Display panel and manufacturing method thereof

Abstract

The application discloses a display panel and a preparation method thereof. The display panel comprises a display area and a peripheral area surrounding the display area. A convex platform structure is arranged on the peripheral area. An alignment mark is arranged on the platform structure. A normal projection of the alignment mark on the upper surface of the platform structure is located in the upper surface, and the area of the upper surface is greater than the area of the normal projection. The application provides a display panel with high alignment accuracy and a preparation method thereof.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] Display panels are multifunctional stacked film structures, and their fabrication process often requires multiple exposures and developments to pattern each functional layer. However, these exposures and developments require alignment marks to prevent misalignment of the functional layers.

[0003] Take a display panel manufactured using Color Filter on Encapsulation (COE) technology as an example. Although COE technology can increase light output and save a significant amount of production costs, the alignment accuracy of its pixel definition layer and black matrix layer urgently needs improvement. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a display panel and a method for manufacturing the same, which overcomes or at least partially solves the above problems.

[0005] In a first aspect, a display panel is provided, comprising:

[0006] The display area and the surrounding area of ​​the display area;

[0007] A raised platform structure is provided on the peripheral area, and an alignment mark is provided on the platform structure. The orthographic projection of the alignment mark on the upper surface of the platform structure is located within the upper surface, and the area of ​​the upper surface is larger than the area of ​​the orthographic projection.

[0008] Optionally, the height of the platform structure is 1.0~5.0μm; the thickness of the alignment mark is 0.1~0.5μm.

[0009] Optionally, the platform structure is made of an organic curable material.

[0010] Optionally, the platform structure is made of photosensitive polyimide or acrylic.

[0011] Optionally, a source / drain layer and a planarization layer are sequentially disposed on the substrate, and the platform structure is on the same layer as the planarization layer; or, a transistor layer and a pixel definition layer are sequentially disposed on the substrate, and the platform structure is on the same layer as the pixel definition layer.

[0012] Optionally, a source / drain layer is disposed on the substrate, and the alignment mark is on the same layer as the source / drain layer; or, a metal electrode layer is disposed on the substrate, and the alignment mark is on the same layer as the metal electrode layer.

[0013] Optionally, the edge of the orthographic projection is spaced apart from the edge of the upper surface. In a second aspect, a method for manufacturing a display panel is provided, comprising:

[0014] Provide substrates;

[0015] A raised platform structure is formed on the substrate.

[0016] Alignment marks are prepared on the platform structure, wherein the orthographic projection of the alignment marks on the upper surface of the platform structure is located within the upper surface, and the area of ​​the upper surface is larger than the area of ​​the orthographic projection.

[0017] Based on the alignment mark, an alignment exposure process is performed to prepare the functional layer.

[0018] Optionally, the height of the platform structure is 1.0~5.0μm; the thickness of the alignment mark is 0.1~0.5μm.

[0019] Optionally, the platform structure is made of an organic curable material.

[0020] Optionally, the platform structure is made of photosensitive polyimide or acrylic.

[0021] Optionally, forming a raised platform structure on the substrate includes: forming a source / drain layer on the substrate and forming a planarization layer on the source / drain layer; patterning the planarization layer to form the platform structure; or, forming a transistor layer on the substrate and forming a pixel definition layer on the transistor layer; patterning the pixel definition layer to form the platform structure.

[0022] Optionally, the step of fabricating alignment marks on the platform structure includes: forming a source / drain layer on the substrate on which the platform structure is formed; patterning the source / drain layer to form the alignment marks; or, forming a metal electrode layer on the substrate on which the platform structure is formed; patterning the metal electrode layer to form the alignment marks.

[0023] Optionally, the edges of the orthographic projection are spaced apart from the edges of the upper surface.

[0024] Optionally, the step of performing an alignment exposure process to prepare a functional layer based on the alignment mark includes: coating a colored photoresist on the substrate, wherein the thickness of the colored photoresist blocked on the alignment mark is reduced due to the height difference between the platform structure and the surrounding area; and performing an alignment exposure process based on the alignment mark to prepare a functional layer.

[0025] Optionally, the step of performing a alignment exposure process based on the alignment mark to prepare a functional layer includes: performing a alignment exposure process based on the alignment mark to prepare a pixel definition layer and / or a black matrix layer.

[0026] The technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:

[0027] The display panel and its fabrication method provided in this invention involve first forming a raised platform structure, and then fabricating alignment marks on the platform structure, with the alignment marks completely located within the upper surface of the platform structure. During the alignment exposure process, under the influence of gravity and the height difference between the platform structure and its surroundings, most of the photoresist coated on the substrate flows down the platform structure, reducing the thickness of the photoresist obscuring the alignment marks and increasing the photoresist transmittance on the alignment mark surface. This avoids the photoresist (especially colored photoresist) obscuring the alignment marks, enabling more accurate identification of the alignment mark position during the exposure process, improving the alignment accuracy during the fabrication of each functional layer, thereby improving yield and product reliability. Attached Figure Description

[0028] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0029] Figure 1 This is a flowchart of the method for preparing the display panel in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the manufacturing process of the display panel in an embodiment of the present invention. Figure 1 ;

[0031] Figure 3 This is a schematic diagram of the manufacturing process of the display panel in an embodiment of the present invention. Figure 2 ;

[0032] Figure 4 This is a schematic diagram of the manufacturing process of the display panel in an embodiment of the present invention. Figure 3 ;

[0033] Figure 5 This is a schematic diagram of the manufacturing process of the display panel in an embodiment of the present invention. Figure 4 ;

[0034] Figure 6 This is a schematic diagram of the manufacturing process of the display panel in an embodiment of the present invention. Figure 5 ;

[0035] Figure 7 This is a schematic diagram of the display panel structure in an embodiment of the present invention;

[0036] Figure 8 This is a cross-sectional view of the display panel in an embodiment of the present invention. Figure 1 ;

[0037] Figure 9 This is a cross-sectional view of the display panel in an embodiment of the present invention. Figure 2 . Detailed Implementation

[0038] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0039] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0040] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0041] To better understand the above technical solutions, the following will describe the above technical solutions in detail with reference to specific implementation methods. It should be understood that the embodiments of this disclosure and the specific features in the embodiments are detailed descriptions of the technical solutions of this application, rather than limitations on the technical solutions of this application. In the absence of conflict, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0042] This application provides a method for manufacturing a display panel, such as... Figure 1 As shown, it includes:

[0043] Step S101: Provide a substrate.

[0044] Step S102: A raised platform structure is formed on the substrate.

[0045] Step S103: An alignment mark is prepared on the platform structure. The orthographic projection of the alignment mark on the upper surface of the platform structure is located within the upper surface, and the area of ​​the upper surface is larger than the area of ​​the orthographic projection.

[0046] Step S104: Based on the alignment mark, perform an alignment exposure process to prepare a functional layer.

[0047] It should be noted that the display panel can be an organic light-emitting diode (OLED) display panel, a liquid crystal display (LCD) display panel, or a light-emitting diode (LED) display panel; there are no restrictions on this.

[0048] Below, in conjunction with Figure 2-6 Taking OLED as an example, the manufacturing method of the display panel in this embodiment is described in detail:

[0049] In step S101, as follows Figure 2 As shown, a substrate 1 is provided, which can be a glass substrate, a plastic substrate, or a semiconductor substrate, and is not limited thereto. Some functional layers may have been pre-fabricated on the substrate 1.

[0050] In step S102, as Figure 3 As shown, a raised platform structure 2 is formed on the substrate 1. Because the platform structure 2 is raised, it has a height difference relative to its surroundings. During subsequent photoresist coating processes, due to gravity and the height difference, the photoresist on the platform structure 2 flows towards the periphery, making the photoresist on the platform structure 2 thinner and increasing its transmittance, thus facilitating accurate identification of alignment marks.

[0051] In an optional implementation, the height of the platform structure 2 can be 1.0~5.0μm. Such a height setting can significantly increase the height difference between the alignment mark surface and the surrounding surface, increase the fluidity of the photoresist, and will not affect the implementation of other processes due to the excessive height of the platform structure 2.

[0052] It should be noted that platform structure 2 is often located outside the display area of ​​the display panel to avoid obstructing the display area. Specifically, it can be located in one of the four corners of the perimeter of the display panel or near the testing area; there are no restrictions here. The upper surface of platform structure 2 can be square, rectangular, circular, or polygonal; there are no restrictions here, and they will not be listed one by one.

[0053] In an optional implementation, the platform structure 2 can be made of an organic curable material. Organic curable materials are stable and their fabrication process is often a coating process. Compared to sputtering or chemical deposition processes, coating processes can more efficiently produce a thicker material layer that meets the height requirements of the platform structure 2. For example, the platform structure 2 can be made of photosensitive polyimide photoresist (PSPI) or acrylic. Both of these materials are required for existing display panel structures. The fabrication of the platform structure 2 can be performed concurrently with the fabrication process of the structural layer made of the same material, reducing process steps, saving costs, and improving efficiency.

[0054] The specific fabrication process steps for platform structure 2 can be set in various ways. Two examples are listed below:

[0055] The first method involves preparing the platform structure 2 simultaneously with the preparation of the planarization layer.

[0056] A source / drain layer (SD layer) is formed on the substrate 1, and a planarization layer (PLN layer) is formed on the source / drain layer. The planarization layer is then patterned to form a platform structure 2. Since display panels often have multiple source / drain layers and multiple planarization layers spaced apart, the platform structure 2 can be fabricated on any of the planarization layers. Because the material of the planarization layer is generally photosensitive polyimide, its coating process and material stability are suitable for fabricating the platform structure 2, ensuring both the height and stability of the platform structure 2. Furthermore, since the planarization layer is located on the array substrate layer and is fabricated before the pixel layer and encapsulation layer, fabricating the platform structure 2 simultaneously with the planarization layer facilitates precise alignment of subsequent key functional layers (such as the pixel definition layer and the black matrix layer).

[0057] The second method involves preparing the platform structure 2 simultaneously with the pixel definition layer.

[0058] A transistor layer (including a source / drain layer, a gate layer, and a planarization layer) is formed on a substrate 1, and a pixel definition layer is formed on the transistor layer. The pixel definition layer is then patterned to form a platform structure 2. Since the pixel definition layer is typically made of photosensitive polyimide, its coating process and material stability are suitable for fabricating the platform structure 2, ensuring both the height and stability of the platform structure 2. Furthermore, the pixel definition layer is fabricated before the black matrix layer; fabricating the platform structure 2 simultaneously with the pixel definition layer facilitates precise alignment between the subsequent black matrix layer and the pixel definition layer.

[0059] Of course, the process steps for preparing platform structure 2 are not limited to the two mentioned above. It can be prepared in any stable material layer with sufficient thickness. In order to take efficiency into consideration, it can be prepared in any organic curable material layer. For example, platform structure 2 can be prepared at the same time as the filling layer of the fan-out area, bonding area or test area of ​​the peripheral area, or platform structure 2 can be prepared at the same time as the planarization layer (OC layer) above the pixel layer. There are no restrictions here, and they will not be listed one by one.

[0060] In step S103, as Figure 4 and Figure 5 ( Figure 5 for Figure 4 As shown in the top view, alignment marks 3 are fabricated on the platform structure 2. The orthographic projection of the alignment marks 3 onto the upper surface of the platform structure 2 lies within the upper surface, and the area of ​​the upper surface of the platform structure 2 is larger than the area of ​​the orthographic projection. Due to unavoidable process errors, the area of ​​the upper surface of the platform structure 2 is set to be larger than the area of ​​the orthographic projection of the alignment marks 3 onto it. This ensures that even with process errors, the alignment marks 3 can remain completely within the upper surface of the platform structure 2, avoiding damage caused by the alignment marks 3 extending beyond the upper surface of the platform structure 2.

[0061] In an optional implementation, the thickness of the alignment mark 3 is 0.1~0.5μm. This height setting can be achieved using various deposition processes commonly used in display panels, such as sputtering deposition and chemical deposition. Alternatively, it can be... Figure 5 As shown, the edges of the orthographic projection of the alignment mark 3 onto the upper surface of the platform structure 2 are spaced apart from the edges of the upper surface of the platform structure 2. This prevents the alignment mark 3 from exceeding the upper surface of the platform structure 2 and causing damage due to floating, even if deviations occur in any direction caused by process errors. The shape of the alignment mark 3 can be as follows: Figure 5 The shape shown is a cross, but it can also be set to a dot or a rectangle, etc. There are no restrictions here, and they will not be listed one by one.

[0062] In an optional implementation, the alignment mark 3 can be made of metal to ensure its reflectivity and facilitate accurate identification. For example, the alignment mark 3 can be made of a multi-layered metal structure such as Ti / Al / Ti (Ti on the top and bottom layers and Al in the middle layer) or ITO / Ag / ITO (ITO on the top and bottom layers and Ag in the middle layer). These multi-layered materials are the materials required for the existing structure of the display panel. The preparation of the alignment mark 3 can be carried out during the preparation process of the same material structure layer, reducing process steps, saving costs and improving efficiency.

[0063] There are several ways to set the specific preparation process steps for alignment marker 3. Two examples are listed below:

[0064] The first method involves preparing alignment marker 3 simultaneously with the source / drain layer.

[0065] A source / drain layer is formed on a substrate 1 with a platform structure 2, and then the source / drain layer is patterned to form alignment marks 3. As mentioned earlier, display panels often have multiple source / drain layers and multiple planarization layers spaced apart. The platform structure 2 can be fabricated on the previous planarization layer, and the alignment marks 3 can be formed on the next source / drain layer. For example, a first source / drain layer, a first planarization layer, a second source / drain layer, and a second planarization layer can be formed sequentially on the substrate 1. The platform structure 2 is fabricated simultaneously with the fabrication of the first planarization layer, and the alignment marks 3 are fabricated simultaneously with the fabrication of the second source / drain layer. Since the source / drain layer is made of metal, it meets the requirement of high reflectivity for easy identification of the alignment marks 3. Therefore, fabricating the alignment marks 3 simultaneously with the fabrication of the source / drain layer can satisfy the material requirements of the alignment marks 3, reduce process steps, save costs, and ensure efficiency.

[0066] The second method involves preparing alignment markers 3 simultaneously with the preparation of the metal electrode layer.

[0067] A metal electrode layer is formed on a substrate 1 with a platform structure 2, and then the metal electrode layer is patterned to form alignment marks 3. Taking OLED as an example, the alignment marks 3 can be formed at the same time as the anode is prepared. Since the anode often adopts an ITO / Ag / ITO multilayer metal structure, the alignment marks 3 can be prepared using it to meet the requirements of high reflectivity and easy identification, while also reducing process steps, saving costs and ensuring efficiency.

[0068] Of course, the process steps for preparing alignment mark 3 are not limited to the two mentioned above. They can be prepared on any high reflectivity material layer (e.g., metal). For example, alignment mark 3 can be prepared at the same time when preparing the wiring layer of the fan-out area, bonding area or test area of ​​the peripheral area. There are no restrictions here, and they will not be listed one by one.

[0069] In step S104, as Figure 6 As shown, an alignment exposure process is performed based on alignment marker 3 to prepare the functional layer.

[0070] It should be noted that, since the platform structure 2 is provided in this embodiment to increase the height of the surface where the alignment mark 3 is located relative to the surrounding area, and the photoresist layer 601 is fluid during the exposure process, under the action of gravity and the height difference provided by the platform structure 2, the photoresist will flow downwards to the platform structure 2. This results in only a very thin layer of photoresist 601 remaining on the alignment mark 3, effectively improving the light transmittance of the surface of the alignment mark 3. This allows for accurate identification of the position and shape of the alignment mark 3 during exposure, improving alignment accuracy. For example, during exposure, when a photoresist layer of 1.0~2.0μm is coated, the photoresist layer 601 will flow down the platform structure 2, greatly reducing the thickness of the photoresist layer 601 on the alignment mark 3 and improving the light transmittance at that location.

[0071] In the fabrication process of display panels, certain functional layers require exposure using colored photoresist. For example, the pixel definition layer and black matrix layer use black photoresist, while the color filter layer uses colored photoresist. However, colored photoresist has low transmittance, especially black photoresist, which has even lower transmittance. Therefore, existing alignment techniques suffer from the black photoresist obscuring the alignment marks, resulting in blurred morphology of the alignment marks during exposure in the visible light range, making accurate alignment difficult and easily leading to misalignment of the pixel definition layer and black matrix layer. Therefore, when coating colored photoresist on the substrate 1 and performing an alignment exposure process to fabricate functional layers, using the platform structure 2 provided in this embodiment to raise the height of the alignment marks 3 can significantly reduce the obstruction of the alignment marks 3 by the colored photoresist during exposure, improving alignment accuracy.

[0072] For example, when using COE technology to fabricate the pixel definition layer and black matrix layer of an OLED, the fabrication method of the display panel provided in the embodiments of this application can significantly improve the alignment accuracy of the pixel definition layer and the black matrix layer.

[0073] Based on the same inventive concept, embodiments of the present invention also provide a display panel, such as... Figure 7 As shown, it includes:

[0074] Display area 701 and surrounding area 702;

[0075] A raised platform structure 2 is provided on the surrounding area 702. An alignment mark 3 is provided on the platform structure 2. The orthographic projection of the alignment mark 3 on the upper surface of the platform structure 2 is located within the upper surface, and the area of ​​the upper surface is larger than the area of ​​the orthographic projection.

[0076] It should be noted that the platform structure 2 and alignment mark 3 prepared by the display panel preparation method provided in this application embodiment can be cut off or retained after all functional layers are prepared. If retained, they are often set at the four corners or other areas of the peripheral area 702 to avoid obscuring the display area 701.

[0077] In an optional implementation, the height of the platform structure 2 can be 1.0~5.0μm. Such a height setting can significantly increase the height difference between the alignment mark surface and the surrounding surface, increase the flowability of the photoresist during preparation, and will not affect the implementation of other processes due to the excessive height of the platform structure 2.

[0078] In an optional implementation, the thickness of the alignment mark 3 is 0.1~0.5μm. This height setting can be achieved using various deposition processes commonly used in display panels, such as sputtering deposition and chemical deposition. Alternatively, it can be... Figure 5As shown, the edges of the orthographic projection of the alignment mark 3 onto the upper surface of the platform structure 2 are spaced apart from the edges of the upper surface of the platform structure 2. This prevents the alignment mark 3 from exceeding the upper surface of the platform structure 2 and causing damage due to floating, even if deviations occur in any direction caused by process errors. The shape of the alignment mark 3 can be as follows: Figure 5 The shape shown is a cross, but it can also be set to a dot or a rectangle, etc. There are no restrictions here, and they will not be listed one by one.

[0079] In an optional implementation, the platform structure 2 can be made of an organic curable material. Organic curable materials are stable and their fabrication process is often a coating process. Compared to sputtering or chemical deposition processes, coating processes can more efficiently produce a thicker material layer that meets the height requirements of the platform structure 2. For example, the platform structure 2 can be made of photosensitive polyimide photoresist (PSPI) or acrylic. Both of these materials are required for existing display panel structures. The fabrication of the platform structure 2 can be performed concurrently with the fabrication process of the structural layer made of the same material, reducing process steps, saving costs, and improving efficiency.

[0080] In optional embodiments, a source / drain layer and a planarization layer are sequentially disposed on the substrate 1, with the platform structure co-located with the planarization layer; or, a transistor layer and a pixel definition layer are sequentially disposed on the substrate 1, with the platform structure co-located with the pixel definition layer. Of course, the platform structure 2 is not limited to the above two arrangements. It can be disposed on any stable material layer of sufficient thickness. Considering efficiency, it can be fabricated on any organic curable material layer. For example, the platform structure 2 can be fabricated simultaneously when fabricating the filling layer of the fan-out region, bonding region, or test region of the peripheral area, or simultaneously when fabricating the planarization layer (OC layer) above the pixel layer. No restrictions are imposed here, and these will not be listed individually.

[0081] In an optional embodiment, a source / drain layer is provided on the substrate 1, and the alignment mark is on the same layer as the source / drain layer; or, a metal electrode layer is provided on the substrate, and the alignment mark is on the same layer as the metal electrode layer. Of course, the alignment mark 3 is not limited to the above two arrangements. The alignment mark 3 can be set on any high reflectivity material layer (e.g., metal). For example, the alignment mark 3 can be prepared together when preparing the wiring layer of the fan-out region, bonding region, or test region of the peripheral region. There are no restrictions here, and they will not be listed one by one.

[0082] For example, such as Figure 8As shown, a source / drain layer 801, a planarization layer 802, and a pixel definition layer 803 are sequentially disposed on the substrate 1. An anode 804 and a pixel layer 805 are disposed from bottom to top in the recessed area of ​​the pixel definition layer 803. A black matrix layer 806 is also disposed above the pixel definition layer 803. Specifically, a platform structure 2 is fabricated in the same layer as the planarization layer 802, and an alignment mark 3 is fabricated in the same layer as the anode 804.

[0083] For example, such as Figure 9 As shown, a first source / drain layer 8011, a first planarization layer 8021, a second source / drain layer 8012, a second planarization layer 8022, and a pixel definition layer 803 are sequentially disposed on the substrate 1. Among them, a platform structure 2 is fabricated in the same layer as the first planarization layer 8021, and an alignment mark 3 is fabricated in the same layer as the second source / drain layer 8012.

[0084] Of course, the way platform structure 2 and alignment mark 3 are set is not limited to the two mentioned above, and no restrictions are imposed here.

[0085] Since the display panel described in this application embodiment is prepared using the display panel preparation method described in this application embodiment, and the specific implementation has been explained in the process of describing the display panel preparation method, those skilled in the art can understand the specific structure and variations of the display panel based on the display panel preparation method described in this invention embodiment, and therefore will not be repeated here. All display panels prepared using the display panel preparation method of this invention embodiment fall within the scope of protection of this invention.

[0086] The technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:

[0087] The display panel and its fabrication method provided in this invention involve first forming a raised platform structure, and then fabricating alignment marks on the platform structure, with the alignment marks completely located within the upper surface of the platform structure. During the alignment exposure process, under the influence of gravity and the height difference between the platform structure and its surroundings, most of the photoresist coated on the substrate flows down the platform structure, reducing the thickness of the photoresist obscuring the alignment marks and increasing the photoresist transmittance on the alignment mark surface. This avoids the photoresist (especially colored photoresist) obscuring the alignment marks, enabling more accurate identification of the alignment mark position during the exposure process, improving the alignment accuracy during the fabrication of each functional layer, thereby improving yield and product reliability.

[0088] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0089] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this method of disclosure should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim itself is a separate embodiment of the invention.

[0090] Those skilled in the art will understand that modules in the apparatus of the embodiments can be adaptively changed and placed in one or more apparatuses different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0091] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0092] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The invention can be implemented by means of hardware comprising several different components and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A display panel, characterized by, The display panel comprises: a display area and a peripheral area surrounding the display area; the display panel comprises a substrate, a raised platform structure is arranged on the peripheral area to form a raised platform structure on the substrate, alignment marks are arranged on the platform structure, a projection of the alignment marks on the upper surface of the platform structure is located within the upper surface, and an area of the upper surface is greater than an area of the projection; a colored photoresist is coated on the substrate, wherein, under the action of gravity of the colored photoresist and a height difference between the platform structure and the periphery, the colored photoresist flows down the platform structure, and a thickness of the colored photoresist blocked by the alignment marks is thinned; the alignment marks are used for an alignment exposure process to prepare a functional layer.

2. The display panel of claim 1, wherein: a height of the platform structure is 1.0-5.0 μm, and a thickness of the alignment marks is 0.1-0.5 μm.

3. The display panel of claim 1, wherein, a material of the platform structure is an organic curable material.

4. The display panel of claim 3, wherein, a material of the platform structure is photosensitive polyimide or acrylic.

5. The display panel of claim 3, wherein: a source-drain layer and a planarization layer are sequentially arranged on the substrate, and the platform structure is in the same layer as the planarization layer; alternatively, a transistor layer and a pixel definition layer are sequentially arranged on the substrate, and the platform structure is in the same layer as the pixel definition layer.

6. The display panel of claim 1, wherein: a source-drain layer is arranged on the substrate, and the alignment marks are in the same layer as the source-drain layer; alternatively, a metal electrode layer is arranged on the substrate, and the alignment marks are in the same layer as the metal electrode layer.

7. The display panel of claim 1, wherein, edges of the projection and edges of the upper surface are both spaced.

8. The display panel of claim 1, wherein, the platform structure is prepared in a material layer with a thickness satisfying a thickness condition.

9. A method for manufacturing a display panel, characterized by, The display panel comprises: a substrate is provided; a raised platform structure is formed on the substrate; alignment marks are prepared on the platform structure, a projection of the alignment marks on an upper surface of the platform structure is located within the upper surface, and an area of the upper surface is greater than an area of the projection; based on the alignment marks, an alignment exposure process is performed to prepare a functional layer; wherein, based on the alignment marks, the alignment exposure process is performed to prepare the functional layer, comprising: a colored photoresist is coated on the substrate, wherein, under the action of gravity of the colored photoresist and a height difference between the platform structure and the periphery, the colored photoresist flows down the platform structure, and a thickness of the colored photoresist blocked by the alignment marks is thinned; based on the alignment marks, the alignment exposure process is performed to prepare the functional layer.

10. The method of producing a display panel according to claim 9, wherein based on the alignment marks, the alignment exposure process is performed to prepare the functional layer, comprising: based on the alignment marks, the alignment exposure process is performed to prepare a pixel definition layer and / or a black matrix layer.

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