Pick-up collets, pick-up devices and mounting devices

Abstract

The present invention provides a pickup collet, a pickup device, and an installation device that can pick up electronic components in a non-contact manner and position the electronic components. The pickup collet of an embodiment has a rectangular outer edge and sucks, holds, and picks up electronic components. The pickup collet has a porous member that is breathable and ejects gas supplied to the interior in a planar shape through fine pores on a facing surface facing the electronic component. The porous member is provided with a suction hole that has an opening on the facing surface and sucks the electronic component by negative pressure. The pickup collet is provided with a guide portion that is arranged along the outer edge of the electronic component to limit the movement of the electronic component held by the facing surface. The guide portion is provided with a vent portion that causes one orthogonal guide portion side to have a relatively positive pressure relative to the other orthogonal guide portion side.

Description

Technical Field

[0001] The invention relates to a picking collet, a picking device and a mounting device. Background Art

[0002] When electronic parts such as logic devices, memories, and image sensors are mounted on a substrate as semiconductor elements, individual chips are produced by cutting the wafer on which the semiconductor elements are formed. The chips are then picked up one by one by a pickup device, transferred to the substrate, and mounted using a loading device. Various devices have been proposed as mounting devices used to mount such semiconductors on a substrate, and one of them is known to include a transfer device for electronic parts such as chips, a supply device, and a substrate indicating mechanism. In addition, a pickup device, a loading device, and a control device for these are provided on the loading device. The pickup device performs the following operations: picking up electronic parts from the supply device and delivering the picked-up electronic parts to the loading device.

[0003] The surface of one side of the chip becomes a functional surface with a fine circuit formed thereon. When the chip is picked up from the wafer, if the picked-up member directly contacts the functional surface, the circuit and the like may be damaged, so there is a demand to avoid contact.

[0004] Furthermore, the connection terminals on the chip surface are bonded to the connection terminals on the substrate facing each other. To ensure and improve the bonding between the connection terminals, the chip surface is sometimes treated with plasma or surface activation. To maintain the surface condition of the chip after such treatment, there is also a desire to avoid direct contact between the pickup component and the chip surface.

[0005] In order to meet the requirement of preventing the component from contacting the surface of the chip, the surface holding the chip in the collet, which is a component for picking up the chip, has been set as a conical surface, so that the chip is sucked and held from the center in a state where only the peripheral portion of the chip, not the surface of the chip, contacts the conical surface of the collet (see Patent Document 1).

[0006] [Prior art literature]

[0007] [Patent Document]

[0008] [Patent Document 1] Japanese Utility Model Application Laid-Open No. 63-124746 Summary of the Invention

[0009] [Problems to be solved by the invention]

[0010] However, in the prior art described above, the collet contacts only the periphery of the chip, with suction being applied from the center. This can easily strain the chip, potentially causing it to become chipped or cracked. Furthermore, the collet contacts the chip's edge, supporting the chip during suction. This causes stress to concentrate on the periphery, potentially causing chipping or cracking. Furthermore, because the chip's position is fixed during suction, any shifting or tilting during suction cannot be corrected during subsequent transfer to the mounting device.

[0011] The embodiments of the present invention have been made to solve the above-mentioned problems, and an object of the present invention is to provide a pickup collet, a pickup device, and a mounting device that can pick up electronic components in a non-contact manner and position the electronic components.

[0012] [Technical means to solve the problem]

[0013] An embodiment of the present invention is a pickup collet having a rectangular outer edge and sucking, holding and picking up electronic parts. The pickup collet has a porous component, and the porous component is breathable. The gas supplied to the interior is ejected in a planar shape through the fine pores on the opposing surface facing the electronic parts. A suction hole is provided in the porous component, and the suction hole has an opening on the opposing surface. The electronic parts are sucked by negative pressure. The pickup collet is provided with a guide portion, and the guide portion is configured along the outer edge of the electronic part to limit the movement of the electronic part held by the opposing surface. A ventilation portion is provided in the guide portion, and the ventilation portion makes one of the orthogonal guide portion sides become a relatively positive pressure compared to the other orthogonal guide portion side.

[0014] Moreover, an embodiment of the present invention is a picking device that picks up the electronic components from a sheet to which the electronic components are attached, and comprises: the picking-up chuck; and a chuck moving mechanism that enables the picking-up chuck to approach a position in the sheet where the electronic components can be sucked and held, and can peel the sucked and held electronic components from the sheet and transfer them.

[0015] Furthermore, the mounting device according to the embodiment of the present invention comprises: the pickup device; a bonding head arranged to be movable relative to the pickup collet and receiving the electronic component from the pickup collet; and a mounting device that transfers the electronic component held by the bonding head to a substrate and mounts it.

[0016] [Effects of the Invention]

[0017] According to the pickup collet, the pickup device, and the mounting device of the present invention, electronic components can be picked up in a non-contact manner and positioned. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view showing the transfer device and the installation device of the embodiment.

[0019] Figure 2 It is a plan view showing a transfer device and an installation device according to an embodiment.

[0020] Figure 3 (A) is a cross-sectional view showing the principle of using a pickup collet to hold electronic components. Figure 3 (B) is a bottom side perspective view showing the base.

[0021] Figure 4 This is a bottom perspective view showing the pickup collet and the attachment and detachment section.

[0022] Figure 5 It is a perspective view showing the top side of the pickup collet and the attachment and detachment portion.

[0023] Figure 6 This is a block diagram showing the control device of the transfer device and the installation device.

[0024] Figure 7 (A) and Figure 7 (B) is a bottom schematic diagram showing the principle of using a pickup collet to locate electronic components. Figure 7 (A) is a diagram before positioning. Figure 7 (B) is a diagram showing the positioning.

[0025] Figure 8 This is a flowchart showing the procedure of the picking operation according to the embodiment.

[0026] Figure 9 (A)~ Figure 9 (D) is an explanatory diagram showing the picking action of the embodiment.

[0027] Figure 10 It is a schematic cross-sectional view showing a modified example in which a guide portion having a porous member for guiding is provided.

[0028] Figure 11 (A) and Figure 11 (B) is a schematic cross-sectional view showing a modified example in which a guide portion having a discharge port is provided.

[0029] Figure 12 It is a schematic cross-sectional view showing a modified example in which a guide portion having a suction port is provided.

[0030] Figure 13 (A) and Figure 13 (B) is a bottom view showing a modified example of the arrangement of the guide portion.

[0031] Figure 14 (A) and Figure 14 (B) is a bottom side perspective view (A) and a bottom view (B) showing a modified example of the pickup collet.

[0032] [Explanation of Symbols]

[0033] 1: Transfer device

[0034] 2: Electronic components

[0035] 10: Supply device

[0036] 11: Sheet

[0037] 12: Supply stage

[0038] 13, 61: Stage moving mechanism

[0039] 20: Pickup device

[0040] 21: Pickup head

[0041] 22: Collet moving mechanism

[0042] 23: Direction conversion unit

[0043] 24: Sales promotion

[0044] 30: Carrying device

[0045] 31: Joint head

[0046] 31a: Nozzle

[0047] 32: Head moving mechanism

[0048] 50: Control device

[0049] 51: Supply device control unit

[0050] 52: Sales promotion control department

[0051] 53: Pickup control unit

[0052] 54: Bonding head control unit

[0053] 56: Substrate stage control unit

[0054] 57: Storage

[0055] 60: Substrate carrier

[0056] 100: Installation

[0057] 200: Pick up collet

[0058] 201: Porous components

[0059] 201a: Facing surface

[0060] 201b: Back

[0061] 201c: Suction hole

[0062] 201d: Opening

[0063] 202: Base

[0064] 202a: Air supply hole

[0065] 202b: Exhaust hole

[0066] 202c: Mounting hole

[0067] 203, 203K~203N: guide part

[0068] 203a: Ventilation

[0069] 203b: Exhaust port

[0070] 203c: Porous components for guidance

[0071] 203d: Suction port

[0072] 221, 321: Sliding mechanism

[0073] 221a, 321a: Support frame

[0074] 221b, 321b: Orbit

[0075] 221c, 321c: Sliders

[0076] 222, 322: lifting mechanism

[0077] 222a: Arm

[0078] 222b: Loading and unloading department

[0079] 222c: Pin

[0080] 241: Support

[0081] G: Gas

[0082] P1: Supply position

[0083] P2: Handover position

[0084] P3: Installation location DETAILED DESCRIPTION

[0085] The embodiments of the present invention will be described with reference to the accompanying drawings. The accompanying drawings are schematic diagrams, and the dimensions and ratios of the various parts are exaggerated for ease of understanding. Figure 1 and Figure 2 As shown, the pickup collet 200 of this embodiment is used in a transfer device 1 for electronic components 2. The transfer device 1 includes a pickup device 20, a loading device 30, and a control device 50, and transfers the electronic components 2 from the loading device 30 to the pickup device 20.

[0086] The electronic component 2 is, for example, a small, rectangular, thin component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. The semiconductor chip has a functional surface on one side, which functions as a semiconductor element. Furthermore, the mounting apparatus 100 is a device that mounts the electronic component 2 supplied from the supply apparatus 10 onto a substrate via the transfer apparatus 1. Specifically, the mounting apparatus 100 includes, in addition to the components of the transfer apparatus 1, the supply apparatus 10 and a substrate stage 60 that supports the substrate.

[0087] The supply device 10 supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to a supply position P1. Supply position P1 is where the pickup device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12. The stage moving mechanism 13 may utilize, for example, a linear guide that moves a slider on a track using a ball screw mechanism driven by a servo motor.

[0088] Here, the sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged facing upward with their functional surfaces exposed.

[0089] The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. Specifically, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is arranged to be movable horizontally by a stage moving mechanism 13. Because the sheet 11 is horizontally supported by both the supply stage 12 and the stage moving mechanism 13, the sheet 11 and the electronic components 2 placed on the sheet 11 are also arranged to be movable horizontally.

[0090] In addition, if Figure 1 As shown, the horizontal direction in which the supply device 10 and the loading device 30 are arranged is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. Furthermore, the direction perpendicular to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The up direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is placed, while the down direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is not placed.

[0091] [Pickup device]

[0092] The pickup device 20 picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the loading device 30. The pickup device 20 includes a pickup collet 200, a collet moving mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0093] like Figures 3 to 5 As shown, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the suction and holding to release the electronic component 2. The pickup collet 200 includes a porous member 201, a base 202, and a guide portion 203.

[0094] The porous member 201 is a member having air permeability and supplying gas to the interior through the pores of the facing surface 201a facing the electronic component 2 (in addition, in the following description, the gas supplied to the electronic component 2 is marked with the symbol G for illustration). The porous member 201 of this embodiment is in the shape of a rectangular plate, and is densely and roughly uniformly formed with interconnected fine spaces. The porous member 201 has air permeability due to the structure, but its conductivity is very small. Any surface of the porous member 201 becomes the facing surface 201a. If gas is supplied to the interior from the back surface 201b on the opposite side of the facing surface 201a, gas will be ejected from the dense and evenly existing pores of the facing surface 201a. The ejection becomes a substantially planar ejection that expands to the entire surface of the ejected facing surface 201a. The ejection is extremely slow, and it can be said to be a feeling of seeping out, to the extent that the air flow can be slightly felt when the finger is close to it. In addition, the pores on surfaces other than the facing surface 201 a and the back surface 201 b may be blocked.

[0095] The porous member 201 is a continuous structure in which the pores serving as the microscopic spaces inside are interconnected and gas can pass through the pores. Sintered metal, ceramics, resin, etc. can be used as such a porous member 201. Sintered metal is preferably used because it makes it difficult for particles inside to separate and flow out.

[0096] Furthermore, if Figure 3 and Figure 4 As shown, the porous member 201 is provided with a suction hole 201c having an opening 201d on the facing surface 201a and sucking the electronic component 2 by negative pressure. The suction hole 201c of this embodiment is linearly penetrated from the center of the back surface 201b to the center of the facing surface 201a.

[0097] The base 202 is a member that covers the surface of the porous member 201, excluding the facing surface 201a. In this embodiment, the base 202 is a rectangular box with an opening at the bottom. The outer shape of the base 202 forms the outer edge of the rectangular shape of the pickup collet 200. The porous member 201 is inserted through the opening of the base 202, with its bottom surface exposed as the facing surface 201a, and is assembled and secured within the base 202.

[0098] like Figure 3 and Figure 5 As shown, an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided on the top surface of the base 202. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed at a position close to the outer edge of the base 202 due to the pipe connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating a negative pressure at the opening 201d via the suction hole 201c. The exhaust hole 202b extends downward and is formed in a manner consistent with the suction hole 201c of the porous member 201. A space for gas retention is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. In addition, the exhaust hole 202b can also penetrate the suction hole 201c and reach the facing surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided so as to be in close contact with the outside of the exhaust hole 202b reaching the facing surface 201a of the porous member 201. The mounting holes 202c are a pair of recessed holes for preventing displacement when connected to the collet moving mechanism 22.

[0099] The gas supply hole 202a is connected to a gas supply circuit via piping (not shown). The supply circuit comprises a gas supply source, a pump, a valve, and the like. The gas supplied to the porous member 201 via the gas supply hole 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit comprising a vacuum pump, a valve, and the like via piping (not shown).

[0100] The guide portion 203 is a member arranged along the outer edge of the electronic component 2 and restricting the movement of the electronic component 2 held by the facing surface 201a. The so-called "along the outer edge of the electronic component 2" only needs to be arranged in the direction along the outer edge, and the guide portion 203 does not necessarily need to be in contact with the electronic component 2. The guide portion 203 of this embodiment is arranged along the four sides of the side of the rectangular base 202. For example, Figure 3 、 Figure 4 and Figure 5 As shown, the guides 203 are multiple plate-like bodies provided along the four side surfaces of the base 202, that is, the four sides of the rectangular facing surface 201a. Although one guide 203 is provided on each side of the facing surface 201a in this embodiment, the present invention is not limited thereto.

[0101] Each guide portion 203 has a protruding portion that protrudes beyond the facing surface 201a. The distance (protrusion amount) that the guide portion 203 protrudes from the facing surface 201a only needs to be able to limit the movement of the electronic component 2 held by the facing surface 201a across the gas layer, and it only needs to be at least from the facing surface 201a to the electronic component 2 held across the gas layer. However, in the case where the protruding portion of the guide portion 203 protrudes beyond the distance of the electronic component 2 held by the facing surface 201a across the gas layer, it is necessary to consider avoiding contact with the electronic components 2 around the picked electronic component 2 when picking up from the wafer. Therefore, the distance that the protruding portion of the guide portion 203 protrudes from the facing surface 201a is preferably set to be within the side surface of the electronic component 2 held by the facing surface 201a across the gas layer. However, as described below, by controlling the push pin 24 during pickup, it is possible to cope with various protrusion amounts and avoid contact with the surrounding electronic components 2.

[0102] In the guide portion 203, one of the two guide portions 203 facing each other among the four guide portions 203 along each of the four sides of the facing surface 201a is provided with a ventilation portion 203a. Furthermore, the guide portion 203 provided with the ventilation portion 203a is provided on two adjacent sides of the facing surface 201a. As described below, gas can be ejected from the ventilation portion 203a to the facing guide portion 203. That is, the ventilation portion 203a is provided so that the side of one of the orthogonal guide portions 203 in one of the four corners becomes a relatively positive pressure compared to the side of the other orthogonal guide portion 203 in the diagonal corner. The so-called orthogonal here includes the case where two guide portions 203 on adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are multiple guide portions 203 on one side and the guide portions 203 are separated and the straight lines (planes) along which the two are located are orthogonal (refer to Figure 13 In the following description, one of the orthogonal guide portions 203 is designated as 203K and 203L, and the other orthogonal guide portion 203 is designated as 203M and 203N. In the absence of distinction between these, the description will be made in terms of the guide portion 203.

[0103] In this embodiment, the vent 203a is provided within one of the orthogonal guides 203K and 203L, connecting the exterior with the surrounding area of ​​the electronic component 2 held by the facing surface 201a. The vent 203a is connected to a gas supply circuit via piping (not shown). The ends of the vent 203a serve as outlets 203b facing two side surfaces of the electronic component 2. Thus, gas can be ejected from the outlets 203b toward the sides of the electronic component 2.

[0104] The collet movement mechanism 22 moves the pickup head 21, equipped with the pickup collet 200, back and forth between the supply position P1 and the transfer position P2, and raises and lowers the pickup head 21 between the supply position P1 and the transfer position P2. The transfer position P2 is where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the bonding head 31, which functions as a receiving unit, described later. The supply position P1 and transfer position P2 primarily refer to positions in the X and Y axes, and not necessarily to positions in the Z axis.

[0105] Furthermore, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance to push the electronic component 2 upward, the distance to be able to adsorb the electronic component 2, etc. In particular, when referring to the position (height) in the Z-axis direction, in the supply position P1, the height at the approach position is set to H1, and the height at the peeling position is set to H2 (refer to Figure 9 ).

[0106] The collet moving mechanism 22 has an arm 222a on which the pickup head 21 is mounted. By moving the arm 222a, the pickup collet 200 mounted on the pickup head 21 is moved. A loading and unloading portion 222b is provided at the front end of the pickup head 21. The loading and unloading portion 222b includes a magnet inside, and uses the suction force of the magnet to adsorb and hold the base 202 of the pickup collet 200. Figure 4 and Figure 5 As shown, a pair of pins 222c are provided on the surface of the attachment / detachment portion 222b that contacts the base 202. By engaging the pins 222c with the mounting holes 202c provided in the base 202, the pickup collet 200 is prevented from shifting relative to the attachment / detachment portion 222b. Furthermore, although not shown, the piping connected to the exhaust hole 202b passes through the attachment / detachment portion 222b, and the piping connected to the air supply hole 202a is supported by the attachment / detachment portion 222b.

[0107] The collet moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. The sliding mechanism 221 moves the arm 222a to which the pickup head 21 is mounted, thereby reciprocating the pickup collet 200 between the supply position P1 and the delivery position P2. The sliding mechanism 221 includes a rail 221b extending parallel to the X-axis and fixed to a support frame 221a, and a slider 221c that travels on the rail 221b.

[0108] The lifting mechanism 222 moves the pickup collet 200 in the vertical direction by moving the arm 222a to which the pickup head 21 is mounted. Specifically, the lifting mechanism 222 may use a linear guide that moves the slider on a track via a ball screw mechanism driven by a servo motor. In other words, the pickup collet 200 is raised and lowered along the Z-axis by the servo motor. Furthermore, the pickup collet 200 is elastically supported by the pickup head 21 via the loading and unloading portion 222b and is arranged so as to be able to slide up and down along the Z-axis relative to the pickup head 21. Furthermore, the pickup head 21 has a sensor for detecting this sliding movement.

[0109] The direction-changing unit 23 is disposed between the pickup collet 200 and the collet moving mechanism 22. Here, the direction-changing unit 23 is an actuator comprising a drive source such as a motor for changing the orientation of the pickup collet 200, and a rotation guide such as a ball bearing. The orientation of the pickup collet 200 is set so that it faces the opposing surface 201a from the base 202 of the pickup collet 200. Changing the orientation is a rotation of 0° to 180° in the vertical direction. For example, the pickup collet 200 with the opposing surface 201a facing the supply stage 12 adsorbs and holds the electronic component 2 at the supply position P1. Thereafter, the direction-changing unit 23 changes the orientation of the pickup collet 200 so that the adsorption surface faces upward. At this time, the rotation angle is 180°.

[0110] like Figure 1 As shown, the push pin 24 is provided below the sheet 11 of the supply device 10. The push pin 24 is a needle-shaped member with a sharp tip. The push pin 24 is provided inside the support body 241 with its longitudinal direction parallel to the Z-axis direction.

[0111] The support body 241 has a driving mechanism for moving the push pin 24 in and out of the support body or retracting the push pin 24 into the support body. The moving in and out or retracting is performed in the vertical direction. The driving mechanism includes, for example, a slider guided by a vertical track and a cylinder or cam mechanism driving the slider.

[0112] [Equipped device]

[0113] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a bonding head 31 and a head moving mechanism 32.

[0114] The bonding head 31 functions as a receiving unit that receives the electronic component 2 from the pickup collet 200 at the transfer position P2 and mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2.

[0115] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the held state, releasing the electronic component 2. The nozzle 31a includes a nozzle hole. The nozzle hole opens on the suction surface at the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown), such as a vacuum pump. This circuit generates negative pressure, which attracts and holds the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, when the negative pressure is released, the electronic component 2 is released from the suction surface.

[0116] The head moving mechanism 32 is a mechanism that moves the bonding head 31 back and forth between the transfer position P2 and the mounting position P3 and moves it up and down between the transfer position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lift mechanism 322.

[0117] The slide mechanism 321 reciprocates the bonding head 31 between the transfer position P2 and the mounting position P3 and includes two rails 321b extending parallel to the X-axis direction and fixed to a support frame 321a, and a slider 321c running on the rails 321b.

[0118] Although not shown, the sliding mechanism 321 includes a sliding mechanism that allows the bonding head 31 to slide along the Y-axis direction. The sliding mechanism may also include a track in the Y-axis direction and a slider that travels on the track. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lifting mechanism 322 moves the bonding head 31 vertically. Specifically, the lifting mechanism 322 may utilize a linear guide that moves the slider along the track via a ball screw mechanism driven by a servo motor. In other words, the servo motor drives the bonding head 31 upward and downward along the Z-axis direction.

[0119] The substrate stage 60 is a stage that supports the substrate on which the electronic component 2 is mounted. The substrate stage 60 is attached to a stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 in the XY plane and positions the electronic component 2 at the intended mounting position P3 on the substrate. The stage moving mechanism 61 includes, for example, a linear guide, and a ball screw mechanism driven by a servo motor can be used to move a slider on a track.

[0120] The mounting device 30 also includes an imaging device, an image processing device, and a position recognition device (not shown). The imaging device captures images of the electronic component 2 held by the bonding head 31 and the substrate supported by the substrate stage 60. Based on the images processed by the image processing device, the position recognition device identifies the positional relationship between the electronic component 2 and the substrate. Based on this positional relationship, the mounting device 30 mounts the electronic component 2 on the substrate. The imaging device can be a dual-view camera inserted between the electronic component 2 and the substrate to capture both simultaneously, or a camera that captures both separately.

[0121] [Control device]

[0122] The control device 50 controls the start, stop, speed, action timing, etc. of the supply device 10, the pickup device 20, the loading device 30, and the substrate carrier 60. That is, the control device 50 is a control device for the transfer device 1 and the installation device 100. The control device 50 can be implemented, for example, by a dedicated electronic circuit or a computer running a prescribed program. An input device for the operator to input instructions or information required for control, and an output device for confirming the status of the device are connected to the control device 50. The input device can use a switch, a touch screen, a keyboard, a mouse, etc. The output device can use a display unit such as a liquid crystal or an organic electroluminescence (EL).

[0123] Figure 6 is a functional block diagram of the control device 50. Figure 6 As shown, the control device 50 includes a supply device control unit 51 , a pin push control unit 52 , a pickup control unit 53 , a bonding head control unit 54 , a substrate stage control unit 56 , and a storage unit 57 .

[0124] The supply device control unit 51 controls the movement of the supply stage 12 , that is, the movement of the electronic component 2 to be picked up placed on the sheet 11 . The push-up pin control unit 52 controls the movement of the push-up pin 24 , that is, the operation of the support 241 .

[0125] The pickup control unit 53 controls the movement of the pickup collet 200. Specifically, the pickup control unit 53 controls the operation of the collet moving mechanism 22 and the direction changing unit 23. Furthermore, the pickup control unit 53 controls the gas supply circuit connected to the gas supply hole 202a, the negative pressure generating circuit connected to the exhaust hole 202b, and the gas supply circuit connected to the vent 203a, thereby controlling the holding, positioning, and release of the electronic component 2.

[0126] The bonding head control unit 54 controls the movement of the bonding head 31, that is, the operation of the head movement mechanism 32. Furthermore, the bonding head control unit 54 controls the negative pressure generating circuit connected to the nozzle holes of the bonding head 31, thereby controlling the holding and release of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, that is, the operation of the stage movement mechanism 61.

[0127] The storage unit 57 is a storage device that includes various types of memory devices (such as a hard disk drive (HDD) or a solid-state drive (SSD)) as recording media, as well as interfaces for recording media and external devices. The storage unit 57 pre-stores data and programs required for the operation of the transfer device 1. The storage unit 57 also stores data required for the operation of the transfer device 1. Examples of this required data include the gas supply rate, exhaust pressure, the coordinates of the supply position P1, the transfer position P2, and the installation position P3, and the coordinates of each moving mechanism. Each moving mechanism controls the movement of its components based on these coordinates.

[0128] [Principle of suction and holding using a pickup collet]

[0129] Next, the principle of the electronic component 2 being sucked and held by the pickup collet 200 as described above will be described. Figure 3 As shown in (A), the gas supplied from the air supply hole 202a is ejected in a planar shape from the fine holes of the facing surface 201a, thereby forming a gas layer between the electronic component 2. The layer is, for example, 2μm to 10μm. Then, while negative pressure is applied to the suction hole 201c by the negative pressure generating circuit, the facing surface 201a is brought close to the electronic component 2, thereby sucking and holding the electronic component 2. At this time, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a and the electronic component 2 maintain a non-contact state. Moreover, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 201c, and thus the electronic component 2 is released from the pickup collet 200.

[0130] [How the Pickup Collet Positions Electronic Components]

[0131] The principle by which the pickup collet 200 described above can position the electronic component 2 will be described. Specifically, by applying a relatively positive pressure to one of the orthogonal guides 203K and 203L relative to the other orthogonal guides 203M and 203N, the electronic component 2 approaches the other orthogonal guides 203M and 203N, which are at a relatively negative pressure, and is thereby positioned at a corner of the opposing surface 201a along which the other orthogonal guides 203M and 203N extend.

[0132] In this embodiment, if Figure 3(A) and Figure 7 (A) Figure 7 As shown in (B), gas is ejected from the ventilation portion 203a of one of the two perpendicular guide portions 203K and 203L via the ejection port 203b toward one of the two perpendicular side surfaces of the electronic component 2 held by the facing surface 201a as described above. This presses the other two perpendicular side surfaces of the electronic component 2 against the inner walls of the other perpendicular guide portions 203M and 203N. As a result, the electronic component 2 is positioned at a corner of the facing surface 201a.

[0133] [action]

[0134] Regarding the operation of picking up the electronic component 2 from the supply device 10 by the pickup device 20 and delivering the electronic component 2 to the loading device 30 in the above transfer device 1, except for reference to Figures 1 to 7 In addition, refer to Figure 8 Flowchart, Figure 9 The illustration is described below.

[0135] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the supply position P1 where the upper push pin 24 is located, so that the facing surface 201a of the pickup collet 200 faces the upper push pin 24 (step S01). At this point, pressurized gas is supplied to the porous member 201 through the gas supply holes 202a, and the gas is blown out from the facing surface 201a. Furthermore, no exhaust is performed through the exhaust holes 202b, and no suction is performed through the opening 201d. No gas is ejected from the ejection port 203b.

[0136] On the other hand, the supply device 10 moves the supply stage 12, as shown in FIG. Figure 9 As shown in (A), the electronic component 2 to be picked up is positioned at the supply position P1 (step S02). Then, the pickup collet 200, to which the gas is supplied to the surface of the facing surface 201a, is lowered together with the pickup head 21 to approach the electronic component 2. Figure 9 As shown in (B), in order to prevent the guide portion 203 from colliding with the surrounding electronic components 2, according to the protrusion amount of the guide portion 203 from the opposite surface 201a, when the picking collet 200 starts to descend, the push pin 24 rises and pushes up the electronic component 2 to be picked up, thereby raising the electronic component 2 to be picked up to a height at which the guide portion 203 will not collide with the surrounding electronic components 2.

[0137] When the descending picking collet 200 approaches the electronic component 2, the gas supplied to the surface of the facing surface 201a is clamped by the facing surface 201a and the electronic component 2 to form a gas layer. It is considered that the clamped gas layer at this time becomes a viscous flow layer. Therefore, the fluidity of the gas G in the gas layer itself is very poor, and there is almost no suction caused by the exhaust from the exhaust hole 202b described later and no outflow from the outer edge of the gas layer. Then, the picking collet 200 passes through the gas layer without further compression and stops descending relative to the electronic component 2 (step S03). At this time, as described above, the electronic component 2 as the picking object has risen compared to the surrounding electronic components 2, so the guide portion 203 does not contact the electronic components 2 around the picking object on the sheet 11.

[0138] Even if the pickup collet 200 stops descending relative to the electronic component 2, the pickup head 21 continues to descend because the pickup collet 200 is elastically supported by the pickup head 21. The pickup head 21 slides relative to the pickup collet 200. When the sensor detects this sliding, the pickup control unit 53 recognizes that the pickup collet 200 has reached the electronic component 2 and stops descending the pickup head 21.

[0139] As described above, when the pickup head 21 stops, the pickup collet 200 forms a gas layer between the facing surface 201a and the electronic component 2 as described above. The facing surface 201a stops via the gas layer and does not get any closer to the electronic component 2. Therefore, the pickup collet 200 does not come into direct contact with the electronic component 2. The height position of the pickup collet 200 at this time becomes the approach position H1 (refer to Figure 9 ).

[0140] In this way, the pickup collet 200 stops through the gas layer, and then, when the pickup head 21 stops, the gas is exhausted from the exhaust hole 202b, and suction is started using the suction hole 201c (step S04). Figure 9 As shown in (C), the pickup collet 200 starts suctioning while pressing the electronic component 2 against the sheet 11 supported by the support 241 via the gas layer, that is, while sandwiching the sheet 11 and the electronic component 2 between the pickup collet 200 and the support 241 .

[0141] In the above state, the pickup collet 200 rises, and synchronously therewith, the push pin 24 further rises, rises a predetermined amount, and stops (step S05). Figure 9 As shown in (D), the pickup collet 200 rises further, and the electronic component 2 is sucked into the pickup collet 200 by the negative pressure while maintaining the gap formed by the gas layer, and is peeled off from the sheet 11 and picked up (step S06). The height position at which the electronic component 2 is completely peeled off is the peeling position H2.

[0142] The pickup device 20 uses the direction-changing unit 23 to reverse the pickup collet 200 (step S07). Specifically, the pickup collet 200 is rotated 180 degrees in the vertical direction, so that the facing surface 201a of the pickup collet 200 faces upward. While the reversal in step S07 is performed immediately after the electronic component 2 is picked up, it can also be performed at any location between the supply position P1 and the delivery position P2.

[0143] Furthermore, after reversing, when moving to the transfer position P2, the forces exerted on the electronic component 2 by the reversal or horizontal movement are dispersed, thereby reducing the risk of it falling out of the pickup collet 200. When moving while reversing, the forces of reversal and horizontal movement work in tandem, increasing the likelihood of it falling out. However, this can shorten cycle time and improve productivity. The likelihood of it falling out varies depending on the size (size, thickness, etc.) of the electronic component 2, so it is preferable to select an appropriate action based on the electronic component 2.

[0144] The pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 using the collet moving mechanism 22 (step S08). At the transfer position P2, the bonding head 31 of the mounting device 30 stands by, facing the facing surface 201a of the pickup collet 200 with the electronic component 2 interposed therebetween.

[0145] Then, if Figure 3 (A) and Figure 7 As shown in (B), gas is ejected from the vent 203a of one of the orthogonal guide parts 203K and the guide part 203L through the ejection port 203b, thereby pressing the electronic component 2 against the inner wall of the other orthogonal guide part 203M and the guide part 203N and positioning it (step S09). In addition, by positioning the electronic component 2 after the inversion in the above manner, the positional offset caused by the inversion can be corrected. Moreover, by positioning the electronic component 2 before it is handed over to the bonding head 31, the time of contact with the guide part 203M and the guide part 203N can be shortened as much as possible, and the influence of the contact on the electronic component 2 can be suppressed. However, the timing of positioning is not limited to this. The electronic component 2 can be positioned just after it is picked up, or before it is reversed, or while it is being moved to the handover position P2.

[0146] The bonding head 31 is lowered toward the pickup collet 200 at the transfer position P2. After the bonding head 31 holds the electronic component 2, the negative pressure in the pickup collet 200 is released, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S10). The bonding head 31 then rises away from the pickup collet 200 and moves to the mounting position P3 to mount the electronic component 2 on the substrate.

[0147] [Effect]

[0148] (1) The pickup collet 200 of this embodiment has a rectangular outer edge and sucks and holds and picks up the electronic component 2. It has a porous member 201. The porous member 201 has air permeability and ejects the gas supplied to the inside in a planar shape through the pores of the facing surface 201a facing the electronic component 2. The porous member 201 is provided with a suction hole 201c. The suction hole 201c has an opening 201d on the facing surface 201a. The suction hole 201c is sucked by negative pressure. The electronic component 2, the picking collet 200 is provided with a guide portion 203, the guide portion 203 is arranged along the outer edge of the electronic component 2, and limits the movement of the electronic component 2 held by the opposing surface 201a, and a ventilation portion 203a is provided in the guide portion 203, and the ventilation portion 203a makes the side of an orthogonal guide portion 203K and the guide portion 203L become a relatively positive pressure compared to the side of the other orthogonal guide portion 203M and the guide portion 203N.

[0149] Furthermore, the pickup device 20 of this embodiment includes a collet moving mechanism 22 that moves the pickup collet 200 to a position on the sheet 11 where the electronic component 2 can be sucked and held, and can peel the sucked and held electronic component 2 from the sheet 11 and transfer it.

[0150] Furthermore, the mounting device 100 of this embodiment includes: a bonding head 31 that is arranged to be relatively movable relative to the pickup collet 200 and receives the electronic component 2 from the front end of the pickup collet 200; and a loading device that transfers the electronic component 2 held by the bonding head 31 to the substrate and mounts it.

[0151] Therefore, when the electronic component 2 is picked up by suction from the suction hole 201c, the layer of gas discharged from the pores of the porous member 201 prevents the electronic component 2 from coming into contact with the facing surface 201a, thereby suppressing damage to the electronic component 2. Furthermore, when the electronic component 2 is transferred, the possibility of damage to the electronic component 2 due to contact with the facing surface 201a is reduced, and the electronic component 2 is held to prevent it from falling.

[0152] Furthermore, even if the electronic component 2 moves horizontally on the facing surface 201 a held in a non-contact manner via the gas layer due to inertial force accompanying the movement of the electronic component 2 during inversion, the guide portion 203 can prevent the electronic component 2 from falling off the pickup collet 200 .

[0153] Furthermore, by applying relative positive pressure to one of the orthogonal guides 203K and 203L, the electronic component 2 is positioned at the corner formed by the plane along which the other orthogonal guides 203M and 203N extend. Therefore, even if the position or angle of the electronic component 2 held by the facing surface 201a varies during pickup, it can still be transferred to the bonding head 31 at the appropriate position, reducing misalignment during mounting. Furthermore, during positioning, the electronic component 2 moves parallel to the facing surface 201a, but as described above, the electronic component 2 does not contact the facing surface 201a, thus preventing damage to the electronic component 2 caused by friction. Furthermore, even if the position of the electronic component 2 shifts within the area surrounded by the guides 203, suction and retention are maintained regardless of the position of the opening 201d, as long as the suction of the opening 201d is within the projection plane of the electronic component 2.

[0154] Here, the reasons why the guide portion 203 and positioning described above are effective when the pickup collet 200 holds the electronic component 2 in a non-contact manner as in the present embodiment will be further explained in detail. Specifically, since the electronic component 2 is held in a non-contact manner by the pickup collet 200 via a gas layer, it can easily move horizontally. Therefore, there is a possibility that the inertial force acting on the electronic component 2 due to the movement of the pickup collet 200 toward the transfer position P2 or the reversal action may cause the electronic component 2 to move on the facing surface 201a of the pickup collet 200. Even if such movement occurs, the movement of the electronic component 2 can be restricted to a predetermined area by the guide portion 203, thereby preventing the electronic component 2 from falling off the pickup collet 200.

[0155] In addition, in order to avoid contact with the electronic component 2 when picking up from the sheet 11, the opposing interval of the guide portion 203 needs to be set to be larger than the size of the electronic component 2. Therefore, a gap is set between the electronic component 2 held by the pickup collet 200 and the guide portion 203. Therefore, when the electronic component 2 moves as described above, there is a situation where the position or angle of the electronic component 2 moves within the range of the gap amount. The state of this holding posture is very uneven. If there is such an uneven holding posture, the holding posture of the electronic component 2 handed over to the bonding head 31 will also be uneven relative to the reference position (appropriate position) that serves as the positioning reference. When the holding position of the electronic component 2 is photographed and the position is identified using a camera device (not shown), the time taken or the amount of position correction is large, resulting in a larger movement error during correction. In this embodiment, as described above, it is possible to always position it at the appropriate position relative to the opposing surface 201a, thereby suppressing the uneven holding posture and reducing the amount of position correction or movement error during correction.

[0156] The proper position refers to the holding position of the electronic component 2 held by the pickup collet 200, which is approximately directly transferred to the bonding head 31. This position also corresponds to the reference position for mounting the electronic component 2 on the substrate. When the proper position is captured and position recognized by the camera, even if the holding position of the electronic component 2 relative to the reference position varies, as long as the recognition time is within the allowable range and the movement error during the correction movement is within the allowable range, the variation in the holding position is included.

[0157] Furthermore, there is a possibility that the electronic component 2 can be held by a Bernoulli chuck using the negative pressure generated by the large airflow to generate suction force by circulating gas exhausted from the space between the electronic component 2 and the surface facing it. In this case, the suction force is very weak. Even if the electronic component 2 can be held at a certain distance from the collet, the suction force required to peel the electronic component 2 from the sheet 11 cannot be achieved. Furthermore, to achieve the Bernoulli effect, a very high gas flow rate per unit time is required, making it extremely difficult to adjust the suction force required to maintain non-contact. Furthermore, there is a concern that a large amount of gas may be blown around the pickup area, potentially generating particles.

[0158] Moreover, a gas ejection hole having a size equal to that of the suction hole is provided on the surface of the collet facing the electronic component 2, rather than a fine hole like the porous member 201, and gas is ejected toward the electronic component 2 to suspend the electronic component 2. When the electronic component 2 is sucked through the suction hole to counteract the levitation force of the electronic component 2 generated by the ejection, as described above, it is very difficult to adjust the suction force for generally maintaining non-contact (suspension), and there is a concern that a large amount of gas may be blown out to the vicinity of the pickup portion, leading to the generation of particles.

[0159] In contrast, in this embodiment, the flow rate of gas blown out from the entire facing surface 201a in a planar manner through the fine holes in the facing surface 201a is extremely small. Therefore, there is no concern about the generation of particles. Blowing out from the facing surface 201a does not actively suspend the electronic component 2, but rather forms a layer of gas that forms a viscous flow when the facing surface 201a and the electronic component 2 are close to each other. Therefore, the stronger the suction force, the easier it is to maintain the facing surface 201a and the electronic component 2 in a non-contact state. Even if the suction force generated by the negative pressure from the suction hole 201c is set to a force sufficient to peel the electronic component 2 from the sheet 11, the layer of gas between the facing surface 201a and the electronic component 2 can prevent contact, so both obtaining a strong suction force and adjusting the suction force become easy.

[0160] For example, under the following conditions, the pickup collet 200 can maintain non-contact with the electronic component 2 while suctioning and holding it. For example, a porous member 201 with a gas permeability of approximately 0.7 L / min at a supply pressure of 0.3 MPa is used. The pressure of the gas (nitrogen) supplied to the porous member 201 can be in the range of approximately 0.1 MPa to 0.7 MPa. In this case, the gas flow rate through the porous member 201 is in the range of approximately 0.3 L / min to 1.5 L / min, reliably maintaining non-contact between the pickup collet 200 and the electronic component 2. Furthermore, the suction pressure is in the range of -10 kPa to -90 kPa, reliably picking up the electronic component 2 from the sheet 11. In this case, the pressure in the gas layer between the electronic component 2 and the facing surface 201a is 0.1 MPa to 0.5 MPa.

[0161] (2) The vent 203a is configured to eject gas from one of the orthogonal guides 203K and 203L. Therefore, the ejection of gas creates a relatively positive pressure on one of the orthogonal guides 203K and 203L, allowing the electronic component 2 to be moved to the other orthogonal guide 203 in a non-contact manner. This reduces damage to the electronic component 2 during positioning.

[0162] [Modification]

[0163] The present invention is not limited to the above-described embodiment. The basic structure is the same as that of the above-described embodiment, and the following modified examples are also applicable.

[0164] (1) If the electronic component 2 comes into contact with the other orthogonal guides 203M and 203N, there is a possibility that the electronic component 2 will be affected. Therefore, by maintaining the ejection of gas from the guides 203K and 203L, and by ejecting gas from the guides 203M and 203N, the electronic component 2 does not come into contact with the side surfaces of the electronic component 2. At this time, the guides 203K and 203L are also kept at a relatively positive pressure, thereby preventing the electronic component 2 from being separated from the pickup collet 200 during the reversal or movement of the pickup collet 200 and positioning it, thereby preventing damage to the electronic component 2 caused by contact with the guides 203.

[0165] For example, Figure 10As shown, vent 203a is configured to eject gas from two orthogonal guides 203M and 203N via a porous member 203c for the guide. Specifically, porous member 203c for the guide is positioned at a location where the protruding portion of each orthogonal guide 203M and 203N faces the side of electronic component 2. Ventilation 203a is provided within guides 203M and 203N, connecting the porous member 203c for the guide to the outside. Ventilation 203a is connected to a gas supply circuit via piping (not shown) and is controlled by control device 50.

[0166] The guides 203M and 203N eject gas through the porous guide member 203c. This creates a gas layer along the sides of the guides 203M and 203N. Therefore, even when the electronic component 2 is moved to the side of the other orthogonal guide 203M and 203N for positioning, the electronic component 2 remains out of contact with the other pair of guides 203. This ensures that the electronic component 2 is positioned via the gas layer, minimizing damage and cracking, and suppressing the generation of particles caused by contact. The amount of gas ejected can be kept small, thus suppressing the generation of particles caused by airflow. Furthermore, this reduces the risk of electronic components 2 shifting or falling during transport.

[0167] Moreover, if Figure 11 As shown in (A), gas is ejected not only from one of the orthogonal guide portions 203K and 203L, but also from the ejection port 203b of the other orthogonal guide portion 203M and 203N, which is connected to the vent portion 203a, toward the other two orthogonal side surfaces of the electronic component 2. This prevents the electronic component 2 from shifting or deviating during movement or reversal, or from contacting the electronic component 2. The vent portion 203a is also connected to a gas supply circuit via piping (not shown), and the supply circuit is controlled by the control device 50. In this case, the gas ejected from the guide portions 203M and 203N is sufficient to prevent the side surfaces of the electronic component 2 from contacting the guide portions 203M and 203N, or, even if contact occurs, to limit damage to the electronic component 2 to an acceptable level. That is, in the case described above, by making the amount of gas ejected from the guide parts 203M and 203N less than the amount of gas ejected from the guide parts 203K and 203L, the guide parts 203K and 203L sides can be made to have a relatively positive pressure, thereby preventing the electronic component 2 from being separated from the picking collet 200 during the reversal or movement of the picking collet 200, and the electronic component 2 is positioned via the gas layer, and damage to the electronic component 2 due to contact with the guide part 203 will no longer occur.

[0168] Furthermore, in the case described, when positioning, as Figure 11As shown in (B), gas ejection from the other orthogonal guide portion 203M or 203N can be stopped, and gas ejection from only one of the orthogonal guide portions 203K or 203L can be achieved. This creates a relatively positive pressure on the side of one of the orthogonal guide portions 203K or 203L, thereby positioning the electronic component 2. By stopping gas ejection from the other orthogonal guide portion 203M or 203N while the electronic component 2 is close to or in contact with the other orthogonal guide portion 203M or 203N, the impact on the electronic component 2 can be reduced, making it less likely to be damaged. Furthermore, by pressing the electronic component 2 against the other orthogonal guide portion 203M or 203N, reliable positioning can be achieved. Furthermore, when gas ejection from the other orthogonal guide portion 203M or 203N is stopped, the ejection can be gradually weakened and stopped. The impact on the electronic component 2 when the electronic component 2 is pressed against and positioned on the guide portions 203M and 203N can be further suppressed, making it less likely to be damaged.

[0169] As described above, in the positioning step, gas is ejected from one of the orthogonal guide portions 203K and 203L, and gas may or may not be ejected from the other orthogonal guide portion 203M and 203N.

[0170] Furthermore, after picking up the electronic component 2, gas can be uniformly ejected from all guides 203K, 203L, 203M, and 203N until the transfer position P2 is reached. At the transfer position P2, the ejection of gas from the other orthogonal guides 203M and 203N can be stopped or reduced. This prevents the electronic component 2 from contacting the guides 203 during the transfer to the transfer position P2, thereby preventing damage to the electronic component 2. Furthermore, at the transfer position P2, a relatively positive pressure can be applied to one of the orthogonal guides 203K and 203L, thereby positioning the electronic component 2. This prevents the electronic component 2 from dislodging from the pickup collet 200 during rotation or movement, and allows the electronic component 2 to be positioned without any damage to the electronic component 2 from contact with the guides 203.

[0171] Furthermore, if Figure 12As shown, the vent 203a can also be configured to draw gas from two other orthogonal sides of the guide portion 203. For example, a vent 203a is provided inside the other orthogonal guide portions 203M and 203N, connecting the exterior to the area surrounding the electronic component 2 held by the facing surface 201a. The vent 203a is connected to a gas exhaust circuit (negative pressure generating circuit) via piping (not shown), which is controlled by the control device 50. The ends of the vent 203a serve as suction ports 203d facing the other two side faces of the electronic component 2. Therefore, the side faces of the electronic component 2 can be drawn from the suction ports 203d. Consequently, since the pressure on one of the orthogonal guide portions 203K and 203L is relatively positive compared to the pressure on the other orthogonal guide portions 203M and 203N, the electronic component 2 is positioned at an appropriate corner, similar to the above. In addition, in the above case, the ventilation portion 203a may be provided in one of the orthogonal guide portions 203K and 203L, or may not be provided.

[0172] The time required to position the electronic component 2 can be determined in advance through experiments, and the suction operation can be switched to the other guide portion 203M or 203N after the specified time has passed. For example, at the handover position P2, as described above, gas is ejected from one guide portion 203K or 203L, and then the gas is sucked from the other guide portion 203M or 203N after the specified time has passed. Alternatively, after picking up the electronic component 2, gas can be ejected from one guide portion 203K or 203L, and then the gas is sucked from the other guide portion 203M or 203N after the specified time has passed. In this case, since the suction operation is switched while the electronic component 2 is in proximity to or in contact with the other guide portion 203M or 203N, the impact on the electronic component 2 can be reduced, making it less likely to be damaged. When ejecting from one guide portion 203K or 203L and bringing it close to the other guide portion 203M or 203N, the ejection can be gradually reduced and stopped before suction from the other guide portion 203M or 203N to mitigate the impact. This allows electronic component 2 to be attracted to guide portions 203M or 203N after positioning, preventing further displacement. This allows positioning to be completed during movement, eliminating the need for positioning at the transfer position P2, thereby improving productivity.

[0173] The guide portion 203 as described above can be provided along the outer edge of the facing surface 201a in a manner that can limit the movement of the electronic component 2. Therefore, it can be provided on the entire periphery of the facing surface 201a or on a portion thereof. Figure 13 (A) as across the corner or as Figure 13As shown in (B), the guide portions 203 are continuously arranged along the corners, so that one of the orthogonal guide portions 203 sides becomes relatively positive pressure, thereby achieving positioning of the electronic component 2. Figure 13 As shown in (B), there is also a case where one orthogonal guide portion 203 is continuous with another orthogonal guide portion 203.

[0174] (2) The number and size of the suction holes 201c, openings 201d, ejection ports 203b, and suction ports 203d are not limited to the configurations described above. The suction holding state and the non-contact state can be maintained by balancing the area of ​​the electronic component 2 supported by the gas layer on the facing surface 201a of the porous member 201 with the total area of ​​the openings 201d. Furthermore, the number and size of the ejection ports 203b and suction ports 203d can be determined so that they can be positioned in the other orthogonal guide portion 203.

[0175] (3) The positions and shapes of the suction hole 201c, opening 201d, discharge port 203b, and suction port 203d are not limited to the above-described configurations. For example, the shape of the opening 201d may be circular or rectangular as described above, or may be an ellipse, polygon, rounded polygon, star, or the like.

[0176] (4) By making the pickup collet 200 replaceable, it can be replaced according to the shape and size of the electronic component 2. As such a replaceable structure, a structure that uses magnets for suction and retention is simple, and replacement is also easy. However, any structure that allows the pickup collet 200 to be replaced is sufficient. For example, a structure that uses negative pressure for suction and retention or a structure that mechanically retains the component can be used.

[0177] (5) The outer edge of the pickup collet 200 is not limited to a rectangular shape. Moreover, the guide portion 203 can be arranged along the outer edge of the electronic component 2, and does not need to be arranged on the outer edge of the pickup collet 200 as described above. For example, Figure 14 (A) and Figure 14 As shown in FIG. 1 (B), the pickup collet 200 may include a base 202 having a cylindrical or other curved outer edge, and a guide portion 203 may be provided on the bottom surface. The facing surface 201a is not limited to a rectangular shape.

[0178] [Other embodiments]

[0179] The present invention is not limited to the embodiments described above. During implementation, the structural elements may be modified and refined within the scope of the present invention. Furthermore, various inventions may be formed by appropriately combining multiple structural elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, structural elements from different embodiments may be appropriately combined.

Claims

1. A pickup collet having a rectangular outer edge and adapted to suction, hold, and pick up electronic components, characterized in that: The porous member has air permeability and ejects the gas supplied to the interior in a planar shape through the pores on the surface facing the electronic component. The porous member is provided with a suction hole, the suction hole having an opening on the facing surface, and sucking the electronic component by negative pressure. A guide portion is provided, the guide portion being arranged along the outer edge of the electronic component and restricting movement of the electronic component held by the facing surface. The guide portion is provided with a vent portion, and the vent portion causes a relatively positive pressure on one side of the guide portion perpendicular thereto compared to another side of the guide portion perpendicular thereto.

2. The pickup collet according to claim 1, characterized in that: The vent portion is provided in a manner such that gas can be ejected from one of the orthogonal guide portions.

3. The pickup collet according to claim 2, characterized in that: The vent is provided so as to be able to eject gas from the other orthogonal guide portion via the porous member for guidance.

4. The pickup collet according to claim 1, characterized in that: The vent portion is provided so as to be able to draw gas from the other orthogonal guide portion side.

5. The pickup collet according to claim 2, characterized in that: The vent portion is provided so as to be able to draw gas from the other orthogonal guide portion side.

6. A picking device for picking up the electronic component from a sheet on which the electronic component is attached, characterized in that have: The pickup collet according to any one of claims 1 to 5; and The collet moving mechanism brings the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and can peel the sucked and held electronic component from the sheet and transfer it.

7. A picking device for picking up an electronic component from a sheet on which the electronic component is attached, characterized in that: Having a pickup collet as claimed in claim 1, The vent is arranged in such a way that gas can be ejected from one of the orthogonal guide portions. The pickup device has: a collet moving mechanism, which enables the pickup collet to approach a position in the sheet material where the electronic component can be sucked and held, and is capable of peeling the sucked and held electronic component from the sheet material and transferring it; and The control device ejects gas from one of the orthogonal guide portions at a handover position where the pickup collet is handed over to a bonding head for mounting the electronic component on a substrate.

8. The pickup device according to claim 7, wherein: The vent is arranged in such a manner that gas can be drawn from another orthogonal guide portion. The control device ejects gas from one of the orthogonal guide portions at the handover position, and draws gas from the other orthogonal guide portion after a predetermined time has passed.

9. A picking device for picking up an electronic component from a sheet on which the electronic component is attached, characterized in that: Having a pickup collet as claimed in claim 1, The vent is arranged in a manner that gas can be ejected from one of the orthogonal guides and in a manner that gas can be sucked from the other orthogonal guide. The pickup device has: a collet moving mechanism, which enables the pickup collet to approach a position in the sheet material where the electronic component can be sucked and held, and is capable of peeling the sucked and held electronic component from the sheet material and transferring it; and The control device ejects gas from one of the orthogonal guide portions after the pickup collet picks up the electronic component, and draws gas from the other orthogonal guide portion after a predetermined time has passed.

10. A picking device for picking up electronic components from a sheet on which the electronic components are attached, characterized in that: Having a pickup collet as claimed in claim 1, The vent is provided in such a manner that gas can be ejected from one of the orthogonal guides and the other orthogonal guide. The pickup device has: a collet moving mechanism, which enables the pickup collet to approach a position in the sheet material where the electronic component can be sucked and held, and is capable of peeling the sucked and held electronic component from the sheet material and transferring it; and The control device ejects gas from one of the orthogonal guide parts and the other orthogonal guide part after the pickup collet picks up the electronic component, and stops ejecting gas from the other orthogonal guide part at the handover position from the pickup collet to the bonding head that mounts the electronic component on the substrate.

11. A mounting device for mounting electronic components on a substrate, characterized in that have: The pickup device according to any one of claims 7 to 10; a bonding head, arranged in a relatively movable manner relative to the pickup collet, and receiving the electronic component from the pickup collet; and The mounting device transfers the electronic component held by the bonding head to a substrate and mounts the electronic component thereon.

12. A mounting device for mounting electronic components on a substrate, characterized in that have: The pickup device according to claim 6; a bonding head, arranged in a relatively movable manner relative to the pickup collet, and receiving the electronic component from the pickup collet; and The mounting device transfers the electronic component held by the bonding head to a substrate and mounts the electronic component thereon.

Images