Semiconductor 12-inch 20nm and below process polishing liquid supply system and method

Abstract

The present invention relates to a system and method for supplying polishing liquid for semiconductor 12-inch and below 20nm processes, and belongs to the field of automation. The system includes a raw material conveying unit, an automatic acid mixing unit, a distribution valve box, a terminal valve box, and a filter valve box; the raw material conveying unit, the automatic acid mixing unit, the distribution valve box, and the terminal valve box are connected in sequence. The present invention can not only ensure a continuous, uninterrupted, and stable supply of polishing liquid, but also effectively prevent the crystallization and deposition of the polishing liquid. It effectively improves the wafer polishing yield and significantly increases production capacity. In addition, it can maintain the cleanliness of the polishing system, gently convey or process sensitive liquids, and provide accurate, stable, and reliable flow and pressure supply for the process.

Description

Technical Field

[0001] The present invention belongs to the field of automation and relates to a polishing liquid supply system and method for a semiconductor 12-inch below 20nm process. Background Art

[0002] Currently, there are few processes suitable for polishing slurries in semiconductor processes with a thickness of less than 20nm, and these processes place high demands on the production process, requiring a continuous and stable supply of polishing slurry while also preventing crystallization and deposition. As a result, the current wafer polishing yield and production capacity of polishing slurries in semiconductor processes with a thickness of less than 20nm are low. Furthermore, some types of polishing slurries place high demands on the flow rate of the supply system. Summary of the Invention

[0003] In view of this, an object of the present invention is to provide a polishing liquid supply system and method for semiconductor 12-inch and below 20nm processes.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] Semiconductor 12-inch 20nm and below process polishing liquid supply system, including raw material delivery unit, automatic acid mixing unit, distribution valve box, end valve box and filter valve box;

[0006] The raw material conveying unit, the automatic acid mixing unit, the distribution valve box and the terminal valve box are connected in sequence;

[0007] The distribution valve box is also connected to the filter valve box, and the filter valve box is connected to the chemical mechanical polishing (CMP) machine;

[0008] The raw material conveying unit, automatic acid mixing unit, distribution valve box, terminal valve box and filter valve box are connected by double-layer pipes. The inner pipe of the double-layer pipe is PFA pipe and the outer pipe is C-PVC transparent pipe.

[0009] The polishing liquid is delivered to the CMP machine through the distribution valve box and the filter valve box;

[0010] The raw material conveying unit is also connected to the pure water system, process cooling water supply and process cooling return water, and is also provided with a drainage interface;

[0011] The automatic acid mixing unit is also connected to the pure water system, process cooling water supply and process cooling return water, and is also provided with a hydrogen peroxide interface;

[0012] The distribution valve box is provided with a modular valve, one way in and one way out, and each outlet is equipped with a flow meter to detect the outlet flow; the distribution valve box is provided with a leakage sensor;

[0013] The terminal valve box is provided with a pressure regulating valve and a pressure sensor for pressure adjustment, and the terminal valve box is provided with a liquid leakage sensor;

[0014] Two groups of module valves and two groups of detachable filters are arranged in the filter valve box; a liquid leakage sensor is arranged in the filter valve box.

[0015] Optionally, pulleys are provided at the bottom of the raw material conveying unit and the automatic acid mixing unit, and the pulleys are provided with fixing buckles.

[0016] Optionally, interfaces of the raw material conveying unit, the automatic acid mixing unit, the distribution valve box, the terminal valve box and the filter valve box are provided with double redundancy.

[0017] Optionally, the upper covers of the distribution valve box, the terminal valve box and the filter valve box are provided with RFID tags.

[0018] A method for supplying polishing liquid for a semiconductor 12-inch process below 20 nm based on the supply system includes the following steps:

[0019] The grinding liquid raw material barrel is transported to the raw material delivery unit via a cart;

[0020] In the raw material conveying unit, a liquid extraction joint is connected to the raw material barrel, a liquid level detector is installed, and a TB airbag is evacuated with nitrogen. The grinding liquid in the raw material barrel flows into the TB airbag (made of a filter shell) on the corresponding pipeline inside the raw material conveying unit equipment by the siphon effect. The TB airbag is connected to the inlet end of the magnetic levitation pump (on the internal pipeline of the equipment, at the inlet pipe of the magnetic levitation pump), so that the inlet end of the magnetic levitation pump is filled with grinding liquid; the inlet end of the magnetic levitation pump is opened only when it is full of liquid; a vacuum breaking device is set at the highest point of the corresponding pipeline inside the equipment;

[0021] The TB airbag liquid level is detected. When it reaches the highest level, the magnetic levitation pump is turned on to transport the grinding liquid raw materials to the automatic acid mixing unit. The system is equipped with a wet nitrogen humidifier device, which adds wet nitrogen to the raw material barrel to ensure that the humidity in the raw material barrel reaches above 95% to prevent the grinding liquid from crystallizing and depositing. The system is equipped with a process cooling water PCW heat exchanger, which uses process cooling water for heat exchange to maintain the grinding liquid temperature at 24°C. The system is equipped with a pure water flushing device with water guns and air guns to flush the liquid extraction joints, pipes and valves. The waste liquid after flushing is discharged to the waste liquid collection pipe through a pneumatic pump and is detected for leakage at the same time. The raw liquid sampling device is used to sample the raw liquid.

[0022] In the automatic acid mixing unit, the grinding liquid raw material is delivered to the automatic acid mixing unit through the raw material delivery unit, the formula ratio is set, the pneumatic valve is opened, and the grinding liquid enters the mixing tank. The flow rate of the liquid is recorded by a flow meter, and the weight is recorded by a weighing sensor at the bottom of the mixing tank. A certain amount of hydrogen peroxide and pure water are added, and the mixture is stirred and mixed thoroughly. The magnetic levitation pump is turned on, and the mixed grinding liquid passes through a filter and a module valve, and then through a grinding liquid raw material bottom jet device and returns to the mixing tank. At the same time, the conductivity, specific gravity and concentration of the mixed liquid are detected by a hydrogen peroxide titrator. When all indicators are met, the module valve is switched to deliver the mixed grinding liquid to the distribution valve box.

[0023] Set up a temporary raw material supply system, push the raw material barrel to the automatic acid mixing unit with a cart, connect the liquid extraction joint, and transport it to the mixing tank through a pneumatic pump. Set the acid mixing ratio, mix the acid, and then transport it; install a vacuum breaker at the highest point;

[0024] The mixing tank is conical to prevent the grinding liquid from settling and crystallizing. The system is equipped with a wet nitrogen humidifier device, which adds wet nitrogen to the mixing tank to keep the humidity in the mixing tank above 95% to prevent the grinding liquid from crystallizing and depositing. The system is equipped with a PCW heat exchanger, which uses process cooling water for heat exchange to keep the grinding liquid temperature at 24°C. The system is equipped with a pure water flushing device, equipped with water guns and air guns to flush the mixing tank, liquid extraction joints, pipes and valves. The waste liquid after flushing is discharged to the waste liquid collection pipe through a pneumatic pump and is detected for leakage. The stock liquid sampling device is used to sample the stock liquid.

[0025] In the distribution valve box, the automatic acid mixing unit delivers the mixed grinding liquid to the distribution valve box. The distribution valve box is equipped with a modular valve with two inlets and two outlets. Each outlet is equipped with a flow meter to detect the outlet flow. The distribution valve box is also equipped with a leakage sensor to issue an alarm if leakage occurs.

[0026] In the terminal valve box, a terminal valve box is installed at the end of the distribution valve box of each liquid supply circuit. A pressure regulating valve and a pressure sensor are installed in the terminal valve box to adjust the system pressure. A leakage sensor is installed in the valve box to issue an alarm if leakage occurs.

[0027] In the filter valve box, the grinding liquid passes through the distribution valve box to the filter valve box, and two groups of module valves and two groups of detachable filters are installed in the filter valve box; a leakage sensor is installed in the valve box, and an alarm is issued if leakage occurs.

[0028] Optionally, the specific position of each valve box and whether there is leakage are obtained through the RFID tags on the distribution valve box, the terminal valve box and the filter valve box.

[0029] The beneficial effects of this invention include ensuring a continuous, uninterrupted, and stable supply of polishing fluid while effectively preventing crystallization and deposition. This effectively improves wafer polishing yield and significantly increases production capacity. Furthermore, it maintains the cleanliness of the polishing system, gently transports or processes sensitive liquids, and provides accurate, stable, and reliable flow and pressure supply for the process.

[0030] Other advantages, objects, and features of the present invention will be described in part in the following description and, in part, will be apparent to those skilled in the art upon examination of the following description or may be learned from practice of the present invention. The objects and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be described in detail below with reference to the accompanying drawings, in which:

[0032] Figure 1 This is a diagram of the system composition of the present invention;

[0033] Figure 2 This is a schematic diagram of a first embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the second embodiment of the present invention;

[0035] Figure 4 This is a structural diagram of the raw material conveying unit in the system of the present invention;

[0036] Figure 5 This is a flow chart of the raw material delivery unit in the system of the present invention;

[0037] Figure 6 This is a structural diagram of the automatic acid mixing unit in the system of the present invention;

[0038] Figure 7 This is a flow chart of the automatic acid mixing unit in the system of the present invention;

[0039] Figure 8 This is a structural diagram of the distribution valve box in the system of the present invention;

[0040] Figure 9 This is a flow chart of the distribution valve box in the system of the present invention;

[0041] Figure 10 This is a structural diagram of the terminal valve box in the system of the present invention;

[0042] Figure 11 This is a flow chart of the terminal valve box in the system of the present invention;

[0043] Figure 12 This is a structural diagram of the filter valve box in the system of the present invention;

[0044] Figure 13 This is a flow chart of the filter valve box in the system of the present invention. DETAILED DESCRIPTION

[0045] The following describes the embodiments of the present invention by means of specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and the following embodiments and features in the embodiments can be combined with each other without conflict.

[0046] Among them, the accompanying drawings are only for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limiting the present invention. In order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings may be omitted, enlarged or reduced, and do not represent the dimensions of actual products. For those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the accompanying drawings.

[0047] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "front", "back", etc. indicating directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0048] like Figure 1 As shown, the system includes a raw material conveying unit, an automatic acid mixing unit, a distribution valve box, a terminal valve box and a filter valve box;

[0049] The raw material conveying unit, the automatic acid mixing unit, the distribution valve box and the terminal valve box are connected in sequence;

[0050] The distribution valve box is also connected to the filter valve box, and the filter valve box is connected to a chemical mechanical polishing (CMP) machine.

[0051] Example 1

[0052] like Figure 2 As shown, the system includes 1 raw material conveying unit, 3 automatic acid mixing units, and 2 circuits output to the distribution valve box;

[0053] Each device is connected with an inner PFA tube and an outer C-PVC transparent tube, and the polishing liquid is delivered to the CMP machine through the distribution valve box and the filter valve box.

[0054] Example 2

[0055] like Figure 3 As shown, the system includes 1 raw material conveying unit, 6 automatic acid mixing units, and 4 circuits output to the distribution valve box;

[0056] Each device is connected with an inner PFA tube and an outer C-PVC transparent tube, and the grinding liquid is transported to the CMP machine through the distribution valve box and the filter valve box.

[0057] The appearance of the raw material conveying unit is as follows Figure 4 As shown, the box dimensions (mm): 2100 (W) x 2000 (H) (including wheels) x 1500 (D); frame material: 304 grade stainless steel, panel material: PVC (compliant with FM4910); panel thickness: ≧8mm.

[0058] like Figure 5 The figure shows a flow chart of the raw material delivery unit. A 200L barrel of grinding liquid is transported to the raw material delivery unit via a cart. A dedicated liquid extraction connector is connected to the barrel. A level sensor is installed, and a TB airbag is evacuated with nitrogen. The siphon effect draws the grinding liquid from the barrel into the TB airbag, which is then connected to the inlet of the magnetic levitation pump, filling it with grinding liquid. The magnetic levitation pump inlet must be filled with liquid before it can be opened. A vacuum breaker is installed at the highest point.

[0059] Two sets of raw material extraction and liquid supply systems are set up, including two raw material barrels and two magnetic levitation pumps. The pneumatic valve controls which system supplies the liquid. The redundant design improves the safety, reliability and stability of the system.

[0060] The TB airbag liquid level is detected. When it reaches the maximum level, the magnetic levitation pump is activated to transport the grinding liquid raw material to the automatic acid mixing unit. The system is equipped with a wet nitrogen humidifier, which adds wet nitrogen to the raw material barrel to increase the humidity to above 95% to prevent grinding liquid crystal deposition. The system is equipped with a dedicated heat exchanger for process cooling water (PCW), which uses process cooling water for heat exchange to maintain the grinding liquid temperature at 24°C. The system is equipped with a pure water flushing function, equipped with water and air guns to flush liquid extraction joints, pipes, valves, etc. The waste liquid after flushing is discharged to the waste liquid collection pipe through a pneumatic pump and is centrally discharged. A leak detection device is also installed in the system. The system is equipped with a raw liquid sampling device for raw liquid sampling.

[0061] The raw material conveying unit is controlled by a programmable logic controller (PLC). The touch screen displays the operation status in real time and is equipped with an alarm function. The control system power supply adopts a redundant design. The raw material conveying unit is equipped with an exhaust device.

[0062] The appearance of the automatic acid mixing unit is as follows Figure 6 As shown, the box size (mm): 1500 (W) x 2000 (H) (including wheels) x 1500 (D), frame material: 304 grade stainless steel, wall material: PVC (compliant with FM4910), board thickness: 8mm.

[0063] like Figure 7 The figure shows the flow chart of the automatic acid mixing unit. The grinding liquid raw materials are delivered to the automatic acid mixing unit through the raw material delivery unit. The formula ratio is set, and the pneumatic valve is opened to allow the grinding liquid to enter the 250L mixing tank. The flow rate of the liquid is recorded by the flow meter, and the weight is recorded by the weighing sensor at the bottom of the mixing tank. A certain amount of hydrogen peroxide and pure water are added, and the mixture is stirred and mixed thoroughly. The magnetic levitation pump is turned on, and the mixed grinding liquid passes through the filter, the module valve, and then the bottom spray device of the barrel and returns to the mixing tank. At the same time, the conductivity, specific gravity and concentration of the mixed liquid are detected by the hydrogen peroxide titrator. When all indicators are met, the module valve is switched to transport the mixed grinding liquid to the distribution valve box.

[0064] In addition, a temporary raw material supply system was set up. A cart pushed a 200L raw material barrel to the automatic acid mixing unit, connected a dedicated liquid extraction connector, and pumped it into the mixing tank via a pneumatic pump. The acid mixing ratio was also set, and the acid was mixed and then transported. A vacuum breaker was installed at the highest point.

[0065] The 250L mixing tank adopts a conical design to effectively prevent grinding fluid deposition and crystallization. The system is equipped with a wet nitrogen humidifier, which adds wet nitrogen to the mixing tank to maintain humidity above 95%, preventing grinding fluid crystallization and deposition. The system is equipped with a PCW-specific heat exchanger, which uses process cooling water for heat exchange to maintain the grinding fluid temperature at 24°C. The system is equipped with a pure water flushing function, equipped with water and air guns to flush the mixing tank, liquid extraction joints, pipes, valves, etc. The waste liquid after flushing is discharged to the waste liquid collection pipe through a pneumatic pump and is equipped with a leak detection device. The system is equipped with a raw liquid sampling device for raw liquid sampling.

[0066] The automatic acid mixing unit is controlled by a programmable logic controller (PLC). The touch screen displays the operation status and real-time display of the working status, sets the formula ratio, and has an alarm function. The control system power supply adopts a redundant design. The automatic acid mixing unit is equipped with an exhaust device.

[0067] The appearance of the distribution valve box is as follows Figure 8As shown, the box material is PVC (compliant with FM4910); size (mm): 500 (L) x 300 (D) x 200 (H), box thickness: 8mm, transparent cover thickness: 8mm.

[0068] like Figure 9 Figure 2 shows a flow chart of the distribution valve box. The automatic acid mixing unit delivers the mixed grinding fluid to the distribution valve box, which is equipped with a modular valve with two inlets and two outlets. Each outlet is equipped with a flow meter to detect the outlet flow rate. A leak sensor is also installed in the distribution valve box. If a leak occurs, it will sound an alarm and notify the operator.

[0069] The valve box cover is equipped with a rewritable RFID tag, so the operator can clearly know the specific location of each valve box, whether there is any leakage, and deal with it in time.

[0070] The shape of the terminal valve box is as follows Figure 10 As shown, material: PVC, board thickness: 8mm, in line with FM4910, size (mm): 600(D)x420(W)x 200(H), front transparent cover (CPVC), board thickness: 8mm.

[0071] like Figure 11 The figure shows a flow chart of the terminal valve box. Each liquid supply circuit has a terminal valve box installed at the end of the distribution valve box. The terminal valve box is equipped with a pressure regulating valve and pressure sensor to adjust the system pressure. A leakage sensor is installed in the valve box to sound an alarm and notify the operator if a leakage occurs.

[0072] The valve box cover is equipped with a rewritable RFID tag, so the operator can clearly know the specific location of each valve box, whether there is any leakage, and deal with it in time.

[0073] The filter valve box looks like Figure 12 As shown, material: PVC, board thickness: 8mm, in line with FM4910, size (mm): 550x450x200, front transparent cover (CPVC) board thickness: 8mm.

[0074] like Figure 13 The figure shows the flow chart of the filter valve box. The grinding liquid passes through the distribution valve box to the filter valve box, which is equipped with two sets of modular valves and two sets of removable filters. The valve box is also equipped with a leakage sensor. If a leakage occurs, an alarm will be issued to notify the operator.

[0075] The valve box cover is equipped with a rewritable RFID tag, so the operator can clearly know the specific location of each valve box, whether there is any leakage, and deal with it in time.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solutions, which should all be included in the scope of the claims of the present invention.

Claims

1. A method for supplying polishing liquid for a semiconductor process with a thickness below 20 nm and a 12-inch thickness, characterized by: The supply method is based on a semiconductor 12-inch 20nm or less process polishing liquid supply system, which includes a raw material delivery unit, an automatic acid mixing unit, a distribution valve box, an end valve box and a filter valve box; The raw material conveying unit, the automatic acid mixing unit, the distribution valve box and the terminal valve box are connected in sequence; The distribution valve box is also connected to the filter valve box, and the filter valve box is connected to the chemical mechanical polishing (CMP) machine; The raw material conveying unit, automatic acid mixing unit, distribution valve box, terminal valve box and filter valve box are connected by double-layer pipes. The inner pipe of the double-layer pipe is PFA pipe and the outer pipe is C-PVC transparent pipe. The polishing liquid is delivered to the CMP machine through the distribution valve box and the filter valve box; The raw material conveying unit is also connected to the pure water system, process cooling water supply and process cooling return water, and is also provided with a drainage interface; The automatic acid mixing unit is also connected to the pure water system, process cooling water supply and process cooling return water, and is also provided with a hydrogen peroxide interface; The distribution valve box is provided with a modular valve, two inlets and two outlets, and each outlet is equipped with a flow meter to detect the outlet flow; the distribution valve box is provided with a leakage sensor; The terminal valve box is provided with a pressure regulating valve and a pressure sensor for pressure adjustment, and the terminal valve box is provided with a liquid leakage sensor; The filter valve box is provided with two sets of modular valves and two sets of detachable filters; the filter valve box is provided with a liquid leakage sensor; The supply method comprises the following steps: The grinding liquid raw material barrel is transported to the raw material delivery unit via a cart; The raw material conveying unit is connected to the raw material barrel with a liquid extraction joint, and a liquid level detector is installed. The TB airbag is evacuated with nitrogen, and the grinding liquid in the raw material barrel flows into the TB airbag on the corresponding pipeline inside the raw material conveying unit equipment by the siphon effect. The TB airbag is connected to the inlet end of the magnetic levitation pump, so that the inlet end of the magnetic levitation pump is filled with grinding liquid; the inlet end of the magnetic levitation pump is opened only when it is full of liquid; a vacuum breaking device is installed at the highest point of the corresponding pipeline inside the equipment; The TB airbag liquid level is detected. When it reaches the highest level, the magnetic levitation pump is turned on to transport the grinding liquid raw materials to the automatic acid mixing unit. The system is equipped with a wet nitrogen humidifier device, which adds wet nitrogen to the raw material barrel to ensure that the humidity in the raw material barrel reaches above 95% to prevent the grinding liquid from crystallizing and depositing. The system is equipped with a process cooling water PCW heat exchanger, which uses process cooling water for heat exchange to maintain the grinding liquid temperature at 24°C. The system is equipped with a pure water flushing device with water guns and air guns to flush the liquid extraction joints, pipes and valves. The waste liquid after flushing is discharged to the waste liquid collection pipe through a pneumatic pump and is detected for leakage at the same time. The raw liquid sampling device is used to sample the raw liquid. In the automatic acid mixing unit, the grinding liquid raw material is delivered to the automatic acid mixing unit through the raw material delivery unit, the formula ratio is set, the pneumatic valve is opened, and the grinding liquid enters the mixing tank. The flow rate of the liquid is recorded by a flow meter, and the weight is recorded by a weighing sensor at the bottom of the mixing tank. A certain amount of hydrogen peroxide and pure water are added, and the mixture is stirred and mixed thoroughly. The magnetic levitation pump is turned on, and the mixed grinding liquid passes through a filter and a module valve, and then through a spray device at the bottom of the grinding liquid raw material barrel, and returns to the mixing tank. At the same time, the conductivity, specific gravity and concentration of the mixed liquid are detected by a hydrogen peroxide titrator. When all indicators are met, the module valve is switched to deliver the mixed grinding liquid to the distribution valve box. Set up a temporary raw material supply system, push the raw material barrel to the automatic acid mixing unit with a cart, connect the liquid extraction joint, and transport it to the mixing tank through a pneumatic pump. Set the acid mixing ratio, mix the acid, and then transport it. Install a vacuum breaker at the highest point of the temporary raw material supply system pipeline inside the equipment; The mixing tank is conical to prevent the grinding liquid from settling and crystallizing. The system is equipped with a wet nitrogen humidifier device, which adds wet nitrogen to the mixing tank to keep the humidity in the mixing tank above 95% to prevent the grinding liquid from crystallizing and depositing. The system is equipped with a PCW heat exchanger, which uses process cooling water for heat exchange to keep the grinding liquid temperature at 24°C. The system is equipped with a pure water flushing device, equipped with water guns and air guns to flush the mixing tank, liquid extraction joints, pipes and valves. The waste liquid after flushing is discharged to the waste liquid collection pipe through a pneumatic pump and is detected for leakage. The stock liquid sampling device is used to sample the stock liquid. In the distribution valve box, the automatic acid mixing unit delivers the mixed grinding liquid to the distribution valve box. The distribution valve box is equipped with a modular valve with two inlets and two outlets. Each outlet is equipped with a flow meter to detect the outlet flow. The distribution valve box is also equipped with a leakage sensor to issue an alarm if leakage occurs. In the terminal valve box, a terminal valve box is installed at the end of the distribution valve box of each liquid supply circuit. A pressure regulating valve and a pressure sensor are installed in the terminal valve box to adjust the system pressure. A leakage sensor is installed in the valve box to issue an alarm if leakage occurs. In the filter valve box, the grinding liquid passes through the distribution valve box to the filter valve box, and two groups of module valves and two groups of detachable filters are installed in the filter valve box; a leakage sensor is installed in the valve box, and an alarm is issued if leakage occurs.

2. The method for supplying polishing liquid for a semiconductor process with a thickness below 20 nm in a 12-inch process according to claim 1, wherein: The bottom of the raw material conveying unit and the automatic acid mixing unit is provided with pulleys, and the pulleys are provided with fixing buckles.

3. The method for supplying polishing liquid for a semiconductor process with a thickness below 20 nm in a 12-inch process according to claim 1, wherein: The interfaces of the raw material conveying unit, the automatic acid mixing unit, the distribution valve box, the terminal valve box and the filter valve box are provided with double redundancy.

4. The method for supplying polishing liquid for a semiconductor process with a thickness below 20 nm in a 12-inch process according to claim 1, wherein: The upper covers of the distribution valve box, the terminal valve box and the filter valve box are provided with RFID tags.

5. The method for supplying polishing liquid for a semiconductor process with a thickness below 20 nm in a 12-inch process according to claim 1, wherein: The specific position of each valve box and whether there is leakage are obtained through the RFID tags on the distribution valve box, the terminal valve box and the filter valve box.

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