A lower nozzle evaporation device for metal evaporation and purification method thereof

Abstract

The present invention discloses a lower nozzle evaporation device for metal evaporation, characterized in that it comprises a bottom plate, support columns are installed on both sides of the bottom plate, and the support columns are sequentially installed with a collecting plate and an evaporation mechanism from bottom to top, and a heating unit is arranged in the evaporation mechanism. The present invention can effectively avoid the phenomenon of metal purification products falling off, and can also achieve the purpose of improving product purity through multi-zone temperature controlled evaporation.

Description

Technical Field

[0001] The invention belongs to the technical field of metal evaporation, in particular to a lower nozzle evaporation device for metal evaporation and a purification method thereof. Background Art

[0002] Evaporation and purification of metals in a vacuum environment is a common purification method. Traditional evaporation and purification adopts an upper nozzle evaporation mode. The upper nozzle mode will cause product shedding during the long evaporation process, thus affecting product quality. The lower nozzle mode avoids product shedding and can also achieve the purpose of improving product purity through multi-zone temperature controlled evaporation.

[0003] Through the above analysis, the problems and defects of the existing technology are as follows: the commonly used evaporation device adopts the upper nozzle evaporation mode, and the material evaporated on the collection plate will fall off under the action of gravity during the long evaporation process, resulting in a decrease in yield. At the same time, the common evaporation device lacks a beam-type structure, and the atomic divergence angle evaporated from the upper nozzle is large, and the atoms are easily evaporated onto structures other than the collection plate.

[0004] The significance of solving the above technical problems lies in: changing the nozzle of the evaporation device to a lower nozzle, and placing the collecting plate below the nozzle, thereby avoiding the problem of product loss caused by the product on the collecting plate falling off under the action of gravity, greatly increasing the output, and also improving the stability of the evaporation device for long-term operation. At the same time, adding beam structures such as collimated nozzles and slit plates to the evaporation structure can reduce atomic divergence and prevent the evaporated atomic vapor from being deposited on structures other than the collecting plate, thereby reducing the evaporation utilization rate. Summary of the invention

[0005] According to the above problems, the present invention provides a lower nozzle evaporation device for metal evaporation and a purification method thereof.

[0006] The technical solution of the present invention is:

[0007] A lower nozzle evaporation device for metal evaporation comprises a bottom plate, support columns are installed on both sides of the bottom plate, and collecting plates and evaporation mechanisms are installed on the support columns in sequence from bottom to top, and a heating unit is arranged in the evaporation mechanism.

[0008] Preferably, the evaporation mechanism comprises a slit plate mounted on the support column, a crucible is mounted above the slit plate, a collimated nozzle is provided at the bottom of the crucible, and a crucible cover is installed on the top of the crucible; the crucible and the crucible cover are both hollow structures, and a heating unit is provided inside.

[0009] Further preferably, the bottom of the crucible is formed by two "L"-shaped parts facing each other, and a collimated nozzle is formed between the two "L"-shaped parts.

[0010] Further preferably, a honeycomb panel is vertically mounted at the lower end of the collimating nozzle.

[0011] Further preferably, the heating unit is composed of evenly distributed resistance heating wires.

[0012] Further preferably, a wide slit is formed in the middle of the slit plate, and the wide slit and the collimating nozzle are parallel and corresponding to each other.

[0013] Further preferably, the slit plate is mounted on the support column via a supporting angle iron.

[0014] Further preferably, the slit plates are provided with multiple layers from top to bottom along the support column.

[0015] Further preferably, a support platform is provided on the bottom plate, and the collecting plate is mounted on the support platform.

[0016] The second purpose of the present invention is:

[0017] A purification method for metal evaporation, using a lower nozzle evaporation device for metal evaporation, comprises the following steps:

[0018] S101: placing a target metal in a crucible;

[0019] S102: placing the lower nozzle evaporation device as a whole in a vacuum chamber, using a vacuum holding system to evacuate the air in the vacuum chamber, and when the vacuum degree reaches a preset process value, heating the crucible and the crucible cover respectively, so that the target metal in the crucible begins to evaporate;

[0020] S103: The metal vapor generated after evaporation passes through the collimated nozzle heating area, the collimated nozzle beam area, the honeycomb plate and the slit plate on the collimated nozzle, and is finally condensed on the collecting plate below the collimated nozzle to complete the purification of the target metal.

[0021] Combining all the above technical solutions, the advantages and positive effects of the present invention are as follows:

[0022] 1. Using this device in a vacuum environment can effectively avoid the shedding of metal purification products, and at the same time, it can also achieve the purpose of improving product purity through multi-zone temperature-controlled evaporation.

[0023] 2. Due to the different evaporation temperatures and impurities, the target metal will condense on the collimated nozzle of the crucible and the slit plates at different positions through different heating temperatures and different physical properties, and then further sink to the collection plate. At the same time, because the lower nozzle device is purified and separated under vacuum conditions, the metal oxide will also be reduced accordingly, ultimately achieving the purpose of improving the purity of the metal.

[0024] 3. Beam structures such as collimated nozzles and slit plates are added to the evaporation structure to reduce atomic divergence and prevent the atomic vapor evaporated from the slit plate from evaporating onto structures other than the collecting plate, causing a decrease in evaporation utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, but it should be understood that these drawings are designed only for explanation purposes and are not intended to limit the scope of the present invention. In addition, unless otherwise specified, these drawings are intended only to conceptually illustrate the structural configurations described herein and are not necessarily drawn to scale.

[0026] Figure 1 It is a schematic diagram of the planar structure of the present invention enclosed in a vacuum cavity;

[0027] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention;

[0028] Figure 3 It is a planar structural cross-sectional view of the crucible in the present invention.

[0029] In the figure:

[0030] 1-crucible cover; 2-crucible; 3-slit plate; 4-support angle iron; 5-collecting plate; 6-crucible cover heating area; 7-crucible heating area; 8-collimated nozzle; 9-collimated nozzle beam area; 10-honeycomb plate; 11-target metal; 12-bottom plate; 13-support column; 14-support table. DETAILED DESCRIPTION

[0031] First of all, it should be noted that the specific structure, features and advantages of the present invention will be specifically described below by way of example, but all descriptions are only for illustration and should not be understood as limiting the present invention in any way. In addition, any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature displayed or implied in the drawings, can still be combined or deleted between these technical features (or their equivalents) to obtain more other embodiments of the present invention that may not be directly mentioned in this document. In addition, in order to simplify the drawings, the same or similar technical features may be marked only in one place in the same drawing.

[0032] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0033] The following is combined with Figure 1-3 The present invention will be described in detail.

[0034] Embodiment 1:

[0035] A lower nozzle evaporation device for metal evaporation comprises a bottom plate 12, support columns 13 are installed on both sides of the bottom plate 12, and the support columns 13 are sequentially installed with a collecting plate 5 and an evaporation mechanism from bottom to top, and a heating unit is arranged in the evaporation mechanism.

[0036] Working principle:

[0037] This technical solution heats the target metal 11 placed in the evaporation mechanism, so that the impurities generated by it are left behind, and the generated vapor is precipitated downward and finally condensed on the collecting plate 5, thereby achieving metal purification. The heating temperatures of various parts of the evaporation mechanism are different, and the physical properties of different target metals 11 are also different, so that metal purification with different requirements can be finally achieved.

[0038] Furthermore, in an embodiment, it can also be considered that the evaporation mechanism includes a slit plate 3 installed on the support column 13, a crucible 2 is installed above the slit plate 3, a collimated nozzle 8 is provided at the bottom of the crucible 2, and a crucible cover 1 is installed on the top of the crucible 2; the crucible 2 and the crucible cover 1 are both hollow structures, and a heating unit is provided inside.

[0039] A crucible heating area 7 is formed on the crucible 2 , a crucible cover heating area 6 is formed on the crucible cover 1 , and a heating area is also formed on the collimating nozzle 8 .

[0040] The target metal 11 is placed in the crucible 2, and the crucible 2 is heated. The target metal 11 begins to evaporate, so that the metal vapor enters the heating area of ​​the collimated nozzle 8, and the metal vapor is evaporated from the bottom of the crucible 2 through the slit plate 3, and finally condensed on the collecting plate 5 below the nozzle, completing the metal purification with different requirements.

[0041] The arrangement of the collimated nozzle 8 and the slit plate 3 can reduce atomic divergence and prevent the evaporated atomic vapor from being deposited on structures other than the collecting plate 5, thereby reducing the evaporation utilization rate.

[0042] Furthermore, in the embodiment, it can be considered that the bottom of the crucible 2 is formed by two "L"-shaped parts facing each other, and a collimated nozzle 8 is formed between the two "L"-shaped parts. During the purification operation, the target metal 11 can be placed on the horizontal part of the "L"-shaped part. The collimated nozzle 8 of this shape can form a collimated nozzle beam area 9, and there is also a heating unit inside the collimated nozzle 8, which is conducive to controlling the temperature and steam beam, so that impurities are left and the purified steam is precipitated downward.

[0043] Furthermore, in the embodiment, it can be considered that a honeycomb plate 10 is vertically installed at the lower end of the collimating nozzle 8. The honeycomb plate 10 can play the role of energy storage and temperature storage, so that the steam will not condense prematurely and can further sink to the slit plate 3. At the same time, the honeycomb plate 10 can also be regarded as an array composed of multiple slender tubes, which can reduce the large-angle scattering of atomic vapor and further improve the vapor beam shape.

[0044] Furthermore, it can also be considered in the embodiment that the heating unit is composed of uniformly distributed resistance heating wires. The resistance heating wires are heated and temperature controlled by a temperature-controlled power supply. The resistance heating wires have low energy consumption and low cost. The use of resistance heating wires in this embodiment is only a preferred choice, and other heating materials are also applicable to this technical solution.

[0045] Furthermore, in the embodiment, it can be considered that a wide slit is formed in the middle of the slit plate 3, and the wide slit is parallel to and corresponds to the collimated nozzle 8. The wide slit of the slit plate 3 is provided with different sizes according to different process requirements. The formation of the wide slit further constrains the flow path of the steam, and can reduce the heat loss of the steam, so that it precipitates downward within the range of the wide slit and finally gathers on the collecting plate 5. At the same time, part of the impurities evaporated also remain on the slit plate 3 to further purify the steam.

[0046] Furthermore, in the embodiment, it can also be considered that the slit plate 3 is installed on the support column 13 through the support angle iron 4. The support angle iron 4 is easy to install and replace, and its support bearing capacity is relatively strong, which is suitable for various pressure environments.

[0047] Furthermore, in the embodiment, it can be considered that the slit plate 3 is provided with multiple layers from top to bottom along the support column 13. The slit plate 3 is installed on the support column 13 through the support angle iron 4, and the position of the slit plate 3 is adjusted in accordance with different assembly positions and different layers, so that the metal completes the evaporation beam in the vacuum chamber, and the final product is condensed on the collection plate 5 below.

[0048] Furthermore, in the embodiment, it can be considered that a support platform 14 is provided on the bottom plate 12, and the collecting plate 5 is mounted on the support platform 14. The support platform 14 provides support for the collecting plate 5, so that the collecting plate 5 can remain stable even after heavy metal objects are condensed on it.

[0049] In this technical solution, the metal vapor generated by the heated crucible 2 is beamed through the collimated nozzle beam area 9 and the honeycomb plate 10, and then further beamed by the multi-layer slit plate 3, and finally the metal purification is completed on the collecting plate 5. The crucible 2, the slit plate 3, the supporting angle iron 4, and the collecting plate 5 are all made of 304 stainless steel. Stainless steel is rust-proof, has a long service life, is suitable for vacuum environment, and has stable physical properties. It will not be affected by high temperature changes and the purification of the target metal 11 will not be affected.

[0050] Furthermore, in the embodiment, it can also be considered that the support column 13 is a T-shaped structure for stably supporting the evaporation device.

[0051] Embodiment 2:

[0052] A purification method for metal evaporation, using the lower nozzle evaporation device for metal evaporation in Example 1, comprises the following steps:

[0053] S101: placing the target metal 11 in the crucible 2;

[0054] S102: placing the lower nozzle evaporation device as a whole in a vacuum chamber, using a vacuum holding system to evacuate the air in the vacuum chamber, and when the vacuum degree reaches a preset process value, heating the crucible 2 and the crucible cover 1 respectively, so that the target metal 11 in the crucible 2 starts to evaporate;

[0055] S103: The metal vapor generated after evaporation passes through the collimated nozzle 8 heating area, the collimated nozzle beam area 9, the honeycomb plate 10 and the slit plate 3 on the collimated nozzle 8, and finally condenses on the collecting plate 5 below the collimated nozzle 8, completing the purification of the target metal 11.

[0056] Steps:

[0057] The air in the vacuum chamber is evacuated by a vacuum holding system. When the vacuum degree inside the vacuum chamber reaches the preset value of the process, the crucible 2 and the crucible cover 1 are heated respectively. The resistance heating wires inside the crucible 2 and the crucible cover 1 begin to heat up. The target metal 11 inside the crucible 2 begins to evaporate. The generated steam rises, part of the steam sticks to the crucible cover 1, and part of the steam descends into the collimated nozzle 8 of the crucible 2. The collimated nozzle beam area 9 gathers the steam. The honeycomb plate 10 on the collimated nozzle 8 can keep the heat of the steam, keep it at a high temperature, and let the steam sink further. The sinking steam passes through the wide slits on the slit plates 3 of the set number of layers in turn, further beams, and finally condenses on the collecting plate 5 below to complete the purification of the target metal 11.

[0058] Because different metals have different physical properties and evaporation curves, the vapor can condense impurities in a designated area when passing through areas with different temperatures, that is, by controlling the different heating temperatures of the three parts of the crucible 2, the crucible cover 1 and the collimated nozzle 8 inside the crucible 2, the goal of preliminarily purifying the metal inside the crucible 2 can be achieved. The structure of the collimated nozzle 8 will evaporate the vapor at the bottom of the crucible 2, and finally condense it at the collecting plate 5, completing the purification of metals with different requirements.

[0059] By adopting this lower nozzle device solution, the metal materials on the collecting plate 5 will not fall off due to gravity problems, thereby affecting the production.

[0060] In summary, the present invention provides a lower nozzle evaporation device for metal evaporation and a purification method thereof.

[0061] The above embodiments describe the present invention in detail, but the contents are only preferred embodiments of the present invention and cannot be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the present invention.

Claims

1. A lower nozzle evaporation device for metal evaporation, characterized in that: It comprises a bottom plate, support columns are installed on both sides of the bottom plate, and the support columns are sequentially installed with a collecting plate and an evaporation mechanism from bottom to top, and a heating unit is arranged in the evaporation mechanism; The evaporation mechanism comprises a slit plate mounted on the support column, a crucible is mounted above the slit plate, a collimated nozzle is provided at the bottom of the crucible, and a crucible cover is installed on the top of the crucible; the crucible and the crucible cover are both hollow structures, and a heating unit is provided inside; The bottom of the crucible is formed by two "L"-shaped parts facing each other, and a collimated nozzle is formed between the two "L"-shaped parts; A honeycomb plate is vertically installed at the lower end of the collimating nozzle.

2. A lower nozzle evaporation device for metal evaporation according to claim 1, characterized in that: The heating unit is composed of evenly distributed resistance heating wires.

3. The lower nozzle evaporation device for metal evaporation according to claim 2, characterized in that: A wide slot is formed in the middle of the slit plate, and the wide slot is parallel to and corresponds to the collimating nozzle.

4. The lower nozzle evaporation device for metal evaporation according to claim 3, characterized in that: The slit plates are mounted on the support columns via support angle irons.

5. The lower nozzle evaporation device for metal evaporation according to claim 4, characterized in that: The slit plates are provided with multiple layers from top to bottom along the support column.

6. A lower nozzle evaporation device for metal evaporation according to any one of claims 1 to 5, characterized in that: A support platform is provided on the bottom plate, and the collecting plate is installed on the support platform.

7. A purification method for metal evaporation, using the lower nozzle evaporation device for metal evaporation according to claim 6, characterized in that: The following steps are involved: S101: placing a target metal in a crucible; S102: placing the lower nozzle evaporation device as a whole in a vacuum chamber, using a vacuum holding system to evacuate the air in the vacuum chamber, and when the vacuum degree reaches a preset process value, heating the crucible and the crucible cover respectively, so that the target metal in the crucible begins to evaporate; S103: The metal vapor generated after evaporation passes through the collimated nozzle heating area, the collimated nozzle beam area, the honeycomb plate and the slit plate on the collimated nozzle, and is finally condensed on the collecting plate below the collimated nozzle to complete the purification of the target metal.

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