A computer thermal characteristic coupling correction evaluation method

Abstract

The present application relates to a kind of computer thermal characteristics coupling correction evaluation methods, evaluation method is realized in the case where box and module are separated, steps are as follows: 1, first, respectively obtain the thermal resistance data of each box end coupling surface and each module device, wherein the thermal resistance of each module device includes module device thermal resistance and the thermal resistance between the coupling surface of two ends of module itself;2, then, the global thermal resistance of each module and box combination is updated, the heat flow distribution data of module and box coupling surface in the case where box and single module are combined is calculated;3, according to the homogeneity principle of linear time invariant system, the temperature rise distribution data of all coupling surfaces is obtained;4, according to the superposition principle of linear time invariant system, the temperature data of coupling place when multiple modules coexist is calculated, and according to the heat flow distribution data of coupling place obtained above and the thermal resistance distribution data of each module device, the temperature data of each module device is backstepped.The present application improves the estimation efficiency and provides convenience for estimation work.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of thermal reliability, and particularly relates to a computer thermal characteristic coupling correction evaluation method. BACKGROUND

[0002] The notebook display is also commonly known as a computer monitor or computer screen, and is the most important computer component except for a CPU, a mainboard, a memory, a power supply, a keyboard and a mouse, and is a display tool for displaying certain electronic file information on a screen and then reflecting the screen to human eyes through specific transmission equipment.

[0003] At present, the notebook computer is required to be used in a very wide environment, such as field operation, vehicle, ship and airborne operation, and the use environment is becoming more and more harsh, so the requirement for the notebook display is also becoming higher and higher. For example, the notebook display needs to be stable and firm in a harsh environment such as bumping and swinging, and cannot swing forward and backward to hinder the operator from observing the screen. Meanwhile, with the opening and closing or forward and backward swinging of the notebook display, the damping shaft between the screen and the notebook computer will also be worn, and when the wear reaches a certain degree, the effect of the damping shaft will also gradually decrease. Therefore, a fixing device capable of supporting and fixing the notebook display is urgently needed to ensure that the notebook display can be fixed firmly after being opened. SUMMARY

[0004] The application aims at overcoming the defects of the prior art, and provides a computer thermal characteristic coupling correction evaluation method.

[0005] The above object of the application is achieved by the following technical scheme.

[0006] A computer thermal characteristic coupling correction evaluation method, characterized in that the evaluation method is realized in the case that a box body and a module are separated, and the basic surfaces for obtaining thermal resistance data are defined as a box body end coupling surface, a module end coupling surface and a device surface, and the method comprises the following steps.

[0007] Step 1: Firstly, thermal resistance data of each box body end coupling surface and each module device are obtained respectively, wherein the thermal resistance of each module device includes module device thermal resistance and thermal resistance between two end coupling surfaces of the module itself.

[0008] Step 2: Then, global thermal resistance of each module and box body combination is updated, and thermal flow distribution data of the module and the box body coupling surface in the case that the box body and a single module are combined are calculated.

[0009] Step 3: Temperature rise distribution data of all coupling surfaces are calculated according to the homogeneity principle of a linear time-invariant system.

[0010] Step 4, according to the superposition principle of linear time-invariant system, the temperature data at the coupling place when multiple modules coexist is calculated, and according to the heat flow distribution data and the thermal resistance distribution data of each module device obtained in the previous step, the temperature data of each module device is back calculated.

[0011] Further: in step 1, the data acquisition method of each box end coupling surface thermal resistance is:

[0012] 1) A plurality of probes are arranged on all box end coupling surfaces, wherein the numbering of the box end coupling surfaces is 1 to m;

[0013] 2) A surface heat source is installed at one of the box end coupling surfaces, and a heat flow Q is input. When the external strong convection environment is constant, the steady-state temperature difference between all box end coupling surfaces and the external strong convection environment is obtained through the probe, and the steady-state thermal resistance [R] between the box end coupling surface and the external strong convection environment is calculated;

[0014] 3) The remaining numbered box end coupling surfaces are traversed in turn by using the method of the previous step; the steady-state thermal resistance of all box end coupling surfaces and the external strong convection environment is obtained;

[0015] 4) The steady-state thermal resistance data of all box end coupling surfaces and the external strong convection environment is transmitted to the one-dimensional simulation analysis software Amesim, and a thermal network layer is constructed.

[0016] Further: the calculation of the steady-state thermal resistance [R] of the box end coupling surface and the external strong convection environment is:

[0017] The box section has m groups of box end coupling surfaces, numbered as k, k = 1 ~ m, and the box model is disassembled into m dry areas, each area corresponding to four nodes, namely: upper outer node WS, upper inner node NS, lower outer node WX, and lower inner node NX. Nodes WS, WX, NS, and NX all have m, k = 1 ~ m; the two sides of the box can be regarded as a whole, respectively denoted as L and R. According to the principle that the algebraic sum of the inputs of each branch of the node is zero, the expressions for the WS, WX, NS, and NX nodes numbered k are shown in Formulas 1-4, the expressions for the L and R nodes are shown in Formulas 5 and 6, and the constraint conditions are shown in Formulas 7 and 8.

[0018]

[0019] When k = 1,

[0020] When k = m,

[0021] Further: in step 1, the data acquisition method of each module device thermal resistance is:

[0022] 1) First, arrange several probes around the module end coupling surface and the device, and the device number in the module is 1 to n;

[0023] 2) Install a heat source on the surface of the device numbered 1, input heat flow q, when the convection environment of the module end coupling surface is certain, obtain the steady-state temperature difference between the device numbered 1 to n and the module end coupling surface through the probe, and calculate the steady-state thermal resistance [r] between the device numbered 1 and the module end coupling surface;

[0024] 3) Use the method of the previous step to traverse the remaining numbered devices in turn; finally, all data is transmitted to the one-dimensional simulation analysis software Amesim to build a coupling calculation framework associated with the thermal network layer.

[0025] Further: in step 1, the module device thermal resistance calculation method is:

[0026] Suppose there are n devices in the module, and the device number i = 1 ~ n; when calculating the thermal resistance of each device to the upper and lower coupling surfaces of the module, the upper and lower coupling surfaces need to use isothermal boundary, the average temperature of the upper coupling surface is denoted as TS i，1 , the average temperature of the lower coupling surface is denoted as TX i，2 , including the following steps:

[0027] 1) First, input a specified power P i，1 at the device, let the module dissipate on the upper coupling surface and keep the lower coupling surface at a constant temperature, get the average temperature of the upper coupling surface denoted as TS i，1 , the average temperature of the lower coupling surface denoted as TX i，1 , and obtain the steady-state average temperature of the heat generating device at this time as T i，1 ;

[0028] 2) Then input a specified power P i，2 at the device, let the module only dissipate on the lower coupling surface and keep the upper coupling surface at a constant temperature, get the average temperature of the lower coupling surface denoted as TX i，2 , the average temperature of the upper coupling surface denoted as TS i，2 , and obtain the steady-state average temperature of the heat generating device at this time as T i，2 ;

[0029] 3) According to the processing of the previous two steps, obtain the thermal resistance RS i of each device to the upper coupling surface and the thermal resistance RX i of each device to the lower coupling surface, according to the node distribution characteristics of the device heat flow in the module, and arrange to obtain formulas (9) and (10):

[0030]

[0031] Further: in step 1, the method for obtaining the thermal resistance between the two end coupling surfaces of the module itself is:

[0032] In the thermal resistance R between the coupling surfaces at both ends of the module MK In solving, several probes are arranged at the coupling surfaces at both ends of the module, a constant heat flow P is input at the coupling surface at one end of the module by means of one test or simulation, and the average temperature conditions of the coupling surfaces at both ends are observed, TS and TX represent the steady-state average temperatures of the upper and lower coupling surfaces respectively, and the thermal resistance of the module is obtained as shown in the following formula;

[0033]

[0034] Further, step 2 is specifically:

[0035] The heat flow input at the upper and lower coupling surfaces of the kth slot module And The heat flow respectively distributed to the upper and lower coupling surfaces by the devices in the module Or The sum, as shown in formulas 12 and 13; Rkiu represents the thermal resistance between the ith heat source in the kth slot module and the upper coupling surface, RkiL represents the thermal resistance between the ith heat source in the kth slot module and the lower coupling surface;

[0036]

[0037] Further, step 3 is: synthesizing formulas (1)-(8) and (12) and (13), solving the temperature of each coupling surface in each heat network layer, and obtaining the actual temperature data TS by superimposing the corresponding coupling surface data in the C heat network layers k And TX k As shown in formulas 14 and 15;

[0038]

[0039] Further, step 4 is: according to the principle that the temperature at the heat source node is constant along the heat flow path, the actual temperature data of the module device is back calculated, as shown in formula 16, and the actual temperature of the heat source node is calculated

[0040]

[0041] The present application has the advantages and positive effects:

[0042] 1. In the heat estimation aspect, the present application is beneficial to constructing a data set, improving the estimation efficiency, and providing convenience for estimation work.

[0043] 2. In the heat design aspect, the present application will become a good simulation verification tool, clearly defines the design boundary, improves the accuracy of simulation data, and further improves the effective degree of system-level correlation.

[0044] 3. In terms of thermal testing, this invention can play a positive role in clarifying the true performance limits of equipment and standardizing the layout of cabinet slots and module components in both front-end and back-end product testing stages.

[0045] 4. In terms of thermal management, this invention will further enhance the level of refinement in aspects such as the influence of PCB board wiring scheme on its heat transfer characteristics, the micro-nano structure of components and heat generation principle, and the heat transfer characteristics of complex composite cold plates.

[0046] 5. In terms of thermal maintenance, this invention reduces the complexity of thermal system coupling and improves the convenience of system maintenance. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of a computer.

[0048] Figure 2 This is a schematic diagram of the thermal property coupling correction evaluation method;

[0049] Figure 3 This is a diagram illustrating how data such as thermal resistance of each compartment is obtained.

[0050] Figure 4 This is a diagram illustrating how data such as thermal resistance of each module component is obtained;

[0051] Figure 5 This is a flowchart for acquiring data on heat flow and temperature rise distribution at the coupling surface when the enclosure is combined with a single module.

[0052] Figure 6 This is a schematic diagram of the module's thermal resistance. Figure 1 ;

[0053] Figure 7 This is a schematic diagram of the module's thermal resistance. Figure 2 ;

[0054] Figure 8 This is a diagram showing the disassembly of the box model;

[0055] Figure 9 This is a schematic diagram of the heating network layer;

[0056] Figure 10 This is a schematic diagram of the coupled solution framework. Detailed Implementation

[0057] The structure of the present invention will be further described below with reference to the accompanying drawings and embodiments. It should be noted that these embodiments are descriptive and not limiting.

[0058] Computer form diagram as shown Figure 1The computer is composed of a box and a module, and the computer thermal characteristic coupling correction evaluation method is implemented in the case of the box and the module being separated, thereby generating a box end coupling surface and a module end coupling surface.

[0059] The thermal characteristic coupling correction evaluation method is shown in the figure Figure 2 Firstly, the thermal resistance data of each box slot and each module device are obtained respectively; then, the global thermal resistance of each module and the box combination is updated, the heat flow distribution data of the module and the box coupling surface in the case of the box and a single module combination is calculated; then, the temperature rise distribution data of all coupling surfaces is calculated according to the homogeneity principle of the linear time-invariant system; finally, the temperature data of the coupling place in the case of multiple modules coexisting is calculated according to the superposition principle of the linear time-invariant system, and the temperature data of each module device is back calculated according to the heat flow distribution data of the coupling place obtained in the foregoing and the thermal resistance distribution data of each module device.

[0060] The data acquisition method of each box end coupling surface thermal resistance and the like described in the application is shown in the figure Figure 3 Firstly, a plurality of probes are arranged on all the box end coupling surfaces, and the box end coupling surfaces in the foregoing computer are numbered as 1 to m; then, a surface heat source is installed at one of the box end coupling surfaces, and a heat flow Q is input; when the external strong convection environment is constant, the steady-state temperature difference between all the box end coupling surfaces and the external strong convection environment can be obtained by using the probes, and the steady-state thermal resistance [R] between the box end coupling surface and the external strong convection environment is calculated; then, the remaining numbered box end coupling surfaces are traversed by using the method in the foregoing step; finally, all the data are transmitted to a one-dimensional simulation analysis software Amesim to construct a thermal network graph layer for subsequent use.

[0061] The data acquisition method of each module device thermal resistance and the like described in the application is shown in the figure Figure 4 Firstly, a plurality of probes are arranged near all the module end coupling surfaces and devices, and the devices in the foregoing module are numbered as 1 to n; then, a surface heat source is installed on the surface of the device numbered as 1, and a heat flow q is input; when the convection environment of the module end coupling surface is constant, the steady-state temperature difference between the devices numbered as 1 to n and the module end coupling surface can be obtained by using the probes, and the steady-state thermal resistance [r] between the device numbered as 1 and the module end coupling surface is calculated; then, the remaining numbered devices are traversed by using the method in the foregoing step; then, a plurality of probes are arranged at the two end coupling surfaces of the module, and a constant heat flow P can be input at any one end coupling surface of the module by using a one-time test or simulation method, and the average temperature of the two end coupling surfaces is observed, and the thermal resistance R between the two end coupling surfaces of the module is calculated MK ; finally, all the data are transmitted to a one-dimensional simulation analysis software Amesim to construct a coupling solution framework in association with a thermal network graph layer for subsequent use.

[0062] The coupling surface heat flow and temperature rise distribution data acquisition of the box combined with a single module is shown in the figure. Figure 5 When the number of modules in the computer is k, k=1~m, the steady-state thermal resistance [r] between the device in the module numbered k and the coupling surface of the module is combined with the steady-state thermal resistance [R] between the end coupling surface of the box corresponding to the module and the external strong convection environment, the global thermal resistance is updated, and the heat flow distribution data [Q] of each device when passing through the coupling surface is obtained according to the series-parallel relationship of the thermal resistance network, and the temperature rise distribution data [T] of all coupling surfaces is calculated according to the homogeneity principle of linear time-invariant system. The homogeneity principle is expressed as follows:

[0063] T(a*Q1)==a*T(Q1)

[0064] The device temperature acquisition scheme of the multiple module coexistence case of the present application is as follows. The coupling surface temperature data when multiple modules coexist is calculated according to the superposition principle of linear time-invariant system, and the device temperature data of each module is back calculated by using the coupling surface heat flow distribution data and the device thermal resistance distribution data of each module obtained in the previous step. The superposition principle is expressed as follows:

[0065] T(a*Q1+b*Q2+······+z*Qn)==T(a*Q1)+T(b*Q2)+······+T(z*Qn)==a*T(Q1)+b*T(Q2)+······+z*T(Qn)

[0066] When the number of coupling surfaces of the box and the module is large, the above scheme can be implemented. In order to improve the evaluation accuracy, the number of probes at the coupling surface needs to be increased.

[0067] The processing process of the present application is as follows:

[0068] (1) Box end coupling surface (also called slot) thermal resistance data acquisition

[0069] Since there are m slots on the box, numbered k, k=1~m, the box model shown in Figure 3 is disassembled into several regions according to Figure 8 , each region corresponds to Figure 9 , the nodes and their thermal resistance are marked as shown in Figure 9 , the upper outer node is marked as WS, the upper inner node is marked as NS, the lower outer node is marked as WX, and the lower inner node is marked as NX, so the nodes WS, WX, NS and NX all have m, k=1~m. Since the two sides of the box can be regarded as a whole, they are marked as L and R, and according to the principle that the algebraic sum of the input branches of the nodes is zero, the following processing is performed:

[0070] Firstly, several probes are arranged on all the box end coupling surfaces; then, a surface heat source is installed at one of the box end coupling surfaces, and a constant heat flow is input. When the external strong convection environment is constant, the steady-state temperature difference between all the box end coupling surfaces and the external strong convection environment can be obtained by using the probes, and the steady-state thermal resistance [R] between the box end coupling surface and the external strong convection environment can be calculated, thereby obtaining a thermal network layer. The expressions of the nodes numbered as k for the WS, WX, NS, and NX are shown in Formulas 1-4, the expressions of the nodes L and R are shown in Formulas 5 and 6, and the constraint conditions are shown in Formulas 7 and 8. respectively represent the heat flow input value of the coupling surface on the slot numbered as k and the heat flow input value of the upper coupling surface. Since there is only one coupling surface with heat flow input in each thermal network layer, there is only the upper coupling surface or the lower coupling surface of the corresponding slot in each thermal network layer and the heat flow input value of the coupling surface in each thermal network layer is a specified constant value.

[0071] The remaining box end coupling surfaces numbered are traversed by using the method in the previous step, and the remaining thermal network layers are obtained. The thermal network layer data of the slots of the box are transmitted to the simulation analysis software Amesim for subsequent use. Since a plurality of thermal network layers are constructed, the number is marked as C, and the corresponding coupling surface positions are divided into C-S1-C-Sm and C-X1-C-Xm.

[0072]

[0073]

[0074]

[0075]

[0076]

[0077]

[0078] When k = 1,

[0079] When k = m,

[0080] Tm(k) represents the average temperature of the upper outer node of the kth slot;

[0081] Tm(k) represents the average temperature of the upper outer node of the kth slot;

[0082] Tm(k) represents the average temperature of the upper outer node of the kth slot;​

[0083] T k, left, bottom, outside, average, temperature, k, represents the average temperature of the left bottom outside node of the kth slot;

[0084] T k, right, top, outside, average, temperature, k, represents the average temperature of the right top outside node of the kth slot;

[0085] T k, right, bottom, outside, average, temperature, k, represents the average temperature of the right bottom outside node of the kth slot;

[0086] T k, top, inside, average, temperature, k, represents the average temperature of the top inside node of the kth slot;

[0087] T k, bottom, inside, average, temperature, k, represents the average temperature of the bottom inside node of the kth slot;

[0088] T ambient, represents the ambient temperature; ∞

[0089] T left, uniform, average, temperature, represents the average temperature of the left uniform node of the tank; L

[0090] T right, uniform, average, temperature, represents the average temperature of the right uniform node of the tank; R

[0091] R k, top, outside, to, left, top, outside, k, represents the thermal resistance between the top outside node of the kth slot and the left top outside node of the kth slot;

[0092] R k, bottom, outside, to, left, bottom, outside, k, represents the thermal resistance between the bottom outside node of the kth slot and the left bottom outside node of the kth slot;

[0093] R k, top, outside, to, right, top, outside, k, represents the thermal resistance between the top outside node of the kth slot and the right top outside node of the kth slot;

[0094] R k, bottom, outside, to, right, bottom, outside, k, represents the thermal resistance between the bottom outside node of the kth slot and the right bottom outside node of the kth slot;

[0095] R k, top, outside, to, top, inside, k, represents the thermal resistance between the top outside node of the kth slot and the top inside node of the kth slot;

[0096] R k, bottom, outside, to, bottom, inside, k, represents the thermal resistance between the bottom outside node of the kth slot and the bottom inside node of the kth slot;

[0097] R k, top, outside, to, ambient, k, represents the thermal resistance between the top outside node of the kth slot and the ambient;

[0098] R k, bottom, outside, to, ambient, k, represents the thermal resistance between the bottom outside node of the kth slot and the ambient;​​​

[0099] Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0100] R SL Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0101] R SR Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0102] R XL Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0103] R XR Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0104] R ∞L Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0105] R ∞R Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0106] Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment;

[0107] Rk,up represents the thermal resistance between the upper coupling surface of the kth slot module and the ambient environment.

[0108] (2) Module device thermal resistance data acquisition

[0109] Given that there are n devices in the module, and the device number is i = 1 ~ n; when calculating the thermal resistance of each device to the upper and lower coupling surfaces of the module, the upper and lower coupling surfaces need to adopt isothermal boundary, the average temperature of the upper coupling surface is denoted as TS i，1 , and the average temperature of the lower coupling surface is denoted as TX i，2 , and the following steps are performed: first, input the specified power P i，1 at the device, let the module dissipate on the upper coupling surface, and let the lower coupling surface be heat-insulated, thereby obtaining the average temperature of the upper coupling surface, denoted as TS i，1 , the corresponding average temperature of the lower coupling surface, denoted as TX i，1 , and obtaining the steady-state average temperature of the heat-generating device at this time, denoted as T i，1 ; then input the specified power P i，2 at the device, let the module only dissipate on the lower coupling surface, and let the upper coupling surface be heat-insulated, thereby obtaining the average temperature of the lower coupling surface, denoted as TX i，2 , the corresponding average temperature of the upper coupling surface, denoted as TS i，2and the steady-state average temperature of the heat generating device at this time is T i，２ ; the thermal resistance RS of each device to the upper coupling surface and the thermal resistance RX of each device to the lower coupling surface are obtained according to the processing of the previous two steps i i According to the node distribution characteristics of the device heat flow in the module, the formulas 9 and 10 are arranged

[0110]

[0111] RS i represents the thermal resistance between the i-th device and the upper coupling surface of the module;

[0112] RX i represents the thermal resistance between the i-th device and the lower coupling surface of the module;

[0113] T i，1 represents the average temperature of the surface of the i-th device when only the upper coupling surface dissipates;

[0114] T i，2 represents the average temperature of the surface of the i-th device when only the lower coupling surface dissipates;

[0115] TS i，1 represents the average temperature of the upper coupling surface when only the upper coupling surface dissipates;

[0116] TS i，2 represents the average temperature of the upper coupling surface when only the lower coupling surface dissipates;

[0117] TX i，1 represents the average temperature of the lower coupling surface when only the upper coupling surface dissipates;

[0118] TX i，2 represents the average temperature of the lower coupling surface when only the lower coupling surface dissipates;

[0119] P i，1 represents the surface heat flow input value of the i-th device when only the upper coupling surface dissipates;

[0120] P i，2 represents the surface heat flow input value of the i-th device when only the lower coupling surface dissipates;

[0121] (3) Module thermal resistance acquisition

[0122] When solving the thermal resistance R MK between the two end coupling surfaces of the module itself, a constant heat flow P can be input at any one end coupling surface of the module, and the average temperature conditions of the two end coupling surfaces are observed, TS and TX represent the steady-state average temperatures of the upper and lower coupling surfaces respectively, and the module thermal resistance acquisition is shown in formula 11.

[0123] ​

[0124] R MK thermal resistance between the coupling surfaces at both ends of the module itself;

[0125] average temperature of the upper end surface of TS;

[0126] average temperature of the lower end surface of TX;

[0127] constant heat flow input value at either end of the P module;

[0128] (4) Coupling solution

[0129] input heat flow of each upper and lower coupling surface of the kth slot module and the sum of the heat flows respectively allocated to the upper and lower coupling surfaces by each device of the module, as shown in Equations 12 and 13. or the sum of the heat flows respectively allocated to the upper and lower coupling surfaces by each device of the module, as shown in Equations 12 and 13. Rkiu represents the thermal resistance between the ith heat source and the upper coupling surface in the kth slot module, RkiL represents the thermal resistance between the ith heat source and the lower coupling surface in the kth slot module. By synthesizing Equations (1) to (13), the temperature of each coupling surface in each heat network layer can be solved, and then the actual temperature data TS and TX can be obtained by superimposing the corresponding coupling surface data in C heat network layers according to the homogeneity and additivity principles, as shown in Equations 14 and 15. k k as shown in Equations 14 and 15.

[0130] Finally, the actual temperature data of the module devices are back-calculated according to the principle that the temperature at the heat source node is constant along the heat flow path, as shown in Equation 16, to obtain the actual temperature of the device node At this point, the temperature data of the key target positions are solved by the coupling correction evaluation method, and the coupling solution framework is shown in Figure 10 .

[0131]

[0132]

[0133]

[0134]

[0135]

[0136] Rkiu represents the thermal resistance between the ith heat source and the upper coupling surface in the kth slot module,

[0137] Rkiu represents the thermal resistance between the ith heat source and the upper coupling surface in the kth slot module, RkiL represents the thermal resistance between the ith heat source and the lower coupling surface in the kth slot module.

[0138] represents the average temperature of the surface of the i-th device in the k-th module;

[0139] represents the thermal resistance between the i-th device and the upper coupling surface of the k-th module;

[0140] represents the thermal resistance between the i-th device and the lower coupling surface of the k-th module;

[0141] TS k represents the average temperature of the upper coupling surface after superimposing the upper coupling surface data of the k-th slot in all thermal network layers;

[0142] TX k represents the average temperature of the lower coupling surface after superimposing the lower coupling surface data of the k-th slot in all thermal network layers;

[0143] represents the heat flow input value of the i-th device in the k-th module;

[0144] represents the average temperature of the surface of the i-th device in the k-th module obtained by back calculation;

[0145] Although the embodiments of the present application and the drawings are disclosed for the purpose of illustration, it is understood that various substitutions, changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present application and the appended claims, therefore, the scope of the present application is not limited to the disclosed embodiments and drawings.

Claims

1. A method for evaluating the coupled correction of computer thermal characteristics, characterized in that: The evaluation method is implemented with the enclosure and modules separated, and the basic surfaces for obtaining thermal resistance data are defined as the enclosure end coupling surface, the module end coupling surface, and the device surface, including the following steps: Step 1: First, obtain the thermal resistance data of each housing end coupling surface and each module device. The thermal resistance of each module device includes the thermal resistance of the module device and the thermal resistance between the coupling surfaces at both ends of the module itself. Step 2: Then, update the global thermal resistance of each module and enclosure combination, and calculate the heat flow distribution data of the coupling surface between the module and the enclosure when the enclosure is combined with a single module. Step 3: Calculate the temperature rise distribution data of all coupling surfaces according to the principle of homogeneity of linear time-invariant systems; Step 4: Based on the superposition principle of linear time-invariant systems, calculate the temperature data at the coupling point when multiple modules coexist, and deduce the temperature data of each module based on the heat flow distribution data at the coupling point and the thermal resistance distribution data of each module device obtained earlier. In step 1, the thermal resistance data of the coupling surfaces at each housing end are obtained as follows: 1) Several probes are arranged on all coupling surfaces at the ends of the housing, and the coupling surfaces at the ends of the housing are numbered from 1 to m; 2) Install a surface heat source at one of the coupling surfaces of the housing end, and input heat flow. Q When the external strong convection environment is constant, the steady-state temperature difference between all the coupling surfaces of the box end and the external strong convection environment is obtained by probe, and the steady-state thermal resistance between the coupling surfaces of the box end and the external strong convection environment is calculated. R ]; 3) Using the method in the previous step, traverse the remaining numbered box end coupling surfaces in sequence; obtain the steady-state thermal resistance of all box end coupling surfaces to the external strong convection environment; 4) Transmit the steady-state thermal resistance data of all box end coupling surfaces to the external strong convection environment to the one-dimensional simulation analysis software Amesim, and construct the thermal network layer; Steady-state thermal resistance between the coupling surface at the end of the enclosure and the external strong convection environment [ R The calculation of ] is as follows: The box section has m sets of box end coupling surfaces, numbered k, k=1~m. The box model is decomposed into m dry regions, each region corresponding to four nodes: upper outer node WS, upper inner node NS, lower outer node WX, and lower inner node NX. There are m nodes WS, WX, NS, and NX, k=1~m. The two sides of the box can be regarded as a whole, denoted as L and R. According to the principle that the algebraic sum of the inputs of each branch of the node is zero, the expressions for the k-numbered WS, WX, NS, and NX nodes are shown in Equations 1~4, and the expressions for the L and R nodes are shown in Equations 5 and 6, respectively. The constraints are Equations 7 and 8. （1） （2） （3） （4） （5） （6） （7） （8） in, , These represent the average temperatures of the upper and lower outer nodes of the k-th slot, respectively. , These represent the average temperatures of the outer nodes on the upper left and lower left sides of the k-th slot, respectively. , These represent the average temperatures of the outer nodes on the upper right and lower right sides of the k-th slot, respectively. , These represent the average temperatures of the upper and lower internal nodes of the k-th slot, respectively. Indicates ambient temperature; , These represent the average temperatures of the uniformized nodes on the far left and far right of the enclosure, respectively. This represents the thermal resistance between the upper outer node of the k-th slot and the upper outer node on the left side of the k-th slot. This represents the thermal resistance between the lower outer node of the k-th slot and the lower outer node on the left side of the k-th slot. This represents the thermal resistance between the upper outer node of the k-th slot and the upper outer node on the right side of the k-th slot. This represents the thermal resistance between the lower outer node of the k-th slot and the lower outer node on the right side of the k-th slot. This represents the thermal resistance between the outer node on the upper side of the k-th slot and the inner node on the upper side of the k-th slot. This represents the thermal resistance between the lower outer node of the k-th slot and the lower inner node of the k-th slot. , These represent the thermal resistances between the upper outer node and the lower outer node of the k-th slot and the environment, respectively. This represents the thermal resistance between the upper and lower coupling surfaces of the k-th slot module; , These represent the thermal resistances between the leftmost and rightmost uniform nodes of the housing and the upper outer node of the adjacent k-th slot, respectively. , These represent the thermal resistances between the leftmost and rightmost uniform nodes of the housing and the lower outer node of the adjacent k-th slot, respectively. , These represent the thermal resistances between the leftmost and rightmost homogenized nodes of the enclosure and the environment, respectively. , These represent the heat flux input values ​​of the upper and lower coupling surfaces of the k-th slot, respectively.

2. The computer thermal characteristic coupling correction evaluation method according to claim 1, characterized in that: In step 1, the method for obtaining the thermal resistance data of each module device is as follows: 1) First, several probes are placed on all module coupling surfaces and near the devices. The devices within the module are numbered from 1 to n. 2) Mount a surface heat source on the surface of device number 1 and input heat flow. q When the flow environment at the module end coupling surface is constant, the steady-state temperature difference between the devices numbered 1 to n and the module end coupling surface is obtained through probes, and the steady-state thermal resistance between the device numbered 1 and the module end coupling surface is calculated. r ]; 3) Use the method in the previous step to traverse the remaining numbered devices in sequence; finally, transfer all data to the one-dimensional simulation analysis software Amesim and associate it with the thermal network layer to build a coupled solution framework.

3. The computer thermal characteristic coupling correction evaluation method according to claim 2, characterized in that: In step 1, the method for calculating the thermal resistance of the module components is as follows: The module contains n devices, numbered i = 1 to n. When calculating the thermal resistance of each device to the upper and lower coupling surfaces of the module, isothermal boundaries must be used for the upper and lower coupling surfaces, and the average temperature of the upper coupling surface is denoted as . The average temperature of the lower coupling surface is denoted as It includes the following steps: 1) First, input the specified power consumption at the device. The upper coupling surface of the module dissipates heat, while the lower coupling surface is insulated. The average temperature of the upper coupling surface is denoted as . The average temperature of the lower coupling surface is denoted as And obtain the steady-state average temperature of the heat-generating device at this time. ; 2) Then input the specified power consumption at the device. The module dissipates heat only on the lower coupling surface, while the upper coupling surface is insulated. The average temperature of the lower coupling surface is thus obtained and denoted as... The average temperature of the coupling surface is denoted as And obtain the steady-state average temperature of the heat-generating device at this time. ; 3) Based on the processing in the first two steps, obtain the thermal resistance of each device to the upper coupling surface. Thermal resistance of each device to the lower coupling surface Based on the node distribution characteristics of heat flow in the modules, equations (9) and (10) are obtained. （9） （10） in, This represents the thermal resistance between the i-th device and the coupling surface on the module; This represents the thermal resistance between the i-th device and the lower coupling surface of the module; This represents the average temperature of the i-th device surface when only the upper coupling surface dissipates; This represents the average temperature of the i-th device surface when only the lower coupling surface dissipates; This represents the average temperature of the upper coupling surface when only the upper coupling surface dissipates. This represents the average temperature of the upper coupling surface when only the lower coupling surface dissipates heat. This represents the average temperature of the lower coupling surface when only the upper coupling surface dissipates. This represents the average temperature of the lower coupling surface when only the lower coupling surface dissipates. This represents the heat flux input value of the i-th device surface when only the upper coupling surface dissipates; This represents the heat flux input value of the i-th device surface when only the lower coupling surface dissipates heat.

4. The computer thermal characteristic coupling correction evaluation method according to claim 3, characterized in that: In step 1, the method for obtaining the thermal resistance between the coupling surfaces at both ends of the module is as follows: Thermal resistance between the coupling surfaces at both ends of the module itself During the solution process, several probes need to be placed at the coupling surfaces at both ends of the module. Through a test or simulation, a constant heat flux P is input at the coupling surface at either end of the module, and the average temperature of the coupling surfaces at both ends is observed. TS and TX represent the steady-state average temperature of the upper and lower coupling surfaces, respectively. The thermal resistance of the module is obtained as shown in the following formula. （11） in, Thermal resistance between the coupling surfaces at both ends of the module itself; , These are the average temperatures of the upper and lower end surfaces, respectively. A constant heat flux input value is applied at any end of the module.

5. The computer thermal characteristic coupling correction evaluation method according to claim 4, characterized in that: Step 2 is as follows: The upper and lower coupling surfaces of the k-th slot module receive heat flow. and Each component in the module is assigned heat flow to its respective upper and lower coupling surfaces. or The sum is shown in formulas 12 and 13; This represents the thermal resistance between the i-th heat source and the upper coupling surface in the k-th slot module. This represents the thermal resistance between the i-th heat source and the lower coupling surface in the k-th slot module; （12） （13） in, This represents the input value indicating the thermal flow of the i-th device in the k-th module into the upper coupling surface; This represents the input value of the heat flow into the lower coupling surface of the i-th device in the k-th module; This represents the average temperature of the surface of the i-th device in the k-th module; This represents the thermal resistance between the i-th device in the k-th module and the coupling surface on the module. This represents the thermal resistance between the i-th device in the k-th module and the lower coupling surface of the module.

6. The computer thermal characteristic coupling correction evaluation method according to claim 5, characterized in that: Step 3 is as follows: Combining formulas (1) to (8) and (12) and (13), the temperature of each coupling surface in each heat network layer is calculated. The actual temperature data is obtained by superimposing the corresponding coupling surface data in C heat network layers. and As shown in formulas 14 and 15; （14） （15） in, This indicates that the average temperature of the upper coupling surface is obtained by superimposing the upper coupling surface data of the k-th slot in all the heat network layers; This indicates that the average temperature of the upper coupling surface is obtained by superimposing the lower coupling surface data of the kth slot in all the thermal network layers.

7. The computer thermal characteristic coupling correction evaluation method according to claim 6, characterized in that: Step 4 is as follows: Based on the principle that the temperature remains constant at the heat source node along the heat flow path, the actual temperature data of the module device is deduced, as shown in Formula 16, to obtain the actual temperature of the heat source node. ; （16） in, This represents the thermal resistance between the i-th device in the k-th module and the coupling surface on the module. This represents the thermal resistance between the i-th device in the k-th module and the lower coupling surface of the module; This indicates that the average temperature of the upper coupling surface is obtained by superimposing the upper coupling surface data of the k-th slot in all the heat network layers; This indicates that the average temperature of the upper coupling surface is obtained by superimposing the lower coupling surface data of the k-th slot in all the thermal network layers; This represents the heat flux input value of the i-th device in the k-th module; The average surface temperature of the i-th device in the k-th module is obtained by reverse calculation.

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