Chip moving device

Abstract

This invention provides a chip moving device, relating to the field of chip testing technology. The chip moving device includes a base, an adsorption element, and a clamping assembly. The base has a mounting portion with an end face and an assembly cavity extending horizontally and penetrating the end face. A limiting assembly is provided on the end face. The adsorption element extends vertically and is limited by the limiting assembly. The clamping assembly is disposed within the assembly cavity and extends one end beyond the end face of the mounting portion. The clamping assembly is configured to be horizontally retractable, and when extended or retracted, it can provide a horizontal clamping force to the adsorption element. This technical solution, through the design of the clamping assembly, provides a horizontal clamping force to the adsorption element for secure engagement, without generating a vertical component force, thus preventing damage to the test chip. Furthermore, the clamping assembly can achieve engagement and disengagement with the adsorption element through retraction, offering flexibility and convenience for replacing the adsorption element.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a chip moving device. Background Technology

[0002] In the semiconductor industry, chip testing and placement are essential key processes in chip manufacturing. The chip testing and placement process requires chip handling and high-precision placement, which necessitates the use of placement machines and testing machines. The placement adsorption mechanism, as the component in the placement machine and testing machine that directly contacts the chip, plays a crucial role in the equipment.

[0003] In existing chip testing machines, the chip mounting structure uses magnetic adsorption. When the adsorbed component moves significantly along the Z-axis, the magnet remains stationary. When the adsorbed component moves a large distance along the Z-axis, the magnetic adsorption force will form an angle with the horizontal direction. At this time, a component of the adsorption force will act in the vertical direction of the adsorbed component, which will increase the chip picking and placing pressure of the adsorbed component's nozzle. This will create a risk of damaging the chip surface and causing chip damage. Summary of the Invention

[0004] The purpose of this invention is to provide a chip moving device that solves the technical problem in the prior art where the nonlinear increase in axial pressure of the adsorption element increases the risk of chip damage during chip pick-up.

[0005] According to the purpose of this invention, a chip moving device is provided, comprising:

[0006] The base has a mounting portion having an end face and an assembly cavity extending horizontally and penetrating the end face, the end face being provided with a limiting component;

[0007] The adsorption element extends vertically and is limited by the limiting component;

[0008] A clamping assembly is disposed within the assembly cavity and extends one end out of the end face of the mounting portion. The clamping assembly is configured to be telescopically extendable in the horizontal direction and, when extended or retracted, to provide a clamping force in the horizontal direction to the adsorption member.

[0009] Optionally, the clamping assembly includes a clamping portion located on the side of the adsorption member away from the mounting portion.

[0010] Optionally, the clamping assembly includes a clamping portion located on one side of the adsorption member near the end face of the mounting portion.

[0011] Optionally, the clamping part is a claw, which is configured to engage with the adsorption element to clamp the adsorption element.

[0012] Optionally, the clamping part is a bearing, and the outer peripheral surface of the bearing abuts against the adsorption element, thereby clamping the adsorption element.

[0013] Optionally, the clamping assembly further includes:

[0014] A sliding part is disposed within the assembly cavity and is capable of sliding along the assembly cavity;

[0015] An elastic element is connected at one end to the sliding part and at the other end to the mounting part to allow the clamping assembly to extend and retract in the horizontal direction.

[0016] Optionally, the clamping assembly further includes an extension extending out of the end face of the mounting portion, the extension, the clamping portion, and the sliding portion together defining a through hole through which the suction member passes.

[0017] Optionally, the extension has a first portion and a second portion extending along the horizontal direction and arranged opposite to each other, the first portion and the second portion being connected by a pivot, and the snap-fit ​​member being disposed at the pivot.

[0018] Optionally, the clamping assembly further includes an extension extending out of the end face of the mounting portion, the extension, the clamping portion, and the sliding portion together defining a groove to limit the adsorption member within the groove and allow the adsorption member to disengage from the extension from the opening of the groove.

[0019] Optionally, the sliding part has a first mounting cavity extending in a horizontal direction, and a first mounting member is provided in the first mounting cavity;

[0020] The mounting part is further provided with a second mounting cavity extending along the horizontal direction and communicating with the assembly cavity. The second mounting cavity is provided with at least one second mounting member. The two ends of the elastic member are respectively connected to the first mounting member and one of the second mounting members.

[0021] The chip moving device of this invention includes a base, an adsorption element, and a clamping assembly. The base has a mounting portion with an end face and an assembly cavity extending horizontally and penetrating the end face. A limiting assembly is provided on the end face. The adsorption element extends vertically and is limited by the limiting assembly. The clamping assembly is disposed within the assembly cavity and extends one end beyond the end face of the mounting portion. The clamping assembly is configured to be horizontally retractable and provides a horizontal clamping force to the adsorption element when extended or retracted. This technical solution, through the design of the clamping assembly, provides a horizontal clamping force to the adsorption element for secure engagement, without generating a vertical force component, thus preventing damage to the test chip. Furthermore, the clamping assembly can achieve engagement and disengagement with the adsorption element through extension and retraction, offering flexibility and convenience for replacing the adsorption element.

[0022] Furthermore, in this invention, the clamping part is a bearing, and the outer peripheral surface of the bearing abuts against the adsorption component, thereby clamping the adsorption component. In the above technical solution, when the adsorption component moves vertically, the bearing rotates, thus clamping the adsorption component without affecting its movement.

[0023] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0024] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0025] Figure 1 This is a schematic structural diagram of a chip moving device according to an embodiment of the present invention;

[0026] Figure 2 yes Figure 1 A schematic installation diagram of the base and clamping assembly in the chip moving device shown;

[0027] Figure 3 yes Figure 1 A schematic structural diagram of the clamping component in the chip moving device shown;

[0028] Figure 4 This is a schematic cross-sectional view of a chip moving device according to an embodiment of the present invention;

[0029] Figure 5 This is a schematic structural diagram of a chip moving device according to another embodiment of the present invention;

[0030] Figure 6 yes Figure 5 A schematic structural diagram of the clamping component in the chip moving device shown;

[0031] Figure 7 This is a schematic cross-sectional view of a chip moving device according to another embodiment of the present invention.

[0032] Figure label:

[0033] 100-Chip moving device, 10-Adsorption component, 20-Test chip, 30-Base, 40-Clamping assembly, 31-Mounting part, 32-Limiting assembly, 33-End face, 34-Assembly cavity, 35-Second mounting cavity, 36-Second mounting component, 41-Clamping part, 42-Extension part, 43-Sliding part, 44-Rotating shaft, 45-Elastic component, 46-First mounting cavity, 47-First mounting component, 421-First part, 422-Second part. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0036] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0037] Unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0039] Example 1:

[0040] Figure 1 This is a schematic structural diagram of a chip moving device 100 according to an embodiment of the present invention. Figure 2 yes Figure 1 The diagram shows a schematic installation of the base 30 and the clamping assembly 40 in the chip moving device 100. Figure 3 yes Figure 1 A schematic structural diagram of the clamping assembly 40 in the chip moving device 100 shown. Figures 1 to 3 As shown, in one specific embodiment, the chip moving device 100 includes a base 30, an adsorption member 10, and a clamping assembly 40. The base 30 has a mounting portion 31, which has an end face 33 and an assembly cavity 34 extending horizontally and penetrating the end face 33. A limiting assembly 32 is provided on the end face 33. The adsorption member 10 extends vertically and is limited by the limiting assembly 32. The clamping assembly 40 is disposed within the assembly cavity 34 and extends one end beyond the end face 33 of the mounting portion 31. The clamping assembly 40 is configured to be horizontally retractable and, when extended or retracted, can provide a horizontal clamping force to the adsorption member 10. Here, the test chip 20 is located at the bottom of the adsorption member 10.

[0041] This embodiment, by designing the clamping component 40, can provide a horizontal clamping force to the adsorption component 10 to clamp the adsorption component 10 without generating a vertical component force, thus preventing damage to the test chip 20; on the other hand, the clamping component 40 can achieve clamping and separation with the adsorption component 10 through telescopic means, which is more flexible and provides convenience for replacing the adsorption component 10.

[0042] In this embodiment, the clamping assembly 40 includes a clamping portion 41, which is located on the side of the adsorption member 10 away from the end face 33 of the mounting portion 31. It can be understood that the clamping portion 41 is disposed on the front side of the adsorption member 10, and the adsorption member 10 is located between the clamping portion 41 and the mounting portion 31.

[0043] In this embodiment, the clamping part 41 is a bearing, and the outer peripheral surface of the bearing abuts against the adsorption member 10, thereby clamping the adsorption member 10. When installing the adsorption member 10, the clamping assembly 40 is first pulled outward, so that the clamping assembly 40 is in the extended state. Then, the limiting assembly 32 is used to limit the adsorption member 10 at the end face 33 of the mounting part 31. Finally, the clamping assembly 40 is released, so that the clamping assembly 40 is in the retracted state, and the clamping part 41 abuts against the adsorption member 10, thereby clamping the adsorption member 10. In this embodiment, when the adsorption member 10 moves in the vertical direction, the bearing can roll, which can achieve the purpose of clamping the adsorption member 10 without affecting the up and down movement of the adsorption member 10. In other embodiments, the clamping part 41 can also be configured as a claw. The claw is in the open state when the clamping assembly 40 is in the extended state and in the retracted state when the clamping assembly 40 is in the retracted state, thereby clamping the adsorption member 10.

[0044] Figure 4 This is a schematic cross-sectional view of a chip moving device 100 according to an embodiment of the present invention. Figure 4 As shown, and see Figures 1 to 3 In this embodiment, the clamping assembly 40 further includes a sliding portion 43 and an elastic member 45. The sliding portion 43 is disposed in the assembly cavity 34 and can slide along the assembly cavity 34. The extension portion 42 is formed by extending outward from the side of the sliding portion 43 near the end face 33 of the mounting portion 31. The elastic member 45 is disposed on the side of the sliding portion 43 away from the end face 33 of the mounting portion 31. One end of the elastic member 45 is connected to the sliding portion 43 and the other end is connected to the mounting portion 31 to allow the clamping assembly 40 to extend and retract in the horizontal direction.

[0045] In this embodiment, the clamping assembly 40 further includes an extension 42 extending from the end face 33 of the mounting portion 31. The extension 42, the clamping portion 41, and the sliding portion 43 together define a groove to limit the adsorption member 10 within the groove and allow the adsorption member 10 to disengage from the opening of the groove from the extension 42.

[0046] In this embodiment, when the adsorption element 10 needs to be replaced, simply pull the clamping assembly 40 to separate the clamping part 41 from the adsorption element 10, and then remove the adsorption element 10 from the opening of the groove to separate it from the base 30, that is, remove it from the side of the clamping assembly 40. Disassembly is relatively convenient and allows the adsorption element 10 to be replaced quickly.

[0047] In this embodiment, the sliding part 43 has a first mounting cavity 46 extending horizontally inside, and a first mounting member 47 is disposed within the first mounting cavity 46. The mounting part 31 also has a second mounting cavity 35 extending horizontally and communicating with the assembly cavity 34. At least one second mounting member 36 is disposed within the second mounting cavity 35. The two ends of the elastic member 45 are respectively connected to the first mounting member 47 and one of the second mounting members 36. Here, the elastic member 45 is a spring, the first mounting member 47 is rod-shaped and extends in a direction perpendicular to the horizontal direction, both ends of the first mounting member 47 are connected to the sliding part 43, and one end of the spring is hooked onto the first mounting member 47. In this embodiment, there are multiple second mounting members 36, which are arranged spaced apart horizontally. The second mounting members 36 are also rod-shaped and extend in the same direction as the first mounting member 47. The spring hook is attached to one of the multiple second mounting members 36. In this embodiment, by setting multiple second mounting parts 36, the elastic element 45 can be hooked onto one of the second mounting parts 36 according to specific design requirements. Specifically, the selection can be based on the displacement required by the clamping assembly 40 and the elastic performance of the elastic element 45.

[0048] In this embodiment, the limiting component 32 includes at least one pair of limiting parts, each pair of limiting parts including two oppositely arranged bearings. The two bearings of each pair of limiting parts together limit the adsorption member 10, thereby limiting the adsorption member 10 at the end face 33 of the mounting part 31. In this embodiment, the limiting component 32 includes two pairs of limiting parts, which are arranged vertically at intervals, and the clamping component 40 is located between the two pairs of limiting parts. It can be understood that one pair of limiting parts is located near the top of the end face 33 of the mounting part 31, and the other pair of limiting parts is located near the bottom of the end face 33 of the mounting part 31. This embodiment is equivalent to clamping the adsorption member 10 at the upper, middle, and lower positions, thereby improving the stability of the adsorption member 10 installation.

[0049] This embodiment eliminates the use of magnets to adsorb the adsorbent 10 and instead uses a more stable telescopic stretching method to snap the adsorbent 10 together. This ensures that the pressure of the adsorbent 10 in the vertical direction is not affected by the tension in the horizontal direction, and the adsorbent 10 can maintain a stable pick-and-place pressure for a long time, so as not to damage the test chip 20.

[0050] Example 2:

[0051] The only difference between Example 2 and Example 1 is that:

[0052] Figure 5 This is a schematic structural diagram of a chip moving device 100 according to another embodiment of the present invention. Figure 6 yes Figure 5The schematic structural diagram of the clamping assembly 40 in the chip moving device 100 shown is as follows. Figure 7 This is a schematic cross-sectional view of a chip moving device 100 according to another embodiment of the present invention. Figures 5 to 7 As shown, in this embodiment, the clamping assembly 40 further includes an extension 42 extending from the end face 33 of the mounting portion 31. The extension 42, the clamping portion 41, and the sliding portion 43 together define a through hole through which the adsorbent 10 passes. Specifically, when clamping the adsorbent 10, the clamping assembly 40 is first stretched to the extended state, then the adsorbent 10 is passed through the through hole in the vertical direction, and finally the clamping assembly 40 is released so that the clamping portion 41 abuts against the adsorbent 10, thereby clamping the adsorbent 10.

[0053] In this embodiment, the extension 42 has a first portion 421 and a second portion 422 that extend horizontally and are arranged opposite to each other. The first portion 421 and the second portion 422 are connected by a pivot 44, and a snap-fit ​​member is provided at the pivot 44. See details below. Figure 6 Here, both the first part 421 and the second part 422 are formed by the sliding member extending outward from the side of the end face 33 near the mounting part 31.

[0054] Example 3:

[0055] The only difference between Example 3 and Example 1 is that:

[0056] The clamping assembly 40 includes a clamping part 41, which is located on the side of the adsorption member 10 near the end face 33 of the mounting part 31. That is, the adsorption member 10 is located on the outermost side, and the clamping part 41 is located between the adsorption member 10 and the end face 33 of the mounting part 31.

[0057] In this embodiment, the clamping part 41 is a claw, which is configured to engage with the adsorbent 10, thereby clamping the adsorbent 10. Specifically, when engaging the adsorbent 10, the clamping assembly 40 is first stretched to the extended position, at which point the claw is in the open state. When the claw grasps the adsorbent 10, it switches to the retracted state, thereby engaging the adsorbent 10. After the claw engages with the adsorbent 10, the clamping assembly 40 is released, thereby engaging the adsorbent 10 at the end face 33 of the mounting part 31. Here, the claw can be made of Teflon or polyoxymethylene (POM) and other low-friction engineering plastics to avoid damaging the adsorbent 10.

[0058] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A chip-moving device, characterized in that, include: The base has a mounting portion having an end face and an assembly cavity extending horizontally and penetrating the end face, the end face being provided with a limiting component; The adsorption element extends vertically and is limited by the limiting component; A clamping assembly is disposed within the assembly cavity and extends one end out of the end face of the mounting portion. The clamping assembly is configured to be telescopically extendable in the horizontal direction and, when extended or retracted, can provide a clamping force in the horizontal direction to the adsorption member. The clamping assembly includes: A sliding part is disposed within the assembly cavity and is capable of sliding along the assembly cavity; An elastic element, with one end connected to the sliding part and the other end connected to the mounting part, allows the clamping assembly to extend and retract along the horizontal direction, thereby achieving clamping or separation from the adsorption element.

2. The chip moving device according to claim 1, characterized in that, The clamping assembly includes a clamping part located on the side of the adsorption member away from the mounting part.

3. The chip moving device according to claim 1, characterized in that, The clamping assembly includes a clamping part located on one side of the adsorption member near the end face of the mounting part.

4. The chip moving device according to claim 2 or 3, characterized in that, The clamping part is a claw, which is configured to engage with the adsorption element to clamp the adsorption element.

5. The chip moving device according to claim 2, characterized in that, The clamping part is a bearing, and the outer peripheral surface of the bearing abuts against the adsorption element, thereby clamping the adsorption element.

6. The chip moving device according to claim 2, characterized in that, The clamping assembly further includes an extension extending from the end face of the mounting portion, the extension, the clamping portion, and the sliding portion together defining a through hole through which the adsorption member passes.

7. The chip moving device according to claim 6, characterized in that, The extension has a first part and a second part that extend along the horizontal direction and are arranged opposite to each other. The first part and the second part are connected by a pivot, and a snap-fit ​​element is provided at the pivot.

8. The chip moving device according to claim 2, characterized in that, The clamping assembly further includes an extension extending out of the end face of the mounting portion. The extension, the clamping portion, and the sliding portion together define a groove to confine the adsorption member within the groove and allow the adsorption member to disengage from the extension from the opening of the groove.

9. The chip moving device according to claim 1, characterized in that, The sliding part has a first mounting cavity extending horizontally inside, and a first mounting member is provided inside the first mounting cavity; The mounting part is further provided with a second mounting cavity extending along the horizontal direction and communicating with the assembly cavity. The second mounting cavity is provided with at least one second mounting member. The two ends of the elastic member are respectively connected to the first mounting member and one of the second mounting members.

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