Coil component

Abstract

The present invention relates to a coil component. The present invention provides a coil component which reduces the amount of use of a conductive material connecting coil conductors and which obtains good coil characteristics. A coil component (1) is provided with a laminate (S) in which a plurality of insulating layers (I) and coil conductor layers (M) are laminated in a lamination direction, and has first via conductors (FV) and second via conductors (SV) which electrically connect the coil conductor layers (M) to each other, the first via conductors (FV) being smaller than the second via conductors (SV).

Description

Technical Field

[0001] This invention relates to coil components. Background Technology

[0002] Due to the recent trend of increasing current in electronic devices, coil components are required to have high rated current. For example, Patent Documents 1-3 disclose a coil component that is formed by overlapping multiple sheets (e.g., two sheets) of which coil conductors are formed, connecting them in parallel via through holes, and then connecting the parallel-connected sheets in series with each other.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2008-053368

[0004] Patent Document 2: Japanese Patent Application Publication No. 8-130115

[0005] Patent Document 3: Japanese Utility Model Application Publication No. 5-57817

[0006] As more layers of sheets forming the coil conductors are overlapped to achieve the desired coil characteristics, the stress between the insulation layer and the coil conductors increases, potentially leading to cracking. Furthermore, a greater supply of conductive material is required to the through-holes that electrically connect the coil conductors. This increases the amount of conductive material used, resulting in higher material costs. Summary of the Invention

[0007] Therefore, the main objective of this invention is to provide a coil component that reduces the amount of conductive material used in connecting coil conductors and obtains good coil characteristics.

[0008] The coil component of the present invention includes a laminate having a plurality of insulating layers and coil conductor layers stacked in a stacking direction, and having a first through-hole conductor and a second through-hole conductor electrically connecting the coil conductor layers to each other, wherein the first through-hole conductor is smaller than the second through-hole conductor.

[0009] According to the coil component of the present invention, the amount of conductive material used in the first and second through-hole conductors that electrically connect the coil conductor layers to each other can be reduced, thereby obtaining good coil characteristics. Attached Figure Description

[0010] Figure 1 This is a perspective view of the coil component of the present invention.

[0011] Figure 2 This is an exploded perspective view of the stack of coil components according to the first embodiment.

[0012] Figure 3 This is a top view of each of the laminated components constituting the coil component according to the first embodiment.

[0013] Figure 4 yes Figure 2 A cross-sectional view along line IV-IV in the direction of view.

[0014] Figure 5 yes Figure 4 An enlarged sectional view of the dashed section.

[0015] Figure 6 (a) is a schematic cross-sectional view showing the process of fabricating the insulating layer. Figure 6 (b) is a schematic cross-sectional view showing the process of making the resin paste for forming voids. Figure 6 (c) is a schematic cross-sectional view showing the manufacturing process of the coil conductor layer. Figure 6 (d) is a schematic cross-sectional view showing the process of arranging insulating material around the coil conductor layer. Figure 6 (e) is a schematic cross-sectional view showing the fabrication process of the laminate.

[0016] Figure 7 (a) is a top view of the stacked components that make up the stacked body. Figure 7 (b) is Figure 7 (a) is a cross-sectional view of the bb line in the direction of view.

[0017] Figure 8 (a) is a top view of the stacked components that make up the stacked body. Figure 8 (b) is Figure 8 (a) is a cross-sectional view of the bb line in the direction of view.

[0018] Figure 9 This is a top view of each of the laminated components constituting the coil component according to the second embodiment.

[0019] Figure 10 This is a cross-sectional view of the coil component according to the second embodiment.

[0020] Figure 11 This is a top view of each laminated member constituting the laminate in the coil component according to the third embodiment.

[0021] Figure 12 This is a cross-sectional view of the coil component according to the third embodiment.

[0022] Explanation of reference numerals in the attached figures

[0023] 1…coil component; E…external electrode; S…laminated body; sb1~sb16…laminated components; I…insulating layer; Im…insulating material; M…coil conductor layer; Md…lead-out portion; D…lead-out electrode layer; V…through-hole conductor; FV…first through-hole conductor; SV…second through-hole conductor; A…gap; P…resin paste for forming gap portion. Detailed Implementation

[0024] The coil component of the present invention will now be described in detail. While the description is based on the accompanying drawings as needed, the illustrations are merely schematic and illustrative for the purpose of understanding the invention, and their appearance, dimensions, etc., may differ from the actual product. Furthermore, the structure of the coil component described herein is merely illustrative for the purpose of understanding the invention and is not intended to limit the invention.

[0025] like Figure 1 As shown, the coil component 1 includes a laminated body S and external electrodes E. The laminated body S has a generally cuboid shape and can house a coil. The external electrodes E are electrically connected to the coils, extend along the lamination direction, and are disposed on opposite sides of the laminated body S. Hereinafter, the first to third embodiments of the coil component of the present invention will be described.

[0026] [Coil component of the first embodiment]

[0027] The coil component 1 of the present invention includes a laminate S, which has a plurality of insulating layers I and coil conductor layers M stacked in the lamination direction, and has a first through-hole conductor FV and a second through-hole conductor SV that electrically connect the coil conductor layers M to each other.

[0028] First, the multiple stacked members sb1 to sb16 constituting the stacked body S will be described. Furthermore, an example of 16 stacked members will be given, but this is not a limitation.

[0029] The outermost stacked components SB1 and SB16 can cover the coil conductor layer M (described later) and have an insulating layer I. The insulating layer I is preferably made of a magnetic material, more preferably of sintered ferrite. The insulating layer I can contain at least Fe, Zn, Cu, and Ni as main components. As an example, Fe (converted to Fe2O3) may be 40.0 mol% to 49.5 mol%, Zn (converted to ZnO) may be 2 mol% to 35 mol%, Cu (converted to CuO) may be 6 mol% to 13 mol%, and Ni (converted to NiO) may be 10 mol% to 45 mol%. Furthermore, the insulating layer I may also contain additives such as Co, Bi, Sn, or Mn, or unavoidable manufacturing impurities.

[0030] The stacked members sb2 to sb15, which are located inside the outermost stacked members sb1 and sb16, may have the aforementioned insulating layer I, coil conductor layer M, and through-hole conductor V.

[0031] The conductive material constituting the coil conductor layer M is not particularly limited, and examples include Au, Ag, Cu, Pd, or Ni. Ag or Cu is preferred, and Ag is more preferred. There may be only one type of conductive material, or there may be two or more types. The coil conductor layer M is configured in a shape such as a U-shape where the ends are not connected to each other (i.e., the coil conductor layer is not closed), and the coil conductor layer M may be formed on the insulating layer I.

[0032] The thickness of the coil conductor layer M is determined based on the rated current flowing through the coil component. When a large current flows, the thickness of the coil conductor layer M is preferably 20 μm to 100 μm. By increasing the thickness of the coil conductor layer M, the resistance of the coil component becomes smaller. However, if the thickness of the coil conductor layer M increases, the amount of protrusion of the coil conductor layer M from the surface of the insulating layer I increases, which may cause strain when the laminated components sb1 to sb16 are laminated to manufacture the laminate S. To reduce this strain, insulating material Im can be placed around the coil conductor layer M to reduce the amount of protrusion of the coil conductor layer M (see reference). Figure 7 (b) and Figure 8 (b) Furthermore, if the thickness of the coil conductor layer M is relatively thin and the strain is less when manufacturing the laminate S, it is not necessary to form an insulating material Im around the coil conductor layer M.

[0033] From a manufacturing point of view, the via conductor V is preferably made of the same material as the coil conductor layer M, but a different material may also be used. The via conductor V may include a first via conductor FV and a second via conductor SV that electrically connect the coil conductor layers M to each other. Furthermore, the first via conductor FV may be smaller than the second via conductor SV. In other words, the amount of conductive material used for the first via conductor FV may be less than the amount of conductive material used for the second via conductor SV. That is, the phrase "the first via conductor FV is smaller than the second via conductor SV" in this specification refers to the size relationship based on the volume of the via conductors. Therefore, since the first via conductor FV of the coil component 1 of the present invention is smaller than the second via conductor SV, compared to a coil component 1 where the coil conductor layers M are electrically connected to each other only through the second via conductor SV, the amount of conductive material used for the via conductors can be reduced.

[0034] Furthermore, as any structure of the laminated components sb1 to sb16, a gap A can be provided between the coil conductor layer M and the insulating layer I. The gap A functions as a so-called stress-relieving space. That is, if the temperature drops to room temperature after firing the laminate S, the linear expansion coefficients of the coil conductor layer M and the insulating layer I are different, thus stress is applied between the coil conductor layer M and the insulating layer I. This stress can be relieved by the gap A. The thickness of the gap A is preferably 1 μm or more. By making the thickness of the gap A 1 μm or more, internal stress can be further relieved, and the generation of cracks can be effectively suppressed.

[0035] Next, the laminated body S formed by stacking the laminated components sb1 to sb16 described above will be described.

[0036] The stacked body S of the coil component 1 of the present invention can use a first through-hole conductor FV to electrically connect adjacent coil conductor layers M in parallel with each other in the stacking direction (see reference). Figure 2 and Figure 3 Here, "parallel connection" as used in this specification refers to a structure in which either end of the coil conductor layer M is electrically connected to an adjacent coil conductor layer in the stacking direction. As an example, such as... Figure 2 and Figure 3 As shown, for the second and third stacked members sb2 and sb3 from the top in the stacking direction, one end of the coil conductor layer M is electrically connected to each other through the external electrode E, and the other end is electrically connected to each other through the first through-hole conductor FV. Additionally, as an example, the two ends of the coil conductor layer M of the fourth and fifth stacked members sb4 and sb5 from the top in the stacking direction are electrically connected to each other through the first through-hole conductor FV. Furthermore, the example shown illustrates a parallel connection of two adjacent stacked members, but it is also possible to connect three or more stacked members in parallel.

[0037] The stacked body S of the coil component 1 of the present invention can be electrically connected in series with adjacent coil conductor layers M in the stacking direction using a second through-hole conductor SV (see reference). Figure 2 and Figure 3 Here, "series connection" as used in this specification refers to a structure in which either end of the coil conductor layer M is electrically connected to an adjacent coil conductor layer in the stacking direction. As an example, such as... Figure 2 and Figure 3 As shown, for the third and fourth stacked members sb3 and sb4 from the top in the stacking direction, one end of the coil conductor layer M is electrically connected to each other through the second through-hole conductor SV, but the other ends of the coil conductor layers M are not electrically connected to each other. Furthermore, it can be said that the same applies to the fifth and sixth stacked members sb5 and sb6 from the top in the stacking direction.

[0038] When the coil component 1 of the present invention is used for high current applications, by connecting the coil conductor layers M in parallel, the same amount of current can flow as in the case where the apparent thickness of the coil conductor layers M is increased. By connecting these parallel-connected coil conductor layers in series, the desired coil characteristics can be obtained. Here, the current flowing through the first through-hole conductor FV used for parallel connection is less than the current flowing through the second through-hole conductor SV used for series connection. Therefore, even if the first through-hole conductor FV is smaller than the second through-hole conductor SV, the impact on the electrical characteristics of the coil component is low. Therefore, it is possible to form a coil component that obtains good electrical characteristics even with a reduction in the amount of conductive material used for the through-hole conductors.

[0039] In a preferred embodiment of coil component 1, the coil conductor layers M connected by the first through-hole conductor FV can have the same shape, while the coil conductor layers M connected by the second through-hole conductor SV can have different shapes. As an example, such as... Figure 2 and Figure 3 As shown, the coil conductor layer M of the second stacked member sb2, connected by the first through-hole conductor FV, and the coil conductor layer M of the third stacked member sb3 have the same shape. The coil conductor layer M of the third stacked member sb3, connected by the second through-hole conductor SV, and the coil conductor layer M of the fourth stacked member sb4 have different shapes. Here, "same shape" in this specification means that the coil conductor layers M are substantially overlapping when viewed from the stacking direction, and "different shape" means that the coil conductor layers M are substantially non-overlapping when viewed from the stacking direction. The coil component of the present invention electrically connects coil conductor layers M of the same shape to each other through the first through-hole conductor FV, and electrically connects coil conductor layers M of different shapes to each other through the second through-hole conductor SV. Therefore, it is possible to form a coil component that reduces the amount of conductive material used for the through-hole conductor and obtains good electrical characteristics.

[0040] As a preferred embodiment of the coil component 1, lead-out portions Md that are electrically connected to the external electrode E can be provided in the outermost and adjacent coil conductor layers M of the laminate S (refer to...). Figure 2 According to the structure of the lead-out portion Md of the present invention, since the external electrode E is electrically connected through the lead-out portions Md provided in a plurality of coil conductor layers adjacent to each other, even if one lead-out portion Md is defective, the electrical connection can be ensured through the other lead-out portion Md.

[0041] Furthermore, regarding the aforementioned lead-out portion Md, the coil conductor layers M with which the lead-out portion Md is provided are electrically connected to each other through the first through-hole conductor FV. According to this structure, the coil conductor layers M with the lead-out portion Md are connected in parallel with each other and the external electrode E through the lead-out portion Md. Therefore, since the first through-hole conductor FV, which uses a small amount of conductive material, connects the coil conductor layers M to each other, it is possible to form a coil component that reduces the amount of conductive material used and obtains good electrical characteristics.

[0042] Next, the preferred configurations of the first via conductor FV and the second via conductor SV will be described.

[0043] As a preferred via conductor, the first via conductor FV and the second via conductor SV can be arranged on the same straight line. By arranging the via conductors in this way, the coil conductor layers M can be electrically connected to each other using a simple method without complicated processes.

[0044] As a preferred shape for the via conductors, in the cross-section, the first via conductor FV and the second via conductor SV can have a tapered shape that widens in the stacking direction (see reference). Figure 4 and Figure 5 By making the conductor of the via tapered, conductive material can be easily supplied from the wider side.

[0045] Furthermore, in the cross-section, the narrowest width of the first via conductor can be at least 0.5 times and less than 0.75 times the narrowest width of the second via conductor. The basis for this value will be explained in the embodiments described later.

[0046] [Manufacturing method of coil component according to the first embodiment]

[0047] Next, the manufacturing method of the coil component according to the first embodiment will be described. The manufacturing method of the coil component includes an insulation layer fabrication process, a through-hole conductor fabrication process, a coil conductor layer fabrication process, and a laminate fabrication process.

[0048] - Insulation layer fabrication process (refer to) Figure 6 (a))-

[0049] First, Fe₂O₃, ZnO, CuO, and NiO are weighed as raw materials to achieve the composition specified above. This raw material is then placed in a ball mill along with pure water and PSZ (partially stabilized zirconia) balls and wet-milled for 4 to 8 hours. After the water is evaporated and the mixture is dried, it is calcined at a temperature of 700°C to 800°C for 2 to 5 hours to produce the calcined product (calcined powder).

[0050] The prepared calcined material is placed in a ball mill along with PSZ media, and then a polyvinyl butyral-based organic binder, organic solvents such as ethanol or toluene, and plasticizers are added and mixed. Then, it is shaped into sheets with a film thickness of 20μm to 30μm using a doctor blade method, and then punched into rectangular shapes to produce sheet-like insulating layer I.

[0051] - Conductor fabrication process for vias -

[0052] A through-hole is formed by irradiating a predetermined area of ​​the fabricated sheet-like insulating layer I with a laser. When forming a through-hole by laser irradiation, the shape of the through-hole can be a tapered shape where the width of the laser irradiation surface increases and the tip tapers. Furthermore, the formation of the through-hole is not limited to laser irradiation; other processing techniques capable of forming through-holes can also be used. The through-hole is formed for forming a second through-hole conductor SV and for forming a first through-hole conductor FV, which is smaller than the second through-hole conductor SV.

[0053] Although not a necessary step in the manufacturing process of coil components, a resin paste P for forming voids can be arbitrarily created after the through-hole conductor fabrication process and printed onto the insulating layer I (see reference). Figure 6 (b)). As an example, the resin paste P for forming voids can be made by dissolving resin (e.g., acrylic resin, etc.) that disappears during firing in a solvent (such as isoflurane). Furthermore, to prevent voids A from being exposed from the outer surface of the laminate S, the resin paste P for forming voids is not formed at the location of the lead-out portion Md connected to the external electrode E.

[0054] - Coil conductor layer fabrication process (refer to) Figure 6 (c))-

[0055] First, a conductive material is prepared. Examples of conductive materials include Au, Ag, Cu, Pd, and / or Ni, with Ag or Cu being preferred, and Ag being more preferred. A conductive paste can be prepared by weighing a specified amount of conductive material powder, mixing the powder with a specified amount of solvent (eugenol, etc.), resin (ethyl cellulose, etc.), and dispersant using a planetary mixer or the like, and then dispersing them using a three-roll mill or the like.

[0056] A conductive paste is printed on the insulating layer I to conform to the shape of the specified coil conductor layer M. Figure 6 In the manufacturing method shown in (c), the coil conductor layer M is formed to cover the resin paste P used for forming the gaps. That is, it is preferable that the area of ​​the coil conductor layer M is larger than the area of ​​the resin paste P used for forming the gaps when viewed from above. Furthermore, the method for forming the conductive paste is not limited to printing, but may also be coating or the like.

[0057] Here, although it is not a necessary step in the manufacturing process of the coil component, when the thickness of the coil conductor layer M is relatively thick, strain will occur during the lamination process. Therefore, in order to improve the strain, the process of placing an insulating material Im around the coil conductor layer M can be arbitrarily performed (see reference). Figure 6 (d)). This insulating material Im can be manufactured by mixing raw materials containing ketone solvents, polyvinyl acetal resins, alkyd plasticizers, and ferrite raw materials (calcined materials) of a specified composition with a specified particle size using a planetary mixer or similar equipment, and then dispersing them using a three-roll mill or similar equipment. The manufactured insulating material Im can then be printed to cover the area around the coil conductor layer M. Furthermore, this step can be omitted if the thickness of the coil conductor layer M is thin enough to minimize strain during lamination.

[0058] -Laminated body manufacturing process ( Figure 6 (e))-

[0059] Arrange the laminated components sb1 to sb16 produced through the above steps in a prescribed order (for example, refer to...). Figure 2 and Figure 3 The laminated preform is fabricated by hot pressing. After the laminate preform is segmented, it is fired in a furnace at a temperature of 900°C to 920°C for 2 to 4 hours. Here, when a void-forming resin paste P is applied, the void-forming resin paste P is removed by firing, forming voids A. Then, as an optional step, the fired laminate is placed in a rotary drum machine, and the corners are chamfered.

[0060] After coating the laminate S prepared as described above with a conductive paste for forming the external electrode E, and sintering it at a temperature of 800°C to 820°C to form the base electrode, a Ni film and a Sn film are sequentially formed by electroplating. Thus, the desired coil component 1 can be manufactured.

[0061] [Coil component of the second embodiment]

[0062] Next, refer to Figure 9 and Figure 10 The coil component of the second embodiment will be described. Furthermore, descriptions that are repeated above will be omitted as appropriate.

[0063] In the first embodiment, the coil component connects adjacent coil conductor layers M in parallel. However, from the viewpoint of the rated current flowing through the coil component, the coil component in the second embodiment may also have portions that are not connected in parallel. In other words, the coil component 1 in the second embodiment may also include portions that are continuously connected in series in the lamination direction within the laminate S.

[0064] like Figure 9 As illustrated, for example, adjacent stacked members sb3 and sb4 are connected in series, and adjacent stacked members sb4 and sb5 are also connected in series. Furthermore, in this embodiment, the via conductors connected in series can also be the second via conductor SV, and the via conductors connected in parallel can also be the first via conductor FV.

[0065] Based on this structure, the coil components can be appropriately designed to allow the specified rated current to flow through them.

[0066] [Coil component of the third embodiment]

[0067] Next, refer to Figure 11 and Figure 12 The coil component of the third embodiment will be described. Furthermore, descriptions that are repeated above will be omitted as appropriate.

[0068] In the first embodiment, the coil component has lead-out portions Md that are electrically connected to the external electrode E in the outermost and adjacent coil conductor layers M located on the laminate S. However, in the third embodiment, the coil component may also have at least two lead-out electrode layers D that are electrically connected to the external electrode E on the outer side of the coil conductor layer M in the lamination direction, and the at least two lead-out electrode layers D are adjacent to each other.

[0069] The lead-out electrode layer D may not be a curved shape forming the coil, but a non-curved shape. In other words, the lead-out electrode layer D may also be a wiring layer that serves to electrically connect the adjacent coil conductor layer M to the external electrode E.

[0070] As a preferred embodiment of the lead electrode layers D, the two lead electrode layers D can be arranged to be adjacent to each other. With this structure, even if one lead electrode layer D is defective, electrical connection can be guaranteed through the other lead electrode layer D.

[0071] According to the coil component of the third embodiment, it is electrically connected to the external electrode E through a lead-out electrode layer D that is different from the coil conductor layer M, thereby increasing the degree of freedom in the layout (position, size, etc.) of the lead-out electrode layer D.

[0072] Regarding the preferred embodiment of the lead-out electrode layers D, the lead-out electrode layers D are electrically connected to each other through the first through-hole conductor FV. That is, the lead-out electrode layers D are connected in parallel with each other and the external electrode E through the first through-hole conductor FV. Therefore, by using the first through-hole conductor FV, which requires less conductive material, a coil component with reduced conductive material usage and good electrical characteristics can be formed.

[0073] Furthermore, the lead-out electrode layer D and the coil conductor layer M can also be electrically connected through the second through-hole conductor SV. That is, the lead-out electrode layer D and the coil conductor layer M can also be connected in series. With this structure, the desired coil characteristics as a coil component can be obtained.

[0074]

Example

[0075] Verification experiments were conducted on the "coil component" involved in this invention. Specifically, a coil component with 1.5 turns of coil conductor layers connected in series was fabricated. These coil conductor layers were formed by connecting coil conductors with a thickness of 12 μm and a width of 110 μm in parallel (i.e., for...). Figure 2 and Figure 3 The coil component shown is a coil component formed by connecting laminated members sb1 to sb3 and laminated members sb14 to sb16 in series. Here, the narrowest width dimension is set as shown in [Table 1] for the sizes of the first via conductor FV and the second via conductor SV. Furthermore, the ratio of the first via conductor FV to the second via conductor SV based on this width dimension is set as shown in [Table 1]. Moreover, the DC resistance of each of the manufactured coil components is measured. The results of the DC resistance measurement are shown in Table 1.

[0076] Table 1

[0077]

[0078] Furthermore, the evaluation method for the width dimension of the via conductor is to perform FIB processing on the exposed cross-section of the first and second via conductors using a focused ion beam processing device (SMI3050R of Seiko Nanotechnology Co., Ltd.), and to calculate the narrowest width dimension of the first and second via conductors by observing the cross-section through SEM.

[0079] In addition, for DC resistance, a digital resistance meter 755611 manufactured by Yokokawa Electric Corporation was used to measure the resistance value by measuring the current value of 10mA.

[0080] In addition, regarding whether there are cracks in the via conductor, when 100 samples were manufactured, the above-mentioned SEM observation was used to confirm whether cracks were generated in the first or second via conductor.

[0081] According to Table 1 above, regarding the DC resistance of the coil components, for samples No. 2 and No. 3, the resistance value remained within a 5% increase, resulting in good coil characteristics. However, for samples No. 1 and No. 2, due to the large values ​​of the first through-hole conductor FV and the second through-hole conductor SV, the stress between the coil conductor layer M and the insulation layer I increased, leading to cracks and other defects. Therefore, based on the above verification experiments, the narrowest width of the first through-hole conductor is preferably 0.5 times or more and less than 0.75 times the narrowest width of the second through-hole conductor.

[0082] Furthermore, all points in the disclosed embodiments are merely illustrative and not intended as a basis for limiting interpretation. Therefore, the technical scope of the present invention is not limited to the above embodiments, but is defined based on the claims. Additionally, the technical scope of the present invention includes all modifications equivalent to the claims and within their scope.

[0083] Industrial applicability

[0084] The stacked coil component of the present invention can be widely used as an inductor and for various other applications.

Claims

1. A coil component comprising a laminate in which a plurality of insulating layers and coil conductor layers are stacked in a stacking direction, and having a first via conductor and a second via conductor that electrically connect the coil conductor layers to each other, characterized in that: the volume of the first via conductor is smaller than the volume of the second via conductor, in a cross section, the narrowest width dimension of the first via conductor is 0.5 times or more and less than 0.75 times the narrowest width dimension of the second via conductor, the first via conductor is a via conductor that electrically connects coil conductor layers adjacent in the stacking direction in parallel to each other, and the second via conductor is a via conductor that electrically connects coil conductor layers adjacent in the stacking direction in series to each other.

2. The coil component according to claim 1, characterized in that: the shapes of the coil conductor layers connected to each other by the first via conductor are mutually identical shapes, and the shapes of the coil conductor layers connected to each other by the second via conductor are mutually different shapes.

3. The coil component according to claim 1 or 2, characterized in that: the first via conductor and the second via conductor are arranged on the same straight line.

4. The coil component according to claim 1 or 2, characterized in that: the first via conductor and the second via conductor have a tapered shape in which the width widens in the stacking direction in a cross section.

5. The coil component according to claim 1 or 2, characterized in that: the coil conductor layers located at the outermost sides of the laminate and adjacent to each other are respectively provided with a lead-out portion that is electrically connected to an external electrode.

6. The coil component according to claim 5, characterized in that: the coil conductor layers provided with the lead-out portions are electrically connected to each other by the first via conductor.

7. The coil component according to claim 1 or 2, characterized in that: at least two lead-out electrode layers that are electrically connected to an external electrode are arranged on the outer sides of the coil conductor layers in a manner adjacent to each other.

8. The coil component according to claim 7, characterized in that: the lead-out electrode layers are electrically connected to each other by the first via conductor.

9. The coil component according to claim 7, characterized in that: the lead-out electrode layers and the coil conductor layers are electrically connected by the second via conductor.

10. The coil component according to claim 1 or 2, characterized in that: a gap portion is provided between the coil conductor layers and the insulating layers. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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