Chip inductor solder paste judging apparatus

By designing a surface mount inductor solder paste inspection device, which uses a CCD camera and control module to automatically determine the qualification of the solder paste application area, the problem of low efficiency of manual inspection is solved, and efficient and accurate automated inspection is achieved.

CN115846801BActive Publication Date: 2025-12-19ZHUHAI SBS PRECISION TECH CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202211671793.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-26
Publication Date
2025-12-19
Estimated Expiration
2042-12-26

AI Technical Summary

Technical Problem

In the current production process of surface mount inductors, the qualification of the solder paste application area relies on manual screening, which results in high cost, low efficiency, and easy errors.

Method used

A surface mount inductor solder paste inspection device was designed. It uses a CCD camera and control module to automatically determine the qualification of the solder paste application area, and uses mold components and unloading components to realize the automatic separation and recycling of defective products.

Benefits of technology

It enables automatic determination of solder paste application areas, saving labor costs and improving determination efficiency and accuracy.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115846801B_ABST
    Figure CN115846801B_ABST
Patent Text Reader

Abstract

The application discloses a patch type inductor tin paste judging device, which comprises a rack and a control module. The rack is provided with a mold assembly. The rack is further provided with a CCD camera in sequence along a first direction. When the mold assembly slides along the first direction, a plurality of patch type inductors on the mold assembly can pass under the CCD camera in sequence. The CCD camera is electrically connected with the control module. The CCD camera can send image information to the control module. A waste tray is used for receiving unqualified patch type inductors. A blanking assembly is provided with a plurality of first suction members. The plurality of first suction members can correspondingly adsorb the plurality of patch type inductors on the mold assembly. The control module can control the first suction member corresponding to the unqualified patch type inductor to release the patch type inductor when the blanking assembly slides to above the waste tray according to the image information. The application can automatically judge whether the tin paste coating area on the patch type inductor is qualified or not, can save labor cost, and can improve judging efficiency and accuracy.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the field of inductance production equipment, in particular to a patch inductance solder paste determination device. BACKGROUND

[0002] Patch inductance has the characteristics of miniaturization, high quality, high energy storage and low resistance. In the production process of patch inductance, solder paste needs to be applied on the surface of inductance. The solder paste can complete the mechanical connection and electrical connection of components and circuit board through current.

[0003] The application area of the solder paste needs to meet the requirements, otherwise it will affect the connection quality of the inductance and the circuit board in the subsequent process. In the existing production process of patch inductance, whether the application area of the solder paste on the inductance meets the standard is checked by manual screening, which has high labor cost and low screening efficiency. In addition, the volume of patch inductance is usually small, and manual screening is easy to miss. SUMMARY

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application provides a patch inductance solder paste determination device, which can automatically determine whether the application area of the solder paste on the patch inductance is qualified, can save labor cost, and improve determination efficiency and accuracy.

[0005] According to the patch inductance solder paste determination device of the present application, the machine frame is provided with a mold assembly capable of sliding in a first direction, the mold assembly is suitable for supporting a plurality of patch inductances, and the machine frame is further provided with a CCD camera in sequence along the first direction. The CCD camera is used to obtain image information of the patch inductance below the CCD camera. When the mold assembly slides in the first direction, a plurality of patch inductances on the mold assembly can pass below the CCD camera in sequence. The CCD camera is electrically connected with the control module, and the CCD camera can send the image information to the control module. A waste tray is used to receive unqualified patch inductances. A blanking assembly can slide relative to the machine frame along the first direction. The blanking assembly is provided with a plurality of first suction members, and a plurality of first suction members can correspondingly suction a plurality of patch inductances on the mold assembly. The blanking assembly is electrically connected with the control module, and the control module can control the first suction member corresponding to the unqualified patch inductance to release the patch inductance when the blanking assembly slides to above the waste tray according to the image information. The machine frame is provided with a blanking position tray below the blanking assembly, and the blanking position tray is used to support the qualified patch inductance transferred by the blanking assembly.

[0006] At least has the following beneficial effects: when the tin paste coating area on the plurality of patch inductors needs to be determined, the plurality of patch inductors can be placed on the mold assembly, when the mold assembly supports the plurality of patch inductors and slides in the first direction, the plurality of patch inductors on the mold assembly will pass under the CCD camera in turn, the CCD camera can obtain the image information of the patch inductor under the CCD camera, and the image information is sent to the control system; then, the control system can determine whether the tin paste coating area on the patch inductor is unqualified according to the above image information, when the patch inductor is unqualified, the control system can control the corresponding first suction element of the discharging assembly to release the unqualified patch inductor when moving above the waste tray, the unqualified patch inductor will fall into the waste tray and wait for recycling, and the qualified patch inductor will be moved and placed on the discharging position tray by the discharging assembly. The present application can automatically determine whether the tin paste coating area on the patch inductor is qualified, can save labor cost, and can improve determination efficiency and accuracy.

[0007] According to some embodiments of the application, the rack is further provided with a feeding position tray and a feeding assembly, the feeding position tray is used to support a plurality of patch inductors, and the feeding assembly can slide in the first direction relative to the rack. The feeding assembly can suck the plurality of patch inductors in the feeding position tray and transfer the plurality of patch inductors to the mold assembly.

[0008] According to some embodiments of the application, the number of patch inductors that can be supported by the mold assembly is equal to the number of patch inductors that can be supported by the feeding position tray, and the number of patch inductors that can be supported by the discharging position tray in the first direction is an integer multiple of the number of patch inductors that can be supported by the mold assembly.

[0009] According to some embodiments of the present application, the feeding assembly comprises a sliding block, a bracket and a plurality of second suction accessories, the sliding block is arranged on the rack and slides in the first direction, the bracket is arranged on the sliding block and slides in the vertical direction, the second suction accessories are arranged on the bracket and slide vertically between a first position and a second position relative to the bracket, the first position is directly above the second position, a plurality of the second suction accessories can correspondingly suck a plurality of the patch inductors in the feeding tray, a plurality of proximity sensors are installed on the bracket, a plurality of the proximity sensors correspond to a plurality of the second suction accessories one-to-one, the proximity sensors are used to detect whether an object is blocked within a certain distance in the horizontal direction, the control module is electrically connected with a plurality of the proximity sensors and a plurality of the second suction accessories, a plurality of accommodation grooves are arranged on the feeding tray, a plurality of the accommodation grooves are used to accommodate a plurality of the patch inductors respectively, when the second suction accessories are in the second position, the proximity sensors are not blocked by the second suction accessories, when the bracket moves downward and the lower end of the second suction accessories is attached to the top surface of the patch inductor, the bracket continues to move downward by a preset distance to make the second suction accessories in the first position, at this time, the top of the second suction accessories blocks the proximity sensors, and the preset distance is less than the groove depth of the accommodation grooves.

[0010] According to some embodiments of the present application, a compression elastic member is arranged between the second suction accessory and the bracket, and two ends of the compression elastic member are respectively connected with the second suction accessory and the bracket.

[0011] According to some embodiments of the present application, the mold assembly comprises a base plate and a first clamping plate and a second clamping plate, the first clamping plate and the second clamping plate are both arranged on the base plate and can clamp and fix the patch inductor on the base plate.

[0012] According to some embodiments of the present application, a plurality of placement positions are arranged on the base plate, a limiting protrusion is arranged at each of the placement positions, the limiting protrusion can resist one side of the patch inductor in the first direction, the first clamping plate is provided with a plurality of first abutting blocks corresponding to a plurality of the placement positions, the first clamping plate can slide in the first direction to clamp the patch inductor between the first abutting blocks and the limiting protrusions in the first direction, the second clamping plate is provided with a plurality of second abutting blocks corresponding to a plurality of the placement positions, the second clamping plate can slide in a horizontal plane in a second direction perpendicular to the first direction, and the second clamping plate can clamp the patch inductor between the second abutting blocks and the limiting protrusions in the second direction.

[0013] According to some embodiments of the present application, the limiting protrusion has a first limiting surface and a second limiting surface, an included angle between the first limiting surface and the second limiting surface is 90°, the first clamping plate can clamp the patch inductor between the first abutting block and the first limiting surface, and the second clamping plate can clamp the patch inductor between the second abutting block and the second limiting surface.

[0014] Additional aspects and advantages of the present application will be given, partially in the following description, partially become obvious from the following description, or be understood by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0015] The present application will be further described below in conjunction with the drawings and embodiments, in which:

[0016] Figure 1 Structure schematic diagram of an embodiment of the present application;

[0017] Figure 2 Partial structure schematic diagram of a blanking position of a blanking tray and a blanking assembly of an embodiment of the present application;

[0018] Figure 3 Structure schematic diagram of a feeding assembly when a second suction accessory is located at a first position in an embodiment of the present application;

[0019] Figure 4 Structure schematic diagram of a feeding assembly when a second suction accessory is located at a first position in an embodiment of the present application; Figure 3 Partial enlarged structure schematic diagram of position A in the above figure;

[0020] Figure 5 Structure schematic diagram of a mounting position of a CCD camera in an embodiment of the present application;

[0021] Figure 6 Structure schematic diagram of a mold assembly in an embodiment of the present application;

[0022] Figure 7 Structure schematic diagram of a mold assembly in an embodiment of the present application; Figure 6 Partial structure schematic diagram of position B in the above figure.

[0023] LIST OF ELEMENTS IN THE DRAWINGS

[0024] Rack 100, blanking position tray 110, feeding position tray 120;

[0025] Mold assembly 200, base plate 210, blanking position 211, limiting protrusion 222, first limiting surface 223, second limiting surface 224, first clamping plate 220, first abutting block 221, second clamping plate 230, second abutting block 231;

[0026] Patch inductor 300, tin paste smearing area 310;

[0027] CCD camera 400;

[0028] Waste tray 500;

[0029] Blanking assembly 600, first suction accessory 610;

[0030] Feeding assembly 700, sliding block 710, support 720, second suction accessory 730, proximity sensor 740. DETAILED DESCRIPTION

[0031] Embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the present application, and cannot be understood as a limitation of the present application.

[0032] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by the upper, lower, first direction, second direction, etc. is based on the orientation or position relationship shown in the drawings, only for the purpose of facilitating the description of the present application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0033] In the description of the present application, if there is a description of first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of indicated technical features.

[0034] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0035] Referring to Figures 1 to 7 The embodiment of the present application discloses a patch inductor tin paste determination device, which comprises a rack 100 and a control module, the rack 100 is provided with a mold assembly 200 which can slide in a first direction, the mold assembly 200 can support a plurality of patch inductors 300, and the rack 100 is further provided with a CCD camera 400, a waste tray 500 and a blanking assembly 600 in sequence along the first direction.

[0036] The CCD camera 400 is used to acquire image information of the patch inductor 300 below the CCD camera 400, when the mold assembly 200 slides along the first direction, the plurality of patch inductors 300 on the mold assembly 200 can pass below the CCD camera 400 in turn, the CCD camera 400 is electrically connected with the control module, the CCD camera 400 can send the image information to the control module, the waste tray 500 is used to support the unqualified patch inductor 300, the blanking assembly 600 can slide along the first direction relative to the rack 100, the blanking assembly 600 is provided with a plurality of first suction members 610, the plurality of first suction members 610 can correspondingly adsorb the plurality of patch inductors 300 on the mold assembly 200, the blanking assembly 600 is electrically connected with the control module, the control module can control the first suction member 610 corresponding to the unqualified patch inductor 300 to release the patch inductor 300 when the blanking assembly 600 slides to above the waste tray 500 according to the image information, and the rack 100 is provided with a blanking material tray 110 below the blanking assembly 600, and the blanking material tray 110 is used to support the qualified patch inductor 300 transferred by the blanking assembly 600.

[0037] It can be understood that when it is needed to determine whether the tin paste coating area 310 on the plurality of patch inductors 300 is qualified, the plurality of patch inductors 300 can be first placed on the mold assembly 200, when the mold assembly 200 supports the plurality of patch inductors 300 and slides along the first direction, the plurality of patch inductors 300 on the mold assembly 200 can pass below the CCD camera 400 in turn, the CCD camera 400 can acquire the image information of the patch inductor 300 below and send the image information to the control system, then the control system can determine whether the tin paste coating area 310 on the patch inductor 300 is unqualified according to the above image information, when the patch inductor 300 is unqualified, the control system can control the corresponding first suction member 610 on the blanking assembly 600 to release the unqualified patch inductor 300 when the first suction member 610 moves to above the waste tray 500, the unqualified patch inductor 300 falls into the waste tray 500 to wait for recycling, and the remaining qualified patch inductor 300 is transferred by the blanking assembly 600 and placed on the blanking material tray 110. The present application can automatically determine whether the tin paste coating area 310 on the patch inductor 300 is qualified, can save labor cost, and improve determination efficiency and accuracy.

[0038] It should be noted that the CCD camera has strong scanning function, good image definition, and can capture images at any time. The CCD camera is a commonly used device in the processing, manufacturing and testing process in the field, and its specific structure and principle are common knowledge in the field, which will not be described here.

[0039] In addition, the first suction accessory 610 described above can be a suction disc connected to a negative pressure source. When the first suction accessory 610 adsorbs the unqualified patch inductor 300, the control module can cut off the communication between the corresponding first suction accessory 610 and the negative pressure source.

[0040] As shown in Figures 1 to 3 The rack 100 is further provided with a feeding tray 120 and a feeding assembly 700. The feeding tray 120 is used to support a plurality of patch inductors 300. The feeding assembly 700 can slide relative to the rack 100 along a first direction. The feeding assembly 700 can suck the plurality of patch inductors 300 in the feeding tray 120 and transfer the plurality of patch inductors 300 to the mold assembly 200. By providing the feeding assembly 700, the continuous supply of patch inductors 300 to the mold assembly 200 can be realized, and the continuous automatic determination of a large number of patch inductors 300 can be realized.

[0041] It can be understood that the number of patch inductors 300 that the mold assembly 200 in the embodiment of the present application can support is equal to the number of patch inductors 300 that the feeding tray 120 can support. The number of patch inductors 300 that the unloading tray 110 can support in the first direction is an integer multiple of the number of patch inductors 300 that the mold assembly 200 can support. For example, when the mold assembly 200 can support ten patch inductors 300, the feeding tray 120 can also support ten patch inductors 300. At this time, the feeding assembly 700 can transfer ten patch inductors 300 from the feeding tray 120 to the mold assembly 200. Correspondingly, the number of patch inductors 300 that the unloading tray 110 can support in the first direction can be twenty, that is, the unloading assembly 600 needs to transfer the patch inductors 300 on the mold assembly 200 twice to fill a row of material placement positions of the unloading tray 110 in the first direction. It should be noted that the unloading assembly 600 needs to be staggered by a certain distance between each time it is transferred to the position of the unloading tray 110. The above distance is the distance between adjacent patch inductors 300 in the unloading tray 110. Specifically, the number of patch inductors 300 that the unloading tray 110 can support in the first direction is designed to be an integer multiple of the number of patch inductors 300 that the mold assembly 200 can support. This can make the patch inductors 300 in the unloading tray 110 more closely arranged, saving space. Designing the number of patch inductors 300 that the mold assembly 200 can support to be equal to the number of patch inductors 300 that the feeding tray 120 can support can make the adjacent patch inductors 300 on the mold assembly 200 have a proper distance, preventing the CCD camera from being unable to identify due to the proximity of the patch inductors 300.

[0042] Referring to Figure 3 and Figure 4The feeding assembly 700 in the embodiment of the present application comprises a sliding block 710, a support 720 and a plurality of second suction accessories 730. The sliding block 710 is arranged on the rack 100 and slides in the first direction. The support 720 is arranged on the sliding block 710 and can slide in the vertical direction. The second suction accessories 730 are arranged on the support 720 and can slide vertically relative to the support 720 between the first position and the second position. The first position is directly above the second position. The plurality of second suction accessories 730 can correspondingly suck the plurality of patch inductors 300 in the feeding position tray 120. A plurality of proximity sensors 740 are installed on the support 720. The plurality of proximity sensors 740 correspond to the plurality of second suction accessories 730 one by one. The proximity sensor 740 is used to detect whether an object is blocked within a certain distance in the horizontal direction. The proximity sensor is a commonly used sensor in the field, and its structure and working principle will not be described here. The control module is electrically connected with the plurality of proximity sensors 740 and the plurality of second suction accessories 730. The feeding position tray 120 is arranged with a plurality of accommodation grooves for respectively accommodating the plurality of patch inductors 300. When the second suction accessory 730 is located at the second position, the proximity sensor 740 is not blocked by the second suction accessory 730. When the support 720 moves downward and the lower end of the second suction accessory 730 is attached to the top surface of the patch inductor 300, the support 720 can continue to move downward by a preset distance to make the second suction accessory 730 located at the first position. At this time, the top of the second suction accessory 730 blocks the proximity sensor 740. The preset distance is less than the groove depth of the accommodation groove.

[0043] Specifically, when some of the accommodation grooves in the feeding position tray 120 lack patch inductors 300, after the support 720 moves downward and the lower end of the second suction accessory 730 is attached to the top surface of the patch inductor 300, if the support 720 continues to move downward by a preset distance, the second suction accessory 730 corresponding to the accommodation groove lacking the patch inductor 300 will not be stopped by the patch inductor 300. The lower end of the second suction accessory 730 will extend into the accommodation groove. Therefore, this part of the second suction accessory 730 is still located at the second position, and the top of the second suction accessory 730 located at the second position will not block the proximity sensor 740. Conversely, the second suction accessory 730 corresponding to the accommodation groove containing the patch inductor 300 will be lifted upward relative to the support 720 to the first position due to the upward stopping force of the patch inductor 300. At this time, the top of the second suction accessory 730 at the first position will block the proximity sensor 740. By arranging the proximity sensor 740 and the second suction accessory 730 that can slide, the feeding assembly 700 can determine whether there is no patch inductor 300 placed in the accommodation groove, thereby preventing the patch inductor 300 from being missed on the feeding position tray 120.

[0044] The second suction accessory 730 can be a suction cup connected with a negative pressure source. It should be noted that if the patch inductor 300 is missed in the feeding position 120, the second suction accessory 730 at the position where the patch inductor 300 is missed will produce air leakage when the feeding assembly 700 moves the patch inductor 300, which will easily cause the suction force of other second suction accessories 730 to weaken, thereby causing the patch inductor 300 to fall off during the movement of the feeding assembly 700.

[0045] It can be understood that the second suction accessory 730 in the embodiment of the present application is provided between the support 720 and the second suction accessory 730, and a compression elastic member (not shown in the figure) is arranged at both ends of the compression elastic member, and the two ends of the compression elastic member are connected with the second suction accessory 730 and the support 720, respectively. The compression elastic member can assist the second suction accessory 730 to move downward to the second position. Of course, in the embodiment without the compression elastic member, the second suction accessory 730 can also return to the second position by gravity.

[0046] Referring to Figure 6 and Figure 7 The mold assembly 200 includes a base plate 210 and a first clamping plate 220 and a second clamping plate 230, and the first clamping plate 220 and the second clamping plate 230 are both slidingly arranged on the base plate 210, and the first clamping plate 220 and the second clamping plate 230 can clamp and fix the patch inductor 300 on the base plate 210. In the embodiment without the first clamping plate 220 and the second clamping plate 230, the patch inductor 300 only needs to be placed in the plurality of feeding positions 211 on the mold assembly 200. However, in order to make the position of the patch inductor 300 on the base plate 210 more accurate, so that the CCD camera 400 can acquire image information more quickly and accurately, the first clamping plate 220 and the second clamping plate 230 can be arranged, and when the patch inductor 300 is placed on the base plate 210, the first clamping plate 220 and the second clamping plate 230 can slide a certain distance and clamp the patch inductor 300, thereby realizing the positioning of the patch inductor 300.

[0047] Referring to Figure 6 and Figure 7The substrate 210 is provided with a plurality of storage positions 211, and a limiting protrusion 222 is arranged at each storage position 211 of the substrate 210 and can resist one side of the chip inductor 300 in the first direction. The first clamping plate 220 is provided with a plurality of first abutting blocks 221 corresponding to the plurality of storage positions 211, and the first clamping plate 220 can slide in the first direction to clamp the chip inductor 300 between the first abutting block 221 and the limiting protrusion 222 in the first direction, that is, the first clamping plate 220 can clamp the chip inductor 300 from the first direction. It can be understood that the sliding of the first clamping plate 220 can drive the plurality of first abutting blocks 221 on the first clamping plate 220 to slide synchronously in the first direction, so that the synchronous positioning of the plurality of chip inductors 300 in the first direction can be realized. In addition, the second clamping plate 230 is provided with a plurality of second abutting blocks 231 corresponding to the plurality of storage positions 211, and the second clamping plate 230 can slide in the horizontal plane in the second direction perpendicular to the first direction. The second clamping plate 230 can clamp the chip inductor 300 between the second abutting block 231 and the limiting protrusion 222 in the second direction, that is, the second clamping plate 230 can clamp the chip inductor 300 from the second direction. It can be understood that the sliding of the second clamping plate 230 can drive the plurality of second abutting blocks 231 on the second clamping plate 230 to slide synchronously in the second direction, so that the synchronous positioning of the plurality of chip inductors 300 in the second direction can be realized. It should be noted that the sliding of the first clamping plate 220 and the second clamping plate 230 can be driven by the air cylinder.

[0048] As shown in Figure 6 and Figure 7 The limiting protrusion 222 has a first limiting surface 223 and a second limiting surface 224, and the included angle between the first limiting surface 223 and the second limiting surface 224 is 90°, that is, the first limiting surface 223 and the second limiting surface 224 form a 90° corner on the limiting protrusion 222. The first clamping plate 220 can clamp the chip inductor 300 between the first abutting block 221 and the first limiting surface 223, and the second clamping plate 230 can clamp the chip inductor 300 between the second abutting block 231 and the second limiting surface 224.

[0049] The technical features of the above-mentioned embodiments can be combined in any manner. In order to make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0050] Of course, the present application is not limited to the above-mentioned embodiments, and those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A patch type inductance solder paste judging device characterized by, The machine frame and the control module, the machine frame is provided with a mold assembly which can slide along a first direction, the mold assembly is suitable for supporting a plurality of the patch inductors, the machine frame is further provided with: a CCD camera for acquiring image information of the patch inductors below the CCD camera, when the mold assembly slides along the first direction, a plurality of the patch inductors on the mold assembly can pass below the CCD camera in turn, the CCD camera is electrically connected with the control module, and the CCD camera can send the image information to the control module; a waste tray for supporting unqualified patch inductors; a blanking assembly which can slide along the first direction relative to the machine frame, the blanking assembly is provided with a plurality of first suction members, and the plurality of first suction members can correspondingly adsorb a plurality of the patch inductors on the mold assembly, the blanking assembly is electrically connected with the control module, and the control module can control the first suction member corresponding to the unqualified patch inductor to release the patch inductor when the blanking assembly slides to above the waste tray according to the image information; wherein the machine frame is provided below the blanking assembly with a blanking material tray for supporting qualified patch inductors transferred by the blanking assembly.

2. The patch type inductance solder paste judging apparatus according to claim 1, wherein The machine frame is further provided with a feeding material tray and a feeding assembly, the feeding material tray is used for supporting a plurality of the patch inductors, the feeding assembly can slide along a first direction relative to the machine frame, the feeding assembly can adsorb a plurality of the patch inductors in the feeding material tray and transfer the plurality of the patch inductors to the mold assembly.

3. The patch type inductance solder paste judging apparatus according to claim 2, wherein The number of the patch inductors supported by the mold assembly is equal to the number of the patch inductors supported by the feeding material tray, and the number of the patch inductors supported by the blanking material tray in the first direction is an integer multiple of the number of the patch inductors supported by the mold assembly.

4. The patch type inductance solder paste judging apparatus according to claim 2, wherein The feeding assembly comprises a sliding block, a bracket and a plurality of second suction accessories. The sliding block is arranged on the rack and slides in the first direction. The bracket is arranged on the sliding block and slides in the vertical direction. The second suction accessories are arranged on the bracket and slide vertically relative to the bracket between a first position and a second position. The first position is directly above the second position. The plurality of second suction accessories can correspondingly suck the plurality of patch inductors in the feeding tray. A plurality of proximity sensors are installed on the bracket. The plurality of proximity sensors correspond to the plurality of second suction accessories one by one. The proximity sensors are used to detect whether an object is blocked within a certain distance in the horizontal direction. The control module is electrically connected to the plurality of proximity sensors and the plurality of second suction accessories. The feeding tray is arranged with a plurality of accommodation grooves. The plurality of accommodation grooves are used to accommodate the plurality of patch inductors respectively. When the second suction accessory is in the second position, the proximity sensor is not blocked by the second suction accessory. When the bracket moves downward and the lower end of the second suction accessory is attached to the top surface of the patch inductor, the bracket continues to move downward by a preset distance to make the second suction accessory in the first position. At this time, the top of the second suction accessory blocks the proximity sensor. The preset distance is less than the groove depth of the accommodation groove.

5. The patch type inductance solder paste judgment device according to claim 4, characterized by A compression elastic member is arranged between the second suction accessory and the bracket. The two ends of the compression elastic member are connected to the second suction accessory and the bracket respectively.

6. The patch type inductance solder paste judgment device according to claim 1, wherein The mold assembly comprises a base plate and a first clamping plate and a second clamping plate. The first clamping plate and the second clamping plate are both slidingly arranged on the base plate. The first clamping plate and the second clamping plate can clamp and fix the patch inductor on the base plate.

7. The patch type inductance solder paste judgment device according to claim 6, wherein The base plate is arranged with a plurality of placement positions. The base plate is arranged with a limiting protrusion at each placement position. The limiting protrusion can resist one side of the patch inductor in the first direction. The first clamping plate is arranged with a plurality of first abutting blocks corresponding to the plurality of placement positions. The first clamping plate can slide in the first direction to clamp the patch inductor between the first abutting block and the limiting protrusion in the first direction. The second clamping plate is arranged with a plurality of second abutting blocks corresponding to the plurality of placement positions. The second clamping plate can slide in the horizontal plane in a second direction perpendicular to the first direction. The second clamping plate can clamp the patch inductor between the second abutting block and the limiting protrusion in the second direction.

8. The patch type inductance solder paste judgment device according to claim 7, wherein The limiting protrusion has a first limiting surface and a second limiting surface. The included angle between the first limiting surface and the second limiting surface is 90°. The first clamping plate can clamp the patch inductor between the first abutting block and the first limiting surface. The second clamping plate can clamp the patch inductor between the second abutting block and the second limiting surface.

Citation Information

Patent Citations

  • Power lithium ion battery pole piece defect automatic detection method

    CN104730084A

  • Automatic assembling and feeding machine for heat conduction blocks

    CN112676672A