Micro LED Cleaning Equipment, LED Repair System, and Cleaning Method

Abstract

The present invention belongs to the field of semiconductor technology, and discloses a micro-LED cleaning device, an LED repair system, and a cleaning method. The micro-LED cleaning device includes a camera device, an adsorption device, and a cleaning device. The cleaning device includes a position adjustment mechanism, a mounting plate, a roller release mechanism, and a wiping head mechanism. The wiping head mechanism includes a first mounting member and a wiping head assembly. The wiping head assembly includes a micro-wiping head. The size of the micro-wiping head is smaller than the size of the vacant position of the substrate. The micro-wiping head is transmission-connected to the first mounting member. The roller release mechanism includes a cleaning cloth that is intermittently transmitted, and the micro-wiping head can be pressed against the cleaning cloth. The above-mentioned arrangement ensures that the micro-LED cleaning device and the LED repair system can accurately and mechanically clean the impurities in the vacant positions of the substrate, avoid the impurities from adhering to the substrate, ensure that the impurities are adsorbed away, improve the cleaning effect, and ensure the success of the re-welding. The LED repair system has a good cleaning effect on the vacant positions of the substrate and a high success rate of re-welding.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a micro-LED cleaning device, an LED repair system, and a cleaning method. Background Art

[0002] With the wide application of display screens in various fields, as an important component of the display screen, LEDs (Light Emitting Diodes) have higher and higher requirements for their factory production. An LED includes a glass substrate (hereinafter referred to as the substrate) and a plurality of micro-chips (hereinafter referred to as chips) regularly arranged thereon. The chips are mounted on the substrate by pads. Due to the large number of chips, it is inevitable that some chips will fail before leaving the factory. Therefore, LEDs must be inspected for defective chips before leaving the factory and the defective chips are removed. After the defective chips are removed, substrate vacancies are formed on the substrate. New chips are re-soldered to the substrate vacancies to ensure that all chips in the LED operate normally.

[0003] However, after the defective chips are desoldered and removed, a large amount of foreign matter and flux residue left during desoldering and previous soldering often remain on the substrate vacancies and the corresponding pads. If new chips are directly re-soldered, the solder paste will not melt evenly due to the presence of impurities and flux, making it difficult to melt, resulting in insecure re-soldering and even serious LED repair failure. Since the chip size is very small (50μm - 80μm), in the prior art, lasers are commonly used to burn the impurities and then adsorb them. However, laser cleaning will cause a small amount of impurities to adhere to the substrate or pads after being burned, and the adsorption device cannot suck away such impurities. Therefore, the cleaning effect of laser cleaning is not ideal, and the solder paste is still difficult to melt, resulting in re-soldering failure. Of course, this problem also exists during product repair.

[0004] Therefore, it is urgent to design a micro-LED cleaning device, an LED repair system, and a cleaning method to solve the above problems. Summary of the Invention

[0005] An object of the present invention is to provide a micro-LED cleaning device, which can accurately and mechanically clean the impurities in the substrate vacancies, avoid impurities from adhering to the substrate, ensure that the impurities are adsorbed away, improve the cleaning effect, and ensure successful re-soldering.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A micro-LED cleaning device is used to clean the substrate vacancies on the substrate after desoldering defective dies. The above-mentioned micro-LED cleaning device includes a camera device, a suction device, and a cleaning device. The above-mentioned camera device is used to locate the substrate vacancies and determine the cleaning degree of the substrate vacancies. The suction device is used to suck away impurities. The above-mentioned cleaning device includes:

[0008] A position adjustment mechanism, communicatively connected to the above-mentioned camera device;

[0009] A mounting plate, mounted on the output end of the above-mentioned position adjustment mechanism;

[0010] A cloth feeding mechanism, mounted on the above-mentioned mounting plate. The above-mentioned cloth feeding mechanism includes a cleaning cloth that is intermittently conveyed; and

[0011] A wiping head mechanism, including a first mounting member and a wiping head assembly. The above-mentioned first mounting member is connected to the above-mentioned mounting plate. The above-mentioned wiping head assembly includes a micro wiping head provided at the free end of the above-mentioned wiping head assembly. The size of the free end of the above-mentioned micro wiping head is smaller than the size of the substrate vacancy. The above-mentioned micro wiping head is drivingly connected to the above-mentioned first mounting member. The above-mentioned micro wiping head can be pressed against the above-mentioned cleaning cloth. The above-mentioned position adjustment mechanism can adjust the positions of the above-mentioned micro wiping head and the above-mentioned cleaning cloth.

[0012] Optionally, the relative position of the above-mentioned wiping head assembly in the direction towards the above-mentioned cleaning cloth and the above-mentioned first mounting member is adjustable.

[0013] Optionally, the above-mentioned wiping head mechanism further includes an adjusting tension driving member. The above-mentioned adjusting tension driving member is mounted on the above-mentioned first mounting member. The above-mentioned wiping head assembly is mounted on the output end of the above-mentioned adjusting tension driving member. The above-mentioned adjusting tension driving member can drive the above-mentioned wiping head assembly to move in a preset direction.

[0014] Optionally, the above-mentioned adjusting tension driving member is a slider cylinder.

[0015] Optionally, the above-mentioned wiping head assembly further includes:

[0016] A second mounting member, mounted on the output end of the above-mentioned adjusting tension driving member;

[0017] A guiding member, extending along a preset direction and mounted on the above-mentioned second mounting member;

[0018] A limiting member, mounted on one end of the above-mentioned guiding member;

[0019] A connecting member, slidably and cooperatively connected to the above-mentioned guiding member. The above-mentioned micro wiping head is connected to the above-mentioned connecting member; and

[0020] An elastic member, provided at the other end of the above-mentioned guiding member and capable of abutting against the above-mentioned connecting member.

[0021] Optionally, the above-mentioned connecting member is detachably connected to the above-mentioned micro wiping head.

[0022] Optionally, the above-mentioned micro LED cleaning device further includes a filling mechanism. The filling mechanism includes a filling container. A through hole is formed in the above-mentioned micro wiping head. One end of the through hole can abut against the above-mentioned cleaning cloth. The filling container is communicated with the through hole, and the filling container can intermittently release a cleaning agent into the through hole.

[0023] Optionally, the above-mentioned micro wiping head includes a body portion and a convex portion. The convex portion protrudes from the body portion and its size is smaller than the size of the vacancy on the substrate. A through hole is formed in the body portion. One end of the through hole is located on the circumferential side of the convex portion. The free end of the convex portion is a smooth spherical surface.

[0024] Another object of the present invention is to provide an LED repair system with good cleaning effect on the vacancy of the substrate and high success rate of re-soldering.

[0025] To achieve this purpose, the present invention adopts the following technical solutions:

[0026] An LED repair system includes a defective die disassembling device. The LED repair system further includes the above-mentioned micro LED cleaning device. The defective die is removed from the substrate by the defective die disassembling device to form a vacancy on the substrate. The micro LED cleaning device is used to clean the impurities on the vacancy of the substrate.

[0027] Another object of the present invention is to provide a cleaning method that can accurately and mechanically clean the impurities on the vacancy of the substrate, avoid the adhesion of impurities to the substrate, ensure that the impurities are adsorbed away, improve the cleaning effect, and ensure the success of re-soldering.

[0028] To achieve this purpose, the present invention adopts the following technical solutions:

[0029] A cleaning method uses the above-mentioned micro LED cleaning device. The camera device includes a first camera and a second camera. The first camera is used to locate the vacancy of the substrate. The second camera is used to determine the dirt condition of the vacancy of the substrate after desoldering. The position adjustment mechanism is respectively communicatively connected to the first camera and the second camera; the micro LED cleaning device further includes a filling mechanism. The filling mechanism can intermittently release a cleaning agent to the cleaning cloth. The cleaning method includes:

[0030] S1: The first camera calibrates the vacancy of the substrate;

[0031] S2: The filling mechanism fills a preset amount of the cleaning agent onto the cleaning cloth;

[0032] S3: The above position adjustment mechanism drives the above substrate to move so that the above micro wiping head reaches the vacant position of the above substrate; the order of the above S2 and the above S3 can be swapped;

[0033] S4: The above position adjustment mechanism drives the above micro wiping head to wipe at the vacant position of the substrate;

[0034] S5: The above adsorption device sucks away the dropped impurities; the above S4 and the above S5 are carried out synchronously;

[0035] S6: The above second camera determines the dirt condition of the wiped vacant position of the substrate. If the cleaning is qualified, the reflow soldering process is carried out; if the cleaning is unqualified, S2 - S5 are repeated until the second camera determines that the cleaning is qualified.

[0036] The beneficial effects of the present invention are as follows:

[0037] The present invention provides a micro - LED cleaning device. After the defective die is desoldered, the camera device accurately locates the position of the vacant position on the substrate. Then, the position adjustment mechanism drives the mounting plate to move, so that the micro wiping head installed on the mounting plate drives the cleaning cloth to extend into the vacant position on the substrate for wiping, mechanically cleaning the impurities adhered to the substrate. After the impurities are separated from the substrate, they are sucked away by the adsorption device. The camera device determines the cleaning degree of the vacant position on the substrate. After passing the qualification, reflow soldering is carried out. If the determination is unqualified, cleaning is carried out again until the cleaning is qualified, ensuring the cleaning degree of the vacant position on the substrate. Compared with laser cleaning, it will not cause secondary adhesion, ensuring thorough cleaning and thus ensuring the effect of reflow soldering.

[0038] The present invention also provides an LED repair system. By adopting the above - mentioned micro - LED cleaning device, the cleaning effect of the vacant position on the substrate is good, and the reflow soldering success rate is high.

[0039] The present invention also provides a cleaning method. By adopting the above - mentioned micro - LED cleaning device, the impurities at the vacant position on the substrate can be accurately and mechanically cleaned, avoiding the adhesion of impurities to the substrate, ensuring that the impurities are sucked away, improving the cleaning effect, and ensuring the success of reflow soldering. Description of the Drawings

[0040] Figure 1 is a schematic structural diagram of an LED provided by an embodiment of the present invention;

[0041] Figure 2 is a schematic structural diagram of a micro - LED cleaning device provided by an embodiment of the present invention;

[0042] Figure 3 is a schematic structural diagram of a wiping head mechanism provided by an embodiment of the present invention.

[0043] In the figure:

[0044] 10. Cleaning device; 12. Mounting plate; 13. Unwinding mechanism; 131. Cleaning cloth; 132. Discharging roller; 133. Rewinding roller; 134. Auxiliary roller; 11. Rubbing head mechanism; 111. First mounting member; 112. Rubbing head assembly; 1121. Micro rubbing head; 11211. Body part; 112111. Through hole; 11212. Convex part; 1122. Second mounting member; 1123. Guide member; 1124. Limiting member; 1125. Connecting member; 11251. First connecting member; 11252. Second connecting member; 11253. Third connecting member; 1126. Elastic member; 1127. Sealing ring; 1128. Third mounting member; 113. Tightening adjustment driving member;

[0045] 20. Filling mechanism; 21. Filling container; 22. Connecting pipe;

[0046] 200. LED; 210. Substrate; 211. Substrate vacancy; 220. Chiplet. Detailed implementation manners

[0047] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only the parts related to the present invention are shown in the drawings, rather than all the structures.

[0048] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0049] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is at a higher horizontal height than the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is at a lower horizontal height than the second feature.

[0050] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings. They are only for the convenience of description and simplifying the operations, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0051] As Figure 1 shown, the LED 200 includes a substrate 210 and a plurality of die chips 220 regularly arranged thereon. The die chips 220 are carried by pads (not shown in the figure) and mounted on the substrate 210. Due to the large number of die chips 220, it is inevitable that some die chips 220 are defective before leaving the factory. Therefore, the LED 200 must detect the defective die chips 220 before leaving the factory and remove them. After the defective die chips 220 are removed, substrate vacancies 211 are formed on the substrate 210. New die chips 220 are soldered to the substrate vacancies 211 to ensure that all the die chips 220 in the LED 200 operate normally.

[0052] However, after the defective die chips 220 are desoldered and removed, a large amount of foreign matters and flux residues left during desoldering and previous soldering often remain on the substrate vacancies 211 and the corresponding pads. If new die chips 220 are directly soldered, the uneven heating of the solder paste caused by the presence of impurities and flux makes it difficult to melt, resulting in insecure soldering. In severe cases, the repair of the LED 200 fails. Laser cleaning will cause a small amount of impurities to adhere to the substrate 210 or the pads after being charred, and the cleaning effect is still not ideal.

[0053] To solve the above problems, this embodiment provides a micro-LED cleaning device, which can accurately and mechanically clean the impurities in the substrate vacancies 211, avoid the adhesion of impurities to the substrate 210, ensure that the impurities are adsorbed away, improve the cleaning effect, and ensure the success of soldering repair. Specifically, as Figure 2As shown in the figure, the micro-LED cleaning device includes a camera device, a suction device, and a cleaning device 10. The camera device is used to locate the substrate vacancy 211 and determine the cleaning degree of the substrate vacancy 211. The suction device is used to suck away impurities. The cleaning device 10 includes a position adjustment mechanism, a mounting plate 12, a cloth feeding mechanism 13, and a wiping head mechanism 11. The position adjustment mechanism is communicatively connected to the camera device. The mounting plate 12 is installed at the output end of the position adjustment mechanism. The cloth feeding mechanism 13 is installed on the mounting plate 12. The cloth feeding mechanism 13 includes a cleaning cloth 131 that is intermittently conveyed. The wiping head mechanism 11 includes a first mounting member 111 and a wiping head assembly 112. The first mounting member 111 is connected to the mounting plate 12. The wiping head assembly 112 includes a micro wiping head 1121 provided at the free end of the wiping head assembly 112. The size of the free end of the micro wiping head 1121 is smaller than the size of the substrate vacancy 211. The micro wiping head 1121 is drivingly connected to the first mounting member 111. The micro wiping head 1121 can be pressed against the cleaning cloth 131. The position adjustment mechanism can adjust the positions of the micro wiping head 1121 and the cleaning cloth 131. Through the above settings, after the defective die 220 is desoldered, the camera device accurately locates the position of the substrate vacancy 211. Then, the position adjustment mechanism drives the mounting plate 12 to move, so that the micro wiping head 1121 mounted on the mounting plate 12 drives the cleaning cloth 131 to extend into the substrate vacancy 211 for wiping, and the impurities adhered to the substrate 210 are removed by mechanical means. After the impurities are separated from the substrate 210, they are sucked away by the suction device. The camera device determines the cleaning degree of the substrate vacancy 211. After passing the inspection, re-soldering is performed. If the inspection fails, cleaning is performed again until the cleaning is qualified, ensuring the cleaning degree of the substrate vacancy 211. Compared with laser cleaning, it will not cause secondary adhesion, ensuring thorough cleaning, and thus ensuring the effect of re-soldering.

[0054] Among them, the suction device is a suction pipe connected to a negative pressure generator, which can suck away the impurities separated from the substrate 210 synchronously with the cleaning of the cleaning device 10. This is a conventional setting in the prior art and will not be elaborated here. The camera device (not shown in the figure) includes a first camera and a second camera. The first camera is used to locate the substrate vacancy 211, and the second camera is used to determine the dirt condition of the substrate vacancy 211 after desoldering. The position adjustment mechanism is communicatively connected to the first camera and the second camera respectively. Both the first camera and the second camera are vision positioning cameras, and their structures and operation methods are all in the prior art and will not be elaborated here.

[0055] Optionally, the position adjustment mechanism is three mutually perpendicular linear drive modules to achieve the adjustment of the micro wiping head 1121 in the vertical direction and two horizontal directions. The linear drive module can also be a cylinder, which is not limited here. In other embodiments, the position adjustment mechanism can also be a multi-axis manipulator.

[0056] Optionally, as Figure 2As shown, the roller feeding mechanism 13 further includes a discharging roller 132, a material collecting roller 133, and an auxiliary roller 134 mounted on the mounting plate 12. The cleaning cloth 131 extends from the discharging roller 132, passes through the auxiliary roller 134 and the micro wiping head 1121, and is wound up by the material collecting roller 133. At least one of the discharging roller 132 and the material collecting roller 133 is connected with a rotary driving member to intermittently drive the discharging roller 132 or the material collecting roller 133 to rotate so as to intermittently move the cleaning cloth 131. When the cleaning cloth 131 located at the micro wiping head 1121 gets dirty, the cleaning cloth 131 moves to move the clean cleaning cloth 131 to the position of the micro wiping head 1121 for the next cleaning. Optionally, a plurality of auxiliary rollers 134 are provided to improve the tension of the cleaning cloth 131 and prevent the cleaning cloth 131 from piling up during movement.

[0057] Preferably, the relative position of the wiping head assembly 112 in the direction towards the cleaning cloth 131 and the first mounting member 111 is adjustable, so as to control the force of the wiping head assembly 112 against the cleaning cloth 131, and further adjust the tension of the cleaning cloth 131.

[0058] Optionally, as Figure 3 shown, the wiping head mechanism 11 further includes a tension adjusting driving member 113. The tension adjusting driving member 113 is mounted on the first mounting member 111, and the wiping head assembly 112 is mounted on the output end of the tension adjusting driving member 113. The tension adjusting driving member 113 can drive the wiping head assembly 112 to move along a preset direction. Through the above setting, the relative position of the wiping head assembly 112 and the first mounting member 111 is adjustable. In this embodiment, the preset direction is the vertical direction. In other embodiments, the preset direction can be adjusted according to the placement direction of the product and the direction of the cleaning surface.

[0059] Preferably, the tension adjusting driving member 113 is a slider cylinder. Compared with an ordinary cylinder, the slider cylinder has its own guiding function, has a compact structure, saves parts, and does not require an additional guide rail.

[0060] Preferably, as Figure 2 shown, an avoidance groove is formed on the mounting plate 12 so that a part of the wiping head mechanism 11 is located in the avoidance groove, reducing the size of the micro LED cleaning device in the vertical direction.

[0061] Preferably, as Figure 3As shown, the eraser head assembly 112 further includes a second mounting member 1122, a guiding member 1123, a limiting member 1124, a connecting member 1125, and an elastic member 1126. The second mounting member 1122 is mounted on the output end of the adjusting tension driving member 113; the guiding member 1123 extends along a preset direction and is mounted on the second mounting member 1122; the limiting member 1124 is mounted on one end of the guiding member 1123; the connecting member 1125 is slidably connected to the guiding member 1123, and the micro eraser head 1121 is connected to the connecting member 1125; the elastic member 1126 is disposed at the other end of the guiding member 1123 and can abut against the connecting member 1125. Through the above arrangement, when the cleaning cloth 131 is not installed on the micro LED cleaning device, the connecting member 1125 is limited at the limiting member 1124 to prevent the connecting member 1125 and the micro eraser head 1121 from falling off. After the cleaning cloth 131 is installed, the cleaning cloth 131 is tightened to make the micro eraser head 1121 move towards the elastic member 1126, so that the elastic member 1126 is compressed to provide a reaction force to the cleaning cloth 131. That is, during the cleaning process, the micro eraser head 1121 is in a floating state under the reaction force of the elastic member 1126, and the wiping force of the micro eraser head 1121 on the substrate vacancy 211 is also appropriately adjusted, avoiding excessive impact on the substrate 210 caused by the movement of the position adjustment mechanism, reducing the adjustment accuracy of the position adjustment mechanism in the preset direction, and at the same time ensuring the cleaning force; in addition, based on the setting of the adjusting tension driving member 113, the elastic member 1126 can be appropriately compressed or relaxed to adjust the initial wiping force on the substrate 210, ensuring that the initial wiping force and cleaning force are suitable for substrates 210 with different strengths or substrates 210 with different degrees of dirtiness.

[0062] Optionally, the eraser head assembly 112 further includes a third mounting member 1128. The third mounting member 1128 is mounted on the second mounting member 1122 and is located at one end of the guiding member 1123, and the elastic member 1126 is mounted on the third mounting member 1128 to realize the installation of the elastic member 1126. In other embodiments, the second mounting member 1122 and the third mounting member 1128 can be integrally formed into an L shape, which can also realize the installation of the elastic member 1126, and this is not limited herein.

[0063] Optionally, as Figure 3As shown, the connecting member 1125 includes a first connecting member 11251, a second connecting member 11252, and a third connecting member 11253. The first connecting member 11251 is slidably connected to the guiding member 1123. The second connecting member 11252 is mounted on the first connecting member 11251. The elastic member 1126 abuts against the second connecting member 11252. The third connecting member 11253 is mounted on the second connecting member 11252. The micro wiping head 1121 is connected to the third connecting member 11253. Through the above arrangement, the third connecting member 11253 provides a large mounting surface for the micro wiping head 1121, and the second connecting member 11252 provides a suitable position for the elastic member 1126 to abut. Of course, the first connecting member 11251 and the second connecting member 11252 can also be integrally provided, or the three can be integrally provided, which are not limited herein.

[0064] Preferably, the connecting member 1125 is detachably connected to the micro wiping head 1121, and different-sized micro wiping heads 1121 can be replaced to adapt to different-sized substrate vacancies 211. Specifically, the third connecting member 11253 and the micro wiping head 1121 are connected by screws.

[0065] Preferably, as Figure 2 and Figure 3 shown, the micro LED cleaning device further includes a filling mechanism 20. The filling mechanism 20 includes a filling container 21. A through hole 112111 is formed in the micro wiping head 1121. One end of the through hole 112111 can abut against the cleaning cloth 131. The filling container 21 is communicated with the through hole 112111. The filling container 21 can intermittently release a cleaning agent into the through hole 112111. Through the above arrangement, the cleaning ability of the cleaning cloth 131 is improved.

[0066] Preferably, the cleaning agent is a volatile cleaning agent, that is, the cleaning agent will not remain on the substrate 210 after wiping, preventing the cleaning agent from causing secondary pollution to the substrate 210, and the cleaning agent will not adhere to impurities to cause the situation where the impurities cannot be sucked away. In this embodiment, the cleaning agent is alcohol. In other embodiments, the cleaning agent can also be other volatile liquids, which are not limited herein. Optionally, as Figure 2 and Figure 3 shown, the filling container 21 and the through hole 112111 are communicated through a connecting pipe 22. The connecting pipe 22 includes a fixed pipe and a flexible pipe. The fixed pipe is arranged on the third connecting member 11253 and is communicated with the through hole 112111. The flexible pipe is communicated between the fixed pipe and the filling container 21.

[0067] Preferably, the through hole 112111 is a stepped hole. The wiping head assembly 112 further includes a sealing ring 1127. The sealing ring 1127 is placed on the stepped surface of the stepped hole to seal between the third connecting member 11253 and the micro wiping head 1121, preventing the volatile cleaning agent from volatilizing between the two.

[0068] Preferably, the micro wiper 1121 includes a body portion 11211 and a convex portion 11212. The convex portion 11212 protrudes from the body portion 11211 and has a size smaller than that of the substrate vacancy 211. A through hole 112111 is formed in the body portion 11211. One end of the through hole 112111 is located on the circumferential side of the convex portion 11212. The free end of the convex portion 11212 is a smooth spherical surface. With the above arrangement, the convex portion 11212 precisely wipes the substrate vacancy 211, better controlling the wiping range, and the smooth spherical surface reduces the friction force on the cleaning cloth 131.

[0069] This embodiment also provides an LED repair system, which includes a defective die disassembling device and the above-mentioned micro LED cleaning device. The defective die 220 is removed from the substrate 210 by the defective die disassembling device to form a substrate vacancy 211, and the micro LED cleaning device is used to clean the impurities on the substrate vacancy 211. By adopting the above-mentioned micro LED cleaning device, the cleaning effect of the substrate vacancy 211 is good and the reflow soldering success rate is high.

[0070] This embodiment also provides a cleaning method, which adopts the above-mentioned micro LED cleaning device. Specifically, the cleaning method includes:

[0071] S1: The first camera calibrates the substrate vacancy 211; accurately positioning the substrate vacancy 211.

[0072] S2: The filling mechanism 20 fills a preset amount of cleaning agent into the cleaning cloth 131; in this embodiment, the filling amount is 1 ml, and the filling amount is controlled by the filling container 21. In other embodiments, the filling amount can be adaptively adjusted according to the demand of the cleaning cloth 131.

[0073] S3: The position adjusting mechanism drives the substrate 210 to move so that the micro wiper 1121 reaches the substrate vacancy 211; the order of S2 and S3 can be interchanged;

[0074] S4: The position adjusting mechanism drives the micro wiper 1121 to wipe at the substrate vacancy 211;

[0075] S5: The adsorption device sucks away the fallen impurities; S4 and S5 are carried out synchronously;

[0076] S6: The second camera determines the dirt condition of the wiped substrate vacancy 211. If the cleaning is qualified, the reflow soldering process is carried out; if the cleaning is unqualified, S2 - S5 are repeated until the second camera determines that the cleaning is qualified.

[0077] By using the above-mentioned micro-LED cleaning device, the cleaning method can accurately and mechanically clean the impurities in the vacant position 211 of the substrate, avoid the adhesion of impurities to the substrate 210, ensure that the impurities are adsorbed and removed, improve the cleaning effect, and ensure the success of rework soldering.

[0078] Preferably, the camera device further includes a third camera, which is used to monitor the state of the die 220 after rework soldering. If the rework soldering is qualified, the repair process is ended. If it is unqualified, the die 220 after rework soldering is desoldered and then re-enters the cleaning process and is reworked soldered again.

[0079] Obviously, the above-mentioned embodiments of the present invention are only examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A micro LED cleaning device for cleaning a substrate vacant position (211) on a substrate (210) after desoldering a defective core particle (220), It is characterized in that The micro LED cleaning device comprises a camera device, an adsorption device and a cleaning device (10), wherein the camera device is used to locate a substrate vacant position (211) and determine the degree of cleanliness of the substrate vacant position (211), the adsorption device is used to absorb impurities, and the cleaning device (10) comprises: A position adjustment mechanism, communicatively connected to the camera device; A mounting plate (12) mounted on the output end of the position adjustment mechanism; A roller placing mechanism (13) is mounted on the mounting plate (12), wherein the roller placing mechanism (13) comprises a cleaning cloth (131) that is intermittently conveyed; and A wiping head mechanism (11), comprising a first mounting member (111) and a wiping head assembly (112), wherein the first mounting member (111) is connected to the mounting plate (12), the wiping head assembly (112) comprises a micro wiping head (1121) arranged at the free end of the wiping head assembly (112), the size of the free end of the micro wiping head (1121) being smaller than the size of the vacant position (211) of the substrate, the micro wiping head (1121) being transmission-connected to the first mounting member (111), the micro wiping head (1121) being able to press against the cleaning cloth (131), and the position adjustment mechanism being able to adjust the positions of the micro wiping head (1121) and the cleaning cloth (131); The relative position of the wiping head assembly (112) and the first mounting member (111) in the direction toward the cleaning cloth (131) is adjustable; The wiping head mechanism (11) further comprises a tension adjustment driving member (113), wherein the tension adjustment driving member (113) is mounted on the first mounting member (111), and the wiping head assembly (112) is mounted on an output end of the tension adjustment driving member (113), and the tension adjustment driving member (113) can drive the wiping head assembly (112) to move along a preset direction; The wiping head assembly (112) further comprises: A second mounting member (1122) is mounted on the output end of the tension adjustment driving member (113); A guide member (1123) extending along a preset direction and mounted on the second mounting member (1122); A limiting member (1124) is installed at one end of the guide member (1123); A connecting member (1125) is connected to the guide member (1123) in a sliding manner, and the micro-wiping head (1121) is connected to the connecting member (1125); and An elastic member (1126) is disposed at the other end of the guide member (1123) and is capable of abutting against the connecting member (1125); The connecting piece (1125) is detachably connected to the micro-wiping head (1121); The micro-LED cleaning device further includes a filling mechanism (20), the filling mechanism (20) includes a filling container (21), a through hole (112111) is formed on the micro-wiping head (1121), one end of the through hole (112111) can abut against the cleaning cloth (131), the filling container (21) is communicated with the through hole (112111), and the filling container (21) can intermittently release a cleaning agent into the through hole (112111); The micro-wiping head (1121) includes a main body portion (11211) and a convex portion (11212), the convex portion (11212) protrudes from the main body portion (11211) and its size is smaller than the size of the substrate vacancy (211), the through hole (112111) is formed on the main body portion (11211), one end of the through hole (112111) is located on the circumferential side of the convex portion (11212), and the free end of the convex portion (11212) is a smooth spherical surface.

2. The micro-LED cleaning device according to claim 1, characterized in that, The adjusting and tightening driving member (113) is a slider cylinder.

3. An LED repair system, including a defective die disassembling device, characterized in that, The LED repair system further includes the micro-LED cleaning device according to any one of claims 1-2. The defective die (220) is removed from the substrate (210) by the defective die disassembling device to form a substrate vacancy (211), and the micro-LED cleaning device is used to clean the impurities on the substrate vacancy (211).

4. A cleaning method, using the micro-LED cleaning device according to any one of claims 1-2, characterized in that, The camera device includes a first camera and a second camera. The first camera is used to locate the substrate vacancy (211), the second camera is used to determine the dirt condition of the substrate vacancy (211) after desoldering, and the position adjusting mechanism is respectively communicatively connected with the first camera and the second camera; the micro-LED cleaning device further includes a filling mechanism (20), the filling mechanism (20) can intermittently release a cleaning agent to the cleaning cloth (131), and the cleaning method includes: S1: The first camera calibrates the substrate vacancy (211); S2: The filling mechanism (20) fills a preset amount of the cleaning agent onto the cleaning cloth (131); S3: The position adjusting mechanism drives the substrate (210) to move so that the micro-wiping head (1121) reaches the substrate vacancy (211); The order of S2 and S3 can be exchanged; S4: The position adjusting mechanism drives the micro-wiping head (1121) to wipe at the substrate vacancy (211); S5: The adsorption device sucks away the fallen impurities; S4 and S5 are performed synchronously; S6: The second camera determines the dirt condition of the wiped substrate vacancy (211). If the cleaning is qualified, a re-soldering process is performed; if the cleaning is unqualified, S2-S5 are repeated until the second camera determines that the cleaning is qualified.

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