Liner Adjustment Device Cleaning System

Abstract

A padding adjustment head cleaning tool includes a first clamp configured to removably engage a first portion of a sponge against an outer surface of a disc-shaped padding adjustment head in a first position; a second clamp configured to removably engage a second portion of the sponge against an outer surface of the disc-shaped padding adjustment head in a second position; and an arm coupling the first clamp to the second clamp. The arm is sufficiently resilient to allow the first and second clamps to separate for engagement around the disc-shaped padding adjustment head, and sufficiently stretched to inwardly offset the first and second clamps to press the sponge against the outer surface of the padding adjustment head.

Description

Technical Field

[0001] This disclosure relates to chemical mechanical polishing, and more specifically, to the cleaning of the liner adjustment device. Background Technology

[0002] Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconductor, or insulating layers on a silicon wafer. One fabrication step involves depositing a fill layer on a non-planar surface and planarizing the fill layer. For some applications, the conductive fill layer is planarized until the top surface of the patterned layer is exposed. For other applications, such as oxide polishing, the fill layer is planarized until a predetermined thickness is left on the non-planar surface. Furthermore, photolithography often requires planarization of the substrate surface.

[0003] Chemical mechanical polishing (CMP) is an acceptable method for planarization. This planarization method typically requires the substrate to be mounted on a carrier or polishing head. The exposed surface of the substrate is usually placed against a rotating polishing pad. The carrier head provides a controllable load on the substrate to push the substrate against the polishing pad. Polishing fluid is typically supplied to the surface of the polishing pad.

[0004] Polishing systems typically include an adjustment device system with an adjustment head, and an adjustment device disk with a grinding lower surface for adjusting the polishing pad. Adjusting the polishing pad maintains a consistent surface roughness, ensuring uniform polishing conditions from wafer to wafer. Summary of the Invention

[0005] In one aspect, a pad adjusting head cleaning tool includes a first clamp, a second clamp, and an arm coupling member. The first clamp is configured to removably engage a first portion of a sponge against an outer surface of a disc-shaped pad adjusting head in a first position. The second clamp is configured to removably engage a second portion of a sponge against an outer surface of the disc-shaped pad adjusting head in a second position. The arm couples the first clamp to the second clamp. The arm is flexible enough to allow the first and second clamps to separate and engage around the disc-shaped pad adjusting head, and is sufficiently stretched to inwardly offset the first and second clamps to press the sponge against the outer surface of the pad adjusting head.

[0006] An instance may include one or more of the following feature structures.

[0007] The first and second clamps can be arcuate. The arm can also be arcuate. When the cleaning tool for the pad adjusting device head is secured to the pad adjusting device head, the center of the arcuate shape of the first and second clamps can be the center of the adjusting device head. The first clamp can be a single piece, and the second clamp can also be a single piece. Each of the first and second clamps can have an upper flange and a lower flange configured to receive the adjusting device head. A portion of the outer surface of each of the first and second clamps can be recessed. The first clamp, the second clamp, and the arm can be a single arcuate body with a gap between the first and second clamps. The gap is configured to receive a sponge.

[0008] The tool may include a sponge. The sponge may be a dry sponge. The sponge may be a wet sponge. The sponge may be disc-shaped.

[0009] In another aspect, a method for cleaning a pad adjustment head includes causing two gripping arms of a cleaning tool to bend inward toward the disc-shaped pad adjustment head to press a sponge against the outer surface of the disc-shaped pad adjustment head; and establishing relative movement between the cleaning tool and the pad adjustment head to wipe the sponge against the pad adjustment head.

[0010] Examples may optionally include, but are not limited to, one or more of the following advantages. Polishing quality can be enhanced, for example, by reducing scratches and defects during the polishing process caused by dried debris particles accumulated from the polishing slurry and detached from the pad adjuster. Furthermore, the number of wafers discarded due to defects can be reduced. Maintenance downtime for the polishing system can be significantly reduced. This enhances the productivity of the polishing system and reduces operator time, as less time is spent focusing on cleaning the pad adjuster. Switching between different cleaning modes (i.e., dry cleaning and wet cleaning) is simpler. Cleaning processes can be quickly modified by adjusting the tool pressure engagement with the pad adjuster. Moreover, cleaning processes can be quickly modified by changing the sponge type and / or adding cleaning fluid.

[0011] Details of one or more examples are mentioned in the accompanying drawings and the following description. Other aspects, features, and advantages will be apparent from the specification, the drawings, and the claims. Attached Figure Description

[0012] Figure 1A This diagram shows a schematic cross-sectional view of a pad adjustment device system, which has an adjustment head for engaging the polishing pad of a chemical mechanical polishing system.

[0013] Figure 1B show Figure 1AA schematic cross-sectional view of the cleaning system of the liner adjustment device of the chemical mechanical polishing system, showing the liner adjustment device head at the cleaning position.

[0014] Figure 2 show Figure 1B A schematic cross-sectional view of the liner adjustment device cleaning system.

[0015] Figure 3 show Figure 1B A frontal perspective view of the liner adjustment device cleaning system.

[0016] Figure 4 Showing a front perspective view of a liner adjustment device cleaning system installed on a liner adjustment device system, having the liner adjustment device system detached from the chemical mechanical polishing system of Figure 1.

[0017] Figure 5A show Figure 1B The front view of the first sponge.

[0018] Figure 5B show Figure 1B The front view of the second sponge.

[0019] Figure 6 The method of displaying the cleaning pad adjustment device.

[0020] Similar reference numerals and symbols represent similar elements in various figures. Detailed Implementation

[0021] During chemical mechanical polishing, a polishing liquid, such as an abrasive polishing slurry, is supplied to the surface of the polishing pad. Polishing systems typically include a conditioning system with a conditioning head and a conditioning disc having a grinding lower surface for adjusting the polishing pad.

[0022] As the platform and polishing pad rotate, the polishing fluid is centrifugally dispersed on the polishing pad. While some of the polishing fluid will flow away from the polishing pad and collect in the basin, some may splash onto the conditioning head. If this occurs, the polishing fluid can form larger particles on the conditioning head, for example, by condensation or simply drying. The accumulation of dried or condensed polishing fluid on the polishing pad over time has multiple detrimental effects. For example, larger particles can dislodge and return to the polishing surface, thus creating a risk of scratches and defects. Significant amounts of non-productive time must be spent cleaning the conditioning head and conditioning pan to prevent the accumulation of dried polishing fluid.

[0023] These harmful effects can be mitigated by cleaning tools for the adjustment head that can be easily attached without requiring disassembly.

[0024] Figure 1AThe polishing system 20 is operable to polish substrate 10. The polishing system 20 includes a rotatable platform 24 on which a polishing pad 30 is seated. The polishing system 20 may also include a platform shield 26 surrounding the rotatable platform 24 and separated from the platform 24 by an annular gap 22. The rotatable platform 24 is operable to rotate about an axis 28. For example, a motor 30 can rotate a drive rod 32 to rotate the rotatable platform 24.

[0025] The polishing system 20 includes a carrier head 70 operable to hold the substrate 10 against the polishing pad 30. The carrier head 70 is suspended from a support structure 72, such as a carousel or track, and is connected to a carrier head rotary motor 76 via a carrier drive rod 74, allowing the carrier head to rotate about an axis 71. Furthermore, the carrier head 70 can oscillate laterally across the polishing pad 30, for example, by movement in radial grooves in an actuator-driven carousel 72, by rotation of the motor-driven carousel, or by backward and forward movement along an actuator-driven track. In operation, the platform 24 rotates about a central axis 25, and the carrier head 70 rotates about a central axis 71 and translates laterally across the top surface of the polishing pad 30.

[0026] The polishing system 20 may include a polishing liquid transfer arm 34. During polishing, the arm 34 is operable to dispense polishing liquid 36. The polishing liquid 36 may be a slurry containing abrasive particles. The polishing liquid 36 may be referred to by multiple names, such as abrasive polishing slurry, abrasive polishing liquid, or polishing paste.

[0027] The polishing system 20 may also include an adjustment device system 40 having a rotatable adjustment device head 42, and may include, for example, a grinding lower surface on a removable adjustment disc to adjust the polishing surface 38 of the main polishing pad 30. The adjustment device system 40 may also include a motor 44 to drive the adjustment device head 42, and a drive rod 46 connecting the motor 44 to the adjustment device head 42. The adjustment device system 40 may also include an actuator configured to laterally sweep the adjustment device head 40 across the polishing pad 30. The adjustment device system 40 may also include an arm 88 to rotate the pad adjustment device head 42 to laterally move to and away from the polishing pad 30. A notch or cut-out 22 may be formed in the platform shield 26 to, as Figure 4 The image shows that the adjustment head 40 is allowed to move laterally away from the polishing pad 30.

[0028] Although some polishing fluid 36 will flow away from the polishing pad 30 and can be collected below the polishing system 20, some polishing fluid 36 on the polishing pad 30 may stick to the adjustment head 42. Furthermore, the adjustment of the polishing pad 30 can remove polishing debris from the polishing pad 30, and this debris may also stick to the adjustment head 42. In either case, the polishing fluid 36 on the carrier head 70 may dry and further accumulate on the adjustment pad head 42.

[0029] Figure 1B This shows the adjustment device pad head cleaning tool 50 mounted on the adjustment device head 42 of the polishing system 20. The adjustment device pad head cleaning tool 50 includes a sponge retainer 52 and a sponge 54. (As shown...) Figure 2 As shown, the sponge retainer 52 deflects the sponge 54 against one or more surfaces of the padding adjustment head 42, such as the top surface 48a or the side surface 48b, to clean the padding adjustment head 42.

[0030] Reference Figure 5A and Figure 5B The sponge 54 may be disc-shaped. The sponge 54 may have a body extending through the sponge and a hole 90 positioned at the center 96 of the sponge. The hole 90 is sized to accommodate the diameter of the drive rod 46 that connects the motor 44 to the adjustment head 42. A groove 92 extends from the periphery 94 of the sponge 54 to a void. The groove 92 allows the sponge 54 to be placed around the padding adjustment head 42.

[0031] Sponge 54 is made of a soft, porous, absorbent material. Sponge 54 can be made from naturally occurring or synthetic materials. For example, sponge 54 can be formed from naturally occurring materials such as plant cellulose, marine sponges, hemp plants, or wood fibers. Alternatively, sponge 54 can be formed from synthetic materials such as polyester or polyurethane.

[0032] Sponge 54 can be either a dry or wet sponge. Dry sponges do not contain any fluid chemicals added to them. Dry sponges can be used for scraping. (See reference...) Figure 5A Dry sponges can have a muffin-like surface texture to enhance shaving. Wet sponges have a fluid added to them. For example... Figure 5B As shown, a wet sponge can be used to wipe away accumulated dry polishing liquid 36, soften and loosen accumulated dry polishing liquid 36, or apply chemicals to the pad adjusting head 42. For example, deionized water, isopropanol, or potassium hydroxide can be applied to the sponge.

[0033] Reference Figures 2-4The sponge retainer 52 includes two clamps 56a and 56b. Each clamp 56 has an upper jaw 58 and a lower jaw 60. A frame 62 connects the upper jaw 58 and the lower jaw 60. The first clamp 56a has an upper jaw 58a and a lower jaw 60a connected by a frame 62a, which is configured to engage a first portion 64 of the sponge 54 against the adjustment head 42. The second clamp 56b has an upper jaw 58b and a lower jaw 60b connected by a frame 62b, which is configured to engage a second portion 66 of the sponge 54 against the adjustment head 42. The upper jaw 56 and the lower jaw 58 can, for example, be separately distributed to articulately attach to the adjustment head 42.

[0034] The two clamps 56a and 56b are arcuate, i.e., from a top view. The outer surfaces of the upper jaw 58 and the lower jaw 60 may have grooves 78 formed in the top surface 80. The first clamp 56a has a top surface 80 with grooves 78a. The second clamp 56b has a top surface 80 with grooves 78b. The grooves 78a and 78b are configured to enhance the holding of the manipulator on the clamps 56a and 56b. The bottom surface 82 of the clamps 56a and 56b may also have grooves 78.

[0035] The inner surfaces of the upper jaw 58 and the lower jaw 60 can be flat, for example, in Figure 2 As shown in, or convex, for example in Figure 3 As shown in the image.

[0036] exist Figure 3 As shown, clamps 56a and 56b are connected by arm coupling 68. The coupling arm may be arc-shaped. Arm coupling 68 is flexible enough to allow the first clamp 56a and the second clamp 56b to open and engage around the pad adjusting head 42, and is sufficiently stretched to offset the first clamp 56a and the second clamp 56b inward to engage the outer surface 48 of the pad adjusting head 42. If the sponge extends along the outer surface 48, the first clamp 56a and the second clamp 56b can press the sponge 54 against the outer surface 48 of the adjusting head 48. The first clamp 56a and the second clamp 56b are arranged by arm coupling 68 such that when the pad adjusting head cleaning tool 50 is fastened to the pad adjusting head 42, the center of the arc of the first clamp and the second clamp is the center of the adjusting head 42. The first clamp 56a, the second clamp 56b and the arm coupling 68 may be a single piece. Each clamp has an upper flange and a lower flange, configured to accommodate the adjustment device head.

[0037] The sponge 54 is held by the sponge holder 52 such that the outer surface 84 of the sponge 54 presses against at least one surface 48 of the pad adjusting head 42. In operation, the sponge holder 52 and the sponge 54 can be rotated, for example, by an actuator about an axis 86 while the pad adjusting head 42 remains stationary. In some instances, the sponge holder 52 and the sponge 54 rotate alternately in clockwise and counterclockwise directions. Alternatively, the pad adjusting head 42 can be rotated, for example, by a drive rod about an axis 86 while the actuator keeps the sponge holder 52 and the sponge 54 stationary. In either case, the sponge holder 52 holds the sponge 54 in contact with the pad adjusting head 42, and the relative motion wipes or abrades away any accumulation of polishing liquid 36.

[0038] The foam retainer can be made of elastic plastic. For example, the foam retainer can be made of steel, aluminum, high-density polyethylene, or a composite.

[0039] Figure 6 A method 600 is shown for cleaning a pad adjusting head using a pad adjusting head cleaning tool. At 602, a sponge is installed in the gap of the pad adjusting head cleaning tool. Alternatively, the sponge may be placed directly on the pad adjusting head. At 604, the cleaning tool is installed on the adjusting head. Installing the pad adjusting head cleaning tool may include opening a first clamp and a second clamp, moving the cleaning tool to surround the adjusting head (and the sponge), and releasing the first clamp to hold the sponge against the adjusting head. Pressure may be applied to the outside of the clamps, for example, by an actuator, further forcing the sponge into contact with the pad adjusting head. At 606, the sponge abrades the pad adjusting head. Abrading the pad adjusting head may include rotating the pad adjusting head and / or rotating the pad adjusting head tool. In some instances, abrasion includes changing directions with clockwise-counterclockwise motion. The pad adjusting head may be abraded with a dry sponge. A wet sponge may be moistened with a cleaning solution. The pad adjusting head may then be abraded with a wet sponge. At 608, remove the liner adjustment head cleaning tool from the liner adjustment head.

[0040] Several embodiments have been described. However, it will be understood that various modifications can be made. Therefore, many other embodiments are within the scope of the following claims.

Claims

1. A cleaning tool for a pad adjustment device head, comprising: The first clamp is configured to removably engage a first portion of the sponge against the outer surface of the disc-shaped pad adjusting head at a first position; The second clamp is configured to removably engage a second portion of the sponge against the outer surface of the disc-shaped pad adjusting head at a second position; and An arm that couples the first clamp to the second clamp, wherein the arm is flexible enough to allow the first clamp and the second clamp to separate and engage around the disc-shaped pad adjusting head, and is elastic enough to offset the first clamp and the second clamp inward to press the sponge against the outer surface of the pad adjusting head.

2. The tool of claim 1, wherein the arm is bow-shaped.

3. The tool of claim 1, wherein the first clamp and the second clamp are arc-shaped.

4. The tool of claim 3, wherein when the pad adjusting head cleaning tool is fastened to the pad adjusting head, the center of the arc of the first clamp and the second clamp is the center of the adjusting head.

5. The tool of claim 1, wherein the first clamp is a single piece, and the second clamp is a single piece.

6. The tool of claim 5, wherein each of the first clamp and the second clamp has an upper flange and a lower flange, the upper flange and the lower flange being configured to receive the adjusting device head.

7. The tool of claim 5, wherein a portion of the outer surface of each of the first clamp and the second clamp is recessed.

8. The tool of claim 1, wherein the first clamp, the second clamp, and the arm are a single arc-shaped body having a gap between the first clamp and the second clamp, the gap being configured to accommodate the sponge.

9. The tool of claim 1, further comprising a sponge.

10. The tool of claim 9, wherein the sponge is a dry sponge.

11. The tool of claim 9, wherein the sponge is a wet sponge.

12. The tool of claim 9, wherein the sponge is disc-shaped.

13. A method for cleaning the head of a pad adjusting device, comprising the following steps: A sponge is installed in the gap of the liner adjustment device head cleaning tool, the liner adjustment device head cleaning tool comprising: The first clamp is configured to removably engage a first portion of the sponge against the outer surface of the disc-shaped pad adjusting head at a first position; The second clamp is configured to removably engage a second portion of the sponge against the outer surface of the disc-shaped pad adjusting head at a second position; and An arm that couples the first clamp to the second clamp, wherein the arm is flexible enough to allow the first clamp and the second clamp to separate and engage around the disc-shaped pad adjusting head, and is elastic enough to offset the first clamp and the second clamp inward to press the sponge against the outer surface of the pad adjusting head. This forces the sponge into contact with the head of the padding adjustment device; and The sponge is used to rub the head of the pad adjustment device.

14. The method of claim 13, wherein the step of installing the sponge in the gap of the pad adjusting device head cleaning tool further comprises the following steps: Extend the first clamp to move the sponge into the gap; The first portion of the sponge is disposed in the gap and inside the first clamp; Release the first clamp to hold the first portion of the sponge; Extend the second clamp to move the sponge into the gap; The second portion of the sponge is positioned within the gap and inside the second clamp; and Release the second clamp to hold the second portion of the sponge.

15. The method of claim 13, further comprising the step of: removing the liner adjustment head cleaning tool from the liner adjustment head.

16. A method for cleaning an adjustment device head, comprising the following steps: This causes the two clamps of the cleaning tool to align inwards towards the disc-shaped pad adjusting head, pressing the sponge against the outer surface of the disc-shaped pad adjusting head; and A relative movement is established between the cleaning tool and the pad adjustment head to bring the sponge wiping against the pad adjustment head.

17. The method of claim 16, wherein establishing relative motion comprises rotating the pad adjusting head.

18. The method of claim 17, wherein establishing relative motion comprises rotating the pad adjusting head tool in alternating directions of clockwise-counterclockwise motion.

19. The method of claim 16, wherein the sponge is a dry sponge.

20. The method of claim 16, further comprising the following steps: The sponge is moistened with a cleaning solution to provide a wet sponge; and Wipe the pad adjustment head with the wet sponge.

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