An optical module

Abstract

The present disclosure provides an optical module, comprising: a circuit board; an optical transceiver component, electrically connected to the circuit board; the optical transceiver component includes an optical receiving component, the optical receiving component includes a third tube seat and an optical detection component; the third tube seat includes: a third tube seat body, a third through hole penetrating the top and bottom surfaces of the third tube seat body, and a light detection component supported and arranged on the top surface; a third grounding pin and a fourth grounding pin, one end of which is connected to a second metal ring, the second metal ring is arranged in the third through hole and a fourth insulating layer is arranged between the third tube seat body; a third high-frequency pin and a fourth high-frequency pin, one end of which passes through the second metal ring respectively and a third insulating layer is arranged between the second metal ring, and one end of which passes through the second metal ring is electrically connected to the optical detection component. The optical module provided by the present disclosure can optimize the return path of the optical receiving component of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals. They are one of the key components in optical communication equipment and are at the core of optical communication. Coaxial packaging is a commonly used packaging form for optical modules. Summary of the invention

[0003] The embodiment of the present disclosure provides an optical module for optimizing the return path in the TO structure and reducing the radiation diffusion of high-frequency signals on the entire TO structure.

[0004] In a first aspect, the present disclosure provides an optical module, comprising: a circuit board; an optical transceiver component, electrically connected to the circuit board, and used to transmit optical signals and receive optical signals input from outside the optical module; wherein the optical transceiver component includes an optical receiving component, and the optical receiving component includes a third tube seat and an optical detection component; the third tube seat includes: a third tube seat body, a third through hole penetrating the top and bottom surfaces of the third tube seat body, and the optical detection component is supported and arranged on the top surface; a third grounding pin and a fourth grounding pin, one end of which is connected to a second metal ring, the second metal ring is arranged in the third through hole and a fourth insulating layer is arranged between the second metal ring and the third tube seat body; a third high-frequency pin and a fourth high-frequency pin, one end of which passes through the second metal ring respectively and a third insulating layer is arranged between the second metal ring and the second metal ring, and one end of which passes through the second metal ring is electrically connected to the optical detection component.

[0005] In the optical module provided by the present disclosure, a second metal ring is provided at the end of the third grounding pin and the fourth grounding pin, and is embedded in the third through hole through the second metal ring, and the third high-frequency pin and the fourth high-frequency pin are embedded in the second metal ring and the end thereof passes through the second metal ring and is electrically connected to the optical detection component, and the third high-frequency pin and the fourth high-frequency pin are respectively isolated from the third tube socket body through the second metal ring. Furthermore, when a high-frequency differential signal is transmitted through the third high-frequency pin and the fourth high-frequency pin, the second metal ring causes the radiation generated by the high-frequency signal to flow between the second metal ring and the third high-frequency pin and the fourth high-frequency pin, so that the radiation generated by the high-frequency signal can be effectively reduced from flowing outside the third tube cap through the second metal ring. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical receiving component of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0006] In a second aspect, the present disclosure provides an optical module, comprising: a circuit board; an optical transceiver component, electrically connected to the circuit board, for transmitting optical signals and receiving optical signals input from outside the optical module; wherein the optical transceiver component includes an optical emitting component, and the optical emitting component includes a first tube seat and a laser component; the first tube seat includes: a first tube seat body, a first through hole penetrating the top and bottom surfaces of the first tube seat body, and the laser component is supported and arranged on the top surface; a first grounding pin, one end of which is connected to a first metal ring, the first metal ring is arranged in the first through hole and a second insulating layer is arranged between the first tube seat body; a first high-frequency pin, one end of which passes through the first metal ring and a second insulating layer is arranged between the first metal ring and the first metal ring, passes through one end of the first metal ring and is electrically connected to the laser component.

[0007] In the optical module provided by the present disclosure, a first metal ring is provided at one end of the first grounding pin, and is embedded in the first through hole through the first metal ring, and the first high-frequency pin is embedded in the first metal ring and the end thereof passes through the first metal ring and is electrically connected to the laser component, and the first high-frequency pin is isolated from the first tube seat body through the first metal ring. Furthermore, when a high-frequency signal is transmitted through the first high-frequency pin, the first metal ring causes the radiation generated by the high-frequency signal to flow between the first metal ring and the first high-frequency pin, and the radiation flowing to the first tube cap is reduced, so that the radiation generated by the high-frequency signal can be effectively reduced from flowing outside the first tube cap through the first metal ring. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical emitting component of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0008] In a third aspect, the present disclosure provides an optical module, comprising: a circuit board; an optical transceiver component, electrically connected to the circuit board, for transmitting optical signals and receiving optical signals input from outside the optical module; wherein the optical transceiver component comprises a tube seat and an optical device, the tube seat comprising: a tube seat body, a through hole extending through the top and bottom surfaces of the tube seat body, and the optical device being supported and arranged on the top surface; a grounding pin, one end of which is connected to a conductive layer, the conductive layer is arranged in the through hole and an insulating layer is arranged between the conductive layer and the tube seat body; a high-frequency pin, one end of which passes through the conductive layer, the conductive layer surrounds the edge of the high-frequency pin and an insulating layer is arranged between the high-frequency pin, and one end of which passes through the conductive layer is electrically connected to the optical device.

[0009] In the optical module provided by the present disclosure, the end of the grounding pin is connected to a conductive layer, the conductive layer is arranged in a through hole on the tube seat body, and an insulating layer is arranged between the conductive layer and the tube seat body; one end of the high-frequency pin passes through the conductive layer, so that the conductive layer surrounds the edge of the high-frequency pin, and an insulating layer is arranged between the high-frequency pin and the conductive layer, so as to achieve isolation of the high-frequency pin from the tube seat body through the conductive layer. Then, when a high-frequency signal is transmitted through the high-frequency pin, the conductive layer connected to the grounding pin in the through hole makes the radiation generated by the high-frequency pin transmitting the high-frequency signal mainly flow between the conductive layer and the high-frequency pin, effectively reducing the radiation generated by the high-frequency signal flowing outside the tube cap; at the same time, it can also shield the radiation generated by the outside of the TO structure to the high-frequency pin, preventing the external radiation of the TO structure from deteriorating the useful signal inside the TO structure. Therefore, the optical module provided by the present invention can optimize the return path of the optical receiving component of the TO structure by setting a conductive layer in the through hole on the tube seat body, connecting the conductive layer to the ground pin, and forming a high-frequency pin-first insulating layer-conductive layer-second insulating layer-tube seat body structure between the high-frequency pin and the tube seat body, so as to reduce the radiation diffusion of the high-frequency signal on the entire TO structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0011] Figure 1 is a connection relationship diagram of an optical communication system according to some embodiments;

[0012] Figure 2 is a structural diagram of an optical network terminal according to some embodiments;

[0013] Figure 3 is a schematic structural diagram of an optical module according to some embodiments;

[0014] Figure 4 is an exploded view of an optical module according to some embodiments;

[0015] Figure 5 is a schematic structural diagram of a light emitting component according to some embodiments;

[0016] Figure 6 is a partial structural schematic diagram of a light emitting component according to some embodiments;

[0017] Figure 7FIG. 1 is a schematic diagram of a structure of a first tube holder according to some embodiments Figure 1 ;

[0018] Figure 8 FIG2 is a second structural diagram of a first tube socket according to some embodiments;

[0019] Fig. 9 is a cross-sectional view of a first tube socket according to some embodiments;

[0020] Fig.10 Schematic diagram of a first tube holder according to some embodiments Figure 1 ;

[0021] Fig.11 Schematic diagram of a first tube holder according to some embodiments Figure 2 ;

[0022] Fig.12 is a schematic structural diagram of another light emitting component according to some embodiments;

[0023] Fig.13 is a partial structural schematic diagram of another light emitting component according to some embodiments;

[0024] Fig.14 FIG. 1 is a schematic diagram of a structure of a second tube holder according to some embodiments. Figure 1 ;

[0025] Fig.15 FIG2 is a second structural diagram of a second tube base according to some embodiments;

[0026] Fig.16 is a cross-sectional view of a second tube socket according to some embodiments;

[0027] Fig.17 is a schematic structural diagram of a light receiving component according to some embodiments;

[0028] Fig.18 A partial structure diagram of a light receiving component according to some embodiments Figure 1 ;

[0029] Fig.19 A partial structure diagram of a light receiving component according to some embodiments Figure 2 ;

[0030] Fig. 20 is a cross-sectional view of a partial structure of a light receiving component according to some embodiments;

[0031] Fig.21 Schematic diagram of a first tube holder according to some embodiments Figure 1 ;

[0032] Fig. 22 Schematic diagram of a first tube holder according to some embodiments Figure 2 ;

[0033] Fig.23 is a schematic structural diagram of another light emitting component according to some embodiments;

[0034] Fig.24 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Figure 1 ;

[0035] Fig.25 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Figure 2 ;

[0036] Fig.26 is a cross-sectional view of another light emitting component according to some embodiments;

[0037] Fig. 27 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Figure 3 . DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0039] In optical communication technology, light is used to carry the information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved. In addition, the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion between electrical signals and optical signals.

[0040] Optical modules realize the above-mentioned mutual conversion function between optical signals and electrical signals in the field of optical fiber communication technology. Optical modules include optical ports and electrical ports. The optical modules realize optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical ports, and realize electrical connection with optical network terminals (for example, optical modems) through the electrical ports. The electrical connection is mainly used to realize power supply, I2C signal transmission, data signal transmission, and grounding. The optical network terminal transmits electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).

[0041] Figure 1 FIG. 1 is a connection diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103;

[0042] One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if a repeater is used, ultra-long-distance transmission can be achieved in theory. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.

[0043] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, etc.

[0044] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

[0045] The optical module 200 includes an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be connected to the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 realizes the mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101.

[0046] The optical network terminal 100 includes a housing that is roughly rectangular, and an optical module interface 102 and a network cable interface 104 arranged on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the network cable 103. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the operation of the optical module 200. In addition to the optical network terminal 100, the host computer of the optical module 200 can also include an optical line terminal (Optical Line Terminal, OLT) and the like.

[0047] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .

[0048] Figure 2 FIG. 1 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 Only the structure of the optical network terminal 100 related to the optical module 200 is shown. Figure 2 As shown, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins that increase the heat dissipation area.

[0049] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical fiber 101.

[0050] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 is an exploded view of an optical module according to some embodiments, Figure 3 and Figure 4 A coaxial package (TO-CAN, referred to as TO) optical module is shown. Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 206 and an optical transceiver component 207 disposed in the shell.

[0051] The shell comprises an upper shell 201 and a lower shell 202 . The upper shell 201 covers the lower shell 202 to form the above shell with two openings. The outer contour of the shell is generally a square body.

[0052] In some embodiments of the present disclosure, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0053] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0054] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 206 extends from the electrical port 204 and is inserted into the upper computer (such as the optical network terminal 100); the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the external optical fiber 101 is connected to the optical transceiver component 207 inside the optical module 200.

[0055] The upper housing 201 and the lower housing 202 are combined to facilitate installation of components such as the circuit board 206 and the optical transceiver component 207 into the housing, and these components are packaged and protected by the upper housing 201 and the lower housing 202. In addition, when assembling components such as the circuit board 206 and the optical transceiver component 207, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.

[0056] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.

[0057] In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing, and the unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0058] For example, the unlocking component 203 is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a snap-fit ​​component that matches the cage of the host computer (for example, the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the host computer, the snap-fit ​​component of the unlocking component fixes the optical module 200 in the cage of the host computer; when the unlocking component 203 is pulled, the snap-fit ​​component of the unlocking component 203 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage of the host computer.

[0059] The circuit board 206 includes circuit traces, electronic components and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (MOSFET). The chips include microcontroller units (MCU), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, digital signal processing (DSP) chips, etc.

[0060] The circuit board 206 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; when the optical transceiver component is located on the circuit board, the rigid circuit board can also provide stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0061] The circuit board 206 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 206 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 206 (for example, Figure 4The gold finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0062] Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards. For example, a flexible circuit board can be used to connect a rigid circuit board to an optical transceiver component.

[0063] In some embodiments, the optical transceiver component 207 includes an optical emitting component 300 and an optical receiving component 400. The optical emitting component 300 is configured to transmit an optical signal, and the optical receiving component 400 is configured to receive an optical signal. For example, the optical emitting component 300 and the optical receiving component 400 are combined together to form an integrated optical transceiver component. Of course, in the embodiment of the present disclosure, the optical emitting component 300 and the optical receiving component 400 can also be separated, that is, the optical emitting component 300 and the optical receiving component 400 do not share a housing.

[0064] In some embodiments, Figure 4 As shown, the optical emitting component 300 and the optical receiving component 400 are respectively packaged in TO. Of course, in the embodiment of the present application, it is not limited to that both the optical emitting component 300 and the optical receiving component 400 adopt the TO packaging structure. It is also possible to adopt that one of the optical emitting component 300 and the optical receiving component 400 adopts TO packaging, that is, the optical transceiver component 207 adopts TO packaging in combination with other packaging structures, such as COB (Chip On Board) packaging, micro-optical packaging, etc.

[0065] The optical transmitting component 300 and the optical receiving component 400 of the TO package generally include a TO tube seat and a TO tube cap covering the TO tube seat. An optical device for transmitting optical signals or an optical device for receiving optical signals is arranged on the top surface of the TO tube seat. Various pins are arranged on the TO tube seat, and the pins are configured to be powered on, transmit signals or reflux, etc. For example, a number of high-frequency signal pins and a number of ground pins are arranged on the TO tube seat. The high-frequency signal pins are configured to transmit high-frequency signals, and the ground pins are configured to reflux high-frequency signals or DC signals. In order to ensure the reflux performance of the ground pins, a number of ground pins are usually arranged close to the high-frequency signal pins. However, it is found in use that even if the ground pins are arranged close to the high-frequency signal pins, the high-frequency signal will still radiate and diffuse on the entire TO structure, resulting in the formation of a strong electromagnetic field on the TO tube cap.

[0066] In some embodiments, the TO socket includes a socket body, the socket body is configured to be provided with an optical device, the optical device is a device for transmitting or receiving an optical signal; a through hole is provided on the socket body, which passes through the top and bottom surfaces of the socket body, an insulating layer is provided in the through hole, a high-frequency pin is embedded in the insulating layer in the through hole and is insulated from the socket body by the insulating layer, and one end of the high-frequency pin is used to electrically connect the optical device. For example, one end of the high-frequency pin passes through the insulating layer, so that the high-frequency pin can be electrically connected to the electrical device.

[0067] In order to optimize the return path of the TO structure in the optical transceiver component 207 and reduce the radiation diffusion of the high-frequency signal on the entire TO structure, in some embodiments, in the TO structure used in the optical transceiver component 207, a conductive layer is set in the through hole on the tube seat body, the conductive layer surrounds one end of the high-frequency pin, and the conductive layer is insulated from the high-frequency pin and the tube seat body by an insulating layer; some grounding pins are electrically connected to the conductive layer, and some grounding pins are electrically connected to the tube seat body, so that the grounding pins for the return high-frequency signal are not shared with the grounding pins for the return other signals, so that the high-frequency signal return has a dedicated grounding pin. In the through hole on the tube seat body, a structure of high-frequency pin-first insulating layer-conductive layer-second insulating layer-tube seat body is formed between the high-frequency pin and the tube seat body, wherein the first insulating layer, the conductive layer and the second insulating layer are not limited to a single-layer structure, but can also be a multi-layer structure. The conductive layer can be made of metal, such as a metal ring; the insulating layer can be made of insulating glue, such as glass glue.

[0068] When a high-frequency signal is transmitted through a high-frequency pin, the conductive layer connected to the ground pin in the through hole makes the radiation generated by the high-frequency signal transmitted by the high-frequency pin flow mainly between the conductive layer and the high-frequency pin, effectively reducing the radiation generated by the high-frequency signal flowing outside the cap; at the same time, it can also shield the radiation generated by the outside of the TO structure to the high-frequency pin, preventing the external radiation of the TO structure from deteriorating the useful signal inside the TO structure. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical receiving component of the TO structure by arranging a conductive layer in the through hole on the tube seat body, the conductive layer connecting the ground pin, and forming a high-frequency pin-first insulating layer-conductive layer-second insulating layer-tube seat body between the high-frequency pin and the tube seat body, so as to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0069] In order to optimize the return path of the TO structure in the optical transceiver component 207 and reduce the radiation diffusion of the high-frequency signal on the entire TO structure, in some embodiments, in the TO structure used by the optical transceiver component 207, a conductive wall is provided on the top surface of the socket body, and the conductive wall surrounds the edge of the through hole and the edge of the high-frequency pin. The conductive wall can be made of metal, and the metal can be the same material as the socket body.

[0070] When a high-frequency signal is transmitted through the high-frequency pin, the conductive wall allows the radiation generated by the high-frequency signal to flow between the conductive wall and the high-frequency pin, effectively reducing the radiation generated by the high-frequency signal flowing outside the cap; at the same time, it can also shield the radiation generated by the outside of the TO structure to the high-frequency pin, preventing the external radiation of the TO structure from deteriorating the useful signal inside the TO structure. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical receiving component of the TO structure by arranging the conductive wall on the top surface of the tube seat body and the edge of the through hole, so as to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0071] In some embodiments, in a TO structure with a conductive wall set at the edge of the through hole, a conductive layer can also be set in the through hole, and the conductive layer surrounds the high-frequency pin. The conductive layer is insulated from the high-frequency pin and the stem body by insulating layers, so that a structure of high-frequency pin-first insulating layer-conductive layer-second insulating layer-stub body is formed between the high-frequency pin and the stem body, so as to further optimize the return path of the TO structure in the optical transceiver component 207 and reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0072] The following is a detailed description of the structures of the light emitting component 300 and the light receiving component 400.

[0073] Figure 5 is a schematic structural diagram of a light emitting component according to some embodiments, Figure 6 FIG. 1 is a schematic diagram of a partial structure of a light emitting component according to some embodiments. Figure 5 and Figure 6 As shown, in some embodiments, the light emitting component 300 includes a first tube seat 310 and a first tube cap 320; the first tube cap 320 is covered on the first tube seat 310 and fixedly connected to the first tube seat 310 to form a relatively closed space for accommodating and setting a laser component 330; the laser component 330 is arranged on the top surface of the first tube seat 310. The laser component 330 includes an optical device for realizing that the light emitting component 300 emits an optical signal, such as a laser, a TEC, a substrate, a heat sink, a thermistor, etc.

[0074] Figure 7 FIG. 1 is a schematic diagram of a structure of a first tube holder according to some embodiments Figure 1 , Figure 8 FIG2 is a second structural diagram of a first tube holder according to some embodiments. Fig. 9 FIG. 4 is a cross-sectional view of a first tube base according to some embodiments. Figure 7-Figure 9As shown, the first tube seat 310 includes a first tube seat body 311, on which a first ground pin 312 and a first high-frequency pin 313 are arranged, and the top of the first tube seat body 311 is used to support and connect the first tube cap 320 and the laser component 330, etc.; the first high-frequency pin 313 is used to transmit high-frequency signals to the laser component 330, and the first ground pin 312 is used as a return ground for high-frequency signals.

[0075] The first tube seat body 311 is provided with a first through hole 3111, which penetrates the top and bottom surfaces of the first tube seat body 311, so as to realize the connection between the top and bottom surfaces of the first tube seat body 311. A first metal ring 3121 is provided at one end of the first grounding pin 312, and the first grounding pin 312 is electrically connected to the first metal ring 3121; one end of the first high-frequency pin 313 passes through the first metal ring 3121, and a first insulating layer 3112 is provided between the first high-frequency pin 313 and the first metal ring 3121, so that the first metal ring 3121 surrounds the side of one end of the first high-frequency pin 313 and is not electrically conductive with the first high-frequency pin 313; the first metal ring 3121 is provided in the first through hole 3111, and a second insulating layer 3113 is provided between the first metal ring 3121 and the first tube seat body 311, so that the first metal ring 3121 and the first tube seat body 311 are not electrically conductive. In some embodiments, one end of the first high-frequency pin 313 passes through the first metal ring 3121 and is higher than the top surface of the first socket body 311, so as to facilitate the first high-frequency pin 313 to be electrically connected to the laser assembly 330. In some embodiments, the first metal ring 3121 is used to form a conductive layer in the first through hole 3111, and of course the conductive layer in the embodiments of the present disclosure is not limited to the structural form of the first metal ring 3121.

[0076] In some embodiments of the present disclosure, the first tube base 310 further includes a ground pin 314, one end of which is connected to the bottom surface of the first tube base body 311, and is used for grounding thermistors, lasers, etc. For example, the ground pin 314 is located near the center of the first tube base body 311.

[0077] In some embodiments of the present disclosure, the first insulating layer 3112 is made of insulating glue, which may be glass glue, such as black glass glue, etc. The second insulating layer 3113 is made of insulating glue, which may be glass glue, such as black glass glue, etc. For example, the first insulating layer 3112 and the second insulating layer 3113 may use the same insulating glue, such as the first insulating layer 3112 and the second insulating layer 3113 both use black glass glue with the same dielectric constant.

[0078] Fig.10 Schematic diagram of a first tube holder according to some embodiments Figure 1 , Fig.11 Schematic diagram of a first tube holder according to some embodiments Figure 2 .like Fig.10 and Fig.11 As shown, in some embodiments of the present disclosure, the first high-frequency pin 313 can be first fixed in the first metal ring 3121, and the first insulating layer 3112 is formed between the first metal ring 3121 and the first high-frequency pin 313 by insulating glue; then the first grounding pin 312 with the first high-frequency pin 313 installed and fixed is installed and fixed in the first through hole 3111, and the second insulating layer 3113 is formed between the first metal ring 3121 and the first socket body 311 by insulating glue.

[0079] In some embodiments of the present disclosure, the top surface of the first metal ring 3121 is higher than the top surface of the first tube seat body 311 , or the top surface of the first metal ring 3121 is flush with the top surface of the first tube seat body 311 .

[0080] In some embodiments of the present disclosure, a step surface is provided between the side wall of the first through hole 3111 and the top surface of the first tube seat body 311, and the step surface is lower than the top surface of the first tube seat body 311, so that the first through hole 3111 is sunken toward the bottom surface of the first tube seat body 311 so that the first tube seat body 311 forms a step at the first through hole 3111, so as to further isolate the radiation generated when the first high-frequency pin 313 transmits a high-frequency signal from being transmitted to the first tube cap 320 and its outside.

[0081] In some embodiments of the present disclosure, the first metal ring 3121 is a circular metal ring to facilitate manufacturing and adjust the size of the first metal ring 3121 and the size of the first high-frequency pin 313 according to the characteristic impedance requirements of the high-frequency signal transmission path. In some embodiments of the present disclosure, the relationship between the diameter b of the first metal ring 3121 and the diameter a of the first high-frequency pin 313 satisfies Where, the unit of b and a is in, Z0 is the characteristic impedance of the high-frequency signal transmission path, ε r is the dielectric constant of the insulating glue. In the disclosed embodiment, the sizes of the first metal ring 3121 and the first high-frequency pin 313 actually required can be determined by simulation calculation, and then verified by experimental testing according to the simulation training results. In some embodiments, the first metal ring 3121 is not limited to a circular metal ring, but can also be an elliptical, square, or other shaped metal ring.

[0082] In the optical module provided by the embodiment of the present disclosure, by providing a first metal ring 3121 at one end of the first ground pin 312 and embedding the first metal ring 3121 in the first through hole 3111, the first high-frequency pin 313 is embedded in the first metal ring 3121 and the end thereof passes through the first metal ring 3121 and is electrically connected to the laser assembly 330, and the first high-frequency pin 313 is isolated from the first socket body 311 by the first metal ring 3121. Therefore, in the embodiment of the present disclosure, a structure of a first insulating layer-metal ring-second insulating layer, such as a structure of glass glue-metal ring-glass glue, is formed in the first through hole 3111 to completely isolate the first high-frequency pin 313 from the first socket body 311. When a high-frequency signal is transmitted through the first high-frequency pin 313, the first metal ring 3121 causes the high-frequency signal to generate radiation that flows between the first metal ring 3121 and the first high-frequency pin 313, and the radiation that flows to the first tube cap 320 is reduced, and thus the first metal ring 3121 in the embodiment of the present disclosure can effectively reduce the radiation generated by the high-frequency signal from flowing outside the first tube cap 320. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical emitting component 300 of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0083] In addition, in the embodiment of the present disclosure, the insulating glue-metal ring-insulating glue structure formed by the first metal ring 3121 in the first through hole 3111 combined with the first tube cap 320 and the first tube seat body 311 can shield the external radiation of the light emitting component of the TO structure, thereby preventing the external radiation of the light emitting component from deteriorating the useful signal in the light emitting component.

[0084] Furthermore, in the embodiment of the present disclosure, a first metal ring 3121 is provided at one end of the first ground pin 312, which can reduce the capacitance of the loop of the optical emitting component 300, thereby pushing the resonance point of the bandwidth to a higher frequency. The optical emitting component 300 provided in the embodiment of the present disclosure will not generate resonance on the cap within 30DHz, while in some conventional TO-structured optical emitting components, the resonance on the cap is generated at 15GHz. Therefore, the optical emitting component 300 provided in the embodiment of the present disclosure has more important improvements in EMC and bandwidth resonance area, and can meet the requirements of higher bandwidth of the optical module.

[0085] In order to meet the requirement of higher bandwidth of the optical module, the embodiment of the present disclosure further provides another optical emitting component. Fig.12 is a schematic structural diagram of another light emitting component according to some embodiments, Fig.13 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Fig.12 and Fig.13As shown, in some embodiments, the light emitting component 300 includes a second tube base 340 and a second tube cap 350. The second tube cap 350 is covered on the second tube base 340 and fixedly connected to the second tube base 340 to form a closed space for accommodating the laser assembly 330. The laser assembly 330 is arranged on the top surface of the second tube base 340. The laser assembly 330 includes devices for realizing the light emitting component 300 to emit optical signals, such as a laser, a TEC, a substrate, a heat sink, a thermistor, etc.

[0086] Fig.14 FIG. 1 is a schematic diagram of a structure of a second tube holder according to some embodiments. Figure 1 , Fig.15 FIG2 is a second structural diagram of a second tube holder according to some embodiments. Fig.16 FIG. 4 is a cross-sectional view of a second tube base according to some embodiments. Figure 14-16 As shown, the second tube base 340 includes a second tube base body 341 , on which a second high-frequency pin 342 is disposed, and the top of the second tube base body 341 is used to support and connect the second tube cap 350 and the laser assembly 330 .

[0087] The second tube base body 341 is provided with a second through hole 3411, and the second through hole 3411 penetrates the top surface and the bottom surface of the second tube base body 341, so as to realize the communication between the top surface and the bottom surface of the second tube base body 341. One end of the second high-frequency pin 342 passes through the second through hole 3411, and an insulating layer 3412 is provided between the second tube base body 341. For example, one end of the second high-frequency pin 342 passes through the second through hole 3411 and is higher than the top surface of the second tube base body 341, so as to facilitate the electrical connection with the laser assembly 330. The second high-frequency pin 342 is used to transmit a high-frequency signal to the laser assembly 330.

[0088] In some embodiments, a first metal sidewall 343 is disposed on the top surface of the second tube seat body 341, and the first metal sidewall 343 surrounds the edge of the second through hole 3411, and is used to isolate the second high-frequency pin 342 from the second tube seat body 341. When a high-frequency signal is transmitted through the second high-frequency pin, the first metal sidewall 343 causes the radiation generated by the high-frequency signal to flow between the first metal sidewall 343 and the second high-frequency pin, effectively reducing the radiation generated by the high-frequency signal flowing outside the second tube cap 350 to deteriorate the useful signal. Therefore, the optical module provided by the present disclosure can optimize the return path of the light emitting component 300 of the TO structure by the first metal sidewall 343 disposed on the top surface of the second tube seat body 341, so as to reduce the radiation diffusion of the high-frequency signal on the entire TO structure. In some embodiments, the first metal sidewall 343 is used to form a conductive wall on the top surface of the second tube seat body 341. Of course, the conductive wall in the embodiment of the present disclosure is not limited to the structural form of the first metal sidewall 343.

[0089] In some embodiments, a first notch 3431 is provided on the first metal sidewall 343 on a side facing or close to the laser assembly 330, so as to facilitate the second high-frequency pin 342 to be electrically connected to the laser assembly 330 through the first notch 3431 provided on the first metal sidewall 343. By way of example, the laser assembly 330 includes an adapter plate 331, which is disposed at the first notch 3431 and is used to electrically connect the second high-frequency pin 342 to realize the electrical connection transfer from the second high-frequency pin 342 to the laser in the laser assembly 330.

[0090] In some embodiments, a grounding metal layer 3311 is disposed on the transfer plate 331 , and the grounding metal layer 3311 contacts and connects to the first metal sidewall, so as to further optimize the return path of the laser assembly 330 .

[0091] In some embodiments, the top surface of the first metal sidewall 343 is higher than or flush with the top surface of the second high-frequency pin 342 to ensure the isolation effect of the first metal sidewall 343 on the second high-frequency pin 342 and the second socket body 341 .

[0092] In some embodiments, insulating glue is disposed in the second through hole 3411 to fix the second high-frequency pin 342 . The insulating glue may be glass glue, such as black glass glue.

[0093] In some embodiments, the second through hole 3411 is a circular through hole, and the first metal side wall 343 is an arc-shaped metal side wall, so as to facilitate manufacturing and adjust the size of the second through hole 3411 and the second high-frequency pin 342 according to the characteristic impedance requirements of the high-frequency signal transmission path. In some embodiments, the relationship between the diameter b of the second through hole 3411 and the diameter a of the second high-frequency pin 342 satisfies Where, the unit of b and a is in, Z0 is the characteristic impedance of the high-frequency signal transmission path, ε r In the embodiment of the present disclosure, the actual required sizes of the second through hole 3411 and the second high-frequency pin 342 can be determined by simulation calculation, and then verified by experimental test according to the simulation training results.

[0094] In the optical module provided by the embodiment of the present disclosure, a first metal side wall 343 is provided on the top surface of the second tube base body 341, the first metal side wall 343 surrounds the edge of the second through hole 3411, and the second high-frequency pin 342 is embedded in the second through hole 2411, and the second high-frequency pin 342 is isolated from the second tube base body 341 by the first metal side wall 343. Furthermore, when a high-frequency signal is transmitted through the second high-frequency pin 342, the first metal side wall 343 causes the radiation generated by the high-frequency signal to flow between the first metal side wall 343 and the first high-frequency pin 342, effectively reducing the radiation generated by the high-frequency signal flowing to the outside of the second tube cap 350 to deteriorate the useful signal. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical emitting component 300 of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0095] Furthermore, in the embodiment of the present disclosure, the edge of the second through hole 3411 is provided with a first metal sidewall 343, which can reduce the capacitance of the loop of the optical emitting component 300, thereby pushing the resonance point of the bandwidth to a higher frequency. The optical emitting component 300 provided in the embodiment of the present disclosure will not generate resonance on the tube cap within 30DHz, while in some conventional TO-structured optical emitting components, the resonance on the tube cap is generated at 15GHz. Therefore, the optical emitting component 300 provided in the embodiment of the present disclosure has more important improvements in EMC and bandwidth resonance area, and can meet the requirements of higher bandwidth of the optical module.

[0096] In some embodiments, a conductive layer is also disposed in the second through hole 3411, and the conductive layer surrounds the second high-frequency pin 342. The conductive layer is insulated from the second high-frequency pin 342 and the second base body 341 by insulating layers, so that a structure of second high-frequency pin-first insulating layer-conductive layer-second insulating layer-second base body 341 is formed between the second high-frequency pin 342 and the second base body 341. The configuration of the conductive layer can be as follows: Figure 6-Figure 11 The configuration of the first metal ring 3121 in the structure shown in the embodiment is of course not limited to the configuration of the first metal ring 3121, and can be similar to the configuration of the first metal ring 3121; the configuration of the first insulating layer and the second insulating layer can also be as follows: Figure 6-Figure 11 The structure shown in the embodiment includes a first insulating layer 3112 and a second insulating layer 3113 .

[0097] Fig.17 is a schematic structural diagram of a light receiving component according to some embodiments, Fig.18 A partial structure diagram of a light receiving component according to some embodiments Figure 1 .like Fig.17 and Fig.18As shown, in some embodiments, the light receiving component 400 includes a third tube base 410 and a third tube cap 420; the third tube cap 420 is covered on the third tube base 410 and fixedly connected to the third tube base 410 to form a relatively closed space for accommodating and setting the light detection component 430; the light detection component 430 is arranged on the top surface of the third tube base 410. The light detection component 430 includes a device for enabling the light receiving component 400 to receive an optical signal, such as a photodetector, a heat sink, etc.

[0098] Fig.19 A partial structure diagram of a light receiving component according to some embodiments Figure 2 , Fig. 20 FIG. 4 is a cross-sectional view of a partial structure of a light receiving component according to some embodiments. Figure 18-Figure 20 As shown, the third tube socket 410 includes a third tube socket body 411, on which a third high-frequency pin 412, a fourth high-frequency pin 413, a third grounding pin 414 and a fourth grounding pin 415 are arranged; the top of the third tube socket body 411 is used to support and connect the third tube cap 420 and the optical detection component 430; the third high-frequency pin 412 and the fourth high-frequency pin 413 are used to transmit high-frequency differential signals, and the third grounding pin 414 and the fourth grounding pin 415 are used as the return ground of the high-frequency differential signal.

[0099] The third tube base body 411 is provided with a third through hole 4111 , and the third through hole 4111 penetrates the top surface and the bottom surface of the third tube base body 411 , so as to achieve communication between the top surface and the bottom surface of the third tube base body 411 . A second metal ring 416 is disposed at one end of the third ground pin 414, and the third ground pin 414 is electrically connected to the second metal ring 416, and the fourth ground pin 415 is electrically connected to the second metal ring 416; one end of the third high-frequency pin 412 and the fourth high-frequency pin 413 passes through the second metal ring 416, and a third insulating layer 4112 is disposed between the third high-frequency pin 412, the fourth high-frequency pin 413 and the second metal ring 416, and the second metal ring 416 surrounds the edge of one end of the third high-frequency pin 412 and the fourth high-frequency pin 413, so that the third high-frequency pin 412, the fourth high-frequency pin 413 and the second metal ring 416 are insulated from each other by the third insulating layer 4112; the second metal ring 416 is disposed in the third through hole 4111, and a fourth insulating layer 4113 is disposed between the second metal ring 416 and the third tube base body 411, so that there is no electrical conduction between the second metal ring 416 and the third tube base body 411. In some embodiments, one end of the third high-frequency pin 412 and the fourth high-frequency pin 413 passes through the second metal ring 416 and is higher than the top surface of the third socket body 411, so as to facilitate the third high-frequency pin 412 and the fourth high-frequency pin 413 to be electrically connected to the light detection component 430. In some embodiments, the second metal ring 416 is used to form a conductive layer in the third through hole 4111. Of course, the conductive layer in the embodiment of the present disclosure is not limited to the structural form of the second metal ring 416.

[0100] In some embodiments of the present disclosure, the third insulating layer 4112 is made of insulating glue, which may be glass glue, such as black glass glue; the fourth insulating layer 4113 is made of insulating glue, which may be glass glue, such as black glass glue.

[0101] In some embodiments, the third high-frequency pin 412 and the fourth high-frequency pin 413 are axially symmetrically arranged in the second metal ring 416, the third ground pin 414 is arranged on the second metal ring 416 on a side close to the third high-frequency pin 412, and the fourth ground pin 415 is arranged on the second metal ring 416 on a side close to the fourth high-frequency pin 413. For example, the third ground pin 414 is arranged on the left side of the third high-frequency pin 412, and the fourth ground pin 415 is arranged on the right side of the fourth high-frequency pin 413.

[0102] In some embodiments, the third through hole 4111 is an elliptical through hole, the second metal ring 416 is an elliptical metal ring, the second metal ring 416 is close to the side wall of the third through hole 4111 but does not contact the side wall of the third through hole 4111; the third grounding pin 414 and the fourth grounding pin 415 are located on the long axis of the second metal ring 416, and the third high-frequency pin 412 and the fourth high-frequency pin 413 are located between the connecting line of the third grounding pin 414 and the fourth grounding pin 415.

[0103] In some embodiments, the positive electrode of the differential signal of the optical detection component 430 is connected to the third high frequency pin 412 and the fourth high frequency pin 413 by wire bonding, and the negative electrode of the differential signal of the optical detection component 430 is connected to the third ground pin 414 and the fourth ground pin 415 by wire bonding. For example, the third high frequency pin 412 and the fourth high frequency pin 413 are connected to the differential pad of the optical detection component 430 by wire bonding, and the second metal ring 416 is connected to the ground pad of the optical detection component 430 by wire bonding.

[0104] Fig.21 Schematic diagram of a first tube holder according to some embodiments Figure 1 , Fig. 22 Schematic diagram of a first tube holder according to some embodiments Figure 2 .like Fig.21 and Fig. 22 As shown, in some embodiments of the present disclosure, the third high-frequency pin 412 and the fourth high-frequency pin 413 can be first fixed in the second metal ring 416, and the third high-frequency pin 412 and the fourth high-frequency pin 413 can be formed with a third insulating layer 4112 by insulating glue; then, the second metal ring 416 on which the third high-frequency pin 412 and the fourth high-frequency pin 413 are installed and fixed is embedded in the third through hole 4111, and the fourth insulating layer 4113 is formed between the second metal ring 416 and the third stem body 411 by insulating glue.

[0105] In some embodiments, the top surface of the second metal ring 416 is higher than the top surface of the third socket body 411, or the top surface of the second metal ring 416 is flush with the top surface of the third socket body 411, so that the second metal ring 416 can be wired to the light detection component 430. For example, an area enlargement region is provided on the second metal ring 416 at positions corresponding to the third ground pin 414 and the fourth ground pin 415, so that it is more convenient for the second metal ring 416 to be wired to the light detection component 430.

[0106] In some embodiments of the present disclosure, a step surface is provided between the side wall of the third through hole 4111 and the top surface of the third tube socket body 411, and the step surface is lower than the top surface of the third tube socket body 411, so that the third through hole 4111 is sunken toward the bottom surface of the third tube socket body 411 so that the third tube socket body 411 forms a step at the third through hole 4111, so as to further isolate the radiation generated when the third high-frequency pin 412 and the fourth high-frequency pin 413 transmit high-frequency signals and transmit it to the third tube cap 420 and its outside.

[0107] In some embodiments of the application, the second metal ring 416 is an elliptical metal ring, which is convenient for manufacturing and controlling the area occupied by it when assembled on the third tube seat body 411, and is also convenient for adjusting the size of the second metal ring 416 and the sizes of the third high-frequency pin 412 and the fourth high-frequency pin 413 according to the characteristic impedance requirements of the high-frequency differential signal transmission path.

[0108] In the embodiment of the present disclosure, the characteristic impedance of the high-frequency differential signal transmission path is between and Wherein: Z0 is the characteristic impedance of the high-frequency signal transmission path, in Ω; r is the radius of the high-frequency pin, in in; s is the center distance between the third high-frequency pin 412 and the fourth high-frequency pin 413, in in; h is the distance from the center of the high-frequency pin to the side of the second metal ring 416, in in; ε r The dimensions of the second metal ring 416, the third high-frequency pin 412 and the fourth high-frequency pin 413 are selected in combination with the characteristic impedance of the high-frequency differential signal transmission path.

[0109] In the optical module provided by the embodiment of the present disclosure, by arranging the second metal ring 416 at one end of the third ground pin 414 and the fourth ground pin 415 and embedding the second metal ring 416 in the third through hole 4111, the third high-frequency pin 412 and the fourth high-frequency pin 413 are embedded in the second metal ring 416 and the ends thereof pass through the second metal ring 416 and are electrically connected to the optical detection component 430, and the third high-frequency pin 412 and the fourth high-frequency pin 413 are isolated from the first tube base body 311 by the second metal ring 416. Therefore, in the embodiment of the present disclosure, a structure of a third insulating layer-metal ring-fourth insulating layer, such as a structure of glass glue-metal ring-glass glue, is formed in the third through hole 4111 to completely isolate the third high-frequency pin 412 and the fourth high-frequency pin 413 from the third tube base body 411. When a high-frequency differential signal is transmitted through the third high-frequency pin 412 and the fourth high-frequency pin 413, the second metal ring 416 causes the high-frequency signal to generate radiation that flows between the second metal ring 416 and the third high-frequency pin 412 and the fourth high-frequency pin 413, and thus in the embodiment of the present disclosure, the second metal ring 416 can effectively reduce the radiation generated by the high-frequency signal from flowing outside the third cap 420. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical receiving component 400 of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0110] In addition, in the embodiment of the present disclosure, the insulating glue-metal ring-insulating glue structure formed by the second metal ring 416 in the third through hole 4111 combined with the third tube cap 420 and the third tube seat body 411 can shield the external radiation of the TO structure's optical receiving component, thereby preventing the external radiation of the optical receiving component from deteriorating the useful signal in the optical receiving component.

[0111] Further, in the embodiment of the present disclosure, a second metal ring 416 is provided at one end of the third ground pin 414 and the fourth ground pin 415, which can reduce the capacitance of the loop of the optical receiving component 400, thereby pushing the resonance point of the bandwidth to a higher frequency. The optical receiving component 400 provided in the embodiment of the present disclosure will not generate resonance on the cap within 30DHz, while in some conventional TO-structured optical emitting components, the resonance on the cap is generated at 15GHz. Therefore, the optical emitting component 300 provided in the embodiment of the present disclosure has more important improvements in EMC and bandwidth resonance area, and can meet the requirements of higher bandwidth of the optical module.

[0112] In order to meet the requirement of higher bandwidth of the optical module, the embodiment of the present disclosure further provides another optical receiving component. Fig.23 is a schematic structural diagram of another light emitting component according to some embodiments, Fig.24 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Figure 1 .like Fig.23 and Fig.24 As shown, in some embodiments, the light receiving component 400 includes a fourth tube base 440 and a fourth tube cap 450; the fourth tube cap 450 is covered on the fourth tube base 440 and connected to the top of the fourth tube base 440 to form a relatively closed space for accommodating and setting the light detection component 430; the light detection component 430 is arranged on the top surface of the fourth light 440. The light detection component 430 includes a device for enabling the light receiving component 400 to receive an optical signal, such as a photodetector, a heat sink, etc.

[0113] Fig.25 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Figure 2 , Fig.26 FIG. 4 is a cross-sectional view of another light emitting component according to some embodiments. Figure 24-26 As shown, the fourth tube socket 440 includes a fourth tube socket body 441, on which a fifth high-frequency pin 442, a sixth high-frequency pin 443, a fifth ground pin 444 and a sixth ground pin 445 are arranged; the top of the fourth tube socket body 441 is used to support and connect the fourth tube cap 450 and the optical detection component 430.

[0114] A fourth through hole 4411 is provided on the fourth tube base body 441, and the fourth through hole 4411 penetrates the top surface and the bottom surface of the fourth tube base body 441, so as to realize the connection between the top surface and the bottom surface of the fourth tube base body 441. The fifth high frequency pin 442 and the sixth high frequency pin 443 are embedded in the fourth through hole 4411, and an insulating layer 4412 is provided between the fifth high frequency pin 442 and the sixth high frequency pin 443 and the fourth tube base body 441. For example, one end of the fifth high frequency pin 442 and the sixth high frequency pin 443 passes through the fourth through hole 4411 and is higher than the top surface of the fourth tube base body 441, so as to facilitate the electrical connection of the optical detection component 430. The fifth high frequency pin 442 and the sixth high frequency pin 443 are used to transmit high frequency differential signals. The fifth grounding pin 444 and the sixth grounding pin 445 are located at the edge of the fourth through hole 4411, and are correspondingly close to the fifth high frequency pin 442 and the sixth high frequency pin 443, and are used as the return ground of the fifth high frequency pin 442 and the sixth high frequency pin 443. By way of example, the fifth ground pin 444 is located on the left side of the fifth high-frequency pin 442 , and the sixth ground pin 445 is located on the right side of the sixth high-frequency pin 443 .

[0115] In the embodiment of the present disclosure, a second metal sidewall 446 is disposed on the top surface of the fourth socket body 441. The second metal sidewall 446 is disposed around the edge of the fourth through hole 4411 to isolate the fifth high-frequency pin 442 and the sixth high-frequency pin 443 from the fourth socket body 441. In some embodiments, the second metal sidewall 446 is used to form a conductive wall on the top surface of the fourth socket body 441. Of course, the conductive wall in the embodiment of the present disclosure is not limited to the structural form of the second metal sidewall 446.

[0116] In some embodiments, a second notch 4461 is opened on the second metal sidewall 446 toward or close to the side of the light detection component 430 to facilitate the fifth high-frequency pin 442 and the sixth high-frequency pin 443 to be electrically connected to the light detection component 430 through the second notch 4461 opened on the second metal sidewall 446, such as one end of the light detection component 430 is located in the second notch 4461, and both sides of the second notch 4461 are used for wiring to connect the light detection component 430.

[0117] In some embodiments of the present disclosure, a ground pad 431, a first differential pad 432, and a second differential pad 433 are disposed at one end of the top surface of the light detection component 430; the ground pad 431 is wired to the second metal sidewall 446, the first differential pad 432 is wired to the fifth high-frequency pin 442, and the second differential pad 433 is wired to the sixth high-frequency pin 443. For example, the ground pad 431 is wired to the edges of the top surface on both sides of the second notch 4461.

[0118] In some embodiments, the top surface of the second metal side wall 446 is higher than the top surfaces of the fifth high-frequency pin 442 and the sixth high-frequency pin 443 or is flush with the top surfaces of the fifth high-frequency pin 442 and the sixth high-frequency pin 443, so as to ensure the isolation effect of the second metal side wall 446 on the fifth high-frequency pin 442, the sixth high-frequency pin 443 and the fourth stem body 441.

[0119] In some embodiments, insulating glue is disposed in the fourth through hole 4411 to fix the fifth high-frequency pin 442 and the sixth high-frequency pin 443 . The insulating glue may be glass glue, such as black glass glue.

[0120] In some embodiments of the present disclosure, the fifth high-frequency pin 442 and the sixth high-frequency pin 443 are axially symmetrically arranged in the fourth through hole 4411 , the fifth grounding pin 444 is arranged on the left side of the fifth high-frequency pin 442 , and the sixth grounding pin 445 is arranged on the right side of the sixth high-frequency pin 443 .

[0121] In some embodiments of the present disclosure, a first boss 4441 and a second boss 4451 are provided on the bottom surface of the fourth socket body 441, the first boss 4441 is connected to the fifth ground pin 444, the second boss 4451 is connected to the sixth ground pin 445, and the first boss 4441 and the second boss 4451 are provided to facilitate adjustment of the matching resistance on the transmission circuit of the optical detection assembly 430.

[0122] In some embodiments of the present disclosure, the fourth through hole 4411 is an elliptical through hole, which is convenient for controlling the area occupied by the fourth tube seat body 441, and is also convenient for adjusting the size of the fourth through hole 4411 and the sizes of the fifth high-frequency pin 442 and the sixth high-frequency pin 443 according to the characteristic impedance requirements of the high-frequency differential signal transmission path.

[0123] In some embodiments, the fourth through hole 4411 is an elliptical through hole, the fifth high-frequency pin 442 and the sixth high-frequency pin 443 are located on the long axis of the fourth through hole 4411, such as the focus of the fourth through hole 4411, the fifth grounding pin 444 is arranged on the left side of the fifth high-frequency pin 442, and the sixth grounding pin 445 is arranged on the right side of the sixth high-frequency pin 443.

[0124] Fig. 27 FIG. 1 is a schematic diagram of a partial structure of another light emitting component according to some embodiments. Figure 3 .like Fig. 27 As shown, a cross-bonding wire 4462 is set between the left end and the right end of the second metal side wall 446, that is, one end of the cross-bonding wire 4462 is connected to one end of the second metal side wall 446, and the other end is connected to the other end of the second metal side wall, so as to further ensure the grounding return effect of the second metal side wall 446.

[0125] In the embodiment of the present disclosure, the characteristic impedance of the high-frequency differential signal transmission path is between and Wherein: Z0 is the characteristic impedance of the high-frequency signal transmission path, in Ω; r is the radius of the high-frequency pin, in in; s is the center distance between the fifth high-frequency pin 442 and the sixth high-frequency pin 443, in in; h is the distance from the center of the high-frequency pin to the side of the second metal sidewall 446, in in; ε r The dimensions of the second metal ring 416, the fifth high-frequency pin 442 and the sixth high-frequency pin 443 are selected in combination with the characteristic impedance of the high-frequency differential signal transmission path.

[0126] In the optical module provided by the embodiment of the present disclosure, a second metal sidewall 446 is provided on the top surface of the fourth tube base body 441, the second metal sidewall 446 surrounds the edge of the fourth through hole 4411, the fifth high-frequency pin 442 and the sixth high-frequency pin 443 are embedded in the fourth through hole 4411, and the fifth high-frequency pin 442 and the sixth high-frequency pin 443 are isolated from the second tube base body 341 by the second metal sidewall 446. Furthermore, when the high-frequency differential signal is transmitted through the fifth high-frequency pin 442 and the sixth high-frequency pin 443, the second metal sidewall 446 causes the high-frequency signal to generate radiation and flow between the second metal sidewall 343 and the fifth high-frequency pin 442 and the sixth high-frequency pin 443, effectively reducing the radiation generated by the high-frequency signal flowing to the outside of the fourth tube cap 450 to deteriorate the useful signal. Therefore, the optical module provided by the present disclosure can optimize the return path of the optical receiving component 400 of the TO structure to reduce the radiation diffusion of the high-frequency signal on the entire TO structure.

[0127] Further, in the embodiment of the present disclosure, the edge of the fourth through hole 4411 is provided with a second metal sidewall 446, which can reduce the capacitance of the loop of the optical receiving component 400, thereby pushing the resonance point of the bandwidth to a higher frequency. The optical receiving component 400 provided in the embodiment of the present disclosure will not generate resonance on the tube cap within 30DHz, while in some conventional TO-structured optical emitting components, the resonance on the tube cap is generated at 15GHz. Therefore, the optical receiving component 400 provided in the embodiment of the present disclosure has more important improvements in EMC and bandwidth resonance area, and can meet the requirements of higher bandwidth of the optical module.

[0128] In some embodiments, a conductive layer is also disposed in the fourth through hole 4411, and the conductive layer surrounds the fifth high-frequency pin 442 and the sixth high-frequency pin 443. The conductive layer is insulated from the fifth high-frequency pin 442, the sixth high-frequency pin 443, and the fourth tube base body 441 by insulating layers, so that a structure of high-frequency pin-third insulating layer-conductive layer-fourth insulating layer-fourth tube base body 441 is formed between the fifth high-frequency pin 442, the sixth high-frequency pin 443, and the fourth tube base body 441. The configuration of the conductive layer can be as follows: Figure 18-Figure 22 The configuration of the second metal ring 416 in the structure shown in the embodiment is of course not limited to the configuration of the second metal ring 416, and can be similar to the configuration of the second metal ring 416; the configuration of the third insulating layer and the fourth insulating layer can also be as follows: Figure 18-Figure 22 The third insulating layer 4112 and the fourth insulating layer 4113 in the structure shown in the embodiment.

[0129] In some embodiments, a TO structure with one high-frequency pin disposed in a through hole can be used for the light receiving component 400 , and a TO structure with one high-frequency pin disposed in a through hole can be used for the light emitting component 300 .

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Circuit boards; An optical transceiver component, electrically connected to the circuit board, for transmitting an optical signal and receiving an optical signal input from outside the optical module; Wherein, the optical transceiver component includes an optical receiving component, and the optical receiving component includes a third tube holder and an optical detection component; the third tube holder includes: A third tube base body is provided with a third through hole penetrating through the top surface and the bottom surface of the third tube base body, and the light detection component is supported and arranged on the top surface; A third grounding pin and a fourth grounding pin, one end of which is connected to a second metal ring, the second metal ring is arranged in the third through hole and a fourth insulating layer is arranged between the second metal ring and the third tube base body; One end of the third high-frequency pin and the fourth high-frequency pin respectively passes through the second metal ring with a third insulating layer arranged between the second metal ring, and one end passing through the second metal ring is electrically connected to the light detection component.

2. The optical module according to claim 1, characterized in that: The third through hole is an elliptical through hole, the second metal ring is an elliptical metal ring, and the third grounding pin and the fourth grounding pin are located on a straight line where the long axis of the second metal ring is located.

3. The optical module according to claim 1, characterized in that: The impedance of the path between the third high-frequency pin and the fourth high-frequency pin is between and Wherein: Z0 is the characteristic impedance of the high-frequency signal transmission path, in Ω; r is the radius of the high-frequency pin, in in; s is the center distance between the third high-frequency pin and the fourth high-frequency pin, in in; h is the distance from the center of the high-frequency pin to the side of the second metal ring, in in; ε r is the dielectric constant of the insulating layer.

4. The optical module according to claim 1, characterized in that: A ground pad, a first differential pad and a second differential pad are arranged on the top surface of the optical detection component, the third high-frequency pin is connected to the first differential pad by a wire bonding, and the fourth high-frequency pin is connected to the second differential pad by a wire bonding.

5. The optical module according to claim 1, characterized in that: A conductive wall is disposed on the top surface of the third tube base body, and the conductive wall surrounds the edge of the third through hole.

6. The optical module according to claim 1, characterized in that: A step surface is arranged between the side wall of the third through hole and the top surface of the third tube base body, and the step surface is lower than the top surface of the third tube base body.

7. An optical module, characterized in that: include: Circuit boards; An optical transceiver component, electrically connected to the circuit board, for transmitting an optical signal and receiving an optical signal input from outside the optical module; Wherein, the optical transceiver component includes an optical emitting component, and the optical emitting component includes a first tube holder and a laser assembly; the first tube holder includes: A first tube base body is provided with a first through hole penetrating through the top surface and the bottom surface of the first tube base body, and the laser component is supported and arranged on the top surface; A first grounding pin, one end of which is connected to a first metal ring, wherein the first metal ring is disposed in the first through hole and a second insulating layer is disposed between the first metal ring and the first socket body; One end of the first high-frequency pin passes through the first metal ring and a first insulating layer is arranged between the first metal ring, and the first high-frequency pin passes through one end of the first metal ring and is electrically connected to the laser component.

8. The optical module according to claim 7, characterized in that: The first metal ring is a circular metal ring, and the relationship between the radius of the first metal ring and the radius of the first high-frequency pin satisfies Wherein, b is the radius of the first metal ring, a is the radius of the first high-frequency pin, the units of b and a are in, and Z0 is the characteristic impedance of the high-frequency signal transmission path, in Ω, ε r is the dielectric constant of the insulating glue.

9. The optical module according to claim 7, characterized in that: The first insulating layer is made of black glass glue, and the second insulating layer is made of black glass glue; the top surface of the first metal ring is higher than the top surface of the first tube seat body or the top surface of the first metal ring is flush with the top surface of the tube seat body.

10. An optical module, characterized in that: include: Circuit boards; An optical transceiver component, electrically connected to the circuit board, for transmitting an optical signal and receiving an optical signal input from outside the optical module; Wherein, the optical transceiver component includes a tube holder and an optical device, and the tube holder includes: A tube base body, with a through hole penetrating the top and bottom surfaces of the tube base body, and the optical device is supported and arranged on the top surface; A grounding pin, one end of which is connected to a conductive layer, wherein the conductive layer is arranged in the through hole and an insulating layer is arranged between the conductive layer and the base body; One end of the high-frequency pin passes through the conductive layer, the conductive layer surrounds the edge of the high-frequency pin and an insulating layer is arranged between the high-frequency pin, and one end passing through the conductive layer is electrically connected to the optical device.

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