A heat dissipation base plate and a power module

Abstract

The application relates to a heat dissipation base plate, which comprises a mounting base plate for mounting an integrated circuit board and a fin assembly for heat dissipation, one end surface of the mounting base plate is used for mounting the integrated circuit board, the other end surface of the mounting base plate is used for connecting the fin assembly, and the heat dissipation base plate is characterized in that: a wind channel assembly and a wind generating assembly for generating air flow are further included; the fin assembly comprises a plurality of fin pieces which are distributed in a circle along a straight line perpendicular to the mounting base plate; one end of the fin piece is connected to the end surface of the mounting base plate; the other end of the fin piece is connected to the wind channel assembly; two adjacent fin pieces, the mounting base plate and the wind channel assembly form a first wind channel; the wind channel assembly is made of heat conductive material; the wind channel assembly is provided with a second wind channel; and the wind generating assembly can make air flow through all the first wind channels and the second wind channel in sequence. The application has the effect of improving heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of heat sinks, and more particularly to a heat sink base plate and a power module. Background Technology

[0002] Currently, with the development and progress of science and technology, most electronic products use integrated circuit boards as the carrier of the main control system.

[0003] Because integrated circuit boards have a small working space and many control circuits, they generate heat during operation. Therefore, integrated circuit boards are generally mounted on a heat sink. In related technologies, the heat sink includes a base plate and fins. The base plate is made of thermally conductive material. One end of the base plate is used to mount the integrated circuit board, and the other end of the base plate is provided with fins. The fins increase the contact area between the base plate and the air, giving the base plate a better heat dissipation effect.

[0004] Regarding the aforementioned technologies, the control systems of products such as computers, commercial air conditioner outdoor units, and car batteries are quite complex, but the space occupied by the controller is relatively small. In this case, the structure of the integrated circuit board is quite complex, and the power generated by the integrated circuit board during operation is large, resulting in a large amount of heat generated per unit time. When using the heat dissipation base plate in the relevant technologies, the heat dissipation efficiency of the integrated circuit board may be lower than the heat generation efficiency, causing the temperature of the integrated circuit board to gradually rise during operation, eventually leading to damage to the integrated circuit board. Summary of the Invention

[0005] To improve heat dissipation efficiency, this application provides a heat dissipation base plate and a power module.

[0006] In a first aspect, this application provides a heat dissipation base plate, which adopts the following technical solution:

[0007] A heat dissipation base plate includes a mounting base plate for mounting an integrated circuit board and a fin assembly for heat dissipation. One end face of the mounting base plate is used to mount the integrated circuit board, and the other end face of the mounting base plate is used to connect the fin assembly. The base plate is characterized by further including an air duct assembly and an air-generating assembly for generating airflow. The fin assembly includes a plurality of fins distributed circumferentially along a straight line perpendicular to the mounting base plate. One end of each fin is connected to the end face of the mounting base plate, and the other end of each fin is connected to the air duct assembly. Two adjacent fins, the mounting base plate, and the air duct assembly form a first air duct. The air duct assembly is made of a thermally conductive material. A second air duct is provided on the air duct assembly. The air-generating assembly enables air to flow sequentially through all of the first and second air ducts.

[0008] By adopting the above technical solution, firstly, the airflow generated by the air-generating component can pass through each of the first air ducts simultaneously, and when airflow passes through the first air duct, it can make more full contact with the sides of the fins on both sides of the first air duct, making the heat dissipation of the integrated circuit board more uniform. At the same time, under the action of the air duct component, the airflow generated by the air-generating component passes through the first air duct and the second air duct in sequence, thus greatly improving the overall heat dissipation efficiency of the integrated circuit board. In addition, the fins can support the air duct component, and some of the heat in the fins can also be conducted into the air duct component. When the air flows in the second air duct, it can play a secondary heat dissipation role. In the end, this solution can make the heat dissipation of the integrated circuit board more uniform and improve the overall heat dissipation efficiency.

[0009] Preferably, the air duct assembly is trumpet-shaped, and the opening of the air duct assembly is positioned directly opposite the end face of the mounting base plate where the fin assembly is located.

[0010] By adopting the above technical solution, under the action of the horn-shaped air duct component, the first air duct and the second air duct are set perpendicular to each other. The air flowing out of the first air duct will form a convergence between the first air duct and the second air duct, and then pass through the second air duct, which can more fully remove the heat from the fin assembly and the air duct assembly, thereby further improving the overall heat dissipation efficiency. Moreover, the first air duct and the second air duct are connected by an arc transition at the horn opening, which reduces the wind resistance and the loss of air volume, thereby improving the heat dissipation efficiency.

[0011] Preferably, the cross-sectional area of ​​the first air duct gradually decreases along the airflow direction generated by the air-generating component.

[0012] By adopting the above technical solution, the temperature of the air gradually increases as it flows in the first air duct. As the cross-sectional area of ​​the first air duct gradually decreases, the air velocity in the first air duct gradually increases. Ultimately, the air velocity in the first air duct is high when it is high and low when it is low, which makes the heat dissipation effect of the fins more uniform and improves the heat dissipation efficiency.

[0013] Preferably, when viewed perpendicular to the end face of the mounting base plate, the fin has an arc-shaped thin sheet structure.

[0014] By adopting the above technical solution, the first air duct is arc-shaped, and when the air flows through the first air duct, it can make more full contact with the side of the fins, thereby achieving a better heat dissipation effect.

[0015] Preferably, the angle corresponding to the arc length of the fin is X°, and the number of fins is greater than Y, X is less than or equal to 30, Y is greater than or equal to 12, and the product of X and Y is less than or equal to 360.

[0016] By adopting the above technical solution, the first air duct, with a certain curvature, has less additional resistance to the flow of air, thus increasing the overall heat dissipation effect.

[0017] Preferably, it also includes a water-cooling assembly, which includes cooling pipes for introducing coolant, a plurality of cooling pipes, and mounting holes provided on the fins, with the cooling pipes passing through the mounting holes along the fins.

[0018] By adopting the above technical solution, after coolant is introduced into the cooling pipe, the coolant can carry away some of the heat from the fins. At the same time, the cooling pipe obstructs the airflow passing through the center of the first air duct, directing it towards the mounting base plate end face or the air duct assembly, thus further increasing the overall heat dissipation effect. In addition, the fins fix the cooling pipe, eliminating the need for additional fixing structures. The airflow passing through the center of the first air duct can also dissipate heat from the liquid in the cooling pipe, ultimately improving the overall heat dissipation efficiency.

[0019] Preferably, when viewed along the first air duct direction, all the cooling pipes do not overlap, and when viewed from the end face perpendicular to the mounting base plate, there is a gap between two adjacent cooling pipes.

[0020] By adopting the above technical solution, part of the airflow passing through the first air duct passes through the first air duct without contacting the side of the fins. When the cooling pipes do not overlap along the direction of the first air duct, the cooling pipes can block more of the airflow, allowing the airflow that does not contact the side of the fins to carry away the heat in the cooling pipes to a greater extent. At the same time, it allows the airflow to contact the end face of the mounting base plate or the air duct assembly to a greater extent, ultimately improving the overall heat dissipation efficiency.

[0021] Preferably, at least one of the cooling pipes is disposed close to the end face of the mounting base plate.

[0022] By adopting the above technical solution, the cooling pipe directly contacts the end face of the mounting base plate, and the coolant in the cooling pipe can carry away the heat from the end face of the mounting base plate to a greater extent, thereby improving the heat dissipation efficiency.

[0023] Secondly, this application provides a power module, which adopts the following technical solution:

[0024] A power module comprising a plurality of heat sink base plates.

[0025] By adopting the above technical solution, when a number of heat dissipation base plates are spliced ​​together, the cooling pipes are connected by connecting pipes, and then the cooling pipes are connected to the water source by connecting pipes. One water source can supply coolant to multiple heat dissipation base plates.

[0026] Preferably, all heat dissipation base plates are arranged in an array, and the fin assemblies on all heat dissipation base plates are arranged in an array.

[0027] By adopting the above technical solution, the fin assembly spacing on two adjacent heat dissipation base plates is equal. Theoretically, when the power of the air-generating component on each heat dissipation component is the same, the heat dissipation efficiency of all heat dissipation components is the same, making the overall heat dissipation efficiency more uniform.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. The airflow generated by the air-generating component can pass through each of the first air ducts simultaneously. When airflow passes through the first air duct, it can make more thorough contact with the sides of the fins on both sides of the first air duct, making the heat dissipation of the integrated circuit board more uniform. Under the action of the air duct component, the airflow generated by the air-generating component passes through the first and second air ducts in sequence, thus greatly improving the overall heat dissipation efficiency of the integrated circuit board. In addition, the fins can support the air duct component, and some of the heat in the fins can also be conducted into the air duct component. When the air flows in the second air duct, it can play a secondary heat dissipation role. In the end, this solution can make the heat dissipation of the integrated circuit board more uniform and improve the overall heat dissipation efficiency.

[0030] 2. After coolant is introduced into the cooling pipe, the coolant can carry away some of the heat from the fins. At the same time, the cooling pipe obstructs the airflow passing through the center of the first air duct, directing it towards the mounting base or the air duct assembly, thus further increasing the overall heat dissipation effect. In addition, the fins fix the cooling pipe, eliminating the need for additional fixing structures. The airflow passing through the center of the first air duct also dissipates heat from the liquid in the cooling pipe, ultimately improving the overall heat dissipation efficiency.

[0031] 3. When a number of heat dissipation base plates are spliced ​​together, the cooling pipes are connected by connecting pipes, and then the cooling pipes are connected to the water source by connecting pipes. One water source can supply coolant to multiple heat dissipation base plates. Attached Figure Description

[0032] Figure 1 This is a cross-sectional view of a heat dissipation base plate.

[0033] Figure 2 This is a top view of the fin assembly in Embodiment 1.

[0034] Figure 3 This is a schematic diagram of the airflow direction in a heat dissipation base plate.

[0035] Figure 4 This is a top view of the fin assembly in Embodiment 2.

[0036] Figure 5 This is a schematic diagram of a power module layout.

[0037] Explanation of reference numerals in the attached drawings: 1. Mounting base plate; 2. Fin assembly; 21. Fin piece; 211. Mounting hole; 3. Air duct assembly; 31. Second air duct; 4. Air generating assembly; 41. Motor; 42. Axial flow fan blade; 5. Water cooling assembly; 51. Cooling pipe; 6. First air duct. Detailed Implementation

[0038] The present application will be further described in detail below with reference to all the accompanying drawings.

[0039] This application discloses a heat dissipation base plate.

[0040] Example 1

[0041] Reference Figure 1 and 2 A heat dissipation base plate includes a mounting base plate 1 for supporting an integrated circuit board, a fin assembly 2 for heat dissipation, an air duct assembly 3 for guiding airflow, an air-generating assembly 4 for generating airflow, and a water-cooling assembly 5 for heat dissipation. One end of the mounting base plate 1 is detachably connected to the integrated circuit board, and the other end of the mounting base plate 1 is fixedly connected to the fin assembly 2 by welding. The end of the fin assembly 2 away from the mounting base plate 1 is connected to the air duct assembly 3 by welding. The fin assembly 2, the mounting base plate 1, and the air-generating assembly 4 form several first air ducts 6. The air duct assembly 3 is provided with second air ducts 31, and the air-generating assembly 4 is disposed within the second air ducts 31. The air-generating assembly 4 is capable of generating airflow that sequentially flows through the first air ducts 6 and the second air ducts 31.

[0042] Reference Figure 1 and 2 The water-cooling component 5 is embedded in the fin assembly 2. The water-cooling component 5 can be connected to the cold water tank for providing coolant through the pipe joint. The water-cooling component 5 can be supplied with cooling water. With the above structure, the integrated circuit board placed on the mounting base plate 1 can dissipate heat through both air cooling and water cooling. The air cooling and water cooling can promote each other, which greatly improves the heat dissipation efficiency of the integrated circuit board.

[0043] Reference Figure 1 Specifically, the mounting base plate 1 is a rectangular heat-conducting metal plate coated with insulating varnish. One end face of the mounting base plate 1 is provided with a snap-fit ​​component for mounting the integrated circuit board. The mounting base plate 1 and the integrated circuit board are also provided with threaded holes at one end. After the integrated circuit board is connected to the mounting base plate 1 through the snap-fit ​​component, it is then fixed to the mounting base plate 1 along the threaded holes by self-tapping screws. Through the above structure, the end face of the integrated circuit board and the end face of the mounting base plate 1 are in close contact, which facilitates the heat conduction effect between the integrated circuit board and the mounting base plate 1 and improves the heat dissipation efficiency.

[0044] Reference Figure 1 and 2 The fin assembly 2 includes several rectangular sheet-like fins 21. The number of fins 21 is at least twelve, and the number of fins 21 is adjusted appropriately according to the actual heat dissipation area. The fins 21 are aluminum sheet structures. The end face of the fins 21 is perpendicular to the end face of the mounting base plate 1. One side of the fins 21 is connected to the end face of the mounting base plate 1 by welding, and the side of the fins 21 away from the mounting base plate 1 is connected to the air duct assembly 3 by welding. All the fins 21 are evenly distributed circumferentially along a straight line perpendicular to the end face of the mounting base plate 1. When viewed from the direction perpendicular to the end face of the mounting base plate 1, the fins 21 are strip-shaped. All the fins 21 are distributed radially, and the extensions of the fitted line segments of all the fins 21 intersect at the same point. The beginning and end points of the fitted line segments of two adjacent fins 21 are connected to form a trapezoid. The length of the long base of the trapezoid is less than half of its height.

[0045] Reference Figure 2 With the above structure, two adjacent fins 21, the mounting base plate 1, and the air duct assembly 3 surround and form a first air duct 6. The number of first air ducts 6 is equal to the number of fins 21, and all the first air ducts 6 are connected to form a ring. The length of the first air duct 6 is greater than twice the distance between its openings, and the extension direction of each first air duct 6 has a certain angle with the end faces of the fins 21 on both sides. Therefore, when the airflow generated by the air-generating assembly 4 passes through the first air duct 6, part of the airflow is squeezed by the action of the fins 21, so the airflow has more contact with the fins 21. When the airflow flows through the first air duct 6, it can carry away more heat from the fins 21, thus improving the heat dissipation efficiency.

[0046] Reference Figure 2 Meanwhile, as the airflow passes through the first air duct 6, the cross-sectional area of ​​the first air duct 6 gradually decreases with the direction of airflow, causing the airflow speed to gradually increase. As the airflow flows through the first air duct 6, its temperature also gradually increases due to the heat dissipation process. Therefore, in this scheme, the airflow with lower temperature has a slower flow rate in the first air duct 6, while the airflow with higher temperature has a faster flow rate in the first air duct 6. Ultimately, this makes the heat dissipation effect in each area of ​​the fin 21 more uniform, thereby improving the overall heat dissipation efficiency.

[0047] Reference Figure 1 and 2The water-cooling assembly 5 includes a number of cooling pipes 51. In this embodiment, the number of cooling pipes 51 is three. In other embodiments, the number of cooling pipes 51 can be other integers. The cooling pipes 51 are made of thermally conductive material and are arranged in a ring shape inside the fin assembly 2. The annular part of the cooling pipe 51 extends perpendicularly to the end face of the fin 21. Both ends of the cooling pipe 51 are bent towards the air duct assembly 3 and protrude along the air duct assembly 3. Both ends of the cooling pipe 51 are water inlets and water outlets. Both ends of the cooling pipe 51 can be connected to pipe connectors. With the above structure, the water inlets and water outlets of the cooling pipes 51 can be connected to the cold water tank through connecting pipes with pipe connectors, and the cooling pipes 51 can also be connected to each other through connecting pipes with pipe connectors.

[0048] Reference Figure 1 and 2 Each fin assembly 21 has a circular mounting hole 211 for mounting a cooling pipe 51. The diameter of the mounting hole 211 is adapted to the outer diameter of the cooling pipe 51. The number of mounting holes 211 is equal to the number of cooling pipes 51. When viewed from a direction perpendicular to the end face of the fin assembly 21, the three mounting holes 211 are arranged linearly and equidistantly. The angle between the line connecting the centers of the three mounting holes 211 and the mounting base plate 1 is less than 30°. One of the mounting holes 211 is set close to the end face of the mounting base plate 1. When the cooling pipe 51 is installed in the fin assembly 2 along the mounting hole 211, when viewed from the direction extending along one of the first air ducts 6, the three drain pipes overlap each other. When viewed from the direction perpendicular to the direction extending along the first air duct 6, the three drain pipes are spaced apart.

[0049] Reference Figure 2 and 3 Through the above structure, firstly, the fin assembly 2 fixes and supports the cooling pipe 51 through the mounting hole 211, so the cooling pipe 51 does not need an additional fixing structure; secondly, when coolant flows inside the cooling pipe 51, the heat inside the fin assembly 21 can be transferred to the coolant through heat conduction and carried away, and at the same time, the heat inside the mounting base plate 1 can also be conducted to the cooling pipe 51 that is in contact with the mounting base plate 1, and thus carried away by the coolant, ultimately improving the heat dissipation efficiency; when the coolant flows inside the cooling pipe 51, the airflow flowing through the first air duct 6 can contact the outer surface of the cooling pipe 51 and carry away the heat inside the cooling pipe 51, further improving the heat dissipation efficiency. At the same time, when the airflow passing through the first air duct 6 contacts the cooling pipe 51, the cooling pipe 51 guides the airflow upward or downward, causing the air to flow close to the end face of the mounting base plate 1 or the air duct assembly 3, further improving the heat dissipation efficiency.

[0050] Reference Figure 1 and 3Specifically, the air duct assembly 3 is a horn-shaped structure made of thermally conductive metal. The horn opening of the air duct assembly 3 is positioned directly opposite the fin assembly 2. The air duct assembly 3 is connected to the end of all fins 21 away from the mounting base plate 1 by welding. The air duct assembly 3 extends along the horn opening in a direction away from the fin assembly 2 to form a second air duct 31. The second air duct 31 is a hollow frustum shape and is set perpendicular to the end face of the mounting base plate 1. The cross-sectional area of ​​the second air duct 31 gradually increases in the direction away from the mounting base plate 1. When viewed in a direction perpendicular to the end face of the mounting base plate 1, the center of the fin assembly 2 overlaps with the center of the second air duct 31. Through the above structure, the fin assembly 2 supports the air duct assembly 3 while the heat inside the fin assembly 2 can be conducted to the air duct assembly 3, further improving the overall heat dissipation efficiency.

[0051] Reference Figure 1 and 3 The air-generating component 4 includes a motor 41 and an axial fan blade 42. The axial fan blade 42 is rotatably connected to the motor 41, and the motor 41 is fixedly connected to the inner wall of the second air duct 31 through a mounting bracket. The motor 41 can drive the axial fan blade 42 to rotate. When the motor 41 drives the axial fan blade 42 to rotate, the air flows evenly in each of the first air ducts 6. The airflow from the first air duct 6 converges at the opening of the second air duct 31 and then flows through the second air duct 31. Due to the flared structure of the air duct component 3, the convection effect of the airflow from the first air duct 6 is relatively reduced during the convergence process. Moreover, as the air flows through the second air duct 31, the cross-sectional area of ​​the second air duct 31 gradually increases with the direction of airflow, thus reducing the air recirculation effect and improving the overall heat dissipation efficiency.

[0052] In summary, the airflow generated by the air-generating component 4 passes sequentially through the first air duct 6 and the second air duct 31. As the airflow passes through the first air duct 6, the cross-sectional area of ​​the first air duct 6 gradually decreases along the airflow direction, allowing the airflow to better remove heat from the fins 21 on both sides of the first air duct 6. Therefore, both ends of each fin 21 can efficiently exchange heat with the airflow. In addition, the water-cooling component 5 can remove heat from the fin assembly 2 and the mounting base plate 1 through the coolant. At the same time, the airflow flowing through the first air duct 6 can also remove some heat from the water-cooling component 5. The water-cooling component 5 allows the airflow flowing through the first air duct 6 to have better contact with the mounting base plate 1 and the air duct assembly 3. The water-cooling system and the air-cooling system have a mutually reinforcing effect, ultimately resulting in a significant improvement in the overall heat dissipation efficiency.

[0053] The implementation principle of Example 1 is as follows: First, the cooling pipe 51 is connected to the cold water tank through the connecting pipe. Then, the cold water tank supplies flowing coolant to the cooling pipe 51. At the same time, the motor 41 is turned on, and the axial fan blade 42 generates airflow that flows through the first air duct 6 and the second air duct 31 in sequence. The heat in the integrated circuit board connected to the mounting base plate 1 is first conducted to the mounting base plate 1. The heat in the mounting base plate 1 is transferred to the fin assembly 2, the cooling pipe 51 and the air-generating assembly 4. Finally, the heat is carried away by the coolant or the airflow, thus achieving high-efficiency heat dissipation.

[0054] Example 2

[0055] Reference Figure 4 The difference between this embodiment and embodiment 1 is that the fin piece 21 is in the shape of an arc plate, the angle corresponding to the arc length of the fin piece 21 is X°, the fin assembly 2 includes Y fin pieces 21, X is less than or equal to 30, Y is greater than or equal to 12, and the product of X and Y is less than or equal to 360; when viewed along the direction perpendicular to the end face of the mounting base plate 1, the extension lines of the line segments formed by connecting the beginning and end of all the fin pieces 21 intersect at the same point.

[0056] With the above structure, the first air duct 6 is arc-shaped, and the airflow can better contact the side of the fin 21 during the process of flowing through the first air duct 6, thereby better removing the heat inside the fin 21 and ultimately improving the heat dissipation efficiency.

[0057] This application also discloses a power module.

[0058] Reference Figure 5 A power module includes a number of the aforementioned heat dissipation base plates, all of which are arranged in an array, and the fin assemblies 2 in all of the heat dissipation base plates face the same side. The water-cooling assemblies 5 in the same row of heat dissipation base plates use the same cold water tank, and the water-cooling assemblies 5 in two adjacent heat dissipation base plates in the same row are connected by connecting pipes.

[0059] With the above structure, one water source can supply coolant to multiple heat dissipation base plates. At the same time, the fin assembly 2 on two adjacent heat dissipation base plates in the same row or column has equal spacing. Theoretically, all heat dissipation components have the same heat dissipation efficiency, making the overall heat dissipation efficiency more uniform.

[0060] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation base plate, comprising a mounting base plate (1) for mounting an integrated circuit board and a fin assembly (2) for heat dissipation, wherein one end face of the mounting base plate (1) is used for mounting the integrated circuit board, and the other end face of the mounting base plate (1) is used for connecting the fin assembly (2), characterized in that: It also includes a duct assembly (3) and a wind-generating assembly (4) for generating airflow. The fin assembly (2) includes a number of fins (21). The fins (21) are distributed circumferentially along a straight line perpendicular to the mounting base plate (1). One end of the fin (21) is connected to the end face of the mounting base plate (1), and the other end of the fin (21) is connected to the duct assembly (3). Two adjacent fins (21), the mounting base plate (1), and the duct assembly (3) form a first duct (6). The duct assembly (3) is made of thermally conductive material. The duct assembly (3) is provided with a second duct (31). The wind-generating assembly (4) enables air to flow sequentially through all the first duct (6) and the second duct (31). The air duct assembly (3) is horn-shaped, and the opening direction of the air duct assembly (3) is directly opposite to the end face of the mounting base plate (1) where the fin assembly (2) is located; The cross-sectional area of ​​the first air duct (6) gradually decreases along the airflow direction generated by the air-generating component (4); The second air duct (31) is a hollow frustum shape, perpendicular to the end face of the mounting base plate (1), and its cross-sectional area gradually increases along the direction away from the mounting base plate (1); the air duct assembly (3) is a horn-shaped structure made of heat-conducting metal, and is fixedly connected to the end of the fin (21) away from the mounting base plate (1) by welding; the center of the fin assembly (2) overlaps with the center of the second air duct (31) along the direction perpendicular to the end face of the mounting base plate (1); The air-generating component (4) is disposed within the second air duct (31).

2. The heat dissipation base plate according to claim 1, characterized in that: Viewed perpendicular to the end face of the mounting base plate (1), the fin (21) has an arc-shaped thin sheet structure.

3. A heat dissipation base plate according to claim 2, characterized in that: The angle corresponding to the arc length of the fin (21) is X°, and the number of the fins (21) is greater than Y, X is less than or equal to 30, Y is greater than or equal to 12, and the product of X and Y is less than or equal to 360.

4. A heat dissipation base plate according to claim 1, characterized in that: It also includes a water-cooling assembly (5), which includes a cooling pipe (51) for introducing coolant. There are several cooling pipes (51). The fin (21) is provided with a mounting hole (211). The cooling pipe (51) passes through the fin (21) along the mounting hole (211).

5. A heat dissipation base plate according to claim 4, characterized in that: Looking along the first air duct (6), all the cooling pipes (51) do not overlap, and when viewed from the end face perpendicular to the mounting base plate (1), there is a gap between two adjacent cooling pipes (51).

6. A heat dissipation base plate according to claim 4, characterized in that: At least one of the cooling pipes (51) is set close to the end face of the mounting base plate (1).

7. A power module, characterized in that: Includes a number of heat dissipation base plates as described in any one of claims 1-6.

8. A power module according to claim 7, characterized in that: All heat dissipation base plates are arranged in an array, and the fin assemblies (2) on all heat dissipation base plates are arranged in an array.

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