An OCR rapid positioning device for semiconductor wafer transport systems

Abstract

This invention discloses an OCR rapid positioning device for a semiconductor wafer transport system. A rotating clamping mechanism, a first plate, a second plate, and a third plate are disposed on a substrate. The first plate, second plate, and third plate are respectively connected to a first side alignment mechanism, a second side adjustment mechanism, and a third side adjustment mechanism. The rotating clamping mechanism cooperates with a wafer support stage in a PA device to clamp or release the wafer support stage. The first side alignment mechanism is used to adjust the gap between the first plate and one side of the base in the PA device. The second side adjustment mechanism is used to adjust the angle of the first side of the OCR device and record its relative position to the second plate. The third side adjustment mechanism is used to adjust the angle of the second side of the OCR device and record its relative position to the third plate. A height detection mechanism is disposed above the OCR device to measure the distance between the top of the OCR device and the substrate.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor equipment, and more specifically to an OCR rapid positioning device for semiconductor wafer transport systems. Background Technology

[0002] Currently, the adsorption grippers and adsorption adjusters (hereinafter referred to as PAs) used in the industry cannot guarantee that their relative positions with the wafers are consistent during wafer ID reading.

[0003] On the one hand, slight differences in the position of the wafer wafer in the wafer cassette can lead to different relative positions of the wafer wafer and the gripper during wafer retrieval. After being placed in the PA device, the relative position of the center of the wafer wafer and the center of the PA device will also be different, resulting in a difference between the final position of the wafer wafer and the relative position of the OCR device. As a result, when using the OCR device to read the wafer ID, the different position of the wafer wafer affects the success rate of reading, which in turn affects the working efficiency of the entire machine.

[0004] On the other hand, when multiple machines are generating simultaneously, if one machine fails to read the OCR, and after the on-site engineer successfully debugs it, in order to ensure smooth subsequent production, the remaining machines need to be debugged using the same method. This makes it impossible to quickly copy the successfully debugged location to other machines, which is time-consuming and labor-intensive. Summary of the Invention

[0005] This invention provides an OCR rapid positioning device for a semiconductor wafer transport system, which can quickly calibrate and adjust the position of a wafer placed on a PA device relative to the OCR device, thereby enabling rapid adjustment of the OCR device and rapid replication of the wafer's position relative to the PA device and the OCR device to other machines, saving labor costs and improving work efficiency.

[0006] This invention can be achieved through the following technical solutions:

[0007] An OCR rapid positioning device for a semiconductor wafer transport system includes a substrate. A rotary clamping mechanism, a first plate, a second plate, and a third plate are disposed on the substrate. The first plate is connected to a first side alignment mechanism, the second plate is connected to a second side adjustment mechanism, and the third plate is connected to a third side adjustment mechanism.

[0008] The rotary clamping mechanism cooperates with the wafer support stage in the PA equipment and adopts a three-jaw clamping structure for clamping or releasing the wafer support stage;

[0009] The first side alignment mechanism is used to adjust the gap between the first plate and one side of the base in the PA device so that the two are in contact; the second side adjustment mechanism is used to adjust the position and angle of the first side of the OCR device so that the OCR device can accurately read the wafer ID on the PA device and record the relative position of the first side and the second plate; the third side adjustment mechanism is used to adjust the position and angle of the second side of the OCR device so that the OCR device can accurately read the wafer ID on the PA device and record the relative position of the second side and the third plate, and the first side and the second side are connected.

[0010] A height detection mechanism is provided above the top of the OCR device, which is used to measure the distance between the top of the OCR device and the substrate.

[0011] Furthermore, the first side alignment mechanism includes a first dovetail slider disposed on the top of the first plate. The first dovetail slider cooperates with a first slide rail. The first slide rail is disposed directly above one side of the PA device, and its line is perpendicular to one side of the PA device and in contact with the bottom surface of the substrate. A first knob is disposed on the substrate. The first knob passes through the substrate, the first slide rail, and makes movable contact with the top of the first dovetail slider. Loosening the first knob allows the first dovetail slider and the first plate to move along the first slide rail. Tightening the first knob locks the position of the first dovetail slider and the first plate on the first slide rail.

[0012] The second side adjustment mechanism includes a second dovetail slider disposed on the top of the second flat plate. The second dovetail slider cooperates with a second slide rail, which is disposed directly above the first side of the OCR device. The slide rail is perpendicular to the first side and contacts the bottom surface of the substrate. Three adjusting bolts are vertically disposed on the second flat plate. These bolts are not collinear and all pass through the second flat plate towards the first side. By adjusting the length of the three adjusting bolts extending out of the second flat plate, the position and angle of the first side are changed, enabling the OCR device to accurately read the wafer ID on the PA device.

[0013] A second knob is provided on the substrate. The second knob passes through the substrate and the second slide rail and makes movable contact with the top of the second dovetail slider. Loosening the second knob allows the second dovetail slider and the second plate to move along the second slide rail. Tightening the second knob locks the position of the second dovetail slider and the second plate on the second slide rail.

[0014] The third side adjustment mechanism includes a third dovetail slider mounted on the top of the third plate. The third dovetail slider cooperates with a third slide rail, which is positioned directly above the second side of the OCR device. The slide rail's line is perpendicular to the second side and contacts the bottom surface of the substrate. Two non-collinear adjusting bolts are vertically mounted on the third plate, both extending through the plate towards the second side. By adjusting the length of these two adjusting bolts extending beyond the third plate, the position and angle of the second side are changed, enabling the OCR device to accurately read the wafer ID on the PA device.

[0015] A third knob is provided on the substrate. The third knob passes through the substrate, the third slide rail, and makes movable contact with the top of the third dovetail slider. Loosening the third knob allows the second dovetail slider and the third plate to move along the third slide rail. Tightening the third knob locks the position of the third dovetail slider and the third plate on the third slide rail.

[0016] Furthermore, the axial center lines of the first slide rail and the second slide rail are collinear or parallel to each other. A scale is provided on the surface of the substrate corresponding to the positions of the first dovetail slide block, the second dovetail slide block, and the third dovetail slide block. The scale is provided along the moving direction of the first dovetail slide block, the second dovetail slide block, and the third dovetail slide block. Indicating arrows pointing to the scale are provided on the sides of the first dovetail slide block, the second dovetail slide block, and the third dovetail slide block.

[0017] Furthermore, grooves are provided on the contact surfaces of the first, second, and third dovetail groove sliders and their corresponding first, second, and third slide rails, respectively. Brake blocks are provided inside the cavities formed by two corresponding upper and lower grooves. The gap between the brake blocks and the cavities is smaller than the gap between the first, second, and third dovetail groove sliders and their corresponding first, second, and third slide rails.

[0018] The first knob, the second knob, and the third knob pass through the grooves on the bottom surfaces of the first dovetail groove slider, the second dovetail groove slider, and the third dovetail groove slider, respectively, and make contact with the corresponding brake blocks.

[0019] Furthermore, the height detection mechanism includes a pen-shaped elevation ruler, the tip of which passes through the substrate and faces the top surface of the OCR device. A fourth knob is provided on the side of the substrate corresponding to the elevation ruler position, and the fourth knob passes through the substrate and makes movable contact with the elevation ruler.

[0020] Loosen the fourth knob to move the height ruler up and down relative to the substrate so that the tip of the height ruler contacts the top surface of the OCR device; tighten the fourth knob to lock the position of the height ruler on the substrate.

[0021] Furthermore, the rotary clamping mechanism includes a star-shaped knob, the rotating shaft of which passes through the substrate and is connected to the center of the cam. The cam and two stops are arranged around the wafer support stage at a 120-degree interval. Rotating the star-shaped knob changes the contact position between the cam and the wafer support stage, thereby clamping or releasing the wafer support stage.

[0022] Furthermore, an extension surface is provided at the contact position between the cam, the stop block and the wafer support stage.

[0023] The beneficial technical effects of this invention are as follows:

[0024] 1. By setting the rapid positioning device of the present invention on the PA equipment and the OCR equipment, the PA equipment is positioned by means of the rotating clamping mechanism and the first side alignment mechanism, and the OCR equipment is positioned and adjusted by means of the second side adjustment mechanism, the third side adjustment mechanism and the height detection mechanism. This ensures that the OCR equipment can accurately read the wafer ID on the PA equipment. At the same time, the rotating clamping mechanism can be used to easily remove the entire rapid positioning device from the PA equipment and install it on other machines to be debugged. Then, according to the position of the OCR equipment relative to the PA equipment recorded on the rapid positioning device, the OCR equipment on the machine to be adjusted is adjusted, ensuring the consistency of all machines and providing a foundation for smooth subsequent production.

[0025] 2. The rotary clamping mechanism adopts a three-jaw clamping structure, one of which is a cam. By utilizing the asymmetry of the cam, the clamping and release of the wafer support stage can be achieved. The structure is simple and the function is stable.

[0026] 3. By using the dovetail slider and slide rail in the second and third side adjustment mechanisms, the second and third plates are positioned to the OCR equipment. Combined with the adjustment bolts, the angle of the OCR equipment can be adjusted to ensure that the OCR equipment can accurately read the wafer ID and record the relative position of the OCR equipment at this time. Finally, combined with the gap position of the OCR equipment relative to the substrate obtained by the height detection mechanism, the positioning of the OCR equipment in front, back, left, right and up is completed, providing an adjustment basis for subsequent machine replication and ensuring the consistency of all machines.

[0027] 4. The entire device has a simple structure, is easy to adjust and operate, and is easy to promote and apply. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the exploded structure of the present invention;

[0030] Among them, 1-substrate, 2-first plate, 3-second plate, 4-third plate, 5-PA device, 6-OCR device, 7-star knob, 8-cam, 9-stop block, 10-first dovetail slide block, 11-first knob, 12-second dovetail slide block, 13-adjusting bolt, 14-second knob, 15-third dovetail slide block, 16-third slide rail, 17-third knob, 18-slide rail, 19-brake block, 20-elevation ruler, 21-fourth knob. Detailed Implementation

[0031] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings and preferred embodiments.

[0032] like Figure 1-2 As shown, the present invention provides an OCR rapid positioning device for a semiconductor wafer transfer system, including a substrate 1. A rotating clamping mechanism, a first plate 2, a second plate 3, and a third plate 4 are disposed on the substrate 1. The first plate 2 is connected to a first side alignment mechanism, the second plate 3 is connected to a second side adjustment mechanism, and the third plate 4 is connected to a third side adjustment mechanism. The rotating clamping mechanism cooperates with a wafer support stage in a PA device 5, employing a three-jaw clamping structure for clamping or releasing the wafer support stage. The first side alignment mechanism is used to adjust the gap between the first plate 2 and one side of the base in the PA device 5, so that the two are in contact. The OCR device 6 has a first side adjustment mechanism for adjusting the position and angle of its first side, enabling it to accurately read the wafer ID on the PA device 5 and record the relative position of the first side and the second plate 2. A third side adjustment mechanism is also used to adjust the position and angle of the second side of the OCR device 6, allowing it to accurately read the wafer ID on the PA device 5 and record the relative position of the second side and the third plate 3. The first and second sides are connected. A height detection mechanism is located above the top of the OCR device 6 to measure the distance between the top of the OCR device 6 and the substrate 1. Thus, the PA device is positioned using the first side alignment mechanism and the rotating clamping mechanism. Simultaneously, the OCR device is adjusted and positioned using the second side adjustment mechanism, the third side adjustment mechanism, and the height detection mechanism, enabling it to more accurately read the wafer ID on the PA device. Connecting the two via the substrate allows for faster and more accurate replication to other machines, reducing debugging time, improving operational efficiency, and enhancing practicality.

[0033] Specifically as follows:

[0034] The rotary clamping mechanism includes a star-shaped knob 7, the axis of which passes through the substrate 1 and is connected to the center of the cam 8. The cam 8 and two stops 9 are arranged around the wafer support stage at a 120-degree interval, so that the three can achieve three-jaw clamping of the wafer support stage. Therefore, rotating the star-shaped knob 7 can drive the cam 8 to rotate, thereby changing the contact position between the cam 8 and the wafer support stage, realizing clamping or releasing of the wafer support stage.

[0035] To improve the contact of the clamping mechanism, we have provided extended surfaces at the contact points between the cam 8, the stop block 9 and the wafer support stage. These extended surfaces can be made of rubber material to achieve flexible contact with the wafer support stage.

[0036] The first side alignment mechanism includes a first dovetail slider 10 disposed on the top of the first plate 2. The first dovetail slider 10 cooperates with a first slide rail, which is disposed directly above one side of the PA device 5. The line of the first slide rail is perpendicular to one side of the PA device 5 and contacts the bottom surface of the substrate 1. A first knob 11 is disposed on the substrate 1. The first knob 11 passes through the substrate 1, the first slide rail, and makes movable contact with the top of the first dovetail slider 10. That is, when the first knob 11 is loosened, the first dovetail slider 10 together with the first plate 2 can move along the first slide rail until the first plate 2 contacts the side of the base in the PA device 5, thereby positioning the PA device 5. When the first knob 11 is tightened, the position of the first dovetail slider 10 together with the first plate 2 on the first slide rail is locked, and the position at this time can be fixed and recorded for subsequent debugging needs.

[0037] The second side adjustment mechanism includes a second dovetail slider 12 disposed on the top of the second plate 3. The second dovetail slider 12 cooperates with a second slide rail, which is disposed directly above the first side of the OCR device 6. Its line is perpendicular to the first side and contacts the bottom surface of the substrate 1. Three adjustment bolts 13 are vertically disposed on the second plate 3. They are not collinear and all pass through the second plate 3 and face the first side. By rotating the three adjustment bolts 13, their lengths extending out of the second plate 3 are adjusted, thus pushing the first side of the OCR device 6 to change its position and angle, so that it rotates in the direction that can more accurately read the wafer ID. At the same time, the position is recorded by the extension length of the three adjustment bolts 13. In order to improve stability, each adjustment bolt is also locked with a nut.

[0038] A second knob 14 is provided on the substrate 1. The second knob 14 passes through the substrate 1, the second slide rail and makes contact with the top of the second dovetail slider 12. Similar to the first side alignment mechanism, when the second knob 14 is loosened, the second dovetail slider 12 and the second plate 3 can move along the second slide rail until the second plate 3 contacts the first side of the OCR device 6, providing an adjustment basis for the three adjustment bolts 13 subsequently set on the second plate 3; when the second knob 14 is tightened, the position of the second dovetail slider 12 and the second plate 3 on the second slide rail is locked, and the position of the second plate 3 at this time is also recorded.

[0039] Similar to the second side adjustment mechanism, the third side adjustment mechanism includes a third dovetail slider 15 located on the top of the third plate 4. The third dovetail slider 15 cooperates with the third slide rail 16, which is located directly above the second side of the OCR device 6. Its line is perpendicular to the second side and contacts the bottom surface of the substrate 1. Two adjustment bolts 13 are vertically arranged on the third plate 4. They are not collinear and both pass through the third plate 4 and face the second side. By rotating the two adjustment bolts 13, their lengths extending out of the third plate 4 are adjusted, which can push the second side of the OCR device 6 to change its position and angle, so that it can rotate in the direction that can more accurately read the wafer ID. At the same time, the position is recorded by the extension length of the three adjustment bolts 13. Since both the first and second sides belong to the OCR device 6, they can be adjusted together. The benchmark is that the OCR device 6 can more accurately read the wafer ID. Of course, in order to improve stability, each adjustment bolt must also be locked with a nut.

[0040] A third knob 17 is provided on the base plate 1. The third knob 17 passes through the base plate 1, the third slide rail 16 and makes contact with the top of the third dovetail slider 15. Loosening the third knob 17 allows the third dovetail slider 15 and the third plate 4 to move along the third slide rail 16 until the third plate 4 contacts the second side, providing an adjustment base for the two adjusting bolts 13 subsequently set on the third plate 4. Tightening the third knob 17 locks the position of the third dovetail slider 15 and the third plate 4 on the third slide rail 16, and the position of the second plate 4 at this time can also be recorded.

[0041] Normally, PA device 5 and OCR device 6 should be set in parallel or at similar angles. Therefore, the axial center lines of the first and second slide rails can be collinear or parallel to each other, or even integrally formed into a slide rail 18. In this way, the corresponding first plate 2 and second plate 3 are set in parallel and perpendicular to the third plate 4, which makes it easier to manufacture the invention's rapid positioning device.

[0042] A scale is provided on the surface of the substrate 1 at the positions corresponding to the first dovetail slider 10, the second dovetail slider 12, and the third dovetail slider 15. The scale is set along the moving direction of the first dovetail slider 10, the second dovetail slider 12, and the third dovetail slider 15. Indicating arrows pointing to the scale are provided on the sides of the first dovetail slider 10, the second dovetail slider 12, and the third dovetail slider 15. This can more clearly indicate the moving position of each dovetail slider, making it easier for the subsequent machine to replicate. It can also prevent the dovetail sliders from moving accidentally, causing confusion in the machine replication.

[0043] The first dovetail slider 10, the second dovetail slider 12, and the third dovetail slider 15 all have grooves on their contact surfaces with the corresponding first slide rail, second slide rail, and third slide rail 16. Brake blocks 19 are installed inside the cavities formed by two corresponding upper and lower grooves. The gap between the brake block 19 and the cavity is smaller than the gap between the first dovetail slider 10, the second dovetail slider 12, and the third dovetail slider 15 and the corresponding first slide rail, second slide rail, and third slide rail 16. The first knob 11, the second knob 14, and the third knob 17 pass through the grooves on the bottom surfaces of the first dovetail slider 10, the second dovetail slider 12, and the third dovetail slider 15, respectively, and make active contact with the corresponding brake blocks. Similar to the locking mechanism described above, the first knob, the second knob, and the third knob can quickly move or lock the dovetail slider on the corresponding slide rail. In addition, if the channel where the groove is located is in the same direction as the slide rail and runs through the dovetail slide block, baffles need to be installed at both ends of the dovetail slide block corresponding to the groove to prevent the brake block from falling out of the groove.

[0044] The height detection mechanism includes a pen-shaped height ruler 20, the tip of which passes through the substrate and faces the top surface of the OCR device 6. A fourth knob 21 is provided on the side of the substrate 1 corresponding to the position of the height ruler 20. The fourth knob 21 passes through the substrate 1 and makes contact with the height ruler 20. Loosening the fourth knob 21 moves the height ruler 20 up and down relative to the substrate 1 so that the tip of the height ruler 20 contacts the top surface of the OCR device 6, thereby measuring the distance between the top surface of the OCR device 6 and the substrate 1. Tightening the fourth knob 21 locks the height ruler 20 in the position on the substrate 1, and the height position at this time is recorded.

[0045] When adjusting using the OCR quick positioning device of the present invention, first position the two stops of the rotating clamping mechanism on the wafer support stage, rotate the star knob to drive the cam to rotate, realize the three-point clamping of the wafer support stage, and thus set the entire quick positioning device on the PA equipment and OCR equipment.

[0046] Then, using the first side alignment mechanism, adjust the distance between the first plate and one side of the base in the PA device until they contact each other, locking the position of the first plate. Then, using the second side adjustment mechanism, adjust the gap between the second plate and the first side in the OCR device until they contact each other. Subsequently, according to the needs of reading the wafer ID, adjust the extension length of the three adjustment bolts on the second plate to change the position and angle of the first side, i.e., the OCR device. Similarly, using the third side adjustment mechanism, adjust the gap between the third plate and the second side in the OCR device until they contact each other. Subsequently, according to the needs of reading the wafer ID, adjust the extension length of the two adjustment bolts on the third plate to change the position and angle of the second side, i.e., the OCR device. The purpose is to improve the accuracy of reading the wafer ID. Of course, the adjustment of the first and second sides of the OCR device can be carried out in conjunction. After the two sides of the OCR device are adjusted, the distance between the top surface of the OCR device and the substrate can be measured using the height detection mechanism, and the position of the height ruler can be locked, i.e., the position is recorded.

[0047] Finally, by rotating the star-shaped knob to release the three-point clamping on the wafer support stage, the entire OCR rapid positioning device can be removed from the current machine. Since the OCR rapid positioning device has recorded the position of the OCR device relative to the PA device, as long as the rotating clamping mechanism of the OCR rapid positioning device is used to position the entire device on the machine to be adjusted, the position of the OCR device can be adjusted according to the recorded positions in the second side adjustment mechanism, the second side adjustment mechanism, and the height detection mechanism. This ensures that, under the premise of accurate wafer ID reading, the relative positions of the PA device and the OCR device in all machines are consistent, providing a foundation for smooth subsequent production.

[0048] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples. Various changes or modifications can be made to these embodiments without departing from the principles and essence of the present invention. Therefore, the scope of protection of the present invention is defined by the appended claims.

Claims

1. An OCR rapid positioning device for semiconductor wafer transfer systems, characterized in that: The system includes a substrate, on which a rotating clamping mechanism, a first plate, a second plate, and a third plate are disposed. The first plate is connected to a first side alignment mechanism, the second plate is connected to a second side adjustment mechanism, and the third plate is connected to a third side adjustment mechanism. The rotary clamping mechanism cooperates with the wafer support stage in the PA equipment and adopts a three-jaw clamping structure for clamping or releasing the wafer support stage; The first side alignment mechanism is used to adjust the gap between the first plate and one side of the base in the PA device so that the two are in contact; the second side adjustment mechanism is used to adjust the position and angle of the first side of the OCR device so that the OCR device can accurately read the wafer ID on the PA device and record the relative position of the first side and the second plate; the third side adjustment mechanism is used to adjust the position and angle of the second side of the OCR device so that the OCR device can accurately read the wafer ID on the PA device and record the relative position of the second side and the third plate, and the first side and the second side are connected. A height detection mechanism is provided above the top of the OCR device, which is used to measure the distance between the top of the OCR device and the substrate; The height detection mechanism includes a pen-shaped height ruler with its tip passing through the substrate and facing the top surface of the OCR device. A fourth knob is located on the side of the substrate corresponding to the height ruler's position, and the fourth knob passes through the substrate and makes contact with the height ruler. Loosening the fourth knob moves the height ruler up and down relative to the substrate so that the tip of the height ruler contacts the top surface of the OCR device. Tightening the fourth knob locks the height ruler in its position on the substrate. The rotary clamping mechanism includes a star-shaped knob, the axis of which passes through the substrate and is connected to the center of the cam. The cam and two stops are arranged around the wafer support stage at a 120-degree interval. Rotating the star-shaped knob changes the contact position between the cam and the wafer support stage, thereby clamping or releasing the wafer support stage.

2. The OCR rapid positioning device for a semiconductor wafer transport system according to claim 1, characterized in that: The first side alignment mechanism includes a first dovetail slider disposed on the top of the first plate. The first dovetail slider cooperates with a first slide rail. The first slide rail is disposed directly above one side of the PA device, and its line is perpendicular to one side of the PA device and in contact with the bottom surface of the substrate. A first knob is disposed on the substrate. The first knob passes through the substrate, the first slide rail and makes movable contact with the top of the first dovetail slider. Loosening the first knob allows the first dovetail slider together with the first plate to move along the first slide rail. Tightening the first knob locks the position of the first dovetail slider together with the first plate on the first slide rail. The second side adjustment mechanism includes a second dovetail slider disposed on the top of the second flat plate. The second dovetail slider cooperates with a second slide rail, which is disposed directly above the first side of the OCR device. The slide rail is perpendicular to the first side and contacts the bottom surface of the substrate. Three adjusting bolts are vertically disposed on the second flat plate. These bolts are not collinear and all pass through the second flat plate towards the first side. By adjusting the length of the three adjusting bolts extending out of the second flat plate, the position and angle of the first side are changed, enabling the OCR device to accurately read the wafer ID on the PA device. A second knob is provided on the substrate. The second knob passes through the substrate and the second slide rail and makes movable contact with the top of the second dovetail slider. Loosening the second knob allows the second dovetail slider and the second plate to move along the second slide rail. Tightening the second knob locks the position of the second dovetail slider and the second plate on the second slide rail. The third side adjustment mechanism includes a third dovetail slider mounted on the top of the third plate. The third dovetail slider cooperates with a third slide rail, which is positioned directly above the second side of the OCR device. The slide rail's line is perpendicular to the second side and contacts the bottom surface of the substrate. Two non-collinear adjusting bolts are vertically mounted on the third plate, both extending through the plate towards the second side. By adjusting the length of these two adjusting bolts extending beyond the third plate, the position and angle of the second side are changed, enabling the OCR device to accurately read the wafer ID on the PA device. A third knob is provided on the substrate. The third knob passes through the substrate, the third slide rail, and makes movable contact with the top of the third dovetail slider. Loosening the third knob allows the second dovetail slider and the third plate to move along the third slide rail. Tightening the third knob locks the position of the third dovetail slider and the third plate on the third slide rail.

3. The OCR rapid positioning device for a semiconductor wafer transport system according to claim 2, characterized in that: The axial center lines of the first slide rail and the second slide rail are collinear or parallel to each other. A scale is provided on the surface of the substrate corresponding to the positions of the first dovetail slide block, the second dovetail slide block, and the third dovetail slide block. The scale is provided along the moving direction of the first dovetail slide block, the second dovetail slide block, and the third dovetail slide block. Indicating arrows pointing to the scale are provided on the sides of the first dovetail slide block, the second dovetail slide block, and the third dovetail slide block.

4. The OCR rapid positioning device for a semiconductor wafer transport system according to claim 2, characterized in that: The first, second, and third dovetail groove sliders each have grooves on their contact surfaces with the corresponding first, second, and third slide rails. Brake blocks are installed inside the cavities formed by two corresponding upper and lower grooves. The gap between the brake blocks and the cavities is smaller than the gap between the first, second, and third dovetail groove sliders and the corresponding first, second, and third slide rails. The first knob, the second knob, and the third knob pass through the grooves on the bottom surfaces of the first dovetail groove slider, the second dovetail groove slider, and the third dovetail groove slider, respectively, and make contact with the corresponding brake blocks.

5. The OCR rapid positioning device for a semiconductor wafer transport system according to claim 1, characterized in that: An extension surface is provided at the contact position between the cam, the stop block and the wafer support stage.

Images