Stress-resistant wiring structure and piezoelectric detection device made thereof

Abstract

The present invention provides a stress-resistant wiring structure and a piezoelectric detection device fabricated therefrom, comprising: a patterned wiring layer and a porous stress-resistant layer. The patterned wiring layer has a nonlinear pattern and is disposed on the porous stress-resistant layer. The porous stress-resistant layer has a plurality of through-holes, and the through-holes are arranged in a staggered manner perpendicular to the nonlinear pattern.

Description

Technical Field

[0001] The present invention relates to a stress-resistant wiring structure, and more particularly to a piezoelectric detection device having the stress-resistant wiring structure. Background Art

[0002] A piezoelectric detection device (or "piezoelectric sensor") is a sensor based on the piezoelectric effect. It is a self-generating and electromechanical transducer. Its sensitive element is made of piezoelectric material. When a force is applied to the piezoelectric material, a charge is generated on its surface. This charge is amplified and converted to an electrical output proportional to the applied force by a charge amplifier and measurement circuit. Piezoelectric sensors are used to measure non-electrical quantities, such as force and energy, by converting them into electricity. Their advantages include wide bandwidth, high sensitivity, high signal-to-noise ratio, simple structure, reliable operation, and light weight. However, their disadvantages are that some piezoelectric materials require moisture protection, and their output DC response is poor, requiring the use of high-input impedance circuits or charge amplifiers to overcome these drawbacks. (Excerpt from Baidu Encyclopedia: https: / / baike.baidu.hk / item / PiezoelectricSensor / 8835700)

[0003] Please refer to Figure 1 , Figure 1 The figure is a schematic diagram showing some components of a piezoelectric detection device in the prior art. Figure 1 As shown, some components of a conventional piezoelectric detection device 100 include electrode layers 104a, 104b and a polyvinylidene fluoride (PVDF) layer 102 sandwiched therebetween. Conventional piezoelectric detection devices 100 have the problem of easily breaking conductive traces within the device due to stress when the device is bent.

[0004] Therefore, how to provide a stress-resistant wiring structure and a piezoelectric detection device made therefrom that can solve the above-mentioned problems is an important issue that the industry needs to consider. Summary of the Invention

[0005] In light of this, the present disclosure provides a stress-resistant wiring structure and a piezoelectric detection device fabricated therefrom. These structures prevent the patterned electrodes (or "electrode wiring," etc.) within the stress-resistant wiring structure and the piezoelectric detection device fabricated therefrom from being subjected to stress and fracture during bending. It is particularly important to note that each element, module, unit, or component within the stress-resistant wiring structure and the piezoelectric detection device fabricated therefrom is flexible.

[0006] One aspect of the present disclosure provides a stress-resistant wiring structure comprising a patterned wiring layer and a porous stress-resistant layer. The patterned wiring layer has a nonlinear pattern and is disposed on the porous stress-resistant layer. The porous stress-resistant layer has a plurality of through-holes, and the through-holes are arranged in a staggered manner perpendicular to the nonlinear pattern.

[0007] According to one or more embodiments of the present disclosure, the stress-resistant trace structure is used to fabricate a piezoelectric detection device, and the piezoelectric detection device is electrically coupled to a flexible printed circuit board via a plurality of conductive lines.

[0008] According to one or more embodiments of the present disclosure, the stress-resistant wiring structure and another stress-resistant wiring structure are respectively disposed on opposite sides of a flexible piezoelectric material layer to form a piezoelectric detection device.

[0009] According to one or more embodiments of the present disclosure, the flexible piezoelectric material layer is polyvinylidene fluoride (PVDF), a copolymer of polyvinylidene fluoride, or a combination thereof.

[0010] According to one or more embodiments of the present disclosure, the patterned wiring layer is composed of an electrode configured in the nonlinear pattern.

[0011] According to one or more embodiments of the present disclosure, the nonlinear pattern is a regularly or irregularly repeated pattern.

[0012] According to one or more embodiments of the present disclosure, the nonlinear pattern is adjacent to the through-holes.

[0013] According to one or more embodiments of the present disclosure, the nonlinear pattern surrounds the through holes.

[0014] According to one or more embodiments of the present disclosure, the nonlinear pattern is conformally configured with the through holes.

[0015] Another aspect of the present disclosure provides a piezoelectric detection device, comprising: a flexible piezoelectric material layer sandwiched between two adjacent porous deposition layers; a plurality of passivation layers, each disposed adjacent to the porous deposition layers and away from the flexible piezoelectric material layer; and a plurality of patterned electrode wiring layers, each sandwiched between the passivation layers and the porous deposition layers, wherein each patterned electrode wiring layer has a patterned electrode; wherein each porous deposition layer has through-holes staggered in a direction perpendicular to each patterned electrode to prevent each patterned electrode from being fractured due to stress when bent.

[0016] According to one or more embodiments of the present disclosure, the piezoelectric detection device is electrically coupled to a flexible printed circuit board through a plurality of conductive circuits.

[0017] According to one or more embodiments of the present disclosure, the flexible piezoelectric material layer is polyvinylidene fluoride (PVDF), a copolymer of polyvinylidene fluoride, or a combination thereof.

[0018] According to one or more embodiments of the present disclosure, the pattern formed by the patterned electrode is a nonlinear pattern.

[0019] According to one or more embodiments of the present disclosure, the nonlinear pattern is a regularly or irregularly repeated pattern.

[0020] According to one or more embodiments of the present disclosure, the nonlinear pattern is adjacent to the through-holes.

[0021] According to one or more embodiments of the present disclosure, the nonlinear pattern surrounds the through holes.

[0022] According to one or more embodiments of the present disclosure, the nonlinear pattern is conformally configured with the through holes.

[0023] Another aspect of the present disclosure provides a piezoelectric detection device electrically coupled to a flexible printed circuit board via a plurality of conductive circuits, the piezoelectric detection device comprising: a stress-resistant wiring structure; and a plurality of protective layers, each disposed adjacent to each of the porous stress-resistant layers and away from the flexible piezoelectric material layer; wherein the flexible piezoelectric material layer is polyvinylidene fluoride (PVDF), a copolymer of polyvinylidene fluoride, or a combination thereof. The stress-resistant wiring structure comprises: a patterned wiring layer and a porous stress-resistant layer. The patterned wiring layer has a nonlinear pattern and is disposed on the porous stress-resistant layer. The porous stress-resistant layer has a plurality of perforations, and the perforations are staggered in a perpendicular direction to the nonlinear pattern. The stress-resistant wiring structure and another stress-resistant wiring structure are disposed on opposite sides of a flexible piezoelectric material layer to form a piezoelectric detection device.

[0024] According to one or more embodiments of the present disclosure, the nonlinear pattern is a regularly repeated S-shaped pattern.

[0025] According to one or more embodiments of the present disclosure, the nonlinear pattern is a regularly repeated parallelogram pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To make the above and other objects, features, advantages and embodiments of the present invention more easily understood, the accompanying drawings are described as follows:

[0027] Figure 1 The figure is a schematic diagram showing some components in a piezoelectric detection device in the prior art.

[0028] Figure 2 FIG. 1 is a schematic diagram illustrating a piezoelectric detection device according to an embodiment of the present invention.

[0029] Figure 3 FIG. 4 is a schematic diagram illustrating a piezoelectric detection device according to another embodiment of the present invention.

[0030] Figure 4 The invention describes a stress-resistant wiring structure according to an embodiment of the present invention.

[0031] Figure 5 This section describes a stress-resistant wiring structure according to another embodiment of the present invention.

[0032] Figure 6 The figure illustrates the CAE application analysis results of a stress-resistant wiring structure according to an embodiment of the present invention.

[0033] Figure 7 The figure illustrates the CAE application analysis results of a stress-resistant wiring structure according to an embodiment of the present invention.

[0034] According to conventional practice, various features and components in the drawings are not drawn to scale. Instead, they are drawn to best illustrate the specific features and components related to the present invention. In addition, similar elements and components are referred to by the same or similar reference numerals across the different drawings.

[0035] The accompanying drawings are:

[0036] 100, 200, 300 piezoelectric detection devices

[0037] 102 polyvinylidene fluoride layer

[0038] 104a, 104b, 204a, 204b, 304a, 304b, 402, 414, 502, 514 electrode layers

[0039] 202, 302, 408, 508 flexible piezoelectric material layers

[0040] 203a, 203b, 303a, 303b, 410, 412, 510, 512 deposition layers

[0041] 206a, 206b, 306a, 306b, 406, 506 passivation layer

[0042] 400, 500 routing structure module

[0043] 404, 504a, 504b perforations DETAILED DESCRIPTION

[0044] The following disclosure provides different embodiments or examples to implement different features of the subject matter provided. The specific examples of components and arrangements described below are intended to simplify the present disclosure and are not intended to be limiting; the size and shape of the components are not limited by the disclosed ranges or values, but may depend on the process conditions or required characteristics of the components. For example, cross-sectional views are used to describe the technical features of the present invention, and these cross-sectional views are schematic diagrams of idealized embodiments. Therefore, differences in the shapes shown in the illustrations due to manufacturing processes and / or tolerances are foreseeable and should not be limiting.

[0045] Furthermore, spatially relative terms, such as "below," "beneath," "lower than," "above," and "higher than," are intended to facilitate description of the relationships between elements or features illustrated in the accompanying drawings. In addition, spatially relative terms encompass not only the directions depicted in the drawings but also different orientations of the elements when in use or operation.

[0046] First, it should be noted that the "stress-resistant trace structure" mentioned in this specification refers to a laminated structure in which a porous stress-resistant layer is configured with multiple perforations for stress resistance. In other words, this stress-resistant trace structure can be used to prevent traces (such as electrodes) from breaking due to stress when bent. Furthermore, the term "piezoelectric detection device" used in this specification refers to a device that has (including but not limited to) this stress-resistant trace structure and exhibits piezoelectric properties.

[0047] It should be specifically noted here that, in an embodiment of the present invention, the stress-resistant wiring structure further has (including but not limited to) a patterned wiring layer configured on the porous stress-resistant layer, wherein the patterned wiring layer has a nonlinear pattern composed of an electrode, and the nonlinear pattern is staggered in a vertical direction with respect to the through-holes of the porous stress-resistant layer.

[0048] In addition, in an embodiment of the present invention, a structural stress analysis is performed on the stress-resistant wiring structure and the piezoelectric detection device made therefrom using internationally recognized CAE standards and related structural stress analysis software.

[0049] Next, please refer to Figure 2 , Figure 2 FIG. 1 is a schematic diagram illustrating a piezoelectric detection device according to an embodiment of the present invention. Figure 2As shown, some components of the piezoelectric detection device 200 include a flexible piezoelectric material layer 202, a deposition layer 203a, a deposition layer 203b, an electrode layer 204a, an electrode layer 204b, a passivation layer 206a, and a passivation layer 206b. The deposition layers 203a and 203b are formed on opposite surfaces of the flexible piezoelectric material layer 202. The electrode layer 204a is adjacent to the deposition layer 203a, while the electrode layer 204b is adjacent to the deposition layer 203b. The passivation layer 206a covers the electrode layer 204a, while the passivation layer 206b covers the electrode layer 204b. It should be noted that, in an embodiment of the present invention, the deposition layers 203a and 203b are provided with a plurality of through-holes to serve as the porous anti-stress layer. Furthermore, in an embodiment of the present invention, the electrode layers 204a and 204 are patterned wiring layers having a nonlinear pattern.

[0050] Also, please refer to Figure 3 , Figure 3 FIG. 1 is a schematic diagram illustrating a piezoelectric detection device according to another embodiment of the present invention. Figure 3 Similarly, as shown, some components of the piezoelectric detection device 300 include a flexible piezoelectric material layer 302, deposited layers 303a and 303b, electrode layers 304a and 304b, and passivation layers 306a and 306b. The flexible piezoelectric material layer 302 is sandwiched between the deposited layers 303a and 303b. The electrode layers 304a and 304b are disposed on the deposited layers 303a and 303b, respectively. The passivation layers 306a and 306b are formed on the electrode layers 304a and 304b, respectively. It should also be noted that, in this embodiment of the present invention, the deposited layers 303a and 303b are also provided with a plurality of through-holes to serve as the porous stress-resistant layer. Furthermore, in this embodiment of the present invention, the electrode layers 304a and 304 are also patterned trace layers having a nonlinear pattern. Figure 2 The deposition layer 203a, the deposition layer 203b, the electrode layer 204a, the electrode layer 204 and Figure 3 The difference between the deposition layer 303a, the deposition layer 303b, the electrode layer 304a, and the electrode layer 304 is that they have different geometric shapes, as described later.

[0051] Next, please refer to Figure 4 , Figure 4 This figure illustrates a stress-resistant wiring structure according to an embodiment of the present invention. Figure 4As shown, in an embodiment of the present invention, a stress-resistant trace structure module 400, a component of a piezoelectric detection device, includes two stress-resistant trace structures. The stress-resistant trace structure module 400 includes a flexible piezoelectric material layer 408, deposition layers 410 and 412, electrode layers 402 and 414, and a passivation layer 406. It should be noted that in this embodiment of the present invention, deposition layers 410 and 412 are porous stress-resistant layers, while electrode layers 402 and 414 are patterned trace layers. For example, electrode layer 402 has a nonlinear pattern and is disposed on deposition layer 410. In this embodiment of the present invention, deposition layer 410, serving as a porous stress-resistant layer, has a plurality of through-holes 404, which are arranged perpendicularly to the nonlinear pattern formed by electrode layer 402. Furthermore, in this embodiment of the present invention, the nonlinear pattern formed by electrode layer 402 is a regularly repeating S-shaped pattern. Corresponding to the S-shaped pattern formed by the electrode layer 402, the through-holes 404 of the deposition layer 410 are adjacent to the nonlinear pattern. In other embodiments of the present invention, the S-shaped pattern formed by the electrode layer 402 surrounds the through-holes 404 of the deposition layer 410. In other embodiments of the present invention, the S-shaped pattern formed by the electrode layer 402 is conformally configured with the through-holes 404 of the deposition layer 410. It should be noted that in embodiments of the present invention, the shape and size of the through-holes 404 of the deposition layer 410 can be adjusted according to the pattern formed by the electrode layer 402. In addition, in embodiments of the present invention, the flexible piezoelectric material layer 408 can be polyvinylidene fluoride (PVDF), a copolymer of polyvinylidene fluoride, or a combination thereof.

[0052] Next, please refer to Figure 5 , Figure 5 This is to illustrate another embodiment of the stress-resistant wiring structure of the present invention. Figure 5As shown, in an embodiment of the present invention, a stress-resistant trace structure module 500, which is a component of a piezoelectric detection device, includes two stress-resistant trace structures. The stress-resistant trace structure module 500 includes a flexible piezoelectric material layer 508, deposition layers 510 and 512, an electrode layer 502 and 514, and a passivation layer 506. It should be noted that in this embodiment of the present invention, deposition layers 510 and 512 are porous stress-resistant layers, while electrode layers 502 and 514 are patterned trace layers. For example, electrode layer 502 has a nonlinear pattern and is disposed on deposition layer 510. In this embodiment of the present invention, deposition layer 510, which serves as a porous stress-resistant layer, has a plurality of through-holes 504, and these through-holes 504 are arranged in a staggered manner perpendicular to the nonlinear pattern formed by electrode layer 502. Furthermore, in an embodiment of the present invention, the nonlinear pattern formed by the electrode layer 502 is a regularly repeating geometric pattern of parallelograms or rhombuses. Corresponding to the geometric pattern of parallelograms or rhombuses formed by the electrode layer 502, the through-holes 504 of the deposition layer 510 are also adjacent to the nonlinear pattern. In other embodiments of the present invention, the geometric pattern of parallelograms or rhombuses formed by the electrode layer 502 also surrounds the through-holes 504 of the deposition layer 510. In other embodiments of the present invention, the geometric pattern of parallelograms or rhombuses formed by the electrode layer 502 is also conformally arranged with the through-holes 504 of the deposition layer 510. It should be noted that in an embodiment of the present invention, the shape and size of the through-holes 504 of the deposition layer 510 can be adjusted based on the pattern formed by the electrode layer 502. For example, the shape of the through-holes 504 of the deposition layer 510 can be a geometric pattern of parallelograms, rhombuses, or triangles. In addition, in an embodiment of the present invention, the flexible piezoelectric material layer 508 may also be polyvinylidene fluoride (PVDF), a copolymer of polyvinylidene fluoride, or a combination thereof.

[0053] Next, please refer to Figure 6 and Figure 7 , Figure 6 The figure illustrates the CAE application analysis results of a stress-resistant wiring structure according to an embodiment of the present invention. Figure 7 The figure shows the CAE application analysis results of the stress-resistant wiring structure in one embodiment of the present invention. Figure 6 and Figure 7 As shown, in the embodiment of the present invention, after structural stress analysis, the results show Figure 4 The stress-resistant wiring structure module 400 and Figure 5 The stress-resistant wiring structure module 500 is not easily broken after being bent.

[0054] In addition, in an embodiment of the present invention, Figure 4The stress-resistant wiring structure module 400 and Figure 5 The stress-resistant wiring structure module 500 is used to manufacture a piezoelectric detection device, and the piezoelectric detection device is electrically coupled to a flexible printed circuit board through a plurality of conductive circuits.

[0055] In summary, in an embodiment of the present invention, the stress-resistant wiring structure and another stress-resistant wiring structure are respectively arranged on opposite sides of a flexible piezoelectric material layer to form a piezoelectric detection device. The piezoelectric detection device includes: a flexible piezoelectric material layer, sandwiched between two adjacent porous deposition layers; a plurality of passivation layers, respectively arranged in a manner adjacent to each of the porous deposition layers and away from the flexible piezoelectric material layer; and a plurality of patterned electrode wiring layers, respectively sandwiched between each of the passivation layers and each of the porous deposition layers, wherein each of the patterned electrode wiring layers has a patterned electrode; wherein each of the porous deposition layers has perforations that are staggered in a direction perpendicular to each of the patterned electrodes to prevent each of the patterned electrodes from being broken by stress when bent. In addition, in an embodiment of the present invention, the piezoelectric detection device is electrically coupled to a flexible printed circuit board through a plurality of conductive lines. In an embodiment of the present invention, the flexible piezoelectric material layer is polyvinylidene fluoride (PVDF), a copolymer of polyvinylidene fluoride, or a combination thereof. In an embodiment of the present invention, the pattern formed by the patterned electrodes is a nonlinear pattern. In an embodiment of the present invention, the nonlinear pattern is a pattern that is regularly or irregularly repeated.

[0056] In the embodiment of the present invention, the passivation layer serves as a protective layer to prevent the device from being scratched or damaged by external forces.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A stress-resistant wiring structure, characterized in that: Include: The patterned wiring layer has a nonlinear pattern and is arranged on a porous anti-stress layer, wherein the porous anti-stress layer has a plurality of perforations, and the plurality of perforations are arranged in an alternating manner perpendicular to the nonlinear pattern; wherein the anti-stress wiring structure and another anti-stress wiring structure are respectively arranged on opposite sides of the flexible piezoelectric material layer to form a piezoelectric detection device.

2. The stress-resistant wiring structure according to claim 1, wherein: The stress-resistant wiring structure is used to manufacture a piezoelectric detection device, and the piezoelectric detection device is electrically coupled to a flexible printed circuit board through a plurality of conductive lines.

3. The stress-resistant wiring structure according to claim 1, wherein: The flexible piezoelectric material layer is polyvinylidene fluoride, a copolymer of polyvinylidene fluoride or a combination thereof.

4. The stress-resistant wiring structure according to claim 1, wherein: The patterned wiring layer is composed of electrodes configured into the nonlinear pattern.

5. The stress-resistant wiring structure according to claim 1, wherein: The nonlinear pattern is a pattern that is regularly or irregularly repeated.

6. The stress-resistant wiring structure according to claim 1, wherein: The nonlinear pattern is adjacent to the plurality of through-holes.

7. The stress-resistant wiring structure according to claim 1, wherein: The nonlinear pattern surrounds the plurality of through-holes.

8. The stress-resistant wiring structure according to claim 1, wherein: The nonlinear pattern is conformally configured with the plurality of through-holes.

9. A piezoelectric detection device, characterized in that: include: A flexible piezoelectric material layer is sandwiched between two adjacent porous deposition layers; a plurality of passivation layers, each disposed adjacent to each of the porous deposition layers and away from the flexible piezoelectric material layer; as well as A plurality of patterned electrode wiring layers are respectively sandwiched between each of the passivation layers and each of the porous deposition layers, wherein each of the patterned electrode wiring layers has a patterned electrode; Each of the porous deposition layers has through-holes that are arranged in a staggered manner perpendicular to the patterned electrodes, so as to prevent each of the patterned electrodes from being broken due to stress when bent.

10. The piezoelectric detection device according to claim 9, wherein: The piezoelectric detection device is electrically coupled to the flexible printed circuit board through a plurality of conductive lines.

11. The piezoelectric detection device according to claim 9, wherein: The flexible piezoelectric material layer is polyvinylidene fluoride, a copolymer of polyvinylidene fluoride or a combination thereof.

12. The piezoelectric detection device according to claim 9, wherein: The pattern formed by the patterned electrodes is a nonlinear pattern.

13. The piezoelectric detection device according to claim 12, wherein: The nonlinear pattern is a pattern that is regularly or irregularly repeated.

14. The piezoelectric detection device according to claim 12, wherein: The nonlinear pattern is adjacent to the through-hole.

15. The piezoelectric detection device according to claim 12, wherein: The nonlinear pattern surrounds the through-hole.

16. The piezoelectric detection device according to claim 12, wherein: The nonlinear pattern is conformally configured with the through-hole.

17. A piezoelectric detection device, characterized in that: The piezoelectric detection device is electrically coupled to a flexible printed circuit board via a plurality of conductive lines, and comprises: The stress-resistant wiring structure according to claim 1; and a plurality of protective layers, each disposed adjacent to each of the porous anti-stress layers and away from the flexible piezoelectric material layer; The flexible piezoelectric material layer is polyvinylidene fluoride, a copolymer of polyvinylidene fluoride or a combination thereof.

18. The piezoelectric detection device according to claim 17, wherein: The nonlinear pattern is a regularly repeated S-shaped pattern.

19. The piezoelectric detection device according to claim 17, wherein: The nonlinear pattern is a regularly repeated parallelogram pattern.

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