Dielectric electromagnetic composition

Abstract

The present invention discloses a dielectric electromagnetic composition, wherein the dielectric electromagnetic composition comprises BaTi2O5 or (Ba (1‑x) Ca x )Ti2O5, wherein 0≤x<0.1, and the surface of the matrix material powder particles is coated with at least one selected from the group consisting of Mg, Mn, V, Ba, Si, Al and rare earth metals.

Description

[0001] This application is a divisional application of the invention patent application "Multilayer ceramic electronic components, manufacturing methods thereof, and dielectric magnetic compositions" with an application date of March 12, 2019 and application number 201910183890.7. Technical Field

[0002] The present disclosure relates to a method of manufacturing a multilayer ceramic electronic component and a multilayer ceramic electronic component, and more particularly, to a method of manufacturing a multilayer ceramic electronic component capable of having excellent reliability and high capacitance and a multilayer ceramic electronic component capable of having excellent reliability and high capacitance. Background Art

[0003] Recently, as electronic products have become smaller, thinner, and more multifunctional, miniaturized multilayer ceramic capacitors have been required, and the multilayer ceramic capacitors have also been mounted with high integration.

[0004] Multilayer ceramic capacitors (electronic components) are mounted on printed circuit boards of some electronic products (including image display devices (e.g., liquid crystal displays (LCDs), plasma display panels (PDPs), etc.), computers, personal digital assistants (PDAs), cellular phones, etc.) for charging or discharging therefrom.

[0005] Multilayer ceramic capacitors may be used as components of various electronic devices because they have a small size, achieve high capacitance, and can be easily mounted.

[0006] On the other hand, recently, as interest in electrical components has increased in industry, multilayer ceramic capacitors have also been required to have high reliability and high capacitance characteristics in order to be used in vehicles or infotainment systems.

[0007] In particular, with the increase in electronic control systems of internal combustion engine vehicles and electric vehicles, the demand for multilayer ceramic capacitors that can be used in high temperature environments has increased.

[0008] At present, the dielectric material of multilayer ceramic capacitors with high capacitance is mainly barium titanate (BaTiO3), and since nickel (Ni) inner electrodes are used and the ceramic body needs to be sintered in a reducing atmosphere, the dielectric material needs to have reduction resistance.

[0009] However, due to the unique characteristics of barium titanate (BaTiO 3 ) causing capacitance to significantly decrease in an environment of 150° C. or higher, it is difficult to ensure electrical characteristics according to temperature required for electrical components.

[0010] Furthermore, the multilayer ceramic capacitor cannot be used in an environment as high as 200° C. Therefore, there has been a demand for the development of a multilayer ceramic capacitor that can be used even in a high temperature environment by applying a new composition. Summary of the invention

[0011] An aspect of the present disclosure may provide a method of manufacturing a multilayer ceramic electronic component capable of having excellent reliability and having high capacitance and a multilayer ceramic electronic component capable of having excellent reliability and having high capacitance.

[0012] According to one aspect of the present disclosure, a method for manufacturing a multilayer ceramic electronic component may include: preparing a ceramic substrate including BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1), the base material powder particles having a surface coated with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals; preparing a ceramic green sheet using a dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet stack by stacking the ceramic green sheets coated with the internal electrode paste; and preparing a ceramic body by sintering the green sheet stack, the ceramic body comprising a dielectric layer and a plurality of first internal electrodes and a plurality of second internal electrodes arranged to face each other, and each of the dielectric layers is between the first internal electrode and the second internal electrode.

[0013] According to another aspect of the present disclosure, a multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and a plurality of first internal electrodes and a plurality of second internal electrodes arranged to face each other, and each of the dielectric layers is interposed between the first internal electrode and the second internal electrode, and the ceramic body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and a first external electrode and a second external electrode, which are arranged on an outer surface of the ceramic body and are electrically connected to the plurality of first internal electrodes and the plurality of second internal electrodes, respectively, wherein each of the dielectric layers includes a dielectric electromagnetic composition, and the dielectric electromagnetic composition includes a BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1), wherein the base material powder particles have a surface coated with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals.

[0014] According to another aspect of the present disclosure, a dielectric magnetic composition comprises BaTi2O5 or (Ba (1-x) Ca x)Ti2O5, wherein 0≤x<0.1, and the matrix material powder particles have a surface coated with at least one selected from the group consisting of Mg, Mn, V, Ba, Si, Al and rare earth metals. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a perspective view showing a multilayer ceramic capacitor according to an exemplary embodiment in the present disclosure;

[0017] Figure 2 is a schematic diagram showing a ceramic body according to an exemplary embodiment of the present disclosure;

[0018] Figure 3 According to an exemplary embodiment of the present disclosure, Figure 1 A cross-sectional view taken along line I-I';

[0019] Figure 4 yes Figure 3 an enlarged view of region B; and

[0020] Figure 5 According to another exemplary embodiment of the present disclosure, Figure 1 A cross-sectional view taken along line I-I'. DETAILED DESCRIPTION

[0021] Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0022] Figure 1 is a perspective view showing a multilayer ceramic capacitor according to an exemplary embodiment in the present disclosure.

[0023] Figure 2 is a schematic diagram illustrating a ceramic body according to an exemplary embodiment in the present disclosure.

[0024] Figure 3 According to an exemplary embodiment of the present disclosure, Figure 1 A cross-sectional view taken along line I-I'.

[0025] Figure 4 yes Figure 3 Magnified view of area B.

[0026] Reference Figures 1 to 4, a multilayer ceramic electronic component 100 manufactured by the method for manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure may include: a ceramic body 110, including a dielectric layer 111 and a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 arranged to face each other, and each of the dielectric layers 111 is interposed between the first internal electrode 121 and the second internal electrode 122, and the ceramic body 110 has a first surface S1 and a second surface S2 opposite to each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first surface S1 and the second surface S2 and opposite to each other in the second direction, and a fifth surface S5 and a sixth surface S6 connected to the first surface to the fourth surface and opposite to each other in a third direction; and a first external electrode 131 and a second external electrode 132, which are disposed on an outer surface of the ceramic body 110 and are electrically connected to the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122, respectively.

[0027] Hereinafter, a multilayer ceramic electronic component (particularly, a multilayer ceramic capacitor) according to an exemplary embodiment of the present disclosure will be described. However, the multilayer ceramic electronic component according to the present disclosure is not limited thereto.

[0028] In the multilayer ceramic capacitor according to the exemplary embodiment in the present disclosure, the “length direction” refers to Figure 1 The "L" direction refers to the width direction. Figure 1 The “W” direction refers to the thickness direction. Figure 1 Here, the “thickness direction” refers to the direction in which the dielectric layers are stacked (ie, the “stacking direction”).

[0029] In an exemplary embodiment in the present disclosure, the shape of the ceramic body 110 is not particularly limited, and may be a hexahedral shape as shown.

[0030] The ceramic body 110 may have: a first surface S1 and a second surface S2, which are opposite to each other in a first direction; a third surface S3 and a fourth surface S4, which are connected to the first surface S1 and the second surface S2 and are opposite to each other in the second direction; and a fifth surface S5 and a sixth surface S6, which are connected to the first surface to the fourth surface and are opposite to each other in a third direction.

[0031] The first surface S1 and the second surface S2 refer to surfaces of the ceramic body 110 opposite to each other in the thickness direction (first direction), the third surface S3 and the fourth surface S4 refer to surfaces of the ceramic body 110 opposite to each other in the length direction (second direction), and the fifth surface S5 and the sixth surface S6 refer to surfaces of the ceramic body 110 opposite to each other in the width direction (third direction).

[0032] One ends of the plurality of first and second internal electrodes 121 and 122 formed in the ceramic body 110 may be exposed to the third and fourth surfaces S3 and S4 of the ceramic body, respectively.

[0033] The internal electrodes 121 and 122 may have a pair of a first internal electrode 121 and a second internal electrode 122 having different polarities.

[0034] One end of the first internal electrode 121 may be exposed to the third surface S3 , and one end of the second internal electrode 122 may be exposed to the fourth surface S4 .

[0035] The other end of the first internal electrode 121 may be formed to be separated from the fourth surface S4 by a predetermined interval, and the other end of the second internal electrode 122 may be formed to be separated from the third surface S3 by a predetermined interval. More details on this will be described below.

[0036] The first and second external electrodes 131 and 132 may be formed on the third and fourth surfaces S3 and S4 of the ceramic body, respectively, and may be electrically connected to the internal electrodes.

[0037] The ceramic body 110 may include an effective portion A contributing to forming the capacitance of the multilayer ceramic capacitor, and an upper cover portion C1 and a lower cover portion C2 formed on upper and lower surfaces of the effective portion A as an upper edge portion and a lower edge portion, respectively.

[0038] The active portion A may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with each of the dielectric layers 111 interposed between the first internal electrode 121 and the second internal electrode 122 .

[0039] The upper cover C1 and the lower cover C2 may be formed using the same material as that of the dielectric layer 111 , except that they do not include an internal electrode, and may have the same configuration as that of the dielectric layer 111 .

[0040] That is, the upper cover C1 and the lower cover C2 may include a ceramic material such as a barium titanate (BaTiO 3 )-based ceramic material.

[0041] The upper cover C1 and the lower cover C2 may be formed by stacking a single dielectric layer or two or more dielectric layers on upper and lower surfaces of the active part A in a vertical direction, respectively, and may mainly serve to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0042] The material of each of the first and second internal electrodes 121 and 122 is not particularly limited, but may be a conductive paste including one or more of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), and copper (Cu).

[0043] According to an exemplary embodiment in the present disclosure, a multilayer ceramic capacitor may include a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122 .

[0044] The first and second external electrodes 131 and 132 may be electrically connected to the first and second internal electrodes 121 and 122 , respectively, to form capacitance, and the second external electrode 132 may be connected to a potential different from that to which the first external electrode 131 is connected.

[0045] The first and second external electrodes 131 and 132 may be respectively disposed on the third and fourth surfaces S3 and S4 of the ceramic body 110 in the length direction (second direction) and may extend to the first and second surfaces S1 and S2 of the ceramic body 110 in the thickness direction (first direction).

[0046] The external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the outer surface of the ceramic body 110 and electrically connected to the internal electrodes 121 and 122, respectively, and conductive resin layers 131b and 132b disposed on the electrode layers 131a and 132a, respectively.

[0047] The electrode layers 131a and 132a may include conductive metal and glass.

[0048] The conductive metal used for the electrode layers 131 a and 132 a may be any material that can be electrically connected to an internal electrode to form a capacitor, for example, one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0049] The electrode layers 131 a and 132 a may be formed by coating a conductive paste prepared by adding glass frit to conductive metal powder particles and then sintering the conductive paste.

[0050] The conductive resin layers 131 b and 132 b may be formed on the electrode layers 131 a and 132 a , respectively, and may be formed to completely cover the electrode layers 131 a and 132 a , respectively.

[0051] Since the conductive resin layers 131b and 132b are formed to completely cover the electrode layers 131a and 132a, respectively, the distance from the conductive resin layers 131b and 132b formed on the first surface S1 and the second surface S2 of the ceramic body 110 to the end may be greater than the distance from the electrode layers 131a and 132a formed on the first surface S1 and the second surface S2 of the ceramic body 110 to the end.

[0052] The base resin included in each of the conductive resin layers 131 b and 132 b may have a bonding property and an impact absorbing property, may be any resin that may be mixed with conductive metal powder particles to form a paste, and may include, for example, an epoxy-based resin.

[0053] The conductive metal included in each of the conductive resin layers 131b and 132b may be any material that can be electrically connected to the electrode layers 131a and 132a, and for example, may include one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0054] Plated layers 131c and 131d, and 132c and 132d may be further provided on the conductive resin layers 131b and 132b, respectively.

[0055] The plated layers 131c and 131d and 132c and 132d may be disposed on the conductive resin layers 131b and 132b, respectively, and may be disposed to completely cover the conductive resin layers 131b and 132b, respectively.

[0056] The plated layers 131c and 131d and 132c and 132d may include nickel (Ni) plated layers 131c and 132c respectively disposed on the conductive resin layers 131b and 132b and palladium (Pd) plated layers 131d and 132d respectively disposed on the nickel (Ni) plated layers 131c and 132c.

[0057] The multilayer ceramic electronic component 100 may be manufactured by a method for manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure. The method for manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure may include: preparing a multilayer ceramic electronic component including BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1), the base material powder particles having a surface coated with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals; preparing a ceramic green sheet using a dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet laminate by stacking the ceramic green sheets coated with the internal electrode paste; and preparing a ceramic body by sintering the green sheet laminate, the ceramic body including a dielectric layer and a plurality of first internal electrodes and a plurality of second internal electrodes arranged to face each other, and each of the dielectric layers is between the first internal electrode and the second internal electrode.

[0058] Recently, as interest in electrical components has increased in industry, multilayer ceramic capacitors have also been required to have high reliability and high capacitance characteristics in order to be used in vehicles or infotainment systems.

[0059] In particular, with the increase in electronic control systems of internal combustion engine vehicles and electric vehicles, the demand for multilayer ceramic capacitors that can be used in high temperature environments has increased.

[0060] At present, the dielectric material of multilayer ceramic capacitors with high capacitance is mainly barium titanate (BaTiO3), and since nickel (Ni) inner electrodes are used and the ceramic body needs to be sintered in a reducing atmosphere, the dielectric material needs to have reduction resistance.

[0061] However, due to the unique characteristics of barium titanate (BaTiO 3 ) causing capacitance to significantly decrease in an environment of 150° C. or higher, it is difficult to ensure electrical characteristics according to temperature required for electrical components.

[0062] Furthermore, the multilayer ceramic capacitor cannot be used in an environment as high as 200° C. Therefore, there has been a demand for the development of a multilayer ceramic capacitor that can be used even in a high temperature environment by applying a new composition.

[0063] According to an exemplary embodiment of the present disclosure, a material including BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) and having a dielectric electromagnetic composition of base material powder particles whose surfaces are coated with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals to manufacture multilayer ceramic capacitors, thereby stably ensuring the high-temperature capacitance change rate and realizing a high-capacitance multilayer ceramic capacitor.

[0064] Hereinafter, respective components of the dielectric magnetic composition included in the dielectric layer according to an exemplary embodiment in the present disclosure will be described in more detail.

[0065] a) Matrix material powder

[0066] According to an exemplary embodiment of the present disclosure, the dielectric magnetic composition may include BaTi2O5 or (Ba (1-x) Ca x )The matrix material powder particles represented by Ti2O5 (0≤x<0.1).

[0067] The dielectric magnetic composition may include a matrix material powder particle represented by BaTi2O5, and may include a matrix material powder particle represented by (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) or may include base material powder particles represented by BaTi2O5 and base material powder particles represented by (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) is a form in which powder particles of a matrix material are mixed with each other.

[0068] BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) may have a ferroelectric transition temperature higher than that of BaTiO3 as a base material powder included in a conventional dielectric magnetic composition.

[0069] For example, BaTi2O5 can be controlled to have a ferroelectric transition temperature as high as 470°C, and (Ba (1-x) Ca x )Ti2O5 can be controlled to have a ferroelectric transition temperature of 220°C to 470°C.

[0070] Therefore, when BaTi2O5 or (Ba (1-x) Ca x )When the matrix material powder particles represented by Ti2O5 (0≤x<0.1) are used as the main component, the high-temperature capacitance change rate can be stably ensured by the high ferroelectric transition temperature characteristic.

[0071] However, when BaTi2O5 or (Ba (1-x) Ca x )When base material powder particles represented by Ti2O5 (0≤x<0.1) are used as a main component, the amount of titanium (Ti) may be greater than that of BaTiO3 according to the related art, thereby causing a problem in which titanium (Ti) reacts with nickel (Ni) constituting an internal electrode and nickel (Ni) diffuses into a dielectric layer.

[0072] In detail, due to the synthesis of BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 is added in an amount larger than the amount of BaTiO3, and therefore, unreacted TiO2 or a Ti-rich second phase may remain after the synthesis.

[0073] Since the unreacted TiO 2 or the Ti-rich second phase has high reactivity to nickel (Ni) included in the inner electrode, the nickel (Ni) may diffuse into the dielectric layer, and in severe cases, a problem of inner electrode disappearance may occur.

[0074] Therefore, there may be a problem in that the dielectric constant of the multilayer ceramic capacitor decreases.

[0075] That is, when BaTi2O5 or (Ba (1-x) Ca x )When base material powder particles represented by Ti2O5 (0≤x<0.1) are used as a main component, the high-temperature capacitance change rate can be stably ensured by the high ferroelectric transition temperature characteristic, but the dielectric constant of the multilayer ceramic capacitor may decrease.

[0076] Therefore, in order to stably ensure the high-temperature capacitance change rate and realize a high-capacitance multilayer ceramic capacitor, in an exemplary embodiment of the present disclosure, the dielectric magnetic composition may include BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) and having a surface coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal.

[0077] In detail, one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals may be coated on the BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) is formed on the surface of the matrix material powder particles to prevent the contact between nickel (Ni) and titanium (Ti) during the heat treatment process, thereby solving the problem of nickel (Ni) diffusing into the dielectric layer or the disappearance of the inner electrode.

[0078] That is, base material powder particles having surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al, and rare earth metals may prevent a Ti—Ni reaction layer from being formed by a reaction with an inner electrode including nickel (Ni) to increase a dielectric constant.

[0079] In addition, the Ti—Ni reaction layer may be reduced to solve problems such as an increase in dissipation factor (DF), a decrease in specific resistance, and the like.

[0080] On the other hand, one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals having a content of 2 molar parts or less based on 100 molar parts of Ti in the elements of the base material powder particles can be coated on the surface of the base material powder particles.

[0081] One or more of Mg, Mn, V, Ba, Si, Al and rare earth metals having a content of 2 molar parts or less based on 100 molar parts of Ti in the elements of the base material powder particles can be coated on the surface of the base material powder particles to prevent contact between nickel (Ni) and titanium (Ti) during the heat treatment process, thereby preventing the problem of nickel (Ni) diffusing into the dielectric layer or the disappearance of the inner electrode, thereby stably ensuring the high-temperature capacitance change rate and realizing a high-capacitance multilayer ceramic capacitor.

[0082] When the content of one or more of Mg, Mn, V, Ba, Si, Al and rare earth elements (e.g., rare earth metals) exceeding 2 mole parts based on 100 mole parts of Ti in the elements of the base material powder particles is coated on the surface of the base material powder particles, it may be difficult to stably ensure the high-temperature capacitance change rate, making it difficult to use the multilayer ceramic capacitor at high temperatures.

[0083] The rare earth element may be one or more selected from the group consisting of Y, Dy, Ho, La, Ce, Nd, Sm, Gd, and Er, but is not necessarily limited thereto.

[0084] On the other hand, in the (1-x) Ca x )In the matrix material powder particles represented by Ti2O5, 0≤x<0.1.

[0085] That is, in the first main component, Ca may include 0 mol %, and may be included in a content of less than 10 mol %.

[0086] More preferably, in the first main component, Ca may include 0 mol%, and may be included in a content of 7 mol% or less. Therefore, 0≤x≤0.07.

[0087] x may be 0 or greater, and when x is 0, the first main component may be BaTi2O 5。

[0088] The matrix material powder particles are not particularly limited, and may have an average particle size of 150 nm or less.

[0089] b) The first auxiliary ingredient

[0090] According to an exemplary embodiment in the present disclosure, the dielectric magnetic composition may further include an oxide or a carbonate including at least one of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn as a first auxiliary component.

[0091] The oxide or carbonate of at least one of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn included as the first auxiliary component may be included in an amount of 0.1 mol % to 2.0 mol % based on 100 mol % of the base material powder particles.

[0092] The first auxiliary component can be used to reduce the sintering temperature of a multilayer ceramic capacitor using the dielectric magnetic composition, and to improve the high-temperature withstand voltage characteristics of the multilayer ceramic capacitor.

[0093] The content of the first auxiliary component and the content of the second auxiliary component (to be described below) may be based on 100 mol % of base material powder particles, and may be specifically defined as mol % of metal ions included in each auxiliary component.

[0094] When the content of the first auxiliary component is less than 0.1 mol %, the sintering temperature of the multilayer ceramic capacitor may increase, and the high temperature withstand voltage characteristics of the multilayer ceramic capacitor may be deteriorated to some extent.

[0095] When the content of the first auxiliary component is greater than 2.0 mol %, high temperature withstand voltage characteristics and room temperature resistivity of the multilayer ceramic capacitor may be deteriorated.

[0096] Specifically, the dielectric magnetic composition according to the exemplary embodiment of the present disclosure may further include a first auxiliary component having a content of 0.1 mol% to 2.0 mol% based on 100 mol% of the base material powder particles. Therefore, the multilayer ceramic capacitor can be sintered at a low temperature, and the high temperature withstand voltage characteristics of the multilayer ceramic capacitor can be obtained.

[0097] c) Second auxiliary ingredient

[0098] According to exemplary embodiments in the present disclosure, the dielectric magnetic composition may include an oxide including Si or a glass compound including Si as a second auxiliary component.

[0099] The dielectric magnetic composition may further include a second auxiliary component which is an oxide including Si or a glass compound including Si and has a content of 0.2 mol % to 5.0 mol % based on 100 mol % of the base material powder particles.

[0100] The second auxiliary component can be used to reduce the sintering temperature of a multilayer ceramic capacitor using the dielectric magnetic composition, and to improve the high-temperature withstand voltage characteristics of the multilayer ceramic capacitor.

[0101] When the content of the second auxiliary component is less than 0.2 mol % based on 100 mol % of the base material powder particles, the sintering temperature of the multilayer ceramic capacitor may increase.

[0102] When the content of the second auxiliary component is greater than 5.0 mol % based on 100 mol % of the matrix material powder particles, high temperature withstand voltage characteristics of the multilayer ceramic capacitor may be deteriorated.

[0103] Specifically, the dielectric magnetic composition according to the exemplary embodiment of the present disclosure may further include a second auxiliary component in an amount of 0.2 mol% to 5.0 mol% based on 100 mol% of the base material powder particles. Therefore, the multilayer ceramic capacitor can be sintered at a low temperature, and the high temperature withstand voltage characteristics of the multilayer ceramic capacitor can be obtained.

[0104] d) The third auxiliary ingredient

[0105] According to an exemplary embodiment in the present disclosure, the dielectric magnetic composition may further include a third auxiliary component, and the third auxiliary component is an oxide, a carbonate, or a fluoride including Li.

[0106] The dielectric magnetic composition may further include a third auxiliary component including an oxide, a carbonate, or a fluoride of Li and having a content of 0.4 mol % to 12.0 mol % based on 100 mol % of the base material powder particles.

[0107] The third auxiliary component can be used to reduce the sintering temperature of the multilayer ceramic capacitor using the dielectric magnetic composition and to improve the high temperature withstand voltage characteristics of the multilayer ceramic capacitor.

[0108] Furthermore, even in the case of using copper (Cu) as a material of the internal electrode, the third auxiliary component can obtain target characteristics of the multilayer ceramic capacitor.

[0109] When the content of the third auxiliary component is less than 0.4 mol % based on 100 mol % of the base material powder particles, the sintering temperature of the multilayer ceramic capacitor may increase, the dielectric constant of the multilayer ceramic capacitor may decrease, and the high temperature withstand voltage characteristics of the multilayer ceramic capacitor may deteriorate.

[0110] When the content of the third auxiliary component is greater than 12.0 mol % based on 100 mol % of the base material powder particles, high temperature withstand voltage characteristics of the multilayer ceramic capacitor may be deteriorated due to generation of the second phase.

[0111] Specifically, the dielectric magnetic composition according to the exemplary embodiment of the present disclosure may further include a third auxiliary component in an amount of 0.4 mol% to 12.0 mol% based on 100 mol% of the base material powder particles. Therefore, copper (Cu) may be used as a material for the inner electrode, the multilayer ceramic capacitor may be sintered at a low temperature, and the high temperature withstand voltage characteristics of the multilayer ceramic capacitor may be obtained.

[0112] e) The fourth auxiliary ingredient

[0113] According to an exemplary embodiment of the present disclosure, the dielectric magnetic composition may further include a fourth auxiliary component, and the fourth auxiliary component is an oxide, a carbonate, or a fluoride including Ba.

[0114] The dielectric magnetic composition may further include a fourth auxiliary component, which is an oxide, a carbonate or a fluoride including Ba, wherein the content of Ba is 0 at % to 3.0 at % based on 100 at % of the base material powder particles.

[0115] The fourth auxiliary component may be used to increase the dielectric constant of a multilayer ceramic capacitor using the dielectric magnetic composition.

[0116] Furthermore, even in the case of using copper (Cu) as a material of the internal electrode and sintering the multilayer ceramic capacitor under a reducing atmosphere (N 2 atmosphere), the fourth auxiliary component can obtain target characteristics of the multilayer ceramic capacitor.

[0117] When the content of Ba in the fourth auxiliary component exceeds 3.0 at % based on 100 at % of the matrix material powder particles, high temperature withstand voltage characteristics of the multilayer ceramic capacitor may be deteriorated.

[0118] Specifically, the dielectric magnetic composition according to the exemplary embodiment of the present disclosure may further include a fourth auxiliary component, which is an oxide, carbonate or fluoride including Ba, wherein the content of Ba based on 100 at% of the base material powder particles is 0 at% to 3.0 at%. Therefore, copper (Cu) can be used as a material for the inner electrode, the multilayer ceramic capacitor can be sintered under a reducing atmosphere, and the high dielectric constant and high temperature withstand voltage characteristics of the multilayer ceramic capacitor can be obtained.

[0119] On the other hand, according to an exemplary embodiment in the present disclosure, the fourth auxiliary component may include Ba such that a molar ratio between Ba and Si is 0 to 4.0.

[0120] When the molar ratio between the fourth auxiliary component and the second auxiliary component including the oxide containing Si or the glass compound containing Si is controlled to satisfy 0 to 4.0, a high dielectric constant of the multilayer ceramic capacitor can be obtained, and excellent high temperature withstand voltage characteristics of the multilayer ceramic capacitor can be obtained.

[0121] In detail, even in the case where the Ba content of the fourth auxiliary component (including Ba oxide, titanate or fluoride) exceeds 3.0 at %, when the molar ratio between Ba and Si is controlled to 4.0 by increasing the content of Si (the second auxiliary component), the high temperature withstand voltage characteristics of the multilayer ceramic capacitor can be improved.

[0122] However, when the molar ratio between Ba and Si exceeds 4.0, the withstand voltage characteristics of the multilayer ceramic capacitor may be deteriorated, and a reliability problem may occur.

[0123] f) Fifth auxiliary ingredient

[0124] According to an exemplary embodiment in the present disclosure, the dielectric magnetic composition may include a fifth auxiliary component, which is an oxide, a carbonate or a fluoride including at least one of Dy, Y, Ho, Sm, Gd, Er, La and Tb.

[0125] The dielectric magnetic composition may further include a fifth auxiliary component, which is an oxide, carbonate or fluoride of at least one of Dy, Y, Ho, Sm, Gd, Er, La and Tb, wherein the content of each element in the fifth auxiliary component based on 100 at % of the matrix material powder particles is 0 at % to 4.0 at %.

[0126] The fifth auxiliary component may be used to improve direct current (DC) bias characteristics of a multilayer ceramic capacitor using the dielectric magnetic composition, and may be used to improve high temperature withstand voltage characteristics of the multilayer ceramic capacitor to improve reliability.

[0127] When the content of each element in the fifth auxiliary component exceeds 4.0 at % based on 100 at % of the base material powder particles, the room temperature dielectric constant may decrease to make it difficult to achieve target characteristics.

[0128] Specifically, the dielectric magnetic composition according to the exemplary embodiment in the present disclosure may further include a fifth auxiliary component, which is an oxide, carbonate or fluoride including at least one of Dy, Y, Ho, Sm, Gd, Er, La and Tb, wherein the content of each element in the fifth auxiliary component based on 100 at% of the base material powder particles is 0 at% to 4.0 at%. Therefore, the DC bias characteristics of the multilayer ceramic capacitor can be improved, and the high temperature withstand voltage characteristics can be increased to improve reliability.

[0129] In the method of manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure, a ceramic substrate including BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1) and having a base material powder particle whose surface is coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal.

[0130] Powder particles having an average particle size of 150 nm or less can be used as a (1-x) Ca x )The matrix material powder particles represented by Ti2O5 (0≤x<0.1).

[0131] The method of coating one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals on the surface of the base material powder particles is not particularly limited, and can be performed by, for example, performing heat treatment on the base material powder particles co-doped with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals at 1200°C, and wet-grinding the base material powder particles formed after the heat treatment and then drying.

[0132] Additives (such as Sn, Mn, etc.), binders, and organic solvents (such as ethanol, etc.) are added to the coated base material powder particles and wet-mixed with the coated base material powder particles to prepare a dielectric slurry. The dielectric slurry is then applied to a carrier film and dried to form a plurality of ceramic green sheets.

[0133] Thus, a dielectric layer can be formed.

[0134] Next, a conductive paste for an internal electrode including 40 to 50 parts by weight (based on 100 parts by weight of the conductive paste) of nickel powder particles having an average particle size of 0.1 to 0.2 μm may be prepared.

[0135] Conductive paste for internal electrodes is applied to ceramic green sheets by screen printing to form internal electrodes, the ceramic green sheets on which the internal electrode patterns are provided are stacked to form a green sheet laminate, and then the green sheet laminate is pressed and cut.

[0136] Then, the cut green sheet stack is heated to remove the binder, and sintered in a high-temperature reducing atmosphere to form a ceramic body.

[0137] The ceramic body may include a dielectric layer, and a plurality of first and second internal electrodes arranged to face each other with each of the dielectric layers interposed between the first and second internal electrodes.

[0138] In the sintering process, sintering was performed under a reducing atmosphere (atmosphere of 0.1% H2 / 99.9% N2 and H2O / H2 / N2).

[0139] Then, an electrode layer including one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and glass may be formed on an outer surface of the ceramic body.

[0140] The glass is not particularly limited, but may be a material having the same composition as that of glass used to manufacture external electrodes of a conventional multilayer ceramic capacitor.

[0141] Electrode layers may be formed on upper and lower surfaces and end portions of the ceramic body to be electrically connected to the first and second internal electrodes, respectively.

[0142] The electrode layer may include 5% or more (by volume) glass relative to the conductive metal.

[0143] Then, the conductive resin layers 131 b and 132 b may be formed by applying a conductive resin composition to the electrode layers 131 a and 132 a and then hardening the conductive resin composition.

[0144] The conductive resin layers 131 b and 132 b may include one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and a matrix resin. The matrix resin may be an epoxy resin.

[0145] Then, nickel (Ni) plated layers 131 c and 132 c may be formed on the conductive resin layers 131 b and 132 b , respectively, and palladium (Pd) plated layers 131 d and 132 d may be formed on the nickel (Ni) plated layers 131 c and 132 c , respectively.

[0146] A multilayer ceramic electronic component 100 according to another exemplary embodiment of the present disclosure may include: a ceramic body 110 including a dielectric layer 111 and a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 arranged to face each other, and each of the dielectric layers 111 is interposed between the first internal electrode 121 and the second internal electrode 122, and the ceramic body 110 has a first surface S1 and a second surface S2 opposite to each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first surface S1 and the second surface S2 and opposite to each other in the second direction, and a fifth surface S5 and a sixth surface S6 connected to the first surface to the fourth surface and opposite to each other in a third direction; and a first external electrode 131 and a second external electrode 132 disposed on an outer surface of the ceramic body 110 and electrically connected to the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122, wherein each of the dielectric layers 111 includes a first surface S1 and a second surface S2 opposite to each other in a first direction, and a third surface S3 and a fourth surface S4 connected to the first surface S1 and the second surface S2 and opposite to each other in the second direction, and a fifth surface S5 and a sixth surface S6 connected to the first surface to the fourth surface and opposite to each other in a third direction; and a first external electrode 131 and a second external electrode 132 disposed on an outer surface of the ceramic body 110 and electrically connected to the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122, respectively, wherein each of the dielectric layers 111 includes a dielectric layer containing BaTi2O5 or (Ba (1-x) Ca x )Ti2O5 (0≤x<0.1), the base material powder particles having a surface coated with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals.

[0147] Reference Figure 4 , t2>t3, wherein t3 is the thickness of a region where the nickel (Ni) content in the dielectric layer 111 is 3 wt % or less from a boundary of each of the first and second internal electrodes 121 and 122 , and t2 is the thickness of each of the first and second internal electrodes 121 and 122 .

[0148] According to this exemplary embodiment, BaTi2O5 or (Ba (1-x)Ca x )Ti2O5 (0≤x<0.1) may be coated with one or more of Mg, Mn, V, Ba, Si, Al, and rare earth metals, and a thickness t3 of a region (e.g., a continuous region) in which the nickel (Ni) content in the dielectric layer 111 is 3 wt % or less from a boundary of each of the first and second internal electrodes 121 and 122 may therefore be smaller than a thickness t2 of each of the first and second internal electrodes 121 and 122.

[0149] As described above, the problem of nickel (Ni) diffusing into the dielectric layer can be significantly suppressed to prevent a decrease in the dielectric constant, thereby realizing a high-capacitance multilayer ceramic capacitor.

[0150] Reference Figure 4 In a multilayer ceramic electronic component according to another exemplary embodiment in the present disclosure, t1>2×t2, where t1 is the thickness of the dielectric layer 111 and t2 is the thickness of each of the internal electrodes 121 and 122 .

[0151] That is, according to another exemplary embodiment in the present disclosure, the thickness t1 of the dielectric layer 111 may be greater than twice the thickness t2 of each of the internal electrodes 121 and 122 .

[0152] Generally, in a high voltage electrical component, the problem of reliability according to a decrease in breakdown voltage under a high voltage environment may be important.

[0153] In a multilayer ceramic capacitor according to another exemplary embodiment of the present disclosure, the thickness t1 of the dielectric layer 111 may be set to be greater than twice the thickness t2 of each of the internal electrodes 121 and 122 to prevent a decrease in breakdown voltage under a high voltage environment. That is, the thickness of the dielectric layer (the distance between the internal electrodes) may be increased to improve the breakdown voltage characteristics.

[0154] When the thickness t1 of the dielectric layer 111 is equal to or less than twice the thickness t2 of each of the internal electrodes 121 and 122 , the thickness of the dielectric layer (the distance between the internal electrodes) may be small, so that the breakdown voltage may decrease.

[0155] The thickness t2 of the internal electrode may be less than 2 μm, and the thickness t1 of the dielectric layer may be less than 10.0 μm. However, the thickness t2 of the internal electrode and the thickness t1 of the dielectric layer are not necessarily limited thereto.

[0156] Figure 5 According to another exemplary embodiment of the present disclosure, Figure 1 A cross-sectional view taken along line I-I'.

[0157] Reference Figure 5The multilayer ceramic capacitor according to the present exemplary embodiment may further include a plurality of floating electrodes 123 arranged in the ceramic body 110 to be offset from the first and second internal electrodes 121' and 122' in a thickness direction and having opposite ends overlapping portions of the first and second internal electrodes 121' and 122', respectively.

[0158] The first and second internal electrodes 121 ′ and 122 ′ having different polarities may be simultaneously formed on at least one surface of the ceramic sheet forming the dielectric layer 111 to be separated from each other and may be arranged in the ceramic body 110 to be exposed through opposite end surfaces of the ceramic body 110 , respectively.

[0159] The first and second internal electrodes 121 ′ and 122 ′ respectively exposed through opposite end surfaces of the ceramic body 110 may be electrically connected to the first and second external electrodes 131 and 132 , respectively.

[0160] The plurality of floating electrodes 123 and the plurality of first and second internal electrodes 121′ and 122′ may be arranged in the ceramic body 110 to be offset from each other in a thickness direction of the ceramic body 110, and portions of opposite ends of the plurality of floating electrodes 123 may overlap ends of the first and second internal electrodes 121′ and 122′ that are separated from each other, respectively.

[0161] Each of the distances by which the plurality of floating electrodes 123 are separated from the opposite end surfaces of the ceramic body 110 may be 5% or more of the entire length of the ceramic body 110 .

[0162] On the other hand, according to another exemplary embodiment in the present disclosure, the first and second dummy electrodes 124 a and 124 b separated from each other may be arranged in the upper cover portion C1 disposed on the upper surface of the active portion A and the lower cover portion C2 disposed on the lower surface of the active portion A.

[0163] The first dummy electrode 124 a may be exposed to the same surface as the outer surface of the ceramic body 110 where the first internal electrode 121 ′ is exposed, and the second dummy electrode 124 b may be exposed to the same surface as the outer surface of the ceramic body 110 where the second internal electrode 122 ′ is exposed.

[0164] The first dummy electrode 124a may be exposed to the same surface as the outer surface of the ceramic body 110 where the first internal electrode 121' is exposed, and the second dummy electrode 124b may be exposed to the same surface as the outer surface of the ceramic body 110 where the second internal electrode 122' is exposed, thereby improving the warpage strength of the multilayer ceramic capacitor.

[0165] As explained above, according to the exemplary embodiments of the present disclosure, a material including BaTi2O5 or (Ba(1-x) Ca x )Ti2O5 (0≤x<0.1) and having a dielectric electromagnetic composition of base material powder particles whose surfaces are coated with one or more of Mg, Mn, V, Ba, Si, Al and rare earth metals to manufacture multilayer ceramic capacitors, thereby stably ensuring the high-temperature capacitance change rate and realizing a high-capacitance multilayer ceramic capacitor.

[0166] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. A dielectric electromagnetic composition, comprising matrix material powder particles, wherein the matrix material powder particles include powder particles represented by BaTi2O5 and / or (Ba (1-x) Ca x )Ti2O5 represented by powder particles, wherein 0 < x < 0.1, and the surface of the matrix material powder particles is coated with at least one selected from the group consisting of Mg, Mn, V, Ba, Si, Al, and rare earth metals.

2. The dielectric magnetic composition according to claim 1, wherein Based on 100 moles of Ti in the elements of the matrix material powder particles, the content of the at least one selected from the group consisting of Mg, Mn, V, Ba, Si, Al, and rare earth metals is 2 moles or less.

3. The dielectric magnetic composition according to claim 1, wherein The surface of the matrix material powder particles is coated with the rare earth metal, and the rare earth metal includes at least one selected from the group consisting of Y, Dy, Ho, La, Ce, Nd, Sm, Gd, and Er.

4. The dielectric magnetic composition according to claim 1, wherein 0<x≤0.07。 5. The dielectric magnetic composition according to claim 1, wherein the dielectric magnetic composition further comprises a first auxiliary component, and the first auxiliary component includes an oxide or carbonate containing at least one of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn. in, Based on 100 mol% of the matrix material powder particles, the content of the first auxiliary component is 0.1 mol% to 2.0 mol%.

6. The dielectric magnetic composition according to claim 1, wherein the dielectric magnetic composition further comprises a second auxiliary component, and the second auxiliary component includes an oxide containing Si or a glass compound containing Si. in, Based on 100 mol% of the matrix material powder particles, the content of the second auxiliary component is 0.2 mol% to 5.0 mol%.

7. The dielectric magnetic composition according to claim 1, wherein the dielectric magnetic composition further comprises a third auxiliary component, and the third auxiliary component includes an oxide, carbonate, or fluoride containing Li. in, Based on 100 mol% of the matrix material powder particles, the content of the third auxiliary component is 0.4 mol% to 12.0 mol%.

8. The dielectric magnetic composition according to claim 1, wherein the dielectric magnetic composition further comprises a fourth auxiliary component, and the fourth auxiliary component includes an oxide, carbonate, or fluoride containing Ba. in, Based on 100 at% of the matrix material powder particles, the content of the fourth auxiliary component is 0 at% to 3.0 at%.

9. The dielectric magnetic composition according to claim 1, wherein the dielectric magnetic composition further comprises a fifth auxiliary component, and the fifth auxiliary component includes an oxide, carbonate, or fluoride containing at least one of Dy, Y, Ho, Sm, Gd, Er, La, and Tb. in, Based on 100 at% of the matrix material powder particles, the content of the fifth auxiliary component is 0 at% to 4.0 at%.

10. The dielectric magnetic composition according to claim 1, wherein The matrix material powder particles have an average particle size of 150 nm or less.

11. The dielectric magnetic composition according to claim 1, wherein the dielectric magnetic composition further comprises a second auxiliary component and a fourth auxiliary component, the second auxiliary component includes an oxide containing Si or a glass compound containing Si, and the fourth auxiliary component includes an oxide, carbonate, or fluoride containing Ba. in, The molar ratio between the fourth auxiliary component and the second auxiliary component is 0 to 4.0.

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