A direct-push wafer sorting machine and wafer sorting process thereof

Abstract

The present invention discloses a direct-push type wafer sorting machine and its wafer sorting process, including a machine table arranged horizontally and a material box arranged on the machine table, the material box includes at least two, the top of at least two material boxes is an open surface, and also includes a tray handling mechanism and a wafer transfer mechanism; the wafer transfer mechanism includes at least two groups, at least two groups of wafer transfer mechanisms are arranged on the side of the material box; the tray handling mechanism is mounted on the material box and the wafer transfer mechanism; the wafer transfer mechanism includes a wafer bearing assembly, a wafer transfer assembly, a detection assembly and a transfer assembly, and the wafer bearing assembly and the wafer transfer assembly are arranged at intervals; the detection assembly and the transfer assembly are respectively arranged on the sides of the wafer bearing assembly and the wafer transfer assembly; the detection assembly is against the grain contacting part of the bearing turntable from the outside. The present invention adopts a close-gap vertical insertion tray to realize automatic detection and wafer transfer bearing in one, and realizes rapid grain transfer through ejector pin direct push, which effectively improves the wafer sorting efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor automation equipment, and in particular to a direct-push wafer sorting machine and a wafer sorting process thereof. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] In the wafer manufacturing process, wafers of different sizes, types, good or bad products are mixed together after manufacturing. Wafers of the same type need to be sorted and stored, that is, wafer sorting. Wafers are generally fixed by carriers. In existing wafer sorting equipment, the method adopted is to use a robotic arm to take out the wafers from the carrier to be sorted, and then move different types of wafers to different empty carriers respectively. This sorting method requires the robotic arm to rotate back and forth to pick up and put out materials. The time interval between picking up and putting out materials is long, and the sorting efficiency is low, which cannot meet the existing wafer sorting requirements. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and provides a direct-push wafer sorting machine and a wafer sorting process thereof which adopts a close-gap vertical insertion loading plate to realize automatic detection and wafer transfer and loading in one, realizes rapid transfer of grains through direct push of a pin, and effectively improves wafer sorting efficiency.

[0005] The technical solution adopted by the present invention is as follows: a direct-push wafer sorting machine, comprising a horizontally arranged machine platform and a material box arranged on the machine platform, the material box comprising at least two, the tops of at least two material boxes being open surfaces, and also comprising a tray transport mechanism and a wafer transfer mechanism, wherein:

[0006] At least two slots are respectively provided on two symmetrically arranged inner side walls of the material box, and the at least two slots are arranged in the vertical direction and extend upward to the top open surface of the material box so as to take the wafer carrier up and down;

[0007] The wafer transfer mechanism comprises at least two groups, and at least two groups of wafer transfer mechanisms are arranged on the side of the material box;

[0008] The tray transport mechanism is mounted on the material box and the wafer transfer mechanism, and the tray transport mechanism takes out the wafer tray to be sorted from the material box and transports it to the wafer transfer mechanism, and transports the wafer tray after sorting in the wafer transfer mechanism back to the material box;

[0009] The wafer transfer mechanism includes a wafer carrying component, a wafer transfer component, a detection component and a transfer component, wherein the wafer carrying component and the wafer transfer component are spaced apart to form an insertion space therebetween so as to insert a carrying tray and a transfer tray respectively; the detection component and the transfer component are respectively arranged on the sides of the wafer carrying component and the wafer transfer component; the detection component presses against the grain contacting part of the carrying turntable from the outside and detects the wafers on the transfer tray; the transfer component sorts and transfers the grains on the transfer tray to the carrying tray from the outside.

[0010] Preferably, the tray transport mechanism includes a frame, a first linear module, a second linear module and a tray transport assembly, wherein the frame is mounted on a machine platform; the first linear module is horizontally arranged on the frame; the second linear module is connected to the output end of the first linear module in a direction perpendicular to the first linear module; the tray transport assembly is connected to the output end of the second linear module, and the tray transport assembly is driven by the first linear module and the second linear module to move linearly in the longitudinal and transverse directions in the horizontal plane.

[0011] Preferably, the carrier transport assembly includes two sets of chuck components arranged front and back, and the transport assembly moves up and down in the vertical direction so as to approach the material box or wafer transfer mechanism to take and place the wafer carrier; the transport assembly guides and limits the wafer carrier through a flexible annular groove.

[0012] Preferably, the wafer carrier is a plate-like structure, the middle of which is a circular bearing plane, and at least two wafers are arranged in the bearing plane; the outer side of the wafer carrier is a rigid supporting part for clamping and carrying.

[0013] Preferably, the wafer carrying assembly and the wafer transfer assembly are vertically arranged, and the wafer carrying assembly and the wafer transfer assembly are arranged in parallel and spaced apart, and circular through grooves are opened correspondingly on both; a carrying plate is vertically inserted in the wafer carrying assembly, and a transfer plate is vertically inserted in the wafer transfer assembly, and the circular carrying planes of the carrying plate and the transfer plate are arranged corresponding to the circular through grooves.

[0014] Preferably, the wafer carrying assembly includes a carrying component, a carrying rotating component, a carrying plate and a first convex ring, wherein the carrying component is vertically arranged on the machine platform; the carrying plate is vertically arranged on one side of the carrying component, and is rotatably connected to the side wall of the carrying component along the vertical plane direction; the carrying rotating component is arranged on the carrying component, and the output end is connected to the carrying plate so as to drive the carrying plate to rotate; a circular through groove is opened on the carrying plate; the first convex ring is arranged on the carrying plate along the edge of the circular through groove and protrudes outward; the carrying plate is vertically inserted on the carrying plate and fixed by the carrying plate, and the first convex ring pushes the carrying plane of the carrying plate outward to tension the carrying plane.

[0015] Preferably, the detection component includes a detection drive component, a detection component and a carrying head, wherein the detection drive component is arranged on the side of the wafer carrying component and outputs power in the longitudinal and transverse directions in the horizontal plane; the detection component is arranged on the output end of the detection drive component and is driven by the detection drive component; the carrying head is arranged on the output end of the detection drive component and is located between the detection component and the wafer carrying component, and the end face of the carrying head is close to the wafer carrying component so that it can resist the carrying plate on the wafer carrying component when the wafer is transferred.

[0016] Preferably, the wafer transfer assembly includes a transfer supporting component and a transfer supporting seat, wherein the transfer supporting component is vertically arranged on the machine platform and outputs upward power; the transfer supporting seat is vertically connected to the output end of the transfer supporting component and is provided with a circular through groove.

[0017] Preferably, the transfer component includes a transfer drive component and a transfer component, wherein the transfer component is arranged on the side of the wafer transfer component and outputs power in the longitudinal and transverse directions in the horizontal plane; the transfer component is arranged on the output end of the transfer drive component and moves back and forth in a straight line toward the wafer supporting component so as to push the wafer on the transfer carrier on the wafer transfer component to the supporting carrier on the wafer supporting component.

[0018] A wafer sorting process of a direct-push wafer sorting machine includes the following process steps:

[0019] S1. Loading the full tray: The tray handling mechanism takes out the transfer tray to be sorted from the material box and vertically inserts it into the wafer carrying assembly;

[0020] S2, empty tray loading: the tray transport mechanism takes out an empty carrier turntable from the material box and vertically inserts it into the wafer transfer assembly;

[0021] S3, carrier insertion detection and fixation: After the transfer turntable and the carrying turntable are inserted in steps S1 and S2, the wafer carrying assembly and the wafer transfer assembly perform a tray detection, and if no carrier is detected, step S1 and / or step S2 are repeated; the wafer carrying assembly and the wafer transfer assembly adsorb and fix the inserted transfer carrier and the carrying carrier;

[0022] S4, adjusting the position and angle of the carrier: the transfer carrier or the carrier fixed in step S3 is adjusted in position and angle in a vertical plane via a wafer supporting assembly and a wafer transfer assembly respectively;

[0023] S5, wafer inspection: the inspection component arranged outside the wafer carrying component passes through the wafer carrying component and the carrying turntable to photograph the wafer on the transfer carrier, and uploads the photographed pattern to the industrial control center;

[0024] S6, wafer transfer: after analyzing the distribution of wafers on the transfer carrier in step S5, the industrial control center issues a control instruction to the detection component and the transfer component, wherein the transfer component pushes the transfer carrier from the outside of the wafer transfer component, pushes one wafer on the transfer carrier to the carrying carrier, and is carried from the other side by the detection component;

[0025] S7, carrier replacement: after the transfer of the same type of wafer on the transfer carrier in step S6 is completed, the carrier transport mechanism extracts the carrier and transfers it to the material box, and takes out the empty carrier from the material box and inserts it into the wafer carrying assembly;

[0026] S8, wafer sorting: After the loading tray is installed in step S7, steps S3 to S6 are repeated, and the transfer assembly transfers another wafer on the transfer tray to the loading tray, and the cycle continues until all wafers of the same type on the transfer tray are transferred to different loading trays.

[0027] The beneficial effects of the present invention are:

[0028] In view of the defects and shortcomings of the prior art, the present invention independently developed and designed a direct-push wafer sorting machine and its wafer sorting process which adopts a close-gap vertical insertion loading plate to realize automatic detection and wafer transfer and loading in one, realizes rapid transfer of grains through direct push of a pin, and effectively improves wafer sorting efficiency.

[0029] The present invention is applied to the field of automatic wafer sorting, and its function is to transfer different wafers to different carrying trays after automatically detecting a variety of mixed wafers on a transfer tray. Based on the above process requirements, the present invention is provided with a plurality of material boxes arranged in parallel and at intervals on the machine platform, which are used to store transfer trays and carrying trays, and a tray transport mechanism is set above the material box, and the tray transport mechanism moves back and forth linearly above the material box and the wafer transfer mechanism, so as to transfer the tray back and forth between the material box and the wafer transfer mechanism; the wafer transfer mechanism of the present invention is arranged on the side of the material box, and in order to improve the wafer sorting efficiency of the whole machine, the wafer transfer mechanism of the present invention includes multiple groups, one group of wafer transfer mechanisms is in the process of wafer transfer, and the other group can carry out the work of taking and placing the tray, so that the tray transport and wafer transfer actions can be carried out simultaneously, which effectively reduces the standby time of the whole machine station. Different from the prior art, the wafer transfer mechanism of the present invention comprises a wafer carrying assembly and a wafer transfer assembly arranged at intervals, the two are arranged on the machine table at intervals, and an insertion space with an open top is formed between the two. The transfer carrier of the wafer to be transferred is vertically inserted into the wafer transfer assembly, and the empty carrier of the wafer to be carried is vertically inserted into the wafer carrying assembly. The two carriers are arranged parallel and spaced apart after insertion, and the spacing between the two can be controlled to be 2.5 mm. The middle part of the transfer carrier and the carrying carrier is a circular carrying plane, and the circular carrying plane can be made of a flexible blue film material as a carrier. The side parts can be made of rigid metal materials to facilitate clamping and handling; after the carrier is installed, the detection component arranged on the outside of the grain bearing component adjusts its position from the outside to photograph the wafer on the transfer carrier, and approaches the wafer bearing component horizontally from the outside; the transfer component arranged on the outside of the wafer transfer component approaches the wafer bearing component from the outside, and pushes the blue film of the transfer carrier straight from the outside to deform the blue film, and transfer the blue film on the carrier to the blue film on the carrier, while the detection component pushes the receiving part of the blue film of the carrier from the other side of the carrier to provide a horizontal bearing surface to prevent the blue film from being pierced by excessive push. Compared with the traditional mechanical wall rotation transfer and wafer picking and placing sorting method, which takes 50-60 milliseconds to transfer a single wafer, the direct push sorting process of the present invention can reduce the time consumption of a single wafer to less than 40 milliseconds, greatly improving the wafer sorting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is one of the three-dimensional structural schematic diagrams of the present invention.

[0031] Figure 2 This is the second schematic diagram of the three-dimensional structure of the present invention.

[0032] Figure 3 This is the third schematic diagram of the three-dimensional structure of the present invention.

[0033] Figure 4This is the fourth schematic diagram of the three-dimensional structure of the present invention.

[0034] Figure 5 This is one of the three-dimensional structural schematic diagrams of the tray transport mechanism and the material box of the present invention.

[0035] Figure 6 This is the second schematic diagram of the three-dimensional structure of the tray transport mechanism and the material box of the present invention.

[0036] Figure 7 This is one of the three-dimensional structural schematic diagrams of the tray transport assembly of the present invention.

[0037] Figure 8 This is the second schematic diagram of the three-dimensional structure of the tray transport assembly of the present invention.

[0038] Fig. 9 This is the third schematic diagram of the three-dimensional structure of the tray transport assembly of the present invention.

[0039] Fig.10 This is one of the three-dimensional structural schematic diagrams of the chuck assembly of the present invention.

[0040] Fig.11 This is the second schematic diagram of the three-dimensional structure of the chuck assembly of the present invention.

[0041] Fig.12 This is one of the three-dimensional structural schematic diagrams of the wafer transfer mechanism of the present invention.

[0042] Fig.13 This is the second three-dimensional structural schematic diagram of the wafer transfer mechanism of the present invention.

[0043] Fig.14 This is the third three-dimensional structural schematic diagram of the wafer transfer mechanism of the present invention.

[0044] Fig.15 This is the fourth schematic diagram of the three-dimensional structure of the wafer transfer mechanism of the present invention.

[0045] Fig.16 This is one of the three-dimensional structural schematic diagrams of the wafer supporting assembly of the present invention.

[0046] Fig.17 This is the second schematic diagram of the three-dimensional structure of the wafer supporting assembly of the present invention.

[0047] Fig.18 This is the third schematic diagram of the three-dimensional structure of the wafer supporting assembly of the present invention.

[0048] Fig.19 This is one of the three-dimensional structural schematic diagrams of the wafer transfer assembly of the present invention.

[0049] Fig. 20 This is the second schematic diagram of the three-dimensional structure of the wafer transfer assembly of the present invention.

[0050] Fig.21 This is the third schematic diagram of the three-dimensional structure of the wafer transfer assembly of the present invention.

[0051] Fig. 22 This is one of the three-dimensional structural schematic diagrams of the detection component of the present invention.

[0052] Fig.23 This is the second schematic diagram of the three-dimensional structure of the detection component of the present invention.

[0053] Fig.24 This is the third schematic diagram of the three-dimensional structure of the detection component of the present invention.

[0054] Fig.25 It is a schematic diagram of the three-dimensional structure of the transfer component of the present invention. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] It should be noted that all directional indications such as up, down, left, right, front, back, etc. in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] like Figures 1 to 4 As shown, the present invention proposes an adaptive clamping type material picking and placing device, and the technical solution adopted is as follows:

[0059] A direct-push wafer sorting machine includes a horizontally arranged machine platform 1 and a material box 2 arranged on the machine platform 1, wherein the material box 2 includes at least two, and the tops of at least two material boxes 2 are open surfaces, and also includes a tray transport mechanism 3 and a wafer transfer mechanism 4, wherein:

[0060] At least two slots are respectively provided on the two symmetrically arranged inner side walls of the material box 2, and the at least two slots are arranged in the vertical direction and extend upward to the top open surface of the material box 2, so as to take the wafer carrier up and down;

[0061] The wafer transfer mechanism 4 includes at least two groups, and at least two groups of wafer transfer mechanisms 4 are arranged on the side of the material box 2;

[0062] The tray transport mechanism 3 is mounted on the material box 2 and the wafer transfer mechanism 4. The tray transport mechanism 3 takes out the wafer tray to be sorted from the material box 2 and transports it to the wafer transfer mechanism 4, and transports the wafer tray after sorting in the wafer transfer mechanism 4 back to the material box 2.

[0063] The wafer transfer mechanism 4 includes a wafer carrying component 41, a wafer transfer component 42, a detection component 43 and a transfer component 44, wherein the wafer carrying component 41 and the wafer transfer component 42 are arranged at intervals, and an insertion space is formed therebetween to insert a carrying tray and a transfer tray; the detection component 43 and the transfer component 44 are respectively arranged on the sides of the wafer carrying component 41 and the wafer transfer component 42; the detection component 43 presses against the grain contacting part of the carrying turntable from the outside and detects the wafers on the transfer tray; the transfer component sorts and transfers the grains on the transfer tray to the carrying tray from the outside.

[0064] The present invention designs a direct-push wafer sorter and its wafer sorting process which adopts a close-gap vertical insertion tray, realizes automatic detection and wafer transfer and loading in one, realizes rapid grain transfer through ejector direct push, and effectively improves the wafer sorting efficiency. The present invention is applied to the field of automatic wafer sorting, and its function is to automatically detect a variety of mixed wafers on the transfer tray, and then transfer different wafers to different carrying trays. Based on the above process requirements, the present invention provides a plurality of material boxes on the machine platform in parallel and at intervals, which are used for storing transfer carriers and carrying carriers. A carrier transport mechanism is mounted above the material box, and the carrier transport mechanism moves back and forth linearly above the material box and the wafer transfer mechanism so as to transfer the carrier back and forth between the material box and the wafer transfer mechanism; the wafer transfer mechanism of the present invention is arranged on the side of the material box, and in order to improve the wafer sorting efficiency of the whole machine, the wafer transfer mechanism of the present invention includes multiple groups, one group of wafer transfer mechanisms is performing wafer transfer, and the other group can perform the work of taking and placing the carrier, so that the carrier transport and wafer transfer actions can be performed simultaneously, effectively reducing the standby time of the whole machine workstation. Different from the prior art, the wafer transfer mechanism of the present invention comprises a wafer carrying assembly and a wafer transfer assembly arranged at intervals, the two are arranged on the machine table at intervals, and an insertion space with an open top is formed between the two. The transfer carrier of the wafer to be transferred is vertically inserted into the wafer transfer assembly, and the empty carrier of the wafer to be carried is vertically inserted into the wafer carrying assembly. The two carriers are arranged parallel and spaced apart after insertion, and the spacing between the two can be controlled to be 2.5 mm. The middle part of the transfer carrier and the carrying carrier is a circular carrying plane, and the circular carrying plane can be made of a flexible blue film material as a carrier. The side parts can be made of rigid metal materials to facilitate clamping and handling; after the carrier is installed, the detection component arranged on the outside of the grain bearing component adjusts its position from the outside to photograph the wafer on the transfer carrier, and approaches the wafer bearing component horizontally from the outside; the transfer component arranged on the outside of the wafer transfer component approaches the wafer bearing component from the outside, and pushes the blue film of the transfer carrier straight from the outside to deform the blue film, and transfer the blue film on the carrier to the blue film on the carrier, while the detection component pushes the receiving part of the blue film of the carrier from the other side of the carrier to provide a horizontal bearing surface to prevent the blue film from being pierced by excessive push. Compared with the traditional mechanical wall rotation transfer and wafer picking and placing sorting method, which takes 50-60 milliseconds to transfer a single wafer, the direct push sorting process of the present invention can reduce the time consumption of a single wafer to less than 40 milliseconds, greatly improving the wafer sorting efficiency.

[0065] As an embodiment of the present invention, the wafer carrier 0 of the present invention is a plate-like structure, including a turntable carrier and a carrying carrier, the middle of which is a circular carrying plane, the carrying plane can be made of a blue film of a flexible material, and at least two wafers are arranged in the carrying plane; the outer side of the wafer carrier 0 is a rigid supporting part for clamping and carrying.

[0066] like Figures 5 and 6 As shown, the tray transport mechanism 3 of the present invention includes a frame 31, a first linear module 32, a second linear module 33 and a tray transport assembly 34, wherein the frame 31 is mounted on the machine table 1; the first linear module 32 is horizontally arranged on the frame 31; the second linear module 33 is connected to the output end of the first linear module 32 in a direction perpendicular to the first linear module 32; the tray transport assembly 34 is connected to the output end of the second linear module 33, and the tray transport assembly 34 is driven by the first linear module 32 and the second linear module 33 to move linearly in the longitudinal and transverse directions in the horizontal plane.

[0067] like Figures 7 to 11 As shown, the carrier transport assembly 34 of the present invention includes two groups of chuck components arranged in front and back, and the transport assembly 34 moves up and down in the vertical direction so as to approach the material box 2 or the wafer transfer mechanism 4 to pick up and place the wafer carrier 0; the transport assembly 34 guides and limits the wafer carrier 0 through a flexible ring groove. The carrier transport assembly 34 includes a transport bracket 341, a chuck component and a limiting component 349, wherein the transport bracket 341 is a rectangular frame structure; the chuck component includes two groups, and the two groups of chuck components are respectively arranged on the front and rear sides of the transport bracket 341, and move up and down in the vertical direction to clamp the carrier; the limiting component includes two groups, and the two groups of limiting components are respectively arranged on the lower sides of the transport bracket 341, and are movably arranged in the inclined direction so as to guide and limit the carrier from both sides. A guide rail 343 is vertically provided at the bottom of the transport bracket 341.

[0068] like Figure 7 As shown, as an embodiment of the present invention, the chuck component of the present invention includes a first motor 342, a first transmission belt 344, a first connecting block 345, a first chuck cylinder 346, a clamping claw bracket 347 and a first clamping claw 348, wherein the first motor 342 is horizontally arranged at the top and bottom of the transport bracket 341; the first transmission belt 344 is vertically arranged, and its upper end is sleeved on the output shaft of the first motor 342, and the lower end of the first transmission belt 344 is sleeved on the roller at the lower part of the transport bracket 341; the first chuck The cylinder 346 is slidably connected to the guide rail 343 in the vertical direction, and is connected to the first transmission belt 344 through the first connecting block 345. When the output shaft of the first motor 342 rotates, the first chuck cylinder 346 is driven to move up and down through the first transmission belt 344; the clamping jaw bracket 347 includes two, the clamping jaw bracket 347 is an inverted U-shaped structure, and is respectively connected to the output end of the first chuck cylinder 346; the first clamping jaw 348 includes two groups, and the first clamping jaws 348 are connected to the bottom of the clamping jaw bracket 347 in groups of two.

[0069] like Figure 8As shown, as another embodiment of the present invention, the chuck component of the present invention includes a second motor 3410, a second transmission belt 3411, a second connecting block 3412, a chuck slide 3413, a second chuck cylinder 3414, a second clamping jaw 3415, a third chuck cylinder 3416 and a third clamping jaw 3417, wherein the second motor 3410 is horizontally arranged at the top and bottom of the conveying bracket 341; the second transmission belt 3411 is vertically arranged, the upper end of the second transmission belt 3411 is sleeved on the output shaft of the second motor 3410, and the lower end of the second transmission belt 3411 is sleeved on the roller at the lower part of the conveying bracket 341; the chuck slide 3413 is slidably connected to the guide rail 343 in the vertical direction, and is connected to the second transmission belt 3411 through the second connecting block 3412. When the output shaft of the second motor 3410 rotates, the chuck slide 3413 is driven to move up and down through the second transmission belt 3411. The second chuck cylinder 3414 and the third chuck cylinder 3416 are respectively arranged on both sides of the lower part of the chuck slide 3413, and the output ends are arranged downward; the second clamping jaw 3415 and the third clamping jaw 3416 are respectively connected to the output shafts of the second chuck cylinder 3414 and the third chuck cylinder 3416.

[0070] like Figures 7 to 11 As shown, the limiting component 349 includes a limiting support plate 3491, a limiting wheel 3492, a limiting slide rail 3493 and a spring column 3494, wherein the limiting support plate 3491 is vertically arranged; the limiting wheel 3492 includes at least two, at least two limiting wheels 3492 are rotatably connected to the limiting support plate 3491, and are arranged at intervals along the vertical direction, and the middle part of the limiting wheel 3492 is provided with an inwardly recessed annular groove so that the edge of the carrier plate can be embedded; the limiting slide rail 3493 is arranged on the conveying bracket 341 from the middle part to the outside and upward, and is slidably connected to the limiting support plate 3491 through a slide seat; the spring column 3494 is arranged on the side wall of the limiting support plate 3491 along the direction of the limiting slide rail 3493, and the end of the spring column 3494 is connected to the conveying bracket 341.

[0071] The carrier transport mechanism 3 of the present invention is used to realize automatic pick-up and placement of the wafer carrier 0. The first linear module 32 and the second linear module 33 drive the transport component 34 to move between the material box 2 and the wafer transfer mechanism 4. The transport component 34 takes and places the wafer carrier 0 from the material box 2 or the wafer transfer mechanism 4. The transport component 34 of the present invention clamps and fixes the wafer carrier 0 from the top. The front and rear sides of the transport component 34 are respectively provided with chuck components. In the actual working process, the structural design of the double chuck components, one group of chuck components is a working component, and the other group of chuck components is a buffer component. In the actual working process, the two groups of chuck components can clamp two wafer carriers respectively, and the two wafer carriers can be respectively inserted into the wafer bearing component 41 and the wafer transfer component 42 or the two wafer transfer mechanisms 4. Through this double chuck component design, the number of carrier transports can be effectively reduced during the carrier transfer process, the time consumption of carrier transport can be effectively reduced, and the sorting efficiency of the whole machine can be improved. In addition, since the wafer carrier 0 is vertically inserted into the material box 2 or the wafer transfer mechanism 4, the wafer carrier 0 is prone to chuck during the insertion process. In order to avoid the chuck, the transport assembly 34 of the present invention guides and limits the wafer carrier 0 through the limiting component 349. Specifically, the limiting component 349 of the present invention uses a plurality of limiting wheels 3942 rotatably arranged on the limiting support plate 3491 as a guiding component, and the middle part of the limiting wheel 3492 is provided with an inwardly concave annular groove to facilitate the side of the wafer carrier 0 to be embedded, thereby playing a guiding and limiting role. At the same time, the free rolling structure of the limiting wheel 3492 effectively avoids the friction force in the limiting process; at the same time, the entire limiting support plate 3491 uses the limiting slide rail 3493 extending upward from the middle part to the outside as a sliding path, and the flexible connection of the spring column 3494 allows the limiting support plate 3491 to limit the wafer carrier 0 while avoiding the limiting wheel 3492 blocking the wafer carrier 0.

[0072] like Figure 12 to Figure 14 As shown, the wafer carrying component 41 and the wafer transfer component 42 of the present invention are vertically arranged, and the wafer carrying component 41 and the wafer transfer component 42 are arranged in parallel and spaced apart, and circular through grooves are opened correspondingly on both; a carrying plate is vertically inserted in the wafer carrying component 41, and a transfer plate is vertically inserted in the wafer transfer component 42, and the circular carrying planes of the carrying plate and the transfer plate are arranged correspondingly to the circular through grooves.

[0073] like Figures 16 to 18As shown, the wafer carrying assembly 41 of the present invention includes a carrying component, a carrying rotating component, a carrying plate 416 and a first convex ring 4111, wherein the carrying component is vertically arranged on the machine 1; the carrying plate 416 is vertically arranged on one side of the carrying component, and is rotatably connected to the side wall of the carrying component along the vertical plane direction; the carrying rotating component is arranged on the carrying component, and the output end is connected to the carrying plate 416 so as to drive the carrying plate 416 to rotate; a circular through groove is opened on the carrying plate 416; the first convex ring 4111 is arranged on the carrying plate 416 along the edge of the circular through groove and protrudes outward; the carrying plate is vertically inserted on the carrying plate 416 and fixed by the carrying plate 416, and the first convex ring 4111 pushes the carrying plane of the carrying plate outward to tension the carrying plane.

[0074] The bearing components include a bearing bracket 411, a bearing lifting motor 412 and a bearing seat 413, wherein the bearing bracket 411 is vertically arranged on the machine 1; the bearing lifting motor 412 is vertically arranged on the bearing bracket 411, and the output end is arranged upward; the bearing seat 413 is slidably connected to the side wall of the bearing bracket 411 along the vertical direction, and is connected to the output shaft of the bearing lifting motor 412 through a screw rod and a screw rod seat, and the bearing lifting motor 412 drives the bearing seat 413 to move up and down; the circular through groove passes through the side wall of the bearing seat 413.

[0075] A circular gear 417 is disposed on one side of the supporting plate 416 close to the supporting seat 413 .

[0076] The bearing rotating component includes a bearing rotating motor 414, a bearing rotating gear 415 and a bearing rotating belt 418, wherein the bearing rotating motor 414 is arranged on a side wall of the bearing seat 413, and the output shaft passes through the bearing seat 413 and extends to the other side of the bearing seat 413; the bearing rotating gear 415 is sleeved on the output shaft of the bearing rotating motor 414; the bearing rotating belt 418 is sleeved on the circular gear 417 and the bearing rotating gear 415, and is meshed and connected with the circular gear 417 and the bearing rotating gear 415. When the bearing rotating gear 415 rotates, the circular gear 417 is driven by the bearing rotating belt 418 to drive the bearing plate 416 to rotate.

[0077] At least two first magnetic blocks 419 are provided on the carrying plate 416, and at least two first magnetic blocks 419 are arranged on the outer edge of the first convex ring 4111 so as to adsorb and fix the carrying plate; an inwardly concave installation groove is opened on the side wall of the carrying plate 416, and a first sensor 4110 is embedded and fixed in the installation groove so as to sense and detect the carrying plate; the lower part of the carrying plate 416 is provided with a support platform 4112 extending horizontally outward, and the vertically inserted carrying plate is supported by the support platform 4112.

[0078] The wafer bearing assembly 41 of the present invention is used to provide support and fixation for the bearing carrier. Based on the insertion process requirements of the wafer carrier 0, in order to adjust the position of the bearing carrier, the wafer bearing assembly 41 of the present invention drives the bearing seat 413 to move up and down through the bearing lifting motor 412. The present invention uses the bearing seat 413 as the bearing body and the bearing plate 416 as the supporting body of the bearing carrier. A circular through groove is provided on the vertically arranged bearing seat 413. The side of the bearing seat 413 is rotatably connected with the bearing plate 416 along the axial direction of the circular through groove. The bearing plate 416 is correspondingly provided with a circular through groove. The outer side of the bearing plate 416 is provided with a circular gear 417. The bearing rotating motor 414 provided on the side wall of the bearing seat 413 drives the bearing plate 416 to rotate by being sleeved on the bearing rotating belt 418, thereby realizing the rotation of the bearing plate in the vertical plane. In addition, in order to support the vertically inserted carrier, an outwardly protruding support 4112 is provided on the lower side wall of the present invention to support the vertically inserted carrier. At the same time, an embedded groove is provided on the side wall of the bearing seat 413, and a first magnetic block 419 is fixed in the groove. The first magnetic blocks 419 arranged around the circular groove are used to adsorb and fix the carrier. In addition, in order to detect whether the carrier is inserted and avoid empty loading, a first sensor 4110 is also provided on the carrier 416 of the present invention.

[0079] like Fig.17 , Figure 22 to Figure 24 As shown, the detection component 43 of the present invention includes a detection drive component, a detection component and a carrier head 439, wherein the detection drive component is arranged on the side of the wafer carrier component 41, and outputs power in the longitudinal and transverse directions in the horizontal plane; the detection component is arranged on the output end of the detection drive component and is driven by the detection drive component; the carrier head 439 is arranged on the output end of the detection drive component and is located between the detection component and the wafer carrier component 41, and the end face of the carrier head 439 is close to the wafer carrier component 41 so that it can resist the carrier plate on the wafer carrier component 41 when the wafer is transferred.

[0080] The detection driving component includes a detection linear module 431, a detection base 432, a detection cylinder 433 and a detection slide 434, wherein the detection linear module 431 is horizontally arranged on the side of the wafer supporting assembly 41; the detection base 432 is arranged on the detection linear module 431 and is connected to the output end of the detection linear module 431; the detection cylinder 433 is arranged on the detection base 432 in a direction perpendicular to the detection linear module 431; the detection slide 434 is slidably arranged on the detection base 432 and is connected to the output end of the detection cylinder 433, and the detection cylinder 433 drives the detection slide 434 to move linearly.

[0081] The detection component includes a detection camera 435, a light source 436 and a light source box 437, wherein the detection camera 435 is horizontally arranged on the detection slide 434, and its lens direction is arranged toward the wafer supporting component 41; the light source box 437 is arranged on the detection slide 434 and is located outside the lens of the detection camera 435; the light source 436 includes at least two, at least two light sources 436 are arranged on the side of the light source box 437, and their light emission direction is arranged toward the wafer supporting component 41.

[0082] A vertical support plate 438 is provided at one end of the detection slide 434 close to the wafer supporting assembly 41, and a through hole is opened on the vertical support plate 438; the supporting head 439 is horizontally arranged on the side wall of the vertical support plate 438 and is arranged corresponding to the through hole. The supporting head 439 is made of transparent material so that the detection camera 435 can photograph the wafer on the transfer carrier on the wafer transfer assembly 42 through the through hole and the supporting head 439.

[0083] The detection component 43 of the present invention is used to photograph and detect the wafers on the transfer carrier. The detection component 43 drives the detection component to move longitudinally and laterally in the horizontal plane through the detection driving component to adjust the installation position; at the same time, the present invention is provided with a vertical support plate 438 extending vertically upward at the end of the detection slide 434. In order to avoid blocking the detection component, a through hole is opened on the vertical support plate 438 to pass through the left and right. A transparent supporting head 439 is provided on the side wall of the through hole close to the side of the supporting carrier. The side of the supporting head 439 close to the supporting carrier is a pushing plane. When wafer sorting is performed, the detection slide 434 drives the supporting head 439 to synchronize the movement of the transfer component 44 to press against the blue film of the supporting carrier from the outside of the supporting carrier to prevent the blue film from being excessively pushed and pierced during the wafer transfer process. The above structural design not only ensures the shooting inspection during wafer transfer, but also provides bearing support during the transfer process; at the same time, through the planar support of the carrying head, the deformation of the blue film due to resistance and pushing is avoided during the process of the carrying plate receiving the wafer, thereby affecting the wafer position of other parts of the blue film, preventing other wafers from detaching from the blue film of the carrying plate.

[0084] like Figures 19 to 21 As shown, the wafer transfer assembly 42 of the present invention includes a transfer supporting component and a transfer supporting seat 423, wherein the transfer supporting component is vertically arranged on the machine 1 and outputs upward power; the transfer supporting seat 423 is vertically connected to the output end of the transfer supporting component and is provided with a circular through groove.

[0085] The transfer bearing component includes a transfer support 421 and a transfer motor 422, wherein the transfer support 421 is vertically arranged on the machine 1; the transfer motor 422 is arranged on the transfer support 421, and the output end is arranged upward; the transfer bearing seat 423 is slidably connected to the transfer support 421 along the vertical direction, and is connected to the output end of the transfer motor 422, and is driven by the transfer motor 422 to move up and down.

[0086] A carrier plate carrying ring 424 is provided on the side wall of the transfer carrier seat 423 close to the wafer carrying component 41. The carrier plate carrying ring 424 is arranged on the outer side of the circular through groove of the transfer carrier seat 423. At least two second magnetic blocks 426 are embedded in the carrier plate carrying ring 424 to adsorb and fix the transfer carrier; the lower part of the carrier plate carrying ring 424 is provided with a carrying step 427 protruding outward to support the transfer carrier; the carrier plate carrying ring 424 is embedded with a second sensor 428 to sense whether the transfer carrier is inserted; the carrier plate carrying ring 424 is provided with a second convex ring 425, the second convex ring 425 is arranged along the edge of the circular through groove of the transfer carrier seat 423 and protrudes outward, and the transfer carrier adsorbed on the carrier plate carrying ring 424 is pushed and tensioned by the second convex ring 425.

[0087] The wafer transfer assembly 42 of the present invention is used to carry a transfer carrier for the wafer to be transferred. The present invention uses a transfer carrier seat 423 as a carrying component. The transfer carrier seat 423 is driven by the transfer motor 422 below to move up and down so as to adjust the installation position; similarly, a circular through groove is correspondingly opened on the transfer carrier seat 423, and a carrier plate carrying ring 424 is provided on the outer edge of the circular through groove. The carrier plate carrying ring 424 protrudes outward and is used to carry the transfer carrier. The lower part of the carrier plate carrying ring 424 is provided with a carrying step 427 for supporting the vertically inserted transfer carrier; at the same time, a plurality of second magnetic blocks 426 are arranged on the carrier plate carrying ring 424, and the transfer carrier is fixed by the second magnetic blocks 426, and the second sensor 428 embedded in the carrier plate bearing seat 423 is used to detect whether the transfer carrier is inserted.

[0088] like Fig.21 and Fig.25 As shown, the transfer component 44 of the present invention includes a transfer drive component and a transfer component, wherein the transfer component is arranged on the side of the wafer transfer component 42, and outputs power in the longitudinal and transverse directions in the horizontal plane; the transfer component is arranged on the output end of the transfer drive component, and moves back and forth in a straight line toward the wafer supporting component 41, so as to push the wafer on the transfer carrier on the wafer transfer component 42 to the supporting carrier on the wafer supporting component 41.

[0089] The transfer drive component includes a transfer linear module 441, a transfer support, a transfer cylinder and a transfer slide 442, wherein the transfer linear module 441 is horizontally arranged on the side of the wafer transfer component 42; the transfer support is horizontally connected to the output end of the transfer linear module 441; the transfer cylinder is arranged on the transfer support in a direction perpendicular to the transfer linear module 441; the transfer slide 442 is slidably arranged on the transfer support along the direction of the transfer cylinder and is connected to the output end of the transfer cylinder.

[0090] The transfer component includes a transfer motor 443, a transfer shaft 444, a transfer seat 445 and a transfer cap 446, wherein the transfer motor 443 is arranged on the transfer slide 442; the transfer shaft 444 is horizontally connected to the output end of the transfer motor 443, and is driven by the transfer motor 443 to move back and forth in a straight line; the transfer seat 445 is arranged on the outer side of the transfer motor 443, and the transfer shaft 444 passes through the transfer seat 445 and extends toward the wafer supporting component 41; the transfer cap 446 is connected to the end of the transfer seat 445, and a pin is horizontally arranged in the transfer cap 446, and the pin is connected to the transfer shaft 444; a pinhole is arranged on the end face of the transfer cap 446, and at least two suction holes are arranged around the pinhole; the pin is driven by the transfer shaft 444 to pass through the pinhole to push the transfer wafer, and the suction hole adsorbs and fixes the transfer carrier from the periphery.

[0091] The transfer assembly 44 of the present invention is used to perform wafer transfer operations. The transfer assembly 44 is arranged on the outside of the wafer transfer assembly 42, and moves linearly in the longitudinal and lateral directions in the horizontal plane as a whole, so as to cooperate with the lifting and lowering movement of the transfer assembly 44 to push the wafers at different positions on the blue film in the transfer carrier onto the blue film of the supporting carrier; specifically, the transfer assembly 44 of the present invention uses the transfer cap 446 as the transfer plane, and the transfer cap 446 is provided with a pinhole in the middle of the end face close to the transfer carrier. The transfer shaft 444 of the transfer motor 443 drives the pin through the pinhole to push the wafer on the transfer carrier onto the supporting carrier. At the same time, a vacuum negative pressure is formed around the transferred wafer through the air holes arranged around the pinhole to adsorb the blue film of the transfer carrier, so as to avoid the deformation of the blue film during the pushing process and affect the position of the surrounding wafers, causing other wafers to detach from the blue film.

[0092] Furthermore, as an embodiment of the present invention, the convex rings provided on the carrier ring 424 and the carrier plate 416 of the present invention protrude outwards by 0.5 mm respectively, and at the same time, the carrier plate 416 and the carrier ring 424 are respectively provided with a first convex ring 4111 and a second convex ring 425, the first convex ring 4111 and the second convex ring 425 are respectively provided on the outer edge of the circular through groove, and protrude outwards by 0.5 mm; so that the gap between the transfer carrier and the carrier after insertion is maintained at 0.5 mm, thereby ensuring the rapid transfer of the wafer. In addition, the blue film on the carrier and the transfer carrier after insertion is protruded outwards respectively through the first convex ring 4111 and the second convex ring 425, so that the blue film planes of the two are maintained in a tensioned state, which can effectively avoid the position deviation between the wafer detection position and the actual wafer position caused by the wrinkles on the blue film surface, which affects the wafer sorting.

[0093] A wafer sorting process of a direct-push wafer sorting machine includes the following process steps:

[0094] S1. Loading the full tray: The tray handling mechanism takes out the transfer tray to be sorted from the material box and vertically inserts it into the wafer carrying assembly;

[0095] S2, empty tray loading: the tray transport mechanism takes out an empty carrier turntable from the material box and vertically inserts it into the wafer transfer assembly;

[0096] S3, carrier insertion detection and fixation: After the transfer turntable and the carrying turntable are inserted in steps S1 and S2, the wafer carrying assembly and the wafer transfer assembly perform a tray detection, and if no carrier is detected, step S1 and / or step S2 are repeated; the wafer carrying assembly and the wafer transfer assembly adsorb and fix the inserted transfer carrier and the carrying carrier;

[0097] S4, adjusting the position and angle of the carrier: the transfer carrier or the carrier fixed in step S3 is adjusted in position and angle in a vertical plane via a wafer supporting assembly and a wafer transfer assembly respectively;

[0098] S5, wafer inspection: the inspection component arranged outside the wafer carrying component passes through the wafer carrying component and the carrying turntable to photograph the wafer on the transfer carrier, and uploads the photographed pattern to the industrial control center;

[0099] S6, wafer transfer: after analyzing the distribution of wafers on the transfer carrier in step S5, the industrial control center issues a control instruction to the detection component and the transfer component, wherein the transfer component pushes the transfer carrier from the outside of the wafer transfer component, pushes one wafer on the transfer carrier to the carrying carrier, and is carried from the other side by the detection component;

[0100] S7, carrier replacement: after the transfer of the same type of wafer on the transfer carrier in step S6 is completed, the carrier transport mechanism extracts the carrier and transfers it to the material box, and takes out the empty carrier from the material box and inserts it into the wafer carrying assembly;

[0101] S8, wafer sorting: After the loading tray is installed in step S7, steps S3 to S6 are repeated, and the transfer assembly transfers another wafer on the transfer tray to the loading tray, and the cycle continues until all wafers of the same type on the transfer tray are transferred to different loading trays.

[0102] The embodiments of the present invention are only to introduce its specific implementation methods and are not intended to limit its protection scope. The technicians in this industry can make some modifications inspired by this embodiment, so any equivalent changes or modifications made according to the scope of the patent of the present invention are within the scope of the patent claims of the present invention.

Claims

1. A direct-push wafer sorting machine, comprising a horizontally arranged machine platform (1) and a material box (2) arranged on the machine platform (1), wherein the material boxes (2) comprise at least two, and the tops of at least two of the material boxes (2) are open surfaces, characterized in that: It also includes a tray transport mechanism (3) and a wafer transfer mechanism (4), wherein: At least two slots are respectively provided on two symmetrically arranged inner side walls of the material box (2), and the at least two slots are arranged in a vertical direction and extend upward to the top open surface of the material box (2) to facilitate the upper and lower loading and unloading of the wafer carrier; The wafer transfer mechanism (4) comprises at least two groups, and the at least two groups of wafer transfer mechanisms (4) are arranged on the side of the material box (2); The tray transport mechanism (3) is mounted on the material box (2) and the wafer transfer mechanism (4); the tray transport mechanism (3) takes out the wafer tray to be sorted from the material box (2) and transports it to the wafer transfer mechanism (4); and transports the wafer tray after sorting in the wafer transfer mechanism (4) back to the material box (2); The wafer transfer mechanism (4) comprises a wafer bearing assembly (41), a wafer transfer assembly (42), a detection assembly (43) and a transfer assembly (44), wherein the wafer bearing assembly (41) and the wafer transfer assembly (42) are arranged at intervals, and an insertion space is formed between the two so as to insert a bearing tray and a transfer tray respectively; the detection assembly (43) and the transfer assembly (44) are respectively arranged on the side of the wafer bearing assembly (41) and the wafer transfer assembly (42); the detection assembly (43) abuts against the grain contacting portion of the bearing turntable from the outside and detects the wafer on the transfer tray; and the transfer assembly sorts and transfers the grains on the transfer tray to the bearing tray from the outside.

2. A direct-push wafer sorting machine according to claim 1, characterized in that: The tray transport mechanism (3) comprises a frame (31), a first linear module (32), a second linear module (33) and a tray transport assembly (34), wherein the frame (31) is mounted on the machine platform (1); the first linear module (32) is horizontally arranged on the frame (31); the second linear module (33) is connected to the output end of the first linear module (32) in a direction perpendicular to the first linear module (32); the tray transport assembly (34) is connected to the output end of the second linear module (33), and the tray transport assembly (34) is driven by the first linear module (32) and the second linear module (33) to move linearly in the longitudinal and transverse directions in a horizontal plane.

3. A direct-push wafer sorting machine according to claim 2, characterized in that: The carrier plate transport assembly (34) comprises two groups of chuck components arranged front and back, and the transport assembly (34) moves up and down in a vertical direction so as to approach the material box (2) or the wafer transfer mechanism (4) to take and place the wafer carrier plate (0); the transport assembly (34) guides and limits the wafer carrier plate (0) through a flexible annular groove.

4. The direct-push wafer sorting machine according to claim 1, characterized in that: The wafer carrier (0) is a plate-shaped structure, the middle of which is a circular bearing plane, and at least two wafers are arranged in the bearing plane; the outer side of the wafer carrier (0) is a rigid support part for clamping and carrying.

5. The direct-push wafer sorting machine according to claim 1, characterized in that: The wafer bearing assembly (41) and the wafer transfer assembly (42) are arranged vertically, and the wafer bearing assembly (41) and the wafer transfer assembly (42) are arranged in parallel and spaced apart, and circular through grooves are correspondingly provided on both of them; a bearing tray is vertically inserted in the wafer bearing assembly (41), and a transfer tray is vertically inserted in the wafer transfer assembly (42), and the circular bearing planes of the bearing tray and the transfer tray are arranged corresponding to the circular through grooves.

6. The direct-push wafer sorting machine according to claim 1, characterized in that: The wafer supporting assembly (41) comprises a supporting component, a supporting rotating component, a supporting plate (416) and a first convex ring (4111), wherein the supporting component is vertically arranged on the machine platform (1); the supporting plate (416) is vertically arranged on one side of the supporting component and is rotatably connected to the side wall of the supporting component along a vertical plane direction; the supporting rotating component is arranged on the supporting component, and the output end is connected to the supporting plate (416) so as to drive the supporting plate (416) to rotate; a circular through groove is opened on the supporting plate (416); the first convex ring (4111) is arranged on the supporting plate (416) along the edge of the circular through groove and protrudes outward; the supporting plate is vertically inserted on the supporting plate (416) and fixed by the supporting plate (416), and the first convex ring (4111) pushes the supporting plane of the supporting plate outward to tension the supporting plane.

7. The direct-push wafer sorting machine according to claim 1, characterized in that: The detection component (43) includes a detection drive component, a detection component and a carrier head (439), wherein the detection drive component is arranged on the side of the wafer carrier component (41) and outputs power in the longitudinal and transverse directions in the horizontal plane; the detection component is arranged on the output end of the detection drive component and is driven by the detection drive component; the carrier head (439) is arranged on the output end of the detection drive component and is located between the detection component and the wafer carrier component (41), and the end face of the carrier head (439) is closely attached to the wafer carrier component (41) so as to abut against the carrier plate on the wafer carrier component (41) when the wafer is transferred.

8. The direct-push wafer sorting machine according to claim 1, characterized in that: The wafer transfer assembly (42) comprises a transfer bearing component and a transfer bearing seat (423), wherein the transfer bearing component is vertically arranged on the machine platform (1) and outputs upward power; the transfer bearing seat (423) is vertically connected to the output end of the transfer bearing component and is provided with a circular through groove.

9. The direct-push wafer sorting machine according to claim 1, characterized in that: The transfer component (44) comprises a transfer drive component and a transfer component, wherein the transfer component is arranged on the side of the wafer transfer component (42) and outputs power in the longitudinal and transverse directions in the horizontal plane; the transfer component is arranged on the output end of the transfer drive component and moves back and forth in a straight line in the direction of the wafer supporting component (41) so as to push and transfer the wafer on the transfer carrier on the wafer transfer component (42) to the carrier on the wafer supporting component (41).

10. A wafer sorting process of a direct-push wafer sorting machine as claimed in any one of claims 1 to 9, characterized in that: The process steps include: S1. Loading the full tray: The tray handling mechanism takes out the transfer tray to be sorted from the material box and vertically inserts it into the wafer carrying assembly; S2, empty tray loading: the tray transport mechanism takes out an empty carrier turntable from the material box and vertically inserts it into the wafer transfer assembly; S3, carrier insertion detection and fixation: After the transfer turntable and the carrying turntable are inserted in steps S1 and S2, the wafer carrying assembly and the wafer transfer assembly perform a tray detection, and if no carrier is detected, step S1 and / or step S2 are repeated; the wafer carrying assembly and the wafer transfer assembly adsorb and fix the inserted transfer carrier and the carrying carrier; S4, adjusting the position and angle of the carrier: the transfer carrier or the carrier fixed in step S3 is adjusted in position and angle in a vertical plane via a wafer supporting assembly and a wafer transfer assembly respectively; S5, wafer inspection: the inspection component arranged outside the wafer carrying component passes through the wafer carrying component and the carrying turntable to photograph the wafer on the transfer carrier, and uploads the photographed pattern to the industrial control center; S6, wafer transfer: after analyzing the distribution of wafers on the transfer carrier in step S5, the industrial control center issues a control instruction to the detection component and the transfer component, wherein the transfer component pushes the transfer carrier from the outside of the wafer transfer component, pushes one wafer on the transfer carrier to the carrying carrier, and is carried from the other side by the detection component; S7, carrier replacement: after the transfer of the same type of wafer on the transfer carrier in step S6 is completed, the carrier transport mechanism extracts the carrier and transfers it to the material box, and takes out the empty carrier from the material box and inserts it into the wafer carrying assembly; S8, wafer sorting: After the loading tray is installed in step S7, steps S3 to S6 are repeated, and the transfer assembly transfers another wafer on the transfer tray to the loading tray, and the cycle continues until all wafers of the same type on the transfer tray are transferred to different loading trays.

Images