Circuit device and manufacturing method thereof, and circuit system

Abstract

The present invention provides a circuit device, a manufacturing method thereof and a circuit system. The circuit device includes a flexible circuit board, a flexible packaging material layer and an electronic component. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner area and a peripheral area surrounding the inner area, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is arranged in the at least one hollow pattern. The electronic component is arranged on the first surface of the flexible circuit board and is electrically connected to the flexible circuit board.

Description

Technical Field

[0001] The present invention relates to a circuit device and a manufacturing method thereof and a circuit system, and in particular to a flexible circuit device and a manufacturing method thereof and a circuit system. Background Art

[0002] In recent years, the technology of smart fabrics and wearable devices has been widely developed in industry, people's livelihood, leisure and medical fields. For general smart fabrics and wearable devices, electronic components are usually set on the circuit board in the form of hard molding and rigid packaging. Therefore, when the user performs continuous movement, continuous bending and stretching and other complex actions, it may cause the circuit board to bend and break, the solder joints of the electronic components to fail, and the electronic signal to be distorted. Summary of the invention

[0003] The present invention is directed to a circuit device, wherein a flexible circuit board has at least one hollow pattern, and a flexible packaging material layer is disposed in the at least one hollow pattern.

[0004] The present invention is directed to a method for manufacturing a circuit device, which is used to manufacture the above-mentioned circuit device.

[0005] The present invention is directed to a circuit system, which includes the above-mentioned circuit device.

[0006] According to an embodiment of the present invention, a circuit device includes a flexible circuit board, a flexible packaging material layer, and an electronic component. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner area and a peripheral area surrounding the inner area, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is arranged in the at least one hollow pattern. The electronic component is arranged on the first surface of the flexible circuit board and is electrically connected to the flexible circuit board.

[0007] According to an embodiment of the present invention, a method for manufacturing a circuit device comprises the following steps: providing a flexible circuit board; forming an electronic component on the flexible circuit board; forming at least one hollow pattern in the flexible circuit board; and filling the hollow pattern with a flexible packaging material.

[0008] According to an embodiment of the present invention, a circuit system includes a fabric substrate, a circuit device and a conductor. The circuit device is disposed on the fabric substrate. The conductor is disposed on the fabric substrate and is electrically connected to the electronic component. The circuit device includes a flexible circuit board, a flexible packaging material layer and an electronic component. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner area and a peripheral area surrounding the inner area, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic component is disposed on the first surface of the flexible circuit board and is electrically connected to the flexible circuit board.

[0009] In order to make the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figures 1A to 1C A schematic top view of the manufacturing process of the circuit device according to the first embodiment of the present invention;

[0011] FIG. 2A to FIG. 2C For along Figures 1A to 1C A schematic cross-sectional diagram of the manufacturing process of the circuit device along the AA section line;

[0012] Figure 3 is a top view schematically showing a circuit device according to a second embodiment of the present invention;

[0013] Figure 4 is a top view schematically showing a circuit device according to a third embodiment of the present invention;

[0014] Figure 5 is a top view schematically showing a circuit device according to a fourth embodiment of the present invention;

[0015] Fig. 6A is a top view schematically showing a circuit device according to a fifth embodiment of the present invention;

[0016] Figure 6B is a top view schematically showing a circuit device according to a sixth embodiment of the present invention;

[0017] Figure 7 is a top view schematic diagram of a circuit system of the present invention;

[0018] Fig. 8A , Figure 8B and Figure 8C They are cross-sectional schematic diagrams of a circuit device being bonded to a textile substrate. DETAILED DESCRIPTION

[0019] The following examples are listed and described in detail with reference to the accompanying drawings, but the examples provided are not intended to limit the scope of the present invention. In addition, the drawings are for illustration purposes only and are not drawn to their original size. For ease of understanding, the same components will be described with the same symbols in the following description.

[0020] The terms "include", "including", "have", etc. used in this document are open terms, which means "including but not limited to".

[0021] When the terms "first", "second", etc. are used to describe components, they are only used to distinguish these components from each other, and do not limit the order or importance of these components. Therefore, in some cases, the first component may also be referred to as the second component, and the second component may also be referred to as the first component, and this does not deviate from the scope of the present invention.

[0022] In addition, in this article, the range expressed by "a value to another value" is a summary expression method to avoid listing all the values ​​in the range one by one in the specification. Therefore, the description of a specific numerical range covers any value in the numerical range, and covers a smaller numerical range defined by any value in the numerical range.

[0023] Figures 1A to 1C It is a top view schematically showing the manufacturing process of the circuit device according to the first embodiment of the present invention. FIG. 2A to FIG. 2C For along Figures 1A to 1C A schematic cross-sectional diagram of the manufacturing process of the circuit device along the AA section line in FIG.

[0024] Also refer to Figure 1A and Figure 2A , a flexible circuit board 100 is provided. In the present embodiment, the flexible circuit board 100 may have a generally known structure. For example, the flexible circuit board 100 may include an insulating layer, a plurality of circuit layers disposed in the insulating layer, a connection pad disposed on the surface of the insulating layer, and a conductive hole connecting these circuit layers and the connection pad, but the present invention is not limited thereto. In addition, in the present embodiment, the flexible circuit board 100 has, for example, a Young's modulus between 100MPa and 10GPa. Figure 1A and Figure 2AIn order to make the drawings clear and convenient for explanation, only the connection pads are shown, and the detailed structure of the flexible circuit board 100 is not shown in detail. The flexible circuit board 100 has a first surface 100a and a second surface 100b opposite to each other. In the present embodiment, the first surface 100a is a surface for setting various electronic components. Therefore, the first surface 100a can be called the front of the flexible circuit board 100, and the second surface 100b can be called the back of the flexible circuit board 100. In addition, the flexible circuit board 100 includes an inner area 100i and a peripheral area 100p surrounding the inner area 100i. In the present embodiment, the inner area 100i is an area for setting the main electronic components. The connection pad 101 is arranged at the first surface 100a of the flexible circuit board 100 and is located in the inner area 100i, as a connection area where an external device is electrically connected to the flexible circuit board 100. In other embodiments, depending on the actual layout requirements, the connection pad 101 can be located in the peripheral area 100p.

[0025] Then, a rigid material layer 102 may be disposed on the second surface 100b of the flexible circuit board 100. In the present embodiment, the rigid material layer 102 may be located at a position corresponding to a specific electronic component to be disposed on the first surface 100a, so as to provide the specific electronic component with properties such as tensile resistance and bending resistance, so as to prevent the specific electronic component from being damaged when the flexible circuit board 100 is subjected to tensile and bending. In other embodiments, the rigid material layer 102 may be located at a position corresponding to all electronic components to be disposed on the first surface 100a, or the rigid material layer 102 may be omitted. In addition, in the present embodiment, the rigid material layer 102 has, for example, a Young's modulus greater than 3GPa. Next, an electronic component 104 is disposed on the first surface 100a of the flexible circuit board 100. The electronic component 104 is located in the inner area 100i. At this time, the rigid material layer 102 may be located below the specific electronic component 104, preferably directly below the specific electronic component 104. The electronic component 104 may be a sensing component, a signal processing component, a signal transmission component, a power supply, etc., and the present invention is not limited thereto. A plurality of electronic components 104 may be disposed on the first surface 100a, and these electronic components 104 are connected in series or in parallel to each other and electrically connected to the flexible circuit board 100.

[0026] Also refer to Figure 1B and Figure 2B, a hollow pattern 106 is formed in the peripheral area 100p of the flexible circuit board 100. The method for forming the hollow pattern 106 is, for example, mechanical drilling, laser drilling, mechanical cutting or laser cutting of the flexible circuit board 100. The hollow pattern 106 runs through the flexible circuit board 100, that is, the hollow pattern 106 extends from the first surface 100a to the second surface 100b. In the present embodiment, the hollow pattern 106 is formed in the peripheral area 100p and is located at the side outside the corner of the flexible circuit board 100. The hollow pattern 106 can have a desired shape, size and number according to actual needs, and the present invention is not limited to this.

[0027] In this embodiment, when viewed from the top of the flexible printed circuit board 100, Figure 1B As shown, at one side of the flexible circuit board 100, the total length of the hollow pattern 106 extending along the edge of the flexible circuit board 100 is, for example, between 1% and 90% of the length of the side. For example, at the right side of the flexible circuit board 100, the total length (length L1+length L2) of the hollow pattern 106 extending along the edge of the flexible circuit board 100 may be between 1% and 90% of the length L of the right side. In addition, the total area of ​​these hollow patterns 106 is, for example, between 1% and 50% of the area of ​​the flexible circuit board 100. The above-mentioned total length range and total area range will be further explained later.

[0028] Also refer to Figure 1C and Figure 2C , a flexible packaging material layer 108 is formed on the first surface 100a of the flexible circuit board 100. The method of forming the flexible packaging material layer 108 is, for example, a molding packaging process. In the present embodiment, the flexible packaging material layer 108 covers the first surface 100a and the sidewall of the flexible circuit board 100, and fills the hollow pattern 106. In one embodiment, the flexible packaging material layer 108 can be conformally formed on the first surface 100a of the flexible circuit board 100. In addition, in the present embodiment, the flexible packaging material layer 108 has, for example, a Young's modulus between 1 MPa and 300 MPa.

[0029] exist Figure 1CIn order to make the drawings clear and convenient for explanation, the flexible packaging material layer 108 is only shown in the hollow pattern 106, but those skilled in the art can understand that the flexible packaging material layer 108 covers the first surface 100a. In addition, the flexible packaging material layer 108 exposes the connection pad 101, so that an external device (not shown) can be electrically connected to the flexible circuit board 100 via the connection pad 101. In this way, a plurality of flexible packaging material layers 108 are formed in the peripheral area 100p of the flexible circuit board 100. Afterwards, a packaging layer 110 can be formed on the second surface 100b of the flexible circuit board 100 to complete the manufacture of the circuit device 10 of this embodiment. In addition, in this embodiment, the packaging layer 110 has a Young's modulus between 1MPa and 300MPa, for example. Therefore, in the circuit device 10 , the Young's modulus of the rigid material layer 102 is greater than that of the flexible circuit board 100 , and the Young's modulus of the flexible circuit board 100 is greater than that of the flexible packaging material layer 108 and the packaging layer 110 .

[0030] In this embodiment, the encapsulation layer 110 is formed after the flexible encapsulation material layer 108 is formed, but the present invention is not limited thereto. In other embodiments, the flexible encapsulation material layer 108 may be formed after the encapsulation layer 110 is formed. Alternatively, in other embodiments, the encapsulation layer 110 may be omitted.

[0031] In addition, in this embodiment, the material of the flexible encapsulation material layer 108 is different from the material of the encapsulation layer 110, and therefore there is an interface between the flexible encapsulation material layer 108 and the encapsulation layer 110, but the present invention is not limited thereto. In other embodiments, the material of the flexible encapsulation material layer 108 may be the same as the material of the encapsulation layer 110, and therefore there is no interface between the flexible encapsulation material layer 108 and the encapsulation layer 110.

[0032] In addition, in this embodiment, the flexible packaging material layer 108 covers all of the electronic components 104 , but the present invention is not limited thereto. In other embodiments, the flexible packaging material layer 108 may expose a portion of the electronic components 104 .

[0033] In this embodiment, the flexible packaging material layer 108 is disposed in the peripheral area 100p of the flexible circuit board 100. Based on the characteristics of the flexible packaging material layer 108 itself, the stretch resistance of the flexible circuit board 100 can be effectively improved, thereby preventing the circuit device 10 from being damaged during continuous stretching. Figure 1CAs shown, in the circuit device 10, hollow patterns 106 are formed at four sides of the flexible circuit board 100 and the hollow patterns 106 are filled with a flexible packaging material layer 108, so when the circuit device 10 is subjected to a tensile force in the X direction or the Y direction, the flexible circuit board 100 can have greater tensile resistance. In other embodiments, depending on the actual application of the circuit device 10, the hollow patterns 106 can be formed only at one, two or three sides of the flexible circuit board 100.

[0034] In this embodiment, at one side of the flexible circuit board 100, the total length of the hollow pattern 106 extending along the edge of the flexible circuit board 100 is, for example, between 1% and 90% of the length of the side. When the total length is less than 1% of the length of the side, the tensile resistance of the flexible circuit board 100 may not be effectively improved. When the total length is greater than 90% of the length of the side, the mechanical strength of the flexible circuit board 100 may be reduced. In one embodiment, at one side of the flexible circuit board 100, the total length of the hollow pattern 106 extending along the edge of the flexible circuit board 100 may be between 2.6% and 25.1% of the length of the side.

[0035] In addition, the total area of ​​the hollow patterns 106 is, for example, between 1% and 50% of the area of ​​the flexible circuit board 100. When the total area is less than 1% of the area of ​​the flexible circuit board 100, the tensile resistance of the flexible circuit board 100 may not be effectively improved. When the total area is greater than 50% of the area of ​​the flexible circuit board 100, the mechanical strength of the flexible circuit board 100 may be reduced, and the layout area of ​​the electronic component 104 may be too small. In one embodiment, the total area of ​​the hollow patterns 106 may be 25.1% of the area of ​​the flexible circuit board 100.

[0036] In this embodiment, the hollow pattern 106 is formed only in the peripheral area 100p of the flexible circuit board 100 and is located at the side other than the corner of the flexible circuit board 100, but the present invention is not limited thereto. Depending on the actual application of the circuit device 10, the hollow pattern 106 can be formed in other areas of the flexible circuit board 100, which will be described below.

[0037] Figure 3 FIG. 2 is a top view of a circuit device according to a second embodiment of the present invention. In this embodiment, components identical to those in the first embodiment are denoted by the same reference symbols and will not be described separately. Figure 3The difference between this embodiment and the first embodiment is that: in the circuit device 20, the hollow pattern 106 is formed only in the peripheral area 100p of the flexible circuit board 100 and is located at the four corners of the flexible circuit board 100. In addition, the shape and size of the hollow pattern 106 can be adjusted arbitrarily, and the present invention is not limited to this. Depending on the actual application of the circuit device 20, in other embodiments, the hollow pattern 106 can be formed only at one, two or three corners of the flexible circuit board 100.

[0038] In this embodiment, at one side of the flexible circuit board 100, the total length of the hollow pattern 106 extending along the edge of the flexible circuit board 100 is, for example, between 1% and 90% of the length of the side. In addition, the total area of ​​the hollow patterns 106 is, for example, between 1% and 50% of the area of ​​the flexible circuit board 100.

[0039] Figure 4 FIG. 4 is a top view of a circuit device according to a third embodiment of the present invention.

[0040] In this embodiment, the same components as those in the first embodiment are denoted by the same reference symbols and will not be described further. Figure 4 The difference between this embodiment and the first embodiment is that: in the circuit device 30, the hollow pattern 106 is located at a side other than the corner of the flexible circuit board 100, and extends from the edge of the flexible circuit board 100 to the inner area 100i. In addition, the position, number, shape and size of the hollow pattern 106 can be adjusted arbitrarily, and the present invention is not limited thereto. Depending on the actual application of the circuit device 30, in other embodiments, the hollow pattern 106 can be formed at two, three or four sides other than the corner of the flexible circuit board 100.

[0041] Figure 5 FIG. 4 is a top view of a circuit device according to a fourth embodiment of the present invention. In this embodiment, components identical to those in the first embodiment are denoted by the same reference symbols and will not be described separately. Figure 5 The difference between this embodiment and the first embodiment is that in the circuit device 40, the hollow pattern 106 is not formed in the peripheral area 100p, but is independently formed in the inner area 100i. In addition, the position, number, shape and size of the hollow pattern 106 can be adjusted arbitrarily, and the present invention is not limited thereto.

[0042] In addition, according to actual needs, in other embodiments, multiple or all of the first embodiment, the second embodiment, the third embodiment and the fourth embodiment may be arbitrarily combined to improve the stretch resistance of the flexible circuit board.

[0043] Fig. 6AFIG. 5 is a top view of a circuit device according to a fifth embodiment of the present invention. In this embodiment, components identical to those in the first embodiment are denoted by the same reference symbols and will not be described separately. Fig. 6A The difference between this embodiment and the first embodiment is that in the circuit device 50, the fan-shaped hollow patterns 106a are formed at the four corners of the flexible circuit board 100, and the strip-shaped hollow patterns 106b extend from the edge of the flexible circuit board 100 to the inner area 100i. In addition, the electronic component 104 is located in the component area R in the inner area 100i.

[0044] In this embodiment, since the fan-shaped hollow patterns 106a are formed at the four corners of the flexible circuit board 100, when the circuit device 50 is twisted around the torsion axis AX, the flexible circuit board 100 can have a higher bending resistance. In addition, the strip-shaped hollow patterns 106b extend from the edge of the flexible circuit board 100 to the inner area 100i in a direction perpendicular to the torsion axis AX, so during the above twisting process, the flexible circuit board 100 can have a higher tensile resistance. In this way, the flexible circuit board 100 can be effectively prevented from being damaged when the circuit device 50 is twisted.

[0045] In one embodiment, when the circuit device 50 is designed to be twisted 30° clockwise or counterclockwise with the twist axis AX as the central axis, the total area of ​​the hollow pattern 106a and the hollow pattern 106b at one side of the flexible circuit board 100 is between 7.85% and 31.4% of the area of ​​the flexible circuit board 100. In addition, for a flexible circuit board 100 with a size of 80 mm×50 mm, the radius r of each fan-shaped hollow pattern 106a can be 5 mm, and the length of each strip-shaped hollow pattern 106b extending along the edge of the flexible circuit board 100 (i.e., the width W of the hollow pattern 106b) can be 2 mm. For the component area R, the length L4 of the long side of the component area R can be between 4 / 7 and 5 / 7 of the length L3 of the long side of the flexible circuit board 100. For the area used for connecting with an external device, the length L5 between adjacent strip-shaped hollow patterns 106 b may be between 1 / 7 and 3 / 14 of the length L3 of the long side of the flexible circuit board 100 .

[0046] Figure 6B FIG. 6 is a top view of a circuit device according to a sixth embodiment of the present invention. Figure 6B The difference between this embodiment and the fifth embodiment is that in the circuit device 60 , the four corners of the flexible circuit board 100 do not have the fan-shaped hollow patterns 106 a .

[0047] The circuit device of the present invention can be disposed on a fabric and can be connected to an external device via a wire to form a circuit system of the present invention, and can be applied to smart fabrics or wearable devices. The circuit system of an embodiment of the present invention will be described below using the circuit device 10 as an example, and the circuit devices of other embodiments can be disposed on a fabric like the circuit device 10.

[0048] Figure 7 FIG. 1 is a top view schematic diagram of the circuit system of the present invention. Figure 7 , the circuit system 70 includes a fabric substrate 700, a plurality of circuit devices 10, and a wire 702. The fabric substrate 700 can be various fabrics, and the present invention is not limited thereto. The plurality of circuit devices 10 are disposed on the fabric substrate 700. The wire 702 is disposed on the fabric substrate 700 and can be connected to the connection pad 101 of the circuit device 10 to electrically connect the plurality of circuit devices 10 to each other. In addition, according to actual needs, the circuit system 70 can be connected to a desired external device 704 via the wire 702.

[0049] The circuit device 10 can be disposed on the fabric substrate 700 in various ways. Fig. 8A As shown, the adhesive layer 800 is disposed on the second surface 100b of the flexible circuit board 100 (see Figure 2C ) and the fabric substrate 700 and between the wire 702 and the fabric substrate 700. In this way, the circuit device 10 and the wire 702 can be firmly combined with the fabric substrate 700.

[0050] Or, if Figure 8B As shown, the first fixing unit 802 is disposed on the second surface 100b of the flexible circuit board 100 (see Figure 2C ), the second fixing unit 804 is disposed on the fabric substrate 700, and the first fixing unit 802 and the second fixing unit 804 are attached together, so that the circuit device 10 can be firmly combined with the fabric substrate 700. The first fixing unit 802 and the second fixing unit 804 can be attached together by fasteners, magnetic adsorption, electrostatic adsorption or adhesive, and the present invention is not limited to this. In this way, the circuit device 10 can be firmly combined with the fabric substrate 700.

[0051] Or, if Figure 8C As shown, the fixing seat 806 is disposed on the fabric substrate 700, and the circuit device 10 is accommodated in the fixing seat 806. In this way, the circuit device 10 can be firmly combined with the fabric substrate 700.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit device, characterized in that: include: A flexible circuit board having at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other; A flexible packaging material layer is disposed in the at least one hollow pattern; as well as an electronic component disposed on the first surface of the flexible circuit board and electrically connected to the flexible circuit board, The Young's modulus of the flexible circuit board is greater than the Young's modulus of the flexible packaging material layer, and the position of the hollow pattern does not overlap with the position of the electronic component.

2. The circuit arrangement according to claim 1, characterized in that The at least one hollow pattern is located in the peripheral area.

3. The circuit arrangement according to claim 2, characterized in that The at least one hollow pattern is located at a corner of the flexible circuit board.

4. The circuit arrangement according to claim 2, characterized in that The at least one hollow pattern is located at a side edge of the flexible circuit board other than a corner.

5. The circuit arrangement according to claim 2, characterized in that The at least one hollow pattern extends from an edge of the flexible circuit board to the inner area.

6. The circuit arrangement according to claim 2, characterized in that When viewed from above the flexible circuit board, at one side of the flexible circuit board, a total length of the at least one hollow pattern extending along the edge of the flexible circuit board is between 1% and 90% of the length of the side.

7. The circuit arrangement according to claim 1, characterized in that When viewed from above the flexible circuit board, the total area of ​​the at least one hollow pattern is between 1% and 50% of the area of ​​the flexible circuit board.

8. The circuit arrangement according to claim 1, characterized in that The hollow patterns are independently located in the inner area.

9. The circuit arrangement according to claim 1, characterized in that It also includes a rigid material layer, which is disposed on the second surface of the flexible circuit board and is located below the electronic component.

10. The circuit arrangement according to claim 1, characterized in that The flexible packaging material layer covers the first surface of the flexible circuit board.

11. The circuit arrangement according to claim 1, characterized in that It also includes a packaging layer, which is arranged on the second surface of the flexible circuit board.

12. The circuit arrangement according to claim 11, characterized in that The material of the packaging layer is the same as that of the flexible packaging material layer.

13. A circuit system, characterized in that: include: Fabric substrate; A circuit device is disposed on the fabric substrate, wherein the circuit device comprises: A flexible circuit board having at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other; a flexible packaging material layer, disposed in the hollow pattern; and an electronic component disposed on the first surface of the flexible circuit board and electrically connected to the flexible circuit board; and A conductor is disposed on the fabric substrate and is electrically connected to the electronic component. The Young's modulus of the flexible circuit board is greater than the Young's modulus of the flexible packaging material layer, and the position of the hollow pattern does not overlap with the position of the electronic component.

14. The circuit system according to claim 13, characterized in that: It also includes an adhesive layer, which is arranged between the second surface of the flexible circuit board and the fabric substrate and between the wire and the fabric substrate.

15. The circuit system according to claim 13, characterized in that: It also includes a first fixing unit and a second fixing unit, wherein the first fixing unit is arranged on the second surface of the flexible circuit board, the second fixing unit is arranged on the fabric substrate, and the first fixing unit and the second fixing unit are attached together.

16. The circuit system according to claim 15, characterized in that The first fixing unit and the second fixing unit are attached together by fasteners, magnetic adsorption, electrostatic adsorption or adhesion.

17. The circuit system according to claim 13, characterized in that: It also includes a fixing seat, which is arranged on the fabric substrate, wherein the circuit device is accommodated in the fixing seat.

18. The circuit system according to claim 13, characterized in that: The flexible circuit board includes a connection pad exposed at the first surface, and the conductive wire is connected to the connection pad.

19. A method for manufacturing a circuit device, characterized in that: include: Provide flexible circuit boards; forming electronic components on the flexible circuit board; forming at least one hollow pattern in the flexible circuit board; as well as Filling the hollow pattern with a flexible packaging material, The Young's modulus of the flexible circuit board is greater than the Young's modulus of the flexible packaging material, and the position of the hollow pattern does not overlap with the position of the electronic component.

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