A double-layer enhanced heat exchange cooling heat sink

Abstract

The present invention is a one-in-two-out device, belonging to the field of three-dimensional integrated circuits and high-power semiconductor heat dissipation and cooling technology, and relates to a double-layer enhanced heat exchange cooling heat sink. It includes a top plate (1), a jet hole plate (2), a bubble forming cavity (3), a petal-shaped cooling target plate (4), a heat exchange cavity (5), and an outflow hole (6). The present invention proposes a new structure that combines the advantages of ribs and micropores, improves the heat transfer coefficient and critical heat flux density, and enhances heat transfer. When the cooling medium jet enters the bubble forming cavity (3), due to the distribution of ribs and bubble forming holes (32) on it, the nucleation point density is increased, the cooling medium will perform preliminary heat exchange, and a large number of bubbles will be generated to take away heat, thereby improving the working efficiency of the cooling medium; after the cooling medium enters the heat exchange cavity (5), advanced heat exchange will be performed. Due to the arc design of the petal-shaped cooling target plate (4), turbulence will be generated, thereby achieving the purpose of enhanced heat dissipation and making full use of the cooling medium.

Description

Technical Field

[0001] The invention belongs to the technical field of three-dimensional integrated circuit and high-power semiconductor heat dissipation and cooling, and relates to a double-layer enhanced heat exchange cooling heat sink. Background Art

[0002] In recent years, with the rapid development of aerospace technology and microelectronics technology, the integration of electronic circuits has been continuously improved, and the capacity of electronic components has been continuously expanded. The resulting high heat generation of electronic components has become a major hidden danger affecting normal operation. For electronic equipment, increased temperature means decreased reliability. When the temperature of electronic equipment reaches 70-80℃, its reliability decreases by 5% for every 10℃ increase in temperature.

[0003] In view of this situation, microchannel cooling technology has been widely used. At present, microchannel cooling mostly uses ribs, which has the advantage of increasing the critical heat flux density, but cannot increase the heat transfer coefficient. In addition, the micro-nanoscale heat transfer mechanism is the dominant heat transfer mechanism in boiling heat transfer, so the vapor-liquid phase change heat transfer should be strengthened while ensuring sufficient heat exchange. Summary of the invention

[0004] The purpose of the present invention is to improve the cooling efficiency and strengthen the heat exchange through a new structure while ensuring uniform and stable heat exchange. To achieve this purpose, the scheme of the present invention is as follows:

[0005] A double-layer enhanced heat exchange cooling heat sink comprises a top plate (1), a jet hole plate (2), a bubble forming cavity (3), a petal-shaped cooling target plate (4), a heat exchange cavity (5), and an outflow hole (6). The present invention is a one-inlet and two-outlet device.

[0006] Furthermore, the top plate (1) has a water inlet hole, and the cooling medium flows in through the water inlet hole.

[0007] Furthermore, the jet holes in the jet hole plate (2) are arranged in a 4×2 uniform array, with a lateral and longitudinal distance of 19 d. The jet hole plate (2) is 119 d long, 62 d wide and 5 d thick.

[0008] Furthermore, the diamond rib column in the bubble forming chamber (3) is coaxial with the jet hole of the jet hole plate (2); the bubble forming chamber (3) comprises a jet hole (31), a bubble forming hole (32), a circular rib column (33), and a diamond rib column (34), a total of four working units; the jet hole of the bubble forming chamber (3) is coaxial with the petal-shaped cooling target plate (4); and the outflow hole (6) is located on both sides of the heat exchange chamber (5).

[0009] Furthermore, the bubble forming chamber (3) comprises a jet hole (31), a bubble forming hole (32), a circular rib column (33), and a diamond rib column (34), a total of four working units.

[0010] Furthermore, the jet holes (31) are arranged in a uniform array of 6×3 in the bubble forming chamber (3).

[0011] Furthermore, a diamond rib column (34), four bubble forming holes (32), and four circular rib columns (33) form a working group. The diamond rib columns (34) are distributed at the center of the square formed by the jet holes (31) in a 5×2 uniform array; the circular rib columns (33) are distributed around the diamond rib columns (34) up and down, left and right; and the bubble forming holes (32) are distributed around the diamond rib columns (34) and close to the circular rib columns (33).

[0012] Furthermore, the diameters of the jet hole (31), the bubble forming hole (32), and the circular rib column (33) are all 4d; the depth of the bubble forming hole (32) is 3d, and the height of the circular rib column (33) is 3d; the height of the diamond rib column (34) is 3d, and the side length is 2d.

[0013] Furthermore, the cooling medium flows through the bubble forming cavity (3) to perform preliminary heat exchange; the diamond ribs (34) and the circular ribs (33) can enhance the heat exchange, increase the critical heat flux density, and make the heat exchange more sufficient; the bubble forming holes (32) increase the nucleation point density and the heat transfer coefficient, so that the bubbles are formed and separated.

[0014] Furthermore, the jet hole (31) in the bubble forming cavity (3) and the petal-shaped cooling target plate (4) in the heat exchange cavity (5) are cocentric.

[0015] Furthermore, the petal-shaped cooling target plates (4) in the heat exchange cavity (5) are arranged in a 6×3 uniform array.

[0016] Furthermore, four layers of arc-shaped ribs are distributed on the petal-shaped cooling target plate (4), wherein the first layer is composed of three arc-shaped ribs, the second layer is composed of six arc-shaped ribs, the third layer is composed of 12 arc-shaped ribs, and the fourth layer is composed of 24 arc-shaped ribs.

[0017] Furthermore, the petal-shaped cooling target plate (4) has a diameter of 18d and a rib column height of 2d.

[0018] Furthermore, there are three outflow holes (6) on each side of the heat exchange cavity (5); the outflow holes (6) have a diameter of 2d and are spaced 19d apart.

[0019] Furthermore, the cooling medium flows in from the circular water inlet of the top plate (1), passes through the jet hole plate (2), and flows into the bubble forming chamber (3) from the jet hole, impacts the diamond rib column (34) head-on, and then disperses and impacts the circular rib column (33), flows through the bubble forming hole (32), enters the heat exchange chamber (5) from the jet hole (31), performs advanced heat exchange with the petal-shaped cooling target plate (4), and finally flows out from the outlet holes (6) on both sides.

[0020] The advantages of the present invention are:

[0021] The double-layer design allows the cooling medium to undergo two heat exchanges; initial heat exchange is performed in the bubble forming chamber (3), the temperature of the cooling medium rises, and the temperature change in the heat exchange chamber (5) is smaller than that in the bubble forming chamber (3), so bubbles are not easily generated; and after the advanced heat exchange, the overall heat exchange is more sufficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Appearance of double-layer enhanced heat exchange cooling heat sink

[0023] Figure 2 Double-layer enhanced heat exchange cooling heat sink jet orifice plate structure diagram

[0024] Figure 3 Schematic diagram of bubble formation cavity of double-layer enhanced heat exchange cooling heat sink

[0025] Figure 4 Three views of the bubble formation cavity of the double-layer enhanced heat exchange cooling heat sink

[0026] Figure 5 Schematic diagram of heat exchange cavity of double-layer enhanced heat exchange cooling heat sink

[0027] Figure 6 Three views of the heat exchange cavity of the double-layer enhanced heat exchange cooling heat sink

[0028] Figure 7 Double-layer enhanced heat exchange cooling heat sink petal-shaped cooling target plate structure diagram DETAILED DESCRIPTION

[0029] The present invention is a one-inlet and two-outlet device, a double-layer enhanced heat exchange cooling heat sink, comprising a top plate (1), a jet hole plate (2), a bubble forming chamber (3), a petal-shaped cooling target plate (4), a heat exchange chamber (5), and an outflow hole (6); a cooling medium flows in from a circular water inlet of the top plate (1), passes through the jet hole plate (2), flows into the bubble forming chamber (3) from the jet hole, impacts a diamond rib column (34) head-on, and then impacts the circular rib column (33) in all directions, flows through the bubble forming hole (32), enters the heat exchange chamber (5) from the jet hole (31), performs advanced heat exchange with the petal-shaped cooling target plate (4), and finally flows out from the outflow holes (6) on both sides.

[0030] The lower part of the top plate (1) is welded to the upper part of the bubble forming chamber (3), and the lower part of the bubble forming chamber (3) is welded to the upper part of the heat exchange chamber (5). The above structural materials are all made of oxygen-free copper, and the connection method is completed by vacuum welding.

[0031] refer to Figure 2 The jet orifice plate (2) is made of oxygen-free copper, and the jet holes thereon are formed by micro-milling and polished. The jet orifice plate (2) is 119d long, 62d wide, and 5d thick. The jet holes are arranged in a 4×2 uniform array, and the distance between the holes in the horizontal and vertical directions is 19d.

[0032] refer to Figure 4 The presence of the bubble forming holes (32) in the bubble forming cavity (3) significantly improves the nucleation point density and the heat transfer coefficient, and after preliminary heat exchange, the overall heat exchange time is longer and the heat exchange is more sufficient.

[0033] refer to Figure 6 The heat exchange cavity (5) is made of oxygen-free copper smelting method, and its main function is heat exchange; the petal-shaped cooling target plate (4) thereon is designed in an arc shape, so that the disturbance of the cooling medium is increased, and the cooling medium flowing out of the bubble forming cavity (3) can fully play its role; there are six outflow holes (6) on the heat exchange cavity (5), which are arranged on both sides.

[0034] refer to Figure 7 The base of the petal-shaped cooling target plate (4) is cut from oxygen-free copper, and the ribs on it are made from silicon cutting, and the ribs are glued to the base. The rib height is 3d

[0035] The petal-shaped cooling target plate (4) has four layers in total. The first layer is composed of three arc-shaped rib columns, the interior of which is a circle with a diameter of 4d; the second layer is composed of six arc-shaped rib columns, the interior of which is a circle with a diameter of 8d; the third layer is composed of 12 arc-shaped rib columns, the interior of which is a circle with a diameter of 12d; and the fourth layer is composed of 24 arc-shaped rib columns, the interior of which is a circle with a diameter of 16d.

[0036] Matters not covered by the present invention are known technologies.

[0037] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A double-layer enhanced heat exchange cooling heat sink, comprising a top plate (1), a jet orifice plate (2), a bubble forming cavity (3), a petal-shaped cooling target plate (4), a heat exchange cavity (5), and an outflow hole (6), characterized in that: The rhombus rib column in the bubble forming chamber (3) is coaxial with the jet hole of the jet hole plate (2); the bubble forming chamber (3) comprises a jet hole (31), a bubble forming hole (32), a circular rib column (33), and a rhombus rib column (34), a total of four working units; the jet hole (31) of the bubble forming chamber (3) is coaxial with the petal-shaped cooling target plate (4); and the outflow hole (6) is located on both sides of the heat exchange chamber (5).

2. A double-layer enhanced heat exchange cooling heat sink according to claim 1, characterized in that: The bubble forming chamber (3) comprises a jet hole (31), a bubble forming hole (32), a circular rib column (33), and a diamond rib column (34), a total of four working units.

3. A double-layer enhanced heat exchange cooling heat sink according to claim 1, characterized in that: The jet holes (31) are arranged in a 6×3 uniform array in the bubble forming chamber (3); the diamond ribs (34) are distributed in the center of the square formed by the jet holes (31) in a 5×2 uniform array; the circular ribs (33) are distributed around the diamond ribs (34) in the upper, lower, left and right directions; and the bubble forming holes (32) are distributed in the four directions of the diamond ribs (34) and close to the circular ribs (33).

4. A double-layer enhanced heat exchange cooling heat sink according to claim 1, characterized in that: A rhombus rib column (34), four bubble forming holes (32), and four circular rib columns (33) form a working group.

5. The double-layer enhanced heat exchange cooling heat sink according to claim 1, characterized in that: The jet hole (31) in the bubble forming cavity (3) and the petal-shaped cooling target plate (4) in the heat exchange cavity (5) are cocentric.

6. A double-layer enhanced heat exchange cooling heat sink according to claim 1, characterized in that: Four layers of arc-shaped rib columns are distributed on the petal-shaped cooling target plate (4), wherein the first layer is composed of three arc-shaped rib columns, the second layer is composed of six arc-shaped rib columns, the third layer is composed of 12 arc-shaped rib columns, and the fourth layer is composed of 24 arc-shaped rib columns.

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