Bonded wafer bubble detection apparatus and singulation system

Abstract

The application relates to the technical field of semiconductor manufacturing, and particularly discloses a bonded wafer bubble detection device and a sorting system. The device is used for detecting bonded wafers and comprises a platform and a wafer carrier. The platform is provided with an infrared light source and a detection module. The infrared light source is used for irradiating a bonded wafer located at a detection position. The detection module comprises a stand, a first visual detection unit fixed to the stand and a second visual detection unit movably installed on the stand. The first visual detection unit is directly opposite the detection position. The second visual detection unit is selectively arranged between the first visual detection unit and the line connecting the detection position. The platform is provided with at least two bearing positions. The wafer carrier is the same as the number of bearing positions and corresponds to the bearing positions. The wafer carrier is used for moving the bonded wafer between the detection position and one bearing position. The device is designed in a mode that multiple wafer carriers share the same detection module, thereby optimizing the detection process, improving the detection efficiency, and facilitating the switching of the visual detection mode with the aid of the improvement of the detection module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a bonded wafer bubble detection device and a sorting system. BACKGROUND

[0002] With the entry into the post-Moore era, the size of transistors in semiconductor manufacturing has approached the physical limit, bringing great challenges to chip manufacturing. In order to ensure the integration per unit area, a wafer bonding method can be used to bond different wafers to improve the integration. In the wafer bonding process, two wafers are usually pasted face to face, and a certain pressure, temperature, voltage, etc. is applied to the two wafers, so that covalent bond, metal bond, molecular bond, etc. are generated at the interface of the two wafers, and the two wafers are combined into one to form a bonded wafer. During the wafer bonding process, air at the bonding interface is not timely discharged or there are small particles at the bonding interface, which often forms a bubble defect at the bonding interface.

[0003] At present, the ultrasonic detection method is mainly used to detect the bubble defect of the bonding interface of the bonded wafer. The ultrasonic detection method needs to place the bonded wafer in a liquid medium, and the detection speed is slow and the bonded wafer is easy to be contaminated. At the same time, the continuous detection of the existing detection device on the bonded wafer needs to stop after the detection of any bonded wafer is completed, and then wait for the unloading of the current bonded wafer and the feeding of the next bonded wafer, thereby wasting a lot of time in the feeding and unloading process of the bonded wafer.

[0004] Therefore, it is urgent to provide a detection device capable of batch and rapid detection of the bubble defect of the bonded wafer. SUMMARY

[0005] The present application aims to provide a bonded wafer bubble detection device and a sorting system to optimize the detection process of the bubble defect of the bonded wafer, facilitate the switching of the visual detection mode, and improve the detection efficiency.

[0006] To achieve this purpose, the present application adopts the following technical solutions:

[0007] The bonded wafer bubble detection device for detecting a bonded wafer comprises a platform and a wafer carrier; the platform is provided with an infrared light source and a detection module; the infrared light source is used for irradiating the bonded wafer located at a detection position; the detection module comprises a column, a first visual detection unit fixed to the column and a second visual detection unit movably mounted to the column; the first visual detection unit is opposite to the detection position; the second visual detection unit is selectively arranged between the first visual detection unit and the detection position; the platform is provided with at least two bearing positions; the wafer carrier is in one-to-one correspondence with the bearing positions and is used for moving the bonded wafer between the detection position and one of the bearing positions.

[0008] As a preferred technical scheme of the bonded wafer bubble detection device, the detection module further comprises a linear actuator; the linear actuator is used for controlling the second visual detection unit to switch between a shielding position and an avoiding position; when the second visual detection unit is in the shielding position, the second visual detection unit receives the light of the infrared light source passing through the bonded wafer located at the detection position; when the second visual detection unit is in the avoiding position, the first visual detection unit receives the light of the infrared light source passing through the bonded wafer located at the detection position.

[0009] As a preferred technical scheme of the bonded wafer bubble detection device, the second visual detection unit is fixed to the linear actuator; the column is provided with an actuator slide rail; the linear actuator is slidably arranged on the actuator slide rail; the linear actuator can drive the second visual detection unit to move between the shielding position and the avoiding position.

[0010] As a preferred technical scheme of the bonded wafer bubble detection device, the platform is provided with a first slide rail; the first slide rail is in one-to-one correspondence with the wafer carrier; the first slide rail enables the wafer carrier to slide between the detection position and one of the bearing positions.

[0011] As a preferred technical scheme of the bonded wafer bubble detection device, the wafer carrier comprises a first slide table, a second slide table and a carrier main body; the first slide table is slidably arranged on the first slide rail; the first slide table is provided with a second slide rail; the extension direction of the second slide rail is at an angle to the extension direction of the corresponding first slide rail; the second slide table is slidably arranged on the second slide rail; the carrier main body is fixed to the second slide table; and the carrier main body is used for carrying the bonded wafer.

[0012] As a preferred technical scheme of the bonded wafer bubble detection device, the bearing positions are two; the two first slide rails are connected end to end and extend along a first direction; and the detection position is located between the two bearing positions.

[0013] As a preferred technical solution of the bonded wafer bubble detection device, the second sliding rail extends along a second direction, and the first direction and the second direction are perpendicular to each other and are both in a horizontal plane.

[0014] As a preferred technical solution of the bonded wafer bubble detection device, the infrared light source, the detection position, and the first visual detection unit are arranged from bottom to top along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0015] The bonded wafer bubble detection device is used for detecting bubbles in the bonded wafer.

[0016] As a preferred technical solution of the bonded wafer bubble detection device, the first loading and unloading module is used for collecting the bonded wafers that fail to pass the detection, and the second loading and unloading module is used for collecting the bonded wafers to be detected and the bonded wafers that pass the detection; and the mechanical arm can carry the bonded wafers to be detected from the second loading and unloading module to the bonded wafer bubble detection device, carry the bonded wafers that pass the detection to the second loading and unloading module, and carry the bonded wafers that fail to pass the detection to the first loading and unloading module.

[0017] The beneficial effects of the present application are as follows:

[0018] The bonded wafer bubble detection device can select the detection light formed by the first visual detection unit or the second visual detection unit after the infrared monochromatic light passes through the bonded wafer, so that the detection mode of the detection module can be freely switched, the detection capability of the bonded wafer bubble detection device is improved, and the detection efficiency of the bonded wafer bubble detection device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Fig. 1 is a structure schematic view of the bonded wafer sorting system provided by the embodiment of the present application.

[0020] Fig. 2 is a side view of a bonded wafer bubble detection device in a fast detection mode according to an embodiment of the present application;

[0021] Fig. 3 is a side view of a bonded wafer bubble detection device in a high precision detection mode according to an embodiment of the present application.

[0022] In the drawings:

[0023] 100, platform; 200, mechanical arm; 300, wafer stage; 310, first sliding table; 320, second sliding table; 330, stage main body; 400, infrared light source; 500, detection module; 510, column; 520, first visual detection unit; 530, second visual detection unit; 540, linear actuator; 550, actuator sliding rail; 600, first loading and unloading module; 610, first FOUP; 620, first wafer loading and unloading machine; 700, second loading and unloading module; 710, second FOUP; 720, second wafer loading and unloading machine; 900, bonded wafer;

[0024] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0025] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and moreover, the "above", "above" and "above" of the first feature on the second feature include the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature on the second feature include the first feature below and obliquely below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] like Figs. 1-3 As shown, this embodiment provides a bonding wafer bubble detection device for detecting bonding wafers 900, including a platform 100 and a wafer stage 300; the platform 100 is equipped with an infrared light source 400 and a detection module 500. The infrared light source 400 is used to illuminate the bonding wafer 900 located at the detection position. The detection module 500 includes a column 510, a first vision detection unit 520 fixed to the column 510, and a second vision detection unit 530 movably installed on the column 510. The first vision detection unit 520 faces the detection position, and the second vision detection unit 530 is selectively placed between the first vision detection unit 520 and the detection position. The platform 100 has at least two support positions; the number of wafer stages 300 is the same as the number of support positions and they correspond one-to-one. The wafer stage 300 is used to move the bonding wafer 900 between the detection position and a support position.

[0030] This bonding wafer bubble detection device, by incorporating a second vision detection unit 530, allows operators to select whether the detection light formed by the infrared monochromatic light passing through the bonding wafer 900 is received by the first vision detection unit 520 or the second vision detection unit 530, and to obtain the detection image. This enables free switching of the detection mode of the detection module 500, improving the detection capability and efficiency of the bonding wafer bubble detection device. Furthermore, the layout of multiple wafer stages 300 sharing the same detection module 500 ensures full utilization of the module, avoids downtime, optimizes the workflow, and achieves a rational layout for detection operations. This saves time on loading and unloading the bonding wafer 900, improves detection efficiency, and reduces the cost and space required by the single detection module 500 design.

[0031] In the embodiment, the first visual detection unit 520 is a fast visual lens, which is used for fast detection of the bonded wafer 900 and supports bubble detection with a diameter greater than 1000 pm; the second visual detection unit 530 is a high-precision visual lens, which is used for high-precision detection of the bonded wafer 900 and supports bubble detection with a minimum diameter of 50 pm.

[0032] Specifically, when the detection module 500 receives detection light by using the first visual detection unit 520, the bonded wafer bubble detection device is in a fast detection mode; when the detection module 500 receives detection light by using the second visual detection unit 530, the bonded wafer bubble detection device is in a high-precision detection mode.

[0033] Since the damage degree of the bonded wafer 900 is directly related to the size of the bubble diameter. Therefore, the flow of the detection operation has application requirements for both the fast mode that can support batch high-speed detection of the bonded wafer 900 and the high-precision mode that can support in-depth study of small defects in the bonding process by the operator.

[0034] The difference between the fast detection mode and the high-precision detection mode is that the detection field of view of the fast detection mode is five to ten times that of the high-precision detection mode, but correspondingly, the visual resolution of the high-precision detection mode is five to ten times that of the fast detection mode. Therefore, the detection rate in the fast detection mode is greater than that in the high-precision detection mode, and the resolution in the fast detection mode is lower than that in the high-precision detection mode.

[0035] In the embodiment, the detection module 500 further comprises a linear actuator 540, which is used for controlling the second visual detection unit 530 to switch between a shielding position and an avoiding position; when the second visual detection unit 530 is in the shielding position, the second visual detection unit 530 receives light rays of the infrared light source 400 passing through the bonded wafer 900 located in the detection position, and when the second visual detection unit 530 is in the avoiding position, the first visual detection unit 520 receives light rays of the infrared light source 400 passing through the bonded wafer 900 located in the detection position.

[0036] The design of shielding the first visual detection unit 520 by using the visual software system is simple and reliable, which ensures that the detection result of the second visual detection unit 530 is not disturbed and guarantees the smooth operation of the detection module 500. The above design is simple and reliable, occupies small space and has high working stability, which ensures that the detection mode of the detection module 500 can be selected by the operator, reduces the difficulty of mode switching, and also improves the working flexibility of the detection module 500, and guarantees the accuracy of the detection result.

[0037] Further, the second visual detection unit 530 is fixed to a linear actuator 540, the stand 510 is provided with an actuator slide rail 550, and the linear actuator 540 is slidably arranged on the actuator slide rail 550. The linear actuator 540 can drive the second visual detection unit 530 to move between the shielding position and the avoiding position. The above design is simple and reliable, and can ensure the smooth switching of the second visual detection unit 530 between the shielding position and the avoiding position, further reducing the switching difficulty of the detection mode, thereby further improving the working efficiency of the bonded wafer bubble detection device.

[0038] In the embodiment, the platform 100 is provided with a first slide rail, the number of the first slide rails is the same as that of the wafer tables 300 and one-to-one correspondence, and the first slide rail enables the wafer table 300 to slide between the detection position and a bearing position. The above design is simple and reliable, occupies small space and has low production cost, so that the movement of the wafer table 300 driving the bonded wafer 900 between the detection position and the bearing position can be smoothly and efficiently completed, further improving the working efficiency of the bonded wafer bubble detection device.

[0039] Further, the wafer table 300 includes a first slide 310, a second slide 320, and a table body 330. The first slide 310 is slidably arranged on the first slide rail, the first slide 310 is provided with a second slide rail, the extension direction of the second slide rail is at an angle with the extension direction of the corresponding first slide rail, the second slide 320 is slidably arranged on the second slide rail, and the table body 330 is fixed to the second slide 320. The table body 330 is used to bear the bonded wafer 900.

[0040] The design that the second slide 320 slides relative to the first slide 310 can cooperate with the design that the first slide 310 slides relative to the platform 100, which facilitates the fine adjustment of the position of the bonded wafer 900, thereby helping the detection module 500 to accurately complete the complete collection operation of the detection image of the bonded wafer 900, thereby further facilitating the subsequent work. The above improvement further improves the detection effect and ensures the accuracy of the detection result.

[0041] As a preferred, the bearing position is provided with two, two first slide rails are connected end to end and extend along the first direction X, and the detection position is located between the two bearing positions. The above design is simple and reliable, occupies small space and is easy to plan, the risk of position conflict between each wafer table 300 is low, which helps to further improve the working efficiency of the bonded wafer bubble detection device.

[0042] In the embodiment, the loading and unloading process of one wafer table 300 is synchronized with the detection process of another wafer table 300. In engineering practice, two wafer tables 300 can ensure that the detection module 500 continuously runs without stopping and waiting, thereby meeting the design purpose of the embodiment.

[0043] Further, the second slide rail extends along a second direction Y, the first direction X and the second direction Y are perpendicular to each other and are both in a horizontal plane; the infrared light source 400, the detection position and the first visual detection unit 520 are arranged from bottom to top along a third direction Z, the third direction Z is perpendicular to the first direction X and the second direction Y. The above design is simple and reliable, realizes reasonable layout of the bonded wafer bubble detection device, reduces the occupied space of the bonded wafer bubble detection device, reduces the risk of position conflict between components, avoids the influence of the weight of the components on the wafer stage 300 and the bonded wafer 900 on the detection operation, and greatly improves the working stability of the bonded wafer bubble detection device.

[0044] The embodiment also provides a bonded wafer sorting system, which comprises the mechanical arm 200, the first loading and unloading module 600, the second loading and unloading module 700 and the bonded wafer bubble detection device, one of the first loading and unloading module 600 and the second loading and unloading module 700 is used to collect the bonded wafers 900 that pass the detection, and the other is used to collect the bonded wafers 900 that fail the detection; the mechanical arm 200 can place the bonded wafer 900 at the bearing position or take the bonded wafer 900 at the bearing position. The arrangement of the bonded wafer sorting system helps to improve the working efficiency of the bonded wafer bubble detection device, ensures the smooth feeding and discharging of the bonded wafer 900, improves the automation degree of the bonded wafer 900 handling and sorting, reduces the problems caused by operation errors, and improves the accuracy of the bonded wafer 900 sorting.

[0045] In the embodiment, the first loading and unloading module 600 is used to collect the bonded wafers 900 that fail the detection, and the second loading and unloading module 700 is used to collect the bonded wafers 900 to be detected and the bonded wafers 900 that pass the detection; the mechanical arm 200 can carry the bonded wafers 900 to be detected from the second loading and unloading module 700 to the bonded wafer bubble detection device, carry the bonded wafers 900 that pass the detection to the second loading and unloading module 700, and carry the bonded wafers 900 that fail the detection to the first loading and unloading module 600. By arranging the collection space of the qualified bonded wafers 900 and the storage space of the bonded wafers 900 to be detected in the second loading and unloading module 700, the cost of the bonded wafer sorting system is reduced, and the occupied space is reduced.

[0046] In the embodiment, the first loading and unloading module 600 comprises a first FOUP 610 and a first wafer loading and unloading machine 620, and the first wafer loading and unloading machine 620 is communicatively connected to the first FOUP 610; the second loading and unloading module 700 comprises a second FOUP 710 and a second wafer loading and unloading machine 720, and the second wafer loading and unloading machine 720 is communicatively connected to the second FOUP 710. The FOUP (Front Opening Unified Pod) is used to collect the bonded wafer 900, and the wafer loading and unloading machine can control the opening and closing of the corresponding FOUP.

[0047] Obviously, the above embodiments of the present application are merely exemplary for clarity, and are not intended to limit the embodiments of the present application. Based on the above description, other different forms of changes or variations can be made by those of ordinary skill in the art. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A bonding wafer bubble detection device for detecting bonding wafers (900), characterized in that, include: A platform (100) is equipped with an infrared light source (400) and a detection module (500). The infrared light source (400) is used to illuminate the bonded wafer (900) located at the detection position. The detection module (500) includes a column (510), a first visual detection unit (520) fixed to the column (510), and a second visual detection unit (530) movably installed on the column (510). The first visual detection unit (520) faces the detection position, and the second visual detection unit (530) is selectively placed between the first visual detection unit (520) and the detection position. The platform (100) has at least two bearing positions. A wafer stage (300) is provided, wherein the number of wafer stages (300) is the same as the number of the bearing positions and they correspond one-to-one. The wafer stage (300) is used to move the bonding wafer (900) between the detection position and one of the bearing positions. The detection module (500) further includes a linear actuator (540) for controlling the second vision detection unit (530) to switch between an occlusion position and an avoidance position; when the second vision detection unit (530) is in the occlusion position, the second vision detection unit (530) receives light from the infrared light source (400) passing through the bonding wafer (900) located at the detection position; when the second vision detection unit (530) is in the avoidance position, the first vision detection unit (520) receives light from the infrared light source (400) passing through the bonding wafer (900) located at the detection position.

2. The bonding wafer bubble detection device according to claim 1, characterized in that, The second visual detection unit (530) is fixed to the linear actuator (540). The column (510) is provided with an actuator slide rail (550). The linear actuator (540) is slidably mounted on the actuator slide rail (550). The linear actuator (540) can drive the second visual detection unit (530) to move between the occlusion position and the avoidance position.

3. The bonding wafer bubble detection device according to claim 1, characterized in that, The platform (100) is provided with a first slide rail, the number of which is the same as the number of wafer stage (300) and they correspond one-to-one. The first slide rail enables the wafer stage (300) to slide between the detection position and a bearing position.

4. The bonding wafer bubble detection device according to claim 3, characterized in that, The wafer stage (300) includes a first slide (310), a second slide (320), and a stage body (330). The first slide (310) is slidably mounted on the first slide rail. The first slide (310) is provided with a second slide rail. The extension direction of the second slide rail forms an angle with the extension direction of the corresponding first slide rail. The second slide (320) is slidably mounted on the second slide rail. The stage body (330) is fixedly connected to the second slide (320). The stage body (330) is used to support the bonding wafer (900).

5. The bonding wafer bubble detection device according to claim 4, characterized in that, There are two bearing positions, and the two first slide rails are connected end to end and both extend along the first direction (X). The detection position is located between the two bearing positions.

6. The bonding wafer bubble detection device according to claim 5, characterized in that, The second slide rail extends along the second direction (Y), and the first direction (X) is perpendicular to the second direction (Y) and both lie in the horizontal plane.

7. The bonding wafer bubble detection device according to claim 6, characterized in that, The infrared light source (400), the detection position, and the first visual detection unit (520) are arranged from bottom to top along a third direction (Z), which is perpendicular to the first direction (X) and the second direction (Y).

8. A bonding wafer sorting system, characterized in that, The device includes a robotic arm (200), a first loading / unloading module (600), a second loading / unloading module (700), and a bonding wafer bubble detection device according to any one of claims 1-7. One of the first loading / unloading module (600) and the second loading / unloading module (700) is used to collect the bonding wafers (900) that pass the inspection, and the other is used to collect the bonding wafers (900) that fail the inspection. The robotic arm (200) is capable of placing the bonding wafers (900) at the bearing position or picking up the bonding wafers (900) at the bearing position.

9. The bonding wafer sorting system according to claim 8, characterized in that, The first loading and unloading module (600) is used to collect the bonding wafers (900) that fail the inspection, and the second loading and unloading module (700) is used to collect the bonding wafers (900) to be inspected and the bonding wafers (900) that pass the inspection. The robotic arm (200) can transport the bonding wafers (900) to be inspected from the second loading and unloading module (700) to the bonding wafer bubble detection device, transport the bonding wafers (900) that pass the inspection to the second loading and unloading module (700), and transport the bonding wafers (900) that fail the inspection to the first loading and unloading module (600).

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