An online precise single-point detinning and ball planting welding curing equipment

Abstract

The present invention discloses an online precision single-point detinning, ball planting, soldering and curing equipment, comprising a feed runner device, and a feed handling device and a work frame arranged above the feed runner device; a detinning device is further installed on one side of the work frame, and a ball planting and soldering device is further installed on the other side of the work frame; a plurality of preheating platform devices are further provided on one side of the feed runner device, and a ball supply device and a flux supply device are further provided on the other side of the feed runner device; the feed handling device is used to transport the product to be processed on the feed runner device to the preheating platform device for preheating, and to transport and unload the processed product. The present invention integrates the functions of feeding, detinning, ball planting, soldering and curing, testing, and unloading, and can realize the entire process of automatic single-point detinning, ball planting, and soldering and curing of BGA chips, with a high degree of automation and high efficiency of detinning and ball planting.

Description

Technical Field

[0001] The present invention relates to the technical field of BGA chip rework, and in particular to an online precise single-point detinning, ball planting, welding and curing equipment. Background Art

[0002] With the rapid development of the electronics industry, the integration capabilities of electronic products are constantly improving. For example, BGA chips are becoming increasingly powerful while being smaller and smaller. As the layout of electronic components becomes more and more compact and the diameter of solder balls becomes smaller and smaller, there is a certain probability that defective products such as bridges, large and small balls, missing balls, multiple balls, cold solder joints, and misaligned parts will appear during the mass production of BGA chips. These defective BGA chips need to be repaired according to the defective points, that is, the defective solder balls are removed and then the balls are re-installed. With the increasing process requirements, traditional de-tinning and repair methods are difficult to meet the needs. They mainly have the following shortcomings:

[0003] 1) The traditional method of detinning is to manually clean the pads with an electric soldering iron and wick. However, the pads of many BGA chips are now less than 0.2mm, which greatly reduces the adhesion of the metal pads to the circuit board. When using a traditional electric soldering iron to clean the solder balls, the surface of the wick is very rough, and the pads will be removed with the slightest carelessness, which will directly cause the product to be scrapped.

[0004] 2) Single-point desoldering and reballing are impossible. Once a defect appears on a BGA chip, all solder balls on the entire BGA chip must be removed and reballed. This results in significant waste of materials such as solder balls, making it difficult to reduce repair costs. It also increases the risk of BGA chip failure due to careless desoldering and product failure due to a low success rate in reballing.

[0005] 3) The degree of automation is not high. Detinning and ball planting are mostly done manually, which increases the tedious process of going online and offline, and the rework efficiency is low. At the same time, the whole piece needs to be detinned, and in the process of detinning the whole piece, a large amount of harmful smoke gas will be generated, which will affect the environment and harm the body. In addition, due to the melting point properties of the solder ball itself, the detinning and ball planting curing processes need to be carried out in a high temperature environment of over 200°C. During the manual detinning and ball planting process, there is a considerable risk of burns, which is not safe and the consistency of quality cannot be guaranteed. Summary of the Invention

[0006] The purpose of the present invention is to provide an online precise single-point detinning and ball planting soldering and curing equipment to solve the above problems.

[0007] In order to achieve the above objectives, the following technical solutions are adopted:

[0008] An online precision single-point detinning, ball planting, welding and curing equipment comprises a feeding runner device, and a feeding and transporting device and a work frame arranged above the feeding runner device; a detinning device is also installed on one side of the work frame, and a ball planting and welding device is also installed on the other side of the work frame; a plurality of preheating platform devices are also provided on one side of the feeding runner device, and a ball supply device and a flux supply device are also provided on the other side of the feeding runner device; the feeding and transporting device is used to transport the product to be ball-planted on the feeding runner device to the preheating platform device for preheating; the detinning device is used to detin the preheated product; the ball supply device and the flux supply device are used to provide tin balls of required diameter and flux of different thicknesses respectively, and the ball planting and welding device is used to first transfer the flux to the product after detinning, and then implant the tin balls therein and solder and cure them.

[0009] Furthermore, the ball supply device includes a ball supply lifting mechanism, a ball supply rotating mechanism connected to the ball supply lifting mechanism, and a ball supply turntable connected to the ball supply rotating mechanism and used to hold solder balls; a ball supply bracket is also installed on one side of the ball supply lifting mechanism, and a ball supply scraper is also installed on the ball supply bracket; the ball supply scraper is located above the ball supply turntable, and the ball supply scraper is used to scrape out a layer of required solder balls from the solder balls in the ball supply turntable when the ball supply turntable is lifted and rotated; the flux supply The device includes a flux supply lifting mechanism, a flux supply rotating mechanism connected to the flux supply lifting mechanism, and a flux supply turntable connected to the flux supply rotating mechanism and used to hold flux; a flux supply bracket is also installed on one side of the flux supply lifting mechanism, and a flux scraper is also installed on the flux supply bracket; the flux scraper is located above the flux supply turntable, and the flux scraper is used to scrape out flux of different thicknesses when the flux turntable is lifted and rotated.

[0010] Furthermore, the top of the ball supply bracket and the flux supply bracket are each connected to a scraper fixing plate, and the ball supply scraper and the flux scraper both include a fixing part and two scrapers; the fixing part is connected to the bottom of the scraper fixing plate, and the two scrapers are integrally connected to the two ends of the fixing part respectively; a contoured groove is formed between the two scrapers and the fixing part for scraping the tin balls or flux into shape.

[0011] Furthermore, a circular groove is provided on the top of the ball supply turntable and the flux supply turntable, and a limiting cone is provided in the middle of the circular groove; the two scrapers are both arc-shaped, and the outward protruding arc surface of one scraper is tightly attached to the inner wall of the circular groove, and the inward concave arc surface of the other scraper is tightly attached to the outer wall of the limiting cone.

[0012] Furthermore, the ball planting welding device includes a ball planting Y-axis translation mechanism, a ball planting Z-axis lifting mechanism, and a ball planting lifting seat connected to the ball planting Z-axis lifting mechanism installed on the workbench; the ball planting lifting seat is also equipped with a ball planting transfer mechanism, a welding curing mechanism and a flux transfer mechanism.

[0013] Furthermore, the ball planting transfer mechanism includes a ball planting fixing seat installed on one side of the ball planting lifting seat, and a plurality of ball planting components installed on the ball planting fixing seat; each ball planting component includes a first slide rail assembly arranged on one side of the ball planting fixing seat, a ball planting lifting plate arranged on the first slide rail assembly, a first vacuum suction nozzle installed on the ball planting lifting plate, and a ball planting lifting cylinder for driving the ball planting lifting plate to rise and fall; the flux transfer mechanism includes a transfer fixing plate connected to the other side of the ball planting fixing seat, and a plurality of transfer dipping needles installed on the transfer fixing plate; the welding curing mechanism includes a welding laser installed on the ball planting lifting seat.

[0014] Furthermore, a calibration mechanism and a solder ball adsorption mechanism are provided on one side of the preheating platform device; the calibration mechanism includes a calibration camera and a tool setting instrument; the solder ball adsorption mechanism includes a vacuum adsorption seat, a plurality of vacuum adsorption holes opened on the top of the vacuum adsorption seat, and a vacuum negative pressure joint installed on one side of the vacuum adsorption seat.

[0015] Furthermore, the detinning device includes a first translation mechanism installed on the workbench, a first lifting mechanism, a lifting slide connected to the first lifting mechanism, and a visual positioning mechanism and a single-point detinning mechanism installed on the lifting slide; the single-point detinning mechanism is also provided with a hot air blowing mechanism and a vacuum adsorption mechanism; the single-point detinning mechanism includes a first fixed seat fixedly installed on one side of the lifting slide, a weighing sensor installed on the top of the first fixed seat, and a detinning sliding seat slidably arranged on one side of the first fixed seat and its top is in contact with the weighing sensor; the upper part of one side of the detinning sliding seat is provided with a first fixed bracket, and the lower part of this side of the detinning sliding seat is also provided with a There is a detinning fixed seat; a first cavity is also provided in the detinning fixed seat, and an air outlet nozzle connected to the first cavity is also provided at the bottom of the detinning fixed seat; the hot air blowing mechanism includes a hot air heater installed on the first fixed bracket, and one end of the hot air heater is inserted into the detinning fixed seat and connected to the first cavity; the other end of the hot air heater is also provided with a ventilation interface for accessing an external air source; the vacuum adsorption mechanism includes a vacuum detinning nozzle inserted in the air outlet nozzle, and a tin slag recovery box installed on one side of the detinning fixed seat and connected to the vacuum detinning nozzle; one end of the tin slag recovery box is also provided with a vacuum interface for accessing an external negative pressure air source.

[0016] Furthermore, an auxiliary blowing interface connected to the vacuum detinning nozzle and the tin slag recovery box is installed on the other side of the detinning fixed seat; the single-point detinning mechanism also includes a tin slag filter box connected to the vacuum interface, a vacuum generator installed on the tin slag filter box, and a hot air flow switch connected to the ventilation interface; a laser displacement sensor is also installed on the lifting slide.

[0017] Furthermore, the loading and handling device includes a loading Y-axis translation mechanism, a loading Z-axis lifting mechanism, and a loading lifting plate connected to the loading Z-axis lifting mechanism; the loading lifting plate is also equipped with a loading visual positioning component, a cooling blowing component and several loading nozzle components.

[0018] By adopting the above scheme, the beneficial effects of the present invention are:

[0019] 1) The equipment integrates the functions of loading, detinning, ball planting, soldering curing, testing, unloading, etc., and can realize the entire process of automatic single-point detinning and ball planting of BGA chips, with high degree of automation and high efficiency of detinning and ball planting;

[0020] 2) It can realize the function of single-point reballing of repaired chips, which can effectively target single-point defects of chips without having to de-tin the entire product before reballing. This can improve reballing efficiency, effectively reduce resource waste, save costs, and reduce the risk of product damage and scrap;

[0021] 3) Through the ball supply device and the flux supply device, when planting solder balls of different ball diameters, the thickness of the scraped flux and the layer of solder balls can be automatically adjusted to adapt to different usage environments, with strong versatility. At the same time, a welding curing mechanism is provided, which can perform single-point laser welding curing after ball planting, realizing the integrated function of ball planting, welding and curing;

[0022] 4) A non-contact detinning method is used. Hot air is blown onto the pads of the BGA chip to melt the solder balls. The tin slag is then sucked out through a vacuum detinning nozzle to remove the solder balls. During the entire operation, a high-precision laser displacement sensor is used to measure the pad height. The single-point detinning mechanism has no direct contact with the pad, thus avoiding the risk of damage to the pad due to external forces.

[0023] 5) Using a single-point detinning method based on visual positioning, it can effectively remove the single-point defects of BGA chips. It does not need to remove the entire chip, which can improve the detinning efficiency, effectively reduce waste, and greatly reduce the risk of chip damage and scrap during the detinning process. In addition, it can automatically collect and discharge the tin slag into a designated container, which is convenient for handling. The cooperation of the laser displacement sensor and the weighing sensor can avoid direct contact between the single-point detinning mechanism and the BGA chip, thereby reducing the risk of chip damage.

[0024] 6) The hot air heater adopts a closed-loop temperature control method, and the overall temperature control is stable and accurate, which can avoid problems such as incomplete desoldering or overheating that damages the product due to temperature deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A perspective view of the present invention;

[0026] Figure 2 It is a three-dimensional diagram of the feeding runner device of the present invention;

[0027] Figure 3 A perspective view of the loading and handling device of the present invention;

[0028] Figure 4 is a three-dimensional diagram of the preheating platform device of the present invention;

[0029] Figure 5 is a perspective view of a tin removal device according to the present invention;

[0030] Figure 6 for Figure 5 A local enlarged schematic diagram of point A;

[0031] Figure 7 A perspective view of the ball-planting welding device of the present invention;

[0032] Figure 8 for Figure 7 A partial enlarged schematic diagram of point B;

[0033] Figure 9 A perspective view of a ball supply device and a flux supply device according to the present invention;

[0034] Figure 10 It is a three-dimensional diagram of the preheating platform device and the ball-planting welding device of the present invention;

[0035] The accompanying drawings illustrate:

[0036] 1—Feeding channel device; 2—Feeding and handling device; 3—Working frame; 4—Detinning device; 5—Ball implanting and soldering device; 6—Preheating platform device; 7—Ball supply device; 8—Flux supply device; 9—Calibration mechanism; 10—Solder ball adsorption mechanism; 11—Feeding channel frame; 12—Positioning and blocking cylinder; 21—Feeding Y-axis translation mechanism; 22—Feeding Z-axis lifting mechanism; 23—Feeding lifting plate; 24—Feeding visual positioning component; 25—Cooling Blowing assembly; 26—feeding nozzle assembly; 41—first translation mechanism; 42—first lifting mechanism; 43—lifting slide; 44—visual positioning mechanism; 45—single-point detinning mechanism; 46—hot air blowing mechanism; 47—vacuum adsorption mechanism; 48—laser displacement sensor; 51—ball planting Y-axis translation mechanism; 52—ball planting Z-axis lifting mechanism; 53—ball planting lifting seat; 54—ball planting transfer mechanism; 55—welding curing mechanism; 56—soldering Agent transfer mechanism; 61—preheating X-axis translation mechanism; 62—preheating table; 71—ball supply lifting mechanism; 72—ball supply rotation mechanism; 73—ball supply turntable; 74—ball supply bracket; 75—ball supply scraper; 76—scraper fixing plate; 91—calibration camera; 92—tool setting instrument; 451—first fixed seat; 452—weighing sensor; 453—detinning sliding seat; 454—first fixed bracket; 455—detinning fixed seat; 456—air outlet nozzle; 457—Solder slag filter box; 458—Vacuum generator; 459—Hot air flow switch; 461—Hot air heater; 462—Ventilation interface; 471—Solder slag recovery box; 472—Vacuum interface; 541—Ball planting holder; 542—Ball planting lifting plate; 543—First vacuum nozzle; 561—Transfer fixing plate; 562—Transfer dipping needle; 731—Circular groove; 732—Limiting table; 751—Fixed part; 752—Scraper. DETAILED DESCRIPTION

[0037] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Reference Figures 1 to 10As shown, the present invention provides an online precise single-point detinning and ball planting welding and curing equipment, comprising a feeding channel device 1, and a feeding and transporting device 2 and a workbench 3 arranged above the feeding channel device 1; a detinning device 4 is also installed on one side of the workbench 3, and a ball planting and welding device 5 is also installed on the other side of the workbench 3; a plurality of preheating platform devices 6 are also provided on one side of the feeding channel device 1, and a ball supply device 7 and a flux supply device 8 are also provided on the other side of the feeding channel device 1; the feeding and transporting device 2 is used to transport the product to be ball-planted on the feeding channel device 1 to the preheating platform device 6 for preheating; the detinning device 4 is used to detin the preheated product; the ball supply device 7 and the flux supply device 8 are used to provide tin balls of different diameters and flux of different thicknesses respectively, and the ball planting and welding device 5 is used to first transfer the flux to the product after detinning, and then implant the tin balls therein and solder and cure them.

[0039] The ball supply device 7 includes a ball supply lifting mechanism 71, a ball supply rotating mechanism 72 connected to the ball supply lifting mechanism 71, and a ball supply turntable 73 connected to the ball supply rotating mechanism 72 and used to hold solder balls; a ball supply bracket 74 is also installed on one side of the ball supply lifting mechanism 71, and a ball supply scraper 75 is also installed on the ball supply bracket 74; the ball supply scraper 75 is located above the ball supply turntable 73, and the ball supply scraper 75 is used to scrape out solder balls of different thicknesses from the solder balls in the ball supply turntable 73 when the ball supply turntable 73 is lifted and rotated; the The flux supply device 8 includes a flux supply lifting mechanism, a flux supply rotating mechanism connected to the flux supply lifting mechanism, and a flux supply turntable connected to the flux supply rotating mechanism and used to hold the flux; a flux supply bracket is also installed on one side of the flux supply lifting mechanism, and a flux scraper is also installed on the flux supply bracket; the flux scraper is located above the flux supply turntable, and the flux scraper is used to scrape out flux of different thicknesses when the flux turntable is lifted and rotated; the ball supply bracket 74 and the top of the flux supply bracket are also Each is connected to a scraper fixing plate 76, and the ball supply scraper 75 and the flux scraper both include a fixing portion 751 and two scrapers 752; the fixing portion 751 is connected to the bottom of the scraper fixing plate 76, and the two scrapers 752 are integrally connected to the two ends of the fixing portion 751; a contoured groove for scraping the solder balls or flux into shape is formed between the two scrapers 752 and the fixing portion 751; the tops of the ball supply turntable 73 and the flux supply turntable are also provided with a circular groove 731, and the middle of the circular groove 731 is also provided with a limiting truncated table 732; the two The scrapers 752 are all arc-shaped, and the outward-convex arc surface of one scraper 752 is in close contact with the inner wall of the circular groove 731, and the inward-concave arc surface of the other scraper 752 is in close contact with the outer wall of the limiting table 732; the ball planting welding device 5 includes a ball planting Y-axis translation mechanism 51 installed on the workbench 3, a ball planting Z-axis lifting mechanism 52, and a ball planting lifting seat 53 connected to the ball planting Z-axis lifting mechanism 52; the ball planting lifting seat 53 is also equipped with a ball planting transfer mechanism 54, a welding curing mechanism 55 and a flux transfer mechanism 56.

[0040] The ball planting transfer mechanism 54 includes a ball planting fixing seat 541 installed on one side of the ball planting lifting seat 53, and a plurality of ball planting components installed on the ball planting fixing seat 541; each ball planting component includes a first slide rail assembly arranged on one side of the ball planting fixing seat 541, a ball planting lifting plate 542 arranged on the first slide rail assembly, a first vacuum suction nozzle 543 installed on the ball planting lifting plate 542, and a ball planting lifting cylinder for driving the ball planting lifting plate 542 to move up and down; the flux transfer mechanism 56 includes a transfer fixing plate 561 connected to the other side of the ball planting fixing seat 541, and a plurality of transfer dipping needles 562 installed on the transfer fixing plate 561; the welding The curing mechanism 55 includes a welding laser installed on the ball planting lifting seat 53; a calibration mechanism 9 and a solder ball adsorption mechanism 10 are also provided on one side of the preheating platform device 6; the calibration mechanism 9 includes a calibration camera 91 and a tool setting instrument 92; the solder ball adsorption mechanism 10 includes a vacuum adsorption seat, a plurality of vacuum adsorption holes opened on the top of the vacuum adsorption seat, and a vacuum negative pressure joint installed on one side of the vacuum adsorption seat; the detinning device 4 includes a first translation mechanism 41 installed on the workbench 3, a first lifting mechanism 42, a lifting slide 43 connected to the first lifting mechanism 42, and a visual positioning mechanism 44 and a single-point detinning mechanism 4 installed on the lifting slide 43. 5; The single-point detinning mechanism 45 is also provided with a hot air blowing mechanism 46 and a vacuum adsorption mechanism 47; The single-point detinning mechanism 45 includes a first fixed seat 451 fixedly mounted on one side of the lifting slide 43, a weighing sensor 452 mounted on the top of the first fixed seat 451, and a detinning sliding seat 453 slidably arranged on one side of the first fixed seat 451 and its top in contact with the weighing sensor 452; A first fixed bracket 454 is provided on the upper part of one side of the detinning sliding seat 453, and a detinning fixed seat 455 is also provided on the lower part of the side of the detinning sliding seat 453; A first cavity is also provided in the detinning fixed seat 455, and the bottom of the detinning fixed seat 455 is also provided. It is provided with an air outlet nozzle 456 connected to the first cavity; the hot air blowing mechanism 46 includes a hot air heater 461 installed on the first fixed bracket 454, and one end of the hot air heater 461 is inserted into the detinning fixed seat 455 and connected to the first cavity; the other end of the hot air heater 461 is also provided with a ventilation interface 462 for accessing an external air source; the vacuum adsorption mechanism 47 includes a vacuum detinning suction nozzle inserted in the air outlet nozzle 456, and a tin slag recovery box 471 installed on one side of the detinning fixed seat 455 and connected to the vacuum detinning suction nozzle; one end of the tin slag recovery box 471 is also provided with a vacuum interface 472 for accessing an external negative pressure air source.

[0041] An auxiliary blowing interface connected to the vacuum detinning nozzle and the tin slag recovery box 471 is also installed on the other side of the detinning fixed seat 455; the single-point detinning mechanism 45 also includes a tin slag filter box 457 connected to the vacuum interface 472, a vacuum generator 458 installed on the tin slag filter box 457, and a hot air flow switch 459 connected to the ventilation interface 462; a laser displacement sensor 48 is also installed on the lifting slide 43; the loading and handling device 2 includes a loading Y-axis translation mechanism 21, a loading Z-axis lifting mechanism 22, and a loading lifting plate 23 connected to the loading Z-axis lifting mechanism 22; the loading lifting plate 23 is also equipped with a loading visual positioning component 24, a cooling blowing component 25 and several loading nozzle components 26.

[0042] Working principle of the present invention:

[0043] In this embodiment, the equipment also includes a chassis, a feeding flow channel device 1, a feeding and handling device 2, a workbench 3, a tin removal device 4, a ball planting and welding device 5, a preheating platform device 6, a ball supply device 7 and a flux supply device 8 are all installed in the chassis; a three-color indicator light is also installed on the top of the chassis, an observation window, a display screen, a mouse and a keyboard are also provided on the front of the chassis, and caster feet are also installed on the bottom of the chassis; when the equipment is working, the tray containing the product to be detinned (in this embodiment, the product is a BGA chip) can be first placed on the feeding flow channel device 1 or the tray containing the product to be processed delivered by other equipment in the upper station can be connected, and the tray can be transported to the preset feeding position through the feeding flow channel device 1 for clamping and positioning; the tray can then be placed on the loading visual positioning component of the feeding and handling device 2 Each acupuncture point is checked for the presence of products, and then the BGA chip is transferred to the preheating platform device 6 for preheating (in this embodiment, it can be contact heated to about 190°C). Subsequently, a non-contact air outlet nozzle 456 is used to blow hot air above the position of the BGA chip to be detinned to accelerate the melting of the solder balls on the defective parts of the BGA chip. After the solder balls are completely melted, the tin slag is sucked up by the vacuum detinning nozzle to complete the detinning work; after the detinning is completed, the flux is transferred to the pad to be planted by the transfer dip needle 562, and then the solder ball is planted on the pad printed with the flux by the first vacuum suction nozzle 543. Finally, it is solidified by welding with a welding laser, thereby realizing all the processes of automatic detinning and ball planting of the chip, with a high degree of automation and high work efficiency. Specifically:

[0044] Feeding channel device 1: continue to refer to Figure 2As shown, in this embodiment, the feeding runner device 1 includes two feeding runner frames 11, an anti-static belt assembly installed on the feeding runner frame 11, and a runner drive motor for driving the anti-static belt assembly; the two ends of one of the feeding runner frames 11 are respectively equipped with a feed port blocking cylinder and a discharge port blocking cylinder, and a position detection sensor is also installed at both ends and the middle of the feeding runner frame 11 (a total of 3, for detecting whether there is a pallet); a positioning blocking cylinder 12, a positioning clamping cylinder, and a pallet lifting mechanism (including an X-axis translation mechanism and a lifting cylinder) are also installed between the two feeding runner frames 11; when the pallet is conveyed to the positioning blocking cylinder 12, the positioning blocking cylinder 12 is lifted, and then the pallet is blocked and limited, and then the material tray lifting mechanism lifts the pallet upward to separate it from the anti-static belt assembly; then, the positioning clamping cylinder cooperates with the positioning blocking cylinder 12 to clamp and fix the pallet, so that the feeding and handling device 2 can transport the BGA chip on the transfer pallet.

[0045] Loading and handling device 2: Figure 3 As shown, the loading Y-axis translation mechanism 21 and the loading Z-axis lifting mechanism 22 of the loading and transporting device 2 can both be linear motor modules, and the loading visual positioning component 24 includes a loading positioning camera installed on the loading lifting plate 23, and a light source located below the loading positioning camera; the cooling blowing component 25 includes a blowing connector installed on the loading lifting plate 23 (for accessing external airflow), and each loading suction nozzle component 26 includes a loading lifting cylinder and a suction nozzle body connected to the loading lifting cylinder; after the tray is clamped and fixed, the loading positioning camera will move to the top of the tray under the cooperative drive of the loading Y-axis translation mechanism 21 and the loading Z-axis lifting mechanism 22 to determine whether there is material in each acupoint in the tray and locate its position. Subsequently, the material, that is, the BGA chip, is transported one by one to the preheating platform device 6 for preheating in the order pre-set in the background through the loading suction nozzle component 26.

[0046] Preheating platform device 6: In this embodiment, the number of preheating platform devices 6 is set to four groups (the number can be freely set according to actual use requirements to achieve parallel operation of tin removal and ball planting and improve work efficiency). The preheating platform device 6 includes a preheating X-axis translation mechanism 61 (which can be a linear motor module), and a preheating platform 62 connected to the preheating X-axis translation mechanism 61; a heating component (such as a heating resistor, etc.) is installed in the preheating platform 62, and a limiting groove for carrying the BGA chip to be detinned is also provided on the top of the preheating platform 62. The BGA chip can be preheated so that the tin ball at the position to be detinned on the BGA chip is close to a melted state, so as to facilitate the early tin removal and subsequent ball planting work. After the preheating is completed, the BGA chip will be moved to the bottom of the tin removal device 4 for detinning.

[0047] Detinning device 4: continue to refer to Figures 5 to 6As shown, in this embodiment, the first translation mechanism 41 and the first lifting mechanism 42 can both be linear motor modules, and the visual positioning mechanism 44 includes a light source lifting cylinder arranged on the lifting slide 43, a light source assembly slidably arranged on the lifting slide 43 and connected to the light source lifting cylinder, and a CCD camera installed on the lifting slide 43 and located above the light source assembly. When working, the CCD camera of the visual positioning mechanism 44 can first be used to locate the BGA chip, combined with the position information provided by the front-end station, through background processing and analysis, to determine the position of the defective point on the chip (the position of the solder pad where the solder ball needs to be removed). It will perform precise positioning, and then the high-precision laser displacement sensor 48 will measure the height around the defect point to determine the height of the pad, ensuring that the single-point desoldering mechanism 45 will not directly contact the chip or the pad when it descends, thereby avoiding damage to the pad under the action of external force; at the same time, a weighing sensor 452 is also provided. When the single-point desoldering mechanism 45 descends too high and contacts the pad, the weighing sensor 452 senses the stress change, and then determines that the vacuum desoldering nozzle is in contact with the pad, and the background is shut down for maintenance to avoid damage to the product. It cooperates with the laser displacement sensor 48 to achieve the purpose of double protection.

[0048] After locating the position of the defect point, the vacuum adsorption mechanism 47 moves to the top of the defect point (the vacuum detinning nozzle is about 5 mm away from the clean surface), the hot air heater 461 is turned on, and hot air is blown to the defect point through the air outlet 456, so that it quickly heats up to the set tin melting temperature. After heating to the set temperature, continue to blow hot air for a period of time to ensure that the defective tin ball has been completely melted; at the same time, the hot air heater 461 is also connected to a hot air flow switch 459, which can adjust the blowing flow rate and monitor the hot air flow rate in real time, thereby protecting the hot air heater 461; and the hot air heater 461 adopts a closed-loop temperature control method to ensure the accuracy of temperature control.

[0049] Subsequently, the single-point detinning mechanism 45 descends to a position 0.1mm-0.2mm away from the solder pad, the vacuum generator 458 is turned on, and the vacuum detinning nozzle absorbs the melted tin slag into the tin slag recovery box 471 to achieve the purpose of non-contact detinning, thereby achieving the purpose of detinning without damaging the solder pad. While sucking the tin slag, air is blown through the auxiliary blowing interface to blow the tin slag sucked into the vacuum detinning nozzle into the tin slag recovery box 471, which can avoid condensation of the tin slag and cause blockage. At the same time, the vacuum generator 458 is also connected to the tin slag filter box 457, which can filter the tin slag; after the solder balls are removed, the CCD camera takes a picture of it again to check the effect of detinning and determine whether detinning is needed again; at the same time, the tin slag in the tin slag filter box 457 and the tin slag recovery box 471 can be cleaned regularly.

[0050] After the detinning is completed, the preheating platform device 6 will move the detinned chip to the bottom of the ball planting welding device 5 for ball planting. At the same time, the detinning device 4 detinns the remaining chips on the preheating platform device 6 that are waiting for detinning to ensure the continuity of the work.

[0051] Ball planting welding device 5: The ball planting welding device 5 also includes two supporting columns. The two ends of the ball planting Y-axis translation mechanism 51 are respectively arranged on a supporting column. The ball planting Y-axis translation mechanism 51 and the ball planting Z-axis lifting mechanism 52 can both use linear motor modules. Under the mutual cooperation of the two, the ball planting lifting seat 53 can be driven to perform translation and lifting movements; Figures 7 to 10 As shown, in this embodiment, the ball planting transfer mechanism 54 is provided with four groups of ball planting components (the number of ball planting components can be freely configured according to actual use requirements), and the four groups of ball planting components are arranged side by side on the ball planting fixing seat 541, and the ball planting fixing seat 541 is also equipped with four groups of precision proportional pressure regulating valves, which can drive the ball planting lifting plate 542 to drive the first vacuum suction nozzle 543 to rise and fall through the ball planting lifting cylinder, thereby facilitating the first vacuum suction nozzle 543 to absorb or release the solder ball (in this embodiment, the first vacuum suction nozzle 543 adopts the standard suction nozzle of the crystal bonding machine, which can be quickly replaced); in this embodiment, four groups of transfer dipping needles 562 are also provided on the transfer fixing plate 561 (the number of which can be set according to actual use requirements), which can transfer the flux to the solder pads required for the BGA chip to be planted, so as to perform the ball planting work.

[0052] In this embodiment, the structure and principle of the ball supply device 7 are basically the same as those of the flux supply device 8. Only the working principle of the ball supply device 7 is described here (the working principle of the flux supply device 8 is similar to it). In this embodiment, the ball supply lifting mechanism 71 can adopt the transmission method of the motor screw to drive the ball supply rotating mechanism 72 to rise and fall. The ball supply rotating mechanism 72 includes a ball supply lifting seat connected to the ball supply lifting mechanism 71, and a ball supply rotating motor installed on the ball supply lifting seat; the ball supply turntable 73 is connected to the ball supply rotating motor and can drive the ball supply turntable 73 to rotate; the ball supply scraper 75 is arranged in the circular groove 731 of the ball supply turntable 73, and the two scrapers 752 of the ball supply scraper 75 are both arc-shaped, and the outward convex arc surface of one of the scrapers 752 is in close contact with the inner wall of the circular groove 731, and the inward concave arc surface of the other scraper 752 is in close contact with the outer wall of the limiting circular table 732. The two scrapers 752 and the fixing part 751 form a simulated shaped groove, when the ball supply turntable 73 rises and falls and rotates, the tin balls of corresponding thickness can be scraped off through the shaped groove, that is, through the ball supply device 7 and the flux supply device 8, when planting tin balls of different ball diameters, the thickness of the scraped flux and the thickness of the tin balls can be automatically adjusted and controlled to adapt to different usage environments, and the versatility is strong; at the same time, in this embodiment, a tin ball adsorption mechanism 10 is also provided on one side of the preheating platform device 6, which can be connected to the external negative pressure through the vacuum negative pressure connector, and then the excess tin balls on the first vacuum suction nozzle 543 are adsorbed through the vacuum adsorption hole (a first vacuum suction nozzle 543 may adsorb multiple tin balls and stick to each other) to ensure that there is only one tin ball on each first vacuum suction nozzle 543; in addition, a calibration camera 91 and a tool setting instrument 92 are also provided. When the corresponding first vacuum suction nozzle 543 needs to be replaced in response to different usage environments, the replaced first vacuum suction nozzle 543 can be automatically calibrated to ensure the accuracy of ball planting.

[0053] During operation, the ball supply device 7 and the flux supply device 8 are first used to scrape out the flux and solder balls of the required thickness. Then, the first vacuum suction nozzle 543 absorbs the solder balls. While absorbing the solder balls, the transfer dipping needle 562 is simultaneously dipped in the flux. Then, the first vacuum suction nozzle 543 moves to the top of the solder ball adsorption mechanism 10 for vacuum treatment to avoid multiple solder balls on the first vacuum suction nozzle 543, which may lead to subsequent ball planting defects (this step can be performed in advance after the machine is turned on and the ball planting work is not being performed, such as when removing the tin, to improve work efficiency). Then, the transfer dipping needle 562 transfers the flux to the chip pad position where the ball needs to be planted, and then Then the first vacuum suction nozzle 543 places the solder ball on the solder pad that has been stained with flux. After the ball planting is completed, laser welding and curing are performed through the welding laser. After the ball planting is completed, the preheating platform device 6 moves the chip after ball planting to its original position. Subsequently, the cooling and blowing assembly 25 on the loading and transporting device 2 is connected to the external air source to blow air to cool the BGA chip. After the cooling is completed, the loading and transporting device 2 transports it to the original hole position, and then moves the new chip for detinning and ball planting. After all the chips in the entire tray are planted, the loading flow channel device 1 transfers them to the next process. Subsequently, a new round of detinning and ball planting is performed on the chips on the new tray.

[0054] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An online precise single-point detinning and ball implanting soldering and curing equipment, characterized in that: It includes a feeding runner device, a feeding and transporting device and a workbench arranged above the feeding runner device; a tin removal device is also installed on one side of the workbench, and a ball planting and welding device is also installed on the other side of the workbench; a plurality of preheating platform devices are also provided on one side of the feeding runner device, and a ball supply device and a flux supply device are also provided on the other side of the feeding runner device; the feeding and transporting device is used to transport the products to be ball-planted on the feeding runner device to the preheating platform device for preheating; the tin removal device is used to remove tin from the preheated products; the ball supply device and the flux supply device are used to provide the required solder balls of different diameters and flux of different thicknesses respectively, and the ball planting and welding device is used to first transfer the flux to the product after tin removal, and then implant the solder balls therein and weld and solidify them; The ball supply device includes a ball supply lifting mechanism, a ball supply rotating mechanism connected to the ball supply lifting mechanism, and a ball supply turntable connected to the ball supply rotating mechanism and used for holding solder balls; a ball supply bracket is also installed on one side of the ball supply lifting mechanism, and a ball supply scraper is also installed on the ball supply bracket; the ball supply scraper is located above the ball supply turntable, and the ball supply scraper is used to scrape out a required layer of solder balls from the solder balls in the ball supply turntable when the ball supply turntable is lifted and rotated; the flux supply device includes a flux supply lifting mechanism, a flux supply rotating mechanism connected to the flux supply lifting mechanism, and a flux supply turntable connected to the flux supply rotating mechanism and used for holding solder flux; a flux supply bracket is also installed on one side of the flux supply lifting mechanism, and a flux scraper is also installed on the flux supply bracket; the flux scraper is located above the flux supply turntable, and the flux scraper is used to scrape out solder flux of different thicknesses when the flux turntable is lifted and rotated; The top of the ball supply bracket and the flux supply bracket are each connected to a scraper fixing plate. The ball supply scraper and the flux scraper each include a fixing portion and two scraping blades. The fixing portion is connected to the bottom of the scraper fixing plate, and the two scraping blades are integrally connected to the two ends of the fixing portion. A contoured groove is formed between the two scraping blades and the fixing portion for scraping the solder balls or flux into shape. The tops of the ball supply turntable and the flux supply turntable are both provided with circular grooves, and a limiting frustum is provided in the middle of the circular grooves; the two scrapers are both arc-shaped, and the outwardly protruding arc surface of one scraper is tightly attached to the inner wall of the circular groove, and the inwardly concave arc surface of the other scraper is tightly attached to the outer wall of the limiting frustum.

2. The online precise single-point detinning and ball implanting soldering and curing equipment according to claim 1 is characterized in that: The ball planting welding device includes a ball planting Y-axis translation mechanism, a ball planting Z-axis lifting mechanism, and a ball planting lifting seat connected to the ball planting Z-axis lifting mechanism installed on a workbench; the ball planting lifting seat is also equipped with a ball planting transfer mechanism, a welding curing mechanism, and a flux transfer mechanism.

3. The online precise single-point detinning and ball implanting soldering and curing equipment according to claim 2 is characterized in that: The ball planting transfer mechanism includes a ball planting fixing seat installed on one side of the ball planting lifting seat, and a plurality of ball planting components installed on the ball planting fixing seat; each ball planting component includes a first slide rail assembly arranged on one side of the ball planting fixing seat, a ball planting lifting plate arranged on the first slide rail assembly, a first vacuum suction nozzle installed on the ball planting lifting plate, and a ball planting lifting cylinder for driving the ball planting lifting plate to rise and fall; the flux transfer mechanism includes a transfer fixing plate connected to the other side of the ball planting fixing seat, and a plurality of transfer dipping needles installed on the transfer fixing plate; the welding curing mechanism includes a welding laser installed on the ball planting lifting seat.

4. The online precise single-point detinning and ball implanting soldering and curing equipment according to claim 1 is characterized in that: A calibration mechanism and a solder ball adsorption mechanism are also provided on one side of the preheating platform device; the calibration mechanism includes a calibration camera and a tool setting instrument; the solder ball adsorption mechanism includes a vacuum adsorption seat, a plurality of vacuum adsorption holes opened on the top of the vacuum adsorption seat, and a vacuum negative pressure joint installed on one side of the vacuum adsorption seat.

5. The online precise single-point detinning and ball implanting soldering and curing equipment according to claim 1 is characterized in that: The detinning device includes a first translation mechanism installed on the workbench, a first lifting mechanism, a lifting slide connected to the first lifting mechanism, and a visual positioning mechanism and a single-point detinning mechanism installed on the lifting slide; the single-point detinning mechanism is also provided with a hot air blowing mechanism and a vacuum adsorption mechanism; the single-point detinning mechanism includes a first fixed seat fixedly installed on one side of the lifting slide, a weighing sensor installed on the top of the first fixed seat, and a detinning sliding seat slidably arranged on one side of the first fixed seat and its top is in contact with the weighing sensor; the upper part of one side of the detinning sliding seat is provided with a first fixed bracket, and the lower part of the same side of the detinning sliding seat is also provided with a detinning Tin fixing seat; a first cavity is also provided in the detinning fixing seat, and an air outlet nozzle connected to the first cavity is also provided at the bottom of the detinning fixing seat; the hot air blowing mechanism includes a hot air heater installed on the first fixed bracket, and one end of the hot air heater is inserted in the detinning fixing seat and connected to the first cavity; the other end of the hot air heater is also provided with a ventilation interface for accessing an external air source; the vacuum adsorption mechanism includes a vacuum detinning nozzle inserted in the air outlet nozzle, and a tin slag recovery box installed on one side of the detinning fixing seat and connected to the vacuum detinning nozzle; one end of the tin slag recovery box is also provided with a vacuum interface for accessing an external negative pressure air source.

6. The online precise single-point detinning and ball implanting soldering and curing equipment according to claim 5 is characterized in that: An auxiliary blowing interface connected to the vacuum detinning nozzle and the tin slag recovery box is also installed on the other side of the detinning fixed seat; the single-point detinning mechanism also includes a tin slag filter box connected to the vacuum interface, a vacuum generator installed on the tin slag filter box, and a hot air flow switch connected to the ventilation interface; a laser displacement sensor is also installed on the lifting slide.

7. The online precise single-point detinning and ball implanting soldering and curing equipment according to claim 1 is characterized in that: The loading and handling device includes a loading Y-axis translation mechanism, a loading Z-axis lifting mechanism, and a loading lifting plate connected to the loading Z-axis lifting mechanism; the loading lifting plate is also equipped with a loading visual positioning component, a cooling blowing component and several loading nozzle components.

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