Headset housing and method of making same, and headset

By performing surface treatment and 3D printing to form feature parts on a magnesium alloy substrate, combined with laser melting and riveting, the problems of high cost and long production cycle of head-mounted device shells have been solved, achieving rapid and low-cost lightweight shell preparation.

CN115891134BActive Publication Date: 2025-11-11GEER TECH CO LTD
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Patent Information

Application Number
CN202211170152.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-09-22
Publication Date
2025-11-11
Estimated Expiration
2042-09-22

AI Technical Summary

Technical Problem

Existing technologies require high-precision molds to manufacture head-mounted device housings, resulting in high costs and long lead times, making them unsuitable for mass production and difficult to quickly produce lightweight housings with distinctive structures.

Method used

The main body is formed by surface treatment of a magnesium alloy substrate, and vertical plastic features are formed by 3D printing. The features are then mechanically riveted by laser melting, avoiding the need for expensive high-precision molds.

Benefits of technology

It enables efficient and low-cost fabrication of head-mounted device housings, improves the precision and strength of feature parts, is suitable for lightweight housings with complex shapes, and reduces product development costs and time.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a head-mounted device housing, its manufacturing method, and a head-mounted device. The head-mounted device housing includes a main body and a feature portion, wherein the protrusion direction of the feature portion is perpendicular to the surface of the main body. The manufacturing method includes providing a metal substrate, performing surface treatment on the metal substrate to form the main body, and forming the feature portion by 3D printing along the extension direction of the main body to obtain the head-mounted device housing. The manufacturing method of this invention can quickly and cost-effectively produce the head-mounted device housing.
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Description

Technical Field

[0001] This invention relates to the field of head-mounted device technology, and particularly to a head-mounted device housing, a method for manufacturing the same, and a head-mounted device. Background Technology

[0002] With the development of communication technologies, AR / VR products, representing wearable computers, have emerged. They are small in size yet powerful in function, more portable, and offer a better user experience. Because the human head is highly sensitive to the weight of wearable products, thin-walled metal materials, especially magnesium alloys, are widely used to reduce the weight of microelectronic devices. As the lightest metal structural material, magnesium alloys have low density and moderate strength, and are widely used in consumer electronics casings and internal supports.

[0003] For structural components, it is unavoidable to create some feature structures in the vertical direction on the surface of the component, such as small cylinders or cubes, mainly for positioning, snap-fitting, or mating structures of metal parts. These feature structures are often relatively large in the thickness direction, while the overall thickness of thin-walled metal parts is limited in this direction. Therefore, the common practice is to combine magnesium alloys with polymers through adhesive bonding or nano-injection molding processes. The former involves fabricating a structural plastic cylinder, positioning it with a precision mold, applying adhesive, and bonding it to a magnesium alloy with nano- or micro-sized pores formed on the surface. The latter involves forming nano-sized pores on the metal surface, positioning it with a precision mold, and directly injecting high-temperature plastic onto the metal surface to form a mechanical riveting. However, both require the cooperation of precision molds, resulting in high manufacturing costs and long cycles, making them unsuitable for research and development and prototype development work before mass production. Summary of the Invention

[0004] The main objective of this invention is to provide a method for manufacturing a head-mounted device housing, which aims to produce the head-mounted device housing quickly and at low cost.

[0005] To achieve the above objectives, the head-mounted device housing proposed in this invention includes a main body and a feature portion, and the manufacturing method includes:

[0006] A metal substrate is provided, and the surface of the metal substrate is treated to form the main body;

[0007] The feature portion is formed on the surface of the main body by 3D printing, wherein the protrusion direction of the feature portion is perpendicular to the extension direction of the main body, thereby obtaining the head-mounted device housing.

[0008] In an optional embodiment, the metal matrix is ​​made of magnesium-aluminum alloy, magnesium-lithium alloy, or magnesium rare earth alloy.

[0009] In an optional embodiment, the surface treatment includes a roughening process to form a rough surface or a micro / nanopore structure on the surface of the body portion.

[0010] In an optional embodiment, the roughening treatment includes physical and / or chemical methods, wherein the physical method is mechanical polishing, and the chemical method is one or more of passivation, anodizing, and micro-arc oxidation.

[0011] In an optional embodiment, the surface treatment further includes degreasing, wherein the surface of the main body is first degreased and then roughened.

[0012] In an optional embodiment, the material of the feature portion is one of acrylonitrile-butadiene-styrene copolymer, polycarbonate, polyamide, polyphenylene sulfone, polyetheretherketone, epoxy resin, phenolic resin, polylactic acid, and photosensitive resin.

[0013] In an optional embodiment, the melting point of the material of the feature portion is less than or equal to 300°C;

[0014] And / or, the material used in 3D printing is either filament or powder.

[0015] In an optional embodiment, after the step of forming the feature portion on the surface of the main body by 3D printing, the method further includes:

[0016] The main body and the feature parts are passivated, anodized, or micro-arc oxidized.

[0017] The main body and the feature parts are painted.

[0018] In an optional embodiment, after the step of painting the main body and the feature portion, the method further includes:

[0019] The feature portion is precision machined to achieve an accuracy range of ±0.03mm.

[0020] The present invention also proposes a head-mounted device housing, the head-mounted device housing comprising a main body and a feature portion disposed on a surface of the main body, the head-mounted device housing being prepared using any of the head-mounted device housing manufacturing methods described above.

[0021] The present invention also proposes a head-mounted device, the head-mounted device comprising the head-mounted device housing as described above.

[0022] The technical solution of this invention provides a head-mounted device housing comprising a main body and feature parts. By combining a metal substrate with the feature parts made of 3D-printed plastic material and mechanically riveting them using laser melting, the resulting head-mounted device housing exhibits higher strength and higher precision in the feature parts, satisfying personalized customization requirements. This manufacturing method avoids the investment of numerous expensive high-precision molds, effectively reducing costs, and significantly improving manufacturing efficiency compared to manufacturing large parts entirely through 3D printing. Thus, it enables high-efficiency, rapid, and mass production with low processing costs and stable quality, making it particularly suitable for the fabrication of complex-shaped housings and internal feature parts in electronic products and other applications requiring lightweight construction. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a first embodiment of the head-mounted device housing of the present invention;

[0025] Figure 2 This is a schematic flowchart illustrating the steps of an embodiment of the method for manufacturing the housing of the head-mounted device of the present invention;

[0026] Figure 3 This is a schematic flowchart illustrating the steps of another embodiment of the method for manufacturing the housing of the head-mounted device of the present invention;

[0027] Figure 4 This is a schematic flowchart illustrating the steps of another embodiment of the method for manufacturing the housing of the head-mounted device of the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the head-mounted device housing according to a second embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the structure of the head-mounted device housing of the present invention, in embodiment three.

[0030] Figure 7 This is a structural schematic diagram of the head-mounted device housing prepared using existing methods in Comparative Example 4.

[0031] Explanation of icon numbers:

[0032] label name label name 1 Headset housing 13 Feature section 11 Main body 1” Headset housing

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0036] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0038] The present invention proposes a head-mounted device housing 1, which can be selected as the housing of a VR head-mounted device or the housing of an AR head-mounted device.

[0039] Reference Figure 1 and Figure 2 In an optional embodiment of the present invention, the head-mounted device housing 1 includes a main body portion 11 and a feature portion 13, and the manufacturing method includes:

[0040] Step S1: Provide a metal substrate and perform surface treatment on the metal substrate to form the main body 11;

[0041] Step S2: The feature portion 13 is formed on the surface of the main body 11 by 3D printing, wherein the protrusion direction of the feature portion 13 is perpendicular to the extension direction of the main body 11, thereby obtaining the head-mounted device housing 1.

[0042] Understandably, since the head-mounted device housing 1 is worn on the head, it needs to be lightweight to improve comfort. Therefore, for weight reduction, the thickness of the metal substrate selected in step S1 should not be too large, for example, the thickness should not exceed 5mm. A thin substrate should be selected, and the specific dimensions can be chosen according to the actual situation. Here, the metal substrate can be a sheet metal or a profile structure. The surface of the metal substrate used to form the feature part 13 can be flat or curved, without limitation. The specific material of the metal substrate can be magnesium alloy or aluminum alloy, etc., which have low density, moderate strength, and low price. The resulting head-mounted device housing 1 not only has good structural stability, but is also lightweight and low-cost, making it widely applicable.

[0043] Simultaneously, to facilitate manufacturing, the surface of the metal substrate is surface-treated to meet the conditions and requirements for 3D printing, thereby forming the required main body 11. This main body 11 is the main structure of the head-mounted device housing 1, serving a protective function. The surface treatment here can be cleaning or redesigning the surface structure to improve the bonding force with the feature part 13; no limitation is made here. Of course, before surface treatment, the size and shape of the metal substrate can also be adjusted, such as by cutting or bending, to achieve the required size and shape of the product.

[0044] In step S2, the feature portion 13 is formed by 3D printing and directly molded onto the surface of the main body 11, thereby making the feature portion 13 and the main body 11 an integral structure. Here, the feature portion 13 can be a protrusion structure for positioning, a snap-fit ​​structure for connection, or a track structure for limiting, etc., and is not limited here. Furthermore, the feature portion 13 is made of plastic and is formed perpendicular to the extension direction of the main body 11. For example, when the surface of the main body 11 is flat, the feature portion 13 is a structure grown normally to the surface it is on.

[0045] It should be noted that after the feature part 13 is formed by 3D printing, the head-mounted device housing 1 usually undergoes a series of post-processing steps to obtain the head-mounted device housing 1 required by the user, and it can be used after passing the inspection.

[0046] Understandably, the technical solution of this invention, the head-mounted device housing 1 includes a main body 11 and a feature portion 13. By combining a metal substrate with the feature portion 13 made of 3D-printed plastic material and mechanically riveting it using laser melting, the resulting head-mounted device housing 1 has higher strength and higher positioning accuracy of the feature portion 13, allowing for more flexible design and customization. It is highly efficient in scenarios involving the production of small feature portions 13. This manufacturing method avoids the investment of a large number of expensive high-precision molds, resulting in lower investment, faster response, and effectively reduced costs. Compared to manufacturing large parts entirely through 3D printing, it effectively improves overall manufacturing efficiency. Thus, it enables high-efficiency, rapid, and batch production with low processing costs and stable quality. It is particularly suitable for the production of complex-shaped housings and built-in feature portions 13 in electronic products and other products with lightweight requirements, significantly saving development costs and time for product engineering prototypes and improving efficiency.

[0047] In an optional embodiment, the metal matrix is ​​made of magnesium-aluminum alloy, magnesium-lithium alloy, or magnesium rare earth alloy.

[0048] Here, magnesium alloy is chosen as the metal matrix because it is the lightest metal structural material, which can further reduce the weight of the head-mounted device and improve the user experience. In this embodiment, the specific material selected for the metal matrix is ​​magnesium-aluminum alloy, magnesium-lithium alloy, or magnesium rare earth alloy, etc. These materials have a wide range of applications, higher structural strength, and are also lightweight, which can further reduce the weight of the head-mounted device shell 1.

[0049] In an optional embodiment, the surface treatment includes roughening to form a rough surface or micro / nanopore structure on the surface of the body portion 11.

[0050] In this embodiment, to improve the bonding strength, the surface treatment step includes roughening, that is, increasing the surface roughness of the metal substrate to form a rough surface or micro / nano porous structure, which can then bond with the nanoscale 3D printed material, improving the bonding strength between the feature portion 13 and the main body portion 11 to ensure the connection stability of the two. Here, roughening can be performed only on the surface or part of the structure where the feature portion 13 is formed on the main body portion 11, thereby improving processing efficiency. Of course, the entire metal substrate can also be roughened, thereby improving convenience.

[0051] In an optional embodiment, the roughening treatment includes physical and / or chemical methods, wherein the physical method is mechanical polishing, and the chemical method is one or more of passivation, anodizing, and micro-arc oxidation.

[0052] As is known, roughening treatment includes physical and chemical methods. To increase the surface roughness of the main body 11, both physical and chemical methods can be used to treat the metal substrate. For example, chemical treatment can be performed first, followed by physical treatment. Of course, mechanical polishing can be used alone, or one of the chemical methods, namely passivation, anodizing, or micro-arc oxidation, can be used alone. Alternatively, at least two of the chemical methods can be combined.

[0053] In an optional embodiment, the surface treatment further includes degreasing treatment, wherein the surface of the main body 11 is first degreased and then roughened.

[0054] It is understandable that when a metal substrate is made by die casting or other processes, some oil stains or grease will usually remain on the surface. Therefore, in this embodiment, before roughing, the metal substrate can be degreased. The degreasing substance used can be an alkaline substance or an active substance, etc., which is not limited here.

[0055] In an optional embodiment, the material of the feature portion 13 is one of acrylonitrile-butadiene-styrene copolymer, polycarbonate, polyamide, polyphenylene sulfone, polyetheretherketone, epoxy resin, phenolic resin, polylactic acid, and photosensitive resin.

[0056] In this embodiment, the material of the feature portion 13 can be an engineering material that is lightweight and high-strength, meeting the bonding strength requirements. Examples include acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polyamide (PA), polyphenylsulfone (PPSF), and polyether ether ketone (PEEK). The material of the feature portion 13 can also be a thermosetting plastic, such as epoxy resin or phenolic resin, which has high structural strength, good high-temperature resistance, and good structural stability. Alternatively, it can be a bioplastic, such as polylactic acid, which has high structural strength and is environmentally friendly, effectively reducing pollution. Of course, the material of the feature portion 13 can also be a photosensitive resin or other polymeric material, which produces a structure with high strength and toughness, a smooth surface, and high precision, further improving the processing accuracy of the feature portion 13.

[0057] In an optional embodiment, the melting point of the material of the feature portion 13 is less than or equal to 300°C; for example, acrylonitrile-butadiene-styrene copolymer (ABS) has a melting point of 170°C, and PC has a melting point of 230°C to 240°C, etc., so that the main body 11 will not be affected during the processing and printing of the feature portion 13, avoiding deformation of the main body 11 due to excessive temperature, and ensuring the structural stability of the head-mounted device housing 1. Optionally, the melting point of the material of the feature portion 13 is less than or equal to 250°C.

[0058] And / or, the material used in 3D printing is either filament or powder.

[0059] While ensuring the melting point of the material in feature part 13 meets the aforementioned temperature, selecting powder as the material form for 3D printing is more conducive to molding and offers greater flexibility. Furthermore, when the material has good sphericity, uniform particle size distribution, good flowability, and high bulk density, a better molded structure can be achieved. Of course, the material form used for 3D printing here can also be filament, which can be deposited using FDM technology.

[0060] Please refer to Figure 3 In an optional embodiment, after the step of forming the feature portion 13 on the surface of the main body portion 11 by 3D printing, the method further includes:

[0061] Step S3: Passivate, anodize, or micro-arc oxidize the main body 11 and the feature portion 13;

[0062] Step S4: Paint the main body 11 and the feature part 13.

[0063] To further improve the corrosion resistance of the head-mounted device housing 1, after the feature portion 13 is printed, the overall structure undergoes another surface treatment. This involves surface treatment of the main body 11, feature portion 13, and the connection between them. The surface treatment in step S3 can be a chemical process to meet various operating environments, such as passivation, anodizing, or micro-arc oxidation. Following this, the entire structure is then painted. This further improves the corrosion resistance of the head-mounted device housing 1, extends its service life, and enhances its appearance. Alternatively, painting can be performed directly after 3D printing. In other embodiments, after surface treatment of the overall structure, a protective film, such as a wear-resistant layer, is applied.

[0064] Please refer to Figure 4 In an optional embodiment, after step S4 of painting the main body 11 and the feature portion 13, the method further includes:

[0065] Step S5: Perform finishing on the feature portion 13 so that the accuracy range of the feature portion 13 reaches within ±0.03mm.

[0066] Here, after the overall painting is completed, feature 13 needs to be fitted with other structures, such as connecting holes, so its precision requirements are high. Therefore, feature 13 also needs to be precision machined to achieve a precision range within ±0.03mm, thereby meeting the requirements of the connecting structure. Here, precision machining can be carried out by CNC machining or manual machining on a lathe, etc., and is not limited here.

[0067] In summary, optionally, when using magnesium alloys for processing, the magnesium alloy undergoes surface treatment to form a clean and porous micro / nanopore structure, facilitating bonding with high-temperature plastics. Then, using 3D printing technology, the feature structure 13, composed of structural polymer material, is directly grown onto the surface of the magnesium alloy shell structure. Under the control of the 3D printing control mechanism, precise positioning of the printing position can be achieved. The bonding strength between the magnesium alloy and the plastic part is greater than 20 MPa, ensuring the strength of the head-mounted device shell 1 when fastened. The entire part is then subjected to anti-corrosion treatments such as passivation or micro-arc oxidation. Finally, the plastic feature structure on the magnesium alloy is CNC machined to the required dimensions and precision. This method features fast processing speed, no mold investment, low cost, high production efficiency, and controllable safety. It is particularly suitable for the rapid preparation of mechanical fastening parts for internal and external structural or functional components of magnesium alloy electronic products in small batches and with diverse product types. Compared with traditional bonding and nano-injection molding processes that rely on molds, this method has the advantages of low investment, fast response, and strong adaptability, which can greatly save the development cost and time of product engineering prototypes and improve efficiency.

[0068] Please refer to Figure 1 The present invention also proposes a head-mounted device housing 1, which includes a main body portion 11 and a feature portion 13 disposed on a surface of the main body portion 11. The head-mounted device housing 1 is manufactured using any of the head-mounted device housing manufacturing methods described above. Since the head-mounted device housing 1 adopts all the technical solutions of all the foregoing embodiments, it at least has the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be described in detail here.

[0069] The present invention also proposes a head-mounted device, which includes a head-mounted device housing 1 as described above, the specific structure of which refers to the foregoing embodiments. Since the head-mounted device adopts all the technical solutions of all the foregoing embodiments, it at least possesses the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be elaborated further here.

[0070] The head-mounted device of the present invention may be a VR head-mounted device, such as VR glasses or VR helmets, or an AR head-mounted device, such as AR glasses.

[0071] The manufacturing method of the head-mounted device housing 1 of the present invention will be described in detail below through specific embodiments.

[0072] Example 1

[0073] The structure of the head-mounted device housing 1 in this embodiment is shown in the attached figure. Figure 1 As shown, the head-mounted device housing 1, which has six cylinders on one surface of the AZ31 magnesium alloy substrate, is manufactured through the following steps:

[0074] 1. Surface treatment of magnesium alloys

[0075] The magnesium alloy substrate was immersed in an alkaline degreasing agent at 85℃ for 5 minutes. The degreasing agent consisted of 60 g / L NaOH, 20 g / L sodium phosphate, and 5 g / L Na₂CO₃. After degreasing, it was ultrasonicated with pure water for 3 minutes. The magnesium alloy substrate was then subjected to micro-arc oxidation treatment. The micro-arc oxidation electrolyte consisted of 15 g / L Na₂SiO₃, 9 g / L NaAlO₂, 2 g / L Na₂B₄O₇, 7 g / L C₆H₅Na₃O₇, 5 mL / L C₃H₈O₃, and 3 g / L NaOH. Electrical parameters: current density 15 A / dm³. 2 The frequency was 520 Hz, the duty cycle was 38%, the oxidation time was 15 min, and the electrolyte temperature was 25 ℃; it was then dried at 100 ℃ for 30 min before use.

[0076] 2. Plastic 3D Printing

[0077] The magnesium alloy substrate was fixed on the 3D printing stage. ABS resin filament was selected as the 3D printing material. The filament diameter was 1.7mm, the nozzle temperature was 250℃, and the printing speed was 40mm / min. A cylinder with a diameter of about 2mm and a height of about 5mm was printed.

[0078] 3. Machining

[0079] The six cylinders were machined to the required dimensions using CNC machining, while also meeting the precision requirements for fit.

[0080] 4. Testing

[0081] The composite structure prepared in Example 1 of this invention was subjected to a tensile test according to GB / T228.1-2010, and its tensile strength was measured to be 25 MPa. It was then subjected to a neutral salt spray corrosion test for 72 hours according to GB5938-36, followed by a tensile test, and the tensile strength was measured to be 23 MPa. The performance indicators of the magnesium alloy material prepared in Example 1 of this invention are detailed in Table 1.

[0082] Example 2

[0083] The structure of the head-mounted device housing 1 in this embodiment is shown in the attached figure. Figure 5 As shown, the head-mounted device housing 1, which has a through hole at the center of the LZ103 magnesium-lithium alloy substrate, is manufactured through the following steps:

[0084] 1. Surface treatment of magnesium-lithium alloys

[0085] The magnesium-lithium alloy substrate was sandblasted with 200-mesh quartz sand to obtain a rough surface, and then the magnesium-lithium alloy was passivated. The process was as follows: Na2SnO3 50g / L, Na4P2O7 45g / L, C2H3NaO2 8g / L, C2H3NaO2 6g / L, temperature 60℃, time 50min, and after passivation, it was dried at 80℃ for 30min for later use.

[0086] 2. Plastic 3D Printing

[0087] The magnesium-lithium alloy substrate is fixed on the 3D printing stage. PP filament is selected as the 3D printing material with a diameter of 0.5mm. The nozzle temperature is 230℃ and the printing speed is 25mm / min. A cylinder with a diameter of about 2mm and a height of about 5mm is printed in the middle of the magnesium-lithium alloy substrate.

[0088] 3. Machining

[0089] CNC machining is used to process plastics into the required dimensions and meet the precision requirements of the fit.

[0090] 4. Testing

[0091] The composite structure prepared in Example 2 of this invention was subjected to a tensile test according to GB / T228.1-2010, and its tensile strength was measured to be 32 MPa. It was then subjected to a neutral salt spray corrosion test for 72 hours according to GB5938-36, followed by a tensile test, and the tensile strength was measured to be 29 MPa. The performance indicators of the magnesium-lithium alloy material prepared in Example 2 of this invention are detailed in Table 1.

[0092] Example 3

[0093] The structure of the head-mounted device housing 1 in this embodiment is shown in the attached figure. Figure 6 As shown, the LZ91 magnesium-lithium alloy substrate has inverted buckles around its perimeter. The head-mounted device housing 1 with this structure is manufactured through the following steps:

[0094] 1. Surface treatment of magnesium-lithium alloys

[0095] The substrate was sanded and then immersed in an alkaline degreasing agent (10 g / L NaOH, 5 g / L Na₂CO₃) at 85°C for 5 minutes. After degreasing, it was ultrasonically treated with acetone for 3 minutes. The magnesium-lithium alloy substrate was then subjected to micro-arc oxidation. The micro-arc oxidation electrolyte consisted of 10 g / L Na₂SiO₃, 6 g / L KF, 6 g / L KOH, and 5 ml / L glycerol. The electrical parameters were: current density 3 A / dm³. 2 The oxidation process was carried out at a frequency of 400 Hz, a duty cycle of 30%, an oxidation time of 25 min, and an electrolyte temperature of 25 °C. The solution was then dried at 100 °C for 30 min before use.

[0096] 2. Plastic 3D Printing

[0097] The substrate is fixed on the 3D printing stage. PC filament is selected as the 3D printing material with a diameter of 1mm. The nozzle temperature is 150℃ and the printing speed is 16mm / min. A cuboid is printed in the middle of the magnesium-lithium alloy substrate.

[0098] 3. Machining

[0099] CNC machining is used to process plastics into the required dimensions and meet the precision requirements of the fit.

[0100] 4. Testing

[0101] The composite structure prepared in Example 3 of this invention was subjected to a tensile test according to GB / T228.1-2010, and its tensile strength was measured to be 28 MPa. It was then subjected to a neutral salt spray corrosion test for 72 hours according to GB5938-36, followed by another tensile test, and the tensile strength was measured to be 25 MPa. The performance indicators of the magnesium-lithium alloy material prepared in Example 3 of this invention are detailed in Table 1.

[0102] Comparative Example 4

[0103] The structure of the head-mounted device housing 1” in this embodiment is shown in the attached figure. Figure 7 As shown, the AZ91 magnesium alloy substrate has an inverted overhang, and the head-mounted device housing 1” of this structure is manufactured through the following steps:

[0104] 1. Magnesium alloy surface treatment

[0105] The substrate was sanded and then immersed in an alkaline degreasing agent (12 g / L NaOH, 13 g / L NaSO3) at 85°C for 5 minutes. After degreasing, it was ultrasonicated with anhydrous ethanol for 3 minutes. The magnesium alloy substrate was then subjected to micro-arc oxidation. The micro-arc oxidation electrolyte consisted of 12 g / L Na2SO4, 6 g / L NaF, and 5 ml / L acrylate. The electrical parameters were: current density 4 A / dm³. 2The oxidation process was carried out at a frequency of 450 Hz, a duty cycle of 35%, an oxidation time of 25 min, and an electrolyte temperature of 25 °C. Then, it was dried at 100 °C for 30 min before use.

[0106] 2. Nano-injection molding

[0107] The substrate is fixed on a 3D printing table, a special mold is made, and PP material is injected into the mold at 210℃ and 6MPa pressure. The mold is kept at this temperature for 20 minutes and then air-cooled to room temperature to obtain the part.

[0108] 4. Testing

[0109] The composite structure prepared in this comparative example was subjected to a tensile test according to GB / T228.1-2010, and its tensile strength was measured to be 23 MPa. It was then subjected to a neutral salt spray corrosion test for 72 hours according to GB5938-36, followed by a tensile test, and the tensile strength was measured to be 21 MPa. The performance indicators of the magnesium-lithium alloy material prepared in this comparative example are detailed in Table 1.

[0110] Table 1 Performance indicators of the composite materials prepared in the above embodiments

[0111] Example tensile strength Tensile strength after salt spray cost 1 25MPa 23MPa Low 2 32MPa 29MPa Low 3 28MPa 25MPa Low 4 23MPa 21MPa high

[0112] The method provided by this invention is simple and suitable for rapid industrial production. It is particularly applicable to the snap-fit ​​processing of complex-shaped shells and internal components with lightweight requirements, such as the magnesium alloy shells of small electronic products. It can reduce costs, improve efficiency, and produce quickly while ensuring structural strength.

[0113] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a head-mounted device housing, the head-mounted device housing comprising a main body and a feature portion, characterized in that, The feature portion is made of plastic and is used for positioning, snap-fitting, or mating structures of metal parts. The manufacturing method includes: A metal substrate is provided, and the metal substrate is surface treated to form the main body, wherein the surface treatment is a redesign of the surface structure; The feature portion is formed on the surface of the main body by 3D printing and then mechanically riveted by laser melting, wherein the protrusion direction of the feature portion is perpendicular to the extension direction of the main body, thus obtaining the head-mounted device housing; After the step of forming the feature portion on the surface of the main body by 3D printing, the method further includes: The main body and the feature parts are passivated, anodized, or micro-arc oxidized. The main body and the feature parts are painted. The feature portion is precision machined to achieve an accuracy range of ±0.03mm.

2. The method for manufacturing the housing of the head-mounted device as described in claim 1, characterized in that, The metal matrix is ​​made of magnesium-aluminum alloy, magnesium-lithium alloy, or magnesium-rare earth alloy.

3. The method for manufacturing the housing of the head-mounted device as described in claim 1, characterized in that, The surface treatment includes roughening to form a rough surface or micro / nanopore structure on the surface of the main body.

4. The method for manufacturing the head-mounted device housing as described in claim 3, characterized in that, The roughening treatment includes physical and / or chemical methods, wherein the physical method is mechanical polishing, and the chemical method is one or more of passivation, anodizing, and micro-arc oxidation.

5. The method for manufacturing the housing of the head-mounted device as described in claim 3, characterized in that, The surface treatment also includes degreasing, in which the surface of the main body is first degreased and then roughened.

6. The method for manufacturing the housing of the head-mounted device as described in claim 1, characterized in that, The material of the feature portion is one of acrylonitrile-butadiene-styrene copolymer, polycarbonate, polyamide, polyphenylene sulfone, polyetheretherketone, epoxy resin, phenolic resin, polylactic acid, and photosensitive resin.

7. The method for manufacturing the housing of the head-mounted device as described in claim 1, characterized in that, The melting point of the material of the feature part is less than or equal to 300°C; And / or, the material used in 3D printing is either filament or powder.

8. A housing for a head-mounted device, characterized in that, The head-mounted device housing includes a main body and a feature portion disposed on a surface of the main body, and the head-mounted device housing is manufactured using the head-mounted device housing manufacturing method according to any one of claims 1 to 7.

9. A head-mounted device, characterized in that, The head-mounted device includes the head-mounted device housing as described in claim 8.

Citation Information

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