Electronic component operating device, mounting device and mounting method

Abstract

The present invention provides an electronic component handling device, mounting device, and mounting method that can pick up electronic components in a non-contact manner and position them at a mounting position. The handling device in an embodiment comprises: a mounting head that mounts the electronic component on a substrate at the mounting position; a pickup collet having a porous member and a guide portion, the porous member ejecting gas and holding the electronic component in a non-contact manner through negative pressure from a suction hole; the guide portion restricting the movement of the electronic component; the pickup collet picking up the electronic component from a supply portion and transferring it to the mounting head; a reversing drive portion that reverses the pickup collet; a transfer mechanism that transfers the pickup collet to the mounting head; a component-side imaging portion that captures the outer shape of the reversed electronic component; and a positioning mechanism that positions the mounting head on the electronic component based on the captured outer shape of the electronic component, and after transferring the electronic component to the mounting head, positions the mounting head at the mounting position.

Description

Technical Field

[0001] The present invention relates to an operating device for electronic components, an installation device for electronic components and an installation method for electronic components. Background Art

[0002] When electronic parts such as logic devices, memories, and image sensors are mounted on a substrate as semiconductor elements, individual chips are produced by cutting the wafer on which the semiconductor elements are formed. The chips are then picked up one by one by a transfer device, transferred to the substrate, and mounted using a mounting mechanism. Various devices have been proposed as mounting devices used when mounting such semiconductors on a substrate. As one of them, there is known a device that includes an operating device for electronic parts such as chips, a supply unit, a substrate support mechanism, and a control device for these. In addition, the operating device is provided with a mounting mechanism, a substrate side camera unit, a parts side camera unit, and a transfer device. The transfer device performs the following operations: picking up electronic parts from the supply unit and delivering the picked-up electronic parts to the mounting device.

[0003] The surface of one side of the chip becomes a functional surface with a fine circuit formed thereon. When the chip is picked up from the wafer, if the picked-up member directly contacts the functional surface, the circuit and the like may be damaged, so there is a demand to avoid contact.

[0004] Furthermore, the connection terminals on the chip surface are bonded to the connection terminals on the substrate facing each other. To ensure and improve the bonding between the connection terminals, the chip surface is sometimes treated with plasma or surface activation. To maintain the surface condition of the chip after such treatment, there is also a desire to avoid direct contact between the pickup component and the chip surface.

[0005] In order to meet the requirement of preventing the component from contacting the surface of the chip, the surface holding the chip in the collet, which is a component for picking up the chip, has been set as a conical surface, so that the chip is sucked and held from the center in a state where only the peripheral portion of the chip, not the surface of the chip, contacts the conical surface of the collet (see Patent Document 1).

[0006] [Prior art literature]

[0007] [Patent Document]

[0008] [Patent Document 1] Japanese Utility Model Application Laid-Open No. 63-124746 Summary of the Invention

[0009] [Problems to be solved by the invention]

[0010] However, in the prior art described above, the collet contacts only the periphery of the chip, with suction being applied from the center. This can easily strain the chip, potentially causing it to become chipped or cracked. Furthermore, the collet contacts the chip's edge, supporting the chip during suction. This causes stress to concentrate on the periphery, potentially causing chipping or cracking. Furthermore, because the chip's position is fixed during suction, any shifting or tilting during suction cannot be corrected during subsequent transfer to the mounting device.

[0011] The embodiments of the present invention are proposed to solve the above-mentioned problems, and their purpose is to provide an electronic component handling device, an electronic component mounting device, and an electronic component mounting method that can pick up electronic components in a non-contact manner and position them at mounting positions.

[0012] [Technical means to solve the problem]

[0013] The electronic component operating device of the embodiment of the present invention comprises: a mounting head, which mounts the electronic component on the substrate at the mounting position; a picking collet, which has a porous member and a guide part, the porous member ejects gas from fine holes and holds the electronic component in a non-contact manner by the negative pressure of the suction hole, the guide part restricts the movement of the electronic component held in a non-contact manner, the picking collet picks up the electronic component from the supply part that supplies the electronic component and transfers it to the mounting head; a reversing drive part, which reverses the picking collet from the supply position; a transfer mechanism, which transfers the picking collet between the supply part and the mounting head; a part-side shooting part, which shoots the outer shape of the electronic component held by the reversed picking collet; and a positioning mechanism, which positions the mounting head at the electronic component held by the picking collet based on the outer shape of the electronic component photographed by the part-side shooting part, and positions the mounting head at the mounting position after the electronic component is handed over from the picking collet to the mounting head.

[0014] An electronic component mounting apparatus according to an embodiment of the present invention includes a mounting mechanism having a handling device for the electronic component, and mounting the electronic component positioned by the positioning mechanism on the substrate at the mounting position.

[0015] The electronic component mounting method of an embodiment of the present invention is an mounting method for positioning and mounting a substrate and an electronic component, wherein a pickup chuck having a porous member and a guide portion picks up the electronic component from a supply portion of the electronic component, the porous member ejects gas from fine pores, and holds the electronic component in a non-contact manner by the negative pressure of a suction hole, the guide portion restricts the movement of the held electronic component, the reversal drive portion reverses the pickup chuck that has picked up the electronic component, the transfer mechanism transfers the pickup chuck that has picked up the electronic component to a mounting head for mounting the electronic component on a substrate, the component side shooting portion shoots the outer shape of the electronic component held by the reversed pickup chuck, and the positioning mechanism positions the mounting head based on the outer shape of the electronic component shot by the component side shooting portion. The electronic component held by the picking collet is delivered from the picking collet to the mounting head through the relative movement of the picking collet and the mounting head. The positioning mechanism positions the mounting head to which the electronic component is delivered and held at a mounting position for mounting the electronic component on the substrate. When the substrate is retracted from the mounting position by the substrate supporting mechanism, the substrate side shooting section shoots the mark of the electronic component held by the mounting head, and the part side shooting section shoots the image of the mark of the substrate positioned at the mounting position by the substrate supporting mechanism. The positioning mechanism positions the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the mark shot by the part side shooting section and the substrate side shooting section.

[0016] [Effects of the Invention]

[0017] Embodiments of the present invention can provide an electronic component handling device, an electronic component mounting device, and an electronic component mounting method that can pick up an electronic component in a non-contact manner and position it at a mounting position. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view showing the schematic structure of the mounting device according to the embodiment.

[0019] Figure 2 This is a plan view showing electronic components and a substrate.

[0020] Figure 3 (A) and Figure 3 (B) is a plan view of the installation device (A) and an enlarged plan view of the installation part (B).

[0021] Figure 4 (A) is a cross-sectional view showing the principle of using a pickup collet to hold electronic components. Figure 4(B) is a bottom side perspective view showing the base.

[0022] Figure 5 This is a bottom perspective view showing the pickup collet and the attachment and detachment section.

[0023] Figure 6 It is a perspective view showing the top side of the pickup collet and the attachment and detachment portion.

[0024] Figure 7 (A) and Figure 7 (B) is an enlarged view showing the inversion action of the electronic component, with the left side being a front view and the right side being a plan view.

[0025] Figure 8 (A)~ Figure 8 (D) is an explanatory diagram showing the picking-up operation of electronic components.

[0026] Figure 9 (A)~ Figure 9 (E) is an explanatory diagram showing the transfer operation of electronic components.

[0027] Figure 10 (A)~ Figure 10 (C) is an explanatory diagram showing the photographing of electronic components when receiving electronic components using the mounting head (A), the positioning of the mounting head on the electronic components (B), and the positioning of the mounting head at the mounting position (C).

[0028] Figure 11 (A)~ Figure 11 (C) is an explanatory diagram showing the installation action of the installation device.

[0029] Figure 12 This is a flowchart showing the procedure of picking up and delivering electronic components.

[0030] Figure 13 This is a flowchart showing the procedure for mounting electronic components.

[0031] Figure 14 (A) and Figure 14 (B) is a bottom view showing a modified example of the arrangement of the guide portion.

[0032] [Explanation of Symbols]

[0033] 1: Install the device

[0034] 2: Substrate support mechanism

[0035] 3: Installation mechanism

[0036] 4: Substrate side imaging unit

[0037] 5: Parts side shooting section

[0038] 6: Supply Department

[0039] 7: Transfer device

[0040] 8: Control device

[0041] 11: Support platform

[0042] 11a: Receiving hole

[0043] 21: Carrier

[0044] 22, 32, 62: driving mechanism

[0045] 22a, 22b, 33a, 34a, 35a, 62a, 62b: Guide rails

[0046] 23: Mobile board

[0047] 23a: Through hole

[0048] 31: Installation head

[0049] 31a: Hollow part

[0050] 31b: Holding part

[0051] 33, 34, 35, 733: Mobile

[0052] 61: Support mechanism

[0053] 61a: Ring retainer

[0054] 71: Transfer head

[0055] 71a: Adsorption nozzle

[0056] 71b, 710: Reverse drive unit

[0057] 72: Arm

[0058] 72a: Extension

[0059] 72b: base

[0060] 73: Transfer agency

[0061] 700: Pick-up collet

[0062] 701: Porous components

[0063] 701a: Facing surface

[0064] 701b: Back

[0065] 701c: Suction hole

[0066] 701d: Opening

[0067] 702: Base

[0068] 702a: Air supply hole

[0069] 702b: Exhaust hole

[0070] 702c: Mounting hole

[0071] 703, 703K~703N: Guide part

[0072] 704: Loading and unloading department

[0073] 704a: Pin

[0074] 720: Rotating body

[0075] 731: Fixed body

[0076] 732: First drive unit

[0077] 732a: First driving source

[0078] 732b: First sliding part

[0079] 734: Second drive unit

[0080] 734a: Second driving source

[0081] 734b: Second sliding portion

[0082] B: Installation area

[0083] C: Electronic components

[0084] D: Adsorption area

[0085] F: Loading surface

[0086] G: Gas

[0087] L: Height position

[0088] M, m: mark

[0089] OA: Installation location

[0090] S: Substrate

[0091] SL: Sliding part

[0092] T: Transmission area

[0093] WS: wafer DETAILED DESCRIPTION

[0094] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 and Figure 2As shown in FIG. 1 , the present embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. FIG. Figure 1 It is a front view showing a schematic structure of the mounting device 1. Figure 2 1 is a plan view showing an electronic component C and a substrate S. The drawings are schematic diagrams, and the dimensions (hereinafter also referred to as sizes), shapes, and ratios of the dimensions of each part may differ from those in reality.

[0095] [Electronic components]

[0096] First, the electronic components C to be mounted in this embodiment include semiconductor elements such as integrated circuits (ICs) and large-scale integrations (LSIs). Figure 2 As shown, this embodiment uses a rectangular parallelepiped semiconductor chip as the semiconductor element. Semiconductor chips are individual bare chips cut by slicing a semiconductor wafer into small squares. The bare chip has a functional surface on one side, which functions as a semiconductor element. Electrodes with or without bumps are provided on the functional surface, and are mounted by flip-chip connection, bonded to electrode pads on a substrate S.

[0097] The electronic component C is provided with multiple marks m for positioning. In this embodiment, two marks m are provided, one at each of two opposite corners of the rectangular electronic component C. The marks m are provided on the surface of the electronic component C where the electrodes are formed, i.e., the face. This embodiment is an example of a face-down mounting device for mounting the component C with the face facing the substrate S.

[0098] [Substrate]

[0099] In this embodiment, if Figure 2 As shown, the substrate S on which the electronic component C described above is mounted is a plate-shaped member such as a resin having printed circuits formed thereon, or a silicon substrate having a circuit pattern formed thereon. The substrate S has a mounting area B, where the substrate S is mounted, and a plurality of positioning marks M are provided outside the mounting area B. In this embodiment, two marks M are provided outside the mounting area B at positions corresponding to the marks m on the electronic component C.

[0100] [Installation device]

[0101] The mounting device 1 of this embodiment is a high-precision mounting device 1 capable of achieving a mounting accuracy of, for example, ±0.2 μm or less. Figure 1 、 Figure 3 (A) and Figure 3As shown in (B), the mounting device 1 includes a substrate support mechanism 2, a mounting mechanism 3, a substrate-side imaging unit 4, a component-side imaging unit 5, a supply unit 6, a transfer device 7, and a control device 8. The operating device is used for this mounting device 1 and includes part or all of the mounting mechanism 3, the substrate-side imaging unit 4, the component-side imaging unit 5, and the transfer device 7. Figure 3 (A) is a plan view of the installation device 1, Figure 3 (B) is a plan view showing a mark M that is transmitted through a mounting head 31 described later.

[0102] In the following description, the direction in which the mounting mechanism 3 moves in order to mount the electronic component C on the substrate S is referred to as the Z axis, and the two axes perpendicular to each other in the plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as the downward direction, the direction opposing gravity is referred to as the upward direction, and the position on the Z axis is referred to as the height. Furthermore, the X axis and the Y axis are on a horizontal plane, and the Z axis is perpendicular to the substrate S. Figure 1 When viewed from the front, the X-axis represents the left-right direction, and the Y-axis represents the depth direction. However, the present invention is not limited to this orientation. Regardless of the orientation, the side on which the electronic component C is mounted is referred to as the upper side, and the opposite side is referred to as the lower side, based on the substrate S or substrate support mechanism 2.

[0103] The substrate support mechanism 2 supports the substrate S on which the electronic component C is mounted and is a so-called substrate stage. The mounting mechanism 3 mounts the electronic component C on the substrate S. The mounting mechanism 3 includes a mounting head 31. The mounting head 31 has a transmissive portion that can transmit and recognize the marking M on the substrate S facing the electronic component C while holding the electronic component C.

[0104] The substrate-side imaging unit 4 is positioned below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the substrate S. With the substrate S retracted from the mounting position OA by the substrate support mechanism 2, the imaging unit captures the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, i.e., from below. The mounting position OA is the position where the electronic component C is mounted on the substrate S and is indicated in the figure by a dashed line drawn along the Z axis passing through a point (e.g., the center point) on the XY coordinates within the region where the electronic component C is mounted. As described below, the mounting position OA coincides with the optical axes of the cameras of the substrate-side imaging unit 4 and the component-side imaging unit 5.

[0105] The component-side imaging unit 5 is positioned above the mounting head 31 at the mounting position OA, and images the mark M on the substrate S through the transmissive portion of the mounting head 31 (hereinafter referred to as "imaging through the mounting head 31"). Based on the image captured in this manner, the marks m and M can be detected, that is, the marks m and M can be identified. Furthermore, the component-side imaging unit 5 images the outer shape of the electronic component C held by the pickup collet 700 of the transfer head 71, described below, through the mounting head 31.

[0106] Furthermore, the substrate support mechanism 2 and the mounting mechanism 3 each include a positioning mechanism. This positioning mechanism positions the mounting head 31 relative to the electronic component C held by the pickup collet 700 based on the outer shape of the electronic component C captured by the component-side imaging unit 5. Furthermore, the positioning mechanism positions the substrate S and the electronic component C held by the mounting head 31 based on their positions determined from the images of the marks m and M captured by the substrate-side imaging unit 4 and the component-side imaging unit 5. The various components of the mounting device 1 described above are mounted on a support table 11 installed on a mounting surface. The top surface of the support table 11 is horizontal.

[0107] The supply unit 6 supplies electronic components C. The transfer device 7 transfers the electronic components C from the supply unit 6 to the mounting position OA. The transfer device 7 includes a transfer head 71 and a transfer mechanism 73. The transfer head 71 picks up the electronic components C from the supply unit 6, inverts them, and transfers them to the mounting head 31. The transfer mechanism 73 moves the transfer head 71 into the space created by the substrate support mechanism 2 retracting the substrate S from the mounting position OA, positioning the transfer head 71 at the mounting position OA.

[0108] The control device 8 controls the operation of the mounting device 1. This device 8 comprises, for example, an electronic circuit or a computer operating according to a predetermined program. Specifically, the control device 8 is a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU) that reads programs and data from a storage device to control the mounting device 1. Each component is described in detail below.

[0109] (Substrate support mechanism)

[0110] like Figure 1 and Figure 3As shown in (A), the substrate support mechanism 2 is arranged on the support table 11 and includes a carrier 21 and a drive mechanism 22. The carrier 21 is a plate-shaped component on which the substrate S is placed. The drive mechanism 22 is a two-axis moving mechanism, for example, having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction. A motor (not shown) is used as a driving source, and the carrier 21 is moved in a horizontal plane through a conveyor belt or a ball screw. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. In addition, although not shown in the figure, the drive mechanism 22 includes a θ drive mechanism that rotates the carrier 21 in the horizontal plane.

[0111] The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22 b. A through hole 23 a is formed in the moving plate 23 so that the substrate-side imaging unit 4 can image the electronic component C.

[0112] Although not shown, a loader / unloader for supplying / storing substrates S to / from the stage 21 is provided at one of the movable ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the movable end on the right side in the figure). Therefore, the substrate support mechanism 2 receives substrates S from the loader or transfers substrates S to the unloader while the stage 21 is moved to the movable end.

[0113] (Installation mechanism)

[0114] The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is roughly rectangular in shape, with a hollow portion 31a serving as a transmissive portion and a retaining portion 31b. Hollow portion 31a is a cylindrical through-hole formed along the Z-axis. Retaining portion 31b is a plate-like member that allows light for imaging to pass through. It is installed to block the opening in hollow portion 31a facing the substrate S. For example, a transparent glass plate is used as retaining portion 31b. Retaining portion 31b is a so-called mounting tool that holds the electronic component C.

[0115] like Figure 3As shown in (B), a suction area D for sucking and holding the electronic component C is provided in the center of the holding portion 31b. The suction area D and its center line are indicated by a two-dot chain line in the figure. The suction area D is the location where the electronic component C is held by the holding portion 31b. Although not shown, suction holes are formed in the suction area D. A flow path is formed inside the holding portion 31b to connect the suction holes to a negative pressure source, so that the suction holes can suck and hold the electronic component C by generating negative pressure. The suction area D of the holding portion 31b and its surroundings form a transmission area T that can transmit and photograph the electronic component C held by the pickup collet 700. Moreover, even when the suction area D sucks the electronic component C, the transmission area T around the suction area D can also transmit and photograph the mark M on the substrate S. In other words, the mounting head 31 has a transparent portion so that the component-side imaging unit 5 can capture the outer shape of the electronic component C and the mark M on the substrate S. In addition, the holding surface (suction surface) of the holding portion 31b that holds the electronic component C is referred to as the lower end surface.

[0116] The driving mechanism 32 is composed of a moving body 33, a moving body 34, and a moving body 35, and is a mechanism for driving the mounting head 31. The moving body 33 is arranged so as to be movable along a guide rail 33a provided in the Y-axis direction of the support table 11. The moving body 34 is arranged so as to be movable along a guide rail 34a provided in the X-axis direction on the top surface of the moving body 33. The moving body 35 is arranged so as to be movable along a guide rail 35a provided in the Z-axis direction on the front surface of the moving body 34. The moving body 35 is formed in a generally concave shape when viewed from above. These moving bodies 33, 34, and 35 are driven by a ball screw or a linear motor, or a pressure cylinder, etc., which uses a motor as a driving source.

[0117] The mounting head 31 is located below a movable body 35 that moves in the Z-axis direction. Therefore, the movable body 35 performs operations to mount the electronic component C held by the holding portion 31b of the mounting head 31 on the substrate S. Furthermore, the movable body 35, on which the mounting head 31 is mounted, moves in the X-axis and Y-axis directions through the movement of the movable bodies 33 and 34. Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Although not shown in the figure, the drive mechanism 32 includes a θ drive mechanism that rotates the mounting head 31 in a horizontal plane.

[0118] Furthermore, in this embodiment, from the perspective of preventing movement errors, it is preferable to set the amount of movement in the X-axis, Y-axis, and Z-axis directions generated by the drive mechanism 32 to be as short as possible. For example, the amount of movement in the X-axis and Y-axis directions of the movable bodies 33 and 34 is set to a few millimeters to a dozen millimeters, respectively. Furthermore, the amount of movement in the Z-axis direction of the movable body 35 is also set to a few millimeters to a dozen millimeters. That is, the mounting head 31 receives the electronic component C or captures the mark m of the received electronic component C at a height position where the lower end surface of the holding portion 31b is separated from the upper surface of the substrate S placed on the stage 21 by a distance of a few millimeters, for example, 1 mm to 2 mm (a vertical separation distance). Therefore, the amount of movement in the Z-axis direction of the movable body 35 is sufficient to ensure that the electronic component C held by the holding portion 31b can be mounted on the substrate S by applying a predetermined pressure from at least the height position.

[0119] (Substrate side imaging unit)

[0120] The substrate-side camera unit 4 includes a camera, a lens, a lens barrel, a light source, and the like, and is fixed to a receiving hole 11a provided on the support table 11. The substrate-side camera unit 4 positions the optical axis of the camera in a direction capable of capturing an image of the mark m of the electronic component C held by the mounting head 31. Specifically, the optical axis is positioned vertically. In this embodiment, the substrate-side camera unit 4 is positioned upward within the receiving hole 11a of the support table 11, which is located below the substrate support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. When the substrate-side camera unit 4 faces the mounting head 31 so that the pickup collet 700 can transfer the electronic component C, the electronic component C is fixed to the support table 11 so that the electronic component C falls within the field of view of the camera. Furthermore, the substrate-side camera unit 4 sets the magnification of the camera so that the accuracy of capturing the mark m of the electronic component C held by the mounting head 31 and identifying its position reaches the required accuracy. Naturally, the field of view is such that the mark m can be captured. Furthermore, the field of view is set to take into account the unevenness of the positions of the electronic components C held by the mounting head 31, that is, the accuracy of the positional retention. Furthermore, when imaging multiple marks m and identifying the positions of the electronic components C held by the mounting head 31, the field of view can be set to allow for simultaneous imaging of multiple marks m. This magnification and field of view can be appropriately determined based on the required positioning accuracy.

[0121] (Parts side camera)

[0122] The part-side imaging unit 5 includes a camera, a lens, a lens barrel, a light source, and other components. It is supported by a frame (not shown) at a position above the support table 11, more specifically, above the mounting head 31. The part-side imaging unit 5 positions the camera's optical axis in a direction that allows it to capture images of the markings M surrounding the mounting area B of the substrate S, while transmitting through the retaining portion 31b of the mounting head 31. Specifically, in this embodiment, the part-side imaging unit 5 is positioned downwardly and directly above the mounting head 31, with the camera's optical axis aligned with the mounting position OA. The magnification of the imaging unit 5 is set so that the markings M marked on the mounting area B of the substrate S placed on the stage 21 are captured and their position is identified with the required accuracy. Furthermore, the imaging field of view of the part-side imaging unit 5 is set to include two markings M marked at opposite corners of the mounting area B of the substrate S. Furthermore, the range of the imaging field is also set to take into account the unevenness of the position of the substrate S placed on the stage 21, that is, the accuracy of the placement position.

[0123] Furthermore, the component-side camera 5 can capture the outer shape of the electronic component C while the pickup collet 700 is facing the mounting head 31 to transfer the electronic component C. Therefore, the imaging field of the component-side camera 5 is set to take into account the maximum range of movement of the electronic component C while held in the pickup collet 700. In this case, the area formed by the two marks M marked diagonally relative to the mounting area B of the substrate S is larger than the outer dimensions of the electronic component C. Therefore, Rongguang uses the same component-side camera 5 to capture both the two marks M and the outer shape of the electronic component C. However, if the imaging magnification and imaging field required for the required recognition accuracy relative to the substrate S differ significantly from the imaging magnification and imaging field required for the recognition accuracy relative to the outer shape of the electronic component C, the magnification and imaging field can be appropriately determined, for example, using a zoom lens. Furthermore, if necessary, a focusing mechanism, such as a lens shift mechanism or a barrel shift mechanism, can be provided to adjust the focal position as the magnification changes. When the component-side imaging unit 5 captures the outer shape of the electronic component C, it is preferable to set the height of the surface of the electronic component C to the same height as the surface of the substrate S where the mark M is located. This eliminates the need to adjust the focus position when capturing the outer shape of the electronic component C.

[0124] (Supply Department)

[0125] The supply unit 6 has a supporting mechanism 61 and a driving mechanism 62. The supporting mechanism 61 is a device that supports the wafer WS to which the electronic component C is attached. The driving mechanism 62 moves the supporting mechanism 61 along the X-axis direction and the Y-axis direction. The surface (area) on which the electronic component C is mounted in the supply unit 6 is referred to as the loading surface F. In this embodiment, the electronic component C is obtained by dividing the chip attached to the wafer WS into single pieces by cutting the chip. Therefore, the surface of the wafer WS to which the electronic component C is attached (the surface of the chip) is the loading surface F. The wafer WS is attached to a patch ring (wafer ring) not shown in the figure. The supporting mechanism 61 has a ring retainer 61a on which the patch ring is installed. That is, the surface of the supporting mechanism 61 that supports the wafer WS can also be considered to be the loading surface F.

[0126] Although not shown, a loader / unloader for supplying and storing patch rings in the ring holder 61a is provided at one of the movable ends in the Y-axis direction of the support mechanism 61 (specifically, the movable end on the front side in the figure). When the support mechanism 61 moves to this movable end, it receives patch rings from the loader or transfers patch rings to the unloader.

[0127] Although not shown, the support mechanism 61 includes an expansion mechanism that creates gaps between the electronic components C by stretching the wafer WS, and an upward push mechanism that separates the electronic components C by gripping the stretched wafer WS and pushing them upward individually. Furthermore, the support mechanism 61 includes a θ drive mechanism that rotates the ring holder 61a within a horizontal plane. The upward push mechanism is fixed to the support table 11 and receives, or picks up, the electronic components C from the supply unit 6 at the specified position (supply position) using the transfer device 7.

[0128] The driving mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the driving mechanism 62 includes a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction. A motor (not shown) is used as a driving source to move the support mechanism 61 in the X-axis and Y-axis directions in a horizontal plane via a conveyor belt or a ball screw. The driving mechanism 62 functions as a positioning mechanism for positioning the electronic component C relative to the transfer head 71. In addition, the driving mechanism 62 is arranged at a height L higher than the placement surface F (see FIG. 1 ). Figure 5 ) lower position.

[0129] (Transfer device)

[0130] The transfer device 7 transfers the electronic component C to the mounting device 1. The transfer device 7 includes a transfer head 71, an arm 72, and a transfer mechanism 73. Figure 3 As shown in (A), the transfer head 71 has a pickup collet 700 and a reverse drive unit 710. Figure 4 (A)~ Figure 6As shown, the pickup collet 700 is a member that suctions and holds the electronic component C and releases the suction and holds to release the electronic component C. The pickup collet 700 includes a porous member 701, a base 702, and a guide portion 703. In this embodiment, the pickup collet 700 is moved by the transfer device 7 to transfer the electronic component C to the mounting head 31. However, the movement for transfer can be relative movement, and either or both of the pickup collet 700 and the mounting head 31 can be moved.

[0131] The porous member 701 is a member that is air-permeable and supplies gas to the interior through the pores of the facing surface 701a facing the electronic component C (in addition, in the following description, the gas supplied to the electronic component C is marked with the symbol G for illustration). The porous member 701 of this embodiment is in the shape of a rectangular plate, and is densely and roughly uniformly formed with interconnected fine spaces. The porous member 701 has air permeability due to the structure, but its conductivity is very small. Any surface of the porous member 701 becomes the facing surface 701a. If gas is supplied to the interior from the back surface 701b on the opposite side of the facing surface 701a, gas will be ejected from the dense and evenly existing pores of the facing surface 701a. The ejection becomes a substantially planar ejection that extends to the entire surface of the ejected facing surface 701a. The ejection is extremely slow, and it can be said to be a feeling of seeping out, to the extent that the air flow can be slightly felt when the finger is close to it. In addition, the pores on surfaces other than the facing surface 701a and the back surface 701b may be blocked.

[0132] The porous member 701 is a continuous structure in which the pores serving as the microscopic spaces inside are interconnected, and gas can pass through the pores. Sintered metal, ceramics, resin, etc. can be used as such a porous member 701. Sintered metal is preferably used because it makes it difficult for particles inside to separate and flow out.

[0133] Furthermore, if Figure 4 (A) Figure 4 (B) and Figure 5 As shown, the porous member 701 is provided with a suction hole 701c having an opening 701d on the facing surface 701a and sucking the electronic component C by negative pressure. The suction hole 701c of this embodiment passes straight through from the center of the back surface 701b to the center of the facing surface 701a.

[0134] The base 702 is a member that covers the surface of the porous member 701 other than the facing surface 701a. In this embodiment, the base 702 is a rectangular box with an opening at the bottom. The porous member 701 is inserted through the opening of the base 702 so that the bottom surface becomes the facing surface 701a and is exposed. The porous member 701 is assembled into the base 702 and fixed.

[0135] like Figure 4 (A) Figure 4 (B) and Figure 6 As shown, an air supply hole 702a, an exhaust hole 702b, and a mounting hole 702c are provided on the top surface of the base 702. The air supply hole 702a is a through hole for supplying air to the porous member 701. The air supply hole 702a is formed at a position close to the outer edge of the base 702 due to the piping connected to the air supply hole 702a. The exhaust hole 702b is a through hole for generating a negative pressure in the opening 701d via the suction hole 701c. The exhaust hole 702b extends downward and is formed in a manner consistent with the suction hole 701c of the porous member 701. A space for gas retention is formed between the inner surface of the base 702 and the porous member 701 around the exhaust hole 702b. In addition, the exhaust hole 702b can also pass through the suction hole 701c and reach the facing surface 701a. In this case, the suction hole 701c and opening 701d of the porous member 701 are provided so as to be in close contact with the outside of the exhaust hole 702b reaching the facing surface 701a of the porous member 701. The mounting holes 702c are a pair of recessed holes for preventing displacement when connected to the detachable portion 704 described later.

[0136] The gas supply hole 702a is connected to a gas supply circuit via piping (not shown). The supply circuit comprises a gas supply source, a pump, a valve, and the like. Here, the gas supplied to the porous member 701 via the gas supply hole 702a is an inert gas. The exhaust hole 702b is connected to a negative pressure generating circuit comprising a vacuum pump, a valve, and the like via piping (not shown).

[0137] The guide portion 703 is a member arranged along the four sides of the rectangular base 702 along the outer edge of the electronic component C and restricts the movement of the electronic component C held by the facing surface 701a. Figure 4 (A) Figure 4 (B) Figure 5 and Figure 6 As shown, the guide portions 703 are multiple plate-like bodies arranged along the four side surfaces of the base 702, that is, along the four edges of the rectangular facing surface 701a. In this embodiment, one guide portion 703 is provided on each side of the facing surface 701a, but this is not limited to this. Furthermore, the outer edge of the pickup collet 700 formed by the base 702 is not limited to a rectangular shape. The guide portions 703 can be arranged in a manner that restricts the movement of the electronic component C, for example, along the outer edge of the electronic component C, and are not limited to being arranged along the side surfaces of the base 702.

[0138] Each guide portion 703 has a protruding portion that protrudes beyond the facing surface 701a. The distance (protrusion amount) that the guide portion 703 protrudes from the facing surface 701a is sufficient to limit the movement of the electronic component C held by the facing surface 701a through the gas layer, and it can be at least as far from the facing surface 701a as the electronic component C held through the gas layer. However, if the protruding portion of the guide portion 703 protrudes beyond the electronic component C held by the facing surface 701a through the gas layer, it is necessary to avoid contact with surrounding electronic components C when picking up the electronic component C from the wafer. Therefore, the protruding portion of the guide portion 703 preferably protrudes from the facing surface 701a to the inside of the side surface of the electronic component C held by the facing surface 701a through the gas layer. However, before the pickup collet 700 approaches the wafer WS for pickup, the electronic components C are individually pushed up via the wafer WS by the push-up mechanism, thereby being able to cope with various protrusion amounts and avoid contact with surrounding electronic components C.

[0139] In the following description, one of the orthogonal guide portions 703 is referred to as 703K, 703L, and the other orthogonal guide portions 703 are referred to as 703M, 703N. In the case where these are not distinguished, the description is made in terms of the guide portion 703. The term "orthogonal" herein includes the case where two guide portions 703 on adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are multiple guide portions 703 on one side and the straight lines (planes) along which the two guide portions 703 are separated are orthogonal (see FIG. Figure 14 (A) and Figure 14 (B)).

[0140] like Figure 7 (A) Figure 7 As shown in FIG. 1B , the reversal drive unit 710 reverses the electronic component C held by the pickup collet 700 in the vertical direction. Specifically, the pickup collet 700 is configured to be rotatable between a direction toward the wafer WS and a direction toward the mounting head 31 by the reversal drive unit 710. For example, a rotary motor can be used for the reversal drive unit 710.

[0141] The pickup collet 700 is mounted on the reverse drive unit 710 via the rotating body 720 and the loading and unloading unit 704. The rotating body 720 is connected to the reverse drive unit 710 and is arranged so as to be rotatable around the axis in the Y direction. The loading and unloading unit 704 is mounted on the rotating body 720 and is arranged so as to be rotatable together with the rotating body 720. The loading and unloading unit 704 includes a magnet inside, and the base 702 of the pickup collet 700 is adsorbed and held by the suction force of the magnet. Figure 5 and Figure 6As shown, a pair of pins 704a are provided on the contact surface of the attachment portion 704 with the base 702. By fitting the pins 704a into the mounting holes 702c provided in the base 702, the pickup collet 700 is prevented from shifting relative to the attachment portion 704. Furthermore, although not shown, the piping connected to the exhaust hole 702b passes through the attachment portion 704, and the piping connected to the air supply hole 702a is supported by the attachment portion 704.

[0142] Although not shown, the transfer head 71 includes a buffer member that drives the pickup collet 700 in the vertical direction and applies an appropriate load when the tip of the pickup collet 700 contacts the electronic component C, while absorbing excessive load. Examples of the buffer member include elastic members such as springs and rubber, magnets, air cylinders, dampers, and voice coil motors.

[0143] The arm 72 is a member having a transfer head 71 provided at one end. Figure 3 As shown in (A), the arm portion 72 has an extension portion 72a and a base portion 72b. The extension portion 72a is an L-shaped member formed by a rectangular parallelepiped member extending linearly along the Y-axis direction toward the front and a rectangular parallelepiped member extending linearly along the X-axis direction toward the mounting mechanism 3. The reversal drive portion 710 is provided at one end of the extension portion 72a facing the mounting mechanism 3 in such a manner that the rotation axis becomes the Y-axis direction. By mounting the pickup collet 700 on the rotation axis of the reversal drive portion 710, the pickup collet 700 is set to be rotatable. The base portion 72b is a plate-like body parallel to the X-axis direction, and is fixed to the other end of the extension portion 72a (refer to Figure 8 (A)~ Figure 8 (D)).

[0144] The tube connected to the pickup collet 700 for supplying negative pressure, the cables connected to the reverse drive unit 710, and the electrical connection of the buffer member are built into the arm 72. "Built-in" means that they are covered by the outer casing of the arm 72 and are not exposed to the outside. In this embodiment, the tube and cables are inserted into a hollow portion formed inside the arm 72.

[0145] The transfer mechanism 73 moves the transfer head 71 between the supply portion 6 and the installation position OA by driving the arm portion 72. The transfer mechanism 73 has a sliding portion SL provided at a position that does not overlap with the loading surface F when viewed from above. In other words, the sliding portion SL of the transfer mechanism 73 is provided outside the moving range of the support mechanism 61. The transfer mechanism 73 drives the arm portion 72 as the sliding portion SL slides. The sliding portion SL referred to here refers to a structural portion in which components move while in contact with each other. This sliding portion SL becomes a source of dust. As Figure 5As shown, the sliding portion SL of this embodiment includes a first sliding portion 732b and a second sliding portion 734b described below. The first sliding portion 732b and the second sliding portion 734b are provided at a position lower than the height position L of the placement surface F (below).

[0146] like Figure 8 (A)~ Figure 8 As shown in (D), the transfer mechanism 73 includes a fixed body 731, a first driving unit 732, a movable body 733, and a second driving unit 734. The fixed body 731 is fixed to the support platform 11 (see Figure 3 (A)) and a rectangular parallelepiped member extending along the X-axis direction. The position of the fixed body 731 is fixed relative to the installation position OA.

[0147] The first drive unit 732 drives the arm 72 along the X-axis. The first drive unit 732 includes a first drive source 732a and a first sliding portion 732b. The first drive source 732a is a linear motor extending along the X-axis and is located along the upper surface (parallel to the XY plane) of the fixed body 731. The first sliding portion 732b is a linear guide extending along the X-axis and is located on the front surface (parallel to the XZ plane) of the fixed body 731. Since the linear motor moves without contact between the rotor and the stator, the first drive source 732a does not have a sliding portion SL.

[0148] The moving body 733 is a rectangular parallelepiped block, and is provided so as to be able to slide along the X-axis direction as the first driving source 732 a operates by mounting the rotor of the first driving source 732 a and the slider of the first sliding portion 732 b thereon.

[0149] The second drive unit 734 drives the arm 72 along the Z-axis. The second drive unit 734 includes a second drive source 734a and a second slide 734b. The second drive source 734a is a linear motor extending along the Z-axis and is mounted on the movable body 733. The second slide 734b is a linear guide extending along the Z-axis and is mounted on the movable body 733.

[0150] The base portion 72b of the arm portion 72 is configured to be able to slide along the Z-axis by attaching the rotor of the second drive source 734a and the slider of the second sliding portion 734b. Thus, the sliding portion SL of this embodiment includes a first sliding portion 732b and a second sliding portion 734b that slide linearly along two orthogonal axes. Furthermore, the first sliding portion 732b and the second sliding portion 734b are positioned so as to overlap in height on two opposing side surfaces of the common moving body 733. In other words, the two orthogonal axes are positioned close together. Furthermore, the distance between the two side surfaces of the moving body 733 is preferably short, i.e., the moving body 733 is thin.

[0151] (Relationship between the distance between the substrate on the stage and the mounting head and the size of the transfer head)

[0152] In this embodiment, if Figure 1 As shown, in order for the transfer head 71 to move to the mounting position OA, the substrate S must be retracted. To this end, the gap between the substrate S in the mounting position OA and the mounting head 31 is set. In other words, in order for the transfer head 71 to move to the mounting position OA, the substrate S must be retracted. Therefore, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set close to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2. More specifically, the gap h between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 in the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is smaller than the height dimension H of the transfer head 71 at the tip of the arm 72 (h < H). As described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several millimeters.

[0153] (Arm size)

[0154] like Figure 1 、 Figure 3 (A) Figure 7 As shown in (A), the width w of the member extending linearly along the Y-axis direction and the width d of the member extending linearly along the X-axis direction of the extension portion 72a of the arm portion 72 are both longer than the thickness t in the Z-axis direction (w>t, d>t). This prevents the arm portion 72 from increasing in height, while ensuring the rigidity of the relatively long arm portion 72, thereby stabilizing the position of the electronic component C being transferred by the transfer head 71. By preventing the arm portion 72 from increasing in height, it is no longer necessary to raise the receiving position of the mounting head 31.

[0155] (Control device)

[0156] The control device 8 controls the positioning mechanism so as to position the adsorption area D at the position of the outer shape of the electronic component C captured by the component side camera 5. Furthermore, the control device 8 controls the positioning mechanism so as to position the electronic component C held in the adsorption area D at the mounting position OA. Furthermore, the control device 8 controls the positioning mechanism so as to position the substrate S and the electronic component C based on the mark m and mark M captured by the substrate side camera 4 and the component side camera 5. That is, in the control device 8, the designed outer shape position of the electronic component C (corresponding to the adsorption area D when the mounting head 31 is in the mounting position OA, that is, the holding position), the designed position of the mark m of the electronic component C on the XY coordinates, and the designed position of the mark M of the substrate S on the XY coordinates are stored in the storage device as respective reference positions, corresponding to the position where the electronic component C should be accurately mounted.

[0157] The reference position may not be a designed position, but may be the position of the outer shape of the electronic component C, the position of the mark m, and the position of the mark M when the electronic component C is correctly mounted on the substrate S after a preliminary trial. The control device 8 determines the offset between the outer shape of the electronic component C captured by the component-side camera 5 and the reference position, and controls the positioning mechanism (drive mechanism 32) to move the mounting head 31 in the direction and amount of movement to correct the offset. Furthermore, the control device 8 determines the offset between the mark m captured by the substrate-side camera 4 and the mark M captured by the component-side camera 5 and the reference position, and controls the positioning mechanism (drive mechanism 22 and drive mechanism 32) to move the electronic component C and the substrate S in the direction and amount of movement to correct the offset.

[0158] Furthermore, the control device 8 controls the transfer mechanism 73 of the transfer device 7 and the drive mechanism 62 of the supply unit 6 based on the mapping information indicating the position coordinates of the electronic component C on the wafer WS, thereby sequentially positioning the electronic component C to be picked up at the supply position. In addition, the so-called picking up here refers to removing the electronic component C from the member on which the electronic component C is placed, such as the wafer WS, and receiving it. Furthermore, the control device 8 controls the holding of the electronic component C by the pickup collet 700 of the transfer head 71, the reversal of the pickup collet 700 by the reversal drive unit 710, the movement of the transfer head 71 by the transfer mechanism 73 to the mounting position OA where the mounting head 31 is waiting, and the transfer of the electronic component C from the pickup collet 700 to the mounting head 31.

[0159] [Principle of suction and holding using a pickup collet]

[0160] Next, the principle of the electronic component C being sucked and held by the pickup collet 700 as described above will be described. Figure 4As shown in (A), the gas supplied from the air supply hole 702a is ejected in a planar shape from the fine holes of the facing surface 701a, thereby forming a gas layer between the electronic component C. The layer is, for example, 2μm to 10μm. Then, while negative pressure is applied to the suction hole 701c by the negative pressure generating circuit, the facing surface 701a is brought close to the electronic component C, thereby sucking and holding the electronic component C. At this time, since a gas layer is formed between the facing surface 701a and the electronic component C, the facing surface 701a and the electronic component C maintain a non-contact state. Moreover, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 701c, and thus the electronic component C is released from the pickup collet 700.

[0161] [action]

[0162] In addition to the reference Figures 1 to 6 In addition, refer to Figure 7 (A)~ Figure 11 (C) illustration, Figure 12 and Figure 13 In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but is retreated together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA.

[0163] [Transfer of electronic components]

[0164] Reference Figure 7 (A)~ Figure 9 (E) illustration, Figure 12 The transfer operation of the electronic component C is described in the flowchart of FIG. The die ring with the wafer WS attached is mounted on the ring holder 61a of the support mechanism 61 in the supply unit 6 by the automatic loader (see FIG. 1 ). Figure 3 (A) and Figure 3 (B)). Electronic components C that are separated into individual pieces by dicing are attached to the wafer WS. Figure 8 (A)~ Figure 8 In (D), illustrations other than the picked-up electronic component C are omitted.

[0165] First, if Figure 8 (A) Figure 3 As shown in FIG. 1A , the support mechanism 61 moves along the X-axis and Y-axis directions to bring the electronic component C to be mounted to the supply position. Furthermore, the arm 72 is moved along the X-axis direction to position the tip of the pickup collet 700 of the transfer head 71 directly above the electronic component C to be mounted, i.e., at the supply position (step S101).

[0166] The wafer WS is moved in the X-axis and Y-axis directions by the drive mechanism 62 of the supply unit 6. The arm 72 is moved in the X-axis direction by the first drive source 732a of the first drive unit 732, which moves the movable body 733 along the first slide 732b.

[0167] like Figure 8 As shown in (B), the push-up mechanism (not shown) pushes up the electronic component C to be installed. Then, the pickup collet 700 of the transfer head 71 picks up the electronic component C (step S102). At this time, pressurized gas is supplied to the porous member 701 of the pickup collet 700 through the air supply hole 702a, and the gas is blown out from the facing surface 701a. Moreover, the gas is not exhausted from the exhaust hole 702b, and suction is not performed from the opening 701d. In this way, the pickup collet 700 to which the gas is supplied from the facing surface 701a descends and approaches the electronic component C. When the pickup collet 700 approaches the electronic component C, the gas on the facing surface 701a is clamped by the facing surface 701a and the electronic component C to form a gas layer. It is considered that the clamped gas layer at this time becomes a viscous flow layer. Then, the pickup collet 700 passes through the gas layer that is not further compressed and stops descending relative to the electronic component C. In this manner, when the pickup collet 700 is stopped via the gas layer, the gas is exhausted from the gas exhaust hole 702 b and suction through the suction hole 701 c is started, so that the electronic component C can be sucked and held on the facing surface 701 a .

[0168] As described above, the arm 72 moves in a direction close to the wafer WS, and after the pickup collet 700 adsorbs and holds the electronic component C, it moves in a direction away from the wafer WS, thereby Figure 8 As shown in (C), the electronic component C is separated from the wafer WS.

[0169] The movement of the arm 72 at this time is performed by the second driving source 734a of the second driving unit 734, so that the base 72b moves along the second sliding portion 734b. Figure 7 (A) Figure 7 (B) Figure 8 (C) Figure 8 As shown in (D) of FIG. 1 , the reverse driving unit 710 rotates the pickup collet 700 180 degrees to reverse the electronic component C (step S103 ).

[0170] Then, if Figure 9 (A) Figure 9As shown in (B), the transfer head 71 is positioned at the installation position OA (step S104) by moving the arm 72 along the X-axis direction. That is, the pickup collet 700 of the transfer head 71 reaches a position in the installation mechanism 3 that is opposite to the holding portion 31b of the installation head 31. The movement of the arm 72 in the X-axis direction at this time is performed in the following manner: the first driving source 732a of the first driving portion 732 is operated, and the movable body 733 moves the supply position along the first sliding portion 732b to the installation position OA. In addition, at this time, the installation head 31 is on standby at a height position that makes the facing distance between the lower end surface of the holding portion 31b and the upper surface of the substrate S become a distance of several millimeters. Moreover, the height position is maintained until the positioning of the electronic component C and the substrate S described later is completed and the installation head 31 is about to be driven toward the substrate S.

[0171] like Figure 10 As shown in (A), the component side imaging unit 5 captures the outer shape of the electronic component C visible in the transmission area T through the mounting head 31 (step S105). Figure 10 In the example (A), the electronic component C is offset to the upper left in the figure and tilted to the right relative to the adsorption area D indicated by the double-dashed line and its center. The control device 8 calculates the outer shape of the electronic component C captured by the component side imaging unit 5 and the amount of deviation from the reference position (XY direction and θ direction), as shown in FIG. Figure 10 As shown in (B), the drive mechanism 32 is operated to eliminate the offset, thereby positioning the mounting head 31 on the electronic component C (step S106). Figure 10 In the example (B), the mounting head 31 moves toward the upper left in the figure and rotates clockwise to align the electronic component C with the suction area D. In the figure, the lower right arrow outside the dotted line representing the holding portion 31b indicates movement toward the upper left. Furthermore, the upper right arrow inside the solid circle representing the hollow portion 31a indicates rotation toward the clockwise direction.

[0172] like Figure 9 As shown in (C), the arm 72 moves in a direction close to the holding portion 31b, pressing the electronic component C against the holding portion 31b. Figure 9 As shown in (D), the holding portion 31b of the mounting head 31 uses negative pressure to hold and receive the electronic component C (step S107). Simultaneously, the negative pressure on the pickup collet 700 is released, and the arm 72 moves away from the holding portion 31b, thereby releasing the electronic component C. The arm 72 moves in this manner by operating the second drive source 734a of the second drive unit 734, causing the base portion 72b to move along the second slide portion 734b.

[0173] Then, if Figure 10As shown in (C), the control device 8 operates the drive mechanism 32, thereby returning the electronic component C held by the mounting head 31 to the original mounting position OA (step S108). Figure 10 In the example (C), the mounting head 31 moves to the lower right in the figure and rotates to the left, returning to the mounting position OA. In the figure, the upper left arrow outside the dotted line representing the holding portion 31b indicates movement to the lower right. Furthermore, the upper right arrow inside the solid circle representing the hollow portion 31a indicates rotation to the left.

[0174] Furthermore, if Figure 9 As shown in (E), the arm 72 moves toward the supply unit 6, causing the transfer head 71 to retreat from directly below the holding portion 31b. The arm 72 is moved by the first drive source 732a of the first drive unit 732, causing the movable body 733 to move in the X-axis direction along the first slide 732b. Furthermore, the transfer device 7 transfers the electronic component C to the holding portion 31b at the mounting position OA. Therefore, during this transfer, the stage 21 remains retracted to avoid interference with the transfer mechanism 73.

[0175] [Installation of electronic components]

[0176] Next, refer to Figure 11 (A)~ Figure 11 (C) illustration, Figure 13 The flowchart of FIG. 1 illustrates the installation operation of the electronic component C. Figure 11 As shown in FIG2 (A), the holding portion 31b of the mounting head 31 holding the electronic component C is positioned directly below the component-side imaging unit 5. The substrate-side imaging unit 4 captures an image of the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 calculates the positional offset between the position of the mark m captured by the substrate-side imaging unit 4 and the reference position, and operates the drive mechanism 32 to eliminate the offset, thereby positioning the electronic component C (step S202).

[0177] Then, if Figure 11 As shown in (B), the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (this time, the mounting area B for mounting the electronic component C) reaches a position facing the electronic component C held by the mounting head 31, that is, the center of the mounting area B reaches the mounting position OA (step S203). Then, as shown in FIG. Figure 3 As shown in FIG. 2(B), the component-side imaging unit 5 captures an image of the mark M of the substrate S visible in the transmission area T around the electronic component C via the mounting head 31 (step S204).

[0178] The control device 8 calculates the positional offset between the position of the mark M captured by the part side camera 5 and the reference position, and operates the drive mechanism 22 to eliminate the offset, thereby positioning the substrate S (step S205). Figure 11 As shown in FIG. 2 (C), the mounting head 31 is driven toward the substrate S by the driving mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206).

[0179] As described above, the operations of transferring the electronic components C from the wafer WS, delivering the electronic components C to the mounting head 31, positioning the electronic components C and the substrate S, and mounting are repeated, thereby sequentially mounting the electronic components C on each mounting area B of the substrate S. The substrate S, after mounting a predetermined number of electronic components C, is transported by the substrate support mechanism 2 and stored on the unloader.

[0180] [Effects]

[0181] (1) The transfer device 7 of the electronic component C of this embodiment comprises: a mounting head 31, which mounts the electronic component C on the substrate S at the mounting position OA; a pick-up collet 700, which comprises a porous member 701 and a guide portion 703, wherein the porous member 701 ejects gas from fine holes and holds the electronic component C in a non-contact manner by the negative pressure of the suction hole 701c, and the guide portion 703 restricts the movement of the electronic component C held in a non-contact manner, and the pick-up collet 700 picks up the electronic component C from the supply portion 6 for supplying the electronic component C and transfers it to the substrate S. The mounting head 31; the reversal drive unit 710, which reverses the picking collet 700 from the supply position; the transfer mechanism 73, which transfers the picking collet 700 between the supply unit 6 and the mounting head 31; the part side shooting unit 5, which shoots the appearance of the electronic component C held by the reversed picking collet 700; and the positioning mechanism, which positions the mounting head 31 at the electronic component C held by the picking collet 700 based on the appearance of the electronic component C shot by the part side shooting unit 5, and positions the mounting head 31 at the mounting position OA after the picking collet 700 transfers the electronic component C to the mounting head 31.

[0182] Furthermore, the mounting apparatus 1 for the electronic component C of the present embodiment includes a mounting mechanism 3 that mounts the electronic component C positioned by the positioning mechanism on the substrate S at the mounting position OA using a mounting head 31 .

[0183] Furthermore, in the installation method of the electronic component C of the present embodiment, the pickup collet 700 picks up the electronic component C from the supply part 6 of the electronic component C, and the pickup collet 700 has: a porous member 701, which ejects gas from the pores and holds the electronic component C in a non-contact manner through the negative pressure of the suction hole 701c; and a guide part 703, which restricts the movement of the electronic component C held in a non-contact manner, the reversal drive part 710 reverses the pickup collet 700 that has picked up the electronic component C, the transfer mechanism 73 transfers the pickup collet 700 that has picked up the electronic component C to the mounting head 31 for mounting the electronic component C on the substrate S, the part side shooting part 5 shoots the outer shape of the electronic component C held by the reversed pickup collet 700, and the positioning mechanism moves the mounting head 31 based on the outer shape of the electronic component C shot by the part side shooting part 5 1 is positioned on the electronic component C held by the pickup collet 700, and the electronic component C is delivered from the pickup collet 700 to the mounting head 31 through the relative movement of the pickup collet 700 and the mounting head 31. The positioning mechanism positions the mounting head 31, which has received and held the electronic component C, at the mounting position OA for mounting the electronic component C on the substrate S. When the substrate S is retracted from the mounting position OA by the substrate supporting mechanism 2, the substrate-side imaging unit 4 captures the mark m of the electronic component C held by the mounting head 31, and the part-side imaging unit 5 captures an image of the mark M of the substrate S positioned at the mounting position OA by the substrate supporting mechanism 2. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C determined from the images of the mark m and mark M captured by the part-side imaging unit 5 and the substrate-side imaging unit 4.

[0184] Therefore, in this embodiment, the electronic component C can be picked up contactlessly by the pickup collet 700 and positioned when it is handed to the mounting head 31. Here, when gas is ejected from the porous member 701 and suction is applied through the suction holes 701c to pick up the electronic component C contactlessly, the electronic component C is easily displaced within the area surrounded by the guide 703. However, in this embodiment, the mounting head 31 positions itself relative to the displaced electronic component C, receives the electronic component C, and then mounts it after returning to the reference position. Therefore, the mounting head 31 maintains a constant position for the electronic component C. This reduces the time required for position recognition by capturing the mark m on the electronic component C and the subsequent corrective movement, thereby minimizing the risk of increased error. This, in turn, reduces positional deviation during mounting.

[0185] (2) The mounting head 31 includes a transmissive portion that can transmit and identify the electronic component C held by the pickup collet 700. The component-side imaging unit 5 is disposed above the mounting head 31 so as to be able to image the outer shape of the electronic component C through the transmissive portion. Therefore, the position at which the electronic component C is transferred from the pickup collet 700 to the mounting head 31 can be roughly aligned with the imaging position. This can reduce the time required for position identification based on imaging of the mark m of the electronic component C and the subsequent correction movement, thereby reducing the risk of errors.

[0186] (3) It comprises: a substrate supporting mechanism 2, which supports the substrate S and enables the substrate S to move between the installation position OA and a position retreated from the installation position OA; and a substrate side shooting unit 4, which is arranged at the lower side of the substrate supporting mechanism 2 in the installation position OA, and shoots the mark m of the electronic component C held by the installation head 31 positioned at the installation position OA when the substrate S is retreated from the installation position OA. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained based on the image of the mark M of the substrate S supported by the carrier 21 positioned at the installation position OA shot by the component side shooting unit 5 and the image of the mark m of the electronic component C shot by the substrate side shooting unit 4.

[0187] According to this embodiment, with the substrate S retracted from the mounting position OA, the electronic component C held by the mounting head 31 is photographed using the substrate-side shooting section 4 arranged at the lower side of the substrate support mechanism 2 in the mounting position OA, and the substrate S supported by the substrate support mechanism 2 is photographed using the component-side shooting section 5 arranged at the upper side of the mounting head 31 in the mounting position OA through the transmission section of the mounting head 31. Therefore, in a state equivalent to bringing the electronic component C and the substrate S as close as possible, the mark m of the electronic component C and the mark M of the substrate S can be photographed.

[0188] Therefore, the movement distance of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) when capturing the mark m and mark M, as well as the relative movement distance between the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) after capturing the mark m and mark M, can be minimized. This minimizes the amplification of errors caused by moving the mounting head 31 or the substrate support mechanism 2 over long distances. Furthermore, the longer the movement distance of the mechanism, the more dust is generated. However, in this embodiment, the movement distance can be minimized, thus preventing dust from reducing cleanliness and causing bonding defects. Furthermore, as described above, by holding the electronic component C in a non-contact manner, it is possible to reduce positional deviation relative to the holding position (suction area D) when the mounting head 31 receives the electronic component C from the pickup collet 700, which is easily movable. Therefore, when capturing the mark m using the substrate-side imaging unit 4, the deviation can be reduced in advance. This can reduce the time required for position recognition based on capturing the mark m of the electronic component C and the subsequent corrective movement, which can minimize the increase in errors.

[0189] In this embodiment, after the marks m and M are imaged, the moving distances of the electronic components C and the substrate S can be reduced, thereby suppressing any of positional deviation, reduction in productivity, and the amount of dust generated.

[0190] (4) The transmissive portion has a transparent plate-like member. Therefore, it is possible to achieve transmissive photography of the outer shape of the electronic component C, holding of the electronic component C, and transmissive photography of the mark M on the substrate S. Therefore, before the transmissive portion is used to hold the electronic component C, the outer shape of the electronic component C can be photographed at a very close distance between the transmissive portion and the electronic component C. This can suppress the amount of offset when the transmissive portion receives the electronic component C, and thus can more accurately align the holding position (adsorption area D) of the mounting head 31 and deliver the electronic component C. Since the posture of the electronic component C received by the mounting head 31 can be set to a state close to the prescribed posture, it is possible to suppress the time spent or the increase in error in the position recognition by photographing the mark m of the electronic component C held by the mounting head 31 using the substrate-side imaging unit 4 and the subsequent correction movement.

[0191] (5) The substrate-side imaging unit 4 and the component-side imaging unit 5 are fixed relative to the mounting position OA. Therefore, the imaging areas of the substrate-side imaging unit 4 and the component-side imaging unit 5 do not shift, and dust generation due to movement can be prevented.

[0192] [Modification]

[0193] (1) The guide portion 703 of the pickup collet 700 can be provided along the outer edge of the facing surface 701a in a manner that can limit the movement of the electronic component C. In other words, the movement of the electronic component C can be limited to the extent that the movement or reversal of the pickup collet 700 causes the electronic component C to fall off from the pickup collet 700. Therefore, the guide portion 703 can be provided on the four sides of the facing surface 701a, and can be provided on the entire circumference of the facing surface 701a, or can be provided on a portion of each side. For example, Figure 14 As shown in (A) of Figure 14 The guide portion 703 is continuously arranged along the corner portion as shown in (B). Figure 14 As shown in (B), there is also a case where one orthogonal guide portion 703 is continuous with another orthogonal guide portion 703.

[0194] (2) The number and size of the suction holes 701c and openings 701d are not limited to the above-described configurations. On the facing surface 701a of the porous member 701, the suction-holding state and the non-contact state can be maintained by balancing the area of ​​the electronic component C supported by the gas layer and the total area of ​​the openings 701d.

[0195] (3) The positions and shapes of the suction holes 701c and the openings 701d are not limited to the above-described forms. For example, the shape of the opening 701d may be circular, rectangular, elliptical, polygonal, rounded polygonal, star-shaped, etc.

[0196] (4) By making the pickup collet 700 replaceable, it can be replaced according to the shape and size of the electronic component C. As a replaceable structure, a structure that uses magnets for suction and retention is simple, and the replacement operation is also easy. However, any structure that allows the pickup collet 700 to be replaced is sufficient. For example, it can be a structure that uses negative pressure for suction and retention, or a structure that is mechanically retained.

[0197] (5) The supply unit 6 is not limited to a device that supplies electronic components C attached to the wafer WS. For example, it may be a device that supplies electronic components C arranged on a tray. Furthermore, the structure of the transfer mechanism 73 can be any structure as long as it can pick up and transfer electronic components C individually from the supply unit 6. Therefore, the arm 72 may be configured to move along the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move along the X-axis and Y-axis directions.

[0198] (6) In the transfer mechanism 73, the driving portion of the driving arm portion 72 is not limited to a mechanism using a linear motor as a driving source. It can also be a mechanism using a ball screw or a conveyor belt that uses an axially rotating motor as a driving source. In the case of such a mechanism, a sliding portion SL is included, and therefore it is preferably set at a position that does not overlap with the loading surface F when viewed from above. Furthermore, it is preferred that the sliding portion SL is set at a position lower than the height position of the loading surface F. In addition, in the case where there are multiple sliding portions SL, a part of the sliding portions SL may not be set at a position that does not overlap with the loading surface F when viewed from above. Moreover, a part of the sliding portions SL may not be set at a position lower than the height position of the loading surface F. In this case, it is preferred to provide a shielding object such as an outer package, a wall, or other structural parts between the sliding portion SL and the loading surface F. Furthermore, it is preferred to lengthen the distance between the sliding portion SL and the loading surface F.

[0199] (7) The mounting head 31 only needs to be configured so that the component-side imaging unit 5 can capture the outer shape of the electronic component C and the mark M on the substrate S. Therefore, the transmissive portion of the mounting head 31 does not need to be formed of a transparent material, and a through-hole may be formed at a location corresponding to the outer shape of the electronic component C or the mark M. More specifically, the holding portion 31b may be formed of an opaque member, with a through-hole formed at a location corresponding to the outer shape of the electronic component C or the mark M. Alternatively, the hollow portion 31a may be omitted, and the holding portion 31b may be formed of an opaque member, with a through-hole formed at a location corresponding to the outer shape of the electronic component C or the mark M in the mounting head 31 and the holding portion 31b. In other words, such a through-hole also constitutes a transmissive portion of the mounting head 31. Furthermore, when capturing the outer shape of the electronic component C, a portion of the outer shape of the electronic component C is captured. Therefore, it is preferable to capture two adjacent sides of the electronic component C. In this case, the captured portion may be a corner of the electronic component C. By including the image of the two adjacent sides, the posture (position or tilt in the horizontal plane) of the electronic component C can be recognized.

[0200] (8) The substrate side camera 4 or the component side camera 5 can be set in a manner that allows it to move relative to the position (mounting position OA) where the electronic component C is mounted. That is, in a case where it is impossible to capture multiple marks m of the electronic component C or multiple marks M of the substrate S at one time, the substrate side camera 4 or the component side camera 5 can be configured to move between the marks m or between the marks M for capturing. That is, a moving device for moving the substrate side camera 4 between the marks m or a moving device for moving the component side camera 5 between the marks M can be provided. Even in the above case, the moving distance is limited to the size of the mounting area B of the electronic component C or the substrate S and is relatively short, so that errors or dust can be suppressed. Since the shooting magnification can be selected according to the required mounting accuracy, the position recognition accuracy can be improved.

[0201] (9) In the above embodiment, the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are aligned with the reference position (mounting position OA), but the present invention is not limited thereto. The position of the electronic component C may be aligned with the position of the mounting area B, or the position of the mounting area B may be aligned with the position of the electronic component C. In short, it is sufficient as long as the position of the mounting area B of the substrate S and the position of the electronic component C can be aligned. When the substrate S and the electronic component C are aligned without moving the stage 21 by a correction amount for alignment, it is not necessary to move the relatively large and heavy stage 21 for alignment of the mounting areas B, thereby further improving the mounting accuracy and shortening the time required for position correction.

[0202] (10) The substrate S can be transferred from the substrate support mechanism 2 to the stage 21 at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S can be retracted from the mounting position OA before the mark m of the electronic component C is imaged by the substrate-side imaging unit 4.

[0203] [Other embodiments]

[0204] The present invention is not limited to the embodiments described above. During implementation, the structural elements may be modified and refined within the scope of the present invention. Furthermore, various inventions may be formed by appropriately combining multiple structural elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, structural elements from different embodiments may be appropriately combined.

Claims

1. An electronic component operating device, characterized in that have: a mounting head for mounting the electronic component on the substrate at a mounting position; A pickup collet having a porous member and a guide portion, wherein the porous member ejects gas from fine holes and holds the electronic component in a non-contact manner by negative pressure from a suction hole, and the guide portion restricts movement of the electronic component held in a non-contact manner, and the pickup collet picks up the electronic component from a supply portion that supplies the electronic component and transfers it to the mounting head; a reversing drive unit for reversing the pickup collet from a supply position; a transfer device for transferring the pickup collet between the supply portion and the mounting head; a component side photographing unit for photographing the outer shape of the electronic component held by the inverted pickup collet; and The positioning mechanism positions the mounting head at the electronic component held by the pickup collet based on the outer shape of the electronic component photographed by the component side shooting unit, and positions the mounting head at the mounting position after the electronic component is transferred from the pickup collet to the mounting head.

2. The electronic component operating device according to claim 1, characterized in that have: a substrate supporting mechanism that supports the substrate so that the substrate moves between the mounting position and a position retreated from the mounting position; a substrate-side imaging unit, disposed below the substrate support mechanism in the mounting position, for imaging a mark of the electronic component held by the mounting head and positioned at the mounting position, when the substrate is retracted from the mounting position by the substrate support mechanism; and A control device controls the part side imaging unit, the positioning mechanism, the substrate supporting mechanism and the substrate side imaging unit, The control device is At the mounting position, in a state where the substrate is positioned at the mounting position by the substrate support mechanism, the component side imaging unit is caused to image the mark of the substrate positioned at the mounting position. The positioning mechanism positions the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the image of the mark on the substrate positioned at the installation position photographed by the component side photographing unit and the image of the mark on the electronic component photographed by the substrate side photographing unit.

3. The electronic component handling device according to claim 1, wherein: The mounting head includes a transmission portion capable of transmitting and identifying the electronic component held by the pickup collet. The component side imaging unit is disposed on an upper side of the mounting head so as to be able to image the outer shape of the electronic component through the transmission unit.

4. An electronic component mounting device, characterized in that: A mounting mechanism having an operating device according to any one of claims 1 to 3, and The electronic component positioned by the positioning mechanism is mounted on the substrate at the mounting position.

5. A method for mounting electronic components, positioning and mounting a substrate and electronic components, characterized in that: A pickup collet having a porous member and a guide portion picks up the electronic component from the electronic component supply portion. The porous member ejects gas from fine pores and holds the electronic component in a non-contact manner by negative pressure from a suction hole. The guide portion restricts movement of the electronic component held in a non-contact manner. The reverse driving unit reverses the pickup collet that has picked up the electronic component. The transfer mechanism transfers the pickup collet that has picked up the electronic component to a mounting head for mounting the electronic component on the substrate. The component side imaging unit images the outer shape of the electronic component held by the inverted pickup collet. The positioning mechanism positions the mounting head on the electronic component held by the pickup collet based on the outer shape of the electronic component photographed by the component side imaging unit. The electronic component is transferred from the pickup collet to the mounting head by the relative movement of the pickup collet and the mounting head. The positioning mechanism positions the mounting head to which the electronic component is delivered and held at a mounting position for mounting the electronic component on the substrate. In a state where the substrate is retracted from the mounting position by the substrate support mechanism, the substrate-side imaging unit images the mark of the electronic component held by the mounting head. The component side imaging unit captures an image of the mark on the substrate positioned at the mounting position by the substrate supporting mechanism. The positioning mechanism positions the substrate and the electronic component based on positions of the substrate and the electronic component obtained from images of the mark captured by the component-side imaging unit and the substrate-side imaging unit.

Images