Display module, binding method and display device

Abstract

A display module, bonding method, and display device are disclosed. The display module includes a display substrate, bonding elements, and conductive silver paste. The display substrate includes at least two first pads, and at least one first groove is formed on the surface of the first pads away from the display substrate. The bonding element includes at least two second pads, and each second pad includes at least one first through-hole, which penetrates the second pad and the bonding element. The first pads and second pads are in contact in a direction perpendicular to the display substrate, and the orthographic projection of the first through-hole on the display substrate is within the range of the orthographic projection of the first groove on the display substrate. The conductive silver paste fills the first through-hole and the first groove, thereby bonding the display substrate and the bonding element.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module, a bonding method, and a display device. Background Technology

[0002] In the field of display technology, organic light-emitting diode (OLED) panel display technology has been widely used in mobile phone screens, computer monitors, automotive displays and other fields due to its many advantages such as fast response speed, high contrast, wide viewing angle, low power consumption and wide color gamut. It is recognized as the next generation of flexible display technology with the greatest development potential.

[0003] In some technologies, when a display substrate is bonded to bonding components such as chip-on-flex (COF) or flexible printed circuit (FPC), anisotropic conductive film (ACF) is used for bonding to enable signal conduction between different bonding components.

[0004] The inventors of this application have discovered that the signal conduction effect between bonding elements using anisotropic conductive adhesive film is poor. Summary of the Invention

[0005] This disclosure provides a display module, a bonding method, and a display device, which can solve the problem of poor signal conduction between bonding elements using anisotropic conductive adhesive films.

[0006] In a first aspect, embodiments of this disclosure provide a display module, comprising: a display substrate, a bonding element, and conductive silver paste; the display substrate includes at least two first pads, and at least one first groove is provided on the surface of the first pads away from the display substrate; the bonding element includes at least two second pads, and the second pads include at least one first through hole, the first through hole penetrating the second pads and the bonding element; in a direction perpendicular to the display substrate, the first pads and the second pads are in contact, and the orthographic projection of the first through hole on the display substrate is within the range of the orthographic projection of the first groove on the display substrate; the conductive silver paste fills the first through hole and the first groove, thereby bonding the display substrate and the bonding element.

[0007] In one exemplary embodiment, the bonding element further includes a second through-hole located between adjacent second pads; the display module further includes adhesive filling the second through-hole, the orthographic projection of the adhesive on the display substrate surrounding the orthographic projections of the first pad and the second pad on the display substrate.

[0008] In one exemplary embodiment, the bonding element further includes a second through-hole located between adjacent second pads; the display module further includes adhesive filling the second through-hole, the orthographic projection of the adhesive on the display substrate covering the orthographic projections of the first pad and the second pad on the display substrate.

[0009] In one exemplary embodiment, the adhesive material is a UV adhesive.

[0010] In one exemplary embodiment, the orthographic projection of the first groove on the display substrate is rectangular, and the orthographic projection of the first through hole on the display substrate is circular.

[0011] In one exemplary embodiment, the display substrate includes a display area and a bonding pin area located on one side of the display area, wherein a plurality of first pads are located within the bonding pin area and are parallel to each other.

[0012] Secondly, embodiments of this disclosure provide a bonding method, the method comprising: providing a first bonding element, the first bonding element including at least two first pads, and forming at least one first groove on the surface of the first pads away from the first bonding element; providing a second bonding element, the second bonding element including at least two second pads, and pre-processing the second pads, comprising: forming at least one first through hole on the second pads, the first through hole penetrating the second pads and the second bonding element; fitting the first bonding element and the second bonding element together such that the first pads and the second pads are in contact, and in a direction perpendicular to the first bonding element, the orthographic projection of the first through hole on the first bonding element is within the range of the orthographic projection of the first groove on the first bonding element; filling the first through hole and the first groove with conductive silver paste, thereby achieving a bonding connection between the first bonding element and the second bonding element.

[0013] In one exemplary embodiment, the pretreatment of the second pad further includes: attaching an isolation film to the surface of the second bonding element away from the second pad using an adhesive, wherein the orthographic projection of the isolation film on the second bonding element covers the orthographic projection of the second pad on the second bonding element; and the first through-hole penetrates the adhesive and the isolation film.

[0014] In one exemplary embodiment, when the release film is applied, the orthographic projection of the release film onto the second bonding element is positioned outside the range of the second bonding element in at least one direction, and the release film exposed outside the range of the second bonding element forms a tear handle.

[0015] In one exemplary embodiment, the pretreatment of the second pad further includes forming at least one second through-hole on the second bonding element between adjacent second pads, the second through-hole exposing the surface of the adhesive.

[0016] In an exemplary embodiment, filling the first through-hole and the first groove with conductive silver paste includes: applying the conductive silver paste to the surface of the isolation membrane on the side away from the second bonding element, wherein the conductive silver paste enters the first groove of the first bonding element through the first through-hole of the second bonding element.

[0017] In one exemplary embodiment, after filling the first through hole and the first groove with conductive silver paste, the method further includes: peeling off the isolation film and removing the adhesive.

[0018] In one exemplary embodiment, after peeling off the release film and removing the adhesive, the method further includes: injecting adhesive into the second through hole, the adhesive filling the second through hole, the orthographic projection of the adhesive on the first bonding element surrounding the orthographic projection of the first pad and the second pad on the first bonding element.

[0019] In one exemplary embodiment, after peeling off the release film and removing the adhesive, the method further includes: applying adhesive to the surface of the second bonding element away from the first bonding element, the adhesive filling the second through hole, and the orthographic projection of the adhesive on the first bonding element covering the orthographic projections of the first pad and the second pad on the first bonding element.

[0020] Thirdly, embodiments of the present invention also provide a display device, including the display module described above.

[0021] The display module proposed in this embodiment uses conductive silver paste instead of anisotropic conductive adhesive film for bonding. Because conductive silver paste has advantages such as low curing temperature, high bonding strength, stable electrical properties, and suitability for screen printing, applying it to the bonding process can significantly improve conductivity and thus enhance bonding quality. This solves the problem of poor signal conductivity between bonded components using anisotropic conductive adhesive film.

[0022] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0023] The accompanying drawings are provided to further understand the technical solutions of this disclosure and constitute a part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure.

[0024] Figure 1 This is a schematic diagram showing the display substrate and bonding components after bonding.

[0025] Figure 2 for Figure 1 Sectional view at point AA;

[0026] Figure 3 A schematic diagram of the structure of a display module provided for an exemplary embodiment of this disclosure;

[0027] Figure 4 This is a schematic diagram of the structure of a display module provided in yet another embodiment of the present disclosure;

[0028] Figure 5 This is a schematic diagram of the structure of a display substrate in an exemplary embodiment;

[0029] Figure 6 This is a side view of the first groove formed on the first pad of the display substrate in an exemplary embodiment;

[0030] Figure 7 A side view of the bonding element after an isolation film has been attached to the surface away from the second pad in an exemplary embodiment;

[0031] Figure 8 This is a side view of the bonding element and the insulating membrane after the first through hole has been formed in an exemplary embodiment;

[0032] Figure 9 This is a side view of the bonding element after a second through hole has been formed in an exemplary embodiment.

[0033] Figure 10 This is a bottom view of the binding element after a second through hole is formed on it, as shown in an exemplary embodiment.

[0034] Figure 11 In an exemplary embodiment, a side view of the display substrate and bonding elements after pre-bonding is provided;

[0035] Figure 12This is a side view of the insulating membrane after conductive silver paste has been applied to the surface away from the bonding element in an exemplary embodiment.

[0036] Figure 13 A side view of the module after the release liner has been peeled off in an exemplary embodiment;

[0037] Figure 14 A top view of the module after adhesive has been applied to the surface of the bonding components. Detailed Implementation

[0038] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Note that the embodiments can be implemented in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in many ways without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the contents described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0039] In the accompanying drawings, the size of the constituent elements, the thickness of the layers, or the area are sometimes exaggerated for clarity. Therefore, one aspect of this disclosure is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0040] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0041] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of each constituent element being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0042] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0043] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0044] In this specification, a transistor is a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between its drain (drain electrode terminal, drain region, or drain electrode) and its source (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the region through which current primarily flows.

[0045] In this specification, the first electrode can be the drain electrode and the second electrode can be the source electrode, or vice versa. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "source electrode" and "drain electrode" may sometimes be interchanged. Therefore, in this specification, the "source electrode" and "drain electrode" can be interchanged.

[0046] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0047] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may sometimes be replaced with "conductive film." Similarly, "insulating film" may sometimes be replaced with "insulating layer."

[0048] In this specification, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, as are chamfers, curved edges, and other variations.

[0049] Figure 1 This is a schematic diagram showing the display substrate and bonding components after bonding. (Example) Figure 1 As shown, the display module includes a display substrate 100 and a bonding element 200. The bonding element 200 can be, for example, a chip-on-flex (COF) film or a flexible printed circuit (FPC). In this embodiment, the bonding element 200 is described as a COF film. The display substrate 100 and the bonding element 200 have an overlapping area in a direction perpendicular to the display substrate 100. In the overlapping area of ​​the display substrate 100 and the bonding element 200, the display substrate 100 includes a first pad 101, and the bonding element 200 includes a second pad 201. The first pad 101 and the second pad 201 correspond one-to-one, and the first pad 101 and the second pad 201 are bonded together by anisotropic conductive film (ACF) 303. The first pad 101 and the second pad 201 can be electrically connected through the conductive particles of the anisotropic conductive film 303, so that the display substrate 100 and the bonding element 200 are bonded together. The orthographic projection of the first pad 101 and the second pad 201 on the display substrate 100 is within the range of the orthographic projection of the anisotropic conductive film 303 on the display substrate 100. To improve the sealing performance of the display module at the bonding connection, the cross-section of the anisotropic conductive adhesive film 303 is sealed using a first sealant 301 and a second sealant 302. The first sealant 301 can be called the positive adhesive, and the second sealant 302 can be called the back adhesive. Figure 2 for Figure 1 A sectional view at point AA. (See image.) Figure 1 and Figure 2 As shown, a plurality of first pads 101 are provided on the display substrate 100, and each of the plurality of first pads 101 is connected to a plurality of second pads 201 located on the bonding element 200. Along the extending direction of the first pads 101, the second pads 201 are parallel to their corresponding first pads 101. When the display substrate 100 and the bonding element 200 are bonded together, in a direction perpendicular to the display substrate 100, the conductive particles located between the corresponding first pads 101 and second pads 201 are compressed and leak, causing conductivity between the corresponding first pads 101 and second pads 201. Conductive particles located in other positions experience less force and do not leak, thus preventing conductivity between adjacent first pads 101 or adjacent second pads 201.

[0050] The inventors of this application have discovered that when using anisotropic conductive adhesive films for bonding, electrical connections between corresponding pads are achieved through the breakage and leakage of conductive particles. The bursting of these conductive particles directly affects the conductivity, resulting in unstable electrical connections between different bonded components and suboptimal conductivity. Furthermore, this bonding process is quite challenging, requiring precise control over temperature, pressure, and bonding time.

[0051] This disclosure provides a display module, including: a display substrate, bonding elements, and conductive silver paste; the display substrate includes at least two first pads, and at least one first groove is provided on the surface of the first pads away from the display substrate; the bonding elements include at least two second pads, and the second pads include at least one first through hole, the first through hole penetrating the second pads and the bonding elements; in a direction perpendicular to the display substrate, the first pads and the second pads are in contact, and the orthographic projection of the first through hole on the display substrate is within the range of the orthographic projection of the first groove on the display substrate; the conductive silver paste fills the first through hole and the first groove, thereby bonding the display substrate and the bonding elements.

[0052] The display module provided in this disclosure uses conductive silver paste instead of anisotropic conductive adhesive film for bonding. Since conductive silver paste has advantages such as low curing temperature, high bonding strength, stable electrical properties, and suitability for screen printing, applying it to the bonding process can significantly improve conductivity and thus improve bonding quality. Furthermore, the display module provided in this disclosure can eliminate the need for adhesive backing and adhesive fronting, helping to save costs.

[0053] In one exemplary embodiment, the bonding element further includes a second through-hole located between adjacent second pads; the display module further includes adhesive filling the second through-hole, the orthographic projection of the adhesive on the display substrate surrounding the orthographic projections of the first pad and the second pad on the display substrate.

[0054] In one exemplary embodiment, the bonding element further includes a second through-hole located between adjacent second pads; the display module further includes adhesive filling the second through-hole, the orthographic projection of the adhesive on the display substrate covering the orthographic projections of the first pad and the second pad on the display substrate.

[0055] In one exemplary embodiment, the adhesive material is a UV adhesive.

[0056] In one exemplary embodiment, the orthographic projection of the first groove on the display substrate is rectangular, and the orthographic projection of the first through hole on the display substrate is circular.

[0057] In one exemplary embodiment, the display substrate includes a display area and a bonding pin area located on one side of the display area, wherein a plurality of first pads are located within the bonding pin area and are parallel to each other.

[0058] Figure 3 A schematic diagram of the structure of a display module provided for an exemplary embodiment of this disclosure. Figure 4 This is a schematic diagram of the structure of a display module provided in yet another embodiment of this disclosure. (See diagram below.) Figure 3 and Figure 4 As shown, the display module includes a display substrate 10, bonding elements 20, and conductive silver paste 40. The display substrate 10 includes at least two first pads 11, and the bonding elements 20 include at least two second pads 21. The first pads 11 and second pads 21 correspond one-to-one and are in contact with each other. At least one first groove is provided on the surface of the first pad 11 away from the display substrate 10. The second pad 21 includes at least one first through-hole, which penetrates both the second pad 21 and the bonding elements 20. In a direction perpendicular to the display substrate 10, the orthographic projection of the first through-hole onto the display substrate 10 lies within the range of the orthographic projection of the first groove onto the display substrate 10. The conductive silver paste 40 fills the first through-hole and the first groove, thereby bonding the display substrate 10 and the bonding elements 20.

[0059] In an exemplary embodiment, a first groove is provided on the side surface of the first pad 11 away from the display substrate 10, and the second pad 21 includes at least one first through hole, the orthographic projection of the first through hole on the display substrate 10 being within the range of the orthographic projection of the first groove on the display substrate 10.

[0060] In an exemplary embodiment, the surface of the first pad 11 away from the display substrate 10 is provided with at least two first grooves, and the second pad 21 includes at least two first through holes. The orthographic projection of the first through holes on the display substrate 10 is within the range of the orthographic projection of the first grooves on the display substrate 10.

[0061] In an exemplary embodiment, the bonding element 20 further includes a second through-hole located between adjacent second pads 21. The display module also includes adhesive 50 filling the second through-hole. The orthographic projection of the adhesive 50 on the display substrate surrounds the orthographic projections of the first pad 11 and the second pad 21 on the display substrate. Figure 4 As shown.

[0062] In an exemplary embodiment, the bonding element 20 further includes a second through-hole located between adjacent second pads 21. The display module also includes adhesive 50 filling the second through-hole. The orthographic projection of the adhesive 50 on the display substrate covers the orthographic projections of the first pad 11 and the second pad 21 on the display substrate. Figure 3 As shown.

[0063] In an exemplary embodiment, the material of adhesive 50 may be a UV adhesive.

[0064] In an exemplary embodiment, the first pad 11 and the second pad 21 can be rectangles of the same size. In other embodiments, the shape and size of the first pad 11 and the second pad 21 can be set as needed, and this disclosure does not limit this.

[0065] In an exemplary embodiment, the orthographic projection of the first groove on the display substrate 10 can be rectangular. In other embodiments, the orthographic projection of the first groove on the display substrate 10 can be circular, elliptical, triangular, quadrilateral, other polygonal shapes, or irregular shapes, and this disclosure does not limit this.

[0066] In an exemplary embodiment, the orthographic projection of the first through-hole onto the display substrate 10 can be circular. In other embodiments, the orthographic projection of the first groove onto the display substrate 10 can be rectangular, elliptical, triangular, quadrilateral, other polygonal shapes, or irregular shapes, and this disclosure does not impose any limitations on this.

[0067] In an exemplary embodiment, the display substrate includes a display area and a bonding pin area located on one side of the display area, wherein a plurality of first pads are located within the bonding pin area and are parallel to each other.

[0068] Figure 5 This is a schematic diagram of the structure of a display substrate in an exemplary embodiment. On a plane parallel to the display substrate 10, the display substrate 10 may include at least a display area 110, a bonding area 120 located on one side of the display area 110, and border areas 130 located on other sides of the display area 110. In an exemplary embodiment, the display area 110 may be a flat area including a plurality of sub-pixels Pxij constituting a pixel array. The plurality of sub-pixels Pxij are configured to display moving images or still images, and the display area 110 may be referred to as the effective area (AA). In an exemplary embodiment, the display substrate 10 may be deformable, for example, rolled up, bent, folded, or rolled up. Figure 5The display substrate 10 and the display area 110 are both rectangular in shape. In other embodiments, the display substrate 10 and the display area 110 may have different shapes and may be other shapes, such as circles, triangles, quadrilaterals, other polygonal shapes or irregular shapes. This disclosure does not limit them.

[0069] In an exemplary embodiment, the bonding region 120 may include at least a driver chip region and a bonding pin region arranged sequentially along a direction away from the display region 110. A plurality of first pads 11 may be located within the bonding pin region, and the plurality of first pads 11 may be parallel to each other. An integrated circuit (IC) 240 may be bonded to the driver chip region, and a flexible circuit board 250 may be bonded to the bonding pin region.

[0070] The following describes the preparation Figure 3 Taking the display module shown as an example, the preparation process of the display module in this embodiment of the present disclosure is described. In the following preparation process, the bonding element can be a flip-chip film. That is, in this embodiment, the bonding connection between the display substrate and the flip-chip film is illustrated as an example.

[0071] (1) Forming a first groove on a first pad of a display substrate. In an exemplary embodiment, forming a first groove on a first pad of a display substrate may include:

[0072] A first groove is formed on the surface of each first pad away from the display substrate by etching. The orthographic projection of the first groove on the display substrate is within the range of the orthographic projection of the first pad on the display substrate.

[0073] Figure 6 This is a side view of the display substrate after a first groove has been formed on the first pad in an exemplary embodiment. Figure 6 As shown, the display substrate 10 may include a plurality of first pads 11. Each first pad 11 has a first groove T1 on its surface away from the display substrate 10. The orthographic projection of the first groove T1 on the display substrate 10 is within the range of the orthographic projection of the first pad 11 on the display substrate 10. Because conductive silver paste has fluidity, to avoid short circuits caused by conduction between adjacent first pads 11, a first groove T1 is formed on the surface of each first pad 11 away from the display substrate 10. During bonding with bonding elements, the first groove T1 can be used to contain the conductive silver paste, restricting the lateral flow of the conductive silver paste, thereby controlling the connection between the display substrate 10 and the bonding element 20 only between the first pads 11 and the second pads 12. In practical applications, the size of the first groove T1 can be set as needed.

[0074] In an exemplary embodiment, a plurality of first grooves T1 may be formed on the surface of a single first pad 11 away from the display substrate 10 as needed. The number and distribution of the plurality of first grooves T1, as well as the shape and size of the single first groove T1, may be set as needed, and this disclosure does not limit this.

[0075] (2) Applying a release film to the surface of the bonding element away from the second pad. In an exemplary embodiment, applying a release film to the surface of the bonding element away from the second pad includes:

[0076] An adhesive is used to attach a release liner to the surface of the bonding component on the side away from the second pad. The orthogonal projection of the release liner on the bonding component can cover the orthogonal projection of the second pad on the bonding component.

[0077] Figure 7 This is a side view of an exemplary embodiment after an isolation film has been attached to the surface of the bonding element away from the second pad. Figure 7 As shown, one side surface of the bonding element 20 includes a plurality of second pads 21. In an exemplary embodiment, an isolation film 31 is attached to the surface of the bonding element 20 away from the second pads 21 by an adhesive 30. The orthographic projection of the isolation film 31 on the bonding element 20 can cover the orthographic projection of the second pads 21 on the bonding element 20.

[0078] In an exemplary embodiment, the orthographic projection of the release film 31 onto the bonding element 20 may be located outside the range of the bonding element 20 in at least one direction. The release film 31 exposed outside the range of the bonding element 20 forms a tear handle 32, which facilitates the subsequent peeling of the release film 31 from the bonding element 20. The tear handle 32 may be provided on one or more sides of the periphery of the bonding element 20 as needed, and this disclosure does not limit this.

[0079] (3) Forming a first through-hole on the bonding element and the separator. In an exemplary embodiment, forming the first through-hole on the bonding element and the separator includes:

[0080] At least one first through-hole is formed on each second pad of the bonding element, the orthographic projection of the first through-hole on the bonding element is within the range of the orthographic projection of the second pad on the bonding element, and the release film, adhesive, bonding element and second pad within the first through-hole are removed.

[0081] Figure 8 This is a side view of the bonding element and the insulating membrane after the first through-hole has been formed in an exemplary embodiment. Figure 8As shown, each second pad 21 of the bonding element 20 may include a first through-hole K1, the orthographic projection of the first through-hole K1 on the bonding element 20 being within the range of the orthographic projection of the second pad 21 on the bonding element 20. The release liner 31, adhesive 30, bonding element 20, and second pad 21 within the first through-hole K1 are removed. In subsequent steps, the first through-hole K1 can serve as an injection hole for conductive silver paste, and its shape and size can be set as needed.

[0082] In other embodiments, a single second pad 21 may include two or more first through holes K1. The number and distribution of the first through holes K1, as well as the shape and size of a single first through hole K1, may be set as needed, and this disclosure does not limit this.

[0083] (4) Forming a second through hole on the bonding element. In an exemplary embodiment, forming a second through hole on the bonding element includes:

[0084] At least one second through-hole is formed on the bonding element between adjacent second pads, wherein the orthographic projection of the second through-hole on the bonding element lies outside the range of the orthographic projection of the second pad on the bonding element. The bonding element within the second through-hole is removed, exposing the surface of the adhesive.

[0085] Figure 9 This is a side view of the bonding element after a second through hole has been formed in an exemplary embodiment. Figure 9 As shown, at least one second through-hole K2 can be formed on the bonding element 20 between adjacent second pads 21. The orthographic projection of the second through-hole K2 on the bonding element 20 is outside the range of the orthographic projection of the second pad 21 on the bonding element 20. The bonding element 20 within the second through-hole K2 is removed, exposing the surface of the adhesive 30. In subsequent steps, the second through-hole K2 can serve as an adhesive injection hole, and its shape and size can be set as needed.

[0086] In an exemplary embodiment, the number of second through holes K2, the distribution of different second through holes K2 on the bonding elements 20 between adjacent second pads 21, and the shape and size of a single second through hole K2 can be set as needed, and this disclosure does not limit them.

[0087] In an exemplary embodiment, the second through hole may be formed first, followed by the first through hole; alternatively, the timing of forming the first and second through holes may be chosen as needed, and this disclosure does not impose any restrictions on this.

[0088] Figure 10 This is a bottom view of the bonding element after a second through hole has been formed on it in an exemplary embodiment. Figure 10As shown, one side surface of the bonding element 20 includes a plurality of second pads 21, which can be rectangular in shape. A release film 31 is attached to the side surface of the bonding element 20 away from the second pads 21. The orthographic projection of the release film 31 on the display substrate 10 can cover the orthographic projection of the second pads 21 on the display substrate 10. The orthographic projection of the release film 31 on the bonding element 20 can be located outside the range of the bonding element 20 in at least one direction. The release film 31 exposed outside the range of the bonding element 20 forms a peel handle 32, which facilitates subsequent peeling of the release film 31 from the bonding element 20. Each second pad 21 includes a first through-hole K1, which can be circular. The release film 31, adhesive 30, bonding element 20, and second pad 21 within the first through-hole K1 are removed. The orthographic projection of the first through-hole K1 on the bonding element 20 is located within the range of the orthographic projection of the second pad 21 on the bonding element 20. At least one second through hole K2 is included on the bonding element 20 between adjacent second pads 21. The second through hole K2 may be circular. The bonding element 20 within the second through hole K2 is removed, exposing the surface of the adhesive 30. The orthographic projection of the second through hole K2 on the bonding element 20 is outside the range of the orthographic projection of the second pad 21 on the bonding element 20.

[0089] In an exemplary embodiment, the preprocessing of the bonding element 20 described above can be completed first, and then the preprocessing of the display substrate 10 can be completed. This disclosure does not limit this.

[0090] (5) Pre-bonding the display substrate and bonding elements. In an exemplary embodiment, pre-bonding the display substrate and bonding elements includes:

[0091] The side of the display substrate with the first pad is attached to the side of the bonding element with the second pad. The first pad and the second pad can be in direct contact, so that the first pad and the second pad correspond one to one. In the direction perpendicular to the display substrate, the orthogonal projection of the first through hole on the display substrate can be located within the range of the orthogonal projection of the first groove on the display substrate.

[0092] Figure 11 In an exemplary embodiment, a side view of the display substrate and bonding elements after pre-attachment is shown. Figure 11 As shown, the side of the display substrate 10 with the first pad 11 can be attached to the side of the bonding element 20 with the second pad 21. The first pad 11 and the second pad 21 can be in direct contact. The first pad 11 and the second pad 21 are arranged in a one-to-one correspondence. In the direction perpendicular to the display substrate 10, the orthographic projection of the first through hole K1 on the display substrate 10 can be located within the range of the orthographic projection of the first groove T1 on the display substrate 10.

[0093] (6) Applying conductive silver paste to the surface of the separator away from the bonding element. In an exemplary embodiment, applying conductive silver paste to the surface of the separator away from the bonding element includes:

[0094] Conductive silver paste is applied to the surface of the release liner away from the bonding element using a roller coating method. The conductive silver paste can enter the first groove of the display substrate through the first through-hole of the bonding element, making the first pad and the second pad conductive. After coating, the conductive silver paste can cover the bonding element and fill the first through-hole and the first groove, achieving a bonding connection between the display substrate and the bonding element.

[0095] In an exemplary embodiment, conductive silver paste may not be applied to the side of the film-peeling handle away from the bonding element to facilitate subsequent peeling of the release liner; this disclosure does not limit this.

[0096] In an exemplary embodiment, other coating methods may be used to coat conductive silver paste over the separator, and this disclosure does not limit this.

[0097] Figure 12 This is a side view of the insulating membrane after conductive silver paste has been applied to the surface away from the bonding element in an exemplary embodiment. Figure 12 As shown, the conductive silver paste 40 can enter the first groove T1 through the first through hole K1 and fill both the first through hole K1 and the first groove T1, making the first pad 11 and the second pad 21 conductive. Since the first pad 11 and the second pad 21 are in direct contact and conductive through the conductive silver paste 40, the conductivity is excellent. Furthermore, the conductive silver paste 40 can act as an adhesive to bond the display substrate 10 and the bonding element 20 together.

[0098] In an exemplary embodiment, the orthographic projection of the film-peeling handle 32 on the display substrate 10 may be located outside the range of the orthographic projection of the conductive silver paste 40 on the display substrate 10.

[0099] (7) Peel off the release membrane.

[0100] Figure 13 This is a side view of the display module after the release liner has been peeled off in an exemplary embodiment. In the exemplary embodiment, the release liner 31 can be peeled off using the film peeling handle 32 to remove excess conductive silver paste, prevent lateral conductivity between adjacent pads, and remove the adhesive 30, exposing the second via K2. After peeling off the release liner, the display substrate 10 and the bonding element 20 are substantially bonded together, forming the display module.

[0101] Combination Figure 12 and Figure 13After the conductive silver paste is applied, the multiple second pads 21 are laterally conductive. By setting an isolation film on the bonding component, the excess conductive silver paste can be removed by peeling off the isolation film, which can solve the problem of conductive silver paste causing conductivity between different second pads 21.

[0102] (8) Apply adhesive to the side of the bonding element away from the display substrate.

[0103] In an exemplary embodiment, the display module, after applying adhesive to the surface of the bonding element away from the display substrate, can be as follows: Figure 3 As shown. Figure 3 As shown, the adhesive 50 can be located on the surface of the bonding element away from the display substrate. The adhesive 50 can enter the space enclosed by the display substrate 10, adjacent pads, and bonding element 20 through the second through-hole K2, thereby further bonding and fixing the display substrate 10 and the bonding element 20. In an exemplary embodiment, the orthographic projection of the adhesive 50 on the display substrate 10 can cover the orthographic projection of the second pad 21 on the display substrate 10. The adhesive 50 can both enhance the stability of the connection between the display substrate 10 and the bonding element 20 and wrap the bonding area to protect it.

[0104] In an exemplary embodiment, the adhesive 50 may be a UV adhesive, and this disclosure does not limit this.

[0105] In other embodiments, adhesive can be injected into the second through-hole K2, and the adhesive 50 can fill the second through-hole K2. The adhesive 50 may not cover the surface of the bonding element 20 on the side away from the display substrate 10. The orthographic projection of the adhesive 50 on the display substrate 10 surrounds the orthographic projections of the first pad 11 and the second pad 21 on the display substrate 10, forming... Figure 4 The display module shown. The coating range of the adhesive 50 can be set as needed, and this disclosure does not limit this.

[0106] Figure 14 A top view of the module after adhesive has been applied to the surfaces of the bonding components. (Example) Figure 14As shown, the display substrate 10 includes a plurality of first pads 11, and the bonding element 20 includes a plurality of second pads 21. The first pads 11 and the second pads 21 correspond one-to-one, and the second pads 21 and the first pads 11 can be in contact. Each second pad 21 includes at least one first through-hole K1. The isolation film, adhesive, bonding element and second pad in the first through-hole K1 are removed. The first through-hole K1 corresponds to the first groove T1 provided on the corresponding first pad 11. The orthographic projection of the first through-hole K1 on the display substrate 10 can be located within the range of the orthographic projection of the first groove T1 on the display substrate 10. Conductive silver paste 40 fills the first through-hole K1 and the first groove T1, so that the first pads 11 and the second pads 21 are connected. The bonding element 20 also includes a plurality of second through holes K2. The second through holes K2 can be disposed between adjacent second pads 21. The orthographic projection of the second through hole K2 on the display substrate 10 can be located at the orthographic projection of the second pad 21 on the display substrate 10. Adhesive 50 is coated on the surface of the bonding element 20 away from the display substrate 10. The adhesive 50 can enter the space enclosed by the display substrate 10, adjacent pads and bonding element 20 through the second through holes K2, thereby further bonding and fixing the display substrate 10 and the bonding element 20.

[0107] At this point, Figure 3 The display module shown is now complete. During the bonding process between the display substrate 10 and the bonding element 20, it is only necessary to align the first pad 11 and the second pad 21 before applying conductive silver paste 40; the preparation method is simple. Conductive silver paste has a low curing temperature, high bonding strength, and stable electrical properties, making it an ideal adhesive in the bonding process. By setting the first groove, the first through-hole, and the isolation film, the conductive silver paste is made to conduct only between the corresponding first and second pads, avoiding lateral conduction between different pads. The display module prepared by the above process has better conductivity.

[0108] This disclosure also provides a bonding method, the method comprising: providing a first bonding element, the first bonding element including at least two first pads, and forming at least one first groove on the surface of the first pads away from the first bonding element; providing a second bonding element, the second bonding element including at least two second pads, and pre-processing the second pads, including: forming at least one first through hole on the second pads, the first through hole penetrating the second pads and the second bonding element; fitting the first bonding element and the second bonding element together such that the first pads and the second pads are in contact, and in a direction perpendicular to the first bonding element, the orthogonal projection of the first through hole on the first bonding element is within the range of the orthogonal projection of the first groove on the first bonding element; filling the first through hole and the first groove with conductive silver paste, so that the first bonding element and the second bonding element are bonded together.

[0109] The bonding method proposed in this embodiment uses conductive silver paste instead of anisotropic conductive adhesive film for bonding. Since conductive silver paste has advantages such as low curing temperature, high bonding strength, stable electrical properties and suitability for screen printing, applying conductive silver paste to the bonding process can significantly improve the conductivity and thus improve the bonding quality.

[0110] In an exemplary embodiment, the first bonding element may be a display substrate, and the second bonding element may be a flip-chip film or a flexible circuit board; or, the first bonding element may be a flexible circuit board, and the second bonding element may be a flip-chip film or a flexible circuit board, and this disclosure does not limit this.

[0111] In an exemplary embodiment, pre-processing the second pad further includes: attaching an isolation film to the surface of the second bonding element away from the second pad using an adhesive, wherein the orthographic projection of the isolation film on the second bonding element can cover the orthographic projection of the second pad on the second bonding element; and a first through-hole penetrating the adhesive and the isolation film.

[0112] In an exemplary embodiment, when the release film is applied, the orthographic projection of the release film onto the second bonding element is positioned outside the range of the second bonding element in at least one direction, and the release film exposed outside the range of the second bonding element forms a tear handle.

[0113] In an exemplary embodiment, the pretreatment of the second pads further includes forming at least one second through-hole on a second bonding element between adjacent second pads, the second through-hole exposing the surface of the adhesive.

[0114] In an exemplary embodiment, filling the first through-hole and the first groove with conductive silver paste includes: coating the surface of the isolation membrane away from the second bonding element with conductive silver paste, and the conductive silver paste entering the first groove of the first bonding element through the first through-hole of the second bonding element.

[0115] In an exemplary embodiment, after filling the first through-hole and the first groove with conductive silver paste, the method further includes: peeling off the release liner to remove the adhesive. Peeling off the release liner removes excess conductive silver paste, preventing conductivity between different second pads.

[0116] In an exemplary embodiment, after peeling off the release film and removing the adhesive, the method further includes: injecting adhesive into the second through hole, the adhesive filling the second through hole, and the orthographic projection of the adhesive on the first bonding element surrounding the orthographic projection of the first pad and the second pad on the first bonding element.

[0117] In an exemplary embodiment, after peeling off the release film and removing the adhesive, the method further includes: applying adhesive to the surface of the second bonding element away from the first bonding element, the adhesive filling the second through hole, and the orthographic projection of the adhesive on the first bonding element covering the orthographic projection of the first pad and the second pad on the first bonding element.

[0118] Based on the inventive concept of the foregoing embodiments, this invention also provides a display device, which includes the display module adopted in the foregoing embodiments. The display device can be any product or component with display function, such as an OLED display, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator; this disclosure is not limited thereto.

[0119] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A display module, characterized by The application relates to a display module, which comprises a display substrate, a binding element and conductive silver paste. The display substrate comprises at least two first pads, and at least one first groove is arranged on the side surface of the display substrate away from the first pads; the binding element comprises at least two second pads, and the second pads comprise at least one first through hole penetrating through the second pads and the binding element; In the direction perpendicular to the display substrate, the first pads and the second pads are in contact, and the orthographic projection of the first through hole on the display substrate is located in the range of the orthographic projection of the first groove on the display substrate; The conductive silver paste is filled in the first through hole and the first groove, so that the display substrate and the binding element are bound and connected. The binding element further comprises a second through hole between adjacent second pads; the display module further comprises adhesive, which is filled in the second through hole, and the orthographic projection of the adhesive on the display substrate surrounds the orthographic projection of the first pads and the second pads on the display substrate.

2. The display module of claim 1, wherein, The binding element further comprises a second through hole between adjacent second pads; the display module further comprises adhesive, which is filled in the second through hole, and the orthographic projection of the adhesive on the display substrate covers the orthographic projection of the first pads and the second pads on the display substrate.

3. The display module of claim 1, wherein, The material of the adhesive is ultraviolet adhesive.

4. The display module of claim 2 or 3, wherein, The orthographic projection of the first groove on the display substrate is in a rectangular shape, and the orthographic projection of the first through hole on the display substrate is in a circular shape.

5. The display module of claim 1, wherein, The display substrate comprises a display area and a binding pin area on one side of the display area, a plurality of first pads are arranged in the binding pin area, and the first pads are parallel to each other.

6. The display module of claim 1, wherein, The method comprises the following steps:

7. A binding method, characterized by, A first binding element is provided, which comprises at least two first pads, and at least one first groove is formed on the surface of the first pads away from the first binding element; A second binding element is provided, which comprises at least two second pads, and the second pads are pretreated, that is, at least one first through hole penetrating through the second pads and the second binding element is formed on the second pads; The first binding element and the second binding element are arranged in close contact, so that the first pads and the second pads are in contact, and in the direction perpendicular to the first binding element, the orthographic projection of the first through hole on the first binding element is located in the range of the orthographic projection of the first groove on the first binding element; Conductive silver paste is filled in the first through hole and the first groove, so that the first binding element and the second binding element are bound and connected. The pretreatment of the second pads further comprises the following steps:

8. The binding method of claim 7, wherein, An isolation film is attached to the surface of the second binding element away from the second pads by using an adhesive, and the orthographic projection of the isolation film on the second binding element covers the orthographic projection of the second pads on the second binding element; and the first through hole penetrates through the adhesive and the isolation film. ​ 9. The binding method of claim 8, wherein, In the process of attaching the isolation film, the orthographic projection of the isolation film on the second binding element is located outside the range of the second binding element in at least one side direction, and the isolation film exposed outside the range of the second binding element forms a film tearing handle.

10. The binding method of claim 8, wherein, The pre-treatment of the second pad further comprises forming at least one second through hole on the second binding element between adjacent second pads, and the second through hole exposes the surface of the adhesive.

11. The binding method of claim 8, wherein, The filling of the conductive silver paste in the first through hole and the first recess comprises coating the conductive silver paste on the side surface of the isolation film away from the second binding element, and the conductive silver paste enters the first recess of the first binding element through the first through hole of the second binding element.

12. The binding method of claim 10, wherein, After the filling of the conductive silver paste in the first through hole and the first recess, the method further comprises peeling off the isolation film and removing the adhesive.

13. The binding method of claim 12, wherein, After the peeling off of the isolation film and the removal of the adhesive, the method further comprises injecting adhesive in the second through hole, and the adhesive is filled in the second through hole, and the orthographic projection of the adhesive on the first binding element surrounds the orthographic projection of the first pad and the second pad on the first binding element.

14. The binding method of claim 12, wherein, After the peeling off of the isolation film and the removal of the adhesive, the method further comprises coating adhesive on the side surface of the second binding element away from the first binding element, and the adhesive is filled in the second through hole, and the orthographic projection of the adhesive on the first binding element covers the orthographic projection of the first pad and the second pad on the first binding element.

15. A display device comprising: The display module comprises any one of claims 1 to 6.

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