Power module

Abstract

The present invention discloses a power module, which includes: a frame, the frame includes a peripheral wall and a receiving space; a plurality of extending portions are spaced apart on opposite sides of the peripheral wall, and a groove is provided on one side of each of the extending portions; a fixing portion is provided on the inner side of the peripheral wall; a substrate assembly, the substrate assembly is received and fixed in the receiving space; the two exposed side surfaces of the substrate assembly are a first mounting surface and a second mounting surface respectively; components, the components include a plurality of them and are respectively spaced apart on the first mounting surface and the second mounting surface; low-voltage pins, the low-voltage pins include a plurality of them and are respectively embedded in opposite two side surfaces of the fixing portion; high-voltage pins, the high-voltage pins include a plurality of them and are respectively embedded in a plurality of the grooves. The power module of the present invention can avoid soldering voids and the problem of cracking of the insulating layer of the substrate assembly caused by stress generated during the encapsulation mold process due to soldering tolerances.

Description

Technical Field

[0001] The present invention relates to the field of circuit technologies, and particularly to a power module. Background Art

[0002] A power device (power module), namely a modular intelligent power system MIPS (Module Intelligent Power System), not only integrates power switching devices and drive circuits together, but also incorporates fault detection circuits such as overvoltage, overcurrent, and overheat, and can send detection signals to a CPU (Central Processing Unit) or DSP (Digital Signal Processing) for interrupt processing.

[0003] The power module mainly consists of a high-speed and low-power consumption die, an optimized gate-level drive circuit, a fast protection circuit, etc. Even if a load accident or improper use occurs, it can ensure that the MIPS itself is not damaged. MIPS generally uses IGBT (Insulated Gate Bipolar Transistor) as a power switching element and incorporates a current sensor and a drive circuit.

[0004] Existing power modules need to layout an inverter circuit composed of low-voltage control circuits such as an IC drive control circuit, an MIPS sampling and amplifying circuit, and a PFC current protection circuit and a high-voltage power device circuit on the same board. However, during the actual manufacturing process, if the pins are directly welded to the substrates of both circuits, it is easy to cause the problem of welding voids in the pin area, and in severe cases, it will also cause stress during the encapsulation mold process due to welding tolerance, resulting in cracking of the insulating layer of the substrate. Summary of the Invention

[0005] The purpose of the present invention is to provide a new power module to solve the problem that when the existing power module directly connects the low-voltage control circuit and the high-voltage power device circuit through pins, it is easy to cause welding voids in the pin area and lead to cracking of the insulating layer of the substrate.

[0006] To solve the above problems, the present invention provides a power module, which includes:

[0007] A frame, the frame includes an annular peripheral wall and a receiving space surrounded by the peripheral wall; a plurality of extension parts are respectively arranged at intervals on opposite sides of the peripheral wall and extend outwardly in a protruding manner, and a groove is formed by inward depression on one side of each extension part; a fixing part is arranged on the inner side of the peripheral wall and extends inwardly in a protruding manner.

[0008] A substrate assembly, the substrate assembly is received and fixed in the receiving space and its peripheral side abuts against the side of the fixing part away from the peripheral wall; the two exposed side surfaces of the substrate assembly are respectively a first mounting surface and a second mounting surface.

[0009] Components, where there are multiple of the components and they are respectively arranged at intervals on the first mounting surface and the second mounting surface; the multiple components on the first mounting surface are electrically connected to each other, and the multiple components on the second mounting surface are electrically connected to each other;

[0010] Low-voltage pins, where there are multiple of the low-voltage pins and they are respectively embedded in opposite two sides of the fixing part; the low-voltage pins corresponding to those on the first mounting surface are electrically connected to the components on the first mounting surface, and the low-voltage pins corresponding to those on the second mounting surface are electrically connected to the components on the second mounting surface;

[0011] High-voltage pins, where there are multiple of the high-voltage pins and they are respectively embedded in the multiple grooves; the part of the high-voltage pins corresponding to those on the first mounting surface is electrically connected to the components on the first mounting surface, and the part of the high-voltage pins corresponding to those on the second mounting surface is electrically connected to the components on the second mounting surface.

[0012] Preferably, the low-voltage pin includes a low-voltage boss embedded in the fixing part and a low-voltage column protruding and extending in a direction away from the fixing part from a side of the low-voltage boss away from the fixing part; the low-voltage column is used to achieve electrical connection with an external circuit.

[0013] Preferably, the high-voltage pin includes a high-voltage base embedded in the groove, a first high-voltage boss protruding and extending in the direction of the first mounting surface from a position of the high-voltage base corresponding to the first mounting surface, a second high-voltage boss protruding and extending in the direction of the second mounting surface from a position of the high-voltage base corresponding to the second mounting surface, and a high-voltage column inserted at one end of the high-voltage base away from the groove; the first high-voltage boss passes through the peripheral wall and is fixedly attached to a side of the fixing part close to the first mounting surface and is electrically connected to one of the components on the first mounting surface, the second high-voltage boss passes through the peripheral wall and is fixedly attached to a side of the fixing part close to the second mounting surface and is electrically connected to one of the components on the second mounting surface; the high-voltage column is used to achieve electrical connection with the external circuit.

[0014] Preferably, fixing grooves are respectively formed by inward depression at positions of the fixing part corresponding to the first high-voltage boss and the second high-voltage boss, and the first high-voltage boss and the second high-voltage boss are fixedly attached in the corresponding fixing grooves.

[0015] Preferably, the substrate assembly includes two substrates that are opposite and spaced apart from each other, and an air-cooling device fixedly attached between the two substrates. The air-cooling device is composed of a plurality of metal fins; the opposite sides of the two substrates away from each other are the first mounting surface and the second mounting surface respectively; through holes are respectively formed through opposite sides of the peripheral wall, and the through holes on the opposite sides of the peripheral wall respectively correspond to the opposite sides of the air-cooling device.

[0016] Preferably, the substrate assembly further includes a water-cooling device disposed between the substrate and the air-cooling device. The water-cooling device is composed of pipes arranged in a bent manner. One end of the pipe is a water inlet, and the other end of the pipe is a water outlet.

[0017] Preferably, the power module further includes soft silicone potted in the accommodation space. The soft silicone covers the first mounting surface, the components on the first mounting surface, the second mounting surface, and the components on the second mounting surface respectively.

[0018] Preferably, the power module further includes two sealing covers. The two sealing covers are respectively disposed to cover two openings formed by the peripheral wall and are attached to the soft silicone.

[0019] Preferably, electrical connections are achieved between multiple components on the first mounting surface, between multiple components on the second mounting surface, between the low-voltage pins and the components, and between the high-voltage pins and the components through bonding metal wires.

[0020] Preferably, the components include insulated gate bipolar transistors and fast recovery diodes.

[0021] Compared with the prior art, in the power module of the present invention, by mounting the substrate assembly in a frame embedded with low-voltage pins and high-voltage pins, and connecting the components on the substrate assembly to the embedded low-voltage pins and high-voltage pins, problems such as welding voids caused by directly welding pins on the substrate assembly and cracking of the insulating layer of the substrate assembly due to stress caused by welding tolerances during the encapsulation mold process are avoided. Furthermore, the reliability and yield of the power module are improved, and later there is no need for a wire cutting and forming device to cut and shape the pins, which also reduces equipment costs and processing procedures. In addition, by adopting the method of mounting components on both sides, the area of the power module can be reduced under the same integration level, achieving high integration and miniaturization. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0023] Figure 1 It is a schematic diagram of the overall structure of a power module provided by an embodiment of the present invention;

[0024] Figure 2 It is a cross-sectional view of a power module provided by an embodiment of the present invention;

[0025] Figure 3 It is a side view of a power module provided by an embodiment of the present invention;

[0026] Figure 4 It is a schematic diagram of the front structure of a power module after removing the sealing cover provided by an embodiment of the present invention;

[0027] Figure 5 It is a schematic diagram of the back structure of a power module after removing the sealing cover provided by an embodiment of the present invention;

[0028] Figure 6 It is a top view of a power module after removing the sealing cover provided by an embodiment of the present invention;

[0029] Figure 7 It is a bottom view of a power module after removing the sealing cover provided by an embodiment of the present invention;

[0030] Figure 8 It is a schematic diagram of the front structure of a power module after removing the sealing cover and the frame provided by an embodiment of the present invention;

[0031] Figure 9 It is a schematic diagram of the back structure of a power module after removing the sealing cover and the frame provided by an embodiment of the present invention;

[0032] Figure 10 It is a schematic diagram of the structure of the frame in a power module provided by an embodiment of the present invention;

[0033] Figure 11 It is a schematic diagram of the structure of the low-voltage pins in a power module provided by an embodiment of the present invention;

[0034] Figure 12 It is a schematic diagram of the structure of the high-voltage pins in a power module provided by an embodiment of the present invention;

[0035] Figure 13 It is a partial circuit diagram of a power module provided by an embodiment of the present invention.

[0036] Among them, 100 is a power module; 1 is a frame; 11 is a peripheral wall; 12 is a receiving space; 13 is an extension part; 14 is a groove; 15 is a fixing part; 151 is a fixing groove; 2 is a substrate assembly; 21 is a substrate; 22 is an air cooling device; 23 is a water cooling device; 3 is a component; 31 is an insulated gate bipolar transistor; 32 is a fast recovery diode; 4 is a low-voltage pin; 41 is a low-voltage boss; 42 is a low-voltage post; 5 is a high-voltage pin; 51 is a high-voltage base; 52 is a first high-voltage boss; 53 is a second high-voltage boss; 54 is a high-voltage post; 6 is a sealing cover; 7 is soft silica gel; 8 is a bonding wire. Specific embodiments

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] The embodiment of the present invention provides a power module 100, as combined with Figures 1 to 12 shown, which includes a frame 1, a substrate assembly 2, a component 3, a low-voltage pin 4 and a high-voltage pin 5.

[0039] Among them, the frame 1 includes an annular peripheral wall 11 and a receiving space 12 surrounded by the peripheral wall 11; a plurality of extension parts 13 respectively protruding and extending outward are arranged at intervals on opposite sides of the peripheral wall 11, and a groove 14 formed by inward depression is arranged on one side of each extension part 13; a fixing part 15 protruding and extending inward is arranged on the inner side of the peripheral wall 11.

[0040] The substrate assembly 2 is received and fixed in the receiving space 12 and its peripheral side abuts against the side of the fixing part 15 away from the peripheral wall 11; the two exposed side surfaces of the substrate assembly 2 are respectively a first mounting surface and a second mounting surface.

[0041] The component 3 includes a plurality of components which are respectively arranged at intervals on the first mounting surface and the second mounting surface; the plurality of components 3 on the first mounting surface are electrically connected to each other, and the plurality of components 3 on the second mounting surface are electrically connected to each other.

[0042] The low-voltage pin 4 includes a plurality of pins which are respectively embedded in opposite side surfaces of the fixing part 15; the low-voltage pin 4 corresponding to the first mounting surface is electrically connected to the component 3 on the first mounting surface, and the low-voltage pin 4 corresponding to the second mounting surface is electrically connected to the component 3 on the second mounting surface.

[0043] The high-voltage pins 5 include multiple ones respectively embedded in multiple grooves 14; the part of the high-voltage pins 5 corresponding to the first mounting surface is electrically connected to the component 3 on the first mounting surface, and the part of the high-voltage pins 5 corresponding to the second mounting surface is electrically connected to the component 3 on the second mounting surface.

[0044] In this embodiment, the frame 1 is of a rectangular structure, that is, the accommodation space 12 surrounded by the peripheral wall 11 is also a rectangular space, and correspondingly, the substrate assembly 2 is also of a rectangular structure. Of course, according to actual requirements, the frame 1 can also be designed into other shapes, which will not be specifically described here.

[0045] In this embodiment, the substrate assembly 2 includes two substrates 21 arranged opposite to and spaced apart from each other, and an air-cooling device 22 fixedly attached between the two substrates 21. The air-cooling device 22 is composed of multiple metal fins; the mutually remote sides of the two substrates 21 are respectively the first mounting surface and the second mounting surface; through holes penetrating through the peripheral wall 11 are respectively arranged on the opposite sides of the peripheral wall 11, and the through holes on the opposite sides of the peripheral wall 11 respectively correspond to the opposite sides of the air-cooling device 22. The air-cooling device 22 cooperates with the through holes on the peripheral wall 11 to achieve air-cooling heat dissipation for the power module 100, so as to improve the heat dissipation effect of the power module 100.

[0046] The peripheries of the two substrates 21 that do not correspond to the through holes on the opposite sides of the peripheral wall 11 extend and are connected together to achieve stable support and wrap the air-cooling device 22.

[0047] The substrate 21 mainly includes a metal plate as a carrier, an insulating layer arranged on one side of the metal plate, a copper foil layer arranged on the insulating layer, a circuit wiring area formed by etching on the copper foil layer, and a green oil layer arranged on the circuit wiring area for protecting the circuit, etc.; multiple components 3 are respectively arranged in the circuit wiring area and are electrically connected through the circuit wiring.

[0048] In this embodiment, the substrate assembly 2 further includes a water-cooling device 23 attached between the substrate 21 and the air-cooling device 22. The water-cooling device 23 is composed of bent pipes. One end of the pipe is the water inlet, and the other end of the pipe is the water outlet; the water inlet of the pipe is used to access cooling water, and then take out the heat generated by the power module 100, so as to output it from the water outlet of the pipe, thereby realizing water-cooling heat dissipation to further improve the heat dissipation effect of the power module 100.

[0049] Specifically, there are two water-cooling devices 23, and through holes penetrating through the frame 1 are respectively arranged at positions corresponding to the water inlet and the water outlet of the pipe, so as to facilitate the connection of the water inlet and the water outlet of the pipe to external water delivery equipment.

[0050] In this embodiment, the low-voltage pin 4 includes a low-voltage boss 41 embedded in the fixing portion 15 and a low-voltage column 42 protruding and extending in a direction away from the fixing portion 15 from a side of the low-voltage boss 41 away from the fixing portion 15; the low-voltage column 42 is used for electrically connecting with an external circuit.

[0051] Such an arrangement can electrically connect the components 3 on the first mounting surface with an external circuit, and also electrically connect the components 3 on the second mounting surface with an external circuit, avoid the phenomenon of welding voids, and there will be no copper leakage due to pin cutting, improving the reliability of the power module 100. At the same time, there is no need to use a stepped stencil with complex processes for printing, nor is it necessary to use a trimming and forming device to cut and shape the pins, reducing the equipment cost, not generating packaging stress, not requiring post-curing of production and material control, reducing the processing procedures. Additionally, there will be no wire punching phenomenon, etc.

[0052] In this embodiment, the high-voltage pin 5 includes a high-voltage base 51 embedded in the groove 14, a first high-voltage boss 52 protruding and extending in a direction towards the first mounting surface from a position of the high-voltage base 51 corresponding to the first mounting surface, a second high-voltage boss 53 protruding and extending in a direction towards the second mounting surface from a position of the high-voltage base 51 corresponding to the second mounting surface, and a high-voltage column 54 inserted at one end of the high-voltage base 51 away from the groove 14; the first high-voltage boss 52 passes through the peripheral wall 11 and is fixedly attached to a side of the fixing portion 15 close to the first mounting surface, and is electrically connected to one of the components 3 on the first mounting surface, the second high-voltage boss 53 passes through the peripheral wall 11 and is fixedly attached to a side of the fixing portion 15 close to the second mounting surface, and is electrically connected to one of the components 3 on the second mounting surface; the high-voltage column 54 is used for electrically connecting with an external circuit.

[0053] Such an arrangement can electrically connect the components 3 on the first mounting surface with the components 3 on the second mounting surface, and also enable the high-voltage pin 5 connecting the components 3 on the first mounting surface and the second mounting surface to be electrically connected to an external circuit, avoid the phenomenon of welding voids, and there will be no copper leakage due to pin cutting, improving the reliability of the power module 100. At the same time, there is no need to use a stepped stencil with complex processes for printing, nor is it necessary to use a trimming and forming device to cut and shape the pins, reducing the equipment cost, not generating packaging stress, not requiring post-curing of production and material control, reducing the processing procedures. Additionally, there will be no wire punching phenomenon, etc.

[0054] In this embodiment, fixing grooves 151 are formed by inward depression at positions of the fixing portion 15 corresponding to the first high-voltage boss 52 and the second high-voltage boss 53 respectively, and the first high-voltage boss 52 and the second high-voltage boss 53 are fixedly attached in the corresponding fixing grooves 151. This can facilitate the fixing of the first high-voltage boss 52 and the second high-voltage boss 53.

[0055] In this embodiment, the power module 100 further includes soft silicone 7 encapsulated in the accommodation space 12. The soft silicone 7 covers the first mounting surface, the components 3 on the first mounting surface, the second mounting surface, and the components 3 on the second mounting surface respectively.

[0056] The soft silicone 7 is a high-end thermal conductive compound, and it will not solidify or conduct electricity, which can avoid the risk of short circuit; the soft silicone 7 is a one-component, thermally conductive and room-temperature curing silicone bonding and sealing adhesive, which undergoes a condensation reaction through moisture in the air to release low molecules and cause cross-linking curing to vulcanize into a high-performance elastomer. It has excellent cold and heat alternating performance, aging resistance, and electrical insulation performance, and also has excellent moisture-proof, earthquake-proof, corona-resistant, anti-electric leakage, chemical medium-resistant and other performances. It can continuously maintain the above performances under the conditions of -60 - 280 degrees Celsius, without swelling and having good adhesiveness to most metal and non-metal materials, and can achieve high bonding and super strong heat conduction effects on electronic components.

[0057] In this embodiment, the power module 100 further includes two sealing covers 6. The two sealing covers 6 are respectively disposed on the two openings formed by surrounding the peripheral wall 11 and are attached to the soft silicone 7.

[0058] The sealing cover 6 is made of non-metallic insulating material, and its thickness is between 0.1 - 1 mm. Its main function is to protect the soft silicone 7 and avoid damage to the soft silicone 7.

[0059] In this embodiment, the multiple components 3 on the first mounting surface, the multiple components 3 on the second mounting surface, between the low-voltage pins 4 and the components 3, and between the high-voltage pins 5 and the components 3 are all electrically connected through the bonding metal 8.

[0060] The bonding metal 8 is mainly made of metal materials such as gold, aluminum or copper. The bonding metal 8 is used to realize the electrical connection between the components 3, between the components 3 and the low-voltage pins 4 or the high-voltage pins 5.

[0061] In this embodiment, the component 3 includes an insulated gate bipolar transistor 31 and a fast recovery diode 32. The specific connection method is as Figure 13 shown. Of course, according to actual requirements, the component 3 further includes other necessary devices of the power module 100, such as capacitors, resistors, and voltage stabilizing diodes, etc., which will not be described one by one here.

[0062] The power module 100 in this embodiment is applicable to high-specification application places.

[0063] In this embodiment, the manufacturing method of the power module 100 is as follows: First, place the substrate assembly 2 with the water cooling device 23 and the air cooling device 22 on a specific carrier, which can be made of materials such as aluminum, syngony, ceramic, PPS, etc. that can withstand high temperatures above 200 degrees Celsius; paste the power components 3 at the corresponding positions through solder paste or silver glue at the installation positions reserved on the first installation surface and the second installation surface of the substrate assembly 2, and use an automatic die bonding equipment for bonding; then use an automatic SMT equipment to paste other components 3 (capacitors, resistors, etc.) to the corresponding installation positions.

[0064] Then, put the substrate assembly 2 with the components 3 bonded thereon together with the carrier into a reflow oven, and weld all the components 3 to the corresponding installation positions; then detect the welding quality of the components 3 through a visual monitoring ADI device; after that, remove foreign matters such as residual solder resist and aluminum chips through cleaning methods such as spraying and ultrasonic cleaning.

[0065] Put the cleaned substrate assembly 2 into the receiving space 12 of the frame 1, and fix the two through an adhesive, specifically by curing; then connect the corresponding components 3 and the components 3 to the low-voltage pins 4 or high-voltage pins 5 through a bonding metal 8; after that, pour soft silicone 7 into the receiving space 12 of the frame 1 through a double-sided potting device, so that the soft silicone 7 covers the first installation surface, the components 3 on the first installation surface, the second installation surface, and the components 3 on the second installation surface; finally, cover the cover plate on the soft silicone 7, and through marking and electrical parameter testing, form the final power module 100.

[0066] Compared with the prior art, in this embodiment, the power module 100 avoids the welding voids caused by directly welding pins on the substrate assembly 2 and the problem of cracking of the insulating layer of the substrate assembly 2 caused by stress during the encapsulation mold process due to welding tolerances by installing the substrate assembly 2 in the frame 1 embedded with low-voltage pins 4 and high-voltage pins 5 and connecting the components 3 on the substrate assembly 2 to the embedded low-voltage pins 4 and high-voltage pins 5, thereby improving the reliability and yield of the power module 100. Moreover, there is no need for a trimming and forming device to cut and shape the pins later, which also reduces the equipment cost and the processing procedures. In addition, by using the method of double-sided mounting of the components 3, the area of the power module 100 can be reduced under the same integration level, realizing high integration and miniaturization.

[0067] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A power module, characterized in that, Comprising: A frame, the frame including an annular peripheral wall and a receiving space formed by enclosing with the peripheral wall; a plurality of extending portions respectively protruding outward and extending are provided at opposite sides of the peripheral wall at intervals, and a groove formed by inward depression is provided at one side of each of the extending portions; a fixing portion protruding inward and extending is provided at the inner side of the peripheral wall; A substrate assembly, the substrate assembly being received and fixed in the receiving space and its peripheral side abutting against the side of the fixing portion away from the peripheral wall; the two exposed side surfaces of the substrate assembly are respectively a first mounting surface and a second mounting surface; Components, the components including a plurality and being respectively arranged at intervals on the first mounting surface and the second mounting surface; the plurality of components on the first mounting surface are electrically connected to each other, and the plurality of components on the second mounting surface are electrically connected to each other; Low-voltage pins, the low-voltage pins including a plurality and being respectively embedded in opposite side surfaces of the fixing portion; the low-voltage pins corresponding to the first mounting surface are electrically connected to the components on the first mounting surface, and the low-voltage pins corresponding to the second mounting surface are electrically connected to the components on the second mounting surface; High-voltage pins, the high-voltage pins including a plurality and being respectively embedded in a plurality of the grooves; the high-voltage pins corresponding to the first mounting surface are partially electrically connected to the components on the first mounting surface, and the high-voltage pins corresponding to the second mounting surface are partially electrically connected to the components on the second mounting surface.

2. The power module according to claim 1, characterized in that, The low-voltage pins include low-voltage bosses embedded in the fixing portion and low-voltage columns protruding and extending in a direction away from the fixing portion from a side of the low-voltage bosses away from the fixing portion; the low-voltage columns are used for realizing electrical connection with an external circuit.

3. The power module according to claim 2, wherein The high-voltage pins include high-voltage bases embedded in the grooves, a first high-voltage boss protruding and extending in the direction of the first mounting surface from a position of the high-voltage base corresponding to the first mounting surface, a second high-voltage boss protruding and extending in the direction of the second mounting surface from a position of the high-voltage base corresponding to the second mounting surface, and high-voltage columns inserted at one end of the high-voltage bases away from the grooves; the first high-voltage boss passes through the peripheral wall and is fixedly attached to the side of the fixing portion close to the first mounting surface and is electrically connected to one of the components on the first mounting surface, and the second high-voltage boss passes through the peripheral wall and is fixedly attached to the side of the fixing portion close to the second mounting surface and is electrically connected to one of the components on the second mounting surface; the high-voltage columns are used for realizing electrical connection with the external circuit.

4. The power module according to claim 3, characterized in that, Fixing grooves formed by inward depression are respectively provided at positions of the fixing portion corresponding to the first high-voltage boss and the second high-voltage boss, and the first high-voltage boss and the second high-voltage boss are fixedly attached in the corresponding fixing grooves.

5. The power module according to claim 1, characterized in that, The substrate assembly includes two substrates that are opposite and spaced apart from each other, and an air-cooling device that is fixedly attached between the two substrates. The air-cooling device is composed of a plurality of metal fins; the opposite sides of the two substrates away from each other are the first mounting surface and the second mounting surface respectively; through holes are respectively provided on the opposite sides of the peripheral wall, and the through holes on the opposite sides of the peripheral wall respectively correspond to the opposite sides of the air-cooling device.

6. The power module according to claim 5, characterized in that The substrate assembly further includes a water-cooling device disposed between the substrate and the air-cooling device. The water-cooling device is composed of a bent pipe, one end of the pipe is a water inlet, and the other end of the pipe is a water outlet.

7. The power module according to claim 1, characterized in that, The power module further includes soft silicone potted in the receiving space, and the soft silicone covers the first mounting surface, the components on the first mounting surface, the second mounting surface, and the components on the second mounting surface respectively.

8. The power module according to claim 7, characterized in that, The power module further includes two sealing covers, and the two sealing covers are respectively disposed to cover the two openings formed by the peripheral wall and are attached to the soft silicone.

9. The power module according to claim 1, characterized in that, Electrical connections are realized between the multiple components on the first mounting surface, between the multiple components on the second mounting surface, between the low-voltage pins and the components, and between the high-voltage pins and the components through bonding metal wires.

10. The power module according to claim 1, characterized in that, The components include insulated gate bipolar transistors and fast recovery diodes.

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