Use of a highly thermally stable hydrofluoroether

Abstract

The application discloses application of high-thermal-stability hydrofluoroether, and the high-thermal-stability hydrofluoroether has a structural formula of HCF2CF2CF2CF2CH2OCF2CF2H, and is used as a coolant for a cooler of a temperature control device in a semiconductor product processing process, and has the advantages that the high-thermal-stability hydrofluoroether with the specific molecular structure is used as the coolant for the cooler of the temperature control device in the semiconductor product processing process, the substance is compatible with most materials in a wide temperature range, has good thermal stability, chemical inertia and non-corrosiveness, is non-toxic in the use process, has good environmental and safety characteristics, has an ODP value of 0 and a very low GWP value, and the substance has excellent dielectric properties, low viscosity and high resistivity, and is especially suitable for a heat transfer fluid in a semiconductor wafer etching process.

Description

Technical Field

[0001] This invention relates to the field of heat transfer fluid technology, and in particular to the application of a hydrofluoroether with high thermal stability. Background Technology

[0002] Heat transfer fluids are used in the semiconductor and battery industries for their thermal management systems. However, in some applications, selecting the appropriate fluid is crucial. Currently used heat transfer fluids for semiconductors include perfluorocarbons, perfluoropolyethers, perfluoroamines, hydrofluoroether olefins, and hydrofluoroolefins. However, perfluorocarbons, perfluoropolyethers, and perfluoroamines have atmospheric lifetimes exceeding 500 years, and these materials possess very high global warming potential (GWP). GWP refers to the integral value of the warming potential of 1 kg of a sample compound relative to the warming caused by 1 kg of CO2 over a given period, so these heat transfer fluids do not meet current "dual carbon" targets. Furthermore, some materials can produce products with inconsistent molecular weights during preparation, which may therefore alter their properties. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a high thermal stability hydrofluoroether with reliable cooling performance and relatively high cost performance as a heat transfer fluid in the semiconductor field. It not only has the characteristics of low pour point, low viscosity, high dielectric strength and low conductivity, but also has acceptable low toxicity, sufficient thermal stability and effective heat transfer. Most importantly, it has acceptable environmental characteristics, including a short atmospheric lifetime and a low probability of global warming.

[0004] The technical solution adopted by the present invention to solve the above-mentioned technical problems is: the application of a high thermal stability hydrofluoroether, wherein the high thermal stability hydrofluoroether has the structural formula: HCF2CF2CF2CF2CH2OCF2CF2H, and is used as a coolant in the cooler of the temperature control equipment in the semiconductor product processing process.

[0005] Preferably, the semiconductor product processing refers to semiconductor wafer etching, semiconductor component processing, and semiconductor chip processing, and the temperature control equipment is a high and low temperature simulation test equipment that uses PID control algorithm and adaptive temperature control technology.

[0006] The aforementioned high thermal stability hydrofluoroether can also be used as a cooling medium in the temperature control equipment during semiconductor product processing, wherein the cooling medium contains more than 90% by mass of high thermal stability hydrofluoroether.

[0007] Compared with the prior art, the advantages of the present invention are that hydrofluoroether with high thermal stability and specific molecular structure is used as a coolant in the cooler of temperature control equipment in semiconductor product processing. Due to the compatibility of this substance with most materials over a wide temperature range and its good thermal stability, chemical inertness and non-corrosiveness, it is non-toxic during use and has good environmental and safety characteristics. Its ODP value is 0 and its GWP value is extremely low. In addition, this substance has excellent dielectric properties, low viscosity and high resistivity, and is especially suitable for heat transfer fluids in semiconductor wafer etching processes. Detailed Implementation

[0008] The present invention will be further described in detail below with reference to the embodiments.

[0009] Basic parameters of the material in Example 1:

[0010] Table 1 below shows a comparison of the basic physicochemical properties of the high thermal stability hydrofluoroether provided in the embodiments of this application and commercially available coolants.

[0011] Table 1: Basic Physicochemical Properties and Comparison of Hydrofluoroether Compounds and Commercially Available Liquid Coolants.

[0012]

[0013]

[0014] As can be seen from Table 1, the hydrofluoroether with a specific molecular structure of the present invention, which exhibits high thermal stability as a coolant, has a low dielectric constant, excellent insulation properties, and a volume resistivity of only 3.5 × 10⁻⁶. 11 It has a low surface tension and viscosity, with a specific heat capacity of up to 1.19 J / (g·℃) and a thermal conductivity of up to 0.23 W / mK, exhibiting excellent heat transfer performance. It is also environmentally friendly, with an ozone depletion potential (ODP) of zero and a global warming potential (GWP) as low as 102.

[0015] Example 2: Compatibility Experiment.

[0016] 1. Place the main non-metallic material samples of the cooler equipment, namely EPDM, FKM / VITON and PEEK (all of which need to be named in Chinese), into a sealed storage tank containing 100ml of HCF2CF2CF2CF2CH2OCF2CF2H solution, seal it, and then soak it in a 98℃ constant temperature oven for 7*24h.

[0017] 2. The sample mass after immersion and the mass in anhydrous ethanol are: the mass of the sample after immersion treatment and constant temperature at 100℃ for 300 min until constant weight is reached. (For FKM / VITON material, the constant weight time is 600 min).

[0018] 3. The calculation of the soaking volume change rate shall be carried out in accordance with the provisions of 7.3 in GB / T 1690-2010, and the mass change rate shall be calculated according to the percentage change in mass before and after soaking.

[0019] The changes in the materials before and after soaking are shown in Table 2.

[0020] Table 2.

[0021]

[0022] The data in Table 2 show that the hydrofluoroether with a specific molecular structure and high thermal stability provided by the present invention as a coolant has very good material compatibility with electronic devices, high chemical stability, and will not cause swelling or corrosion to the equipment.

[0023] Example 3: Comparative experiment in a semiconductor-specific temperature control device CHILLER.

[0024] 20L of sample coolant was poured into the temperature control device CHILLER, the pump flow rate was set to 17LPM, and the operating temperatures were set to -40℃, 20℃, and 60℃, respectively. The current and pump pressure of the two samples at the three temperatures were investigated.

[0025] Table 3.

[0026]

[0027] Table 3 shows that, under the same temperature and pump flow rate, when using HCF2CF2CF2CF2CH2OCF2CF2H and N(CF2CF2CF3)3 as coolants, the pump current and pump pressure are significantly reduced when using HCF2CF2CF2CF2CH2OCF2CF2H. In the AST chiller equipment, using HCF2CF2CF2CF2CH2OCF2CF2H as a coolant places a smaller load on the pump than using N(CF2CF2CF3)3. Therefore, HCF2CF2CF2CF2CH2OCF2CF2H is more suitable as a coolant for temperature control equipment in semiconductor product processing.

Claims

1. The application of a highly thermally stable hydrofluoroether, characterized in that... The aforementioned highly thermally stable hydrofluoroether has the structural formula: HCF₂CF₂CF₂CF₂CH₂OCF₂CF₂H, and its volume resistivity is 3.5 × 10⁻⁶. 11 It has a thermal conductivity of 0.23 W / mK, an ozone depletion potential of zero, and a global warming potential of 102. It is used as a coolant in the temperature control equipment during semiconductor product processing.

2. The application as described in claim 1, characterized in that... The semiconductor product processing mentioned refers to semiconductor wafer etching, semiconductor component processing, and semiconductor chip processing.

3. The application as described in claim 1, characterized in that... The temperature control device is a high and low temperature simulation testing device.

4. The application as described in claim 1, characterized in that... The temperature control device uses a PID control algorithm and adaptive temperature control technology.

5. The application of a highly thermally stable hydrofluoroether, characterized in that... The high thermal stability hydrofluoroether has the structural formula: HCF2CF2CF2CF2CH2OCF2CF2H, with a volume resistivity of 3.5×10¹¹Ω•cm, a thermal conductivity of 0.23W / mK, an ozone depletion potential of zero, and a global warming potential of 10². It is used as a main component of the cooling medium in the cooler of temperature control equipment during semiconductor product processing.

6. The application as described in claim 5, characterized in that... The cooling medium contains more than 90% by mass of hydrofluoroether with high thermal stability.

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