Laser system

Abstract

The application discloses a laser system, and belongs to the technical field of photoelectricity. The laser system comprises a metal base plate, a frame, a light-emitting chip and a conductive structure. The inner wall of the frame is fixed to the side surface of the metal base plate, and the end surface of the frame at one end in the axial direction is flush with the first plate surface of the metal base plate. The light-emitting chip is located on the second plate surface of the metal base plate opposite to the first plate surface and is surrounded by the frame. The conductive structure is embedded in the frame, the first end of the conductive structure is located in the surrounding area of the frame and is electrically connected to the light-emitting chip, and the second end is located on the end surface. The edge of the first plate surface of the base plate close to the frame has a clearance groove for spacing the second end from the first plate surface. The laser is located on a circuit board, and the base plate is close to the circuit board. The circuit board has a solder pad connected to a power supply, and the second end of the conductive structure covers the solder pad and is electrically connected to the solder pad. The application solves the problem that the electrical connection between the laser and the circuit board is relatively complex. The application is used for light emission.

Description

[0001] This application claims priority to Chinese Patent Application No. 202211732590.8, filed on December 30, 2022, entitled "Laser System", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of optoelectronic technology, and in particular to a laser system. Background Technology

[0003] With the development of optoelectronic technology, lasers are widely used, and the requirements for lasers in all aspects are becoming increasingly higher.

[0004] In related technologies, a laser is electrically connected to a circuit board, which supplies power to the laser. The laser includes: a base plate, a package fixed to the base plate, and a light-emitting chip located within the package. The base plate has circuitry connected to the circuit board, and the package contains a conductive structure. The light-emitting chip is connected to the circuitry on the base plate via the conductive structure in the package, allowing current to be transmitted to the chip via the circuit board, the circuitry, and the conductive structure, thus causing the chip to emit light.

[0005] However, the process of setting up this circuit on the circuit board in related technologies is quite complex, so the process of realizing the electrical connection between the laser and the circuit board is also quite complex. Summary of the Invention

[0006] This application provides a laser system that solves the problem of the complexity in achieving the electrical connection between a laser and a circuit board. The laser system includes: a laser and a circuit board;

[0007] The laser includes: a metal base plate, a frame, a light-emitting chip, and a conductive structure; the inner wall of the frame is fixed to the side of the metal base plate, and one end face of the frame is flush with the first surface of the metal base plate in the axial direction; the light-emitting chip is located on a second surface of the metal base plate opposite to the first surface and is surrounded by the frame; the conductive structure is embedded in the frame, with its first end located within the enclosed area of ​​the frame and electrically connected to the light-emitting chip, and its second end located on the end face; the first surface of the metal base plate has a clearance groove near the edge of the frame, the clearance groove being used to separate the second end from the first surface;

[0008] The laser is located on the circuit board, and the metal base plate is close to the circuit board; the circuit board has pads connected to a power source, and the second end of the conductive structure covers the pads and is electrically connected to the pads.

[0009] The beneficial effects of the technical solution provided in this application include at least the following:

[0010] In the laser system provided in this application, the inner wall of the frame is fixed to the side of the metal base plate, and the axial end face of the frame is flush with the first surface of the metal base plate. A conductive structure is embedded in the frame. The first end of the conductive structure is located within the enclosed area of ​​the frame and is electrically connected to the light-emitting chip. The second end is located on the end face of the frame, and this second end can directly cover and be electrically connected to the pads in the circuit board. This allows current to be transmitted to the light-emitting chip through the circuit board and the conductive structure. Thus, when electrically connecting the laser to the circuit board, it is only necessary to directly fix and electrically connect the second end of the conductive structure in the laser to the pads, simplifying the electrical connection method between the laser and the circuit board.

[0011] Furthermore, the first surface of the metal base plate has an anti-cavity groove near the edge of the frame. This anti-cavity groove can prevent solder from flowing from the second end of the conductive structure to the metal base plate, thus avoiding mis-conduction between the conductive structure and the metal base plate, and thereby avoiding the impact of such mis-conduction on the light-emitting effect of the light-emitting chip. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of a laser system provided in related technologies;

[0014] Figure 2 This is a schematic diagram of the structure of a laser system provided in an embodiment of this application;

[0015] Figure 3 This is a schematic diagram of another laser system provided in an embodiment of this application;

[0016] Figure 4 This is a schematic diagram of the structure of a laser provided in an embodiment of this application;

[0017] Figure 5 This is a schematic diagram of another laser structure provided in an embodiment of this application;

[0018] Figure 6 This is a schematic diagram of another laser structure provided in the embodiments of this application;

[0019] Figure 7 This is a schematic diagram of another laser system provided in the embodiments of this application;

[0020] Figure 8 This is a schematic diagram of another laser structure provided in the embodiments of this application;

[0021] Figure 9 This is a schematic diagram of the structure of a frame provided in an embodiment of this application;

[0022] Figure 10 This is a schematic diagram of the structure of a laser provided in another embodiment of this application;

[0023] Figure 11 This is a schematic diagram of a conductive structure provided in an embodiment of this application;

[0024] Figure 12 This is a schematic diagram of another laser provided in another embodiment of this application;

[0025] Figure 13 This is a schematic diagram of the structure of another laser system provided in the embodiments of this application;

[0026] Figure 14 This is a schematic diagram of a laser system provided in another embodiment of this application. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0028] With the development of optoelectronic technology, lasers are being used more and more widely, and the requirements for the ease of laser fabrication and connection with other devices are also increasing. Lasers need to be connected to circuit boards to transmit current to the laser, exciting the light-emitting chip within the laser to emit laser light. Figure 1 This is a structural schematic diagram of a laser system provided by related technologies. For example... Figure 1 As shown, the laser system includes a laser 00 and a circuit board 01, with the laser 00 located on the circuit board 01. The laser 00 includes: a metal base plate 001, an encapsulation shell 002 fixed to the metal base plate 001, and a light-emitting chip 003 located within the encapsulation shell 002. A circuit layer (not shown) connected to the circuit board 01 is disposed between the metal base plate 001 and the encapsulation shell 002. Insulating layers (not shown) are also laid between the circuit layer and the metal base plate 001, and between the circuit layer and the encapsulation shell 002. A conductive structure (not shown) is embedded in the encapsulation shell 002. The two ends of this conductive structure are connected to the light-emitting chip 003 and the circuit layer on the metal base plate 001, respectively. Current can then be transmitted to the light-emitting chip 003 through the circuit board 01 and the conductive structure, causing the light-emitting chip 003 to emit light.

[0029] In this laser 00, the fabrication process involves setting up an insulating layer and a circuit layer on the metal base plate 001. This process is quite complex, as is the fabrication of the laser 00, which in turn complicates the electrical connection between the laser 00 and the circuit board 01. Furthermore, the conductive structures in the laser 00 must first be precisely electrically connected to corresponding locations in the circuit layer before the circuit layer is precisely connected to the circuit board 01, further increasing the complexity of achieving this connection. The insulating layer may be damaged or poorly laid in certain areas, potentially leading to continuity between the conductive structures and the metal base plate 001, or short circuits between different conductive structures, resulting in a poor electrical connection between the laser 00 and the circuit board 01. Since the circuit layer is located inside the laser 00, any problems with the electrical connection between the laser 00 and the circuit board 01 result in high repair difficulty and cost.

[0030] The following embodiments of this application provide a laser system in which the laser fabrication process is relatively simple, the electrical connection between the laser and the circuit board is relatively simple to achieve, and the electrical connection effect between the laser and the circuit board is good.

[0031] Figure 2 This is a schematic diagram of the structure of a laser system provided in an embodiment of this application. Figure 3 This is a schematic diagram of another laser system provided in an embodiment of this application. Figure 3 for Figure 2 The exploded view of the laser system shown is as follows. Figure 2 It can be Figure 3 A schematic cross-sectional view of the laser system shown. Figure 2 and Figure 3 As shown, the laser system includes a laser 10 and a circuit board 20. The laser 10 is located on the circuit board 20, and the laser 10 and the circuit board 20 can be electrically connected. The circuit board 20 is also known as a printed circuit board (PCB).

[0032] The circuit board 20 has a plate-like structure with two relatively large, opposing surfaces and multiple smaller side surfaces connecting the two surfaces. The two surfaces can be parallel. These two surfaces can be a first surface B1 and a second surface B2, respectively. The surface of the circuit board 20 closest to the laser 10 has pads H connected to a power source. These pads H can serve as either positive or negative terminals for supplying power to the laser 10. Optionally, at least a portion of the pads H on the circuit board 20 can be located within the coverage area of ​​the laser 10, which can refer to the orthographic projection area of ​​the laser 10 onto the circuit board 20.

[0033] The laser 10 includes a metal base plate 101, a frame 102, a light-emitting chip 103, and a conductive structure 104. The metal base plate 101 is fixed to the frame 102 and forms a groove, which serves as a receiving space for accommodating the light-emitting chip 103 and other components. The metal base plate 101 in the laser 10 is located close to the circuit board 20, such that the laser 10 is fixed to the circuit board 20 using the metal base plate 101. The conductive structure 104 is embedded in the frame 102. Figure 3 The light-emitting chip 103 in the laser 10 is not shown in the diagram. Optionally, the material of the metal base plate 101 may include copper, and the material of the metal base plate 101 may be oxygen-free copper. The material of the metal base plate 101 may also include other metals, which are not limited in this embodiment.

[0034] The metal base plate 101 is generally plate-shaped, and the frame 102 and the light-emitting chip 103 are located on one surface of the metal base plate 101. The frame 102 is a frame-shaped structure, with two opposing annular end faces at each end in the axial direction (e.g., the z-direction), and also has an inner wall and an outer wall connecting the two end faces. In this embodiment, the outer wall of the frame 102 is flat, such as being a relatively regular rectangle, which facilitates the assembly of the laser 10 with other components.

[0035] like Figure 2 As shown, the inner wall of the frame 102 is fixed to the side of the metal base plate 101, and at least a portion of the inner wall of the frame 102 is fixed to at least two opposite side surfaces of the metal base plate 101. One end face of the frame 102 located axially is flush with the first plate surface B1 of the metal base plate 101. For ease of description, the end face of the frame 102 that is flush with the first plate surface B1 of the metal base plate 101 is referred to as the first end face, and the other end face is referred to as the second end face.

[0036] The light-emitting chip 103 and other components are located on the second surface B2 of the metal base plate 101 and surrounded by the frame 102. A conductive structure 104 is embedded in the frame 102, with its two ends located outside and outside the area enclosed by the frame 102, respectively. The conductive structure 104 serves to connect the inside and outside of the area enclosed by the frame 102. For example, the first end of the conductive structure 104 may be located within the area enclosed by the frame 102 and electrically connected to the light-emitting chip 103, or it may be electrically connected to the light-emitting chip 103 via a wire X. The second end of the conductive structure 104 is located on the first end face of the frame 102. The second end of the conductive structure 104 may cover at least a portion of the pads H in the circuit board 20 and be electrically connected to the pads H. Thus, the light-emitting chip 103 and the pads H can be electrically connected through the conductive structure 104, allowing current to be transmitted to the light-emitting chip 103 to excite it to emit laser light.

[0037] Optionally, when electrically connecting the second end of the conductive structure 104 to the pad H, conductive solder (such as sheet-like conductive solder) can be placed between the second end and the pad H. The conductive solder can then be melted to fill the gap between the second end and the pad H, thus fixing the second end to the pad H and achieving the electrical connection between the second end and the pad H. Optionally, the area of ​​the second end of the conductive structure 104 can be equal to the area of ​​the pad H, or it can be smaller or larger than the area of ​​the pad H.

[0038] Figure 4 This is a schematic diagram of the structure of a laser provided in an embodiment of this application, and Figure 4 This is a view showing the side where the first plate surface B1 of the laser 10 is located. Please refer to... Figures 2 to 4 The first surface B1 of the metal base plate 101 has a clearance groove C near the edge of the frame 102. This clearance groove C is used to separate the second end of the conductive structure 104 from the first surface B1 of the metal base plate 101. Thus, when the second end of the conductive structure 104 is fixed to the pad H, the clearance groove C can be used to accommodate conductive solder overflowing from between the second end and the pad H, thereby preventing the conductive solder from contacting the metal base plate 101 and avoiding the influence of misalignment between the conductive structure 104 and the metal base plate 101 on the light-emitting effect of the light-emitting chip 103.

[0039] In the laser system of this application embodiment, the inner wall of the frame 102 in the laser 10 is fixed to the side of the metal base plate 101. The light-emitting chip 103 is located on the second plate surface B2 of the metal base plate 101 and is surrounded by the frame 102. This is equivalent to eliminating the bottom of the encapsulation shell in related technologies, so the thickness of the laser 10 can be smaller, which is beneficial to the miniaturization of the laser 10. The light-emitting chip 103 in the laser 10 can be directly connected to the circuit board 20 through the conductive structure 104. There is no need to set an insulating layer and circuit layer on the metal base plate 101, and the fabrication of the laser 10 is relatively simple. When electrically connecting the laser 10 to the circuit board 20, it is only necessary to fix the conductive structure 104 of the laser 10 and the pad H in the circuit board 20. This connection method is relatively simple. Since the conductive structure 104 extends outside the laser 10, if there is a problem with the electrical connection between the laser 10 and the circuit board 20, it is easy to repair, the repair difficulty is low, and the cost is also low.

[0040] In summary, in the laser system provided by this application embodiment, the inner wall of the frame is fixed to the side of the metal base plate, and the axial end face of the frame is flush with the first surface of the metal base plate. A conductive structure is embedded in the frame. The first end of the conductive structure is located within the enclosed area of ​​the frame and is electrically connected to the light-emitting chip. The second end is located on the end face of the frame, and this second end can directly cover and be electrically connected to the pads in the circuit board. This allows current to be transmitted to the light-emitting chip through the circuit board and the conductive structure. Thus, when electrically connecting the laser to the circuit board, it is only necessary to directly fix and electrically connect the second end of the conductive structure in the laser to the pads, simplifying the electrical connection method between the laser and the circuit board.

[0041] Furthermore, the first surface of the metal base plate has an anti-cavity groove near the edge of the frame. This anti-cavity groove can prevent solder from flowing from the second end of the conductive structure to the metal base plate, thus avoiding mis-conduction between the conductive structure and the metal base plate, and thereby avoiding the impact of such mis-conduction on the light-emitting effect of the light-emitting chip.

[0042] In this embodiment, the laser 10 can have one or more light-emitting chips 103. Figure 2 and Figure 3 Taking a laser 10 comprising six light-emitting chips 103 arranged in two rows and three columns, with the row direction being the x-direction and the column direction being the y-direction, as an example. The number and arrangement of the light-emitting chips 103 can be arbitrarily designed, and this embodiment does not limit them. There are multiple conductive structures 104, with different conductive structures 104 spaced apart from each other. Each conductive structure 104 is electrically connected to a pad H on the circuit board 20. The number of pads H in the circuit board 20 can be the same as the number of conductive structures 104.

[0043] The number of conductive structures 104 is related to the number and connection method of light-emitting chips 103. Each light-emitting chip 103 is electrically connected to two conductive structures 104, and these two conductive structures 104 and the pad H are respectively connected to the positive and negative terminals of the power supply. If each row of light-emitting chips 103 is connected in series, and each end needs to be connected to two conductive structures 104, then the number of conductive structures 104 can be twice the number of rows of light-emitting chips 103. Each conductive structure 104 can be located on both sides of the light-emitting chip 103 in the row direction. Figure 3 The laser system shown includes a laser 10 with four conductive structures 104, and a circuit board 20 with four pads H corresponding to the four conductive structures 104. The four conductive structures 104 and the four pads H are connected to each other.

[0044] This application embodiment mainly describes one conductive structure 104 and its corresponding pad H in the laser 10. Other conductive structures 104 and pad H can be referred to the same description, and will not be elaborated further in this application embodiment. The frame 102 in the laser 10 can be surrounded by multiple side walls. For example, in this application embodiment, the frame 102 is rectangular and surrounded by four side walls. Each conductive structure 104 is embedded in one side wall of the frame 102. In this application embodiment, it is taken that multiple conductive structures 104 of the laser 10 are respectively embedded in two opposite side walls of the frame 102.

[0045] In this embodiment of the application, the clearance groove C on the metal base plate 101 can have a variety of optional structures. Two of the optional structures will be described below as examples.

[0046] In the optional structure of the first type of vent slot C, please refer to [reference needed]. Figures 2 to 4 In the laser 10, the first surface B1 of the metal base plate 101 has a plurality of spaced-apart slots C near the edge of the frame 102. These slots C correspond one-to-one with a plurality of conductive structures 104 in the laser 10. Each slot C is located near the second end of its corresponding conductive structure 104, serving to separate the second end of the conductive structure 104 from the first surface B1 of the metal base plate 101. The arrangement direction of each slot C and the second end of its corresponding conductive structure 104 can be parallel to the arrangement direction of the sidewalls of the metal base plate 101 and the conductive structure 104.

[0047] Optionally, in the direction parallel to the wall of the frame 102, the width of the clearance groove C can be greater than or equal to the width of the second end of the corresponding conductive structure 104. For example... Figure 4 In the y-direction, the width of the clearance groove C can be greater than the width of the second end of the corresponding conductive structure 104. This ensures that the conductive solder overflowing from the second end can be contained by the clearance groove C.

[0048] The clearance groove C can be semi-circular or rectangular. The shape of the clearance groove C described in this embodiment refers to the shape of its opening. The clearance groove C has an opening and a bottom. The opening is the portion of the clearance groove C away from the second surface B2 of the metal base plate 101, and the bottom is the portion of the clearance groove C close to the second surface B2. When the clearance groove C is semi-circular, the stress on the area surrounding the clearance groove C can be distributed more evenly when the metal base plate 101 is under stress, ensuring high strength of the metal base plate 101. Optionally, the clearance groove C can also be other shapes, such as pentagons or hexagons, etc., which are not limited in this embodiment.

[0049] In this embodiment, the clearance groove C has a flat bottom opposite the opening, and the shape and size of the bottom are the same as those of the opening. For example, the bottom and opening of the clearance groove C are congruent semicircles. Optionally, the bottom of the clearance groove C may not be flat; it may be a concave-convex surface or a cone shape.

[0050] In the optional structure of the second type of clearance slot C, Figure 5 This is a schematic diagram of another laser structure provided in an embodiment of this application. For example... Figure 5 As shown, each sidewall of the frame 102 with an embedded conductive structure 104 has a strip-shaped clearance groove C between it and the first plate surface B1 of the metal base plate 101. The clearance groove C is used to separate all the conductive structures 104 embedded in the sidewall from the first plate surface B1 of the metal base plate 101.

[0051] Optionally, the length of the clearance groove C can be equal to the length of the sidewall. Alternatively, the length of the clearance groove C can be greater than or equal to the maximum distance between the second ends of the two farthest conductive structures 104 in the sidewall. This simplifies the fabrication process of the clearance groove C and maximizes the strength of the metal base plate 101 while ensuring that all conductive structures 104 are isolated from the first plate surface B1.

[0052] Alternatively, the first surface B1 of the metal base plate 101 may have an annular clearance groove C to isolate the first end faces of all sidewalls from the first surface B1. This embodiment of the application does not illustrate this method.

[0053] Since the strength of the location where the clearance groove C is set on the metal base plate 101 will be weakened to a certain extent, in order to ensure the reliability of the metal base plate 101, the thickness of the metal base plate 101 at the location of the clearance groove C can be greater than or equal to 1 mm in this embodiment.

[0054] In this embodiment, insulating material, such as insulating varnish, can be filled into the clearance groove C. This further ensures a better separation effect between the second end of the conductive structure 104 and the first surface of the metal base plate 101.

[0055] Please continue to refer to this. Figures 2 to 5 In this embodiment, the end face M2 of the second end of the conductive structure 104 can be flush with the first end face of the frame 102. The pad H in the circuit board 20 can also be flush with the surface of the circuit board 20. Thus, the second end of the conductive structure 104 can be directly aligned with the corresponding pad H and soldered for fixation.

[0056] In another alternative implementation, Figure 6 This is a schematic diagram of another laser structure provided in the embodiments of this application. Figure 7This is a schematic diagram of another laser system provided in the embodiments of this application. Figure 7 The laser system shown may include Figure 6 Laser 10 is shown. (As shown) Figure 6 and Figure 7 As shown, the second end of the conductive structure 104 can protrude relative to the first end face of the frame 102. The circuit board 20 has a groove (not shown in the figure) at the location of the pad H, and the pad H can be located in this groove. When fixing the laser 10 and the circuit board 20, the second end of the conductive structure 104 can be inserted into the groove where the pad H is located to fix and electrically connect with the pad H. In this method, the alignment of the conductive structure 104 and the pad H is relatively simple, and the distance between the second end of the conductive structure 104 and the first surface B1 of the metal base plate 101 is further increased, which can further reduce misalignment between the conductive structure 104 and the metal base plate 101.

[0057] The metal base plate 101 in the laser 10 of this application embodiment has four sides. The laser 10 can have a variety of optional structures, and the fixing method between the metal base plate 101 and the frame 102 can be different in different optional structures. The two optional structures of the laser 10 are described below.

[0058] In the first alternative structure, the inner wall of a portion of the sidewall of the frame 102 is fixed to a portion of the sidewall of the metal base plate 101. Figure 8 This is a schematic diagram of another laser structure provided in the embodiments of this application. Figure 8 This is a view of the side where the second plate surface B2 of the metal base plate 101 of the laser 10 is located. Figure 9 This is a schematic diagram of a frame structure provided in an embodiment of this application. The frame can be... Figures 2 to 8 The image shows the housing 102 within the laser 10. Please refer to... Figures 2 to 8 The inner walls of two opposing sidewalls of the frame 102 are fixed to two opposing sidewalls of the metal base plate 101. These two sidewalls are sidewalls inlaid with conductive structures 104. The first end face of the frame 102, flush with the first plate surface B1 of the metal base plate 101, includes the surface of the two sidewalls that is axially away from the second end face of the frame 102. The other two sidewalls are located on the second plate surface B2 of the metal base plate 101, and the surfaces of these other two sidewalls that are axially away from the second end face of the frame 102 are fixed to the second plate surface B2.

[0059] In the second optional structure, the inner walls of each side wall of the frame 102 are fixed in correspondence with each side of the metal base plate 101, and the frame 102 surrounds the metal base plate 101. Figure 10 This is a schematic diagram of the structure of a laser according to another embodiment of this application. Figure 10This is a view of the side where the second surface B2 of the metal base plate 101 of the laser 10 is located. (See image) Figure 10 As shown, the inner walls of the four side walls of the frame 102 are respectively fixed to the four sides of the metal base plate 101. The first end face of the frame 102 that is flush with the first plate surface B1 of the metal base plate 101 includes the surface of the four side walls that is axially away from the second end face of the frame 102.

[0060] Please continue to refer to this. Figures 2 to 10 The inner wall of the frame 102 may have a boss T, such as the inner wall of the side wall where each conductive structure 104 is located. The boss T may be located in the inner wall of the frame 102 near the second plate surface B2 of the metal base plate 101. A portion of the conductive structure 104 near the enclosed area of ​​the frame 102 is embedded in the boss T. The first end of the conductive structure 104 is located on the surface of the boss T away from the metal base plate 101, which facilitates the placement of a wire X on the first end. For example, the end face M1 of the first end of the conductive structure 104 may be flush with the surface of the boss T away from the metal base plate 101, or it may protrude relative to the surface of the boss T away from the metal base plate 101.

[0061] like Figures 2 to 10 As shown, the protrusion T on each sidewall of the frame 102 where the conductive structure 104 is embedded can be strip-shaped, and the length of the protrusion T can be equal to the length of the sidewall. The protrusion T covers the entire position of the sidewall near the metal base plate 101. Optionally, the sidewall with multiple conductive structures 104 embedded can also have multiple protrusions T spaced apart from each other, with each conductive structure 104 embedded in a corresponding protrusion T, and the first end of each conductive structure 104 located on the corresponding protrusion T.

[0062] Figure 11 This is a schematic diagram of a conductive structure provided in an embodiment of this application. For example... Figure 11 As shown, the conductive structure 104 may include: a first end 1041, a second end 1042, and an intermediate portion 1043 located between the first end 1041 and the second end 1042. The end face M1 of the first end 1041 is exposed within the enclosure area of ​​the frame 102 for electrical connection with the light-emitting chip 103. The end face M2 of the second end 1043 is exposed outside the enclosure area of ​​the frame 102 for electrical connection with the pad H in the circuit board 20. The dimensions of the first end 1041 and the second end 1042 may be slightly larger than the dimensions of the intermediate portion 1043 to facilitate connection with the light-emitting chip 103 and the pad H.

[0063] In this embodiment, the frame 102 can be made of an insulating material, such as ceramic. The conductive structure 104 can be made of a metal, such as tungsten. The frame 102 can be fabricated using a ceramic printing process, where a metal material (such as tungsten) can be pre-placed during the ceramic printing process to obtain an integrated frame 102 and conductive structure 104 after the ceramic printing structure is completed. The thickness and number of layers of the metal material during the printing process can be designed according to the current required to pass through the conductive structure 104. Alternatively, an independent conductive structure 104 can be fabricated first, and then ceramic printing can be performed on the outside of the conductive structure 104 to fabricate the frame 102, thus embedding the conductive structure 104 into the frame 102 during the fabrication process.

[0064] After the frame 102 and conductive structure 104 are fabricated, the frame 102 and the metal base plate 101 can be brazed together. For example, brazing solder can be applied between the end face of the frame 102 and the metal base plate 101, and the solder can be melted to fix the frame 102 and the metal base plate 101. Optionally, the brazing solder can be a tin-silver-copper or other metallic solder.

[0065] The metal base plate 101 includes a first region and a second region surrounding the first region. The first region is used to mount the light-emitting chip 103 and other components, and the second region is used to fix it to the frame 102. The first region can protrude relative to the second region, so the strength of the first region can be higher, which helps to ensure a higher flatness of the first region and ensures a better mounting effect of the light-emitting chip 103 and other components.

[0066] A certain safety distance can be reserved between the conductive structure 104 and the metal base plate 101 to avoid mis-conduction between them. A certain safety distance can also be reserved between the conductive structure 104 and the second end face of the frame 102 to prevent the conductive structure 104 from affecting the fixation of the frame 102 and other components. If a component with a similar coefficient of thermal expansion needs to be fixed to the side of the frame 102 furthest from the metal base plate 101, and the coefficient of thermal expansion of the conductive structure 104 differs significantly from that of the frame 102, the distance between the conductive structure 104 and the component fixed above the frame 102 can be greater. This avoids the conductive structure 104 affecting the fixation effect when fixing the component, thus ensuring the reliability of the laser 10 fabrication.

[0067] For example, the minimum distance between the conductive structure 104 and the metal base plate 101 is greater than or equal to 0.5 mm, and / or, the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the metal base plate 101 is greater than or equal to 0.5 mm. The minimum distance between the conductive structure 104 and another component refers to the minimum distance between each location of the conductive structure 104 and that component. The distance between each location of the conductive structure 104 and the metal base plate 101 is greater than or equal to 0.5 mm, and the distance between each location of the conductive structure 104 and the surface of the frame 102 away from the metal base plate 101 is also greater than or equal to 0.5 mm. Figure 2 In the process, the minimum distance between the conductive structure 104 and the metal base plate 101 is the distance d1 in the x direction, which can also be said to be the distance between the second end of the conductive structure 104 and the side of the metal base plate 101; the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the metal base plate 101 is the distance d2 in the z direction, and both d1 and d2 are greater than or equal to 0.5 mm.

[0068] Please continue to refer to this. Figure 2 , Figure 8 and Figure 10 The laser 10 in the image may also include a heat sink 105 and a reflecting prism 106. Each light-emitting chip 103 corresponds to one heat sink 105 and one reflecting prism 106. The heat sink 105 is located on the metal base plate 101, and the light-emitting chip 103 is located on the surface of the heat sink 105 away from the metal base plate 101. The heat sink 105 is used to assist in heat dissipation of the light-emitting chip 103. The material of the heat sink 105 may include ceramic. The reflecting prism 106 is located on the light-emitting side of the corresponding light-emitting chip 103. The laser emitted by the light-emitting chip 103 can be directed towards the corresponding reflecting prism 106. The reflecting prism 106 can reflect the received laser in a direction away from the metal base plate 101, so that the laser can exit the accommodating space enclosed by the metal base plate 101 and the frame 102.

[0069] Figure 12 This is a schematic diagram of another laser structure provided in another embodiment of this application. (See diagram below.) Figure 12 As shown, in Figure 2Based on the laser 10 shown, the laser 10 may further include a light-transmitting sealing component 107. The light-transmitting sealing component 107 may be plate-shaped and located on the side of the frame 102 away from the metal base plate 101. It seals the accommodating space enclosed by the frame 102 and the metal base plate 101, preventing external contaminants such as water and oxygen from damaging the light-emitting chip 103. An edge region of the light-transmitting sealing component 107 near the metal base plate 101 is fixed to the surface of the frame 102 away from the metal base plate 101. For example, the edge region of the light-transmitting sealing component 107 may be pre-filled with solder. The light-transmitting sealing component 107 can be placed on the side of the frame 102 away from the metal base plate 101, with the solder in contact with the surface of the frame 102 away from the metal base plate 101. Next, the frame 102 and the light-transmitting sealing component 107 are placed together in a high-temperature furnace to melt the solder and weld the frame 102 and the light-transmitting sealing component 107.

[0070] Please continue to refer to this. Figure 12 The laser 10 may also include a collimating lens group 108 located on the side of the light-transmitting sealing component 107 away from the metal base plate 101. The collimating lens group 108 may include a plurality of collimating lenses corresponding one-to-one with each of the light-emitting chips 103. The laser emitted by each light-emitting chip 103 is reflected by the corresponding reflecting prism 106 and can then be directed to the corresponding collimating lens. The collimating lens can collimate the received laser before it is emitted, so that the laser is close to parallel light.

[0071] Figure 13 This is a schematic diagram of another laser system provided in the embodiments of this application. Figure 14 This is a schematic diagram of a laser system provided in another embodiment of this application. Figure 14 for Figure 13 The exploded view of the laser system shown is as follows. Figure 13 It can be Figure 14 A schematic cross-sectional view of the laser system shown. Figure 13 and Figure 14 As shown, the circuit board 20 in this embodiment may have a cutout area, with the pad H located outside the cutout area. The metal base plate 101 in the laser 10 may cover the cutout area, and the area of ​​the metal base plate 101 is larger than the area of ​​the cutout area. The cutout area can be used to house a heat sink, and the cold head of the heat sink can extend into the cutout area to contact the metal base plate 101 of the laser 10, thereby achieving a better heat dissipation effect for the laser 10.

[0072] In summary, in the laser system provided by this application embodiment, the inner wall of the frame is fixed to the side of the metal base plate, and the axial end face of the frame is flush with the first surface of the metal base plate. A conductive structure is embedded in the frame. The first end of the conductive structure is located within the enclosed area of ​​the frame and is electrically connected to the light-emitting chip. The second end is located on the end face of the frame, and this second end can directly cover and be electrically connected to the pads in the circuit board. This allows current to be transmitted to the light-emitting chip through the circuit board and the conductive structure. Thus, when electrically connecting the laser to the circuit board, it is only necessary to directly fix and electrically connect the second end of the conductive structure in the laser to the pads, simplifying the electrical connection method between the laser and the circuit board.

[0073] Furthermore, the first surface of the metal base plate has an anti-cavity groove near the edge of the frame. This anti-cavity groove can prevent solder from flowing from the second end of the conductive structure to the metal base plate, thus avoiding mis-conduction between the conductive structure and the metal base plate, and thereby avoiding the impact of such mis-conduction on the light-emitting effect of the light-emitting chip.

[0074] The laser system in this embodiment can be used as a light source in laser projection equipment. In addition to the laser system, the projection light source may also include other optical components, such as a homogenizing component, a shaping component, and a converging lens. The homogenizing component homogenizes the laser emitted by the laser system, the shaping component shapes the laser spot into the shape required for the projected image, and the converging lens focuses the laser beam into subsequent components. For example, the homogenizing component may be a light guide.

[0075] This application also provides a projection device, which may include the aforementioned light source component, as well as a light valve and a lens. The laser emitted by the light source component can be directed towards the light valve, modulated by the light valve, and then directed towards the lens. The lens can then project the received laser to form a projected image. Because the laser emitted by the projection light source has good quality, the display effect of the projected image formed based on this laser is also good, thus improving the display effect of the projection device.

[0076] In this application, the terms "at least one of A and B" and "A and / or B" are merely descriptions of the relationships between related objects, indicating that three relationships can exist: A alone, A and B simultaneously, and B alone. The term "at least one of A, B, and C" indicates that seven relationships can exist: A alone, B alone, C alone, A and B simultaneously, A and C simultaneously, C and B simultaneously, and A, B, and C simultaneously. In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "at least one" refers to one or more, and the term "multiple" refers to two or more, unless otherwise expressly defined.

[0077] Throughout this specification and claims, the terms "comprising" and "including" are open-ended and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect. While certain terms are used in the specification and claims to refer to specific components, those skilled in the art should understand that manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function.

[0078] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser system, characterized in that, The laser system includes: a laser and a circuit board; The laser includes: a metal base plate, a frame, a light-emitting chip, and multiple conductive structures; the inner wall of the frame is fixed to the side of the metal base plate, and one end face of the frame located axially is flush with the first surface of the metal base plate; the frame is made of an insulating material; the light-emitting chip is located on a second surface of the metal base plate opposite to the first surface and is surrounded by the frame; the conductive structures are embedded in the frame, with a first end located within the enclosed area of ​​the frame and electrically connected to the light-emitting chip, and a second end located on the end face; the first surface of the metal base plate has multiple clearance slots near the edge of the frame, and the multiple conductive structures correspond one-to-one with the multiple clearance slots, with each clearance slot close to the second end of the corresponding conductive structure, serving to separate the second end from the first surface; in a direction parallel to the wall of the frame, the width of the clearance slot is greater than or equal to the width of the second end of the corresponding conductive structure; The laser is located on the circuit board, and the metal base plate is close to the circuit board; the circuit board has pads that are connected to the power supply and correspond one-to-one with the conductive structure, and the second end of the conductive structure covers the corresponding pad and is electrically connected to the pad; Wherein, the second end of the conductive structure protrudes relative to the end face, and the circuit board has a groove at the location of the pad, with the pad located in the groove; The second end is inserted into the groove and electrically connected to the pad.

2. The laser system according to claim 1, characterized in that, The clearance groove is semi-circular or rectangular.

3. The laser system according to claim 1, characterized in that, The cavity is filled with insulating material.

4. The laser system according to any one of claims 1 to 3, characterized in that, The metal base plate has four sides, and the frame is formed by four side walls; The inner walls of two opposite sidewalls of the four sidewalls are fixed to two opposite sidewalls of the four sidewalls. The end face of the frame that is flush with the first plate surface of the metal base plate includes: the surface of one of the two sidewalls located at the end in the axial direction. Two of the four sidewalls are located on the second plate surface of the metal base plate, and the surfaces of the other two sidewalls located at one end in the axial direction are fixed to the second plate surface.

5. The laser system according to any one of claims 1 to 3, characterized in that, The inner wall of the frame has a boss, and a portion of the conductive structure is embedded in the boss. The first end of the conductive structure is located on the surface of the boss away from the metal base plate.

6. The laser system according to any one of claims 1 to 3, characterized in that, The minimum distance between the conductive structure and the metal base plate is greater than or equal to 0.5 mm, and / or the minimum distance between the conductive structure and the surface of the frame away from the metal base plate is greater than or equal to 0.5 mm.

7. The laser system according to any one of claims 1 to 3, characterized in that, The frame is made of ceramic, and / or the conductive structure is made of tungsten.

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