A microfluidic chip quality inspection system and quality inspection method, and a detection system

Abstract

This application relates to the field of microfluidic chip quality inspection technology, and provides a microfluidic chip quality inspection system and method, and a detection system. The system includes an illumination module for illuminating and forming a light spot to illuminate the microfluidic chip, a carrier module for moving the microfluidic chip, an imaging module, and a main control module connecting other modules. The imaging module includes an imaging unit for focusing a first light signal formed by the light spot illuminating the microfluidic chip, a camera unit for imaging the microfluidic chip with a processed light signal formed according to the detection mode to obtain a light spot image signal, and a filter unit disposed between the camera unit and the imaging unit for switching detection modes to filter out a preset wavelength light signal from the first light signal. By using the filter module in the imaging module to switch detection modes, multiple different modes of light spot image signals can be obtained, improving the light spot imaging efficiency for microfluidic chip quality inspection and thus improving quality inspection efficiency.

Description

Technical Field

[0001] This application relates to the field of microfluidic chip quality inspection technology, and in particular to a microfluidic chip quality inspection system, inspection method, and detection system. Background Technology

[0002] Currently, microfluidic technology is developing rapidly, leading to a gradual increase in demand for microfluidic chips and a corresponding increase in production capacity. Microfluidic chips are being manufactured at a rapid pace. However, during this rapid production process, the chip surface inevitably becomes contaminated due to the multiple processes involved in their fabrication. This contamination is caused by various substances, and these substances require quality control using optical instruments. This quality control process necessitates switching between different wavelengths of light source to obtain the light signals from the different substances, which reduces the efficiency of the quality control process. Summary of the Invention

[0003] The main objective of this application is to propose a microfluidic chip quality inspection system, method, and detection system, which aims to improve the quality inspection efficiency of microfluidic chips.

[0004] To achieve the above objectives, a first aspect of this application provides a microfluidic chip quality inspection system, the system comprising:

[0005] An illumination module is used to form a light spot to illuminate the microfluidic chip;

[0006] The loading module is used to move the microfluidic chip;

[0007] An imaging module includes a camera unit, a filter unit, and an imaging unit; the imaging unit is used to focus the light spot to illuminate the first light signal formed by the microfluidic chip; the filter unit is disposed between the camera unit and the imaging unit, and is used to switch detection modes to filter out preset wavelength light signals in the first light signal; the camera unit performs light spot imaging on the microfluidic chip according to the processed light signal formed by the detection mode to obtain a light spot image signal;

[0008] The main control module is connected to the cargo module, the lighting module, and the imaging module, respectively.

[0009] In some possible embodiments of this application, the lighting module includes:

[0010] Laser generating unit, used to generate laser beam;

[0011] A beam shaping unit is used to shape the laser beam to form the light spot;

[0012] A laser transmission unit is connected to both the laser generating unit and the beam shaping unit, and is used to transmit the laser beam generated by the laser generating unit to the beam shaping unit.

[0013] In some possible embodiments of this application, the imaging module further includes an adjustment unit for adjusting any of the following parameters according to the adjustment signal sent by the main control module:

[0014] The first focal length parameter of the camera unit, the first position parameter of the camera unit, the second focal length parameter of the imaging unit, the second position parameter of the imaging unit, and the third position parameter of the filter unit.

[0015] In some possible embodiments of this application, the cargo module includes:

[0016] A chip carrier unit is used to carry the microfluidic chip;

[0017] The displacement control unit is used to control the movement of the chip carrier unit according to the scanning signal sent by the main control module.

[0018] In some possible embodiments of this application, the laser beam generating unit includes:

[0019] A pre-laser beam generating unit is used to generate a pre-laser beam and adjust the wavelength of the pre-laser beam to obtain the laser beam.

[0020] In some possible embodiments of this application, the system further includes:

[0021] An image processing module, connected to the main control module, is used to perform image processing on the light spot image signal to obtain the target image signal.

[0022] In some possible embodiments of this application, the filter unit includes:

[0023] A filter element is used to filter out a preset wavelength optical signal from the first optical signal;

[0024] The mode switching unit is used to move the filter element in or out between the camera unit and the imaging unit to achieve the detection mode switching.

[0025] In some possible embodiments of this application, the light spot includes a line light spot, the imaging unit includes a linear array imaging unit, and the linear array imaging unit performs line scanning on the microfluidic chip illuminated by the line light spot to form an image.

[0026] To achieve the above objectives, a second aspect of this application provides a microfluidic chip quality inspection method, which applies the microfluidic chip quality inspection system described in the first aspect above, and the method includes the following steps:

[0027] The microfluidic chip is moved to the initial illumination position, and a light spot for illuminating the microfluidic chip is generated by the illumination module.

[0028] The microfluidic chip is moved from the initial lighting position by the carrier module, so that the microfluidic chip passes through the light spot to form a first light signal;

[0029] The first optical signal is acquired by the imaging unit to form a first pre-image signal;

[0030] When the first pre-image signal is formed, the detection mode is switched through the filter unit and the microfluidic chip is moved to the initial illumination position through the carrier module;

[0031] The microfluidic chip is moved from the initial lighting position through the light spot by the loading module to form a second light signal;

[0032] The second optical signal is acquired through the imaging unit to form a second pre-image signal;

[0033] The target image signal is obtained by image processing based on the first pre-image signal and the second pre-image signal.

[0034] To achieve the above objectives, a third aspect of the present application provides a testing station that uses a microfluidic chip quality inspection system as described in the first aspect above to perform quality inspection on microfluidic chips.

[0035] This application proposes a microfluidic chip quality inspection system and method, and a detection system. The system includes an illumination module for forming a light spot to illuminate the microfluidic chip, a carrier module for moving the microfluidic chip, an imaging module, and a main control module connecting all other modules. The imaging module includes an illumination imaging unit for focusing a first light signal formed by the light spot illuminating the microfluidic chip, a camera unit for imaging the microfluidic chip with a processed light signal formed according to the detection mode to obtain a light spot image signal, and a filter unit disposed between the camera unit and the imaging unit, used to switch detection modes to filter out a preset wavelength light signal from the first light signal. By using the imaging module formed by the imaging unit, the filter unit, and the camera unit, and by using the filter module to switch detection modes, multiple different modes of light spot image signals can be obtained with a single wavelength excitation light, thereby improving the quality inspection efficiency of the microfluidic chip's light spot imaging. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a microfluidic chip quality inspection system provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of the operation of a microfluidic chip quality inspection system provided in an embodiment of this application;

[0038] Figure 3This is a schematic diagram of the internal structure of the lighting module 11 in this embodiment of the application;

[0039] Figure 4 This is a schematic diagram of the internal structure of the imaging module 13 in an embodiment of this application;

[0040] Figure 5 This is a schematic diagram of the structure of the image module in an embodiment of this application;

[0041] Figure 6 This is a schematic diagram of the steps of a microfluidic chip quality inspection method provided in an embodiment of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] Microfluidic chip quality inspection system 10; illumination module 11, laser generation unit 111, pre-laser beam generation unit 1111, laser transmission unit 112, beam shaping unit 113; loading module 12, chip carrying unit 121, displacement control unit 122; imaging module 13, camera unit 131, filter unit 132, filter element 1321, mode switching unit 1322, imaging unit 133, adjustment unit 134; main control module 14; image processing module 15. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0045] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0047] First, let's analyze some of the terms used in this application:

[0048] Microfluidics are micron-scale chips that enable basic operations such as sample preparation, reaction, separation, and detection in biological, chemical, and medical analytical processes. Their goal is to integrate the functions of the entire laboratory, including sampling, dilution, reagent addition, reaction, separation, and detection, onto a single microchip. They feature controllable liquid flow, minimal sample and reagent consumption, and analysis speeds increased tenfold or even hundreds of times. They can simultaneously analyze hundreds of samples in minutes or even less, and can perform the entire sample pretreatment and analysis process online.

[0049] Currently, microfluidic technology is developing rapidly, leading to a gradual increase in demand for microfluidic chips. The production capacity of microfluidic chips is also gradually improving, resulting in their rapid manufacturing. However, during this rapid production process, microfluidic chips undergo multiple steps, including cleaning, coating, adhesive application, and finishing. These steps inevitably lead to surface contamination, which can result in various substances forming on the chip. Quality inspection using optical instruments requires switching between different wavelengths of light to obtain the light signals from these different substances, reducing inspection efficiency.

[0050] Based on this, embodiments of this application provide a microfluidic chip quality inspection system, quality inspection method, and detection system, aiming to improve the quality inspection efficiency of microfluidic chips.

[0051] The microfluidic chip quality inspection system, quality inspection method, and detection system provided in this application are specifically described through the following embodiments. First, the microfluidic chip quality inspection system in this application embodiment is described.

[0052] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a microfluidic chip quality inspection system provided in an embodiment of this application. Figure 2 This is a schematic diagram illustrating the operation of a microfluidic chip quality inspection system provided in an embodiment of this application. The microfluidic chip quality inspection system 10 may include, but is not limited to, the following modules.

[0053] The microfluidic chip quality inspection system 10 includes an illumination module 11, a carrier module 12, an imaging module 13, and a main control module 14. The main control module 14 is connected to the illumination module 11, the carrier module 12, and the imaging module 13, and is used to control the illumination module 11, the carrier module 12, and the imaging module 13. The illumination module 11 forms a light spot to illuminate the microfluidic chip according to the instructions of the main control module 14. The carrier module 12 moves the microfluidic chip so that the entire surface of the microfluidic chip can be illuminated by the light spot to form a first light signal. The imaging module 13 scans the first light signal and performs corresponding optical processing on the formed first light signal according to the detection mode. The light spot is imaged based on the optically processed light signal to obtain the light spot image signal of the microfluidic chip in the corresponding detection mode.

[0054] It should be understood that the first optical signal here refers to the optical signal formed by the light spot illuminating the microfluidic chip. The first optical signal is mixed with various optical signals. The specific type of various optical signals depends on the surface of the microfluidic chip or the material on the surface. For example, when the light spot illuminates the surface of the microfluidic chip, a scattered light signal is generated. The surface material is excited by the light spot illumination and emits a fluorescent signal. The scattered light signal and the fluorescent signal are mixed to form the first optical signal.

[0055] It should be understood that the specific type of optical signal processed here depends on the detection mode. When the detection mode is to detect all optical signals, the optical signal processed is the first optical signal; when the detection mode is to detect a specific type of optical signal, the optical signal processed is the specific type of optical signal in the first optical signal.

[0056] It should be understood that the main control module 14 here is of various types, such as a main control chip, a host computer terminal, etc., which issues control commands to one or more of the lighting module 11, the object-carrying module 12 and the imaging module 13 to achieve specific functions. Those skilled in the art can use specific types of equipment, devices or chips as the main control module 14 according to actual needs, and this application does not limit it.

[0057] It should be understood that the shape of the light spot of the microfluidic chip for illumination is diverse, such as circular, elliptical, or rectangular light spots. Those skilled in the art can choose a suitable light spot shape according to actual needs, and this application does not limit this. The wavelength of the light spot is also diverse. Those skilled in the art can determine the wavelength of the light spot according to the components of the stain that the microfluidic chip needs to detect, and this application does not limit this.

[0058] In some possible embodiments of this application, the light spot formed by the illumination module 11 is a line light spot. Since the imaging module 13 performs imaging by scanning light signals, line light spot imaging, compared to other types of light spot imaging, has a limited illumination range. The first light signal formed by the illumination is approximately a straight line. The first light signal forms a corresponding processed light signal according to the detection mode. The imaging module 13 scans the processed light signal to form processed light signal data. Based on these processed light signal data, a corresponding light spot image signal is generated. Image stitching is performed based on these processed light signal data, which is equivalent to stitching the approximately straight processed light signals along the short side of each scan to obtain the light spot image signal. However, the illumination area of ​​a surface light spot with a specific shape is larger, and the first light signal formed is a surface. The data obtained from scanning the first light signal needs to eliminate the duplicate parts before stitching can be performed. This is equivalent to removing the duplicate parts of all scanned surfaces before stitching can be performed. Therefore, using line light spot imaging makes the imaging part of the microfluidic quality inspection process more efficient.

[0059] In some possible embodiments of this application, the carrier module 12 includes a chip carrier unit 121 and a displacement control unit 122. The chip carrier unit 121 is used to carry the microfluidic chip, and the displacement control unit 122 is used to control the movement of the chip carrier unit 121 according to the control command sent by the main control module 14, so as to cooperate with the imaging module 13 to complete the overall scanning of the first optical signal formed on the surface of the microfluidic chip.

[0060] It should be understood that the displacement control unit 122 here is diverse and exemplary, such as a displacement table, a conveyor belt, etc. Those skilled in the art can select specific equipment as the displacement control unit 122 according to actual needs, and this application does not limit it in this regard.

[0061] Please see Figure 2 ( Figure 2 Not shown Figure 1 (All structures in the present application) In some possible embodiments, the detection modes include dark field detection mode and fluorescence detection mode, which can scan dark field signals or fluorescence signals to achieve dark field imaging and fluorescence imaging. The imaging module 13 and the illumination module 11 are set at a certain angle to perform dark field imaging. This angle is varied, for example, 45°, 60°, etc. Those skilled in the art can set the angle between the imaging module 13 and the illumination module 11 according to actual conditions; this application does not limit this.

[0062] It should be understood that the specific form of the loading module 12 here can be diverse and exemplary, such as an optical gimbal with a loading stage, a mobile platform with a microfluidic chip mounting fixture, etc. Those skilled in the art can select specific equipment as the loading module 12 according to the actual situation, and this application does not limit it in this regard.

[0063] Please see Figure 3 , Figure 3 This is a schematic diagram of the internal structure of the lighting module 11 in an embodiment of this application. In some possible embodiments of this application, the lighting module 11 includes, but is not limited to, the following units.

[0064] The illumination module 11 includes a laser generating unit 111, a laser transmission unit 112, and a beam shaping unit 113. The laser generating unit 111 generates a laser beam, the beam shaping unit 113 shapes the laser beam generated by the laser generating unit 111 into a light spot with a specific shape, and the laser transmission unit 112 transmits the laser beam generated by the shaped laser generating unit 111 to the beam shaping unit 113.

[0065] It should be understood that the laser generating unit 111 here generates a laser beam of a specific wavelength, and its specific form is diverse. For example, it can be a specific wavelength visible light laser generator, a tunable wavelength visible light laser generator, or a laser generating system based on a laser generator. Those skilled in the art can select a suitable device as the laser generating unit 111 to generate a laser beam according to the actual situation. This application does not limit this.

[0066] It should be understood that the laser transmission unit 112 here is diverse and exemplary, such as optical fiber, or a beam transmission system composed of optical fiber, beam splitter, lens, etc. Those skilled in the art can select a suitable device as the laser transmission unit 112 according to factors such as the nature of the laser beam and the site layout, and this application does not limit it in this regard.

[0067] It should be understood that the beam shaping unit 113 here is diverse and exemplary, such as laser lens, laser shaper, etc. Those skilled in the art can select appropriate equipment as the beam shaping unit 113 to shape the laser beam according to actual needs, and this application does not limit it.

[0068] In some possible embodiments of this application, the laser generating unit 111 includes a pre-laser beam generating unit 1111. The pre-laser beam generating unit 1111 generates a pre-laser beam and adjusts its wavelength to transform it into the laser beam generated by the laser generating unit 111. For example, the pre-laser beam generating unit 1111 can adjust the wavelength to generate ultraviolet light, or adjust the wavelength to generate visible light, etc. Different substances on the surface of the microfluidic chip have different characteristics, causing certain differences in the optical signals generated within the first optical signal. The pre-laser beam generating unit 1111 adjusts the generated pre-laser beams so that the illumination module 11 resembles light spots of different wavelengths, increasing the differences between these optical signals and thereby improving the imaging differences between different substances.

[0069] It should be understood that the pre-laser beam here refers to a laser beam without any optical adjustment. The wavelength of the pre-laser beam is diverse, and those skilled in the art can set the wavelength of the generated pre-laser beam according to the actual situation. This application does not limit this.

[0070] It should be understood that the specific form of the pre-laser beam generating unit 1111 here is diverse. For example, the pre-laser beam generating unit 1111 may consist of multiple single-wavelength laser generating devices and switching switches between the single-wavelength laser generating devices. Or, the pre-laser beam generating unit 1111 may consist of a single single-wavelength laser generating device and an adjustment device composed of optical components such as gratings. Those skilled in the art can select appropriate equipment or devices as the pre-laser beam generating unit 1111 according to the actual situation. This application does not limit this.

[0071] Please see Figure 4 , Figure 4 This is a schematic diagram of the internal structure of the imaging module 13 according to an embodiment of this application. The imaging module 13 includes, but is not limited to, the following units.

[0072] The imaging module 13 includes a camera unit 131, a filter unit 132, and an imaging unit 133. The imaging unit 133 is used to focus a light spot to illuminate the first light signal formed by the microfluidic chip. The filter unit 132 is located between the camera unit 131 and the imaging unit 133 and can have a certain filtering capability. It is used to switch the detection mode to filter out the light signal of a preset wavelength in the first light signal after it has been focused by the imaging unit 133.

[0073] It should be understood that the number of filter units 132 here is varied. Those skilled in the art can set a specific number of filter units 132 according to the actual situation to form multiple detection modes to filter out light signals in multiple wavelength ranges. This application does not limit this. For example, setting one filter unit 132 can realize two detection modes: filtering and not filtering.

[0074] In some possible embodiments of this application, the filtering unit 132 includes a filtering element 1321 and a mode switching unit 1322. The filtering element 1321 is used to filter out a preset wavelength light signal from the first light signal, and the mode switching unit 1322 is used to move the filtering element 1321 in or out between the camera unit 131 and the imaging unit 133 to achieve detection mode switching. By changing the detection mode, when using a light spot of a certain wavelength for imaging, the first light signal can be filtered by the filtering unit to quickly acquire a light signal of a specific wavelength. This specific wavelength light signal is then used as the processed light signal for spot imaging, reducing the initial detection process such as the formation and adjustment of light spots of other wavelengths, improving the efficiency of quality inspection, and reducing systematic errors caused by adjusting the light spot.

[0075] It should be understood that the types of filter elements 1321 here are diverse, such as optical filters, or combinations of multiple optical filters and other components. Those skilled in the art can select appropriate devices or components as filter elements 1321 according to actual needs, and this application does not limit this.

[0076] It should be understood that the type of mode switching unit 1322 here is diverse, such as a movable bridge base, a bracket, or a support arm. Those skilled in the art can select a suitable device or component as the mode switching unit 1322 according to the actual situation, and this application does not limit it.

[0077] The camera unit 131 is used to perform spot imaging based on the processed light signal obtained in the corresponding detection mode. When the camera unit 131 does not use the filter unit 132 to filter the light signal, the first light signal is used as the processed light signal for spot imaging. When the camera unit 131 does not use the filter unit 132 to filter the light signal, the first light signal is filtered according to the detection mode switched by the filter unit 132, and spot imaging is performed based on the processed light signal obtained after filtering. For example, assuming that the first light signal includes a scattered light signal and a fluorescence signal, and the detection modes include a fluorescence detection mode and a dark field detection mode, the filter unit 132 can filter out the scattered light signal. In the dark field mode, no filtering is performed. When in the fluorescence detection mode, the filter unit 132 filters out the scattered light signal in the first light signal, leaving only the fluorescence signal, and uses the fluorescence signal as the processed light signal for spot imaging.

[0078] It should be understood that the specific form of the camera unit 131 here is diverse, such as a CMOS camera, a CCD camera, an area scan camera, a line scan camera, etc. Those skilled in the art can select a suitable device as the camera unit 131 according to actual needs, and this application does not limit it in this regard.

[0079] In some possible embodiments of this application, the imaging unit 131 includes a linear array imaging unit, which is paired with the linear light spot formed by the illumination module 11. The linear array imaging unit performs a linear scan on the microfluidic chip illuminated by the linear light spot, and performs light spot imaging based on the line scan method. Different light spot image signals are obtained in different detection modes. For example, if the detection modes include dark field detection mode and fluorescence detection mode, then dark field imaging or fluorescence imaging can be performed based on the line scan method to obtain the corresponding light spot image signal. The linear array imaging unit has the characteristic of high data readout speed. By performing a line scan on the light signal generated by the linear light spot illuminating the microfluidic chip, the imaging exposure time can be reduced and the imaging efficiency can be improved.

[0080] In some possible embodiments of this application, the imaging module 13 further includes an adjustment unit 134. Since the imaging module 13 is connected to the main control module 14, the adjustment unit 134 can adjust the camera unit 131, the filter unit 132, and the imaging unit 133 according to the adjustment signal sent by the main control module 14. The adjustment unit 134 adjusts any of the following parameters: the first focal length parameter of the camera unit 131, the first position parameter of the camera unit 131, the second focal length parameter of the imaging unit 133, the second position parameter of the imaging unit 133, and the third position parameter of the filter unit 132. By adjusting the focal length, position, etc., of the internal units of the imaging module, the quality of the light spot imaging and the efficiency of system adjustment during quality inspection are improved.

[0081] It should be understood that, in addition to the parameters mentioned above, other parameters may also be included here. Those skilled in the art can adjust other specific parameters by adjusting unit 134 according to the actual situation, and this application does not limit this.

[0082] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure including the image module in an embodiment of this application. In some possible embodiments of this application, the microfluidic chip quality inspection system 10 also includes an image processing module 15.

[0083] The image processing module 15 is connected to the main control module 14. The light spot image signal of the imaging module 13 is transmitted to the image processing module 15 through the main control module 14. The image processing module 15 performs image processing on the light spot image signal to obtain the target image signal.

[0084] It should be understood that the content of the target image signal here is an image of a specific type of first light signal, without any other types of first light signals mixed in. For example, suppose the first light signal includes scattered light signal and fluorescence signal, and the detection modes include fluorescence detection mode and dark field detection mode. The filter unit 132 can filter out the scattered light signal, and no filtering is performed in the dark field mode. To obtain two separate images, one containing only fluorescence signal and the other without fluorescence signal, firstly, in the dark field mode, the first light signal is used as the processing light signal. Based on the processing light signal, a mixed image of scattered light signal and fluorescence signal is obtained. Then, the filter unit 132 is controlled to switch the detection mode from dark field mode to fluorescence mode. At this time, the fluorescence signal is used as the processing light signal. Based on the processing light signal, a separate image containing only fluorescence signal is obtained. Then, the image processing module 15 performs image processing on the mixed image of scattered light signal and fluorescence signal and the separate image containing only fluorescence signal to obtain a separate image without fluorescence signal.

[0085] The image processing module 15 performs image processing on different images obtained from multiple first light signals to obtain an image signal containing only one first light signal, which is adapted to the individual quality inspection requirements of multiple pollutants, so as to detect whether each pollutant meets the production requirements and improve the quality inspection efficiency.

[0086] Please see Figure 6 , Figure 6 This is a schematic diagram illustrating the steps of a microfluidic chip quality inspection method provided in an embodiment of this application. This application also provides a microfluidic chip quality inspection method, which uses the aforementioned microfluidic chip quality inspection system 10 to perform quality inspection on the microfluidic chip. This method includes, but is not limited to, the following steps.

[0087] Step S601: Move the microfluidic chip to the initial illumination position and generate a light spot for illuminating the microfluidic chip through the illumination module.

[0088] In step S602, the microfluidic chip is moved from the initial illumination position through the carrier module to pass through the light spot to form the first light signal.

[0089] It should be understood that the first light signal here refers to the light signal formed by the light spot illuminating the microfluidic chip. The first light signal is mixed with various light signals. The specific types of light signals depend on the surface of the microfluidic chip or the material on the surface. For example, when the light spot illuminates the surface of the microfluidic chip, it will generate a scattered light signal. The surface material will be excited by the light spot illumination to generate a fluorescent signal. The scattered light signal and the fluorescent signal are mixed to form the first light signal.

[0090] Step S603: Acquire the first light signal through the imaging unit to form the first pre-image signal.

[0091] It should be understood that the imaging unit here performs spot imaging in a detection mode without filtering, and uses the first light signal as the processed light signal to perform spot imaging, thereby obtaining the first pre-image signal.

[0092] In step S604, when the first pre-image signal is formed, the detection mode is switched through the filter unit and the microfluidic chip is moved to the initial illumination position through the carrier module.

[0093] It should be understood that switching detection modes here refers to switching from a non-filtering detection mode to a detection mode that filters out light signals of a preset wavelength.

[0094] In step S605, the microfluidic chip is moved from the initial illumination position through the carrier module to pass through the light spot to form a second light signal.

[0095] It should be understood that the second optical signal here refers to a specific type of the first optical signal, such as a scattered light signal, a fluorescence signal, etc., or a scattered light signal in a specific wavelength range among all the scattered light signals in the first optical signal. Those skilled in the art can filter the first optical signal by specifically setting the filter unit to obtain the specific second optical signal.

[0096] Step S606: Acquire the second optical signal through the imaging unit to form the second pre-image signal.

[0097] It should be understood that the imaging unit here performs spot imaging in a filtered detection mode, and uses the second light signal as the processed light signal to perform spot imaging, thereby obtaining the second pre-image signal.

[0098] Step S607: Perform image processing based on the first pre-image signal and the second pre-image signal to obtain the target image signal.

[0099] It should be understood that the image processing methods here are diverse and exemplary, such as using the image processing module proposed in the first aspect, or using relevant software in the terminal for processing. Those skilled in the art can select appropriate image processing methods to obtain the target image signal according to the actual situation, and this application does not limit it in this regard.

[0100] The specific implementation method of this microfluidic chip quality inspection method is basically the same as the specific implementation of the microfluidic chip quality inspection system described above, and will not be repeated here.

[0101] This application also provides a testing station that uses the microfluidic chip quality inspection system 10 described above to perform quality inspection on microfluidic chips. The specific implementation of this testing station is basically the same as the specific implementation of the microfluidic chip quality inspection system 10 described above, and will not be repeated here.

[0102] This application proposes a microfluidic chip quality inspection system and method, and a detection system. The system includes an illumination module for illuminating the microfluidic chip, a carrier module for moving the microfluidic chip, an imaging module, and a main control module connecting all other modules. The imaging module includes an imaging unit for focusing a light spot to illuminate the microfluidic chip and form a first light signal, a camera unit for imaging the microfluidic chip with a processed light signal formed according to the detection mode to obtain a light spot image signal, and a filter unit disposed between the camera unit and the imaging unit for switching detection modes to filter out a preset wavelength light signal from the first light signal. By using the imaging module formed by the imaging unit, the filter unit, and the camera unit, and by using the filter module to switch detection modes, multiple different modes of light spot image signals can be obtained with a single wavelength excitation light, thereby improving the quality inspection efficiency of the microfluidic chip and thus increasing the overall quality inspection efficiency.

[0103] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0104] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0105] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0106] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0107] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0108] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0109] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0110] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0111] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0112] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A microfluidic chip quality inspection system, characterized in that, The system includes: An illumination module is used to form a light spot to illuminate the microfluidic chip; The loading module is used to move the microfluidic chip; An imaging module includes a camera unit, a filter unit, and an imaging unit. The imaging unit focuses the light spot to illuminate the first light signal formed by the microfluidic chip. The filter unit is disposed between the camera unit and the imaging unit and is used to switch detection modes to filter out a preset wavelength light signal from the first light signal. The detection modes include a dark field detection mode and a fluorescence detection mode. The camera unit performs light spot imaging on the microfluidic chip according to the processed light signal formed by the detection modes, so as to obtain a first pre-image signal mixed with scattered light signal and fluorescence signal in the dark field detection mode and a second pre-image signal containing only fluorescence signal in the fluorescence detection mode. An image module is configured to perform image processing based on the first pre-image signal and the second pre-image signal to obtain a target image signal, wherein the target image signal does not include a fluorescence signal; The main control module is connected to the object-carrying module, the lighting module, the imaging module, and the image module, respectively.

2. The system according to claim 1, characterized in that, The lighting module includes: Laser generating unit, used to generate laser beam; A beam shaping unit is used to shape the laser beam to form the light spot; A laser transmission unit is connected to both the laser generating unit and the beam shaping unit, and is used to transmit the laser beam generated by the laser generating unit to the beam shaping unit.

3. The system according to claim 1, characterized in that, The imaging module further includes an adjustment unit, used to adjust any of the following parameters according to the adjustment signal sent by the main control module: The first focal length parameter of the camera unit, the first position parameter of the camera unit, the second focal length parameter of the imaging unit, the second position parameter of the imaging unit, and the third position parameter of the filter unit.

4. The system according to claim 1, characterized in that, The cargo-carrying module includes: A chip carrier unit is used to carry the microfluidic chip; The displacement control unit is used to control the movement of the chip carrier unit according to the scanning signal sent by the main control module.

5. The system according to claim 2, characterized in that, The laser generating unit includes: A pre-laser beam generating unit is used to generate a pre-laser beam and adjust the wavelength of the pre-laser beam to obtain the laser beam.

6. The system according to claim 1, characterized in that, The filter unit includes: A filter element is used to filter out a preset wavelength optical signal from the first optical signal; The mode switching unit is used to move the filter element in or out between the camera unit and the imaging unit to achieve the detection mode switching.

7. The system according to claim 2, characterized in that, The light spot includes a line light spot, and the imaging unit includes a linear array imaging unit. The linear array imaging unit performs line scanning on the microfluidic chip illuminated by the line light spot to form an image.

8. A method for quality inspection of microfluidic chips, characterized in that, The method is applied to the microfluidic chip quality inspection system according to any one of claims 1 to 7, and the method includes the following steps: The microfluidic chip is moved to the initial illumination position, and a light spot for illuminating the microfluidic chip is generated by the illumination module. The microfluidic chip is moved from the initial lighting position by the carrier module, so that the microfluidic chip passes through the light spot to form a first light signal; The first light signal is acquired by the imaging unit to form a first pre-image signal that is a mixture of scattered light signal and fluorescence signal; When the first pre-image signal is formed, the detection mode is switched through the filter unit and the microfluidic chip is moved to the initial illumination position through the carrier module; The microfluidic chip is moved from the initial lighting position through the light spot by the loading module to form a second light signal; The imaging unit acquires the second light signal to form a second pre-image signal containing only fluorescence signal; The target image signal is obtained by image processing based on the first pre-image signal and the second pre-image signal, wherein the target image signal does not include fluorescence signal.

9. A detection system, characterized in that, The microfluidic chip quality inspection system as described in any one of claims 1 to 7 is used to perform quality inspection on the microfluidic chip.

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