Data processing method and device, electronic equipment and storage medium

Abstract

This application provides a data processing method, a data processing apparatus, an electronic device, and a storage medium. The method includes: obtaining first identification information, the first identification information including preliminary identification results of whether each unit of the wafer is a normal or abnormal unit obtained based on a wafer scan image, position information of each unit, and an image of each unit; constructing a target image for the wafer based on the position information and the images of each unit; dividing the target image to obtain at least one target sub-image, each target sub-image corresponding to P units of the wafer, where P is a positive integer greater than 1; and correcting the preliminary identification results of at least some units in each unit based on the at least one target sub-image and a preset image to obtain the target identification result of each unit in the target image. Using the technical solution of this application, the accuracy of identifying whether each unit in the wafer is a qualified or unqualified unit can be improved, and misidentification can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and in particular, to a data processing method, a data processing apparatus, an electronic device and a storage medium. BACKGROUND

[0002] In the field of semiconductor, a wafer can be divided into grids, and each grid can be regarded as a unit constituting the wafer. In order to realize electrical parameter and functional testing of the wafer, a test key needs to be arranged on a scribe lane of the wafer. During a die sawing process of the wafer, due to the characteristics of a cutting machine itself (such as stability decline, operation abnormality, etc.), there will be a collapse defect in the wafer. In the related art, a defect detection apparatus (AOI) scans the wafer to obtain a wafer scan image, and through analysis of the wafer scan image, an identification result of whether each unit constituting the wafer is a qualified unit or an unqualified unit can be obtained. It can be understood that the more qualified units on the wafer, the higher the yield of the wafer. Therefore, improving the identification accuracy of whether each unit on the wafer is a qualified unit or an unqualified unit has become a technical problem to be solved. SUMMARY

[0003] The present application provides a data processing method, a data processing apparatus, an electronic device and a storage medium to at least solve the above technical problems in the prior art.

[0004] According to a first aspect of the present application, a data processing method is provided, comprising:

[0005] obtaining first identification information, the first identification information comprising a preliminary identification result of whether each unit of a wafer is a normal unit or an abnormal unit, position information of each unit and an image of each unit based on a wafer scan image;

[0006] constructing a target image for the wafer based on the position information of each unit and the image of each unit;

[0007] dividing the target image to obtain at least one target sub-image, each target sub-image corresponding to P units of the wafer, P being a positive integer greater than 1;

[0008] correcting the preliminary identification result of at least part of the units based on the at least one target sub-image and a preset image to obtain a target identification result of each unit in the target image.

[0009] In an implementation manner, the dividing the target image to obtain at least one target sub-image comprises:

[0010] According to the attribute of the exposure unit of the wafer, the target image is divided to obtain at least one target sub-image, each target sub-image corresponding to M*N units of the wafer, M*N=P, and M and N are positive integers greater than 1.

[0011] In an implementation, the preliminary identification result of at least part of the units is corrected based on the at least one target sub-image and the preset image to obtain the target identification result of each unit in the target image, including:

[0012] Based on the at least one target sub-image and the preset image, a first type of unit in each unit is determined, the first type of unit being a unit in each unit that needs to be corrected in the preliminary identification result;

[0013] According to the preset identification result, the preliminary identification result of the first type of unit is corrected to obtain the target identification result of the first type of unit;

[0014] Based on the target identification result of the first type of unit and the preliminary identification result of a second type of unit in each unit except the first type of unit, the target identification result of each unit in the target image is obtained.

[0015] In an implementation, the first type of unit in each unit is determined based on the at least one target sub-image and the preset image, including:

[0016] Based on the comparison result of each target sub-image in the at least one target sub-image and the preset image and the preliminary identification result of each unit included in each target sub-image, a first sub-image is determined, the first sub-image being a sub-image including a unit whose preliminary identification result needs to be corrected in the at least one target sub-image;

[0017] The first sub-image is regionally divided to obtain a plurality of first regions;

[0018] Based on the comparison result of the plurality of first regions and a plurality of second regions in the preset image and the preliminary identification result of the unit included in each first region, the first type of unit is determined from each unit.

[0019] In an implementation, the first type of unit in each unit is determined based on the at least one target sub-image and the preset image, including:

[0020] Based on the preliminary identification result of each unit, a second sub-image is screened out from the at least one target sub-image, the second sub-image being a sub-image including a unit whose preliminary identification result is abnormal;

[0021] The second sub-image is regionally divided to obtain a plurality of third regions;

[0022] The first type of unit is determined from the units based on the results of the respective comparisons of the plurality of third regions and the plurality of second regions in the preset image, and the preliminary identification results of the units included in the first regions.

[0023] In an implementation, the method further comprises:

[0024] outputting the target image;

[0025] and / or outputting the target identification result of each unit at a position corresponding to the unit on the target image.

[0026] In an implementation, the preliminary identification result is obtained by analyzing a wafer scanning image obtained by scanning each unit on the wafer in a unit scanning manner.

[0027] According to a second aspect of the present disclosure, a data processing apparatus is provided, comprising:

[0028] an obtaining unit configured to obtain first identification information, the first identification information comprising a preliminary identification result of each unit of a wafer being a normal unit or an abnormal unit, position information of each unit, and an image of each unit, the preliminary identification result being obtained based on a wafer scanning image;

[0029] a constructing unit configured to construct a target image of the wafer based on the position information of each unit and the image of each unit;

[0030] a dividing unit configured to divide the target image to obtain at least one target sub-image, each target sub-image corresponding to P units of the wafer, P being a positive integer greater than 1;

[0031] a correcting unit configured to correct the preliminary identification result of at least some of the units based on the at least one target sub-image and a preset image, to obtain a target identification result of each unit in the target image.

[0032] According to a third aspect of the present disclosure, an electronic device is provided, comprising:

[0033] at least one processor; and

[0034] a memory communicatively connected to the at least one processor; wherein

[0035] the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to the present disclosure.

[0036] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, the computer instructions being used to cause a computer to perform the method according to the present disclosure.

[0037] By means of the technical scheme, the identification correctness of whether each unit in the wafer is a qualified unit or an unqualified unit can be improved, and misidentification can be reduced.

[0038] It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the present application, nor is it used to limit the scope of the present application. Other features of the present application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0039] The above and other objects, features and advantages of the present application will become readily apparent by reference to the following detailed description, when taken in conjunction with the accompanying drawings, in which several embodiments of the present application are shown by way of example, and wherein:

[0040] In the drawings, identical or corresponding reference signs refer to identical or corresponding parts.

[0041] Figure 1 An implementation flowchart of a data processing method in an embodiment of the present application is shown Figure 1 ;

[0042] Figure 2 A schematic diagram of an exposure unit Shot in an embodiment of the present application is shown

[0043] Figure 3 A schematic diagram of a standard image in an embodiment of the present application is shown

[0044] Figure 4 An implementation flowchart of a data processing method in an embodiment of the present application is shown Figure 2 ;

[0045] Figure 5 An application schematic diagram in an embodiment of the present application is shown

[0046] Figure 6 A region division schematic diagram of a first sub-image and a second sub-image in an embodiment of the present application is shown

[0047] Figure 7 A component structure schematic diagram of a data processing device in an embodiment of the present application is shown

[0048] Figure 8 A component structure schematic diagram of an electronic device in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0049] In order to make the purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0050] In order to make the purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0051] In the following description, "some embodiments" are related to a subset of all possible embodiments, but it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0052] In the following description, the term "first\second" is only to distinguish similar objects, and does not represent the specific order of the objects. It can be understood that "first\second" can be interchanged in specific order or sequence as allowed, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used herein are only for the purpose of describing the embodiments of the present application, and are not intended to limit the present application.

[0054] It should be understood that in various embodiments of the present application, the size of the serial number of each implementation process does not mean the order of execution, and the execution order of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0055] In the related art, a wafer can be scanned by a defect detection device (AOI) to obtain a result of whether each unit constituting the wafer is a qualified unit or an unqualified unit. Generally, if there is a collapse defect in a unit of the wafer, the AOI considers that the unit is an unqualified unit. In addition, for a unit close to or connected with a test element, the unit can also be considered as an unqualified unit by the AOI device because of the presence of the test element (the AOI can consider that the test element is an abnormal part in the wafer), which is actually a kind of misidentification. Therefore, how to reduce misidentification and improve the accuracy of whether each unit in the wafer is a qualified unit or an unqualified unit has become a technical problem to be solved.

[0056] The technical solution of the present application can correct the preliminary identification result of errors generated for at least part of the units in the wafer based on the construction of the target image of the wafer based on the first identification information, the at least one target sub-image obtained by dividing the constructed target image, and the preset image, so as to improve the identification accuracy of whether each unit in the wafer is a qualified unit or an unqualified unit and reduce misidentification.

[0057] The data processing method of the present application is applied to a data processing device. The data processing device can be used as a separate device or integrated into a reasonable device. For example, it can be integrated into a wafer defect scanning machine (referred to as a scanning machine) for use. The scanning machine is a device that can identify defects in a wafer.

[0058] Figure 1 The implementation flowchart of the data processing method in the embodiment of the present application is shown Figure 1 . As shown in Figure 1 , the method comprises:

[0059] S101: obtaining first identification information, the first identification information comprising a preliminary identification result of whether each unit of a wafer is a normal unit or an abnormal unit based on a wafer scanning image, position information of each unit, and an image of each unit;

[0060] In this step, the first identification information is obtained by receiving or reading the first identification information. The first identification information is usually obtained by analyzing the wafer scanning image obtained by scanning the wafer by the AOI device.

[0061] Generally, the wafer includes A rows*B columns of units. Each unit corresponds to a Die, that is, the wafer includes A rows*B columns of Dies. Wherein, A and B are positive integers greater than or equal to 2. A unit is a normal unit, meaning that the Die corresponding to the unit is a normal Die. A unit is an abnormal unit, meaning that the Die corresponding to the unit is an abnormal Die. Wherein, a normal Die is a Die that can be used normally in the chip manufacturing process. An abnormal Die is a Die that cannot be used normally in the chip manufacturing process.

[0062] The preliminary identification result can be that the AOI device scans each unit on the wafer one by one in a unit scanning (By Die Scan) manner, obtains a wafer scan image, and obtains the preliminary identification result of whether each unit on the wafer is a normal unit or an abnormal unit through analysis of the wafer scan image. The preliminary identification result is obtained through analysis of the wafer scan image obtained by scanning each unit on the wafer one by one in a unit scanning manner.

[0063] The AOI device records the preliminary identification result of each unit, records the position of each unit on the wafer, and takes an image of each unit and records it to form the first identification information. When needed, it can be sent to the data processing device.

[0064] In this application, based on the analysis of the wafer scan image obtained in the By Die Scan manner to obtain the preliminary identification result, the identification of whether the preliminary identification result of the wafer in the Die unit, that is, this fine granularity, needs to be corrected can be realized. Fine-grained identification is realized.

[0065] S102: Based on the position information of each unit and the image of each unit, a target image for the wafer is constructed;

[0066] In implementation, this step can splice the images of each unit according to the positions of each unit in the wafer to form an image (target image) for the wafer.

[0067] It can be understood that the target image constructed based on the position information of each unit and the image of each unit and the wafer scan image scanned by the AOI can be an image of the same size or an image of a certain size ratio. In some embodiments, it is an image of the same size, so that in the constructed target image and the wafer scan image, the positions of each unit are the same or consistent.

[0068] S103: The target image is divided to obtain at least one target sub-image, and each target sub-image corresponds to P units of the wafer, and P is a positive integer greater than 1;

[0069] During implementation, the target image is divided according to the attributes of the exposure units of the wafer, resulting in at least one target sub-image. Each target sub-image corresponds to M*N units of the wafer, where M*N = P, and M and N are both positive integers greater than 1. The attributes characterize the size or specifications of the exposure units.

[0070] An exposure unit refers to a shot used in the exposure stage of chip manufacturing. The specifications or size of the exposure unit need to be specified before exposure. Typically, an exposure unit is an M x N shot. That is, the size of the shot is the same as the size of an M x N die. An exposure unit comprises M x N exposure sub-units, each of which is the same size as a die.

[0071] like Figure 2 The diagram shows an exposure cell with a size of 2 rows by 3 columns (M=2, N=3). Within this 3 rows by 2 columns exposure cell, there are M*N=6 exposure sub-cells: sub-cell 11, sub-cell 12, sub-cell 13, sub-cell 21, sub-cell 22, and sub-cell 23. Each exposure sub-cell is the same size as a single die on the wafer.

[0072] Figure 2 The image shown is merely a specific example of an exposure unit. Any reasonable specifications or size are within the scope of this application.

[0073] The target image is divided according to the properties of the exposure units of the wafer, and the size or specifications of each target sub-image is the same as the size or specifications of the exposure unit.

[0074] S104: Based on at least one target sub-image and a preset image, the preliminary recognition results of at least some units in each unit are corrected to obtain the target recognition results of each unit in the target image.

[0075] In this step, the preset image can be a pre-set standard image. In terms of size, this standard image is the same size as the exposure unit. In terms of content, it is the same as the content of the exposure unit, and the test chip is set on the cutting path of the exposure unit, such as... Figure 3 As shown. It can be understood that a standard image is an image with a test chip and no defects.

[0076] During implementation, by comparing each target sub-image with a preset image, it can be determined whether any unit in each unit requires correction of the preliminary recognition result. Specifically, if the comparison shows that the target sub-image and the preset image are identical, it is determined that a unit requires correction of the preliminary recognition result. If such a unit is determined, the preliminary recognition result of that unit is corrected based on at least one target sub-image and the preset image.

[0077] In this application's technical solution, because the test components are located on the wafer's dicing channels, the initial identification result of AOI (Automated Optical Inspection) of dies near the dicing channels is usually that they are defective dies. Therefore, in most cases, there are dies among the dies that require correction of the initial identification result. AOI's identification of dies near the dicing channels is due to AOI mistaking the test components for defects, thus identifying them as defective dies. However, test components appear on the wafer as components for testing the wafer's electrical parameters and functionality, not as defects. Therefore, the AOI's (initial) identification result of dies near the dicing channels is incorrect and needs correction.

[0078] In steps S101 to S104, first identification information is obtained. Based on the position information and images of each unit in the first identification information, a target image for the wafer is constructed. Based on at least one target sub-image obtained by dividing the constructed target image and a preset image, erroneous preliminary identification results for at least some units in the wafer can be corrected, thereby improving the accuracy of identifying whether each unit in the wafer is a qualified or unqualified unit and reducing misidentification.

[0079] In some embodiments, the aforementioned scheme of correcting the preliminary recognition results of at least some units in each unit based on at least one target sub-image and a preset image to obtain the target recognition results of each unit in the target image can be implemented through... Figure 4 The solution shown is used to achieve this.

[0080] S401: Based on at least one target sub-image and a preset image, determine the first type of unit in each unit, wherein the first type of unit is the unit in each unit that needs to undergo preliminary identification result correction.

[0081] Among them, the first type of unit in the wafer is the unit whose initial identification result is incorrect and needs to be corrected.

[0082] In this step, dies with initially incorrect identification results that require correction are identified among the dies on the wafer. Further identification of dies requiring correction can be achieved through one of the following two methods.

[0083] Method a: Based on the comparison results of each target sub-image in at least one target sub-image with a preset image, and the preliminary identification results of each unit included in each target sub-image, a first sub-image is determined. The first sub-image is a sub-image in at least one target sub-image that includes units whose preliminary identification results need to be corrected. The first sub-image is divided into regions to obtain multiple first regions. Based on the comparison results of the multiple first regions with multiple second regions in the preset image, and the preliminary identification results of the units included in each first region, a first type of unit is determined from each unit.

[0084] In the manner a, the first sub-image is a sub-image which is consistent with the preset image but includes a unit with the preliminary identification result as abnormal. The preset image is a standard image, defect-free, and consistent with the standard image, which means that the sub-image should be a defect-free image. However, the identification result (the preliminary identification result) given by the AOI indicates that the sub-image includes an abnormal unit (a unit with the preliminary identification result as abnormal), which means that the preliminary identification result given by the AOI for the unit is wrong. The unit with the wrong preliminary identification result is a unit whose preliminary identification result needs to be corrected. The sub-image including the unit with the wrong preliminary identification result can be regarded as a sub-image including a unit whose preliminary identification result needs to be corrected.

[0085] The preset image is divided in advance according to the size of the Die to obtain a plurality of second regions of the preset image. In the implementation, the first sub-image is regionally divided according to the size of the Die to obtain a plurality of first regions. Because the division is performed according to the size of the Die, the second regions and the first regions are the same in size. Because the size of the first sub-image is the same as the size of the exposure unit and the size of the preset image is the same as the size of the exposure unit, the size of the first sub-image is the same as the size of the preset image. The first sub-image and the preset image are both divided according to the size of the Die, and the obtained first regions and second regions are corresponding. For example, the first region of the first sub-image corresponds to the first region of the preset image, the second region of the first sub-image corresponds to the second region of the preset image, and so on.

[0086] The corresponding regions between the first sub-image and the preset image are compared in terms of the gray scale values. If the difference between the gray scale value of a region (region 1) of the first sub-image and the gray scale value of the corresponding region (region 1 of the preset image) of the preset image is greater than or equal to a first threshold value, it is considered that the region 1 is a region with defects. If the difference between the gray scale values is not greater than or equal to the first threshold value, it is considered that the region 1 is not a region with defects. The corresponding regions of the first sub-image and the preset image are compared in terms of the gray scale values by using the above scheme, and the regions without defects are determined. For the regions without defects determined by the comparison of the gray scale values, if there is a unit with the preliminary identification result as abnormal in the region according to the AOI, it is considered that the preliminary identification result of the unit as abnormal in the region according to the AOI is wrong. The preliminary identification result of the unit needs to be corrected. In this way, the units in the wafer with the wrong preliminary identification result and needing to be corrected can be found out.

[0087] The second sub-image is obtained by dividing the second sub-image into a plurality of third regions according to the size of the die. The preset image is divided into a plurality of second regions according to the size of the die. The second regions and the third regions are the same in size. The second sub-image and the preset image are the same in size. The third regions and the second regions are corresponding to each other. For example, the first region of the second sub-image corresponds to the first region of the preset image, the second region of the second sub-image corresponds to the second region of the preset image, and so on.

[0088] In the implementation, the sub-image including the units with the preliminary identification result of abnormality is screened out as the second sub-image in each target sub-image. The second sub-image is divided into a plurality of third regions according to the size of the die. The preset image is divided into a plurality of second regions according to the size of the die. The second regions and the third regions are the same in size. The second sub-image and the preset image are the same in size. The third regions and the second regions are corresponding to each other. For example, the first region of the second sub-image corresponds to the first region of the preset image, the second region of the second sub-image corresponds to the second region of the preset image, and so on.

[0089] The corresponding regions of the second sub-image and the preset image are compared in terms of the gray value. If the difference between the gray value of a region of the second sub-image, for example, the second region, and the gray value of the corresponding region of the preset image, for example, the second region of the preset image, is greater than or equal to the second threshold value, it is considered that the second region is a region with defects. If the difference between the gray value is not greater than or equal to the second threshold value, it is considered that the second region is not a region with defects. The corresponding regions of the second sub-image and the preset image are compared in terms of the gray value according to the above scheme, and the regions without defects are determined. For the regions without defects determined by the comparison of the gray value, if there are units with the preliminary identification result of abnormality in the region according to the AOI, it is considered that the preliminary identification result of the units with the preliminary identification result of abnormality in the region according to the AOI is incorrect. The preliminary identification result of the units needs to be corrected. In this way, the units with incorrect preliminary identification result in the wafer that need to be corrected can be found out.

[0090] No matter whether the mode a or the mode b is adopted, the determination of the unit whose preliminary identification result needs to be corrected is based on the comparison result between the divided regions of the first sub-image and the second sub-image and the divided regions of the preset image, and the preliminary identification result of the unit included in each first region, so that the determination accuracy of the first type of units in the wafer can be ensured. Thus, the identification accuracy of each unit in the wafer being a qualified unit or an unqualified unit is improved, and the misidentification rate is reduced.

[0091] The first threshold value and the second threshold value are values flexibly set according to actual experience, and can be the same or different. For specific description of the foregoing mode one and mode two, refer to subsequent related description, which is not repeated here.

[0092] S402: According to the preset identification result, the preliminary identification result of the first type of units is corrected to obtain the target identification result of the first type of units.

[0093] In this step, the preset identification result is an identification result representing that a unit is a qualified unit. The erroneous preliminary identification result of the first type of units is adjusted to the preset identification result, and the preset identification result is taken as the target identification result of the first type of units.

[0094] S403: Based on the target identification result of the first type of units and the preliminary identification result of the second type of units other than the first type of units, the target identification result of each unit in the target image is obtained.

[0095] In this step, from the perspective of the preliminary identification result of each unit of the wafer by the AOI, each unit of the wafer includes two types. One type is the unit with correct preliminary identification result (the second type of unit). The other type is the unit with erroneous preliminary identification result that needs to be corrected (the first type of unit). The preset identification result of the first type of units and the preliminary identification result of the second type of units are collected to obtain the target identification result of each unit in the target image. That is, the target identification result of each unit in the target image includes the corrected result of the first type of units and the preliminary identification result of the second type of units.

[0096] In S401-S403, based on at least one target sub-image and a preset image, the unit whose preliminary identification result needs to be corrected is determined; according to the preset identification result, the preliminary identification result of the first type of units is corrected to obtain the target identification result of the first type of units; based on the target identification result of the first type of units and the preliminary identification result of the second type of units other than the first type of units, the target identification result of each unit in the target image is obtained. Through the correction of the preliminary identification result of the unit that needs to be corrected, the accurate identification result of the unit is obtained. Thus, the identification accuracy of each unit in the wafer being a qualified unit or an unqualified unit can be improved, and the misidentification is reduced.

[0097] In some embodiments, the method further comprises: outputting the target image; and / or outputting the target recognition result of each unit at a position corresponding to the unit on the target image. Wherein, the output of the target image and the target recognition result can realize the visualization of the target recognition result, and facilitate the relevant personnel to view the target recognition result. The ease of use is improved.

[0098] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings. Figure 5 The technical solutions of the present application will be described in detail below with reference to the accompanying drawings.

[0099] The data processing device in the present application is taken as a reticle (i.e. shot) filter system as an example for description.

[0100] In the Figure 5 In the Figure 5 From the preliminary recognition result shown in the figure, it can be seen that the AOI recognizes a certain Die as an abnormal Die, which can be because there is really an abnormality such as a collapse edge defect on the Die, so the preliminary recognition result of the Die is an abnormal Die. It can also be that the Die itself does not have a collapse edge defect, but because the Die is close to the test element, the test element is mistaken for a defect, and thus the AOI incorrectly recognizes the Die itself without a collapse edge defect as an abnormal Die.

[0101] The reticle filter system in the technical solution of the present application can correct the preliminary identification result of the AOI error identified as an abnormal Die. Specifically, the AOI generates a Klarf file based on the preliminary identification result of each Die in the wafer and the position of each Die in the wafer. The Klarf file records the preliminary identification result of each Die as a normal Die or an abnormal Die and the position of each Die. The AOI captures and records the image of each Die in the wafer, such as the image of the abnormal Die. The AOI sends the Klarf file and the recorded image of each Die to the reticle filter system. The reticle filter system splices the image of each Die according to the position of each Die in the wafer to form a target image for the wafer. It can be understood that if the target image of the wafer is spliced in proportion to the position of each Die, the target image is the same as the wafer scan image. The content recorded in the Klarf file and the image of each Die can be used as the first identification information of the present application.

[0102] In the present example, the exposure unit is taken as an example of 2 rows * 3 columns. The reticle filter system divides the target image according to the size of the exposure unit to obtain a plurality of target sub-images of the target image. Figure 5 The boxes 1, 2 and 3 in the figure show three target sub-images divided. Similar to the exposure unit including 2 rows * 3 columns of Dices, each sub-image includes 2 rows * 3 columns of Dices. It can be understood that because the photolithography pattern in the chip manufacturing process is a repetition of a plurality of exposure unit patterns, the pattern of the target image constructed is also a repetition of a plurality of exposure unit patterns. Each target sub-image is a repetition of an exposure unit pattern.

[0103] In the present application, the preset image is a standard image of 2 rows * 3 columns and no defects, which is the same size as the exposure unit. The 2 rows * 3 columns exposure unit without defects can be captured in advance and used as a standard image.

[0104] The coarse identification scheme or the fine identification scheme in the present application is used to identify the Die that needs to be identified for preliminary identification result correction, and to correct the preliminary identification result of the Die that needs to be corrected.

[0105] Referring to the aforementioned scheme a, each target sub-image is compared with the standard image for consistency. If a target sub-image, such as target sub-image 1, matches the standard image, and the preliminary AOI identification result indicates that target sub-image 1 includes a die with a preliminary identification result of anomalous, it means that the anomalousness of the die with a preliminary identification result in target sub-image 1 is caused by the test element. The preliminary AOI identification result for this die is incorrect. If a target sub-image, such as target sub-image 1, does not match the standard image, and the preliminary AOI identification result indicates that target sub-image 1 includes a die with a preliminary identification result of anomalous, it means that the anomalousness of the die with a preliminary identification result in target sub-image 1 is caused by edge chipping defects. The preliminary AOI identification result for this die is correct.

[0106] In scheme a, if a target sub-image and a standard image are inconsistent, and the preliminary identification result of AOI indicates that the target sub-image includes dies that are initially identified as abnormal, then it means that the abnormality of the die is caused by edge chipping defects. Such target sub-images are excluded, and there is no need to correct the preliminary identification result of the abnormal dies they contain.

[0107] The target sub-image that matches the standard image but has abnormal dies is regarded as the first sub-image (including sub-images with units that need to be corrected based on preliminary identification results).

[0108] assumed Figure 5 The image shown in box 3 is the first sub-image. The image in box 3 is divided into regions according to the size of the die. Because the size of the image shown in box 3 is the same as the size of the exposure unit (M=2, N=3), dividing the image in box 3 into regions according to the size of the die results in 2*3=6 (M*N) first regions. The standard image is also pre-divided into regions according to the size of the die, resulting in 2*3=6 (M*N) second regions. The size of both the first and second regions is the same as the size of a single die.

[0109] Combination Figure 6 As shown, assuming the image in box 3 is divided into regions, we get 6 sub-regions: 101, 102, 103, 201, 202, and 203. Dividing the standard image into regions yields the following results: Figure 3 The sub-regions shown are 11, 12, 13, 21, 22, and 23. Among them, the first region 101 corresponds to the second region 11. The first region 102 corresponds to the second region 12… The first region 203 corresponds to the second region 23.

[0110] The corresponding regions of the two images (the first sub-image and the preset image) are compared in terms of gray scale values. If the gray scale value of region 101 is less than the first threshold value than the gray scale value of region 11 of the preset image, and the gray scale value of region 103 is less than the first threshold value than the gray scale value of region 13 of the preset image, it is considered that regions 101 and 103 are regions without defects. However, if the AOI gives that there are Dies with preliminary identification results of abnormality in regions 101 and 103, the reticle filter system considers that the preliminary identification results of abnormality of the Dies in regions 101 and 103 given by the AOI are wrong. The reticle filter system considers the Dies in regions 101 and 103 as the first type of units in the wafer.

[0111] Referring to the above-mentioned solution b, in each target sub-image, a sub-image including units with preliminary identification results of abnormality is screened out as a second sub-image. For example, the image of the middle frame 3 is screened out as the second sub-image. The division of regions of the second sub-image and the division of regions of the standard image refer to the above-mentioned related descriptions of the division of regions of the first sub-image and the standard image, and are not described herein. Figure 5 Figure 6 and Figure 3 are not described herein.

[0112] The corresponding regions of the two images (the second sub-image and the preset image) are compared in terms of gray scale values. If the gray scale value of region 101 is less than the second threshold value than the gray scale value of region 11 of the preset image, and the gray scale value of region 103 is less than the second threshold value than the gray scale value of region 13 of the preset image, it is considered that regions 101 and 103 are regions without defects. However, if the AOI gives that there are Dies with preliminary identification results of abnormality in regions 101 and 103, the reticle filter system considers that the preliminary identification results of abnormality of the Dies in regions 101 and 103 given by the AOI are wrong. The reticle filter system considers the Dies in regions 101 and 103 as the first type of units in the wafer.

[0113] In solution b, if the gray scale value of a region of the second sub-image is greater than or equal to the second threshold value, it is considered that the region is a region with defects. And the AOI gives that there are Dies with preliminary identification results of abnormality in the region, which indicates that the abnormality of the Dies is caused by the edge collapse defect. Such Dies can be excluded and do not need to be corrected.

[0114] ​In practical application, the division of the first sub-image, the second sub-image and the region of the exposure unit can be a division according to the pixcel of the image. Based on the comparison of the gray value of the corresponding pixcel in the two images (the first sub-image and the preset image, or the second sub-image and the preset image), the identification of the first type unit in the wafer is realized.

[0115] The two aforementioned Die identification schemes for correcting the preliminary identification result in the wafer are easy to implement in engineering, have high feasibility, and can ensure the identification accuracy of the first type unit in the wafer.

[0116] For the preliminary identification result of the Die, the identification result is adjusted from the erroneous identification result to the identification result that the Die is a qualified Die, so as to correct the erroneous preliminary identification result. As shown in the target image, the fourth column and the sixth column in the third row are corrected from the letter B representing abnormality or unqualification to the letter A representing normality or qualification. Thus, the correction of the preliminary identification result of all the units in the first type unit in the wafer can be realized. Figure 5

[0117] It should be noted that the correction in the present application is the preliminary identification result of the AOI that misidentifies the test element as a defect and identifies the Die as an abnormal Die. The preliminary identification result of the Die with the edge collapse defect does not need to be corrected and is excluded.

[0118] In the target image, the corrected identification result of the first type unit and the preliminary identification result of the second type unit in the wafer except the first type unit can be marked in the respective positions of the units. The reticle filter system outputs the target image marked with the above identification result as a Map image and imports it into the AOI.

[0119] The AOI takes the target identification result of each unit in the Map image as the correction result of the preliminary identification result of the AOI, so as to enable the AOI to give a more accurate identification result for the defect detection of the wafer.

[0120] It can be understood that the information in the Map image represents whether each Die in the wafer is a qualified Die or an unqualified Die. The display of the Map image allows relevant personnel to directly see which is a good Die and which is a bad Die. This facilitates the selection of good Dies and the removal of bad Dies by relevant personnel.

[0121] In a popular way, in the present application, the reticle filter system can enable the AOI to correct the Bad Die identified by mistakenly grabbing the Test Key on the cutting path as a defect to a Good Die, thereby avoiding the mistaken grabbing caused by the Test Key.

[0122] ​The application also provides a data processing apparatus, such as Figure 7 as shown in the figure, the apparatus comprises:

[0123] An obtaining unit 701 is configured to obtain first identification information, which comprises a preliminary identification result of each unit of a wafer being a normal unit or an abnormal unit, position information of each unit, and an image of each unit obtained based on a wafer scanning image;

[0124] A constructing unit 702 is configured to construct a target image of the wafer based on the position information of each unit and the image of each unit.

[0125] A dividing unit 703 is configured to divide the target image to obtain at least one target sub-image, each target sub-image corresponding to P units of the wafer, P being a positive integer greater than 1.

[0126] A correcting unit 704 is configured to correct the preliminary identification result of at least part of the units based on the at least one target sub-image and a preset image, to obtain a target identification result of each unit in the target image.

[0127] In some embodiments, the dividing unit 703 is configured to divide the target image according to the attribute of the exposure unit of the wafer to obtain at least one target sub-image, each target sub-image corresponding to M*N units of the wafer, M*N=P, M and N being positive integers greater than 1.

[0128] In some embodiments, the correcting unit 704 is configured to determine a first type of unit in each unit based on the at least one target sub-image and the preset image, the first type of unit being a unit in each unit that needs to have the preliminary identification result corrected.

[0129] The preliminary identification result of the first type of unit is corrected according to a preset identification result to obtain a target identification result of the first type of unit.

[0130] The target identification result of each unit in the target image is obtained based on the target identification result of the first type of unit and the preliminary identification result of a second type of unit in each unit other than the first type of unit.

[0131] In some embodiments, the correcting unit 704 is configured to determine a first sub-image based on the comparison result of each target sub-image in the at least one target sub-image with the preset image and the preliminary identification result of each unit included in each target sub-image, the first sub-image being a sub-image in the at least one target sub-image that includes a unit whose preliminary identification result needs to be corrected.

[0132] The first sub-image is regionally divided to obtain a plurality of first regions.

[0133] The first type of unit is determined from each unit based on the preliminary identification result of each unit and the result of the comparison between the plurality of first regions and the plurality of second regions in the preset image.

[0134] In some embodiments, the correction unit 704 is configured to filter a second sub-image from the at least one target sub-image based on the preliminary identification result of each unit, the second sub-image being a sub-image including units with preliminary identification results being abnormal.

[0135] The second sub-image is regionally divided to obtain a plurality of third regions.

[0136] The first type of unit is determined from each unit based on the preliminary identification result of each unit and the result of the comparison between the plurality of first regions and the plurality of second regions in the preset image.

[0137] In some embodiments, the apparatus further includes an output unit configured to output the target image and / or output the target identification result of each unit at a position corresponding to each unit on the target image.

[0138] It should be noted that the data processing apparatus of the embodiments of the present application has similar principles to the data processing method described above, and therefore, the implementation process and implementation principles of the data processing apparatus can be described with reference to the implementation process and implementation principles of the method described above, and the repeated parts will not be described herein.

[0139] According to the embodiments of the present application, the present application further provides an electronic device and a readable storage medium.

[0140] Figure 8 A schematic block diagram of an example electronic device 800 that can be used to implement embodiments of the present application is shown. The electronic device is intended to represent various forms of digital computers, such as laptops, desktops, tablets, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular telephones, smartphones, wearable devices, and other similar computing devices. The components shown here, their connections and relationships, and their functions, are meant to be examples only, and are not intended to limit the implementations of the present application described and / or claimed in this document.

[0141] As Figure 8As shown, the device 800 includes a computing unit 801 that can perform various appropriate actions and processes in accordance with a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other through a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0142] A plurality of components in the device 800 are connected to the I / O interface 805, including an input unit 806 such as a keyboard, a mouse, etc., an output unit 807 such as various types of displays, speakers, etc., a storage unit 808 such as a magnetic disk, an optical disk, etc., and a communication unit 809 such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the device 800 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0143] The computing unit 801 can be various general and / or special-purpose processing components having processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The computing unit 801 performs various methods and processes described above, such as the data processing method. For example, in some embodiments, the data processing method can be implemented as a computer software program that is tangibly embodied in a machine-readable medium, such as the storage unit 808. In some embodiments, part or all of the computer program can be loaded and / or installed on the device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the data processing method described above can be performed. Alternatively, in other embodiments, the computing unit 801 can be configured to perform the data processing method by any other appropriate means, such as by means of firmware.

[0144] The various embodiments of the systems and techniques described above can be implemented in digital electronic circuitry, integrated circuitry, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on a chip (SOC), a load programmable logic device (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include implementation in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.

[0145] Program code for carrying out methods of the present application can be written in any combination of one or more programming languages. This program code can be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the program code, when executed by the processor or controller, produces a means for implementing the functions / acts specified in the flowcharts and / or block diagrams. The program code can be executed entirely on a machine, partially on a machine, partially on a machine as a stand-alone software package, or entirely on a remote machine or server.

[0146] In the context of the present application, a machine-readable medium can be a tangible medium that contains or stores a program for use by or in connection with an instruction execution system, apparatus, or device. The machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include but is not limited to an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of the machine-readable storage medium will include one or more lines of electrical connections, portable computer disks, hard disk drives, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash memory), optical fibers, portable compact disc read-only memories (CD-ROMs), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0147] To provide for interaction with a user, the systems and techniques described here can be implemented on a computer having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0148] The systems and techniques described here can be implemented in a computing system that includes a back end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front end component (e.g., a user computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0149] The computer system can include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0150] It should be understood that various forms of flow shown above can be used, re-ordered, added to, or deleted from without departing from the spirit of the present disclosure. For example, the steps recited in the present disclosure can be executed in parallel, in series, or in a different order, as long as the desired results of the technical solutions of the present disclosure are achieved, and the present disclosure is not limited herein.

[0151] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A data processing method, characterized by, The method comprises the following steps: obtaining first identification information, the first identification information comprising a preliminary identification result of each unit of a wafer being a normal unit or an abnormal unit, position information of each unit, and an image of each unit obtained based on a wafer scanning image; constructing a target image of the wafer based on the position information of each unit and the image of each unit; dividing the target image to obtain at least one target sub-image, each target sub-image corresponding to P units of the wafer, P being a positive integer greater than 1; correcting the preliminary identification result of at least part of the units based on the at least one target sub-image and a preset image to obtain a target identification result of each unit in the target image; the step of correcting the preliminary identification result of at least part of the units based on the at least one target sub-image and the preset image to obtain the target identification result of each unit in the target image comprises the following steps: determining a first type of unit from the units based on the at least one target sub-image and the preset image, the first type of unit being a unit with an erroneous preliminary identification result; adjusting the preliminary identification result of the first type of unit to a preset identification result, and taking the preset identification result as the target identification result of the first type of unit; the preset identification result is an identification result indicating that a unit is a qualified unit; obtaining the target identification result of each unit in the target image based on the target identification result of the first type of unit and a preliminary identification result of a second type of unit other than the first type of unit.

2. The method of claim 1, wherein, the step of dividing the target image to obtain at least one target sub-image comprises the following step: dividing the target image according to the properties of the exposure units of the wafer to obtain at least one target sub-image, each target sub-image corresponding to M*N units of the wafer, M*N=P, M and N being positive integers greater than 1.

3. The method of claim 1, wherein, the step of determining the first type of unit from the units based on the at least one target sub-image and the preset image comprises the following steps: determining a first sub-image based on the comparison results of each target sub-image in the at least one target sub-image with the preset image and the preliminary identification results of the units included in each target sub-image, the first sub-image being a sub-image in which the comparison result with the preset image is consistent but which includes a unit with an abnormal preliminary identification result; regionally dividing the first sub-image to obtain a plurality of first regions; determining the first type of unit from the units based on the comparison results of the plurality of first regions with a plurality of second regions in the preset image and the preliminary identification results of the units included in each first region.

4. The method of claim 1, wherein, the step of determining the first type of unit from the units based on the at least one target sub-image and the preset image comprises the following steps: screening a second sub-image from the at least one target sub-image based on the preliminary identification results of the units, the second sub-image being a sub-image including a unit with an abnormal preliminary identification result; regionally dividing the second sub-image to obtain a plurality of third regions; determining the first type of unit from the units based on the comparison results of the plurality of third regions with a plurality of second regions in the preset image and the preliminary identification results of the units included in each third region.

5. The method according to claim 1 or 2, characterized in that, The method further comprises the following steps: outputting the target image. And / or, outputting the target recognition result of each unit at a position corresponding to each unit on the target image.

6. The method of claim 1 or 2, wherein, The preliminary recognition result is obtained by analyzing a wafer scanning image obtained by scanning each unit on the wafer in a unit scanning manner.

7. A data processing apparatus, characterized by, Comprise: An obtaining unit configured to obtain first identification information, the first identification information comprising a preliminary recognition result of each unit of a wafer obtained based on a wafer scanning image, information of a position of each unit, and an image of each unit; A constructing unit configured to construct a target image of the wafer based on the information of the position of each unit and the image of each unit; A dividing unit configured to divide the target image to obtain at least one target sub-image, each target sub-image corresponding to P units of the wafer, P being a positive integer greater than 1; A correcting unit configured to correct the preliminary recognition result of at least part of the units based on the at least one target sub-image and a preset image, to obtain a target recognition result of each unit in the target image; The correcting unit is configured to determine a first type of unit in each unit based on the at least one target sub-image and the preset image, the first type of unit being a unit with an incorrect preliminary recognition result; Adjusting the preliminary recognition result of the first type of unit to a preset recognition result, and taking the preset recognition result as the target recognition result of the first type of unit; The preset recognition result is a recognition result indicating that the unit is a qualified unit; and based on the target recognition result of the first type of unit and a preliminary recognition result of a second type of unit other than the first type of unit, a target recognition result of each unit in the target image is obtained.

8. An electronic device, comprising: Comprise: At least one processor; And A memory in communication connection with the at least one processor; wherein The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method of any one of claims 1-6.

9. A non-transitory computer-readable storage medium having stored thereon computer instructions, wherein, The computer instructions are used to enable the computer to execute the method of any one of claims 1-6.

Images