Wafer fixed position defect analysis method, device and electronic equipment

Abstract

The application provides a wafer fixed position defect analysis method, device and electronic equipment. The production of a wafer needs to pass through the process flow of M equipment machines at least. The method is to construct a database of notch directions of the wafer passing through each equipment machine in advance. The wafer image of the wafer with fixed position defects is scanned and acquired at the Mth equipment machine. The defect direction of the fixed position defects of a wafer in the wafer image is different from the defect direction of the fixed position defects of other wafers. The running record of all wafers corresponding to the wafer image is recorded. The running record is the running information of each wafer in the M equipment machines. The notch direction of the wafer image at the current equipment machine is updated according to the notch direction in the database and the running record. Then, whether the current equipment machine is an abnormal equipment machine causing the fixed position defects is judged and analyzed according to the updated wafer image. The application can efficiently and accurately analyze the abnormal equipment machine causing the fixed position defects.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a wafer fixed position defect analysis method and device and electronic equipment. BACKGROUND

[0002] With the increasing integration and performance requirements of semiconductor devices, the defect detection in the semiconductor manufacturing process is also required to be higher and higher. With the passage of time, different conditions of defects may occur in equipment machines, such as fixed position defects. The fixed position defects are generally physical defects caused by the dropping of by-products, mechanical scratches and the like after the aging of the machine, which may cause damage to the fixed position of the wafer after passing through the machine.

[0003] After discovering such defects, since there is no related auxiliary function in the defect management system (DMS) and yield management system (YMS) to determine which equipment machine causes the fixed position defect damage of the wafer, engineers need to first determine which several machines the defect abnormal wafer has passed through; and then start to lock the abnormal equipment machine from the subsequent notch direction by taking the several machines as the starting point for analysis; for example Figure 1 The defect scanning result diagram shown in the figure shows that the #01 defect position is different from other wafers, and after analysis, it is suspected that the wafer may have passed through a certain inspection and measurement station, and only the #01 wafer is extracted, which leads to different angles of the #01 wafer and other wafers in the subsequent process. When the defect falls on the wafer surface during the subsequent process, different positions are presented. It is found from the running record (Table 1) of the batch that the wafer has passed through the following 5 processes, of which 2 processes only extract the measurement station of the #01 wafer. Therefore, the defect formation node must be after process 1. At present, it is usually assumed that each process is the starting point (defect formation point), and the defect scanning is the end point. Through the change of the notch of each wafer, the same position as the defect scanning result is found. However, if there are too many processes and multiple measurement stations for only the #01 wafer, the calculation amount is too large, and at the same time, due to the uncertainty of the starting point, it is difficult to rely on the system to perform comparison. Therefore, it is necessary to exclude through other ways, which tests the experience and calculation ability of engineers, that is, not only tests the cognition of engineers on the machine, but also requires a large amount of time.

[0004] Table 1

[0005] Process Time Machine Site Wafer Count Process 1 12:00 A04 Measurement Site #01 Process 2 13:00 B01 Measurement Site #01 Process 3 14:00 A05 Main Site #01～06 Process 4 15:00 B04 Main Site #01～06 Process 5 16:00 C02 Main Site #01～06 Defect Scan 12:00 X001 Defect Scan Site #01～06 SUMMARY

[0006] In view of the above-mentioned defects of the prior art, the purpose of the present application is to provide a wafer fixed position defect analysis method and device and electronic equipment, which can solve the problem of low efficiency of fixed position defect analysis in the prior art.

[0007] To achieve the above object and other related objects, the present application provides a wafer fixed position defect analysis method, the production of the wafer at least needs to pass through the process flow of M equipment platforms, wherein M≥3, M is a natural number; the method at least includes the following steps:

[0008] A database is constructed in advance, the database stores the notch direction of the wafer when passing through each equipment platform;

[0009] The Mth equipment platform is scanned to obtain the wafer image with fixed position defects, the defect direction of the fixed position defects of a wafer in the wafer image is different from the defect direction of the fixed position defects of other wafers; the fixed position defects refer to the same defects existing in the scanning results of all wafers;

[0010] The running record of all wafers corresponding to the wafer image in the process flow is recorded, the running record is the running information of each wafer in the M equipment platforms;

[0011] The notch direction of the wafer image in the current equipment platform is updated according to the notch direction in the database and the running record, and then whether the current equipment platform is an abnormal equipment platform generating fixed position defects is judged and analyzed according to the updated wafer image.

[0012] Preferably, when the defect directions of all updated wafer images are consistent, it is judged and analyzed that the current equipment platform is an abnormal equipment platform generating fixed position defects.

[0013] Preferably, the notch direction of the wafer image in the current equipment platform is updated in a reverse backtracking manner according to the notch direction in the database and the running record.

[0014] Preferably, the updating manner includes copying and rotating.

[0015] Preferably, the copying is that when the running record does not have the running information of a wafer in the current equipment platform, the notch direction of the scanning result of the wafer in the current equipment platform is the same as the notch direction of the scanning result of the last equipment platform.

[0016] Preferably, the rotating is that when the running record has the running information of a wafer in the current equipment platform, the notch direction of the scanning result of the wafer in the current equipment platform is consistent with the notch direction of the wafer passing through the current equipment platform in the database.

[0017] Preferably, the notch direction of the wafer passing through each equipment platform corresponds to three position states, which are input state, operation state and return state.

[0018] To achieve the above object and other related objects, the present application further provides a wafer fixed position defect analysis device, which is suitable for a wafer production process that needs to pass through at least M equipment platforms, wherein M is a natural number greater than 3; the device comprises:

[0019] a database unit configured to construct a database in advance, wherein the database stores the notch direction of the wafer when passing through each equipment platform;

[0020] an image unit configured to scan the Mth equipment platform to obtain wafer images with fixed position defects, wherein the wafer images include scanning results of at least three wafers, the direction of the fixed position defects of one wafer is different from the direction of the fixed position defects of other wafers, and the fixed position defects refer to the same defects existing in the scanning results of all wafers;

[0021] an information unit configured to record the running record of all wafers corresponding to the wafer images in the process, wherein the running record is the running information of each wafer in the M equipment platforms;

[0022] a processing unit configured to update the notch direction of the wafer image in the current equipment platform according to the notch direction in the database and the running record, and then determine whether the current equipment platform is an abnormal equipment platform that produces fixed position defects according to the updated wafer image.

[0023] Preferably, when the defect angles of all the updated wafer images are consistent, it is determined that the current equipment platform is an abnormal equipment platform that produces fixed position defects.

[0024] Preferably, the processing unit updates the notch direction of the wafer image in the current equipment platform in a reverse backtracking manner according to the notch direction in the database and the running record.

[0025] Preferably, the updating manner includes copying and rotating.

[0026] Preferably, the copying is that when the running record does not have the running information of a wafer in the current equipment platform, the notch direction of the scanning result of the wafer in the current equipment platform is the same as the notch direction of the scanning result of the wafer in the last equipment platform.

[0027] Preferably, the rotating is that when the running record has the running information of a wafer in the current equipment platform, the notch direction of the scanning result of the wafer in the current equipment platform is consistent with the notch direction of the wafer in the database when passing through the current equipment platform.

[0028] To achieve the above object and other related objects, the present application further provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer fixed position defect analysis method when executing the computer program.

[0029] As described above, the wafer fixed position defect analysis method, device and electronic device of the present application have the following beneficial effects:

[0030] In the wafer fixed position defect analysis of the present application, the wafer image with fixed position defects is first scanned and obtained, and the corresponding wafer running record is recorded; then the notch direction of the wafer when passing through each device machine is updated based on the pre-constructed database and the wafer running record, and then the updated wafer image is used to determine whether the current device machine is an abnormal device machine that produces fixed position defects. The wafer image with fixed position defects is updated based on the pre-constructed database to obtain the wafer image of the current device machine, and the updated wafer image is automatically updated and determined, which can more efficiently determine and analyze the abnormal device machine. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A fixed position defect scanning result schematic diagram of a certain process in a wafer production process is shown.

[0032] Figure 2 A flowchart of the wafer fixed position defect analysis method of the present application is shown.

[0033] Figure 3 A wafer and its notch schematic diagram is shown.

[0034] Figure 4 A wafer image update and determination schematic diagram in the embodiment of the present application is shown.

[0035] Figure 5 A schematic diagram of the principle structure of the electronic device in the embodiment of the present application is shown. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described below by specific, concrete examples and in combination with the drawings Figures 2-5 The skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present specification. The present application can also be implemented or applied by different specific embodiments, and the details in the present specification can be based on different views and applications, and the type, number and proportion of components can be arbitrarily changed without departing from the spirit of the present application, and the layout type of the components can be more complex.

[0037] The main technical idea of the present application is to construct a database in advance, in which the notch direction of the wafer when passing through each equipment machine is stored; based on the wafer image with fixed position defects obtained by scanning, the notch direction position of the wafer when entering and leaving each equipment machine in the database is matched according to the notch direction of the wafer at the current site and the running record of the wafer image corresponding to the process flow, so as to quickly lock the abnormal equipment machine and improve the rapidity and accuracy of fixed position defect analysis. Based on the above technical idea, the present application proposes the following technical scheme:

[0038] Method embodiment:

[0039] The present application proposes a semiconductor wafer fixed position defect analysis method, as shown in Figure 2 The production of the semiconductor wafer described in the present application at least needs to pass through a process flow of M equipment machines, wherein M≥3, M is a natural number; the method at least includes the following steps:

[0040] Construct a database, in which the notch direction of the wafer when passing through each equipment machine is stored;

[0041] Scan the Mth equipment machine to obtain a wafer image with fixed position defects, the defect direction of the fixed position defects of a wafer in the wafer image is different from that of the fixed position defects of other wafers; the fixed position defects refer to the same defects existing in the scanning results of all wafers;

[0042] Record the running record of all wafers corresponding to the wafer image in the process flow, the running record is the running information of each wafer in the M equipment machines;

[0043] Update the notch direction of the wafer image at the current equipment machine according to the notch direction in the database and the running record, and then determine whether the current equipment machine is an abnormal equipment machine producing fixed position defects according to the updated wafer image.

[0044] In the present application, the wafer at least passes through a process flow of M equipment machines, and the wafer image of the Mth equipment machine is analyzed, which can be specifically understood as: there are M equipment machines in total, and the scanning is performed at the last equipment machine; or there are more than M equipment machines in total, and the scanning is performed at the Mth equipment machine.

[0045] Here, the running record and the notch direction need to be briefly described:

[0046] About the record of running goods: the type of semiconductor wafer is different, so the process flow is different, and the actual equipment that meets the production of different types of wafers is in the same field. In order to realize the production of different types of semiconductor wafers, not all equipment is necessarily passed when producing one type of semiconductor wafer. Therefore, the record of running goods is the running information of each wafer in M equipment, which is specifically the B k th wafer passes through the A1, A i , …, A j th equipment, wherein A and B are natural numbers, and i

[0047] About the direction of the notch: usually, the direction of the wafer is stable when the wafer passes through each equipment in each manufacturing process and each transfer step in the equipment. In order to ensure the stability of wafer manufacturing, the position of the wafer is judged according to the notch (black triangle in the figure) carried by each wafer as shown in Figure 3 . That is, the direction of the notch is the identification of the position of the wafer. When the wafer passes through each manufacturing process, it includes the process of entering and returning to the wafer box when passing through the transfer door, and the corresponding notch direction is the input state and the return state. When the wafer is transferred in the equipment, the corresponding notch direction on the operation table is the operation state. Therefore, the notch direction C of the wafer when passing through each equipment includes three position states, which are the input state C1, the operation state C2 and the return state C3.

[0048] Since the notch direction of the wafer when passing through each equipment includes three position states, the database constructed in the present application stores the notch direction of the wafer when passing through each equipment. In the embodiment of the present application, the database at least includes the equipment number and the notch direction of the wafer (input state C1, operation state C2 and return state C3) of the equipment. As shown in Table 2, the database constructed in the embodiment of the present application is shown in Table 2.

[0049] Table 2

[0050]

[0051] In the analysis of the fixed position defect of the wafer of the present application, the wafer image with the fixed position defect is scanned and obtained, and the running record of all the corresponding wafers is recorded. Then, based on the notch direction of the wafer when passing through each equipment in the pre-constructed database and the running record, the notch direction of the wafer image in the current equipment is updated, and then whether the updated wafer image is an abnormal equipment that generates the fixed position defect is judged. Based on the pre-constructed database, the wafer image with the fixed position defect is updated to obtain the wafer image in the current equipment, which is automatically updated and judged. The updated wafer image can more efficiently judge and analyze the abnormal equipment.

[0052] In the embodiments of the present application, the wafer image with fixed position defects is scanned and acquired as shown in FIG. 1. Figure 1 As shown in FIG. 1, the wafer image is updated in a reverse backtracking manner when the wafer image is updated. Figure 1 The wafer image is updated in a reverse backtracking manner when the wafer image is updated.

[0053] According to the notch direction in the database and the run record, the wafer image is updated in a reverse backtracking manner in the current equipment machine. The updating manner includes copying and rotating.

[0054] In the application, the updating manner includes copying and rotating because when producing a certain type of wafer, due to the sampling inspection of the yield system, at least one wafer in a group of wafers will be sampled, and after the sampling inspection is completed, the wafer will be returned to the wafer box, and the position of the sampled wafer may change when it is returned to the wafer box. Therefore, in the reverse backtracking process, in order to ensure the accuracy of the wafer image update, the updating manner is set to two, which are copying and rotating.

[0055] Specifically, copying means that when the run record does not have the run information of a wafer in the current equipment machine, the notch direction of the scanning result of the wafer in the current equipment machine is the same as the notch direction of the scanning result of the wafer in the last equipment machine.

[0056] In the present application, when the current equipment machine does not have the run information of a wafer, it means that the wafer has not passed through the current equipment machine. Therefore, when updating the wafer image, the scanning result of the wafer in the current equipment machine is required to be consistent with the scanning result of the wafer in the last equipment machine (sorted in a reverse backtracking manner). That is, the notch direction of the scanning result of the wafer in the current equipment machine is consistent with the notch direction of the scanning result of the wafer in the last equipment machine.

[0057] Specifically, rotating means that when the run record has the run information of a wafer in the current equipment machine, the notch direction of the scanning result of the wafer in the current equipment machine is consistent with the notch direction of the wafer in the database when the wafer passes through the current equipment machine.

[0058] In the present application, when the current equipment machine has the run information of a wafer, it means that the wafer has passed through the current equipment machine. Therefore, when updating the wafer image, the wafer is required to be consistent with the notch in the database corresponding to the current equipment machine. That is, the notch direction of the scanning result of the wafer in the current equipment machine is consistent with the scanning result of the wafer in the database when the wafer passes through the current equipment machine.

[0059] Finally, all the updated wafer images are analyzed, and when the defect directions of all the updated wafer images are consistent, it is determined that the current equipment machine is an abnormal equipment machine that produces fixed position defects.

[0060] Specifically, if the defect directions of all updated wafer images are inconsistent when the current equipment is in one of the three position states, then the current equipment is determined to be an abnormal equipment that produces fixed-position defects; if the defect directions of all updated wafer images are consistent when the current equipment is in any position state, then the current equipment is determined to be an abnormal equipment that produces fixed-position defects.

[0061] like Figure 4 The diagram shown is a schematic representation of the wafer image update determination in an embodiment of this application. In the example, it only occurs on the Ath... 10 After each equipment step is completed, a defect scan is performed, and wafer images with defects in fixed locations are obtained. This set of wafer images includes a total of 6 wafers, meaning that there are a total of 6 wafers in this embodiment. The specific three positional states of the wafers when passing through different equipment steps and their notch directions are shown in the database in Table 2. The following is in conjunction with the appendix. Figure 4 This application provides a more detailed example of the technical means used to update the notch direction of the wafer in the current equipment and to determine and analyze a certain current equipment as an abnormal equipment that generates a fixed-position defect.

[0062] In this embodiment of the application, the defect scanning station is only for the Ath defect. 10 Each device is scanned to obtain the following results: Figure 1 The wafer image shown adopts a reverse reasoning method, which essentially takes the scanning station as the starting point and the A1th machine of the process initiation equipment as the ending point, and performs judgment and analysis sequentially from the scanning station to the process initiation equipment.

[0063] In other implementations, there are at least two defect scanning stations. If the first defect scanning station does not obtain a wafer image with a fixed-position defect, but the second defect scanning station does, then the reverse deduction process takes the equipment corresponding to the second defect scanning station as the starting point and the equipment after the first defect scanning station as the ending point. This allows for quick and accurate identification and analysis of the abnormal equipment that caused the fixed-position defect.

[0064] In this embodiment, Figure 1 The aforementioned wafer image is the Ath wafer. 10 The updated wafer image of each equipment, specifically the Ath... 10 The wafer image corresponding to when the equipment returns to status C3. Because of A... 10 If the equipment has processed all the wafers, then the Ath wafer... 10 When the equipment is in operating state C2, the wafer image is updated by rotation, that is, the Ath wafer image is updated by rotation. 10the concave direction of the scanning results of all wafers of the device machine table is rotated (clockwise or counterclockwise) to be consistent with the concave direction of the wafers passing through the device machine table in the database, specifically, the concave direction of the 6 wafer images corresponding to the device machine table in the operation state C2 is rotated to the 3 o'clock direction; the wafer images corresponding to the device machine table in the operation state C2 after the update (for example, the second row in the middle of the table) are immediately subjected to judgment and analysis on the updated wafer images, and the defect directions are inconsistent, so that no fixed position defects are generated in the device machine table in the operation state C2. According to the same update mode, the wafer images corresponding to the device machine table in the input state C1 after the update are 6 wafer images whose concave directions are all rotated to the 12 o'clock direction; the wafer images corresponding to the device machine table in the input state C1 after the update (for example, the third row in the middle of the table) are immediately subjected to judgment and analysis on the updated wafer images, and the defect directions are inconsistent, so that no fixed position defects are generated in the device machine table in the input state C1. 10 10 10 Figure 4 10 10 10 Figure 4 10 10 10

[0065]

[0066] ​​​​​​​​​​​​When the reverse is traced to the A7 device platform, only the B1 wafer has passed through, so the wafer image update mode of the B1 wafer of the current device platform (the A7 device platform) is still rotation, and then the notch direction of the B1 wafer image is rotated to the 6 o'clock direction; and the wafer image update mode of the remaining B1-B6 wafers is copy, that is, the notch direction of the scanning result of the B1-B6 wafers of the A7 device platform is rotated (clockwise or counterclockwise) to be consistent with the notch direction of the scanning result of the last device platform (the A8 device platform), and specifically, the update wafer image of the B1-B6 wafers of the A7 device platform in the operation state C3 is that the notch direction of the wafer image is still 12 o'clock. It can be seen that the update wafer image of the A7 device platform in the operation state C3 is that the notch direction of the B1 wafer image is 6 o'clock, and the notch direction of the B1-B6 wafer image is 12 o'clock.

[0067] The wafer image corresponding to the A7 device platform in the operation state C3 after the update (such as Figure 4 the tenth row in the middle) is immediately analyzed to determine whether the defect direction of the six wafers is consistent, and therefore, the fixed position defect generated by the A7 device platform in the operation state C3 can be determined to be an abnormal device platform. When the abnormal device platform is determined, the wafer image is no longer updated, so as to avoid waste of computing resources.

[0068] In the specific embodiments of the present application, the defect direction of the fixed position defect of only one wafer in the wafer image is different from the defect direction of the fixed position defect of the other five wafers, and as another implementation, there can be at least two device platforms for sampling in the M device platforms, so that the defect direction of the fixed position defect of at least two corresponding wafers is abnormal; however, the fixed position defect mode adopts the technical concept of reverse tracing and the specific technical means of updating and determining described above. The specific application examples of other implementations are no longer introduced in detail in the present application.

[0069] The above analysis method can accurately determine and locate the device platform that generates the fixed position defect in the wafer production process, and the accuracy and efficiency are improved compared with the traditional manual method.

[0070] Device embodiment:

[0071] To solve the problems in the prior art, the present application also provides a wafer fixed position defect analysis device, which is suitable for a wafer production process that needs to pass through M device platforms, wherein M≥3, and M is a natural number; the device comprises:

[0072] a database unit configured to pre-construct a database storing a notch direction of a wafer when passing through each equipment machine;

[0073] an image unit configured to scan the Mth equipment machine to obtain wafer images having fixed position defects, wherein a defect direction of fixed position defects of a wafer in the wafer images is different from a defect direction of fixed position defects of other wafers; the fixed position defects refer to the same defects existing in the scanning results of all wafers;

[0074] an information unit configured to record running records of all wafers corresponding to the wafer images in a process flow, wherein the running records are running information of each wafer in the M equipment machines;

[0075] a processing unit configured to update a notch direction of the wafer images in a current equipment machine according to the notch direction in the database and the running records, and then determine whether the current equipment machine is an abnormal equipment machine generating fixed position defects according to the updated wafer images.

[0076] In the wafer fixed position defect analysis device, the specific functions and implementation means of each unit have been described in detail in the above method embodiments, and will not be described here.

[0077] An electronic device embodiment is provided:

[0078] Figure 5 The electronic device provided in the embodiment of the present application is a structure schematic diagram; the electronic device includes a memory, a processor, and a program stored in the memory and executable on the processor; when the processor executes the program, the following steps are implemented:

[0079] pre-construct a database storing a notch direction of a wafer when passing through each equipment machine;

[0080] scan the Mth equipment machine to obtain wafer images having fixed position defects, wherein a defect direction of fixed position defects of a wafer in the wafer images is different from a defect direction of fixed position defects of other wafers; the fixed position defects refer to the same defects existing in the scanning results of all wafers;

[0081] record running records of all wafers corresponding to the wafer images in a process flow, wherein the running records are running information of each wafer in the M equipment machines;

[0082] update a notch direction of the wafer images in a current equipment machine according to the notch direction in the database and the running records, and then determine whether the current equipment machine is an abnormal equipment machine generating fixed position defects according to the updated wafer images.

[0083] The detailed steps of the method are described in detail in the method embodiment above, which will not be repeated here; it should be noted that the above description is only exemplary, and the embodiments of the present application do not limit this.

[0084] The processor can be a general processor, including a central processing unit (CPU), a network processor (NP), etc., and can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component. The disclosed methods, steps and logic block diagrams in the embodiments of the present application can be implemented or executed. The general processor can be a microprocessor or the processor can be any conventional processor.

[0085] The electronic device of the embodiments of the present application exists in various forms, including but not limited to:

[0086] (1) Mobile communication device: The feature of this type of device is to have mobile communication function, and to provide voice and data communication as the main target. This type of terminal includes: smart phone (such as: IPhone), multimedia phone, functional phone, and low-end phone, etc.

[0087] (2) Ultra-mobile personal computer device: This type of device belongs to the category of personal computers, has computing and processing functions, and generally also has mobile Internet features. This type of terminal includes: PDA, MID and UMPC devices, etc., such as Ipad.

[0088] (3) Portable entertainment device: This type of device can display and play multimedia content. This type of device includes: audio and video players (such as: iPod), handheld game consoles, e-books, and smart toys and portable car navigation devices.

[0089] (4) Server: A device that provides computing services. The components of a server include a processor, a hard disk, a memory, a system bus, etc. The server has a similar architecture to a general-purpose computer, but due to the need to provide high-reliability services, it has higher requirements in terms of processing capability, stability, reliability, security, scalability, and manageability.

[0090] (5) Other electronic devices with data interaction function.

[0091] It should be noted that, according to the needs of implementation, each component / step described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or part of the operation of the components / steps can be combined into a new component / step to achieve the purpose of the embodiments of the present application.

[0092] The methods according to the embodiments of the present application described above can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium such as a CD ROM, a RAM, a floppy disk, a hard disk, or an optical disk, or be downloaded through a network originally stored in a remote recording medium or a non-transitory machine storage medium and stored in a local recording medium, so that the methods described herein can be processed by such software on a recording medium using a general computer, a special purpose processor, or programmable or special purpose hardware such as an ASIC or an FPGA. It can be understood that the computer, the processor, the microprocessor controller, or the programmable hardware includes a storage component (for example, a RAM, a ROM, a flash memory, etc.) that can store or receive software or computer code, when the software or computer code is accessed and executed by the computer, the processor, or the hardware, the switching control method of dual-energy exposure described herein is implemented. In addition, when a general computer accesses the code for implementing the method shown herein, the execution of the code will convert the general computer into a special computer for executing the method shown herein.

[0093] Those skilled in the art can appreciate that the units and method steps of the examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether the functions are implemented in hardware or software depends on the specific application of the technical solution and the involved constraints. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of the present application.

[0094] In summary, the wafer fixed position defect analysis method, device and electronic equipment of the present application have rapidity and accuracy when analyzing the equipment machine that produces fixed position defects, so as to efficiently judge and analyze the wafer fixed position defects as a whole. Therefore, the present application effectively overcomes the various shortcomings in the prior art and has high industrial utilization value.

[0095] The above-described embodiments are merely illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical idea of the present application should be covered by the claims of the present application.

Claims

1. A method for analyzing a fixed position defect of a wafer, the wafer being produced by at least M equipment machines, wherein, M≥3, M is a natural number; characterized in that: the method comprises at least the following steps: Pre-constructing a database, the database stores the notch direction of the wafer when passing through each equipment machine; Scanning the Mth equipment machine to obtain wafer images with fixed position defects, the defect direction of the fixed position defects of a wafer in the wafer images is different from that of the fixed position defects of other wafers; the fixed position defects refer to the same defects existing in the scanning results of all wafers; Recording the running record of all wafers corresponding to the wafer images in the process flow, the running record is the running information of each wafer in the M equipment machines; Updating the notch direction of the wafer images in the current equipment machine according to the notch direction in the database and the running record, and then judging and analyzing whether the current equipment machine is an abnormal equipment machine that produces fixed position defects according to the updated wafer images; When the defect directions of all updated wafer images are consistent, it is judged and analyzed that the current equipment machine is an abnormal equipment machine that produces fixed position defects; Updating the notch direction of the wafer images in the current equipment machine in a reverse and backtracking manner according to the notch direction in the database and the running record; The updating mode includes copying and rotating.

2. The wafer fixed position defect analysis method of claim 1, wherein: The copying is that when the running record does not have the running information of a wafer in the current equipment machine, the notch direction of the scanning result of the wafer in the current equipment machine is the same as that of the scanning result of the last equipment machine.

3. The wafer fixed position defect analysis method of claim 1, wherein: The rotating is that when the running record has the running information of a wafer in the current equipment machine, the notch direction of the scanning result of the wafer in the current equipment machine is consistent with the notch direction of the wafer when passing through the current equipment machine in the database.

4. The wafer fixed position defect analysis method of claim 1, wherein: The notch direction of the wafer when passing through each equipment machine corresponds to three position states, which are input state, operation state and return state.

5. A wafer fixed location defect analysis device, which is adapted for a wafer to be processed through a process flow of M equipment machines, wherein, M≥3, M is a natural number; characterized in that: the device comprises: A database unit configured to pre-construct a database, the database stores the notch direction of the wafer when passing through each equipment machine; An image unit configured to scan the Mth equipment machine to obtain wafer images with fixed position defects, the wafer images include scanning results of at least three wafers, and the direction of the fixed position defects of one wafer is different from that of the fixed position defects of other wafers; the fixed position defects refer to the same defects existing in the scanning results of all wafers; An information unit configured to record the running record of all wafers corresponding to the wafer images in the process flow, the running record is the running information of each wafer in the M equipment machines; A processing unit configured to update the notch direction of the wafer images in the current equipment machine according to the notch direction in the database and the running record, and then judge and analyze whether the current equipment machine is an abnormal equipment machine that produces fixed position defects according to the updated wafer images; When the defect angles of all updated wafer images are consistent, it is judged and analyzed that the current equipment machine is an abnormal equipment machine that produces fixed position defects; The processing unit updates the notch direction of the wafer image in the current equipment machine according to the notch direction in the database and the wafer running record by using a reverse backtracking method; The updating method includes copying and rotating.

6. The wafer fixed position defect analysis apparatus according to claim 5, characterized by: The copying is that when the wafer running record does not have the wafer running information of a wafer in the current equipment machine, the notch direction of the scanning result of the wafer in the current equipment machine is the same as the notch direction of the scanning result of the wafer in the last equipment machine.

7. The wafer fixed position defect analysis apparatus of claim 5, wherein: The rotating is that when the wafer running record has the wafer running information of a wafer in the current equipment machine, the notch direction of the scanning result of the wafer in the current equipment machine is consistent with the notch direction of the wafer in the database when the wafer passes through the current equipment machine.

8. An electronic device comprising a processor, a memory, and a computer program stored in the memory and operable on the processor, characterized in that, The processor realizes the steps of the wafer fixed position defect analysis method in any one of claims 1-4 when executing the computer program.

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