An evaporation coating device and an evaporation coating method

Abstract

The present application discloses an evaporation coating device and an evaporation coating method. Among them, the evaporation coating device includes an evaporation coating chamber, and an entrance and exit is provided on one side of the evaporation coating chamber, and the entrance and exit is used for allowing a glass substrate and a mask plate to enter the evaporation coating chamber; an evaporation coating source is arranged in the evaporation coating chamber, and the evaporation coating source is located on the side surface of the evaporation coating chamber adjacent to or opposite to the entrance and exit; wherein, a rotation mechanism is arranged in the evaporation coating chamber, the rotation mechanism is located in the middle area of the evaporation coating chamber, and a magnet plate is arranged on the rotation mechanism, and the glass substrate and the mask plate are sequentially stacked on the magnet plate. By the above method, the present application can meet the fitting requirements of various products.

Description

Technical Field

[0001] This application relates to the technical field of evaporation coating, and particularly relates to an evaporation coating device and an evaporation coating method. Background Art

[0002] At the present stage, most OLED segment products use the evaporation coating method to position the light-emitting material onto the product. There are two implementation methods for this step: vertical evaporation coating and horizontal evaporation coating. Both methods use a mask plate to implement the positioning evaporation coating problem. Currently, both vertical evaporation coating and horizontal evaporation coating have the problem of mask plate mesh surface accumulation caused by gravity, resulting in abnormal evaporation coating. The difference is that there is a problem of poor adhesion in the middle position between the glass substrate and the mask plate in horizontal evaporation coating, and there is a problem of poor adhesion at the edge position between the glass substrate and the mask plate in vertical evaporation coating. Summary of the Invention

[0003] The main technical problem to be solved by this application is to provide an evaporation coating device and an evaporation coating method that can meet the adhesion requirements of various products and improve the evaporation coating effect.

[0004] To solve the above technical problem, the first technical solution adopted by this application is to provide an evaporation coating device. The evaporation coating device includes an evaporation coating chamber. An entrance and exit is provided on one side of the evaporation coating chamber, and the entrance and exit is used for the glass substrate and the mask plate to enter the evaporation coating chamber. An evaporation source is provided in the evaporation coating chamber, and the evaporation source is located on the side surface of the evaporation coating chamber adjacent to or opposite to the entrance and exit. Among them, a rotation mechanism is provided in the evaporation coating chamber, the rotation mechanism is located in the middle area of the evaporation coating chamber, and a magnet plate is provided on the rotation mechanism. The glass substrate and the mask plate are sequentially stacked on the magnet plate.

[0005] Among them, a alignment mechanism is provided at a position in the evaporation coating chamber close to the entrance and exit.

[0006] Among them, an evaporation source is provided on each of the two side surfaces of the evaporation coating chamber adjacent to the entrance and exit, and both sides of the magnet plate can be used to sequentially stack a glass substrate and a mask plate.

[0007] Among them, the magnet plate is an electromagnetic iron plate that has magnetism after being energized, and the magnetic force magnitudes on both sides of the magnet plate can be respectively adjusted.

[0008] Among them, the number of evaporation coating chambers is multiple, and the multiple evaporation coating chambers are arranged in an array.

[0009] Among them, there is a preset interval between two adjacent evaporation coating chambers arranged horizontally, and two adjacent rows of evaporation coating chambers are staggered; a transmission mechanism is provided at the preset interval, and the transmission mechanism is oppositely arranged with the entrance and exit on the corresponding evaporation coating chamber.

[0010] Among them, the evaporation chamber is square, and the four corners of the evaporation chamber are concave arcs; the minimum distance between two arcs arranged diagonally in the evaporation chamber is greater than the diameter of the rotation of the glass substrate and the mask plate driven by the rotation mechanism.

[0011] Among them, the connection line between the centers of two adjacent evaporation chambers arranged obliquely passes through the center of the arc corresponding to the angle in the evaporation chamber.

[0012] To solve the above technical problems, the second technical solution adopted in this application is to provide an evaporation method. The evaporation method is applied to an evaporation device. The evaporation device includes an evaporation chamber. An entrance and exit are provided on one side of the evaporation chamber. An evaporation source is provided in the evaporation chamber. The evaporation source is located on the side surface of the evaporation chamber adjacent to or opposite to the entrance and exit. Among them, a rotation mechanism is provided in the evaporation chamber. The rotation mechanism is located in the middle area of the evaporation chamber. A magnet plate is provided on the rotation mechanism; the evaporation method includes: adjusting the position of the magnet plate to be parallel to the entrance and exit through the rotation mechanism; transporting the glass substrate into the evaporation chamber from the entrance and exit and attaching it to the magnet plate, transporting the mask plate into the evaporation chamber from the entrance and exit, aligning and attaching it to the glass substrate, adjusting the position of the magnet plate through the rotation mechanism so that the mask plate faces the evaporation source; evaporating the glass substrate.

[0013] Among them, evaporation sources are arranged on two sides adjacent to the entrance and exit in the evaporation chamber; the steps of transporting the glass substrate into the evaporation chamber from the entrance and exit and attaching it to the magnet plate, transporting the mask plate into the evaporation chamber from the entrance and exit, aligning and attaching it to the glass substrate, and adjusting the position of the magnet plate through the rotation mechanism so that the mask plate faces the evaporation source include: adjusting the state of the magnet plate through the rotation mechanism so that the first side of the magnet plate faces the entrance and exit; sequentially transporting a first glass substrate and a first mask plate into the evaporation chamber from the entrance and exit, and stacking them on the first side of the magnet plate, using the magnetic force of the magnet plate to attach the first glass substrate and the first mask plate to each other and integrally adsorb them on the first side of the magnet plate; after the first glass substrate and the first mask plate on the first side of the magnet plate are completely attached and aligned, rotating 180° through the rotation mechanism to adjust the state of the magnet plate so that the second side of the magnet plate faces the entrance and exit; wherein, the second side of the magnet plate is arranged opposite to the first side of the magnet plate; sequentially transporting a second glass substrate and a second mask plate into the evaporation chamber from the entrance and exit, and stacking them on the second side of the magnet plate, using the magnetic force of the magnet plate to attach the second glass substrate and the second mask plate to each other and integrally adsorb them on the second side of the magnet plate; after the second glass substrate and the second mask plate on the second side of the magnet plate are completely attached and aligned, rotating 90° through the rotation mechanism to make the first mask plate face one of the evaporation sources in the evaporation chamber and the second mask plate face the other evaporation source in the evaporation chamber.

[0014] The beneficial effects of this application are: Different from the prior art, this application provides an evaporation device and an evaporation method. Among them, the evaporation device includes an evaporation chamber, and an entrance and exit are arranged on one side of the evaporation chamber for the glass substrate and the mask plate to enter the evaporation chamber; evaporation sources are arranged in the evaporation chamber, and the evaporation sources are located on the side adjacent to or opposite to the entrance and exit in the evaporation chamber; wherein, a rotation mechanism is arranged in the evaporation chamber, the rotation mechanism is located in the middle area of the evaporation chamber, a magnet plate is arranged on the rotation mechanism, and the glass substrate and the mask plate are sequentially stacked on the magnet plate. By arranging a rotation mechanism in the evaporation chamber and arranging a magnet plate on the rotation mechanism, the glass substrate and the mask plate can be sequentially stacked on the magnet plate, and during the evaporation process, the rotation mechanism can drive the glass substrate and the mask plate to rotate as a whole, thereby avoiding the problem of the mask plate mesh surface accumulation caused by gravity due to the unchanged state of the glass substrate and the mask plate inside the evaporation chamber, being able to meet the fitting requirements of various products, and further improving the evaporation effect. Description of the Drawings

[0015] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0016] Figure 1 is a schematic structural diagram of the first state of an embodiment of the evaporation coating device of the present application;

[0017] Figure 2 is Figure 1 a schematic structural diagram of the second state of the evaporation coating device;

[0018] Figure 3 is a schematic structural diagram of the first state of another embodiment of the evaporation coating device of the present application;

[0019] Figure 4 is Figure 3 a schematic structural diagram of the second state of the evaporation coating device;

[0020] Figure 5 is a schematic structural diagram of still another embodiment of the evaporation coating device of the present application;

[0021] Figure 6 is a schematic flowchart of an embodiment of the evaporation coating method of the present application;

[0022] Figure 7 is Figure 6 a schematic flowchart of an embodiment of step S62 in Detailed implementation manners

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0024] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless clearly stated otherwise in the above. "Multiple" generally includes at least two, but does not exclude the case of including at least one.

[0025] It should be understood that the term "and / or" used herein is merely a description of the relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may represent three cases: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text generally indicates that the associated objects before and after are in an "or" relationship.

[0026] It should be understood that the terms "comprise", "include" or any other variants used herein are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

[0027] This application provides an evaporation coating device 10. Please refer to Figures 1 to 4 , wherein, Figure 1 is a schematic structural diagram of the first state of an embodiment of the evaporation coating device of this application, Figure 2 is Figure 1 a schematic structural diagram of the second state of the evaporation coating device of Figure 3 is a schematic structural diagram of the first state of another embodiment of the evaporation coating device of this application, Figure 4 is Figure 3Schematic structural diagram of the second state of the evaporation device. In this embodiment, the evaporation device 10 includes an evaporation chamber 100. An access opening 1000 is provided on one side of the evaporation chamber 100, and the access opening 1000 is used for the glass substrate 1003 and the mask plate 1004 to enter the evaporation chamber 100. An evaporation source 1001 is provided in the evaporation chamber 100, and the evaporation source 1001 is located on the side surface of the evaporation chamber 100 adjacent to or opposite to the access opening 1000. Among them, a rotating mechanism (not shown in the figure) is provided in the evaporation chamber 100, the rotating mechanism is located in the middle area of the evaporation chamber 100, and a magnet plate 1002 is provided on the rotating mechanism. The glass substrate 1003 and the mask plate 1004 are sequentially stacked on the magnet plate 1002. Among them, the size of the access opening 1000 should be larger than the size specifications of the glass substrate 1003 and the mask plate 1004 to ensure that the glass substrate 1003 and the mask plate 1004 can successfully enter and exit the evaporation chamber 100, so that the mask plate 1004 and the glass substrate 1003 can enter and exit the evaporation chamber 100 without restriction. It can be understood that during the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation chamber 100, first, the position of the magnet plate 1002 is adjusted to be parallel to the access opening 1000 through the rotating mechanism, then the glass substrate 1003 enters the evaporation chamber 100 from the access opening 1000 and fits with the magnet plate 1002, and then the mask plate 1004 is transmitted through the access opening 1000 into the evaporation chamber 100 and fits with the glass substrate 1003 after alignment. After complete fitting, the position is adjusted through the rotating mechanism so that the mask plate 1004 faces the evaporation source 1001 and evaporation is performed. In one embodiment, a alignment mechanism 1005 is provided at a position in the evaporation chamber 100 close to the access opening 1000 to ensure that the mask plate 1004 and the glass substrate 1003 can be successfully aligned after entering the evaporation chamber 100 from the access opening 1000.

[0028] In the evaporation device 10 of the embodiment of the present application, by providing a rotating mechanism in the evaporation chamber 100 and providing a magnet plate 1002 on the rotating mechanism, the glass substrate 1003 and the mask plate 1004 can be sequentially stacked on the magnet plate 1002. Thus, during the evaporation process, the rotating mechanism can drive the glass substrate 1003 and the mask plate 1004 to rotate as a whole, thereby avoiding the problem of the mesh surface accumulation of the mask plate 1004 caused by gravity due to the unchanged internal state of the glass substrate 1003 and the mask plate 1004 in the evaporation chamber 100, meeting the fitting requirements of various products, and further improving the evaporation effect.

[0029] In one embodiment, please combine Figure 3 and Figure 4, on the side of the evaporation chamber 100 opposite to the entrance / exit 1000, an evaporation source 1001 is provided. One side of the magnet plate 1002 is used to sequentially stack the glass substrate 1003 and the mask plate 1004. For example, the entrance / exit 1000 can be provided at the top of the evaporation chamber 100, and the evaporation source 1001 is provided at the bottom of the evaporation chamber 100. During the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation chamber 100, first, the magnet plate 1002 is adjusted to a horizontal state by the rotation mechanism, and then the glass substrate 1003 and the mask plate 1004 are sequentially transmitted into the evaporation chamber 100 through the entrance / exit 1000 and stacked on the magnet plate 1002. The magnetic force of the magnet plate 1002 is used to make the glass substrate 1003 and the mask plate 1004 fit together and be adsorbed on the magnet plate 1002 as a whole. After being completely aligned and fitted, it is rotated 180° by the rotation mechanism to make the mask plate 1004 face the bottom of the evaporation chamber 100, so that evaporation can be carried out using the evaporation source 1001 at the bottom of the evaporation chamber 100; that is, horizontal evaporation can be adopted inside the evaporation chamber 100. It can be understood that during the evaporation process of the evaporation device 10 in this embodiment, the rotation mechanism can drive the glass substrate 1003 and the mask plate 1004 to rotate as a whole, thereby avoiding the problem of the mask plate 1004 mesh surface accumulation caused by gravity due to the unchanged state of the glass substrate 1003 and the mask plate 1004 inside the evaporation chamber 100, and specifically being able to avoid the problem of poor fitting at the middle position between the glass substrate 1003 and the mask plate 1004.

[0030] In one embodiment, please refer to Figure 1 and Figure 2, evaporation sources 1001 are provided on both sides of the evaporation chamber 100 adjacent to the entrance / exit 1000. On both sides of the magnet plate 1002, a glass substrate 1003 and a mask plate 1004 can be sequentially stacked. For example, the entrance / exit 1000 can be provided at the top of the evaporation chamber 100, and evaporation sources 1001 can be provided on the left and right sides inside the evaporation chamber 100. During the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation chamber 100, first, the state of the magnet plate 1002 is adjusted by the rotation mechanism so that the first side of the magnet plate 1002 faces upward. Then, a glass substrate 1003 and a mask plate 1004 are sequentially transmitted into the evaporation chamber 100 through the entrance / exit 1000 and stacked on the first side of the magnet plate 1002. The magnetic force of the magnet plate 1002 is used to make the glass substrate 1003 and the mask plate 1004 fit together and be adsorbed on the first side of the magnet plate 1002 as a whole. After the glass substrate 1003 and the mask plate 1004 on the first side are completely fitted and aligned, the magnet plate 1002 is rotated 180° by the rotation mechanism to adjust the state of the magnet plate 1002 so that the second side opposite to the first side faces upward. Then, a glass substrate 1003 and a mask plate 1004 are also sequentially transmitted into the evaporation chamber 100 through the entrance / exit 1000 and stacked on the second side of the magnet plate 1002. Similarly, the magnetic force of the magnet plate 1002 is used to make the glass substrate 1003 and the mask plate 1004 fit together and be adsorbed on the second side of the magnet plate 1002 as a whole. After the glass substrate 1003 and the mask plate 1004 on the second side are completely fitted and aligned, the magnet plate 1002 is rotated 90° by the rotation mechanism to make the mask plates 1004 on both sides of the magnet plate 1002 face the evaporation sources 1001 on both sides inside the evaporation chamber 100. Thus, evaporation can be carried out using the evaporation sources 1001 on both sides inside the evaporation chamber 100. That is, vertical evaporation can be adopted inside the evaporation chamber 100. It can be understood that during the evaporation process of the evaporation device 10 in this embodiment, the rotation mechanism can drive the glass substrate 1003 and the mask plate 1004 to rotate as a whole, thereby avoiding the problem of the mask plate 1004 net surface accumulation caused by gravity due to the unchanged state of the glass substrate 1003 and the mask plate 1004 inside the evaporation chamber 100, and specifically being able to avoid the problem of poor fitting at the edge positions between the glass substrate 1003 and the mask plate 1004.

[0031] Further, the magnet plate 1002 is an electromagnetic iron plate 1002 that has magnetism after being electrified, and the magnetic force magnitudes on both sides of the magnet plate 1002 can be respectively adjusted. It can be understood that since the magnetic force magnitudes on both sides of the magnet plate 1002 can be controlled separately, during the process of successively laminating a glass substrate 1003 and a mask plate 1004 on both sides of the magnet plate 1002, after the glass substrate 1003 and the mask plate 1004 on one side of the magnet plate 1002 are completely and successfully aligned and adhered, by increasing the magnetic force on the other side of the magnet plate 1002, the glass substrate 1003 and the mask plate 1004 on the other side of the magnet plate 1002 can be completely and successfully aligned and adhered, that is, after the glass substrate 1003 and the mask plate 1004 on one side of the magnet plate 1002 are successfully aligned and adhered, it will not affect the alignment and adhesion of the glass substrate 1003 and the mask plate 1004 on the other side of the magnet plate 1002. Further, the maximum evaporation angle at the edge of the evaporation source 1001 should reach the boundary of the preset evaporation effective area to cover the position of the entire mask plate 1004, so as to ensure the uniformity of the film thickness after evaporation.

[0032] Please refer to Figure 5 , Figure 5 which is a schematic structural diagram of another embodiment of the evaporation device of the present application. The number of evaporation chambers 100 is multiple, and the multiple evaporation chambers 100 are arranged in an array. By setting multiple evaporation chambers 100, each evaporation chamber 100 can independently perform the evaporation operation inside it, improving the evaporation efficiency and can meet the evaporation requirements of different products.

[0033] Further, there is a preset interval between two adjacent evaporation chambers 100 arranged horizontally, and two adjacent rows of evaporation chambers 100 are staggered. Please refer to Figure 5 , since two adjacent rows of evaporation chambers 100 are staggered, the position of the preset interval existing between two adjacent evaporation chambers 100 in the upper row of evaporation chambers 100 can correspond to the entrances and exits 1000 of the evaporation chamber 100 in the lower row located between these two evaporation chambers 100, for the glass substrate 1003 and the mask plate 1004 to enter and exit the evaporation chamber 100.

[0034] Further, a transmission mechanism 101 is provided at the preset interval, and the transmission mechanism 101 is oppositely arranged with the entrances and exits 1000 on the corresponding evaporation chamber 100. It can be understood that as shown in Figure 5 , by providing a transmission mechanism 101 between two adjacent evaporation chambers 100 in the upper row of evaporation chambers 100, and the transmission mechanism 101 is correspondingly arranged with the entrances and exits 1000 of the evaporation chamber 100 at the relative position in the lower row, it is convenient to transport the glass substrate 1003 and the mask plate 1004, so that the mask plate 1004 and the glass substrate 1003 enter and exit the evaporation chamber 100.

[0035] In a preferred embodiment, the evaporation chamber 100 is square, and the four corners of the evaporation chamber 100 are concave arcs 1006. Please refer to Figures 1 to 5 , by setting the evaporation chamber 100 as a square structure and setting the four corners of the evaporation chamber 100 as concave arc structures, the occupied space of the evaporation chamber 100 can be made smaller.

[0036] Furthermore, the minimum distance between two diagonally arranged arcs 1006 in the evaporation chamber 100 is greater than the diameter of the rotation of the glass substrate 1003 and the mask plate 1004 driven by the rotation mechanism. Since in the evaporation device 10 of the present application, during the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation chamber 100 and during the evaporation process, it is necessary to adjust the positions of the glass substrate 1003 and the mask plate 1004 by the rotation of the rotation mechanism. Therefore, in order to ensure the smooth movement of the rotation mechanism driving the glass substrate 1003 and the mask plate 1004, it is necessary to ensure that the minimum distance between two diagonally arranged arcs 1006 in the evaporation chamber 100 is greater than the diameter of the rotation of the glass substrate 1003 and the mask plate 1004 driven by the rotation mechanism, so as to avoid the arc structure hindering the rotation movement of the glass substrate 1003 and the mask plate 1004 and causing failures.

[0037] Furthermore, the connection line between the centers C of two adjacent evaporation chambers 100 arranged obliquely passes through the center O of the corresponding arc 1006 in the evaporation chamber 100. As Figure 5 shown, by reserving a preset interval between two adjacent evaporation chambers 100 arranged horizontally, the preset interval serves as the accommodation space for the transmission mechanism 101 for transmitting the glass substrate 1003 and the mask plate 1004, and the connection line between the centers C of two adjacent evaporation chambers 100 arranged obliquely passes through the center O of the arc 1006 at the corresponding angle in the evaporation chamber 100, which can ensure the minimization of the floor area of the entire evaporation device 10.

[0038] The present application also provides an evaporation method, and the evaporation method is applied to any one of the above evaporation devices 10. In one embodiment, please refer to Figure 6 , Figure 6 is a schematic flowchart of an embodiment of the evaporation method of the present application; the evaporation method in this embodiment specifically includes the following steps:

[0039] Step S61: Adjust the position of the magnet plate to be parallel to the entrance and exit through the rotation mechanism.

[0040] Step S62: Transmit the glass substrate from the entrance and exit into the evaporation chamber and attach it to the magnet plate, transmit the mask plate from the entrance and exit into the evaporation chamber, and after alignment, attach it to the glass substrate, and adjust the position of the magnet plate through the rotation mechanism so that the mask plate faces the evaporation source.

[0041] Step S63: Evaporate and deposit on the glass substrate.

[0042] Specifically, with reference to Figure 3 and Figure 4 , the entrance and exit 1000 can be arranged at the top of the evaporation and deposition chamber 100, and the evaporation and deposition source 1001 is arranged at the bottom of the evaporation and deposition chamber 100. During the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation and deposition chamber 100, first, the magnet plate 1002 is adjusted to a horizontal state by the rotation mechanism, and then the glass substrate 1003 and the mask plate 1004 are sequentially transmitted into the evaporation and deposition chamber 100 through the entrance and exit 1000 and stacked on the magnet plate 1002. The magnetic force of the magnet plate 1002 is used to make the glass substrate 1003 and the mask plate 1004 fit together and the whole is adsorbed on the magnet plate 1002. After complete fitting and alignment, the mask plate 1004 is oriented towards the bottom of the evaporation and deposition chamber 100 by rotating 180° through the rotation mechanism. Thus, evaporation and deposition can be carried out using the evaporation and deposition source 1001 at the bottom of the evaporation and deposition chamber 100; during the evaporation and deposition process, the rotation mechanism can drive the glass substrate 1003 and the mask plate 1004 to rotate as a whole, thereby avoiding the problem of the mesh surface accumulation of the mask plate 1004 caused by gravity due to the unchanged state of the glass substrate 1003 and the mask plate 1004 inside the evaporation and deposition chamber 100, and specifically being able to avoid the problem of poor fitting at the middle position between the glass substrate 1003 and the mask plate 1004.

[0043] In one embodiment, with reference to Figure 1 and Figure 2 , evaporation and deposition sources 1001 are arranged on both side surfaces adjacent to the entrance and exit 1000 in the evaporation and deposition chamber 100; with reference to Figure 7 , Figure 7 is Figure 6 a schematic flow chart of one embodiment of step S62 in

[0044] Step S621: Adjust the state of the magnet plate through the rotation mechanism so that the first side surface of the magnet plate faces the entrance and exit.

[0045] Step S622: Transmit the first glass substrate and the first mask plate into the evaporation and deposition chamber through the entrance and exit in sequence and stack them on the first side surface of the magnet plate. The magnetic force of the magnet plate is used to make the first glass substrate and the first mask plate fit together and the whole is adsorbed on the first side surface of the magnet plate.

[0046] Step S623: After the first glass substrate and the first mask plate on the first side of the magnet plate are completely bonded and aligned, rotate 180° through the rotation mechanism to adjust the state of the magnet plate so that the second side of the magnet plate faces the entrance and exit; wherein, the second side of the magnet plate is arranged opposite to the first side of the magnet plate.

[0047] Step S624: Transfer the second glass substrate and the second mask plate into the evaporation chamber in sequence from the entrance and exit, and stack them on the second side of the magnet plate. Use the magnetic force of the magnet plate to bond the second glass substrate and the second mask plate and adsorb them on the second side of the magnet plate as a whole.

[0048] Step S625: After the second glass substrate and the second mask plate on the second side of the magnet plate are completely bonded and aligned, rotate 90° through the rotation mechanism to face the first mask plate towards one evaporation source located in the evaporation chamber and the second mask plate towards the other evaporation source located in the evaporation chamber.

[0049] Specifically, please combine Figure 1 and Figure 2, the entrance and exit 1000 can be set at the top of the evaporation chamber 100. Evaporation sources 1001 can be set on both the left and right sides inside the evaporation chamber 100. During the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation chamber 100, since the magnet plate 1002 has a first side and a second side arranged in opposite directions, first, the state of the magnet plate 1002 is adjusted by the rotation mechanism so that the first side of the magnet plate 1002 faces upward. Then, the first glass substrate 1003a and the first mask plate 1004a are sequentially transmitted into the evaporation chamber 100 through the entrance and exit 1000 and stacked on the first side of the magnet plate 1002. The magnetic force of the magnet plate 1002 is used to make the first glass substrate 1003a and the first mask plate 1004a fit together and be adsorbed on the first side of the magnet plate 1002 as a whole; after the first glass substrate 1003a and the first mask plate 1004a on the first side are completely fitted and aligned, the magnet plate 1002 is rotated 180° by the rotation mechanism to adjust the state of the magnet plate 1002 so that the second side of the magnet plate 1002 faces upward. Then, the second glass substrate 1003b and the second mask plate 1004b can also be sequentially transmitted into the evaporation chamber 100 through the entrance and exit 1000 and stacked on the second side of the magnet plate 1002. Similarly, the magnetic force of the magnet plate 1002 is used to make the second glass substrate 1003b and the second mask plate 1004b fit together and be adsorbed on the second side of the magnet plate 1002 as a whole; after the second glass substrate 1003b and the second mask plate 1004b on the second side are completely fitted and aligned, the magnet plate 1002 is rotated 90° by the rotation mechanism, the first mask plate 1004a on the first side of the magnet plate 1002 is oriented towards the evaporation source 1001 on one side inside the evaporation chamber 100, and the second mask plate 1004b on the second side of the magnet plate 1002 is oriented towards the evaporation source 1001 on the other side inside the evaporation chamber 100. Thus, the evaporation sources 1001 on both sides inside the evaporation chamber 100 can be used to evaporate the first glass substrate 1003a and the second glass substrate 1003b respectively; during the evaporation process, the rotation mechanism can drive the first glass substrate 1003a and the first mask plate 1004a, and the first mask plate 1004a and the second mask plate 1004b to rotate as a whole, thereby avoiding the problem of mask plate mesh surface accumulation caused by gravity due to the unchanged state of the first glass substrate 1003a and the first mask plate 1004a, and the first mask plate 1004a and the second mask plate 1004b inside the evaporation chamber 100, and specifically avoiding the problem of poor fitting at the edge positions of the first glass substrate 1003a and the first mask plate 1004a, and the first mask plate 1004a and the second mask plate 1004b.

[0050] In summary, in the evaporation device 10 of the present application, by arranging a rotation mechanism in the evaporation chamber 100, during the process of loading the glass substrate 1003 and the mask plate 1004 into the evaporation chamber 100, the position of the magnet plate 1002 can be adjusted to be parallel to the entrance / exit 1000 by the rotation mechanism first. Then, the glass substrate 1003 enters the evaporation chamber 100 from the entrance / exit 1000 and adheres to the magnet plate 1002. Next, the mask plate 1004 is transmitted into the evaporation chamber 100 from the entrance / exit 1000 and adheres to the glass substrate 1003 after alignment. After complete adhesion, the position is adjusted by the rotation mechanism to make the mask plate 1004 face the evaporation source 1001 and perform evaporation. Since the glass substrate 1003 and the mask plate 1004 can be stacked on the surface of the magnet plate 1002 on the rotation mechanism in sequence, during the evaporation process, the rotation mechanism can drive the glass substrate 1003 and the mask plate 1004 to rotate as a whole, thereby avoiding the problem of the mesh surface accumulation of the mask plate 1004 caused by gravity due to the unchanged internal state of the glass substrate 1003 and the mask plate 1004 in the evaporation chamber 100, meeting the adhesion requirements of various products, and further improving the evaporation effect.

[0051] The above description is only the implementation mode of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. A vapor deposition apparatus, characterized in that, The evaporation coating device includes an evaporation coating chamber, and an entrance and exit is provided on one side of the evaporation coating chamber, and the entrance and exit is used for allowing a glass substrate and a mask plate to enter the evaporation coating chamber; an evaporation source is arranged in the evaporation coating chamber, and the evaporation source is located on a side surface of the evaporation coating chamber adjacent to or opposite to the entrance and exit. Wherein, a rotation mechanism is arranged in the evaporation coating chamber, the rotation mechanism is located in the middle area of the evaporation coating chamber, a magnet plate is arranged on the rotation mechanism, and the glass substrate and the mask plate are sequentially stacked on the magnet plate; the rotation mechanism is used for driving the glass substrate and the mask plate to rotate integrally during the evaporation coating process, so as to avoid the problem of mask plate mesh surface accumulation caused by gravity due to the unchanged state of the glass substrate and the mask plate inside the evaporation coating chamber.

2. The vapor deposition apparatus according to claim 1, wherein A alignment mechanism is arranged at a position in the evaporation coating chamber close to the entrance and exit.

3. The vapor deposition apparatus according to claim 1, wherein One evaporation source is arranged on each of the two side surfaces of the evaporation coating chamber adjacent to the entrance and exit, and one glass substrate and one mask plate can be sequentially stacked on both sides of the magnet plate.

4. The vapor deposition apparatus according to claim 3, wherein The magnet plate is an electromagnetic iron plate that has magnetism after being electrified, and the magnetic force magnitudes on both sides of the magnet plate can be respectively adjusted.

5. The evaporation deposition apparatus according to claim 1, wherein The number of the evaporation coating chambers is multiple, and the multiple evaporation coating chambers are arranged in an array.

6. The evaporation deposition apparatus according to claim 5, wherein A preset interval is provided between two adjacent evaporation coating chambers arranged horizontally, and two adjacent rows of evaporation coating chambers are arranged staggeredly; A transmission mechanism is arranged at the preset interval, and the transmission mechanism is arranged opposite to the entrance and exit on the corresponding evaporation coating chamber.

7. The evaporation deposition apparatus according to claim 6, characterized in that, The evaporation coating chamber is square, and the four corners of the evaporation coating chamber are concave arcs; The minimum distance between two arcs arranged diagonally in the evaporation coating chamber is greater than the diameter of the rotation of the glass substrate and the mask plate driven by the rotation mechanism.

8. The evaporation deposition apparatus according to claim 7, characterized in that, The connection line between the centers of two adjacent evaporation coating chambers arranged obliquely passes through the center of the arc corresponding to the angle of the evaporation coating chamber.

9. A vapor deposition method, characterized in that, The evaporation coating method is applied to an evaporation coating device, the evaporation coating device includes an evaporation coating chamber, an entrance and exit is provided on one side of the evaporation coating chamber, an evaporation source is arranged in the evaporation coating chamber, and the evaporation source is located on a side surface of the evaporation coating chamber adjacent to or opposite to the entrance and exit. Wherein, a rotation mechanism is arranged in the evaporation coating chamber, the rotation mechanism is located in the middle area of the evaporation coating chamber, and a magnet plate is arranged on the rotation mechanism; the evaporation coating method includes: Step 1: Adjust the position of the magnet plate to be parallel to the entrance and exit through the rotation mechanism; Step 2: Transmit the glass substrate from the entrance and exit into the evaporation coating chamber and attach it to the magnet plate, transmit the mask plate from the entrance and exit into the evaporation coating chamber, align and attach it to the glass substrate, and adjust the position of the magnet plate through the rotation mechanism to make the mask plate face the evaporation source; Step 3: Perform evaporation coating on the glass substrate, and drive the glass substrate and the mask plate to rotate integrally through the rotation mechanism, so as to avoid the problem of mask plate mesh surface accumulation caused by gravity due to the unchanged state of the glass substrate and the mask plate inside the evaporation coating chamber.

10. The vapor deposition method according to claim 9, characterized in that, One evaporation source is arranged on each of the two side surfaces of the evaporation coating chamber adjacent to the entrance and exit; The step of transporting the glass substrate from the entrance and exit into the evaporation chamber and attaching it to the magnet plate, transporting the mask plate from the entrance and exit into the evaporation chamber, aligning and attaching it to the glass substrate, and adjusting the position of the magnet plate through the rotation mechanism so that the mask plate faces the evaporation source includes: Step 21: Adjust the state of the magnet plate through the rotation mechanism so that the first side surface of the magnet plate faces the entrance and exit; Step 22: Transport the first glass substrate and the first mask plate into the evaporation chamber from the entrance and exit in sequence, and stack them on the first side surface of the magnet plate. Use the magnetic force of the magnet plate to make the first glass substrate and the first mask plate fit together and be adsorbed on the first side surface of the magnet plate as a whole; Step 23: After the first glass substrate and the first mask plate on the first side surface of the magnet plate are completely aligned and attached, rotate 180° through the rotation mechanism to adjust the state of the magnet plate so that the second side surface of the magnet plate faces the entrance and exit; wherein, the second side surface of the magnet plate is arranged opposite to the first side surface of the magnet plate; Step 24: Transport the second glass substrate and the second mask plate into the evaporation chamber from the entrance and exit in sequence, and stack them on the second side surface of the magnet plate. Use the magnetic force of the magnet plate to make the second glass substrate and the second mask plate fit together and be adsorbed on the second side surface of the magnet plate as a whole; Step 25: After the second glass substrate and the second mask plate on the second side surface of the magnet plate are completely aligned and attached, rotate 90° through the rotation mechanism to make the first mask plate face one of the evaporation sources located in the evaporation chamber and the second mask plate face the other evaporation source located in the evaporation chamber.

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