Phased array millimeter wave radar seeker integrated structure

Abstract

The application relates to a phased array millimeter wave radar seeker integrated structure, wherein the whole radar seeker is divided into a front end module, a data processing module, a power module and a missile nose cone four parts. The phased array front end module is designed in an integrated mode and is positioned and connected with four bosses in the inside of the missile nose cone through screwing; the data processing module is connected and fixed on the upper and lower sides of the data processing module by two different adapter plates respectively, so that the integration and miniaturization design of the seeker are realized, and the existing narrow space is utilized to compactly install the modules.

Description

Technical Field

[0001] This invention belongs to the field of precision guidance technology, specifically a high-overload millimeter-wave radar seeker for use in a certain caliber naval gun. Background Technology

[0002] In modern warfare, due to the unique operational environment of naval guns, large-caliber naval guns are required to possess characteristics such as speed, accuracy, and guidance. Modern naval guns employ a composite guidance system, combining mid-course guidance with terminal guidance. During the mid-course guidance phase, the gun is guided to a target acquisition area that allows the seeker to enter its field of view. Then, terminal guidance is activated. The fundamental task of the terminal guidance phase is to ensure the final guidance accuracy of the gun, enabling it to kill the target's vital parts with minimal miss. By employing a high-precision terminal guidance method, precise point strikes can be achieved.

[0003] Due to the addition of terminal guidance capabilities, a radar seeker needs to be added to naval gun shells to effectively overcome the shortcomings of optical detection, which is susceptible to weather conditions. This ensures the seeker can perform all-weather, all-time, wide-range, rapid searches for moving targets on the sea surface and improves its anti-jamming capabilities. It enables autonomous search, identification, interception, and tracking of sea and land targets, possessing strong anti-jamming capabilities and adaptability to complex battlefield environments. Furthermore, guided missiles experience high overloads (9000g–12000g) during launch; therefore, the millimeter-wave radar seeker mounted on it must possess high overload resistance.

[0004] Traditional millimeter-wave radar seekers cannot meet the above requirements in terms of overload resistance. Therefore, this invention uses a certain caliber naval gun as a platform to solve the problem of high overload resistance of long-range precision terminal-guided gun-launched missiles. Its innovative structural design is suitable for high overload millimeter-wave radar seekers in large-caliber missile-borne operating environments, filling a gap in this technical field in my country. Summary of the Invention

[0005] Technical problems to be solved

[0006] To address the challenges of high overload resistance (maximum overload ≤ 10000g) and miniaturization in missile-borne environments, this invention provides an integrated phased array millimeter-wave radar seeker structure that is compact and easy to install.

[0007] Technical solution

[0008] An integrated structure for a phased array millimeter-wave radar seeker is characterized by comprising a missile radome and an integrated internal module. The missile radome includes a front section and a rear section, with the rear section having a bonding surface between the front and rear sections. The front and rear sections are bonded together via this bonding surface to form an integrated structure. The integrated internal module includes a front-end module, a data processing module, a power supply module, a first module adapter plate, and a second module adapter plate. The first module adapter plate is located between the front-end module and the data processing module, and the second module adapter plate is located between the data processing module and the power supply module. A boss is provided on the inner wall of the rear section of the radome, and a recessed flange corresponding to the boss is provided on the front-end module.

[0009] A further technical solution of the present invention: flanges are designed on both sides of the top of the power module so that the internal chip is attached to the upper surface and fixed to the second module adapter board by the flanges.

[0010] A further technical solution of the present invention: the front-end module is a tapered module.

[0011] A further technical solution of the present invention: the first module adapter plate is made of aluminum alloy.

[0012] A further technical solution of the present invention: the second module adapter plate is made of aluminum alloy.

[0013] A further technical solution of the present invention: the number of bosses is 4.

[0014] A further technical solution of the present invention: the recessed flange platform comprises four units.

[0015] A further technical solution of the present invention: the front section of the headgear is made of non-metallic wave-transparent material.

[0016] A further technical solution of the present invention: the rear end of the headgear is made of aluminum alloy.

[0017] A further technical solution of the present invention is to use high-performance epoxy resin to pot the entire guide head and the interior of each module.

[0018] Beneficial effects

[0019] This invention proposes an integrated structure for a phased array millimeter-wave radar seeker. The entire radar seeker is divided into four parts: a front-end module, a data processing module, a power supply module, and a missile radome. The phased array front-end module adopts an integrated design and is connected to four protrusions inside the missile radome via screws. The data processing module connects to the power supply module on its upper and lower sides via two different adapter plates. This achieves an integrated and miniaturized design for the seeker, utilizing existing limited space to allow for compact installation of the modules. The beneficial effects are as follows:

[0020] 1. The seeker head adopts an integrated structural design, which not only greatly reduces the internal space of the seeker head, but also reduces its weight.

[0021] 2. This invention fully considers the high overload resistance requirements of millimeter-wave phased array radar seekers. Based on the gap size between each module and the edge of the housing, a special structure and potting channel are designed. High-performance epoxy resin is selected to pot the entire seeker and the interior of each module to enhance the overall overload resistance of the seeker.

[0022] 3. Based on the dynamic simulation results, replace the weak points in the structure with high-strength materials and redesign the structure.

[0023] 4. The modules inside the guide head have the advantages of easy installation and disassembly.

[0024] 5. This invention utilizes the concept of modular design, and the high overload resistant millimeter-wave phased array radar seeker design has good portability and versatility, and can be adapted to other types of terminal-guided naval gun ammunition. Attached Figure Description

[0025] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0026] Figure 1 (a): Schematic diagram of the overall structure of the millimeter-wave radar seeker (half section);

[0027] Figure 1 (b): Exploded view of the overall structure of the millimeter-wave radar seeker

[0028] Figure 2 : Schematic diagram of the connection between the front module and the rear section of the headgear (half section);

[0029] Figure 3 (a): Schematic diagram of the connection between the internal modules of the integrated system;

[0030] Figure 3 (b): Schematic diagram of the connection between the integrated internal modules and the rear section of the headgear;

[0031] Figure 4 : Schematic diagram of the bonding between the front and rear sections of the headgear (half-section);

[0032] 1-Missile hood; 1a-Front section of hood; 1b-Rear section of hood; 2-Front-end module; 3-Data processing module; 4-Power module; 5-Boss; 6-First module adapter board; 7-Second module adapter board; 8-Integrated internal module; 9-Bonding surface between front and rear sections of hood. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0034] like Figure 1 As shown, an integrated structure for a phased array millimeter-wave radar seeker includes a missile radome 1 and an integrated internal module 8.

[0035] The missile radome 1 consists of a front section 1a and a rear section 1b. Unlike the previous threaded installation method of radomes, the front section 1a of the radome, which is made of non-metallic wave-transparent material, is connected to the rear section 1b of the radome, which is made of high-strength aluminum alloy material (and the missile casing in the conventional sense), by screws, and then the two are bonded together by an adhesive process to form an integrated structure.

[0036] like Figure 2 As shown, the integrated internal module 8 includes three electronic modules: front-end module 2, data processing module 3, and power supply module 4, as well as two structural components: a first module adapter plate 6 and a second module adapter plate 7. Due to the constraints of the cartridge case structure shape, the front-end module 2 structure has also been modified, changing the previous columnar module into a conical module with a smaller diameter at the top and a larger diameter at the bottom. Four protrusions 5 are designed on the upper inner wall of the rear section 1b of the hood. At the same time, four opposite recessed flanges are designed on the front-end module 2, which can both position the modules relative to each other and fix the front-end module 2 to the rear section 1b of the hood.

[0037] The connection between front-end module 2, data processing module 3, and power module 4 is achieved by fixing them together using two module adapter plates. The first module adapter plate 6 and the second module adapter plate 7 are connected by a support joint, with the data processing module 3 fixed between the two adapter plates. Flanges are designed on both sides of the top of the power module 4, allowing the internal chip to be attached to the upper surface, and it is fixed to the second module adapter plate 7 via the flanges. This method makes efficient use of the narrow space inside the missile, mechanically fixing the three electronic modules through the two module adapter plates and increasing their contact area. This allows the heat sources of each module to be in close contact with the aluminum alloy module adapter plates, better dissipating heat to the module adapter plates and transferring it to the rear end 1b of the head shroud, thus achieving a satisfactory installation and heat dissipation solution for the electronic modules. Finally, using 3D modeling and simulation software, an annular closed flow channel was designed inside the seeker head, facilitating potting operations, allowing for proper air expulsion, and forming an integrated structure that meets the target requirements for resistance to high overload impacts.

[0038] The installation sequence of the entire guide head is as follows:

[0039] (1) First, push the front-end module 2 into the missile nacelle 1 from the rear until it contacts the boss 5 inside the missile nacelle 1. Then, fasten the front-end module 2 to the boss 5 inside the missile nacelle 1 using 4×M4 countersunk screws. Figure 2 As shown;

[0040] (2) The upper and lower surfaces of the data processing module 3 are screwed and fixed to the first module adapter plate 6 and the second module adapter plate 7 respectively;

[0041] (3) The data processing module 3 with the first module adapter board 6 is fixed to the bottom of the front-end module 2 by screwing.

[0042] (4) The power module 4 is screwed onto the second module adapter plate 7 below the data module 3 to form an integrated internal module 8, as shown below. Figure 3 As shown.

[0043] After the entire unit is installed as a whole, one potting inlet and one potting outlet are designed on the missile hood 1. Based on the flow channel structure, epoxy resin with good flowability is selected, and potting is carried out by first potting the individual units and then the whole unit. This plays a role in protecting the internal modules and resisting high overload impact.

[0044] The structure of this invention has passed multiple overload tests with a maximum load of 10,000g. The experimental results prove that the design method of the high overload resistant millimeter-wave phased array radar seeker of this invention is reasonable and feasible, and meets the high overload resistance requirements of the system.

[0045] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the scope of the technology disclosed in the present invention, and such modifications or substitutions should all be covered within the scope of protection of the present invention.

Claims

1. An integrated structure for a phased array millimeter-wave radar seeker, wherein the overall overload resistance of the millimeter-wave radar seeker is required to be ≤10000g, characterized in that... The system includes a missile hood (1) and an integrated internal module (8). The missile hood (1) includes a front section (1a) and a rear section (1b). The rear section (1b) is provided with a front and rear section hood bonding surface (9). The front section (1a) and the rear section (1b) are bonded together by the front and rear section hood bonding surface (9) to form an integrated structure. The integrated internal module (8) includes a front-end module (2), a data processing module (3), a power supply module (4), a first module adapter board (6), and a second module adapter board (7). The first module adapter board (6) is located between the front-end module (2) and the data processing module (3), and the second module adapter board (7) is located between the data processing module (3) and the power supply module (4). The inner wall of the rear section (1b) of the head cover is provided with a boss (5), and the front module (2) is provided with a recessed flange corresponding to the boss (5); the power module (4) is designed with flanges on both sides of the top, so that the internal chip is attached to the upper end face and fixed to the second module adapter plate (7) by the flange; the front module (2) is a conical module; the first module adapter plate (6) is made of aluminum alloy; the second module adapter plate (7) is made of aluminum alloy; there are 4 bosses (5); there are 4 recessed flanges; the front section (1a) of the head cover is made of non-metallic wave-transparent material; the rear section (1b) of the head cover is made of aluminum alloy; high-performance epoxy resin is used to pot the entire guide head and the interior of each module. The connection between the front-end module (2), the data processing module (3), and the power supply module (4) is fixed by designing two module adapter plates; the first module adapter plate (6) and the second module adapter plate (7) are connected by support columns, and the data processing module (3) is fixed in the middle of the two adapter plates; flanges are designed on both sides of the top of the power supply module (4) so ​​that the internal chip is attached to the upper surface and fixed to the second module adapter plate (7) through the flanges; this method makes reasonable use of the narrow space inside the missile, mechanically fixes the three electronic modules through the two module adapter plates, and increases their contact area, so that the heat source of each module is close to the aluminum alloy module adapter plate, and better transfers the heat to the module adapter plate and to the rear section (1b) of the head cover, realizing the installation and heat dissipation scheme of the electronic modules; finally, through three-dimensional modeling and simulation software, an annular closed flow channel is designed inside the seeker head to facilitate the potting operation, reasonably discharge the air, form an integrated structure, and achieve the target requirement of resisting high overload impact; The installation sequence of the entire guide head is as follows: First, push the front-end module (2) into the rear of the missile hood (1) until it contacts the boss (5) inside the missile hood (1). Then, fasten the front-end module (2) to the boss (5) inside the missile hood (1) with 4×M4 countersunk screws. The top and bottom surfaces of the data processing module (3) are screwed and fixed to the first module adapter plate (6) and the second module adapter plate (7) respectively; The data processing module (3) with the first module adapter board (6) is fixed to the bottom of the front-end module (2) by screwing. The power module (4) is fixed in reverse to the second module adapter plate (7) below the data processing module (3) by screwing, forming an integrated internal module (8). After the whole machine is installed as a whole, there is one potting inlet and one potting outlet on the missile head cover (1). According to the flow channel structure, epoxy resin with good flowability is selected. The potting mode of first potting the individual parts and then the whole machine is adopted to protect the internal modules and resist high overload impact.

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