Multi-layer ceramic electronic component

Abstract

The present disclosure provides a multilayer ceramic electronic component. The multilayer ceramic electronic component has a ceramic body, the ceramic body includes dielectric layers and a plurality of internal electrodes opposite to each other, and the dielectric layers are interposed between the plurality of internal electrodes. External electrodes are provided outside the ceramic body and electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to the internal electrode and a conductive resin layer disposed on the electrode layer. The conductive resin layer extends to a first surface and a second surface of the ceramic body, and the ratio of the thickness (Tb) of the conductive resin layer extending to the first surface and the second surface of the ceramic body to the length (Lm) of the edge portion in the length direction of the ceramic body satisfies 2% to 29%.

Description

[0001] This application is a divisional application of the invention patent application with the application date of May 5, 2019, the application number of 201910367183.3, and the invention title of "Multilayer Ceramic Electronic Component". Technical Field

[0002] The present disclosure relates to a multilayer ceramic electronic component, and more particularly, to a multilayer ceramic electronic component having excellent reliability. Background Art

[0003] In recent years, the miniaturization, thinning, and multifunctionalization of electronic products have required the miniaturization of multilayer ceramic capacitors, and the mounting of multilayer ceramic capacitors has also become highly integrated.

[0004] A multilayer ceramic capacitor (an electronic component) can be mounted on a printed circuit board of various electronic products (for example, imaging devices such as liquid crystal displays (LCDs) or plasma display panels (PDPs), computers, personal digital assistants (PDAs), mobile phones, etc.), and can be used for charging or discharging.

[0005] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its relatively compact size, relatively high capacitance, relatively easy mounting, etc.

[0006] In addition, with the recent increase in industrial interest in electrical / electronic components, multilayer ceramic capacitors are also required to have high reliability and high strength in order to be used in vehicles or infotainment systems.

[0007] In particular, since high flexural strength characteristics are expected for multilayer ceramic capacitors, it is advantageous to improve the internal structure and external structure to enhance the bending performance. Summary of the Invention

[0008] One aspect of the present disclosure is to provide a multilayer ceramic electronic component, and more particularly, to provide a multilayer ceramic electronic component having excellent reliability.

[0009] According to one aspect of the present disclosure, a multilayer ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes facing each other, and the dielectric layers are interposed between the plurality of internal electrodes. The ceramic body includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. External electrodes are provided on the outside of the ceramic body and electrically connected to the internal electrodes. The ceramic body includes: an effective portion including the plurality of internal electrodes facing each other, and the dielectric layers are interposed between the plurality of internal electrodes to form a capacitor; and a covering portion formed above and below the effective portion. Each external electrode includes an electrode layer electrically connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer extends to the first surface and the second surface of the ceramic body. The ratio of the thickness (Tb) of the conductive resin layer extending to the first surface and the second surface of the ceramic body to the length (Lm) of the edge portion in the length direction of the ceramic body satisfies 2% to 29%.

[0010] According to another aspect of the present disclosure, a multilayer ceramic electronic component has a ceramic body including a dielectric layer and a plurality of first inner electrodes and a plurality of second inner electrodes facing each other, and the dielectric layer is interposed between the first inner electrodes and the second inner electrodes. The ceramic body includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. A first outer electrode and a second outer electrode are provided on the outside of the ceramic body and are electrically connected to the first inner electrode and the second inner electrode, respectively. The ceramic body includes: an effective portion including the plurality of first inner electrodes and the plurality of second inner electrodes facing each other, and the dielectric layer is interposed between the first inner electrodes and the second inner electrodes to form a capacitor; and a covering portion formed above and below the effective portion. The first outer electrode includes a first electrode layer electrically connected to the first inner electrode and a first conductive resin layer disposed on the first electrode layer, and the second outer electrode includes a second electrode layer electrically connected to the second inner electrode and a second conductive resin layer disposed on the second electrode layer. The first conductive resin layer and the second conductive resin layer extend to the first surface and the second surface of the ceramic body. The length of the region where the first conductive resin layer and the second conductive resin layer extend to the first surface and the second surface of the ceramic body is greater than the length of the region where the first electrode layer and the second electrode layer extend to the first surface and the second surface of the ceramic body. The ratio of the thickness (Tb) of the first conductive resin layer and the second conductive resin layer extending to the first surface and the second surface of the ceramic body to the length (Lm) of the edge portion in the length direction of the ceramic body satisfies 2% to 29%.

[0011] According to another aspect of the present disclosure, a multilayer ceramic electronic component has a body including a plurality of first internal electrodes and a plurality of second internal electrodes stacked alternately with each other, and dielectric layers are interposed between the first internal electrodes and the second internal electrodes. The first internal electrode has a first end extending to a first surface of the body and a second end opposite to the first end of the first internal electrode and separated from a second surface. The second internal electrode has a first end extending to the second surface of the body and a second end opposite to the first end of the second internal electrode and separated from the first surface. The second surface and the first surface face away from each other. A first external electrode and a second external electrode are respectively disposed on the first surface and the second surface of the body and extend to a third surface and a fourth surface facing away from each other in a stacking direction of the first internal electrode and the second internal electrode. Each of the first external electrode and the second external electrode includes an electrode layer extending a first distance on the third surface and the fourth surface and a conductive resin layer disposed on the electrode layer and extending a second distance on the third surface and the fourth surface. The second distance is greater than the first distance. The ratio of the thickness (Tb) of the conductive resin layer on the third surface and the fourth surface to the length (Lm) by which the second end of the first internal electrode is separated from the second surface and the ratio of the thickness (Tb) of the conductive resin layer on the third surface and the fourth surface to the length (Lm) by which the second end of the second internal electrode is separated from the first surface are in the range of 2% to 29%. Description of the Drawings

[0012] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure;

[0014] Figure 2 is a schematic diagram showing a ceramic body according to an embodiment of the present disclosure;

[0015] Figure 3 is along Figure 1 sectional view taken along line I-I' in; and

[0016] Figure 4 is Figure 3 an enlarged view of part B in. Detailed Description of the Embodiments

[0017] Embodiments of the present disclosure can be modified to have various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Embodiments of the present disclosure are also provided to more fully describe the present disclosure to those skilled in the art. Therefore, for clarity, the shapes and sizes of the elements in the drawings may be exaggerated, and the elements denoted by the same reference numerals in the drawings are the same elements.

[0018] Throughout the specification, unless otherwise specifically stated, when an element is referred to as "including" a component, this means that the element may also include other components, rather than excluding other components.

[0019] To clearly illustrate the present disclosure, parts irrelevant to the description are omitted, and the thickness is exaggerated to clearly represent the layers and regions, and throughout the specification, similar parts are denoted by similar reference numerals.

[0020] Hereinafter, preferred embodiments of the present disclosure will be described with reference to the drawings.

[0021] Figure 1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure.

[0022] Figure 2 is a schematic view showing a ceramic body according to an embodiment of the present disclosure.

[0023] Figure 3 is along Figure 1 a cross-sectional view taken along line I-I' in

[0024] Referring to Figures 1 to 3 , a multilayer ceramic electronic component 100 according to an embodiment of the present disclosure may include a ceramic body 110, the ceramic body 110 including a plurality of dielectric layers 111 and a plurality of inner electrodes 121 and 122 facing each other, and the dielectric layer 111 being interposed between the plurality of inner electrodes 121 and 122. The ceramic body 110 includes a first surface S1 and a second surface S2 facing each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first surface S1 and the second surface S2 and facing each other in a second direction, and a fifth surface S5 and a sixth surface S6 connected to the first surface S1 to the fourth surface S4 and facing each other in a third direction. Outer electrodes 131 and 132 are provided on the outside of the ceramic body 110 and are electrically connected to the inner electrodes 121 and 122, respectively. The ceramic body 110 includes: an effective portion A including a plurality of inner electrodes 121 and 122 facing each other, and the dielectric layer 111 being interposed between the plurality of inner electrodes 121 and 122 to form a capacitance; and covering portions C1 and C2 formed above and below the effective portion A in the stacking direction of the inner electrodes.

[0025] Hereinafter, an illustrative multilayer ceramic electronic component according to an embodiment of the present disclosure will be described, but the present disclosure is not limited thereto.

[0026] In a multilayer ceramic capacitor according to an embodiment of the present disclosure, the "length direction" of the multilayer ceramic capacitor refers to Figure 1 the "L" direction, the "width direction" of the multilayer ceramic capacitor refers to Figure 1 the "W" direction, and the "thickness direction" of the multilayer ceramic capacitor refers to Figure 1 the "T" direction. The "thickness direction" may be used in the same sense as the direction in which the dielectric layers are stacked upward (e.g., the "stacking direction").

[0027] In an embodiment of the present disclosure, the shape of the ceramic body 110 is not particularly limited, but may be a hexahedral shape as shown.

[0028] The ceramic body 110 may include a first surface S1 and a second surface S2 facing each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first surface S1 and the second surface S2 and facing each other in a second direction, and a fifth surface S5 and a sixth surface S6 connected to the first surface S1 to the fourth surface S4 and facing each other in a third direction.

[0029] The first surface S1 and the second surface S2 may be defined as facing each other in the thickness direction (i.e., the first direction) of the ceramic body 110, the third surface S3 and the fourth surface S4 may be defined as facing each other in the length direction (i.e., the second direction) of the ceramic body 110, and the fifth surface S5 and the sixth surface S6 may be defined as facing each other in the width direction (i.e., the third direction) of the ceramic body 110.

[0030] One end of each of the plurality of internal electrodes 121 and 122 formed in the ceramic body 110 may be exposed to the third surface S3 or the fourth surface S4 of the ceramic body.

[0031] The internal electrodes 121 and 122 may have a first internal electrode 121 and a second internal electrode 122 having different polarities and arranged in pairs in the body 110.

[0032] One end of the first internal electrode 121 may be exposed to the third surface S3, and one end of the second internal electrode 122 may be exposed to the fourth surface S4.

[0033] The other end of the first internal electrode 121 and the other end of the second internal electrode 122 may be formed to be separated from the fourth surface S4 or the third surface S3 at regular intervals. More specific details thereof will be described later.

[0034] The first external electrode 131 and the second external electrode 132 may be formed on the third surface S3 and the fourth surface S4 of the ceramic body, respectively, and may be electrically connected to the internal electrodes 121 and 122, respectively.

[0035] According to an embodiment of the present disclosure, the raw material for forming the dielectric layer 111 is not particularly limited as long as a sufficient electrostatic capacitance can be obtained. For example, a barium titanate-based material, a composite lead calcium titanate-based material, a strontium titanate-based material, etc. may be used.

[0036] For the purpose of the present disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added together with barium titanate (BaTiO3) powder or the like (the material for forming the dielectric layer 111).

[0037] The ceramic body 110 may include: an effective portion A, which serves as a portion that contributes to the formation of the capacitance of the capacitor; and an upper covering portion C1 and a lower covering portion C2, which are formed as an upper edge portion and a lower edge portion above and below (in the stacking direction) of the effective portion A, respectively.

[0038] The effective portion A may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 and interposing the dielectric layer 111 between the first internal electrode 121 and the second internal electrode 122.

[0039] Except that the upper covering portion C1 and the lower covering portion C2 do not include internal electrodes, the upper covering portion C1 and the lower covering portion C2 may have the same material and structure as those of the dielectric layer 111.

[0040] For example, the upper covering portion C1 and the lower covering portion C2 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0041] The upper covering portion C1 and the lower covering portion C2 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the effective portion A in the vertical direction, and may be basically used to prevent the internal electrodes from being damaged by physical stress or chemical stress.

[0042] The material for forming the first internal electrode 121 and the second internal electrode 122 is not particularly limited, and the first internal electrode 121 and the second internal electrode 122 may be formed of a conductive paste including one or more of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), and copper (Cu).

[0043] The multilayer ceramic capacitor according to an embodiment of the present disclosure may include a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122.

[0044] The first outer electrode 131 and the second outer electrode 132 can be electrically connected to the first inner electrode 121 and the second inner electrode 122 respectively to form an electrostatic capacitance, and the second outer electrode 132 can be connected to a potential different from that of the first outer electrode 131.

[0045] The first outer electrode 131 and the second outer electrode 132 can be disposed on the third surface S3 and the fourth surface S4 in the length direction (i.e., the second direction) of the ceramic body 110 respectively, but can extend to the first surface S1 and the second surface S2 in the thickness direction (i.e., the first direction) of the ceramic body 110.

[0046] The outer electrodes 131 and 132 can be provided outside the ceramic body 110, and can include electrode layers 131a and 132a electrically connected to and in direct contact with the inner electrodes 121 and 122, and conductive resin layers 131b and 132b disposed on the electrode layers 131a and 132a.

[0047] Specifically, the first outer electrode 131 can be disposed on the third surface S3 in the length direction (i.e., the second direction) of the ceramic body 110, and can include a first electrode layer 131a directly disposed on the third surface S3 to be electrically connected to the first inner electrode 121, and a first conductive resin layer 131b disposed on the first electrode layer 131a.

[0048] In addition, the second outer electrode 132 can be disposed on the fourth surface S4 in the length direction (i.e., the second direction) of the ceramic body 110 and be electrically connected to the second inner electrode 122, and the second outer electrode 132 can include a second electrode layer 132a directly disposed on the fourth surface S4 to be electrically connected to the second inner electrode 122, and a second conductive resin layer 132b disposed on the second electrode layer 132a.

[0049] The electrode layers 131a and 132a can include a conductive metal and glass.

[0050] There is no particular limitation on the conductive metal for the electrode layers 131a and 132a, as long as the conductive metal is a material that can be electrically connected to the inner electrode for forming an electrostatic capacitance. For example, the conductive metal can be one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and their alloys.

[0051] The electrode layers 131a and 132a can be formed by coating a conductive paste prepared by adding a frit to the powder of the conductive metal and then firing the conductive paste.

[0052] The conductive resin layers 131b and 132b can be formed on the electrode layers 131a and 132a, and can be formed to completely cover the electrode layers 131a and 132a.

[0053] The base resins included in the conductive resin layers 131b and 132b are not particularly limited as long as the base resins have adhesiveness and impact absorption ability, and can be mixed with conductive metal powder to form a paste. For example, the base resin may include an epoxy resin.

[0054] The conductive metal included in the conductive resin layers 131b and 132b is not particularly limited as long as the conductive metal is a material that can be electrically connected to the electrode layers 131a and 132a. For example, the conductive metal may include one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and their alloys.

[0055] The conductive resin layers 131b and 132b may overhang on the edges of the electrode layers 131a and 132a so as to extend to the first surface S1 and the second surface S2 of the ceramic body 110. The ratio of the thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the longitudinal edge portion of the ceramic body 110 (only the longitudinal portion where the first inner electrodes 121 overlap each other or only the longitudinal portion where the second inner electrodes 122 overlap each other) may satisfy 2% to 29%.

[0056] According to an embodiment of the present disclosure, the conductive resin layers 131b and 132b may overhang on the edges of the electrode layers 131a and 132a so as to extend to the first surface S1 and the second surface S2 of the ceramic body 110. The ratio of the thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the longitudinal edge portion of the ceramic body 110 may satisfy 2% to 29%. Therefore, the bending strength of the multilayer ceramic capacitor can be improved.

[0057] The thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 may be the maximum thickness among the thicknesses of the conductive resin layers 131b and 132b.

[0058] In addition, the length Lm of the longitudinal edge portion of the ceramic body 110 may be the length extending from one of the third surface S3 and the fourth surface S4 of the ceramic body 110 to the end (e.g., the proximal end) of the region where the plurality of inner electrodes 121 and 122 provided in the effective portion A overlap each other.

[0059] Generally, when evaluating the bending strength characteristics of a multilayer ceramic capacitor, the number of dielectric layers on which inner electrodes are printed and the coating degree of the conductive resin layer as a secondary electrode in the outer electrode may be important factors for ensuring the bending strength.

[0060] In particular, as the number of stacked layers increases, the proportion of the inner electrodes can be relatively high to improve the bending strength. In addition, when the proportion of the inner electrodes is relatively low, the bending strength may deteriorate.

[0061] In addition, when the proportion of the inner electrodes affects the improvement of the strength of the multilayer ceramic capacitor, a conductive resin layer of the secondary electrode as the outer electrode can be coated as a device for absorbing or treating stress generated by external actions. Therefore, recently, attempts have been made to achieve a certain level of bending strength by increasing the coating amount.

[0062] In an embodiment of the present disclosure, the ratio of the thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the lengthwise edge portion, which is a region where the proportion (or number) of the inner electrodes in the ceramic body 110 is relatively low, can be controlled. Therefore, the bending strength of the multilayer ceramic capacitor can be improved.

[0063] For example, the ratio of the thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the lengthwise edge portion of the ceramic body 110 can be controlled to satisfy 2% to 29%. Therefore, the bending strength of the multilayer ceramic capacitor can be improved.

[0064] When the ratio of the thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the lengthwise edge portion of the ceramic body 110 is less than 2%, defects may occur when measuring the bending strength of 5 mm, and the effect of improving the bending strength may not be exhibited.

[0065] When the ratio of the thickness Tb of the conductive resin layers 131b and 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the lengthwise edge portion of the ceramic body 110 exceeds 29%, the outer electrode may have a relatively high thickness. Therefore, the reliability may be reduced due to poor appearance of the finished product, voids in the conductive resin layer, etc.

[0066] Figure 4 is Figure 3 an enlarged view of part B in.

[0067] Referring to Figure 4 , in the multilayer ceramic electronic component according to an embodiment of the present disclosure, the thickness td of the dielectric layer 111 (for example, the distance between two adjacent inner electrodes 121 and 122) and the thickness te of the inner electrodes 121 and 122 (for example, the distance between two adjacent dielectric layers 111 having an inner electrode therebetween) can satisfy the relationship td > 2 × te.

[0068] For example, according to an embodiment of the present disclosure, the thickness td of the dielectric layer 111 may be greater than twice the thickness te of the inner electrodes 121 and 122.

[0069] Generally, since the dielectric breakdown voltage decreases in an environment of relatively high voltage, electronic components in high-voltage electrical / electronic devices may have reliability problems.

[0070] The multilayer ceramic capacitor according to an embodiment of the present disclosure can increase the dielectric breakdown voltage characteristic by increasing the thickness td of the dielectric layer 111 to be greater than twice the thickness te of the inner electrodes 121 and 122 to prevent the dielectric breakdown voltage from decreasing in an environment of relatively high voltage.

[0071] When the thickness td of the dielectric layer 111 is twice or less than the thickness te of the inner electrodes 121 and 122, the dielectric breakdown voltage may decrease due to the relatively thin dielectric layer (distance between the inner electrodes).

[0072] The thickness te of the inner electrode may be less than 1 μm, and the thickness td of the dielectric layer may be less than 2.8 μm, but is not limited thereto.

[0073] A multilayer ceramic electronic component 100 according to another embodiment of the present disclosure may include: a ceramic body 110 including a dielectric layer 111 and a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 facing each other, and the dielectric layer 111 is interposed between the first internal electrodes 121 and the second internal electrodes 122. The ceramic body 110 includes a first surface S1 and a second surface S2 facing each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first surface S1 and the second surface S2 and facing each other in a second direction, and a fifth surface S5 and a sixth surface S6 connected to the first surface S1 to the fourth surface S4 and facing each other in a third direction; a first external electrode 131 and a second external electrode 132 respectively disposed on the outside of the ceramic body 110 and electrically connected to the first internal electrode 121 and the second internal electrode 122 respectively. The ceramic body 110 includes: an effective portion A including a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 facing each other, and the dielectric layer 111 is interposed between the first internal electrodes 121 and the second internal electrodes 122 to form a capacitor; and covering portions C1 and C2 formed above and below the effective portion A. The first external electrode 131 includes a first electrode layer 131a electrically connected to and in contact with the first internal electrode 121 and a first conductive resin layer 131b disposed on the first electrode layer 131a. The second external electrode 132 includes a second electrode layer 132a electrically connected to and in contact with the second internal electrode 122 and a second conductive resin layer 132b disposed on the second electrode layer 132a. The first conductive resin layer 131b and the second conductive resin layer 132b extend to the first surface S1 and the second surface S2 of the ceramic body 110, and the length of the region where the first conductive resin layer 131b and the second conductive resin layer 132b extend to (and extend beyond) the first surface S1 and the second surface S2 of the ceramic body 110 is greater than the length of the region where the first electrode layer 131a and the second electrode layer 132a extend to the first surface S1 and the second surface S2 of the ceramic body 110, and the ratio of the thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the edge portion in the length direction of the ceramic body 110 satisfies 2% to 29%.

[0074] In the description of the multilayer ceramic electronic component according to another embodiment of the present disclosure, components that are the same as those of the multilayer ceramic electronic component according to the embodiment of the present disclosure above may be omitted herein to avoid redundant explanations.

[0075] According to another embodiment of the present disclosure, the lengths of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the regions of the first surface S1 and the second surface S2 of the ceramic body 110 (e.g., the length from the third surface S3 in the length direction to the farthest point of the first conductive resin layer 131b on the first surface S1 and the second surface S2, or the length from the fourth surface S4 in the length direction to the farthest point of the second conductive resin layer 132b on the first surface S1 and the second surface S2) may be greater than the lengths of the first electrode layer 131a and the second electrode layer 132a extending to the regions of the first surface S1 and the second surface S2 of the ceramic body 110 (e.g., the length from the third surface S3 in the length direction to the farthest point of the first electrode layer 131a on the first surface S1 and the second surface S2, or the length from the fourth surface S4 in the length direction to the farthest point of the second electrode layer 132a on the first surface S1 and the second surface S2).

[0076] For example, the first conductive resin layer 131b and the second conductive resin layer 132b may be respectively formed on the first electrode layer 131a and the second electrode layer 132a, and may be formed to completely cover the first electrode layer 131a and the second electrode layer 132a by extending beyond the ends of the first electrode layer 131a and the second electrode layer 132a to contact the first surface S1 and the second surface S2.

[0077] Therefore, the lengths of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the regions of the first surface S1 and the second surface S2 of the ceramic body 110 may be set to be greater than the lengths of the first electrode layer 131a and the second electrode layer 132a extending to the regions of the first surface S1 and the second surface S2 of the ceramic body 110.

[0078] The first external electrode 131 and the second external electrode 132 may be provided on the outside of the ceramic body 110, and the first external electrode 131 may include a first electrode layer 131a electrically connected to the first internal electrode 121 and a first conductive resin layer 131b provided on the first electrode layer 131a, and the second external electrode 132 may include a second electrode layer 132a electrically connected to the second internal electrode 122 and a second conductive resin layer 132b provided on the second electrode layer 132a.

[0079] Specifically, the first external electrode 131 may be provided on the third surface S3 in the length direction (i.e., the second direction) of the ceramic body 110, and may include a first electrode layer 131a electrically connected to (and physically contacting) the first internal electrode 121 and a first conductive resin layer 131b provided on the first electrode layer 131a.

[0080] In addition, the second external electrode 132 may be disposed on the fourth surface S4 in the length direction (i.e., the second direction) of the ceramic body 110 and electrically connected to the second internal electrode 122, and may include a second electrode layer 132a electrically connected to (and physically contacting) the second internal electrode 122 and a second conductive resin layer 132b disposed on the second electrode layer 132a.

[0081] Hereinafter, a method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present disclosure will be described, but the present disclosure is not limited thereto.

[0082] A method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present disclosure may include first applying a slurry formed of a powder such as barium titanate (BaTiO3) onto a carrier film and drying it to form a plurality of green ceramic sheets to form a dielectric layer.

[0083] The green ceramic sheet may be prepared by mixing ceramic powder, a binder, and a solvent to prepare a slurry and forming a sheet having a thickness of several micrometers by performing a doctor blade method on the slurry.

[0084] Next, an internal electrode conductive paste having an average nickel particle size of 0.1 μm to 0.2 μm and containing 40 to 50 parts by weight (based on 100 parts by weight of the internal electrode conductive paste) of nickel powder may be provided.

[0085] The internal electrode conductive paste may be applied onto the green ceramic sheet by a screen printing method to form an internal electrode pattern, and then the green ceramic sheets on which the internal electrode patterns are disposed may be stacked to form the ceramic body 110.

[0086] Next, an electrode layer including one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof and glass may be formed on the outside of the ceramic body.

[0087] The glass is not particularly limited, and a material having the same composition as the glass used for manufacturing the external electrode of a conventional multilayer ceramic capacitor may be used.

[0088] The electrode layer may be formed on the upper surface, the lower surface, and the ends of the ceramic body to be electrically connected to the first internal electrode and the second internal electrode, respectively.

[0089] Based on the conductive metal, the electrode layer may contain 5% by volume or more of glass.

[0090] Next, the conductive resin composition may be applied onto the electrode layers 131a and 132a and then cured to form the conductive resin layers 131b and 132b.

[0091] The conductive resin layers 131b and 132b may include one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and their alloys, and a matrix resin, and the matrix resin may be an epoxy resin.

[0092] According to an embodiment of the present disclosure, the conductive resin layer may be provided to extend to the first surface and the second surface of the ceramic body, and the ratio of the thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the lengthwise edge portion of the ceramic body 110 may satisfy 2% to 29%.

[0093] The thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 may be the maximum thickness among the thicknesses of the conductive resin layers 131b and 132b, and may be measured substantially perpendicular to the first surface S1 and the second surface S2 of the ceramic body 110.

[0094] In addition, the length Lm of the lengthwise edge portion of the ceramic body 110 may be the length from the third surface S3 and the fourth surface S4 of the ceramic body 110 to the end of the region where the plurality of internal electrodes 121 and 122 provided in the effective portion A overlap, and may be measured in the length direction substantially perpendicular to the third surface and the fourth surface.

[0095] Hereinafter, the occurrence frequency of bending cracks is measured according to the ratio of the thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the lengthwise edge portion of the ceramic body 110, and the value is recorded in Table 1.

[0096] In the case of measuring the frequency of bending cracks, a sample of the multilayer ceramic capacitor is mounted on a substrate. The distance of the central portion subjected to bending pressure is set to 5 mm, and each of the 60 samples is measured five times and observed to determine whether the bending strength at 5 mm is ensured.

[0097] [Table 1]

[0098] sample Tb / Lm A B C D E *1 1.0％ 3 / 60 1 / 60 1 / 60 2 / 60 1 / 60 2 2.0％ 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 3 10.0％ 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 4 15.0％ 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 5 29.0％ 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 *6 30.0％ 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

[0099] *: Comparative example

[0100] Referring to Table 1, it can be seen that in the case of Samples 2 to 5 where the ratio of the thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the longitudinal edge portion of the ceramic body 110 satisfies 2% to 29%, the flexural strength at a distance of up to 5 mm can be satisfied.

[0101] In contrast, it can be seen that in Comparative Example 1 where the ratio of the thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the longitudinal edge portion of the ceramic body 110 is less than 2%, defects may occur when measuring the flexural strength at 5 mm, and the effect of enhancing the flexural strength may not be exhibited.

[0102] In the case of Comparative Example 6 where the ratio of the thickness Tb of the first conductive resin layer 131b and the second conductive resin layer 132b extending to the first surface S1 and the second surface S2 of the ceramic body 110 to the length Lm of the longitudinal edge portion of the ceramic body 110 exceeds 29%, the flexural strength characteristics can be satisfied, but the thickness of the outer electrode may be relatively high. Therefore, the reliability may be reduced due to poor appearance of the finished product, voids in the conductive resin layer, etc.

[0103] According to an embodiment of the present disclosure, the ratio of the thickness Tb of the first conductive resin layer and the second conductive resin layer extending to the first surface and the second surface of the ceramic body to the length Lm of the longitudinal edge portion of the ceramic body can be controlled. Therefore, the flexural strength can be improved and the reliability can be improved.

[0104] Although the exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and changes can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: a ceramic body including a plurality of dielectric layers and a plurality of internal electrodes facing each other, and the dielectric layers are interposed between the plurality of internal electrodes, the ceramic body including a first surface and a second surface facing away from each other in a first direction corresponding to the stacking direction of the internal electrodes, a third surface and a fourth surface connected to the first surface and the second surface and facing away from each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing away from each other in a third direction, the second direction being the length direction of the ceramic body; and external electrodes provided on the third surface and the fourth surface of the ceramic body and electrically connected to the internal electrodes, wherein the ceramic body includes: an effective portion including the plurality of internal electrodes facing each other, and the dielectric layers are interposed between the plurality of internal electrodes to form a capacitor; and a covering portion formed above and below the effective portion and having no internal electrodes, each external electrode includes an electrode layer provided on the third surface and the fourth surface to be electrically connected to at least some of the internal electrodes and a conductive resin layer disposed on the electrode layer, and the conductive resin layer extends to the first surface and the second surface of the ceramic body, a ratio of a thickness Tb of the conductive resin layer extending to the first surface and the second surface of the ceramic body to a length Lm of an edge portion in the length direction of the ceramic body satisfies 2% to 29%, the edge portion in the length direction being between the third surface and / or the fourth surface and a region where the plurality of internal electrodes provided in the effective portion overlap, and wherein a thickness td of the dielectric layer and a thickness te of the internal electrode are different from each other.

2. The multilayer ceramic electronic component according to claim 1, wherein, The thickness Tb of the conductive resin layer extending to the first surface and the second surface of the ceramic body is a maximum thickness among the thicknesses of the conductive resin layer measured perpendicular to the first surface.

3. The multilayer ceramic electronic component according to claim 1, wherein, The length Lm of the edge portion in the length direction of the ceramic body is a length measured in the second direction from an end of the third surface or the fourth surface of the ceramic body to an end of a region where the plurality of internal electrodes provided in the effective portion overlap.

4. The multilayer ceramic electronic component according to claim 1, wherein, The electrode layer includes one or more conductive metals selected from the group consisting of copper, silver, nickel, and alloys thereof.

5. The multilayer ceramic electronic component according to claim 1, wherein, The conductive resin layer includes one or more conductive metals selected from the group consisting of copper, silver, nickel, and alloys thereof and a matrix resin.

6. The multilayer ceramic electronic component according to claim 1, wherein, The thickness te of the internal electrode is less than 1 μm.

7. The multilayer ceramic electronic component according to claim 1, wherein, The thickness td of the dielectric layer is less than 2.8 μm.

8. The multilayer ceramic electronic component according to claim 1, wherein, td is the thickness of the dielectric layer, te is the thickness of the internal electrode, and they satisfy the relationship td > 2×te.

9. A multilayer ceramic electronic component, comprising: A ceramic body includes a plurality of dielectric layers, and a plurality of first inner electrodes and a plurality of second inner electrodes facing each other, and the dielectric layers are interposed between the first inner electrodes and the second inner electrodes. The ceramic body includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. The second direction is the length direction of the ceramic body; and a first outer electrode and a second outer electrode are provided on the outside of the ceramic body and are electrically connected to the first inner electrode and the second inner electrode respectively, wherein, the ceramic body includes: an effective portion including the plurality of first inner electrodes and the plurality of second inner electrodes facing each other, and the dielectric layers are interposed between the first inner electrodes and the second inner electrodes to form a capacitor; and a covering portion formed above and below the effective portion in the first direction, the first outer electrode includes a first electrode layer electrically connected to the first inner electrode and a first conductive resin layer disposed on the first electrode layer, the second outer electrode includes a second electrode layer electrically connected to the second inner electrode and a second conductive resin layer disposed on the second electrode layer, and the first conductive resin layer and the second conductive resin layer extend to the first surface and the second surface of the ceramic body, the length of the regions where the first conductive resin layer and the second conductive resin layer extend to the first surface and the second surface of the ceramic body is greater than the length of the regions where the first electrode layer and the second electrode layer extend to the first surface and the second surface of the ceramic body, the ratio of the thickness Tb of the first conductive resin layer and the second conductive resin layer extending to the first surface and the second surface of the ceramic body to the length Lm of the edge portion in the length direction of the ceramic body satisfies 2% to 29%. The edge portion in the length direction is located between the third surface and the plurality of second inner electrodes and / or between the fourth surface and the plurality of first inner electrodes, and wherein, the thickness td of the dielectric layer and the thickness te of the first inner electrode and the second inner electrode are different from each other.

10. The multilayer ceramic electronic component according to claim 9, wherein, The thickness Tb of the first conductive resin layer and the second conductive resin layer extending to the first surface and the second surface of the ceramic body is the maximum thickness of the thickness of the first conductive resin layer measured perpendicular to the first surface and the maximum thickness of the thickness of the second conductive resin layer measured.

11. The multilayer ceramic electronic component according to claim 9, wherein, The length Lm of the edge portion in the length direction of the ceramic body is the shortest distance measured in the second direction from the third surface or the fourth surface of the ceramic body to the end of the region where the first inner electrode and the second inner electrode provided in the effective portion overlap.

12. The multilayer ceramic electronic component according to claim 9, wherein, Each of the first electrode layer and the second electrode layer includes one or more conductive metals selected from the group consisting of copper, silver, nickel, and alloys thereof.

13. The multilayer ceramic electronic component according to claim 9, wherein, Each of the first conductive resin layer and the second conductive resin layer includes one or more conductive metals selected from the group consisting of copper, silver, nickel, and alloys thereof and a matrix resin.

14. The multilayer ceramic electronic component according to claim 9, wherein, The thickness te of the first inner electrode and the second inner electrode is less than 1 μm.

15. The multilayer ceramic electronic component according to claim 9, wherein, The thickness td of the dielectric layer is less than 2.8 μm.

16. The multilayer ceramic electronic component according to claim 9, wherein, td is the thickness of the dielectric layer, and te is the thickness of the first inner electrode and the second inner electrode, satisfying the relationship td > 2 × te.

17. A multilayer ceramic electronic component, comprising: A body including a plurality of first inner electrodes and a plurality of second inner electrodes stacked alternately with each other, and a dielectric layer interposed between the first inner electrode and the second inner electrode. The first inner electrode has a first end extending to a first surface of the body and a second end opposite to the first end of the first inner electrode and separated from a second surface. The second inner electrode has a first end extending to the second surface of the body and a second end opposite to the first end of the second inner electrode and separated from the first surface. The second surface and the first surface face away from each other. And A first outer electrode and a second outer electrode respectively disposed on the first surface and the second surface of the body and extending to a third surface and a fourth surface facing away from each other in the stacking direction of the first inner electrode and the second inner electrode, wherein each of the first outer electrode and the second outer electrode includes an electrode layer extending a first distance on the third surface and the fourth surface and a conductive resin layer disposed on the electrode layer and extending a second distance on the third surface and the fourth surface. The second distance is greater than the first distance, and the ratio of the thickness Tb of the conductive resin layer on the third surface and the fourth surface to the length Lm by which the second end of the first inner electrode is separated from the second surface and the ratio of the thickness Tb of the conductive resin layer on the third surface and the fourth surface to the length Lm by which the second end of the second inner electrode is separated from the first surface are in the range of 2% to 29%, and wherein the thickness td of the dielectric layer and the thickness te of the first inner electrode and the second inner electrode are different from each other.

18. The multilayer ceramic electronic component according to claim 17, wherein, The thickness Tb of the conductive resin layer is the maximum thickness of the conductive resin layer measured perpendicular to the third surface.

19. The multilayer ceramic electronic component according to claim 17, wherein, The thickness te of the first inner electrode and the second inner electrode is less than 1 μm, and the thickness td of the dielectric layer is less than 2.8 μm.

20. The multilayer ceramic electronic component according to claim 17, wherein, td is the thickness of the dielectric layer, and te is the thickness of the first inner electrode and the second inner electrode, satisfying the relationship td > 2 × te.

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