Cutting Planning Method and Device for Wire Rod Raw Materials

Abstract

This application relates to the field of machining technology, and provides a cutting planning method and device for wire rod raw materials. The method includes: performing a logarithmic transformation on the maximum target production volume among the production volumes to be produced for each part to determine multiple layers; performing binary layering on the production volume to be produced for any one of the parts, so as to determine at least one target layer where the part is located from each of the layers; generating a corresponding cutting planning diagram for each of the target layers according to the part lengths of each part in each of the target layers, so as to generate a cutting planning result for the wire rod raw material according to each of the cutting planning diagrams. The cutting planning method for wire rod raw materials provided by the embodiments of this application can improve the production efficiency of parts.

Description

Technical Field

[0001] This application relates to the technical field of machining, and particularly relates to a method and device for cutting planning of wire materials. Background Art

[0002] In the manufacturing industry, in order to obtain usable parts, in the related art, it is usually necessary to cut wire materials, such as pipe materials or bar materials, etc., to produce usable parts. Since the parts are obtained by cutting wire materials, the cutting method of wire materials will affect the production efficiency of parts. When cutting wire materials simultaneously, how to effectively plan the cutting method of wire materials during cutting to improve the production efficiency of parts is the problem faced in current wire material cutting. Summary of the Invention

[0003] This application aims to solve at least one of the technical problems existing in the related art. For this purpose, this application proposes a cutting planning method for wire materials, which can improve the production efficiency of parts.

[0004] This application also proposes a cutting planning device for wire materials.

[0005] This application also proposes an electronic device.

[0006] This application also proposes a computer-readable storage medium.

[0007] The cutting planning method for wire materials according to the first aspect embodiment of this application includes:

[0008] Performing logarithmic transformation on the maximum target production volume among the to-be-produced volumes of each part to determine multiple layers;

[0009] Performing binary stratification on the to-be-produced volume of any one of the parts to determine at least one target layer where the part is located from each of the layers;

[0010] Generating a cutting planning diagram corresponding to each of the target layers according to the part lengths of each part in each of the target layers, and generating a cutting planning result of the wire material according to each of the cutting planning diagrams.

[0011] After performing logarithmic transformation on the maximum target production volume among the to-be-produced volumes of each part to determine multiple layers, performing binary stratification on the production volume of the parts, determining the target layer where the part is located from each layer, and then generating a cutting planning diagram corresponding to each of the target layers according to the part lengths of each part in each of the target layers to generate a cutting planning result of the wire material, thereby using the binary stratification method to make the number of obtained cutting planning diagrams small enough, and further effectively reducing the startup times of the cutting equipment during wire material cutting, and effectively improving the production efficiency of parts.

[0012] According to an embodiment of the present application, perform a logarithmic transformation on the maximum target production quantity among the production quantities to be produced for each part, and determine multiple layers, including:

[0013] According to K = log2(n), perform a logarithmic transformation on the maximum target production quantity among the production quantities to be produced for each part, and determine the total height of the binary layer;

[0014] According to the total height, determine each of the layers;

[0015] Wherein, n represents the target production quantity, and K represents the total height.

[0016] According to an embodiment of the present application, according to the part lengths of each part in each of the target layers, generate each cutting plan diagram corresponding to each of the target layers, including:

[0017] According to the layer height of each of the target layers, successively from high to low, according to the part lengths of each part in each of the target layers, generate each cutting plan diagram corresponding to each of the target layers.

[0018] According to an embodiment of the present application, according to the layer height of each of the target layers, successively from high to low, according to the part lengths of each part in each of the target layers, generate each cutting plan diagram corresponding to each of the target layers, including:

[0019] Obtain the part lengths of each part in the current target layer currently, and generate an initial cutting plan diagram corresponding to the current target layer;

[0020] Determine that when the initial cutting plan diagram cuts the wire raw material, the utilization rate of the wire raw material is greater than the target utilization rate among each preset utilization rate, and determine the initial cutting plan diagram as the cutting plan diagram corresponding to the current target layer;

[0021] Wherein, the target utilization rate is any one of the preset utilization rates.

[0022] According to an embodiment of the present application, further include:

[0023] Determine that when the initial cutting plan diagram cuts the wire raw material, the utilization rate of the wire raw material is less than or equal to the target utilization rate, and add the part lengths of each part in the current target layer currently to the next-level target layer of the current target layer.

[0024] According to an embodiment of the present application, according to each of the cutting plan diagrams, generate a cutting plan result of the wire raw material, including:

[0025] Generate the cutting plan result corresponding to the target utilization rate according to each of the cutting plan diagrams.

[0026] According to an embodiment of the present application, it further includes:

[0027] Obtain the target cutting plan result from each of the cutting plan results corresponding to each of the preset utilization rates one by one, and cut the wire material according to the target cutting plan result;

[0028] Wherein, the target cutting plan result is the cutting plan result with the highest planning score;

[0029] The planning score is determined according to the number of cutting diagrams in the cutting plan result and the consumption length of the wire material when the wire material is cut according to the cutting plan result.

[0030] The cutting plan device for wire materials according to the embodiment of the second aspect of the present application includes:

[0031] A part stratification determination module, configured to perform a logarithmic transformation on the target production quantity with the largest production quantity to be produced among the parts of each part, and determine multiple stratifications;

[0032] A binary stratification module, configured to perform binary stratification on the production quantity to be produced of any one of the parts, so as to determine at least one target stratification where the part is located from each of the stratifications;

[0033] A raw material cutting plan module, configured to generate each cutting plan diagram corresponding to each of the target stratifications according to the part lengths of the parts in each of the target stratifications, so as to generate a cutting plan result of the wire material according to each of the cutting plan diagrams.

[0034] The electronic device according to the embodiment of the third aspect of the present application includes a processor and a memory storing a computer program, and when the processor executes the computer program, it implements the cutting plan method for wire materials described in any of the above embodiments.

[0035] The computer-readable storage medium according to the embodiment of the fourth aspect of the present application stores a computer program thereon, and when the computer program is executed by a processor, it implements the cutting plan method for wire materials described in any of the above embodiments.

[0036] The computer program product according to the embodiment of the fifth aspect of the present application includes: when the computer program is executed by a processor, it implements the cutting plan method for wire materials described in any of the above embodiments.

[0037] One or more of the above technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0038] By performing a logarithmic transformation on the target production volume, which is the largest among the production volumes to be produced for each part, and determining multiple stratifications, the production volume of the parts is stratified binary. After determining the target stratification in which the part is located from each stratification, according to the part lengths of the parts in each target stratification, cutting planning diagrams corresponding to each target stratification are generated to obtain the cutting planning result of the wire material. Thus, by using the binary stratification method, the number of obtained cutting planning diagrams is small enough, and further, the startup times of the cutting equipment during the cutting of the wire material can be effectively reduced, and the production efficiency of the parts is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0040] Figure 1 is a schematic flowchart of a method for cutting planning of wire materials provided by an embodiment of the present application;

[0041] Figure 2 is in an embodiment of the present application Figure 1 a schematic flowchart for further refining the generation of the cutting planning diagram in the method for cutting planning of wire materials;

[0042] Figure 3 is in an embodiment of the present application Figure 2 a schematic flowchart for further refining the generation of the cutting planning diagram in the method for cutting planning of wire materials;

[0043] Figure 4 is a schematic structural diagram of a cutting planning device for wire materials provided by an embodiment of the present application;

[0044] Figure 5 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0045] To make the objectives, technical solutions, and advantages of the present application clearer, the following will clearly and completely describe the technical solutions in the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0046] Next, several specific embodiments will be used to introduce and illustrate in detail the wire material cutting planning method and device provided by the embodiments of the present application.

[0047] When cutting wire materials to produce usable parts, it is necessary to provide a cutting plan for the wire materials and generate a cutting plan diagram for the wire materials, so as to produce corresponding parts according to this cutting plan diagram. Exemplarily, assume that the lengths of the wire materials are 16 and 20 respectively, and the existing part requirements are as follows:

[0048] Part length Number of parts 3 25 7 27 5 20

[0049] The cutting plan for the wire materials can be:

[0050] Cutting plan drawing Frequency Length of wire raw material 3 3 7 7 8 20 3 5 5 7 6 20 5 5 5 5 2 20 3 3 3 7 1 16 7 7 2 16

[0051] Among them, what is recorded in the cutting plan diagram is the number of times of cutting to generate parts of a certain length. For example, the cutting plan diagram (3, 3, 7, 7) means that it is necessary to cut the wire material twice to generate parts with a length of 3, and cut the wire material twice to generate parts with a cutting length of 7. The frequency indicates the number of times the cutting plan diagram needs to be executed.

[0052] In addition, assuming that the wire materials and part requirements remain unchanged, the cutting plan for the wire materials can also be:

[0053] Planned cutting drawing Frequency Wire raw material 5 5 5 5 4 20 3 3 7 7 8 20 3 3 3 7 3 16 5 7 7 4 20

[0054] For these two schemes, their utilization rates are both 98.91%. However, the number of cutting plan diagrams in the first scheme is 5, while the number of cutting plan diagrams in the second scheme is only 4. According to the limit that the cutting equipment in Factory B can hold at most 4 wire materials, the first scheme needs to start the equipment 7 times (the first two cutting diagrams need to be cut in two times), while the second scheme only needs to start the equipment 4 times. Obviously, the cutting efficiency is much higher. In actual production, there are more than 200 types of parts required, and generally 4 to 5 types of wire materials. Therefore, how to quickly and effectively plan the cutting method of wire materials during cutting to improve the production efficiency of parts is the problem faced in the current cutting of wire materials.

[0055] To this end, in one embodiment, a cutting planning method for wire rod raw materials is provided. This method is applied to a terminal device and is used to plan the cutting of wire rod raw materials. Among them, the terminal device can be a user terminal or a server. The user terminal can be a desktop terminal or a portable terminal, such as a desktop computer, a laptop computer, etc. The server can be an independent server or a server cluster composed of multiple servers, and can also be a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence sampling point devices.

[0056] As Figure 1 shown, a cutting planning method for wire rod raw materials provided in this embodiment includes:

[0057] Step 101, perform a logarithmic transformation on the maximum target production volume among the production volumes to be produced of each part, and determine multiple layers;

[0058] Step 102, perform binary stratification on the production volume to be produced of any one part among each of the parts, so as to determine at least one target layer where the part is located from each of the layers;

[0059] Step 103, generate cutting planning diagrams corresponding to each of the target layers according to the part lengths of each part in each of the target layers, and generate a cutting planning result of the wire rod raw material.

[0060] After performing a logarithmic transformation on the maximum target production volume among the production volumes to be produced of each part and determining multiple layers, perform binary stratification on the production volume of the parts, so as to determine the target layer where the part is located from each layer. Then, according to the part lengths of each part in each target layer, generate cutting planning diagrams corresponding to each of the target layers to generate a cutting planning result of the wire rod raw material. Thus, by using the binary stratification method, the number of obtained cutting planning diagrams is small enough, and further, the startup times of the cutting equipment during the cutting of the wire rod raw material can be effectively reduced, and the production efficiency of the parts can be effectively improved.

[0061] In one embodiment, the terminal device pre-extracts the production volumes to be produced of each part from a record table recording the part data of the parts. Then, from the production volumes to be produced of each part, obtain the maximum production volume to be produced as the target production volume, so as to perform a logarithmic transformation using the target production volume and calculate the layer height of the binary stratification, thereby determining multiple layers.

[0062] Specifically, the target production quantity can be logarithmically transformed according to K = log2(n), where n represents the target production quantity and K represents the total floor height, so as to obtain the total floor height K. If K is not an integer, round up to use the obtained integer as the total floor height n. Then, according to this total floor height, starting from the 0th floor, each layer can be determined in turn, so as to obtain 0 to n - 1 layers.

[0063] Exemplarily, assume the record table is as follows:

[0064]

[0065]

[0066]

[0067] Traverse the record table, and it can be determined that the part with the largest production quantity to be produced is part 17, and the production quantity to be produced is 171. At this time, the production quantity to be produced 171 can be obtained from this record table as the target production quantity. Then, perform logarithmic operation according to K = log2(171), and round up the operation result, and it can be determined that the total floor height of the binary layer is 8 floors. After determining that the total floor height is 8 floors, starting from the 0th floor, determine each layer from bottom to top in turn, so as to obtain the layer numbers of each layer as 0 to 7, and the frequency corresponding to each layer is 2^layer number.

[0068] After obtaining each layer, the production quantity to be produced of any part can be binary-layered to determine the target layer where the part is located. As shown in the above table, the production quantity to be produced of part 1 is 5, then binary-layer the production quantity to be produced of part 1, and it can be obtained that the production quantity to be produced of part 1, 5 = 2^2 + 2^0. At this time, it can be determined that the target layers where part 1 is located are the 2nd layer and the 0th layer. The production quantity to be produced of part 17 is 17, then binary-layer the production quantity to be produced of part 17, and it can be obtained that the production quantity to be produced of part 17, 171 = 2^7 + 2^5 + 2^3 + 2^1 + 2^0, that is, the target layers where part 17 is located are the 7th, 5th, 3rd, 1st, and 0th layers respectively. In this way, using the property that every positive integer can be split into the sum of powers of two, all parts are assigned to their respective target layers.

[0069] After completing the layering of each part, the part lengths of each part recorded in a certain target layer can be combined to generate the cutting plan diagram corresponding to this target layer. For example, only part 1 and part 1 are recorded in the 0th layer. The part length of part 1 is 1000, and the part length of part 17 is 1800. Then the cutting plan diagram corresponding to the 0th layer is (1000, 1800). At the same time, the frequency corresponding to this cutting plan diagram is 2^0 = 1.

[0070] In one embodiment, when generating the cutting plan diagrams corresponding to each target layer one by one, such asFigure 2 As shown, according to the part lengths of the parts in each of the target layers, generate cutting planning diagrams corresponding to each of the target layers, including:

[0071] Step 201: According to the layer height of each of the target layers, from high to low, successively generate cutting planning diagrams corresponding to each of the target layers according to the part lengths of the parts in each of the target layers.

[0072] In one embodiment, when generating cutting planning diagrams corresponding to each of the target layers, from high to low, according to the layer height of each of the target layers, successively generate the cutting planning diagram of each target layer. For example, if the target layers are from layer 0 to layer 7, first obtain the part lengths of the parts recorded in layer 7, generate the cutting planning diagram corresponding to layer 7, then obtain the part lengths of the parts recorded in layer 6, and generate the cutting planning diagram corresponding to layer 6, and so on.

[0073] Considering that there are too few combinable parts in some layers, resulting in the generated cutting planning diagram may waste more wire materials. Therefore, in order to improve the utilization rate of wire materials, in one embodiment, as Figure 3 shown, according to the layer height of each of the target layers, from high to low, successively generate cutting planning diagrams corresponding to each of the target layers according to the part lengths of the parts in each of the target layers, including:

[0074] Step 301: Obtain the part lengths of the current parts in the current target layer, and generate an initial cutting planning diagram corresponding to the current target layer;

[0075] Step 302: Determine that when the initial cutting planning diagram cuts the wire material, the utilization rate of the wire material is greater than the target utilization rate among each preset utilization rate, and determine the initial cutting planning diagram as the cutting planning diagram corresponding to the current target layer;

[0076] Wherein, the target utilization rate is any one of the preset utilization rates.

[0077] In one embodiment, for the current target layer, after obtaining the part lengths of the current parts in the current target layer, first generate an initial cutting planning diagram corresponding to the current target layer according to the part lengths of the current parts. For example, if the current target layer is layer 7, and it only records part 17 currently, and the part length of part 17 is 1800, then the initial cutting planning diagram corresponding to the current target layer is (1800).

[0078] After obtaining the initial cutting plan diagram corresponding to the current target layer, obtain the length of the wire raw material, and use a fast algorithm to detect whether the utilization rate of the wire raw material is greater than the target utilization rate u among the preset utilization rates when cutting the wire raw material using the initial cutting plan diagram corresponding to the current target layer through the length of the wire raw material. Among them, the preset utilization rates can be generated according to the preset utilization rate iteration step u_step. Exemplarily, assuming that the utilization rate iteration step u_step is 0.01, initially set a preset utilization rate to 0.8, and the highest utilization rate is 1, then from 0.8 to 1, it can be iterated 0.2 / 0.01 = 20 times, and the preset utilization rates are from 0.8, 0.81, 0.82.. to 0.99, 1, thus forming multiple preset utilization rates with the same interval.

[0079] Then, any one of the preset utilization rates among the preset utilization rates can be used. For example, 0.8 is used as the target utilization rate u to detect whether the utilization rate of the wire raw material is greater than the target utilization rate u among the preset utilization rates when cutting the wire raw material using the initial cutting plan diagram corresponding to the current target layer. If so, it means that the utilization rate of the wire raw material meets the actual requirements. At this time, the initial cutting plan diagram can be determined as the cutting plan diagram corresponding to the current target layer.

[0080] In one embodiment, the fast algorithm can be a heuristic algorithm such as first fit Decreasing, or an intelligent algorithm such as large domain search, genetic algorithm, etc.

[0081] By obtaining the part lengths of the current parts in the current target layer, generating the initial cutting plan diagram corresponding to the current target layer, and when it is determined that the utilization rate of the wire raw material is greater than the current preset utilization rate when cutting the wire raw material using the initial cutting plan diagram, then determining the initial cutting plan diagram as the cutting plan diagram corresponding to the current target layer, so that the utilization rate of the wire raw material can meet the requirements and improve the utilization rate of the wire raw material.

[0082] When the initial cutting plan is determined to cut the wire material, if the utilization rate of the wire material is less than or equal to the target utilization rate u, it means that the utilization rate of the wire material does not meet the actual demand. At this time, the parts currently recorded in the initial cutting plan are downgraded to the next layer. Since the frequency of each layer is twice that of the next layer, the number of parts downgraded to the next layer needs to be multiplied by 2. For example, the current target layer is the 7th layer, and its corresponding initial cutting plan only records the part length of part 17, that is, (1800). If the initial cutting plan cuts the wire material, the utilization rate of the wire material is less than or equal to the target utilization rate u, then part 17 in the 7th layer is downgraded to the 6th layer for recording. At this time, the current parts of the 6th layer include part 17, so when obtaining the initial cutting plan for the 6th layer, the part length of part 17 needs to be taken into account.

[0083] By determining that the utilization rate of the wire material is less than or equal to the target utilization rate when cutting the wire material according to the initial cutting plan, the part lengths of the current parts in the current target layer are added to the next level target layer of the current target layer, so that the wire material can be effectively utilized.

[0084] In this way, through calculation, multiple cutting plan graphs can be obtained, and the plan graph set composed of multiple cutting plan graphs can be used as the cutting plan result corresponding to the target utilization rate. For example, if the target utilization rate u = 0.8, the cutting plan result obtained at this time corresponds to the preset utilization rate of 0.8.

[0085] Since the target utilization rate is any preset utilization rate, each preset utilization rate can obtain a corresponding cutting planning result. For example, if there are 20 preset utilization rates, 20 corresponding cutting planning results can be obtained.

[0086] In order to make the cutting of the wire material more efficient, in one embodiment, the method further includes:

[0087] Obtaining a target cutting planning result from each cutting planning result corresponding to each of the preset utilization rates to cut the wire material;

[0088] Wherein, the target cutting planning result is the cutting planning result with the highest planning score;

[0089] The planning score is determined according to the number of cutting diagrams in the cutting planning result and the length of the wire material consumed when the wire material is cut according to the cutting planning result.

[0090] In one embodiment, after obtaining the cutting plan result corresponding to a certain preset utilization rate, the planning score of the cutting plan result can be obtained by adding the number of cutting plan diagrams in the cutting plan result and the length of the wire material consumed when cutting the wire material with the cutting plan result. After obtaining the planning scores of each cutting plan result, the cutting plan result corresponding to the highest planning score can be obtained from each planning score and used as the target cutting result to cut the wire material, so that the cutting plan finally used for cutting the wire material takes into account both the cutting utilization rate and the cutting efficiency of the wire material, thereby making the cutting of the wire material more efficient.

[0091] The cutting plan device for wire materials provided by the present application will be described below. The cutting plan device for wire materials described below can be correspondingly referred to the cutting plan method for wire materials described above.

[0092] In one embodiment, as Figure 4 shown, a cutting plan device for wire materials is provided, including:

[0093] A part layering determination module 210, configured to perform a logarithmic transformation on the maximum target production volume among the production volumes to be produced of each part, and determine multiple layers;

[0094] A binary layering module 220, configured to perform binary layering on the production volume to be produced of any one part among each part, so as to determine at least one target layer where the part is located from each of the layers;

[0095] A raw material cutting plan module 230, configured to generate each cutting plan diagram corresponding to each target layer according to the part lengths of each part in each target layer, and generate a cutting plan result of the wire material according to each cutting plan diagram.

[0096] After performing a logarithmic transformation on the maximum target production volume among the production volumes to be produced of each part to determine multiple layers, performing binary layering on the production volume of the part, determining the target layer where the part is located from each layer, and generating each cutting plan diagram corresponding to each target layer according to the part lengths of each part in each target layer to generate a cutting plan result of the wire material, thereby using the binary layering method to make the number of obtained cutting plan diagrams small enough, and effectively reducing the start-up times when the cutting equipment cuts the wire material, and effectively improving the production efficiency of the parts.

[0097] In one embodiment, the part layering determination module 210 is specifically configured to:

[0098] According to K = log2(n), perform a logarithmic transformation on the maximum target production volume among the production volumes to be produced of each part, and determine the total height of the binary layering;

[0099] Determine each of the sub - layers according to the total storey height.

[0100] Where n represents the target production volume and K represents the total storey height.

[0101] In one embodiment, the raw material cutting planning module 230 is specifically configured to:

[0102] According to the storey height of each of the target sub - layers, and in descending order according to the part lengths of each of the parts in each of the target sub - layers, generate each cutting planning diagram corresponding to each of the target sub - layers.

[0103] In one embodiment, the raw material cutting planning module 230 is specifically configured to:

[0104] Obtain the part lengths of each of the current parts in the current target sub - layer, and generate an initial cutting planning diagram corresponding to the current target sub - layer;

[0105] Determine that when the initial cutting planning diagram cuts the wire raw material, the utilization rate of the wire raw material is greater than the target utilization rate among each of the preset utilization rates, and determine the initial cutting planning diagram as the cutting planning diagram corresponding to the current target sub - layer;

[0106] Where the target utilization rate is any one of the preset utilization rates.

[0107] In one embodiment, the raw material cutting planning module 230 is further configured to:

[0108] Determine that when the initial cutting planning diagram cuts the wire raw material, the utilization rate of the wire raw material is less than or equal to the target utilization rate, and add the part lengths of each of the current parts in the current target sub - layer to the next - level target sub - layer of the current target sub - layer.

[0109] In one embodiment, the raw material cutting planning module 230 is specifically configured to:

[0110] Generate the cutting planning result corresponding to the target utilization rate according to each of the cutting planning diagrams.

[0111] In one embodiment, the raw material cutting planning module 230 is further configured to:

[0112] Obtain the target cutting planning result from each of the cutting planning results corresponding to each of the preset utilization rates, and cut the wire raw material with the target cutting planning result;

[0113] Where the target cutting planning result is the cutting planning result with the highest planning score;

[0114] The planned score is determined according to the number of cutting diagrams in the cutting plan result and the consumed length of the wire raw material when cutting the wire raw material according to the cutting plan result.

[0115] Figure 5 An example of a schematic diagram of the physical structure of an electronic device is shown as Figure 5 shown. The electronic device may include: a processor 810, a communication interface 820, a memory 830, and a communication bus 840. Among them, the processor 810, the communication interface 820, and the memory 830 communicate with each other through the communication bus 840. The processor 810 may call a computer program in the memory 830 to execute the cutting plan method of the wire raw material, for example, including:

[0116] Perform a logarithmic transformation on the maximum target production volume among the production volumes to be produced for each part to determine multiple layers;

[0117] Perform binary layering on the production volume to be produced for any one of the parts to determine at least one target layer where the part is located from each of the layers;

[0118] Generate cutting plan diagrams corresponding to each of the target layers according to the part lengths of each part in each of the target layers, and generate a cutting plan result of the wire raw material according to each of the cutting plan diagrams.

[0119] In addition, when the logical instructions in the above-mentioned memory 830 are implemented in the form of software function units and sold or used as an independent product, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in the various embodiments of the present application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks, or optical discs that can store program codes.

[0120] On the other hand, an embodiment of the present application also provides a storage medium. The storage medium includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the cutting plan method of the wire raw material provided in the above-mentioned various embodiments, for example, including:

[0121] Logarithmically transform the target production volume, which is the largest among the production volumes to be produced for each part, and determine multiple stratifications;

[0122] Perform binary stratification on the production volume to be produced for any one of the parts, so as to determine at least one target stratification in which the part is located from each of the stratifications;

[0123] Generate cutting planning diagrams corresponding to each of the target stratifications according to the part lengths of the parts in each of the target stratifications, so as to generate a cutting planning result of the wire material according to each of the cutting planning diagrams.

[0124] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative efforts.

[0125] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the essence of the above technical solution, or the part that contributes to the prior art, can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A cutting planning method for wire rod raw materials, characterized in that, Including: Performing a logarithmic transformation on the maximum target production quantity among the production quantities to be produced for each part to determine multiple layers; Performing binary layering on the production quantity to be produced for any one of the parts to determine at least one target layer in which the part is located from each of the layers; Generating respective cutting planning diagrams corresponding to each of the target layers according to the part lengths of the parts in each of the target layers, and generating a cutting planning result of the wire material according to each of the cutting planning diagrams; Generating respective cutting planning diagrams corresponding to each of the target layers according to the part lengths of the parts in each of the target layers, including: Obtaining the part lengths of the current parts in the current target layer and generating an initial cutting planning diagram corresponding to the current target layer; Determining that when the initial cutting planning diagram cuts the wire material, the utilization rate of the wire material is greater than the target utilization rate among each preset utilization rate, and determining the initial cutting planning diagram as the cutting planning diagram corresponding to the current target layer; Wherein, the target utilization rate is any one of the preset utilization rates.

2. The cutting planning method for wire rod raw materials according to claim 1, characterized in that, Performing a logarithmic transformation on the maximum target production quantity among the production quantities to be produced for each part to determine multiple layers, including: According to K = log2(n), performing a logarithmic transformation on the maximum target production quantity among the production quantities to be produced for each part to determine the total height of the binary layering; Determining each of the layers according to the total height; Wherein, n represents the maximum target production quantity, and K represents the total height.

3. The cutting planning method for wire material raw materials according to claim 1, characterized in that Also including: Determining that when the initial cutting planning diagram cuts the wire material, the utilization rate of the wire material is less than or equal to the target utilization rate, and adding the part lengths of the current parts in the current target layer to the next-level target layer of the current target layer.

4. The cutting planning method for wire rod raw materials according to claim 1 or 3, characterized in that, Generating a cutting planning result of the wire material according to each of the cutting planning diagrams, including: Generating the cutting planning result corresponding to the target utilization rate according to each of the cutting planning diagrams.

5. The cutting planning method for wire rod raw materials according to claim 4, characterized in that Also including: Obtaining a target cutting planning result from the cutting planning results corresponding to each of the preset utilization rates one by one and cutting the wire material; Wherein, the target cutting planning result is the cutting planning result with the highest planning score; The planning score is determined according to the number of cutting diagrams in the cutting planning result and the consumed length of the wire material when the cutting planning result cuts the wire material.

6. A cutting planning device for wire rod raw materials, characterized in that, Including: A part layering determination module for performing a logarithmic transformation on the maximum target production quantity among the production quantities to be produced for each part to determine multiple layers; A binary layering module for performing binary layering on the production quantity to be produced for any one of the parts to determine at least one target layer in which the part is located from each of the layers; A raw material cutting planning module for generating respective cutting planning diagrams corresponding to each of the target layers according to the part lengths of the parts in each of the target layers, and generating a cutting planning result of the wire material according to each of the cutting planning diagrams; The raw material cutting planning module is specifically used for: Obtaining the part lengths of the current parts in the current target layer and generating an initial cutting planning diagram corresponding to the current target layer; When it is determined that the utilization rate of the wire material is greater than the target utilization rate among the preset utilization rates when the initial cutting plan diagram cuts the wire material, the initial cutting plan diagram is determined as the cutting plan diagram corresponding to the current target layer; Wherein, the target utilization rate is any one of the preset utilization rates.

7. An electronic device, comprising a processor and a memory storing a computer program, characterized in that, When the processor executes the computer program, the wire material cutting planning method according to any one of claims 1 to 5 is implemented.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the wire material cutting planning method according to any one of claims 1 to 5 is implemented.

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