Power grid structure for integrated circuits

Abstract

The present application is a power grid structure applied to an integrated circuit. A power switch element is designed on a chip of the integrated circuit, and the power switch element is used to control switching of a power domain operation. In the design of the power grid, power lines with different electrical characteristics are designed in the same row or the same column to reduce the layout area of the power grid on a metal layer.

Description

Technical Field

[0001] This invention relates to a power grid structure for use in integrated circuits, and more particularly to a power grid structure for controlling the operation of a power domain in an integrated circuit using a power switch cell. Background Technology

[0002] As integrated circuit (IC) designs become increasingly complex, corresponding power meshes need to be designed to provide working voltages to different power domains on the IC. Summary of the Invention

[0003] This invention proposes a power grid structure for use in integrated circuits. A chip of the integrated circuit has a power domain, and the power domain includes a power switching element. The power grid structure includes: a first power grid located above the chip, the first power grid including multiple power supply lines in a first direction, each of which includes multiple regional power lines and multiple ground lines. The power switching element is connected to at least one of the ground lines of the first power grid, and a voltage output terminal of the power switching element is connected to at least one of the regional power lines of the first power grid; and a second power grid including multiple power supply lines in a second direction, each of which includes a global power line and two regional power lines, with the global power line and the two regional power lines arranged in the same row. The global power line on the second power grid is connected to a voltage input terminal of the power switching element, and the two regional power lines on the second power grid are connected to the regional power lines of the first power grid. A power supply network includes: a third power supply network including a second-direction power supply line, wherein the second-direction power supply line includes a ground wire, wherein the ground wire of the third power supply network is connected to the ground wire of the first power supply network; a fourth power supply network including multiple first-direction power supply lines, wherein each first-direction power supply line includes a global power supply line and a ground wire, wherein the global power supply line and the ground wire are arranged in the same column, wherein the global power supply line of the fourth power supply network is connected to the global power supply line of the second power supply network, and the ground wire of the fourth power supply network is connected to the ground wire of the third power supply network; and a fifth power supply network including multiple second-direction power supply lines, wherein each second-direction power supply line includes a global power supply line and a ground wire, wherein the global power supply line receives an operating voltage, and the ground wire receives a ground voltage, wherein the global power supply line of the fifth power supply network is connected to the global power supply line of the fourth power supply network, and the ground wire of the fifth power supply network is connected to the ground wire of the fourth power supply network.

[0004] This invention proposes a power grid structure for use in integrated circuits. A chip of the integrated circuit has a first power domain and a second power domain, and a power switching element is included in the power domain. The power grid structure includes: a first power grid located above the chip; the first power grid includes multiple power supply lines in a first direction, and these first power supply lines include multiple global power lines, multiple regional power lines, and multiple ground lines. The global power lines are located above the first power domain, and the regional power lines are located above the second power domain. The power switching element is at least connected to the ground line of the first power grid. One of them, and a voltage output terminal of the power switching element is connected to at least one of the regional power lines of the first power network; a second power network, including multiple second-direction power supply lines, the second-direction power supply lines including a global power line and two regional power lines, wherein the global power line and the two regional power lines are located above the second power domain and are designed in the same row, wherein the global power line on the second power network is connected to a voltage input terminal of the power switching element, and the two regional power lines on the second power network are connected to the regional power lines of the first power network; a third power network. A third power grid includes a second-direction power supply line, which includes multiple global power lines and multiple grounding lines, wherein the global power lines are located above the first power grid. The grounding line of the third power grid is connected to the grounding line of the first power grid, and the global power lines of the third power grid are connected to the global power lines of the first power grid. A fourth power grid includes multiple first-direction power supply lines, which include multiple global power lines and multiple grounding lines, wherein the grounding line of the fourth power grid is connected to the grounding line in the third power grid. The global power line above the source domain is connected to the global power line of the second power network; and the global power line of the fourth power network above the first power domain is connected to the global power line of the third power network; a fifth power network includes multiple second-direction power supply lines, and the second-direction power supply line includes a global power line and a grounding line, the global power line receives a working voltage, the grounding line receives a grounding voltage, wherein the global power line of the fifth power network is connected to the global power line of the fourth power network, and the grounding line of the fifth power network is connected to the grounding line of the fourth power network. Attached Figure Description

[0005] To provide a better understanding of the above and other aspects of the present invention, preferred embodiments are described below in detail with reference to the accompanying drawings:

[0006] Figures 1A to 1EThis is a first embodiment of the present invention applied to the power grid structure of an integrated circuit;

[0007] Figures 2A to 2G This is a second embodiment of the present invention applied to the power grid structure of an integrated circuit; and

[0008] Figure 3 This is the third embodiment of the present invention applied to the power grid structure of integrated circuits.

[0009] The reference numerals in the attached figures are explained as follows:

[0010] 100, 500, 600: Chips

[0011] 110, 120, 510, 520, 610, 620, 720: Power domains

[0012] 300: Regional Power Grid

[0013] 310, 320: Partial regional power grid

[0014] 321, 401, 402: Power cords

[0015] 322, 403, 514, 524, 534, 544, 614, 624, 644, 654, 664, 724, 744, 754, 764: Grounding wire

[0016] 400: Global Power Supply Network

[0017] 521, 522, 621, 622, 722: Power switching components

[0018] 516, 536, 546, 616, 636, 646, 656, 666, 736, 756, 766: All-domain power cord

[0019] 523, 623: Penetration Hole

[0020] 528, 538, 628, 638, 728, 738: Area power lines Detailed Implementation

[0021] Please refer to Figures 1A to 1E The illustration depicts a first embodiment of the power grid structure of the present invention applied to an integrated circuit. For example... Figure 1A As shown, the integrated circuit chip 500 is divided into two power domains 510 and 520. In addition, power switch cells 521 and 522 are designed on the chip 500 to control the power switching of power domain 520.

[0022] Please refer to Figure 1BThis is a schematic diagram of the first power mesh. The first power mesh is positioned above chip 500. The first power mesh is partitioned into two partial power meshes. The first partial power mesh is located above power domain 510, and the second partial power mesh is located above power domain 520. Furthermore, the two partial power meshes can be correspondingly coupled to the electronic components in the two power domains 510 and 520 below via via holes.

[0023] like Figure 1B As shown, in the first power network, the first portion of the power network above power domain 510 includes multiple horizontal power supply wires, including a global power wire 516 and a ground wire 514. Additionally, the second portion of the power network above power domain 520 includes multiple horizontal power supply wires, including a local power wire 528 and a ground wire 524. The global power wire 516 is indicated by a diagonal line, the local power wire 528 by a cross line, and the ground wires 514 and 524 by blank spaces. Furthermore, power switching elements 521 and 522 in power domain 520 are connected to at least one local power wire 528 and at least one ground wire 524 via through-holes. For example, power switching element 521 is connected to ground wire 524 via through-hole 523.

[0024] like Figure 1B As shown, in the first power grid, columns one through three are all located above power domain 510, so each column is a complete horizontal power supply line. Additionally, in the first power grid, columns four through nine are located above power domains 510 and 520, so each column includes two non-contacting horizontal power supply lines. For example, column four includes two horizontal power supply lines: one is a global power line 516, and the other is a regional power line 528. Similarly, column five includes two horizontal power supply lines: one is a grounding line 514, and the other is a grounding line 524.

[0025] Please refer to Figure 1C This is a schematic diagram of the second power grid. The second power grid is positioned above the first power grid. The second power grid includes multiple vertical power supply wires, including a global power supply wire 536, a grounding wire 534, and a regional power supply wire 538.

[0026] like Figure 1CAs shown, in the second power grid, the vertical power supply lines corresponding to the power domain 510 include a global power line 536 and a grounding line 534. Additionally, the vertical power supply lines corresponding to the power domain 520 include a global power line 536, a grounding line 534, and a regional power line 538. The grounding line 534 is connected to the grounding lines 514 and 524 of the first power grid via a via hole. That is, the grounding lines 524 and 514 of the first power grid are electrically connected using the grounding line 534 of the second power grid. Furthermore, the regional power line 538 is connected to the regional power line 528 of the first power grid via a via hole. The global power line 536 is connected to the global power line 516 of the first power grid via a via hole. Additionally, the global power line 536 is connected to the power switching elements 521 and 522 via a via hole.

[0027] Please refer to Figure 1D This is a schematic diagram of a third power supply network. The third power supply network is positioned above the second power supply network. The third power supply network includes multiple horizontal power supply lines, including a global power supply line 546 and a grounding line 544. The grounding line 544 is connected to the grounding line 534 of the second power supply network via a via hole. The global power supply line 546 is connected to the global power supply line 536 of the second power supply network via a via hole.

[0028] like Figure 1E As shown, the power grid structure of the first embodiment of the present invention is implemented using three metal layers. For example, the first power grid is disposed on the lower metal layer M1, the second power grid is disposed on the metal layer M5, and the third power grid is disposed on the higher metal layer M6. Of course, the present invention is not limited to the metal layers on which the three power grids are disposed; the present invention only limits the first power grid to be located below the second power grid, and the second power grid to be located below the third power grid.

[0029] Furthermore, in the power grid structure of the first embodiment, power lines and grounding lines with the same electrical properties can be interconnected using via holes. In other words, grounding lines 514, 524, 534, and 544 are electrically connected, global power lines 516, 536, and 546 are electrically connected, and regional power lines 528 and 538 are electrically connected. Therefore, when the global power line 546 and grounding line 544 of the third power grid respectively receive the operating voltage V... DD and grounding voltage V GND At that time, the electronic components in the power domain 510 can operate according to the working voltage V.DD and grounding voltage V GND Run it.

[0030] Furthermore, according to the first embodiment of the present invention, power switch elements 521 and 522 designed on chip 500 are connected to the global power line 536, the regional power line 528, and the ground line 524. Moreover, power switch elements 521 and 522 each include a voltage input terminal and a voltage output terminal, wherein the voltage input terminal is connected to the global power line 536 of the second power grid, and the voltage output terminal is connected to the regional power line 528 of the first power grid. Therefore, when power switch elements 521 and 522 are in the closed state, the operating voltage V on the global power line 536 is... DD This can be conducted to the power lines 528 and 538 in the power zone. At this point, the electronic components in power zone 520 can operate according to the working voltage V. DD and grounding voltage V GND To run. Conversely, when power switching elements 521 and 522 are in the open state, the operating voltage V on the global power line 536 is... DD The power cannot be conducted to the area power line 528, at which point the electronic components in the power domain 520 stop operating.

[0031] For example, when the integrated circuit is in normal mode, the power switch elements 521 and 522 on chip 500 are closed, and the electronic components in power domains 510 and 520 can operate according to the working voltage V. DD and grounding voltage V GND When the integrated circuit is in sleep mode, the power switch elements 521 and 522 on the chip 500 are in the off state, and only the electronic components in the power domain 510 can operate, while the electronic components in the power domain 520 stop operating.

[0032] Please refer to Figures 2A to 2G The illustration depicts a second embodiment of the power grid structure of the present invention applied to integrated circuits. For example... Figure 2A As shown, the integrated circuit chip 600 is divided into two power domains 610 and 620. In addition, power switching elements 621 and 622 are designed on the chip 600 to control the power switching of power domain 620.

[0033] Please refer to Figure 2BThis is a schematic diagram of the first power mesh. The first power mesh is positioned above chip 600. The first power mesh is partitioned into two partial power meshes. The first partial power mesh is located above power domain 610, and the second partial power mesh is located above power domain 620. Furthermore, the two partial power meshes can be correspondingly coupled to the electronic components in the two power domains 610 and 620 below via via holes.

[0034] like Figure 2B As shown, in the first power network, the first part of the power network above power domain 610 includes multiple horizontal power supply lines, including a global power line 616 and a grounding line 614. Additionally, the second part of the power network above power domain 620 includes multiple horizontal power supply lines, including a regional power line 628 and a grounding line 624. The global power line 616 is indicated by a diagonal line, the regional power line 628 by a cross line, and the grounding lines 614 and 624 by blank spaces. Furthermore, power switching elements 621 and 622 in power domain 620 are connected to the regional power line 628 and the grounding line 624 via through-holes. For example, power switching element 621 is connected to the regional power line 628 via a through-hole 623.

[0035] like Figure 2B As shown, in the first power grid, the first and second rows are both located above power domain 610, so each row is a complete horizontal power supply line. Additionally, in the first power grid, the third to ninth rows are located above power domains 610 and 620, so each row includes two non-contacting horizontal power supply lines. For example, the third row includes two horizontal power supply lines: one is a global power line 616, and the other is a regional power line 628. Similarly, the fourth row includes two horizontal power supply lines: one is a ground line 614, and the other is a ground line 624.

[0036] Please refer to Figure 2C This is a schematic diagram of the second power grid. The second power grid is positioned above the first power grid, corresponding to power domain 620. The second power grid includes multiple vertical power supply lines, including a global power line 636 and a regional power line 638. In the second power grid, the regional power line 638 is connected to the regional power line 628 of the first power grid via a via hole, and the global power line 636 is connected to power switching elements 621 and 622 via via holes.

[0037] like Figure 2CAs shown, in the second power grid, both the first and second columns are located above power domain 620. Each column includes multiple non-contacting vertical power supply lines. For example, the first column includes three vertical power supply lines: one global power line 636 and two regional power lines 638. In the first column, the global power line 636 passes above the power switching element 621, and the regional power lines 638 are located at both ends of the global power line 636. Similarly, the second column includes three vertical power supply lines: one global power line 636 and two regional power lines 638. In the second column, the global power line 636 passes above the power switching element 622, and the regional power lines 638 are located at both ends of the global power line 636.

[0038] Please refer to Figure 2D This is a schematic diagram of the third power supply network. The third power supply network is configured above the second power supply network. The third power supply network includes multiple vertical power supply lines, including a global power supply line 646 and a grounding line 644.

[0039] like Figure 2D As shown, in the third power grid, the vertical power supply line corresponding to the area above power domain 610 includes a global power line 646 and a grounding line 644. Additionally, the vertical power supply line corresponding to the area above power domain 620 only includes a grounding line 644. The grounding line 644 of the third power grid is connected to the grounding lines 614 and 624 of the first power grid via a via hole. That is, the grounding lines 614 and 624 of the first power grid are electrically connected using the grounding line 644 of the third power grid. Furthermore, the global power line 646 is connected to the global power line 616 of the first power grid via a via hole.

[0040] Please refer to Figure 2E This is a schematic diagram of the fourth power supply network. The fourth power supply network is positioned above the third power supply network. The fourth power supply network includes multiple horizontal power supply lines, including a global power supply line 656 and a grounding wire 654. The grounding wire 654 is connected to the grounding wire 644 of the third power supply network via a via hole.

[0041] Additionally, in the fourth power grid, the horizontal power supply lines corresponding to the power domain 610 include a global power line 656 and a grounding line 654. The global power line 656 is connected to the global power line 646 of the third power grid via a via hole.

[0042] According to a second embodiment of the present invention, above the power domain 620, a column of horizontal power supply lines includes non-contact global power lines 656 and ground lines 654. In the first column, the global power line 656 passes above the power switching element 621, and both ends of the global power line 656 are ground lines 654. Similarly, in the second column, the global power line 656 passes above the power switching element 622, and both ends of the global power line 656 are ground lines 654. Furthermore, the global power line 656 is connected to the global power line 636 of the second power grid via a via hole.

[0043] Please refer to Figure 2F This is a schematic diagram of the fifth power supply network. The fifth power supply network is positioned above the fourth power supply network. The fifth power supply network includes multiple vertical power supply lines, including a global power supply line 666 and a grounding line 664. The grounding line 664 is connected to the grounding line 654 of the fourth power supply network via a via hole. The global power supply line 666 is connected to the global power supply line 656 of the fourth power supply network via a via hole.

[0044] like Figure 2G As shown, the power grid structure of the second embodiment of the present invention is implemented using five metal layers. For example, the first power grid is configured in the lower metal layer M1, the second power grid is configured in the metal layer M3, the third power grid is configured in the metal layer M5, the fourth power grid is configured in the metal layer M6, and the fifth power grid is configured in the higher metal layer M7. Of course, the present invention is not limited to the number of metal layers in which the five power grids are configured; the present invention only limits the first power grid to be below the second power grid, the second power grid to be below the third power grid, the third power grid to be below the fourth power grid, and the fourth power grid to be below the fifth power grid.

[0045] Furthermore, in the power grid structure of the second embodiment, power lines and grounding lines with the same electrical properties can be interconnected using via holes. In other words, grounding lines 614, 624, 644, 654, and 664 are electrically connected, global power lines 616, 636, 646, 656, and 666 are electrically connected, and regional power lines 628 and 638 are electrically connected. Therefore, when the global power line 666 and grounding line 664 of the fifth power grid respectively receive the operating voltage V... DD and grounding voltage V GND At that time, the electronic components in the power domain 610 can operate according to the working voltage V. DD and grounding voltage V GND Run it.

[0046] Furthermore, according to a second embodiment of the present invention, power switch elements 621 and 622 designed on chip 600 are connected to the global power line 636, the regional power line 628, and the ground line 624. Moreover, power switch elements 621 and 622 each include a voltage input terminal and a voltage output terminal, wherein the voltage input terminal is connected to the global power line 636 of the second power grid, and the voltage output terminal is connected to the regional power line 628 of the first power grid. Therefore, when power switch elements 621 and 622 are in the open state, the operating voltage V on the global power line 636 is... DD The voltage cannot be conducted to the regional power line 628, and the electronic components on the power domain 620 cannot operate. Conversely, when the power switching elements 621 and 622 are in the closed state, the operating voltage V on the global power line 636... DD It can be conducted to the area power lines 628 and 638, at which point the electronic components in the power domain 620 can operate according to the working voltage V. DD and grounding voltage V GND Run it.

[0047] For example, when the integrated circuit is in normal mode, the power switching elements 621 and 622 of chip 600 are closed, and the electronic components in power domains 610 and 620 can operate according to the working voltage V. DD and grounding voltage V GND When the integrated circuit is in sleep mode, the power switching elements 621 and 622 of the chip 600 are in the off state, and only the electronic components in the power domain 610 can operate, while the electronic components in the power domain 620 stop operating.

[0048] According to a second embodiment of the present invention, in the power grid design above the power domain 620, power lines with different electrical characteristics are designed in the same row or column to reduce the layout area of ​​the power grid on the metal layer. Furthermore, the remaining metal layer area can be used for the layout design of signal wires.

[0049] Furthermore, in the second embodiment, the power domain 620 of chip 600 is designed with multiple power switching elements 621 and 622. In practical applications, the present invention does not limit the number of power switching elements in the power domain 620. For example, the purpose of the present invention can also be achieved using a single power switching element, as will be explained below.

[0050] Please refer to Figure 3The illustration shows a third embodiment of the power grid structure of the present invention applied to an integrated circuit. In this embodiment, regional power lines 728 and 738 are represented by cross lines, ground lines 724, 744, 754, and 764 are represented by blank lines, and global power lines 736, 756, and 766 are represented by diagonal lines.

[0051] like Figure 3 As shown, a power switch cell 722 is designed in the power domain 720 on the chip to control the power switching of the power domain 720.

[0052] The first power grid is positioned above the chip. This first power grid above the power domain 720 includes multiple horizontal power supply lines, including a zone power line 728 and a ground line 724. Furthermore, a power switching element 722 is connected to the zone power line 728 and the ground line 724 via a via hole. Additionally, the zone power line 728 and the ground line 724 can also be coupled to electronic components in the power domain 720 below via the via hole.

[0053] The second power grid is positioned above the first power grid. The second power grid includes multiple vertical power supply wires, including a global power line 736 and regional power lines 738. The global power line 736 and regional power lines 738 are designed in the same column. That is, each column includes three non-contact vertical power supply wires: one global power line 736 and two regional power lines 738. The global power line 736 passes above the power switching element 722, and the regional power lines 738 are located at both ends of the global power line 736. Furthermore, the regional power lines 738 are connected to the regional power lines 728 of the first power grid via via holes, and the global power line 736 is connected to the power switching element 722 via via holes.

[0054] The third power grid is positioned above the second power grid. The third power grid includes a vertical power supply line, which is a grounding wire 744. The grounding wire 744 of the third power grid is connected to the grounding wire 724 of the first power grid via a via hole. In other words, the grounding wire 724 of the first power grid is electrically connected using the grounding wire 744 of the third power grid.

[0055] The fourth power supply network is positioned above the third power supply network. The fourth power supply network includes multiple horizontal power supply lines, including a global power line 756 and a grounding line 754. The global power line 756 and the grounding line 754 are designed in the same row. That is, each row includes two non-contacting horizontal power supply lines: one is the global power line 756, and the other is the grounding line 754. The global power line 756 passes above the power switching element 722. Furthermore, the global power line 756 is connected to the global power line 736 of the second power supply network via a via hole, and the grounding line 754 is connected to the grounding line 744 of the third power supply network via a via hole.

[0056] The fifth power grid is positioned above the fourth power grid. The fifth power grid includes multiple vertical power supply lines, including a global power supply line 766 and a grounding line 764. The grounding line 764 is connected to the grounding line 754 of the fourth power grid via a via hole. The global power supply line 766 is connected to the global power supply line 756 of the fourth power grid via a via hole.

[0057] In the power grid structure of the third embodiment, power lines and grounding lines with the same electrical properties can be interconnected using via holes. In other words, grounding lines 724, 744, 754, and 764 are electrically connected, global power lines 736, 756, and 766 are electrically connected, and regional power lines 728 and 738 are electrically connected. Furthermore, the global power line 766 and grounding line 764 of the fifth power grid respectively receive the operating voltage V. DD and grounding voltage V GND .

[0058] According to a third embodiment of the present invention, a power switch element 722 designed on the chip is connected to a global power line 736, a regional power line 728, and a ground line 724. Furthermore, each power switch element 722 includes a voltage input terminal and a voltage output terminal, wherein the voltage input terminal is connected to the global power line 736 of the second power grid, and the voltage output terminal is connected to the regional power line 728 of the first power grid.

[0059] When the power switch element 722 is in the open state, the operating voltage V on the global power line 736 is... DD The voltage cannot be conducted to the regional power line 728, and the electronic components on the power domain 720 cannot operate. Conversely, when the power switch element 722 is in the closed state, the operating voltage V on the global power line 736... DDIt can be conducted to the area power lines 728 and 738, at which point the electronic components in the power domain 720 can operate according to the working voltage V. DD and grounding voltage V GND Run it.

[0060] As described above, this invention proposes a power grid structure for integrated circuits. Power switching elements are designed on the integrated circuit chip and used to control the switching of power domain operation. Furthermore, in the design of the power grid, this invention further arranges power lines with different electrical characteristics in the same row or column to reduce the layout area of ​​the power grid on the metal layer.

[0061] Furthermore, in this embodiment of the invention, the power grid architecture is constructed using horizontal and vertical power supply lines. In practice, the invention can utilize two power supply lines in different directions to construct the power grid architecture. Taking the second embodiment as an example, the first power grid may include multiple power supply lines in the first direction, the second power grid may include multiple power supply lines in the second direction, the third power grid may include multiple power supply lines in the second direction, the fourth power grid may include multiple power supply lines in the first direction, and the fifth power grid may include multiple power supply lines in the second direction.

[0062] Furthermore, this invention does not limit the vertical position of multiple power grids in the power grid architecture. Figure 2G For example, the second power grid of metal layer M3 and the third power grid of metal layer M5 can be interchanged; that is, the second power grid can be configured in metal layer M5 and the third power grid can be configured in metal layer M3. Furthermore, the third power grid of metal layer M5 and the fourth power grid of metal layer M6 can also be interchanged; that is, the third power grid can be configured in metal layer M6 and the fourth power grid can be configured in metal layer M5.

[0063] In summary, although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A power grid structure for use in an integrated circuit, wherein a chip of the integrated circuit has a power domain, and the power domain includes a power switching element, the power grid structure comprising: A first power grid is located above the chip. The first power grid includes multiple first-direction power supply lines, and the first-direction power supply lines include multiple area power lines and multiple ground lines. The power switching element is connected to at least one of the ground lines of the first power grid, and a voltage output terminal of the power switching element is connected to at least one of the area power lines of the first power grid. A second power grid includes multiple second-direction power supply lines. The second-direction power supply lines include a global power line and two regional power lines. The global power line and the two regional power lines are designed in the same row. The global power line on the second power grid is connected to a voltage input terminal of the power switching element, and the two regional power lines on the second power grid are connected to the regional power lines of the first power grid. A third power grid includes a second-direction power supply line, and the second-direction power supply line includes a grounding wire, wherein the grounding wire of the third power grid is connected to the grounding wire of the first power grid; A fourth power grid includes multiple power supply lines in a first direction, each power supply line including a global power line and a grounding line, wherein the global power line and the grounding line are arranged in the same column, wherein the global power line of the fourth power grid is connected to the global power line of the second power grid, and the grounding line of the fourth power grid is connected to the grounding line of the third power grid; and A fifth power grid includes multiple second-direction power supply lines, and each second-direction power supply line includes a global power line and a grounding line. The global power line receives a working voltage, and the grounding line receives a grounding voltage. The global power line of the fifth power grid is connected to the global power line of the fourth power grid, and the grounding line of the fifth power grid is connected to the grounding line of the fourth power grid.

2. The power grid structure for integrated circuits as described in claim 1, wherein the regional power lines and the ground lines of the first power grid are coupled to a plurality of electronic components in the power domain.

3. The power grid structure for integrated circuits as described in claim 2, wherein when the power switching element is in a closed state, the electronic components in the power domain operate according to the operating voltage and the ground voltage; and when the power switching element is in an open state, the electronic components in the power domain stop operating.

4. The power grid structure for integrated circuits as described in claim 1, wherein the fifth power grid is disposed above the fourth power grid, the fourth power grid is disposed above the third power grid, the third power grid is disposed above the second power grid, and the second power grid is disposed above the first power grid.

5. The power grid structure for integrated circuits as described in claim 1, wherein the first direction is a horizontal direction and the second direction is a vertical direction.

6. A power grid structure for use in an integrated circuit, wherein a chip of the integrated circuit has a first power domain and a second power domain, and the second power domain includes a power switching element, the power grid structure comprising: A first power grid is located above the chip. The first power grid includes multiple power supply lines in a first direction, and the first power supply lines in the first direction include multiple global power lines, multiple regional power lines, and multiple ground lines. The global power lines are located above the first power domain, the regional power lines are located above the second power domain, the power switching element is connected to at least one of the ground lines of the first power grid, and a voltage output terminal of the power switching element is connected to at least one of the regional power lines of the first power grid. A second power grid includes multiple second-direction power supply lines. The second-direction power supply lines include a global power line and two regional power lines. The global power line and the two regional power lines are located above the second power grid and are designed in the same row. The global power line on the second power grid is connected to a voltage input terminal of the power switching element, and the two regional power lines on the second power grid are connected to the regional power lines of the first power grid. A third power grid includes a second-direction power supply line, and the second-direction power supply line includes multiple global power lines and multiple grounding lines, wherein the global power lines are located above the first power domain, the grounding lines of the third power grid are connected to the grounding lines of the first power grid, and the global power lines of the third power grid are connected to the global power lines of the first power grid. A fourth power grid includes multiple power supply lines in a first direction, and each power supply line in the first direction includes multiple global power lines and multiple grounding lines. The grounding lines of the fourth power grid are connected to the grounding lines of the third power grid. The global power lines above the second power domain are connected to the global power lines of the second power grid. The global power lines of the fourth power grid above the first power domain are connected to the global power lines of the third power grid. A fifth power grid includes multiple second-direction power supply lines, and each second-direction power supply line includes a global power line and a grounding line. The global power line receives a working voltage, and the grounding line receives a grounding voltage. The global power line of the fifth power grid is connected to the global power line of the fourth power grid, and the grounding line of the fifth power grid is connected to the grounding line of the fourth power grid.

7. The power grid structure for integrated circuits as described in claim 6, wherein the regional power lines and the ground lines of the first power grid are coupled to a plurality of electronic components in the second power domain; and the global power lines and the ground lines of the first power grid are coupled to a plurality of electronic components in the first power domain.

8. The power grid structure for use in an integrated circuit as described in claim 7, wherein the electronic components in the first power domain operate according to the operating voltage and the ground voltage.

9. The power grid structure for integrated circuits as claimed in claim 7, wherein when the power switching element is in a closed state, the electronic components in the second power domain operate according to the operating voltage and the ground voltage; and when the power switching element is in an open state, the electronic components in the second power domain cease operation.

10. The power grid structure for use in an integrated circuit as described in claim 6, wherein the fifth power grid is disposed above the fourth power grid, the fourth power grid is disposed above the third power grid, the third power grid is disposed above the second power grid, and the second power grid is disposed above the first power grid.

11. The power grid structure for use in integrated circuits as described in claim 6, wherein the first direction is a horizontal direction and the second direction is a vertical direction.

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