage of water that may enter through the through-hole 648. That is, because the stainless steel mesh component 640 is less prone to bending and deformation, water passing through the through-hole 648 is more easily broken into smaller droplets, which are more easily expelled by air from the speaker or other movement and forces caused by the movement of the device during use.

[0086] In any case, the mesh component 640 (including its through-holes or apertures) allows at least some air to pass through it, such as air moved by the internal speaker, while substantially preventing dust and other debris from the external environment from passing through it. In at least one example, the mesh component 640 is acoustically transparent, allowing sound waves to propagate from the speaker in the internal volume of the device through the mesh component 640 and exit into the external environment.

[0087] Figure 4B A cross-sectional view is shown of a mesh component 640 located within and / or across port 618 to block or cover port 618. More specifically, as shown... Figure 4BAs shown in the cross-sectional view, one example of the mesh member 640 may include a protrusion 656 defining an outer surface 658 of the mesh member 640. The protrusion 656 may also include a wall 670 extending to a lower flange 660. The protrusion 656 may extend at least partially through the port 618 such that the outer surface 642 of the housing 602 is flush with the outer surface 658 of the protrusion 656. In this way, the protrusion 656 forms a continuous surface extending across the port 618, including the outer surface 658 of the mesh member 640 and the outer surface 658 of the protrusion 656 of the mesh member 640. One or more through holes 648 may extend through the protrusion 656 of the mesh member 640, as shown.

[0088] In at least one example, the mesh member 640 further includes a lower flange 660 extending radially outward from and circumferentially around the protrusion 656. The flange 660 may be connected to the protrusion 656 via a sidewall 662 of the mesh member 640. The sidewall 662 of the mesh member 640 may extend at least partially from the internal volume of the device, wherein the sidewall 662 intersects the flange 660 and extends upward into the port 618 defined by the housing 602 and extends through the thickness of the housing 602 from its outer surface 642 to its inner surface 644. In this way, in at least one example, the protrusion 656 of the mesh member 640 may be located at or near the outer surface 642 of the housing 602, such that the outer surface 658 of the protrusion 656 of the mesh member 640 is substantially flush with the outer surface 642 of the housing 602.

[0089] In another example, the outer surface 658 of the protrusion 656 of the mesh component 640 may be recessed from the outer surface 642 of the housing 602, such that the outer surface 658 of the protrusion 656 of the mesh component 640 is set lower than the outer surface 642 of the housing 602. In this way, the mesh component 640 is less likely to be contacted or damaged when in contact with external objects, such as during a device drop event.

[0090] In at least one example, the flange 660 of the mesh component 640 may be circumferentially adjacent to the port 618 and fixed to the inner surface 644 around the port. In at least one example, as Figure 4B As shown, an adhesive material or layer 664 may be disposed between the flange 660 and the housing 602, as illustrated, to secure the mesh component 640 to the housing 602. The adhesive layer 664 may include one or more of the adhesives described elsewhere herein, including pressure-sensitive adhesive materials and glues or other adhesives.

[0091] In at least one example, in addition to or instead of adhesive layer 664 securing mesh component 640 to housing 602, support bracket 666 may be pressed upwards against mesh component 640 to secure mesh component 640 against housing 602. For example, adhesive layer 664 may include an adhesive used during manufacturing to aid assembly of mesh component 640 and housing 602, but it may not be suitable for supporting mesh component 640 against the inner surface 644 of housing 602 during use, for example, if the device is dropped and / or mesh component 640 is pressed inwards during contact and use. Therefore, support bracket 666 may be used to stabilize and support mesh component 640 in place during use during drops, contact, or any other forces pressing against the outer surface 658 of mesh component 640. In at least one example, adhesive layer 664 is absent, and mesh component 640 is secured solely by support bracket 666. Figure 4B As shown, it is fixed in the appropriate position.

[0092] In at least one example, the support bracket 666 includes an outwardly extending support flange 668 configured to press against the flange 660 of the mesh member 640, such as Figure 4B As shown. In at least one example, the support bracket 666 may further include an upwardly extending wall 670 that extends parallel to or adjacent to the sidewall 662 of the grid member 640 to ensure proper placement and support between the support bracket 666 and the grid member 640. In at least one example, the support bracket 666 is held fixed to the grid member 640 by friction between the support flange 668 and the flange 660 of the grid member 640 caused by the normal force generated by the upward force or compression of the support bracket 666 toward the grid member 640.

[0093] In at least one example, one or more adhesive layers may be disposed between the support flange 668 and the flange 660 of the mesh component 640 to secure the support bracket 666 to the mesh component 640. In at least one example, the support flange 668 and the flange 660 of the mesh component 640 may be molded together, welded together, or otherwise secured together.

[0094] In any case, the support bracket 666 may include one or more features or components that press against one or more other components or housings within the internal volume of the device to generate a reaction force against the mesh component 640. Figure 4C An example is a mesh component 640 disposed on top of a support bracket 666, which includes a support flange 668 and one or more compliance mechanisms 672 that cause the support bracket 666 to press against one or more other components or housings within the internal volume of the device to generate a reaction force against the mesh component 640. Various examples of compliance mechanisms described herein (including...) Figure 4BThe compliant mechanism 672 shown may include one or more resilient members or resilient configurations capable of elastically compressing and biasing toward the inner surface 644 of the housing 602. In at least one example, the component pressed against by the compliant mechanism 672 may include a speaker module, such as those described herein. Additionally, the compliant mechanism may serve as a tolerance gap filling feature, allowing for precise positioning and assembly of the mesh 640 and other associated components.

[0095] exist Figure 4C In the example, the mesh component 640 can be similar to Figure 4B The illustrated mesh member 640 includes a sidewall 662 extending between a flange 660 and a protrusion 656 defining an outer surface 658 of the mesh member 640. In at least one example, the compliance mechanism 672 may include one or more biasing protrusions that are elastically deformable upon pressing against another component or surface within the device to bias the support bracket 666 against the mesh member 640 as described above. In particular, in Figure 4C In the illustrated example, the compliance mechanism 672 may be attached to the support bracket 666 or its support flange 668 to abut against the flange 660 of the mesh member 640 and offset the support flange 668 upwards, as shown in the figure. Figure 4B As shown. In at least one example, flange 660 may press against or contact another component, such as a speaker module or other internal components of the device described herein.

[0096] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figures 4A to 4C Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figures 4A to 4C The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0097] Figure 5 Another example of a support bracket 766 is shown, which includes a support flange 768 extending radially outward from and circumferentially around a wall 770. In at least one example, the support flange 768 can be used to press against or bias against another component, such as a speaker module, microphone module, or other housing component or surface within the device, to generate upward pressure on the flange of the mesh or mesh, as described above. In this way, the support flange 768 itself can be a compliant mechanism that upwardly biases adjacent meshes against the inner surface of the housing of the device as described above. Additionally, the support flange 768 can act as a tolerance gap filling feature during assembly.

[0098] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figure 5 Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figure 5 The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0099] Figure 6 Another example of a support bracket 866, including a wall 870 and a support flange 868, is shown, similar to other support brackets described herein. Additionally, Figure 6 The example of the support bracket 866 shown includes a compliance mechanism 870 for pressing against another component or surface within the device against a grid-biased support flange 868, as described above. In at least one example, the compliance mechanism 870 may include a base portion 876 connected to the support flange 868 of the support bracket 866 via one or more bias connectors 874. The bias connectors 874 are resiliently deformable and secure the base portion 876 of the compliance mechanism 870 to the support flange 868 to bias the support flange 868 upwards or away from the base portion 876. As discussed above, the base portion 876 may be configured to contact or press against another surface or component within the electronic device.

[0100] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figure 6 Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figure 6 The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0101] Figure 7 Another example of a support bracket 966, including a support flange 968 and a wall 970, is shown, similar to other support brackets described herein. The illustrated example of the support bracket 966 may have a compliant mechanism including one or more offset protrusions 978 extending downwardly from the support flange 968 at an angle. Figure 7 In the exemplary example, the bias protrusion 978 is elastically deformable, wherein the bias protrusion 978 intersects with or extends from the support flange 968, such that when pressed against another surface or component within the electronic device, the bias protrusion 978 forces or biases the support flange 968 away from the other surface or component and abuts against the mesh or the flange of the mesh, as discussed above with reference to other support brackets and meshes.

[0102] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figure 7Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figure 7 The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0103] Figure 8 Another example of a support bracket 1066, including a support flange 1068 and a wall 1070, is shown, similar to other support brackets described herein. The illustrated example of support bracket 1066 may have a compliant mechanism including one or more biased protrusions 1078 extending downward from the support flange 1068, as shown. Figure 8 The bias protrusion 1078 is shown, which can be similar to Figure 7 The offset protrusion 978 shown functions, but it extends from another portion of the support flange 1068 and is differently shaped and sized. Other offset protrusion shapes, sizes, numbers, and configurations are also conceived herein for generating a reaction force against the grid offset support bracket 1066, as discussed elsewhere herein.

[0104] exist Figure 8 In the exemplary example, the bias protrusion 1078 is elastically deformable, wherein the bias protrusion 1078 intersects with or extends from the support flange 1078, such that when pressed against another surface or component within the electronic device, the bias protrusion 1078 forces or biases the support flange 1068 away from the other surface or component and abuts against the mesh or the flange of the mesh, as discussed above with reference to other support brackets and meshes.

[0105] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figure 8 Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figure 8 The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0106] exist Figures 4C to 8 In the various examples of compliant mechanisms shown, each mechanism can act as a tolerance gap-filling feature to precisely secure the mesh and other associated components within the device. Additionally, each compliant mechanism described herein includes one or more resilient features, such as compliant mechanisms 672, 870, support flange 768, and offset protrusions 978, 1078 extending radially outward and away from the associated support flange. In this way, the various compliant mechanisms, flanges, and offset protrusions described herein are less likely to attract water and debris that might penetrate through the through-holes of the mesh supported by the support brackets described herein.

[0107] Figure 9A and Figure 9B Perspective and sectional views of another example of a grid 1140 defined by the housing 1102 of an electronic device are shown, respectively. Figure 9A and Figure 9B In the example shown, the through-hole 1148 extends directly through the thickness of the housing 1102 between the outer surface 1142 and the inner surface 1144 of the housing 1102. Therefore, in at least one example, the grid 1140 and its through-hole 1148 can form a grid 1140 without ports defined by the housing 1102. In such an example, the housing 1102 defines each hole of the through-hole 1148 constituting the grid 1140 of the housing 1102, beneath which internal components, such as a speaker module or other components described herein, can be disposed.

[0108] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figures 9A to 9B Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figures 9A to 4B The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0109] Figure 10A and Figure 10B Perspective and sectional views are shown respectively of another example of a mesh 1240 disposed within or across a port 1218 defined by a housing 1202 of an electronic device, such that the mesh 1240 blocks or covers the port 1218. The mesh 1240 may define a plurality of through holes 1248. In another example, the mesh 1240 does not include through holes 1248, but includes a porous material referenced elsewhere herein with reference to other mesh materials. Figure 10A and Figure 10B In an exemplary example, port 1218 may include a recessed feature extending from the outer surface of housing 1202 into the thickness of housing 1202. The mesh 1240, defining through-hole 1248 and extending across port 1218, therefore includes an outer surface 1258 recessed from the outer surface 1242 of housing 1202. Through-hole 1248 may extend from its outer surface 1258 through the mesh 1240 into an inner surface 1244 of housing 1202, which mates with the mesh 1240. Because the outer surface 1258 is recessed from the outer surface 1242 of housing 1202, the outer surface 1258 of the mesh 1240 is unlikely to be touched and / or damaged during a device drop event, such as when the device / housing 1202 is dropped by a user onto the ground or other surfaces or objects.

[0110] In any other example of the devices, features, components, and parts shown in the other accompanying drawings, they may be included individually or in any combination. Figures 10A to 10B Any of the features, components, and parts shown, including their arrangement and configuration. Similarly, in Figures 10A to 10B The examples of devices, features, components, and parts shown may include, individually or in any combination, any features, components, parts shown in other figures, including their arrangement and configuration.

[0111] Within the limits applicable to this technology, the collection and use of data from various sources can be used to improve the delivery of inspirational or other content that users may be interested in. This disclosure contemplates that, in some instances, such collected data may include personal information that uniquely identifies or can be used to contact or locate specific individuals. Such personal information may include demographic data, location-based data, telephone numbers, email addresses, etc. ID, home address, data or records related to the user's health or health level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0112] This disclosure recognizes that the use of such personal information data in the techniques of this invention can benefit users. For example, the personal information data can be used to deliver targeted content that is of interest to the user. Therefore, the use of such personal information data enables users to have planned control over the delivered content. Furthermore, this disclosure also anticipates other uses of personal information data that are beneficial to users. For example, health and fitness data can be used to provide insights into a user's overall health status or as positive feedback for individuals using technology to pursue health goals.

[0113] This disclosure assumes that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as data collection and / or use change. Personal information from users should be collected for the entity's lawful and reasonable purposes and not shared or sold outside of these lawful uses. Furthermore, such collection / sharing should be conducted only after obtaining informed consent from users. In addition, such entities should consider taking any necessary steps to protect and safeguard access to such personal information data and ensure that others with access to such personal information data comply with their privacy policies and processes. Additionally, such entities may be subject to third-party evaluations to demonstrate their compliance with widely accepted privacy policies and practices. Furthermore, policies and practices should be adapted to the specific types of personal information data collected and / or accessed, and to applicable laws and standards, including specific considerations regarding jurisdiction. For example, in the United States, the collection or acquisition of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); while in other countries, health data may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained for different types of personal data in each country.

[0114] Regardless of the foregoing, this disclosure also contemplates implementation schemes for users to selectively prevent the use or access to personal information data. That is, this disclosure contemplates providing hardware and / or software components to prevent or block access to such personal information data. For example, with regard to advertising delivery services, the inventive technology can be configured to allow users to opt-in or opt-out at any time during or after service registration to participate in the collection of personal information data. In another example, users can choose not to provide emotion-related data for a targeted content delivery service. In yet another example, users can choose to limit the duration for which emotion-related data is retained, or completely prohibit the development of underlying emotional states. In addition to providing "opt-in" and "opt-out" options, this disclosure envisions providing notifications related to access to or use of personal information. For example, users can be notified when downloading an application that their personal information data will be accessed, and then reminded again just before the application accesses the personal information data.

[0115] Furthermore, the purpose of this disclosure is to manage and process personal information data to minimize the risk of unintentional or unauthorized access or use. Once data is no longer needed, this risk can be minimized by limiting data collection and deleting data. Additionally, and where applicable, including in certain health-related applications, data deidentification can be used to protect user privacy. Deidentification can be facilitated, where appropriate, by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than the address level), controlling how data is stored (e.g., aggregating data among users), and / or other methods.

[0116] Therefore, while this disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, it is also contemplated that various embodiments can be implemented without access to such personal information data. That is, various embodiments of the present invention will not be rendered inoperable due to the absence of all or part of such personal information data. For example, preferences can be inferred based on non-personal information data or a minimal amount of personal information, such as content requested by a device associated with a user, other non-personal information available to the content delivery service, or publicly available information, thereby selecting content and delivering it to the user.

[0117] For illustrative purposes, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, the foregoing description of specific embodiments described herein is presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above.

Claims

1. An electronic device, comprising: a housing defining an interior volume and an aperture; an electronic component disposed within the interior volume and obstructing the aperture; a mesh component disposed against the electronic component, the mesh component including a flange secured against an inner surface of the housing; and a support bracket disposed against the flange such that the flange is disposed between the support bracket and the inner surface, the support bracket including: a support flange disposed against the flange; and a compliant mechanism biasing the mesh component against the inner surface, wherein the compliant mechanism includes a resilient protrusion pressed against the electronic component and a base portion secured to the support flange by the resilient protrusion, and wherein the resilient protrusion extends outwardly and away from the support flange.

2. The electronic device of claim 1, further comprising an adhesive disposed between the electronic component and the mesh component.

3. The electronic device of claim 1, wherein the electronic component includes a speaker module.

4. The electronic device of claim 1, further comprising a resilient barrier disposed between the mesh component and an inner surface of the housing.

5. The electronic device of claim 4, wherein the resilient barrier is disposed against the inner surface of the housing around a perimeter of the aperture.

6. The electronic device of claim 4, wherein the resilient barrier includes a foam material.

7. The electronic device of claim 6, wherein the foam material is elastically compressed between the mesh component and the housing.

8. The electronic device of claim 4, further comprising an adhesive disposed between the resilient barrier and the mesh component.

9. An electronic device, comprising: a housing defining an interior volume and a port; a speaker module disposed within the interior volume and oriented to move air through the port; and an acoustically transparent mesh covering the port, the mesh including: a raised portion extending at least partially through the port; and a flange extending along the raised portion, the flange secured against an inner surface of the housing; and a support bracket disposed against the flange such that the flange is disposed between the support bracket and the inner surface, the support bracket including: a support flange disposed against the flange; and a compliant mechanism biasing the mesh against the inner surface, wherein the compliant mechanism includes a resilient protrusion pressed against the speaker module and a base portion secured to the support flange by the resilient protrusion, and wherein the resilient protrusion extends outwardly and away from the support flange.

10. The electronic device of claim 9, further comprising an adhesive layer disposed between the flange and the inner surface of the housing, the adhesive layer securing the flange to the inner surface of the housing. ​ 11. The electronic device of claim 9, wherein the raised portion defines an outer surface disposed flush with an outer surface of the housing.

12. An electronic device, comprising: a housing defining an aperture; a mesh component occluding the aperture, the mesh component including a flange secured against an inner surface of the housing; and a support bracket disposed against the flange such that the flange is disposed between the support bracket and the inner surface, the support bracket including: a support flange disposed against the flange; and a compliant mechanism biasing the mesh component against the inner surface, wherein the compliant mechanism includes a resilient protrusion pressing against an internal electronic component of the electronic device and a base portion secured to the support flange by the resilient protrusion, and wherein the resilient protrusion extends outwardly and away from the support flange; and a resilient member disposed against the mesh component and biased toward the inner surface of the housing.

13. The electronic device of claim 12, wherein the mesh component is disposed between the resilient member and the housing.

14. The electronic device of claim 12, wherein the resilient member is disposed between the mesh component and the housing.

15. The electronic device of claim 14, wherein the mesh component is disposed between the internal electronic component and the resilient member.

16. The electronic device of claim 15, wherein the mesh component is disposed directly against the internal electronic component and the resilient member is elastically compressed between the housing and the mesh component.

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