Repair system and display panel repair method

Abstract

The application relates to a repairing system and a display panel repairing method, wherein the display panel repairing method comprises the following steps: peeling off a target light-emitting chip from a bearing substrate through a chip peeling mechanism, and the peeled-off target light-emitting chip falls to a balance area under the action of its own gravity; providing symmetrical laser which is shot to the target light-emitting chip in the balance area through a balance laser system, and the graphene layer on the target light-emitting chip generates an action force for balancing the gravity under the action of the symmetrical laser; and reducing the power of the symmetrical laser through the balance laser system to reduce the action force, so that the target light-emitting chip falls to a vacancy position of a driving backboard; and the light-emitting chip does not need to be in contact with the repairing device in the transfer process, and the risk of damage of the light-emitting chip during the repairing is reduced.

Description

Technical Field

[0001] This invention relates to the field of light-emitting diode technology, and in particular to a repair system and a method for repairing display panels. Background Technology

[0002] Micro LED (Micro Light Emitting Diode Display) technology refers to a display technology that uses self-emissive, micrometer-sized LEDs as light-emitting pixel units, assembling them onto a driving panel to form a high-density LED array. In the field of Micro LED displays, the number of Micro LED chips transferred to the driving backplane is typically in the tens of thousands or higher range. Due to the fact that the transfer yield is not 100%, dead pixels will exist on the display panel.

[0003] Therefore, finding a repair solution for dead pixels on display panels is an urgent problem to be solved. Summary of the Invention

[0004] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a repair system and a display panel repair method, which aims to reduce the risk of damage to the light-emitting chip during the repair process by eliminating the need for the light-emitting chip to come into contact with the repair device during the transfer process.

[0005] A repair system, comprising:

[0006] A chip assembly, comprising a carrier substrate and a plurality of light-emitting chips disposed on the carrier substrate; each of the light-emitting chips has a graphene layer on its side surface;

[0007] A balance-maintaining mechanism, comprising a balance zone and a balance laser system disposed around the balance zone; and

[0008] Chip stripping mechanism;

[0009] The chip stripping mechanism and the carrier substrate are located above the balance area, and the light-emitting chip on the carrier substrate faces the balance area;

[0010] The chip stripping mechanism is configured to strip the target light-emitting chip from the carrier substrate, so that the target light-emitting chip falls into the equilibrium area under its own gravity.

[0011] The balancing laser system is configured to provide a symmetrical laser beam directed toward the balancing region, so that when the target light-emitting chip peeled off from the carrier substrate falls into the balancing region, the graphene layer disposed on the side of the target light-emitting chip generates a force to balance its own gravity under the irradiation of the symmetrical laser beam.

[0012] The balancing laser system is also configured to reduce the power of the symmetrical laser to decrease the force, causing the target light-emitting chip to fall into the empty position of the drive backplate located below the balancing zone.

[0013] The aforementioned repair system uses a chip peeling mechanism to peel the target light-emitting chip from the carrier substrate. When the peeled target light-emitting chip falls into the balance zone, under the irradiation of the symmetrical laser provided to the balance zone by the balance laser system, the graphene layer on the target light-emitting chip generates a force to balance its own gravity, thus suspending it in a suspended state. After reducing the power of the symmetrical laser, the target light-emitting chip falls into the empty position of the drive backplate. This ensures that the light-emitting chip does not need to contact the repair device during the transfer process, thereby reducing the risk of damage to the light-emitting chip during repair.

[0014] Based on the same inventive concept, this application also provides a method for repairing a display panel, comprising:

[0015] A chip assembly is provided, wherein the chip assembly includes a carrier substrate and a plurality of light-emitting chips disposed on the carrier substrate; each of the light-emitting chips has a graphene layer on its side surface;

[0016] A balancing mechanism and a chip stripping mechanism are provided, wherein the balancing mechanism includes a balancing area and a balancing laser system disposed around the balancing area;

[0017] A display panel with a faulty chip removed is provided; wherein the display panel includes a drive backplate with a blank space left after the faulty chip is removed;

[0018] The balance holding mechanism and the carrier substrate are placed above the balance area, with the light-emitting chip on the carrier substrate facing the balance area; and the driving backplate is placed below the balance area, with the empty position on the driving backplate facing the balance area.

[0019] The target light-emitting chip is peeled off from the carrier substrate by the chip peeling mechanism, and the peeled target light-emitting chip falls into the equilibrium area under its own gravity.

[0020] The balanced laser system provides a symmetrical laser beam directed toward the target light-emitting chip in the balanced region, and the graphene layer on the target light-emitting chip generates a force to balance its own gravity under the action of the symmetrical laser beam.

[0021] The power of the symmetrical laser is reduced by the balanced laser system to decrease the force, causing the target light-emitting chip to fall into the empty position of the driving backplate.

[0022] The above-described display panel repair method allows the light-emitting chip to avoid contact with the repair device during the transfer process, reducing the risk of damage to the light-emitting chip during repair. Attached Figure Description

[0023] Figure 1 This is a cross-sectional schematic diagram of the chip assembly in an embodiment of the present invention;

[0024] Figure 2 This is a cross-sectional schematic diagram of the repair system in an embodiment of the present invention;

[0025] Figure 3 This is a force diagram of the light-emitting chip in the equilibrium region in an embodiment of the present invention;

[0026] Figure 4 This is a flowchart illustrating a display panel repair process according to an embodiment of the present invention;

[0027] Figure 5 This is a flowchart illustrating another display panel repair process in an embodiment of the present invention;

[0028] Explanation of reference numerals in the attached figures:

[0029] 1-Chip assembly; 10-Carrier substrate; 101-Light-emitting chip; 102-Graphene layer; 20-Balance holding mechanism; 201-Balance area; 202-Balance laser system; 21-Chip stripping mechanism; 3-Drive backplane. Detailed Implementation

[0030] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0032] Micro LED (Micro Light Emitting Diode Display) technology refers to a display technology that uses self-emissive, micrometer-sized LEDs as light-emitting pixel units, assembling them onto a driving panel to form a high-density LED array. In the field of Micro LED displays, the number of Micro LED chips transferred to the driving backplane is typically in the tens of thousands or higher range. Because the transfer yield is not 100%, dead pixels will exist on the display panel. Therefore, providing a repair solution for dead pixels on the display panel is a problem that urgently needs to be solved.

[0033] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0034] Embodiments of the present invention

[0035] Please see Figures 1 to 2 The present invention provides a repair system, comprising at least:

[0036] Chip assembly 1 includes a carrier substrate 10 and a plurality of light-emitting chips 101 disposed on the carrier substrate 10; each light-emitting chip 101 has a graphene layer 102 on its side.

[0037] The balance holding mechanism 20 includes a balance region 201 and a balance laser system 202 disposed around the balance region 201; and

[0038] Chip stripping mechanism 21;

[0039] The chip stripping mechanism 21 and the carrier substrate 10 are located above the balance region 201, and the light-emitting chip 101 on the carrier substrate 10 faces the balance region 201.

[0040] The chip stripping mechanism 21 is configured to strip the target light-emitting chip from the carrier substrate 10 so that the target light-emitting chip falls into the balance area 201 under its own gravity.

[0041] The balancing laser system 202 is configured to provide a symmetrical laser beam directed toward the balancing region 201, so that when the target light-emitting chip peeled off from the carrier substrate 10 falls into the balancing region 201, the graphene layer 102 disposed on the side of the target light-emitting chip generates a force to balance its own gravity under the irradiation of the symmetrical laser.

[0042] The balancing laser system 202 is also configured to reduce the power of the symmetrical laser to reduce the force, causing the target light-emitting chip to fall into the empty position of the drive backplate 3 located below the balancing area 201.

[0043] In this embodiment, to obtain chip component 1, a layer of graphene material can be deposited on the side of the light-emitting chip 101 using semiconductor process technology. The specific fabrication process is as follows:

[0044] Step 1: Place the substrate carrying multiple light-emitting chips into a spin coater to coat the side of the substrate carrying the light-emitting chips with photoresist. This photoresist can be positive or negative. For positive photoresist, after exposure to ultraviolet light, the exposed portion is dissolved, while the unexposed portion remains. For negative photoresist, the exposed portion is retained, while the unexposed portion is dissolved. This application example will be described below using negative photoresist.

[0045] Step 2 involves exposing and developing the photoresist-coated substrate. This step utilizes a photomask with a specific pattern (corresponding to the positional distribution of the graphene layer to be formed on the light-emitting chip) and a developing solution. Ultraviolet light passes through the photomask to selectively irradiate the photoresist; simultaneously, the exposed negative photoresist on the substrate remains, while the unexposed negative photoresist dissolves in the developing solution.

[0046] Step 3: Place the developed substrate into a plating pan and deposit a layer of graphene material on the side of the substrate on which the light-emitting chip is mounted.

[0047] Step 4: Place the substrate coated with graphene material into a gold stripping machine and use a chemical solution to dissolve the negative photoresist. At this time, the graphene layer placed on the negative photoresist will separate from the substrate as the negative photoresist dissolves; the graphene layer placed directly on the side of the light-emitting chip is unaffected and remains on the side of the light-emitting chip; ultimately, graphene layers are placed on the opposite sides of each light-emitting chip on the substrate.

[0048] In this embodiment, the balancing laser system 202 in the balancing holding mechanism 20 can have various structural forms. For example, the balancing laser system 202 can be a ring laser system or a quadrilateral laser system. When the balancing laser system 202 is a ring laser system, this ring laser system may include a ring-shaped light-emitting laser formed by an optical system, or it may include multiple strip-shaped light-emitting lasers arranged in a ring. Here, the ring can be circular or elliptical. With the help of this ring laser system, a ring laser can be provided to the balancing area. When a light-emitting chip separates from the carrier substrate and falls into the balancing area, the ring laser can irradiate all sides of the light-emitting chip to achieve a suspended state for the light-emitting chip. When the balancing laser system 202 is a quadrilateral laser system, this quadrilateral laser system may include a quadrilateral light-emitting laser formed by an optical system, or it may include multiple strip-shaped light-emitting lasers arranged around the perimeter. This quadrilateral laser system can provide either two sets of symmetrical lasers (i.e., two sets of symmetrical lasers) or one set of symmetrical lasers to the balancing region. The quadrilateral lasers can illuminate the four sides (left, right, front, and back) of the light-emitting chip, thus suspending the chip. Alternatively, one set of symmetrical lasers can illuminate two opposite sides (left, right, front, or back) of the light-emitting chip, also suspending it. Simultaneously, the balancing laser system 202 can also be equipped with a control device connected to the laser. This control device is used to control the laser's on / off state and adjust the power of the emitted laser. When the balancing laser system 201 includes multiple lasers, each laser can be configured with a corresponding control device, or the multiple lasers can share a single control device.

[0049] The principle behind the levitation of the light-emitting chip is further explained below. Since the light-emitting chip 101 has a graphene layer 102 on its side, when the chip falls from above into the equilibrium region 201, the graphene layer 102 on the chip is irradiated by a laser, causing a photoelectric effect that generates activated electrons. These activated electrons are ejected against the direction of the incident laser light, and according to the law of conservation of kinetic energy, they generate kinetic energy in the opposite direction. In other words, the chip 101 experiences a force opposite to the direction of the electron's motion. Figure 3As shown, when the left laser irradiates the graphene layer 102 on the left side of the light-emitting chip, the direction of the force is as shown in ①. When the right laser irradiates the graphene layer 102 on the right side of the light-emitting chip, the direction of the force is as shown in ②. The horizontal components of these two forces cancel each other out. If the vertical components of the two forces, when superimposed, can cancel out the gravity G of the light-emitting chip 101, then the light-emitting chip 101 is in a suspended state. If the vertical components of the two forces, when superimposed, are less than the gravity G of the light-emitting chip 101, then the light-emitting chip 101 falls downwards. The magnitude of the force exerted on the light-emitting chip 101 by the photoelectric effect of the graphene layer 102 can be controlled by adjusting the power of the symmetrical laser.

[0050] In this embodiment, the chip stripping mechanism 21 includes, but is not limited to, a stripping laser. The chip stripping mechanism 21 can control the laser provided by the stripping laser to irradiate a designated position on the carrier substrate 10, so as to separate the target light-emitting chip to be transferred from the carrier substrate 10. For example, a single laser beam can be used to scan and achieve the purpose of stripping multiple target light-emitting chips, or multiple laser beams can be used to irradiate simultaneously to achieve the purpose of stripping multiple target light-emitting chips. As for the specific process of the balance holding mechanism 20 in the repair system controlling the target light-emitting chip to fall onto the drive backplate 3 after the stripped target light-emitting chip falls into the balance area 201, it has been described above and will not be repeated here.

[0051] In this embodiment, the repair system may further include a chip removal mechanism; this chip removal mechanism is configured to remove faulty chips from the driving backplate 3 to create a vacancy on the driving backplate 3. In practical applications, due to limitations in related technologies during the manufacturing of the display panel, the final display panel may contain dead pixels, i.e., faulty chips exist on the driving backplate. Faulty chips include, but are not limited to, the following situations: the chip is damaged, the soldering position of the chip on the driving backplate is offset, the soldering position on the driving backplate corresponding to the chip has a cold solder joint, and the chip is skewed after soldering. Specifically, faulty chips on the driving backplate can be detected using an optical inspection device (e.g., an AOI inspection device). To address this, the aforementioned chip removal mechanism may include a cutting tool and a suction nozzle mechanism; the cutting tool is configured to mechanically peel off the faulty light-emitting chip from the driving backplate; the suction nozzle mechanism is configured to suck up the faulty light-emitting chip.

[0052] The aforementioned repair system uses a chip peeling mechanism to peel the target light-emitting chip from the carrier substrate. When the peeled target light-emitting chip falls into the balance zone, under the irradiation of the symmetrical laser provided to the balance zone by the balance laser system, the graphene layer on the target light-emitting chip generates a force to balance its own gravity, thus suspending it in a suspended state. After reducing the power of the symmetrical laser, the target light-emitting chip falls into the empty position of the drive backplate. This ensures that the light-emitting chip does not need to contact the repair device during the transfer process, thereby reducing the risk of damage to the light-emitting chip during repair.

[0053] Please see Figure 4 The present invention also provides a method for repairing a display panel, comprising:

[0054] S101: Provides a chip assembly, a balance holding mechanism, a chip stripping mechanism, and a display panel with the faulty chip removed; wherein the display panel includes a drive backplate with a blank space left after the faulty chip is removed.

[0055] The chip assembly can be any of the chip assemblies described above, and includes a carrier substrate and multiple light-emitting chips disposed on the carrier substrate; each light-emitting chip has a graphene layer on its side. The balancing mechanism can be any of the balancing mechanisms described above, and includes a balancing area and a balancing laser system disposed around the balancing area. The chip stripping mechanism has also been described above and will not be repeated here.

[0056] In this embodiment, before providing a display panel with the faulty chip removed, the method further includes:

[0057] Provide a chip removal mechanism;

[0058] This chip removal mechanism removes faulty chips from the drive backplane to create the vacancy position on the drive backplane.

[0059] In practical applications, due to limitations in related technologies during the manufacturing of display panels, the final display panel may contain dead pixels, i.e., faulty chips on the driver backplane. Faulty chips include, but are not limited to, the following situations: the chip is damaged, the soldering position of the chip on the driver backplane is misaligned, there is a cold solder joint at the corresponding position on the driver backplane, or the chip is misaligned after soldering. Specifically, faulty chips on the driver backplane can be detected using optical inspection devices (such as AOI inspection devices). The chip removal mechanism can include a cutting tool and a suction nozzle mechanism, which can use tools such as cutting tools to peel off the faulty light-emitting chip from the driver backplane and then use the suction nozzle mechanism to remove it. In some embodiments, laser technology can also be used to remove faulty chips from the driver backplane.

[0060] S102: The balance holding mechanism and the carrier substrate are placed above the balance area, and the light-emitting chip on the carrier substrate faces the balance area; and the driving backplate is placed below the balance area, and the empty position on the driving backplate faces the balance area.

[0061] S103: The target light-emitting chip is peeled off from the carrier substrate by the chip peeling mechanism, and the peeled target light-emitting chip falls to the equilibrium area under its own gravity.

[0062] S104: A symmetrical laser is provided by a balanced laser system to the target light-emitting chip in the balanced region. The graphene layer on the target light-emitting chip generates a force to balance its own gravity under the action of the symmetrical laser.

[0063] S105: It also reduces the power of the symmetrical laser by balancing the laser system to reduce the force, causing the target light-emitting chip to fall into the empty position of the driving backplate.

[0064] In this embodiment, please refer to Figure 5 In step S105, the power of the symmetrical laser is reduced by balancing the laser system to decrease the force, causing the target light-emitting chip to fall into the empty position of the driving backplate. The following steps are also included:

[0065] S106: Heat the driving backplane to bond the target light-emitting chip to the driving backplane.

[0066] S107: Provide a cleaning solution, immerse the display panel in the cleaning solution, and use the cleaning solution to remove the graphene layer on the target light-emitting chip.

[0067] This cleaning solution can dissolve graphene, including but not limited to N-methylpyrrolidone (NMP) solvent and N,N-dimethylformamide (DMF) solvent.

[0068] In this embodiment, the methods by which the balanced laser system reduces the power of the symmetric laser to decrease the force in S105 include, but are not limited to, the following:

[0069] The balanced laser system is controlled to stop supplying symmetrical laser light so that the force is reduced to zero instantaneously.

[0070] Alternatively, reduce the power of the symmetrical laser so that the force is instantaneously reduced to a value greater than zero.

[0071] Alternatively, the power of the symmetrical laser can be gradually reduced so that the force gradually decreases to a value greater than zero.

[0072] In this embodiment, it is also possible to transfer light-emitting chips with two or more emission colors, including but not limited to red, green, and blue. The following application example illustrates the transfer of light-emitting chips with two emission colors:

[0073] The carrier substrate includes a first carrier substrate on which a first light-emitting chip is carried and a second carrier substrate on which a second light-emitting chip is carried; wherein the first light-emitting chip and the second light-emitting chip emit different colors;

[0074] The carrier substrate is placed above the equilibrium zone, with the light-emitting chip on the carrier substrate facing the equilibrium zone; the target light-emitting chip is peeled off from the carrier substrate by a chip peeling mechanism, and the peeled target light-emitting chip falls into the equilibrium zone under the influence of gravity, including:

[0075] First, place the first carrier substrate above the balance area, with the first light-emitting chip on the first carrier substrate facing the balance area; peel the first light-emitting chip off the first carrier substrate using a chip peeling mechanism; after the peeled first light-emitting chip falls to the balance area under its own gravity, the chip peeling mechanism stops working and removes the first carrier substrate.

[0076] The second carrier substrate is then placed above the balance area, with the second light-emitting chip on the second carrier substrate facing the balance area; the second light-emitting chip is peeled off from the second carrier substrate by the chip peeling mechanism; the peeled second light-emitting chip falls into the balance area under its own gravity.

[0077] The above-described display panel repair method allows the light-emitting chip to avoid contact with the repair device during the transfer process, reducing the risk of damage to the light-emitting chip during repair.

[0078] To better understand this application, a specific repair system and display panel repair method will be introduced below, taking chip repair as an example:

[0079] The repair system includes a chip stripping mechanism, a balance holding mechanism, a chip assembly and a display panel, and also includes a first clamping device for fixing the chip assembly and a second clamping device for fixing the display panel.

[0080] The balance-maintaining mechanism includes a ring laser system and a balance zone, with the ring laser system supplying a ring laser to the balance zone.

[0081] The chip stripping mechanism includes a stripping laser, which is fixed above the balance zone.

[0082] The chip assembly is a carrier substrate that supports multiple light-emitting chips, each of which has a graphene layer around its perimeter. After being fixed by the first clamping device, the chip assembly is positioned above the equilibrium region and below the lift-off laser. In this example, the carrier substrate includes a first carrier substrate supporting a red light-emitting chip, a second carrier substrate supporting a green light-emitting chip, and a third carrier substrate supporting a red light-emitting chip.

[0083] In this example, before installing the display panel into the repair system, the display panel needs to be pre-processed as follows: first, defective pixels on the display panel are screened out using a detection device, and then the light-emitting chips at the defective pixels on the display panel are removed from the driver backplate using a laser device. At this time, a gap is left on the driver backplate to receive the light-emitting chips to be transferred. After the display panel is fixed to the second clamping device, the display panel is located below the balance zone, and the gap on the driver backplate faces the balance zone.

[0084] The process of transferring the three light-emitting chips of different colors during the repair is as follows:

[0085] The system provides a stripping laser, a balancing mechanism, a first carrier substrate, a second carrier substrate, a third carrier substrate, and a display panel with the faulty chip removed. The balancing mechanism is fixed in the repair system to form a balancing area, the stripping laser is fixed above the balancing area, the display panel is fixed below the balancing area, and the first carrier substrate is disposed between the stripping laser and the balancing area.

[0086] A ring laser system is used to provide a symmetrical laser beam directed toward the equilibrium zone; the stripping laser is turned on, causing the red light-emitting chip to be transferred on the first carrier substrate to be detached from the first carrier substrate; the detached red light-emitting chip falls to the equilibrium zone under its own gravity, at which point the graphene layer on the side of the red light-emitting chip generates a force that balances its own gravity after being irradiated by the laser, so that the red light-emitting chip is in a suspended state; then the stripping laser is turned off and the first carrier substrate is removed.

[0087] The second carrier substrate is placed between the stripping laser and the equilibrium zone. The stripping laser is turned on, causing the green light-emitting chip to be transferred on the second carrier substrate to be detached from the second carrier substrate. The detached green light-emitting chip falls to the equilibrium zone under its own gravity. At this time, the graphene layer on the side of the green light-emitting chip is irradiated by the laser and generates a force that balances its own gravity, so that the green light-emitting chip is in a suspended state. Then the stripping laser is turned off and the second carrier substrate is removed.

[0088] The third carrier substrate is placed between the stripping laser and the equilibrium zone. The stripping laser is turned on, causing the blue light-emitting chip to be transferred on the third carrier substrate to be detached from the third carrier substrate. The detached red light-emitting chip falls to the equilibrium zone under its own gravity. At this time, the graphene layer on the side of the blue light-emitting chip is irradiated by the laser and generates a force that balances its own gravity, so that the blue light-emitting chip is in a suspended state. Then the stripping laser is turned off, and the third carrier substrate and the stripping laser are removed.

[0089] By gradually reducing the power of the symmetrical laser using a ring laser system, the force generated by the photoelectric effect of the graphene layer on the red, blue, and green light-emitting chips gradually decreases, causing the red, blue, and green light-emitting chips to fall into the corresponding empty positions on the drive backplate.

[0090] The driving backplate is then heated so that the transferred red, blue, and green light-emitting chips are bonded to the driving backplate.

[0091] A cleaning solution is also provided, which is used to immerse the display panel in the cleaning solution to remove the graphene layer on the red, blue, and green LED chips. This ultimately achieves chip repair, which is fast, and the LEDs do not need to come into contact with the repair device during the transfer from the substrate to the drive backplane, reducing the risk of damage to the LEDs during repair.

[0092] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A repair system, characterized in that, include: A chip assembly, comprising a carrier substrate and a plurality of light-emitting chips disposed on the carrier substrate; each of the light-emitting chips has a graphene layer on its side surface; A balance-maintaining mechanism, comprising a balance zone and a balance laser system disposed around the balance zone; and Chip stripping mechanism; The chip stripping mechanism and the carrier substrate are located above the balance area, and the light-emitting chip on the carrier substrate faces the balance area; The chip stripping mechanism is configured to strip the target light-emitting chip from the carrier substrate, so that the target light-emitting chip falls into the equilibrium area under its own gravity. The balancing laser system is configured to provide a symmetrical laser beam directed toward the balancing region, so that when the target light-emitting chip peeled off from the carrier substrate falls into the balancing region, the graphene layer disposed on the side of the target light-emitting chip generates a force to balance its own gravity under the irradiation of the symmetrical laser beam. The balancing laser system is also configured to reduce the power of the symmetrical laser to decrease the force, causing the target light-emitting chip to fall into the empty position of the drive backplate located below the balancing zone.

2. The repair system as described in claim 1, characterized in that, The balanced laser system is a ring laser system; the ring laser system includes a ring-shaped emitting laser or multiple strip-shaped emitting lasers arranged in a ring.

3. The repair system as described in claim 1, characterized in that, The balanced laser system is a quadrilateral laser system; the quadrilateral laser system includes a quadrilateral light-emitting laser or multiple strip light-emitting lasers arranged around the perimeter.

4. The repair system according to any one of claims 1-3, characterized in that, Also includes: A chip removal mechanism is configured to remove a faulty chip from the drive backplane to create the vacancy position on the drive backplane.

5. A method for repairing a display panel, characterized in that, include: A chip assembly is provided, wherein the chip assembly includes a carrier substrate and a plurality of light-emitting chips disposed on the carrier substrate; each of the light-emitting chips has a graphene layer on its side surface; A balancing mechanism and a chip stripping mechanism are provided, wherein the balancing mechanism includes a balancing area and a balancing laser system disposed around the balancing area; A display panel with a faulty chip removed is provided; wherein the display panel includes a drive backplate with a blank space left after the faulty chip is removed; The balance holding mechanism and the carrier substrate are placed above the balance area, with the light-emitting chip on the carrier substrate facing the balance area; and the driving backplate is placed below the balance area, with the empty position on the driving backplate facing the balance area. The target light-emitting chip is peeled off from the carrier substrate by the chip peeling mechanism, and the peeled target light-emitting chip falls into the equilibrium area under its own gravity. The balanced laser system provides a symmetrical laser beam directed toward the target light-emitting chip in the balanced region, and the graphene layer on the target light-emitting chip generates a force to balance its own gravity under the action of the symmetrical laser beam. The power of the symmetrical laser is reduced by the balanced laser system to decrease the force, causing the target light-emitting chip to fall into the empty position of the driving backplate.

6. The display panel repair method as described in claim 5, characterized in that, Prior to providing a display panel with the faulty chip removed, the method further includes: Provide a chip removal mechanism; The faulty chip on the drive backplane is removed by the chip removal mechanism to create the vacancy position on the drive backplane.

7. The display panel repair method as described in claim 5, characterized in that, The method further includes reducing the power of the symmetrical laser through the balanced laser system to decrease the force, causing the target light-emitting chip to fall into the empty position of the driving backplate, and then further including: The driving backplate is heated so that the target light-emitting chip is bonded to the driving backplate.

8. The display panel repair method as described in claim 7, characterized in that, The step of heating the driving backplane to bond the target light-emitting chip to the driving backplane further includes: Provide a cleaning solution, The display panel is immersed in the cleaning solution to remove the graphene layer on the target light-emitting chip.

9. The display panel repair method according to any one of claims 5-8, characterized in that, The balanced laser system reduces the power of the symmetrical laser to decrease the force by means of: The balanced laser system is controlled to stop providing the symmetrical laser; or, The power of the symmetrical laser is gradually reduced.

10. The display panel repair method according to any one of claims 5-8, characterized in that, The carrier substrate includes a first carrier substrate carrying a first light-emitting chip and a second carrier substrate carrying a second light-emitting chip; wherein the first light-emitting chip and the second light-emitting chip emit different colors; The step of placing the carrier substrate above the balance area, with the light-emitting chip on the carrier substrate facing the balance area; and peeling the target light-emitting chip off the carrier substrate using the chip peeling mechanism, with the peeled target light-emitting chip falling into the balance area under the influence of gravity, includes: First, the first carrier substrate is placed above the balance area, with the first light-emitting chip on the first carrier substrate facing the balance area; the first light-emitting chip is peeled off from the first carrier substrate by the chip peeling mechanism; after the peeled first light-emitting chip falls to the balance area under its own gravity, the chip peeling mechanism stops working and removes the first carrier substrate. The second carrier substrate is then placed above the balance area, with the second light-emitting chip on the second carrier substrate facing the balance area; the second light-emitting chip is peeled off from the second carrier substrate by the chip peeling mechanism; the peeled second light-emitting chip falls into the balance area under its own gravity.

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