A high wear-resistant and high stability carbon oil PCB board and its manufacturing process

Abstract

The present invention relates to a highly wear-resistant and highly stable carbon oil printed circuit board (PCB) and a manufacturing process. The PCB board includes a PCB substrate, wherein a PCB heat sink is installed internally, an upper PCB copper foil plate is laminated to the upper surface of the PCB substrate, and a lower PCB copper foil plate is laminated to the lower surface of the PCB substrate. The present invention dissipates heat promptly through a heat dissipation network by disposing an "I"-shaped heat sink internally, thereby preventing high temperature from damaging the PCB structure. A solder resist is provided between the copper foil and the carbon oil to prevent unnecessary excessive contact between the copper foil and the carbon oil, thereby preventing a short circuit. The solder resist is then re-applied on the surface of the carbon oil, thereby protecting the entire PCB board from wear and structural damage. By introducing a high-quality, highly stable material into the carbon oil, the wear resistance, stability, and heat dissipation effect of the PCB board are significantly improved. The PCB board is also effectively flame-retardant and anti-static, further enhancing the performance of the PCB board. Through simple structural design and improvement, the electrical conductivity and practicality of the PCB board are significantly improved, thereby having excellent application value and promotion prospects.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board manufacturing, and in particular to a high-wear-resistant and high-stability carbon oil PCB board and a manufacturing process thereof. Background Art

[0002] The main function of PCB is to connect various electronic parts to form a predetermined circuit, play the role of relay transmission, and is a key interconnecting part of electronic products. It is the support body of electronic components and the carrier of electrical connections.

[0003] With the rapid development of PCB technology, conductive carbon ink printed circuit boards (PCBs) continue to be popular with some PCB customers due to their simple production process, relatively low cost, and wear and corrosion resistance, occupying a certain market share. Conductive carbon ink PCBs are manufactured by printing carbon ink on certain solder joints or pads on the PCB, forming a carbon ink finger structure. This process makes the printed carbon ink conductive.

[0004] Carbon ink printing is a PCB printed with carbon ink. Carbon ink printing involves screen printing carbon ink at designated locations on the PCB. After oven curing and testing, a qualified carbon film with a specified resistance value replaces the original resistor element. The production process is similar to silk screen printing, with the only difference being that carbon ink has excellent conductivity, while the characters are made of semiconductor material and serve only as identification and solder barrier.

[0005] Common carbon ink printed circuit boards are not coated with solder mask or other protective layers, which makes the carbon conductive ink easily scratched and abraded, significantly reducing its stability and even directly affecting the normal use of the entire PCB board. Ensuring the wear resistance and stability of the carbon conductive ink while ensuring the normal use of the PCB board is a practical technical challenge that carbon ink printed circuit boards currently need to solve. Summary of the Invention

[0006] The present invention aims to design a highly wear-resistant and highly stable carbon oil-based PCB board and its manufacturing process. By installing an "I"-shaped heat sink inside the PCB board, the generated heat is promptly conducted away and dissipated through a heat dissipation network, preventing high-temperature damage to the PCB board structure. A solder resist is provided between the copper foil and the carbon oil to prevent unnecessary contact between the copper foil and the carbon oil, which could cause a short circuit. Solder resist is then reapplied on the surface of the carbon oil, thereby protecting the entire PCB board from wear and structural damage. By introducing a high-stability material called Gaonanwu into the carbon oil, the wear resistance, stability, and heat dissipation of the PCB board are significantly improved. The carbon oil also provides effective flame retardancy and antistatic properties, further enhancing the performance of the PCB board.

[0007] To achieve the purpose of the present invention, the technical solution adopted is:

[0008] A highly wear-resistant and high-stability carbon-oil PCB board comprises a PCB substrate, wherein a PCB heat sink is installed inside the PCB substrate, an upper PCB copper foil board is laminated to the upper surface of the PCB substrate, and a lower PCB copper foil board is laminated to the lower surface of the PCB substrate; an upper PCB solder resist board is laminated to the upper surface of the upper PCB copper foil board, and a lower PCB solder resist board is laminated to the lower surface of the lower PCB copper foil board; an upper PCB carbon-oil board is laminated to the upper surface of the upper PCB solder resist board, and a lower PCB carbon-oil board is laminated to the lower surface of the lower PCB solder resist board; and a PCB outer solder resist layer is wrapped around the outer surfaces and both sides of the upper and lower PCB carbon-oil boards.

[0009] Preferably, a plurality of heat sink connection holes are provided inside the PCB substrate, and heat sink reinforcement ribs connected to the PCB heat sink are provided at the heat sink connection holes, so that the PCB heat sink is in a plurality of continuous "I" shapes.

[0010] Preferably, a plurality of PCB through-holes are provided in the PCB substrate, the upper PCB copper foil plate and the lower PCB copper foil plate, which coaxially penetrate the PCB substrate, the upper PCB copper foil plate and the lower PCB copper foil plate. The PCB through-holes are not connected to the PCB heat dissipation plate. The inner wall surface of the PCB through-hole is coated with PCB conductive carbon paste. The PCB conductive carbon paste is provided at the upper PCB copper foil plate and the lower PCB copper foil plate with a plurality of conductive carbon paste protrusions embedded in the upper PCB copper foil plate and the lower PCB copper foil plate.

[0011] Preferably, a plurality of irregular carbon oil / copper foil through-grooves are provided between the upper PCB carbon oil plate and the PCB substrate, and between the lower PCB carbon oil plate and the PCB substrate. The upper PCB carbon oil plate penetrates the upper PCB copper foil plate through the carbon oil / copper foil through-grooves to be bonded and connected to the PCB substrate, and the lower PCB carbon oil plate penetrates the lower PCB copper foil plate through the carbon oil / copper foil through-grooves to be bonded and connected to the PCB substrate.

[0012] Preferably, a plurality of irregular carbon oil / copper foil embedded grooves (16) are provided between the upper PCB carbon oil plate and the upper PCB copper foil plate, and between the lower PCB carbon oil plate and the lower PCB copper foil plate. The upper PCB carbon oil plate penetrates the upper PCB solder mask plate through the carbon oil / copper foil embedded grooves and is embedded into the upper PCB copper foil plate. The lower PCB carbon oil plate penetrates the lower PCB solder mask plate through the carbon oil / copper foil embedded grooves and is embedded into the lower PCB copper foil plate.

[0013] Preferably, a plurality of irregular carbon oil / solder resist through-grooves are provided between the upper PCB solder mask and the upper PCB carbon oil plate, and between the lower PCB solder mask and the lower PCB carbon oil plate. The upper PCB carbon oil plate penetrates the upper PCB solder mask through the carbon oil / solder resist through-grooves to be bonded and electrically connected to the upper PCB copper foil plate. The lower PCB carbon oil plate penetrates the lower PCB solder mask through the carbon oil / solder resist through-grooves to be bonded and electrically connected to the lower PCB copper foil plate.

[0014] Preferably, a plurality of irregular solder resist / copper foil through-grooves are provided between the upper PCB solder resist plate and the upper PCB copper foil plate, and between the lower PCB solder resist plate and the lower PCB copper foil plate. The upper PCB solder resist plate penetrates the upper PCB copper foil plate through the solder resist / copper foil through-grooves to be bonded and connected to the PCB substrate, and the lower PCB solder resist plate penetrates the lower PCB copper foil plate through the solder resist / copper foil through-grooves to be bonded and connected to the PCB substrate.

[0015] Preferably, PCB heat dissipation meshes are provided on both sides of the PCB outer solder resist layer, and the PCB heat dissipation plate penetrates the PCB outer solder resist layer and is engaged with the PCB heat dissipation meshes.

[0016] A manufacturing process for the above-mentioned high-wear-resistant and high-stability carbon oil PCB board specifically includes the following steps:

[0017] S1. Accurately weigh the raw materials for preparing the upper PCB carbon oil plate, the lower PCB carbon oil plate and the PCB conductive carbon paste with high wear resistance and high stability carbon oil. The raw materials are thoroughly mixed and stirred at a stirring rate of 200-500r / min to achieve the desired viscosity and square resistance. The desired viscosity is controlled to 300-3000dPa·S and the desired square resistance is controlled to 50-5000Ω.

[0018] S2. The materials constituting the PCB substrate and the PCB heat sink are stacked and pressed according to the structure, so that the heat sink reinforcement ribs are formed inside the PCB heat sink and pass through the heat sink connection holes inside the PCB substrate. The distance from the outer surface of the PCB heat sink to the outer surface of the PCB substrate does not exceed 1 / 5 of the thickness of the PCB substrate. The prepared upper and lower PCB copper foil sheets are attached to both sides of the PCB substrate and pressed again.

[0019] S3. Pour PCB conductive carbon paste into the coaxially arranged PCB through-holes of the PCB substrate, upper PCB copper foil sheet, and lower PCB copper foil sheet, so that the PCB conductive carbon paste is embedded in the upper and lower PCB copper foil sheets and forms conductive carbon paste protrusions. Place the laminated sheet in an oven at 40-80°C for 2-10 hours to ensure that the PCB conductive carbon paste is firmly attached to the PCB through-holes. Then, apply solder resist to the outer surface of the laminated sheet and cure it to form the upper PCB solder mask sheet, the lower PCB solder mask sheet, and the solder resist / copper foil through-hole grooves.

[0020] S4. Prepare the carbon oil pattern to be printed on the outer surface of the upper PCB solder mask and the lower PCB solder mask, and form a carbon oil / copper foil through-groove, a carbon oil / copper foil embedded groove and a carbon oil / solder mask through-groove, and install it together with the prepared carbon oil printing screen on the screen printing machine, adjust the screen distance and the screen printing scraper stroke, align the screen pattern area with the carbon oil pattern area to be printed, invert the prepared high wear-resistant and high stability carbon oil on the non-pattern area of ​​the screen, use the screen printing scraper to scrape the high wear-resistant and high stability carbon oil on the outer surface of the upper PCB solder mask and the lower PCB solder mask, place the PCB board in an oven at 50-100 ° C for 2-10h to make the high wear-resistant and high stability carbon oil, and finally form the upper PCB carbon oil plate and the lower PCB carbon oil plate;

[0021] S5. Then, fully coat the surface of the PCB board with solder resist to form a PCB surface solder resist layer with the same thickness as the upper PCB solder resist board and the lower PCB solder resist board. Then, attach the PCB heat dissipation mesh to the PCB surface solder resist layer, and make the PCB heat dissipation mesh penetrate the PCB surface solder resist layer and connect it to the PCB heat dissipation plate. Bake and solidify the PCB surface solder resist layer to obtain a highly wear-resistant and high-stability carbon oil PCB board.

[0022] Furthermore, the high-wear-resistant and high-stability carbon oil includes the following components in weight percentage: 10-30% of melamine-modified acrylic resin, 10-20% of nano-ceramic matrix-modified acrylic resin, 20-40% of solvent, 3-10% of dispersant, 4-15% of slip agent, 3-15% of coupling agent, 2-15% of antistatic agent, 2-10% of stabilizer, 2-7% of defoaming agent, 3-6% of inhibitor, 20-50% of nano-conductive carbon black, and 5-10% of carbon nanotubes.

[0023] The beneficial effects of the present invention are as follows: the highly wear-resistant and high-stability carbon oil PCB board of the present invention promptly conducts away the generated heat by providing an "I"-shaped heat sink inside the PCB board and dissipating it promptly through a heat dissipation network, thereby preventing high temperature from damaging the PCB board structure; a solder resist is provided between the copper foil and the carbon oil to prevent unnecessary excessive contact between the copper foil and the carbon oil, thereby preventing a short circuit from forming; and solder resist is then re-applied on the surface of the carbon oil, thereby protecting the entire PCB board from wear and structural damage; the introduction of high-stability materials into the carbon oil significantly improves the wear resistance, stability, and heat dissipation effect of the PCB board; and the board is also effectively flame-retardant and antistatic, further enhancing the performance of the PCB board. Through simple structural design and improvement, the conductivity and practicality of the PCB board are significantly improved, thereby having excellent application value and promotion prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the cross-sectional structure of the high wear-resistant and high stability carbon oil PCB board of the present invention. Figure 1 .

[0025] Figure 2 This is a schematic diagram of the cross-sectional structure of the high wear-resistant and high stability carbon oil PCB board of the present invention. Figure 2 .

[0026] In the figure: 1. PCB substrate; 2. PCB heat sink; 3. Upper PCB copper foil board; 4. Lower PCB copper foil board; 5. Upper PCB solder mask; 6. Lower PCB solder mask; 7. Upper PCB carbon oil board; 8. Lower PCB carbon oil board; 9. PCB surface solder mask; 10. PCB through-hole; 11. PCB conductive carbon paste; 12. Conductive carbon paste protrusion; 13. Heat sink connection hole; 14. Heat sink reinforcement rib; 15. Carbon oil / copper foil through-groove; 16. Carbon oil / copper foil embedded groove; 17. Carbon oil / solder mask through-groove; 18. Solder mask / copper foil through-groove; 19. PCB heat sink mesh. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Example 1

[0029] See Figure 1 As shown, a highly wear-resistant and high-stability carbon oil PCB board includes a PCB substrate 1. A PCB heat sink 2 is installed inside the PCB substrate 1, an upper PCB copper foil board 3 is laminated to its upper surface, and a lower PCB copper foil board 4 is laminated to its lower surface; an upper PCB solder mask 5 is laminated to the upper surface of the upper PCB copper foil board 3, and a lower PCB solder mask 6 is laminated to the lower surface of the lower PCB copper foil board 4; an upper PCB carbon oil board 7 is laminated to the upper surface of the upper PCB solder mask 5, and a lower PCB carbon oil board 8 is laminated to the lower surface of the lower PCB solder mask 6; and a PCB outer solder mask layer 9 is wrapped around the outer surfaces and both sides of the upper and lower PCB carbon oil boards 7 and 8.

[0030] See Figure 2As shown, a highly wear-resistant and high-stability carbon oil PCB board has several heat sink connection holes 13 provided inside the PCB substrate 1. The PCB heat sink 2 is provided with heat sink reinforcement ribs 14 connected to the PCB heat sink 2 at the heat sink connection holes 13, so that the PCB heat sink 2 forms multiple groups of continuous "I" shapes. The PCB substrate 1, upper PCB copper foil plate 3, and lower PCB copper foil plate 4 are provided with several PCB through-holes 10 coaxially penetrating the PCB substrate 1, upper PCB copper foil plate 3, and lower PCB copper foil plate 4. The PCB through-holes 10 are not connected to the PCB heat sink 2. The inner wall surface of the PCB through-hole 10 is coated with PCB conductive carbon paste 11. The PCB conductive carbon paste 11 is provided with several conductive carbon paste protrusions 12 embedded in the upper PCB copper foil plate 3 and lower PCB copper foil plate 4.

[0031] Several irregular carbon oil / copper foil through-grooves 15 are provided between the upper PCB carbon oil plate 7 and the PCB substrate 1, and between the lower PCB carbon oil plate 8 and the PCB substrate 1. The upper PCB carbon oil plate 7 penetrates the upper PCB copper foil plate 3 and is bonded to the PCB substrate 1 through the carbon oil / copper foil through-grooves 15. The lower PCB carbon oil plate 8 penetrates the lower PCB copper foil plate 4 and is bonded to the PCB substrate 1 through the carbon oil / copper foil through-grooves 15. Several irregular carbon oil / copper foil embedded grooves 16 are provided between the upper PCB carbon oil plate 7 and the upper PCB copper foil plate 3, and between the lower PCB carbon oil plate 8 and the lower PCB copper foil plate 4. The upper PCB carbon oil plate 7 penetrates the upper PCB solder mask 5 through the carbon oil / copper foil embedded grooves 16 and is embedded in the upper PCB copper foil plate 3. The lower PCB carbon oil plate 8 penetrates the lower PCB solder mask 6 through the carbon oil / copper foil embedded grooves 16 and is embedded in the lower PCB copper foil plate 4. Several irregular carbon oil / solder resist through-grooves 17 are provided between the oil plates 8. The upper PCB carbon oil plate 7 penetrates the upper PCB solder resist plate 5 and is electrically connected to the upper PCB copper foil plate 3 through the carbon oil / solder resist through-grooves 17. The lower PCB carbon oil plate 8 penetrates the lower PCB solder resist plate 6 and is electrically connected to the lower PCB copper foil plate 4 through the carbon oil / solder resist through-grooves 17. Several irregular solder resist / copper foil through-grooves 18 are provided between the upper PCB solder resist plate 5 and the upper PCB copper foil plate 3, and between the lower PCB solder resist plate 6 and the lower PCB copper foil plate 4. The upper PCB solder resist plate 5 penetrates the upper PCB copper foil plate 3 and is electrically connected to the PCB substrate 1 through the solder resist / copper foil through-grooves 18. The lower PCB solder resist plate 6 penetrates the lower PCB copper foil plate 4 and is electrically connected to the PCB substrate 1 through the solder resist / copper foil through-grooves 18. PCB heat dissipation meshes 19 are provided on both sides of the PCB outer solder resist layer 9. The PCB heat dissipation plate 2 penetrates the PCB outer solder resist layer 9 and is interlocked with the PCB heat dissipation meshes 19.

[0032] A manufacturing process for a high-wear-resistant and high-stability carbon oil PCB board based on the above embodiment specifically includes the following steps:

[0033] S1. Accurately weigh the raw materials for preparing the upper PCB carbon oil plate 7, the lower PCB carbon oil plate 8 and the PCB conductive carbon paste 11 of the high wear-resistant and high stability carbon oil, and thoroughly mix the raw materials and stir at a stirring rate of 200-500r / min to achieve the desired viscosity and sheet resistance before use. The desired viscosity is controlled to 300-3000dPa·S, and the desired sheet resistance is controlled to 50-5000Ω;

[0034] S2. The materials comprising the PCB substrate 1 and PCB heat sink 2 are stacked and pressed according to the structure, so that the heat sink reinforcement ribs 14 are formed inside the PCB heat sink 2 and pass through the heat sink connection holes 13 inside the PCB substrate 1. The distance between the outer surface of the PCB heat sink 2 and the outer surface of the PCB substrate 1 does not exceed 1 / 5 of the thickness of the PCB substrate 1. The prepared upper PCB copper foil 3 and lower PCB copper foil 4 are attached to the sides of the PCB substrate 1 and pressed again to form the mold.

[0035] S3. Pour conductive carbon paste 11 into the coaxially arranged PCB through-holes 10 of the PCB substrate 1, upper PCB copper foil sheet 3, and lower PCB copper foil sheet 4, so that the conductive carbon paste 11 is embedded in the upper PCB copper foil sheet 3 and the lower PCB copper foil sheet 4 and forms conductive carbon paste protrusions 12. The laminated plate is then baked in an oven at 40-80°C for 2-10 hours to ensure that the conductive carbon paste 11 is firmly attached to the PCB through-holes 10. Solder resist is then applied to the outer surface of the laminated plate and cured to form the upper PCB solder resist sheet 5, the lower PCB solder resist sheet 6, and the solder resist / copper foil through-hole grooves 18.

[0036] S4. Prepare the carbon oil pattern to be printed on the outer surfaces of the upper PCB solder mask 5 and the lower PCB solder mask 6, and form the carbon oil / copper foil through-grooves 15, the carbon oil / copper foil embedded grooves 16, and the carbon oil / solder mask through-grooves 17. Install them together with the prepared carbon oil printing screen on the screen printing machine, adjust the screen distance and the screen scraper stroke, align the screen pattern area with the carbon oil pattern area to be printed, invert the prepared high-wear-resistant and high-stability carbon oil on the non-pattern area of ​​the screen, and use the screen scraper to scrape the high-wear-resistant and high-stability carbon oil on the outer surfaces of the upper PCB solder mask 5 and the lower PCB solder mask 6. Place the PCB board in an oven at 50-100°C for 2-10 hours to make the high-wear-resistant and high-stability carbon oil, and finally form the upper PCB carbon oil plate 7 and the lower PCB carbon oil plate 8;

[0037] S5. Then, the surface of the PCB board is fully coated with solder resist to form a PCB surface solder resist layer 9 with the same thickness as the upper PCB solder resist plate 5 and the lower PCB solder resist plate 6. The PCB heat dissipation mesh 19 is attached to the PCB surface solder resist layer 9, and the PCB heat dissipation mesh 19 is connected to the PCB heat dissipation plate 2 through the PCB surface solder resist layer 9. The PCB surface solder resist layer 9 is baked and cured to obtain a highly wear-resistant and high-stability carbon oil PCB board.

[0038] Furthermore, the high-wear-resistant and high-stability carbon oil includes the following components in weight percentage: 15% melamine-modified acrylic resin, 10% nano-ceramic matrix-modified acrylic resin, 20% solvent, 3% dispersant, 4% slip agent, 3% coupling agent, 2% antistatic agent, 2% stabilizer, 2% defoaming agent, 3% inhibitor, 30% nano-conductive carbon black, and 6% carbon nanotubes.

[0039] Example 2

[0040] The difference between this embodiment and embodiment 1 is that:

[0041] A highly wear-resistant and highly stable carbon oil PCB board. The highly wear-resistant and highly stable carbon oil constituting an upper PCB carbon oil board 7, a lower PCB carbon oil board 8, and a PCB conductive carbon paste 11 comprises the following components in percentage by weight: 20% melamine-modified acrylic resin, 16% nano-ceramic matrix-modified acrylic resin, 20% solvent, 3% dispersant, 4% slip agent, 3% coupling agent, 2% antistatic agent, 2% stabilizer, 2% defoaming agent, 3% polymerization inhibitor, 20% nano-conductive carbon black, and 5% carbon nanotubes.

[0042] Example 3

[0043] The difference between this embodiment and embodiments 1 and 2 is that:

[0044] A highly wear-resistant and highly stable carbon oil PCB board. The highly wear-resistant and highly stable carbon oil constituting an upper PCB carbon oil board 7, a lower PCB carbon oil board 8, and a PCB conductive carbon paste 11 comprises the following components in percentage by weight: 20% melamine-modified acrylic resin, 11% nano-ceramic matrix-modified acrylic resin, 25% solvent, 3% dispersant, 4% slip agent, 3% coupling agent, 2% antistatic agent, 2% stabilizer, 2% defoaming agent, 3% polymerization inhibitor, 20% nano-conductive carbon black, and 5% carbon nanotubes.

[0045] In the present invention, the highly wear-resistant and high-stability carbon oil PCB board of the present invention promptly conducts away the generated heat and dissipates it through the heat dissipation network by disposing an "I"-shaped heat sink inside the PCB board, thereby preventing high temperature from damaging the PCB board structure. Solder resist is provided between the copper foil and the carbon oil to prevent unnecessary excessive contact between the copper foil and the carbon oil, thereby preventing the formation of a short circuit. Solder resist is then re-applied on the surface of the carbon oil, thereby protecting the entire PCB board from wear and structural damage. By introducing high-nanwu high-stability materials into the carbon oil, the wear resistance, stability, and heat dissipation effect of the PCB board are significantly improved. It can also effectively retard flames and resist static electricity, further enhancing the performance of the PCB board. Through simple structural design and improvement, the conductivity and practicality of the PCB board are significantly improved, and it has excellent application value and promotion prospects.

[0046] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A process for manufacturing a high wear-resistant and high stability carbon oil PCB board, characterized by: The production process specifically includes the following steps: S1. Accurately weigh the raw materials of the high wear-resistant and high stability carbon oil for preparing the upper PCB carbon oil plate (7), the lower PCB carbon oil plate (8) and the PCB conductive carbon paste (11), fully mix the raw materials and stir them at a stirring rate of 200-500 r / min until they reach the required viscosity and square resistance, and then use them. The required viscosity is controlled to be 300-3000 d Pa·S, and the required square resistance is controlled to be 50-5000 Ω; S2. The materials constituting the PCB substrate (1) and the PCB heat sink (2) are stacked according to the structure and then pressed, so that a heat sink reinforcement rib (14) is formed inside the PCB heat sink (2) and passes through the heat sink connection hole (13) inside the PCB substrate (1), and the distance between the outer surface of the PCB heat sink (2) and the outer surface of the PCB substrate (1) does not exceed 1 / 5 of the thickness of the PCB substrate (1); the prepared upper PCB copper foil plate (3) and the lower PCB copper foil plate (4) are attached to both sides of the PCB substrate (1) and pressed again to form; S3. Pour PCB conductive carbon paste (11) into the PCB through-holes (10) coaxially arranged on the PCB substrate (1), the upper PCB copper foil plate (3), and the lower PCB copper foil plate (4), so that the PCB conductive carbon paste (11) is embedded in the upper PCB copper foil plate (3) and the lower PCB copper foil plate (4) and forms conductive carbon paste protrusions (12). Place the laminated plate in an oven at 40-80°C for 2-10 hours to make the PCB conductive carbon paste (11) firmly adhere to the PCB through-holes (10). Then, apply and cure solder resist on the outer surface of the laminated plate to form an upper PCB solder resist plate (5), a lower PCB solder resist plate (6), and a solder resist / copper foil through-hole groove (18). S4. Prepare the carbon oil pattern to be printed on the outer surface of the upper PCB solder mask (5) and the lower PCB solder mask (6), and form the carbon oil / copper foil through-grooves (15), the carbon oil / copper foil embedded grooves (16) and the carbon oil / solder mask through-grooves (17), and install them together with the prepared carbon oil printing screen on the screen printing machine, adjust the screen distance and the screen printing scraper stroke, align the screen pattern area with the carbon oil pattern area to be printed, invert the prepared high wear-resistant and high stability carbon oil on the non-pattern area of ​​the screen, use the screen printing scraper to scrape the high wear-resistant and high stability carbon oil on the outer surface of the upper PCB solder mask (5) and the lower PCB solder mask (6), place the PCB board in an oven at 50-100 ℃ and bake for 2-10 hours to make the high wear-resistant and high stability carbon oil, and finally form the upper PCB carbon oil board (7) and the lower PCB carbon oil board (8); S5. Then, the surface of the PCB board is fully coated with solder resist to form a PCB surface solder resist layer (9) having the same thickness as the upper PCB solder resist plate (5) and the lower PCB solder resist plate (6), and the PCB heat dissipation mesh (19) is attached to the PCB surface solder resist layer (9), and the PCB heat dissipation mesh (19) is connected to the PCB heat dissipation plate (2) by penetrating the PCB surface solder resist layer (9), and the PCB surface solder resist layer (9) is baked and cured to obtain a high wear-resistant and high stability carbon oil PCB board.

2. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 1 is characterized in that: The high-wear-resistant and high-stability carbon oil includes the following components in weight percentage: 10-30% of melamine-modified acrylic resin, 10-20% of nano-ceramic matrix-modified acrylic resin, 20-40% of solvent, 3-10% of dispersant, 4-15% of slip agent, 3-15% of coupling agent, 2-15% of antistatic agent, 2-10% of stabilizer, 2-7% of defoaming agent, 3-6% of polymerization inhibitor, 20-50% of nano-conductive carbon black, and 5-10% of carbon nanotubes.

3. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 1 is characterized in that: The high wear-resistant and high-stability carbon oil PCB board comprises a PCB substrate (1), wherein a PCB heat dissipation plate (2) is installed inside the PCB substrate (1), an upper PCB copper foil plate (3) is laminated on the upper surface thereof, and a lower PCB copper foil plate (4) is laminated on the lower surface thereof; The upper surface of the upper PCB copper foil plate (3) is laminated with an upper PCB solder resist plate (5), the lower surface of the lower PCB copper foil plate (4) is laminated with a lower PCB solder resist plate (6), the upper surface of the upper PCB solder resist plate (5) is laminated with an upper PCB carbon oil plate (7), the lower surface of the lower PCB solder resist plate (6) is laminated with a lower PCB carbon oil plate (8), and the outer surfaces and both sides of the upper PCB carbon oil plate (7) and the lower PCB carbon oil plate (8) are wrapped with a PCB outer solder resist layer (9).

4. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3 is characterized in that: The PCB substrate (1) is provided with a plurality of heat sink connection holes (13) therein, and the PCB heat sink (2) is provided with heat sink reinforcement ribs (14) connected to the PCB heat sink (2) at the heat sink connection holes (13), so that the PCB heat sink (2) is formed into a plurality of continuous "I" shapes.

5. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3 is characterized in that: The PCB substrate (1), the upper PCB copper foil plate (3) and the lower PCB copper foil plate (4) are provided with a plurality of PCB through holes (10) coaxially penetrating the PCB substrate (1), the upper PCB copper foil plate (3) and the lower PCB copper foil plate (4), and the PCB through holes (10) are not connected to the PCB heat dissipation plate (2); The inner wall surface of the PCB through hole (10) is coated with a PCB conductive carbon paste (11), and the PCB conductive carbon paste (11) is provided with a plurality of conductive carbon paste protrusions (12) embedded in the upper PCB copper foil plate (3) and the lower PCB copper foil plate (4) at the upper PCB copper foil plate (3) and the lower PCB copper foil plate (4).

6. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3 is characterized in that: A plurality of irregular carbon oil / copper foil through-grooves (15) are provided between the upper PCB carbon oil plate (7) and the PCB substrate (1), and between the lower PCB carbon oil plate (8) and the PCB substrate (1). The upper PCB carbon oil plate (7) penetrates the upper PCB copper foil plate (3) through the carbon oil / copper foil through-grooves (15) and is bonded to the PCB substrate (1). The lower PCB carbon oil plate (8) penetrates the lower PCB copper foil plate (4) through the carbon oil / copper foil through-grooves (15) and is bonded to the PCB substrate (1).

7. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3 is characterized by: A plurality of irregular carbon oil / copper foil embedded grooves (16) are provided between the upper PCB carbon oil plate (7) and the upper PCB copper foil plate (3), and between the lower PCB carbon oil plate (8) and the lower PCB copper foil plate (4). The upper PCB carbon oil plate (7) penetrates the upper PCB solder mask plate (5) through the carbon oil / copper foil embedded grooves (16) and is embedded into the upper PCB copper foil plate (3). The lower PCB carbon oil plate (8) penetrates the lower PCB solder mask plate (6) through the carbon oil / copper foil embedded grooves (16) and is embedded into the lower PCB copper foil plate (4).

8. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3 is characterized by: A plurality of irregular carbon oil / solder resist through-grooves (17) are provided between the upper PCB solder resist plate (5) and the upper PCB carbon oil plate (7), and between the lower PCB solder resist plate (6) and the lower PCB carbon oil plate (8). The upper PCB carbon oil plate (7) penetrates the upper PCB solder resist plate (5) through the carbon oil / solder resist through-grooves (17) and is bonded and electrically connected to the upper PCB copper foil plate (3). The lower PCB carbon oil plate (8) penetrates the lower PCB solder resist plate (6) through the carbon oil / solder resist through-grooves (17) and is bonded and electrically connected to the lower PCB copper foil plate (4).

9. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3, characterized in that: A plurality of irregular solder resist / copper foil through-grooves (18) are provided between the upper PCB solder resist plate (5) and the upper PCB copper foil plate (3), and between the lower PCB solder resist plate (6) and the lower PCB copper foil plate (4). The upper PCB solder resist plate (5) penetrates the upper PCB copper foil plate (3) through the solder resist / copper foil through-grooves (18) and is bonded to the PCB substrate (1). The lower PCB solder resist plate (6) penetrates the lower PCB copper foil plate (4) through the solder resist / copper foil through-grooves (18) and is bonded to the PCB substrate (1).

10. The manufacturing process of the high wear-resistant and high stability carbon oil PCB board according to claim 3, characterized in that: PCB heat dissipation mesh sheets (19) are bonded to both sides of the PCB surface solder resist layer (9), and the PCB heat dissipation plate (2) penetrates the PCB surface solder resist layer (9) and is engaged with the PCB heat dissipation mesh sheets (19).

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