PCD sintered diamond roller with positive and negative rake angles and preparation device and method

Abstract

The present invention relates to a PCD sintered diamond roller with positive and negative rake angles, and a manufacturing device and method. The PCD sintered diamond roller comprises a substrate and a PCD block, wherein the substrate is a circular substrate, and the PCD block is a sintered layer sintered on the circumferential surface of the substrate; the sintered layer comprises PCD abrasive grains, diamond abrasive grains, and a binder; a plurality of the PCD abrasive grains and a plurality of the diamond abrasive grains are sintered and fixed to the circumferential surface of the substrate via the binder, and the plurality of PCD abrasive grains are evenly distributed on the circumferential surface of the substrate; the PCD abrasive grains are provided with a positive rake angle structure; and adjacent diamond abrasive grains have a negative rake angle. The PCD sintered diamond roller of the present invention can solve the problem of severe tool wear and low grinding efficiency due to difficulty in removing material, high grinding forces, and high grinding temperatures.

Description

Technical Field

[0001] The invention relates to the field of grinding wheel dressing, in particular to a PCD sintered diamond roller with positive and negative rake angles and a preparation device and method thereof. Background Art

[0002] Currently, the most widely used method for grinding wheel dressing is mechanical dressing, which is mainly divided into turning dressing, grinding dressing, and rolling dressing. Grinding dressing methods include ordinary grinding wheel dressing for softer materials and diamond roller grinding dressing. Diamond roller dressing uses expensive diamond rollers to precisely dress grinding wheels with complex contour accuracy requirements. The grinding wheel relies on the shape of the diamond roller to interpolate and complete the shaping of the formed contour.

[0003] During the dressing process of precision-dressed diamond grinding wheels, the material itself is difficult to remove, resulting in a typical "hard-on-hard" situation. Consequently, the grinding and dressing process generates high dressing forces and temperatures, which intensify roller wear. Excessive roller wear can lead to a decrease in dressing wheel precision, resulting in unqualified dressing results. Furthermore, since only the roller tip is ground during the process, tip wear is exacerbated and efficiency is low.

[0004] Therefore, the application of diamond roller grinding and dressing methods is currently greatly limited, and it is urgent to solve the problems of severe tool wear and low grinding efficiency due to difficulty in removing material, large grinding force, and high grinding temperature. Summary of the Invention

[0005] In order to solve the problems existing in the above-mentioned prior art, the present invention provides a PCD sintered diamond roller with positive and negative rake angles, as well as a preparation device and method. It proposes using an ultrafast laser to process a PCD block fixed on a sintered diamond roller into a structure with positive and negative rake angles, so that the cutting edge with positive and negative rake angles on the dressing grinding wheel is provided. When using it to grind the grinding wheel, it can solve the problems of severe tool wear and low grinding efficiency caused by difficulty in removing material, high grinding force and high grinding temperature.

[0006] To achieve the above purpose, the specific technical solutions of the present invention are as follows:

[0007] A PCD sintered diamond roller with positive and negative rake angles, the PCD sintered diamond roller comprising a substrate and a PCD block, the substrate being a circular substrate, and the PCD block being a sintered layer sintered on the circumferential surface of the substrate;

[0008] The sintered layer includes PCD abrasive grains, diamond abrasive grains and a binder; a plurality of the PCD abrasive grains and a plurality of the diamond abrasive grains are sintered and fixed on the circumferential surface of the substrate through the binder, and the plurality of the PCD abrasive grains are evenly distributed on the circumferential surface of the substrate; a positive rake angle structure is provided on the PCD abrasive grains; and a negative rake angle exists between adjacent diamond abrasive grains.

[0009] Furthermore, the positive rake angle structure is a positive rake angle structure with a preset taper, including a positive rake angle and a positive rake angle groove, and two positive rake angle grooves are arranged on both sides of the positive rake angle.

[0010] Furthermore, the substrate is a circular stainless steel substrate.

[0011] The present invention also discloses a device for preparing a PCD sintered diamond roller with positive and negative rake angles as described in any of the above items, the device comprising a drive device, a spindle, and an ultrafast laser and rotary cutting assembly; the PCD sintered diamond roller is sleeved on the spindle through a central mounting hole, and the drive device drives the PCD sintered diamond roller to rotate in the XY plane through the spindle; the focused laser beam emitted by the ultrafast laser and rotary cutting assembly is located directly above the PCD block of the PCD sintered diamond roller, and the positive and negative rake angle structure of the PCD block is processed by the focused laser beam.

[0012] Furthermore, the ultrafast laser and rotary cutting assembly includes an ultrafast laser light source, a reflective lens, an optical rotation module, a focusing lens and a precision slide; the ultrafast laser light source and the reflective lens are respectively arranged above the optical rotation module, and the pulsed laser emitted by the ultrafast laser light source is reflected into the optical rotation module by the reflective lens; the pulsed laser forms rotary cutting light in the optical rotation module; the focusing lens is arranged directly below the laser outlet of the optical rotation module, and the rotary cutting light is focused by the focusing lens to form the focused laser beam; the optical rotation module is fixed on the precision slide, and the height of the focal position of the focused laser beam is adjusted by the precision slide.

[0013] Furthermore, the ultrafast laser and rotary cutting assembly also includes a CCD module, which is arranged above the back side of the reflective lens and is used for real-time monitoring of the preparation process.

[0014] Furthermore, the driving device and the ultrafast laser and rotary cutting assembly are respectively connected to the processing center data.

[0015] The present invention also discloses a method for preparing any one of the above-mentioned PCD sintered diamond rollers with positive and negative rake angles, the preparation method comprising the following steps:

[0016] Step 1: Mount the PCD sintered diamond roller on the spindle and move the focal position of the focused laser beam emitted by the ultrafast laser and peeling assembly to the starting position of PCD abrasive processing;

[0017] Step 2: Set the parameters required for machining positive rake angle in the machining center;

[0018] The parameters include: PCD sintered diamond roller positive rake angle parameters: the angle of the positive rake angle , the width d and height h of the positive rake angle edge; the parameters of the ultrafast laser light source: the average laser power and laser repetition frequency, and determine the laser overlap rate; the parameters of the optical rotation module: rotation speed, prism angle, translation mirror position, according to the positive rake angle , select the rotary cutting light mode of the optical rotation module; the motion parameters of the PCD sintered diamond roller in the XY plane; the adjustment parameters of the Z-axis height of the precision slide during the scanning process;

[0019] Step 3: According to the parameters set in step 2, the machining center controls the drive device and the ultrafast laser and rotary cutting components to process the positive rake angle of the PCD sintered diamond roller;

[0020] Step 4: Reduce the laser power and process the negative rake angle edge of the PCD sintered diamond roller by sharpening.

[0021] Furthermore, in step 3, according to the parameters selected in step 2, the processing of the cutting edge at point O1 is first started, and the focused laser beam is scanned from the coordinate origin according to the set positive rake angle parameters and the set laser overlap rate. According to the scanning progress, the precision slide adjusts the Z-axis height in real time, and the processing is stopped after the processing depth h is reached. The XYZ coordinates of the focus position of the focused laser beam return to point O1; the driving device drives the PCD sintered diamond roller to rotate by an angle M / R through the main shaft, where M is the distance between two cutting edges with positive rake angles on the same PCD abrasive grain, and R is the radius of the PCD sintered diamond roller, and the focused laser beam reaches point O2;

[0022] Repeat the above-mentioned middle cutting edge processing process at the O2 point position. After the processing is completed, the XYZ coordinates of the focus position of the focused laser beam return to the O1 point position, completing the processing of a positive rake angle of a PCD abrasive grain (12);

[0023] Then the driving device drives the PCD sintered diamond roller to rotate by 360° / n through the main shaft, where n is the number of PCD abrasive grains evenly distributed on the circumference of the PCD sintered diamond roller. The focus position of the focused laser beam reaches the O3 point position, and the above-mentioned positive rake angle processing process is repeated. The positive rake angle processing steps are continuously performed in this way until the processing of 2n positive rake angle cutting edges of n PCD abrasive grains is completed.

[0024] Furthermore, in step 1, after the PCD sintered diamond roller is installed on the main shaft, the position of the main shaft in the XY plane is adjusted, and the height of the precision slide is adjusted at the same time so that the focused laser beam hits the upper edge of the PCD sintered diamond roller. The driving device drives the PCD sintered diamond roller to rotate through the main shaft, and moves the focal position of the focused laser beam to the starting position of PCD abrasive processing.

[0025] Beneficial effects of the present invention:

[0026] The PCD sintered diamond roller of the present invention contains PCD abrasive grains and diamond abrasive grains, and the PCD abrasive grains have a positive rake angle structure, and the diamond abrasive grains have a negative rake angle. When using it to grind the grinding wheel, the advantages of the positive rake angle cutting of the PCD abrasive grains and the negative rake angle grinding of the diamond abrasive grains can be fully utilized. At the same time, the positive rake angle grooves and the sharpening grooves are used to discharge the grinding chips, which is beneficial to improving the dressing force in the grinding and dressing process of the grinding wheel, reducing the grinding temperature, improving the efficiency and accuracy of the roller grinding wheel, and greatly reducing wear. It can solve the problem of severe tool wear caused by difficulty in removing material, large grinding force and high grinding temperature.

[0027] The positive and negative rake angles on the PCD sintered diamond roller of the present invention are processed by ultrafast laser and focused laser beam emitted by the rotary cutting component. The focused laser beam has concentrated energy and has high processing capacity. When the binder of the sintered layer is removed in a small amount by using a low-power focused laser beam, the diamond abrasive grains and PCD abrasive grains are not damaged, thus achieving the roller sharpening.

[0028] In addition, when processing the positive and negative rake angles on PCD sintered diamond rollers, intelligent automated processing can be achieved through the data connection between the machining center and the drive device and the ultrafast laser and rotary cutting components, which can greatly speed up the preparation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of the overall and local structures of the PCD sintered diamond roller with positive and negative rake angles in the present invention;

[0030] Figure 2 Schematic diagram of PCD sintered diamond roller processing in the present invention;

[0031] Figure 3 Schematic diagram of the ultrafast laser and rotary cutting components in the present invention;

[0032] Figure 4 These are the three optical rotation modes of the optical rotation module in the present invention;

[0033] Figure 5 Schematic diagram of forming positive rake angle abrasive grains by processing the PCD sintered diamond roller according to the present invention;

[0034] Figure 6Schematic diagram of the negative rake angle abrasive grains formed by sharpening the PCD sintered diamond roller according to the present invention.

[0035] Among them: 1- PCD sintered diamond roller, 11- substrate, 12- PCD abrasive, 13- diamond abrasive, 14- sintered layer, 2- spindle, 3- focused laser beam, 4- ultrafast laser and rotary cutting assembly, 41- ultrafast laser light source, 42- CCD module, 43- reflective lens, 44- optical rotation module, 45- focusing mirror, 46- air blowing device, 47- precision slide. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solution of the present application, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0037] The terms "up", "down", "left", "right", "front", and "back" in this application are based on the positional relationships shown in the accompanying drawings. The corresponding positional relationships may vary depending on the drawings, and should not be construed as limiting the scope of protection.

[0038] In the present invention, the terms "installed," "connected," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, integral connection, mechanical connection, electrical connection, or mutual communication. They may be directly connected or indirectly connected through an intermediate medium. They may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0039] This embodiment describes a PCD sintered diamond roller with positive and negative rake angles, as well as a manufacturing apparatus and method. Ultrafast lasers are used to machine positive and negative rake angles into a PCD block fixed to the PCD sintered diamond roller. When used to grind a grinding wheel, the roller can improve the efficiency and accuracy of grinding the grinding wheel, significantly reduce wear, and extend its service life.

[0040] like Figure 1 As shown, the PCD sintered diamond roller 1 includes a substrate 11 and a PCD block. The substrate 11 is a circular stainless steel substrate, and the PCD block is arranged on the circumferential surface of the substrate 11.

[0041] The PCD block in this embodiment is a sintered layer 14 sintered onto the circumferential surface of a substrate 11. This sintered layer 14 includes a binder, PCD abrasive grains 12, and diamond abrasive grains 13. Multiple PCD abrasive grains 12 are evenly distributed on the circumferential surface of the substrate 11, while multiple diamond abrasive grains 13 are distributed at a predetermined density on the circumferential surface of the substrate 11, excluding the PCD abrasive grains 12. The PCD abrasive grains 12 and diamond abrasive grains 13 are sintered and fixed to the circumferential surface of the substrate 11 via the binder, forming a sintered layer 14. When the PCD sintered diamond roller 1 is used to form a grinding wheel, the PCD abrasive grains 12 and diamond abrasive grains 13 work together to grind the grinding wheel, significantly improving the wear resistance of the PCD sintered diamond roller 1. The number of PCD abrasive grains 12 and diamond abrasive grains 13 can be set based on the roughness of the grinding wheel after grinding.

[0042] In this embodiment, the PCD abrasive grains 12 are provided with a positive rake angle structure with a certain taper, including a positive rake angle and a positive rake angle groove. The positive rake angle grooves on both sides of the positive rake angle are the cutting edges of the PCD sintered diamond roller 1, and preferably the positive rake angle taper is 75° to 85°. The binder is slightly removed between adjacent diamond abrasive grains 13 through sharpening processing, forming a cutting edge with a negative rake angle on the PCD sintered diamond roller 1, also known as a sharpening groove. When the PCD sintered diamond roller 1 is used to dress the grinding wheel, the positive rake angle groove and the sharpening groove are used to facilitate the discharge of grinding chips, improve the dressing force during the grinding and dressing process, reduce the grinding temperature, and improve the dressing efficiency and accuracy.

[0043] The equipment for processing the positive and negative rake angle structures of the PCD sintered diamond roller 1 includes a driving device, a main shaft 2 and an ultrafast laser and rotary cutting component 4.

[0044] The center of the PCD sintered diamond roller 1 is the mounting hole. Figure 2 As shown, the PCD sintered diamond roller 1 is mounted on the spindle 2 through a mounting hole. When the spindle 2 is driven by a drive device, it drives the PCD sintered diamond roller 1 to rotate within the XY plane. The PCD sintered diamond roller 1 and the spindle 2 can be connected in various ways, such as through a keyway connection or meshing connection. This ensures that the PCD sintered diamond roller 1 is fixed to the spindle 2, facilitates maintenance and replacement of the PCD sintered diamond roller 1 and the spindle 2, and is suitable for a wider range of PCD sintered diamond roller 1 specifications.

[0045] In this embodiment, the PCD block on the circumferential surface of the PCD sintered diamond roller 1 is processed with a focused laser beam 3 emitted by an ultrafast laser and a rotary cutting component 4 to perform positive and negative rake angle structure processing. Specifically, when processing the positive rake angle structure of the PCD abrasive grains 12, the spindle 2 is rotated by a corresponding angle before processing so that the focused laser beam 3 is aligned with the position to be processed. The spindle 2 does not rotate during the processing. When performing the sharpening process, the spindle 2 continues to rotate until the processing is completed.

[0046] Ultrafast laser and rotary cutting components 4 Figure 3 The system shown includes an ultrafast laser light source 41 , a CCD module 42 , a reflective lens 43 , an optical rotation module 44 , a focusing lens 45 , an air blowing device 46 and a precision slide 47 .

[0047] An ultrafast laser source 41, a CCD module 42, and a reflector lens 43 are each positioned above a rotation module 44. The ultrafast laser source 41 emits pulsed laser light, with its laser emission port oriented toward the front center of the reflector lens 43. The reflector lens 43 is tilted downward at a predetermined angle, reflecting the pulsed laser light from the ultrafast laser source 41 into the rotation module 44 below. Preferably, the pulsed laser light from the ultrafast laser source 41 is directed horizontally toward the front center of the reflector lens 43. The reflector lens 43 is tilted downward at a 45° angle, reflecting the pulsed laser light vertically into the rotation module 44 below. This arrangement facilitates adjustment of the pulsed laser emission direction and reduces the transmission distance of the pulsed laser light, thereby minimizing damage during transmission. The CCD module 42, located above and behind the reflector lens 43, provides real-time monitoring during processing to ensure a continuous and reliable process.

[0048] The optical rotation module 44 is fixed on a precision slide 47 in the Z direction (i.e., the slide's lifting direction is the Z direction) and is placed below the reflective lens 43. The top of the optical rotation module 44 has a laser receiving port, which is located just below the center of the front of the reflective lens 43. The reflected pulsed laser enters the optical rotation module 44 vertically through the laser receiving port. The pulsed laser rotates at high speed around a certain point in the optical rotation module 44, forming Figure 4 The three rotary cutting light modes shown are used to process various tapered and non-tapered contours. The three rotary cutting light modes include Figure 4 a shows a gradually decreasing trend from top to bottom, which is used to process the positive taper profile; Figure 4 b shows a rotary cutting light that maintains a certain diameter and is used to process right-angle contours; Figure 4 The rotary cutting light with a gradually increasing trend from top to bottom shown in c is used to process the inverted tapered profile. The precision slide 47 can move the focused laser beam 3 up and down along the Z direction to ensure that the processing is carried out at the focal position of the focused laser beam 3.

[0049] Focusing lens 45 is positioned directly below the laser outlet. High-speed rotary cutting light is transmitted through the laser outlet below optical rotation module 44. Focusing lens 45 focuses the laser beam 3, concentrating the energy of the rotary cutting light and enhancing processing capability. The focused laser beam 3 irradiates the processing surface of PCD sintered diamond roller 1, which is placed on the processing platform, processing the surface.

[0050] The blowing device 46 is arranged on the processing platform, coaxial with the focused laser beam 3, and is used to blow protective gases such as argon and nitrogen into the processing surface to avoid the serious graphitization problem of diamond materials during processing.

[0051] In addition, the driving device and the ultrafast laser and rotary cutting component 4 are respectively connected to the processing center data, and the automatic preparation of the positive and negative rake angles of the PCD sintered diamond roller 1 is realized under the control of the processing center.

[0052] The method for automatically preparing the positive and negative rake angles of the PCD sintered diamond roller 1 by using the ultrafast laser and the rotary cutting assembly 4 to emit the focused laser beam 3 is as follows:

[0053] Step 1: Adjust the positions of the PCD sintered diamond wheel 1 and the ultrafast laser and rotary cutting assembly 4, and move the focal position of the focused laser beam 3 to the starting position of the PCD abrasive 12 processing;

[0054] Specifically, the PCD sintered diamond roller 1 is mounted on the spindle 2, the position of the spindle 2 in the XY plane is adjusted, and the height of the precision slide 47 is adjusted at the same time, so that the focused laser beam 3 emitted by the ultrafast laser and peeling assembly 4 hits the upper edge of the PCD sintered diamond roller 1, and the spindle 2 is driven to rotate a certain angle so that the focus position of the focused laser beam 3 moves to the starting position of the PCD abrasive grain 12 processing, as shown in FIG. Figure 5 As shown, the starting position is marked as point O1, and the XYZ coordinates at this time are set as the coordinate origin;

[0055] Step 2: Set the parameters required for machining positive rake angle in the machining center;

[0056] like Figure 5 As shown, the parameters are as follows:

[0057] PCD sintered diamond roller 1 positive rake angle parameters: the angle of the positive rake angle , positive rake edge width d and edge height h;

[0058] Parameters of the ultrafast laser light source 41: average laser power and laser repetition frequency, and determination of laser overlap ratio;

[0059] Parameters of the optical rotation module 44: rotation speed, prism angle, translation mirror position shift; according to the set positive rake angle , select the optical rotation mode of the optical rotation module 44. Since the positive rake angle has a taper, this embodiment only selects the corresponding mode from the two modes a and c;

[0060] The movement time and interval of the PCD sintered diamond roller 1 in the XY plane driven by the spindle 2;

[0061] During the scanning process, the adjustment parameters of the Z-axis height of the precision slide 47 ensure that the focused laser beam 3 is processed at the focal position, thereby ensuring the processing efficiency.

[0062] Preferably, when the positive rake angle When the rake angle is 75°~85°, the positive edge width d is 0.1~0.3mm and the edge height h is 0.3~0.5mm, the laser average power is: 0-100W, the laser repetition frequency is: 400 kHz-20 MHz, the laser overlap rate is: 30-70%, the rotation speed is: 1600-10000 r / min, the prism angle is: -20-20°, and the translation mirror position shift is: 4.5-18.5mm.

[0063] Step 3: Processing the positive rake angle of the PCD sintered diamond roller 1;

[0064] After the parameters are selected, the processing of the cutting edge at point O1 is started. The focused laser beam 3 scans from the coordinate origin according to the set positive rake angle parameters and the set laser overlap rate. According to the scanning progress, the precision slide 47 adjusts the Z-axis height in real time. After reaching the processing depth h, the processing is stopped. The XYZ coordinates of the focal position of the focused laser beam 3 return to point O1, and the processing of the cutting edge is completed. The driving device drives the PCD sintered diamond roller 1 to rotate the angle M / R through the main shaft 2, where M is the distance between the two cutting edges with positive rake angles on the same PCD abrasive 12, and R is the radius of the PCD sintered diamond roller 1, so that the O2 point position reaches the coordinate origin, and thus the focus position of the focused laser beam 3 reaches point O2; the above-mentioned middle cutting edge processing process is repeated at point O2. After the processing is completed, the XYZ coordinates of the focal position of the focused laser beam 3 return to point O1, and the processing of the positive rake angle of one PCD abrasive 12 is completed.

[0065] The driving device drives the PCD sintered diamond roller 1 to rotate by an angle of 360° / n through the main shaft 2, where n is the number of PCD abrasive grains 12 evenly distributed on the circumferential surface of the PCD sintered diamond roller 1. The O3 point position reaches the coordinate origin, so that the focus position of the focused laser beam 3 reaches the O3 point position. The above-mentioned positive rake angle processing process is repeated, and the positive rake angle processing steps are continuously performed in this way until the processing of 2n positive rake angle cutting edges of n PCD abrasive grains 12 is completed.

[0066] Step 4: Processing the negative rake angle edge of the PCD sintered diamond roller 1 by sharpening method;

[0067] The XYZ coordinates of the focal position of the focused laser beam 3 are returned to the coordinate origin, and the laser power is reduced so that the laser power density is greater than the binder removal threshold but less than the removal threshold of the PCD abrasive grains and the diamond abrasive grains, so that the focused laser beam 3 can only remove the binder material of the sintered layer 14 on the PCD sintered diamond roller 1, without removing the PCD abrasive grains 12 and the diamond abrasive grains 13; the driving device drives the spindle 2 to rotate, so that the PCD sintered diamond roller 1 rotates in the XY plane, and a sharpening groove with a depth of H (preferably, the depth H in this embodiment is 0.02-0.04 mm) is processed under the condition of the set laser overlap rate, as shown in FIG. Figure 6 As shown, the abrasive grains of the PCD sintered diamond roller 1 are protruded, forming negative rake angle grinding during the grinding process, and the sharpening groove has a better chip removal space.

[0068] Although the principles of the present invention have been described in detail above in conjunction with the preferred embodiments of the present invention, those skilled in the art should understand that the above embodiments are merely illustrative of the present invention and are not intended to limit the scope of the present invention. The details in the embodiments do not constitute a limitation on the scope of the present invention. Without departing from the spirit and scope of the present invention, any obvious changes such as equivalent transformations and simple substitutions based on the technical solution of the present invention fall within the scope of protection of the present invention.

Claims

1. A PCD sintered diamond roller with positive and negative rake angles, characterized in that: The PCD sintered diamond roller (1) comprises a base body (11) and a PCD block, wherein the base body (11) is a circular base body, and the PCD block is a sintered layer (14) sintered on the circumferential surface of the base body (11); The sintered layer (14) includes PCD abrasive grains (12), diamond abrasive grains (13) and a binder; a plurality of the PCD abrasive grains (12) and a plurality of the diamond abrasive grains (13) are sintered and fixed on the circumferential surface of the substrate (11) through the binder, and a plurality of the PCD abrasive grains (12) are evenly distributed on the circumferential surface of the substrate (11), and a plurality of the diamond abrasive grains (13) are distributed at a predetermined density on the circumferential surface of the substrate (11) except the PCD abrasive grains (12); a positive rake angle structure is provided on the PCD abrasive grains (12), and the positive rake angle structure is a positive rake angle structure with a preset taper, including a positive rake angle and a positive rake angle groove, and two positive rake angle grooves are provided on both sides of the positive rake angle; each PCD abrasive grain (12) has two positive rake angle edges; and there is a negative rake angle between adjacent diamond abrasive grains (13).

2. The PCD sintered diamond roller with positive and negative rake angles according to claim 1, characterized in that: The base (11) is a circular stainless steel base.

3. A device for preparing the PCD sintered diamond roller with positive and negative rake angles according to any one of claims 1 to 2, characterized in that: The device comprises a driving device, a main shaft (2) and an ultrafast laser and rotary cutting assembly (4); the PCD sintered diamond roller (1) is sleeved on the main shaft (2) through a central mounting hole, and the driving device drives the PCD sintered diamond roller (1) to rotate in the XY plane through the main shaft (2); the focused laser beam (3) emitted by the ultrafast laser and rotary cutting assembly (4) is located directly above the PCD block of the PCD sintered diamond roller (1), and the positive and negative rake angle structures of the PCD block are processed by the focused laser beam (3).

4. The device for preparing a PCD sintered diamond roller with positive and negative rake angles according to claim 3, characterized in that: The ultrafast laser and rotary cutting assembly (4) includes an ultrafast laser light source (41), a reflective lens (43), an optical rotation module (44), a focusing lens (45) and a precision slide (47); the ultrafast laser light source (41) and the reflective lens (43) are respectively arranged above the optical rotation module (44), and the pulsed laser emitted by the ultrafast laser light source (41) is reflected into the optical rotation module (44) through the reflective lens (43); the pulsed laser forms rotary cutting light in the optical rotation module (44); the focusing lens (45) is arranged just below the laser outlet of the optical rotation module (44), and the rotary cutting light is focused by the focusing lens (45) to form the focused laser beam (3); the optical rotation module (44) is fixed on the precision slide (47), and the height of the focus position of the focused laser beam (3) is adjusted by the precision slide (47).

5. The device for preparing a PCD sintered diamond roller with positive and negative rake angles according to claim 4, characterized in that: The ultrafast laser and rotary cutting assembly (4) further comprises a CCD module (42), which is arranged above the back side of the reflective lens (43) and is used for real-time monitoring of the preparation process.

6. The device for preparing a PCD sintered diamond roller with positive and negative rake angles according to claim 5, characterized in that: The driving device and the ultrafast laser and rotary cutting component (4) are respectively connected to the processing center data.

7. A method for preparing the PCD sintered diamond roller with positive and negative rake angles according to any one of claims 1 to 2, characterized in that: The preparation method comprises the following steps: Step 1: Mount the PCD sintered diamond roller (1) on the spindle (2), and move the focal position of the focused laser beam (3) emitted by the ultrafast laser and rotary cutting assembly (4) to the starting position of the PCD abrasive (12) processing; Step 2: Set the parameters required for machining positive rake angle in the machining center; The parameters include: positive rake angle parameters of the PCD sintered diamond roller (1): angle of the positive rake angle , the width d of the positive rake angle and the height h of the edge; the parameters of the ultrafast laser light source (41): the average laser power and the laser repetition frequency, and the laser overlap rate is determined; the parameters of the optical rotation module (44): the rotation speed, the prism angle, the translation mirror position, according to the positive rake angle , select the rotary cutting light mode of the optical rotation module (44); the motion parameters of the PCD sintered diamond roller (1) in the XY plane; the adjustment parameters of the Z-axis height of the precision slide (47) during the scanning process; Step 3: According to the parameters set in step 2, the machining center controls the driving device and the ultrafast laser and rotary cutting assembly (4) to process the positive rake angle of the PCD sintered diamond roller (1); Step 4: Reduce the laser power and process the negative rake angle edge of the PCD sintered diamond roller (1) by sharpening.

8. The method for preparing a PCD sintered diamond roller with positive and negative rake angles according to claim 7, characterized in that: In step 3, according to the parameters selected in step 2, the processing of the cutting edge at point O1 is first started, the focused laser beam (3) is scanned from the coordinate origin according to the set positive rake angle parameters and the set laser overlap rate, and the precision slide (47) adjusts the Z-axis height in real time according to the scanning progress. After reaching the processing depth h, the processing is stopped, and the XYZ coordinates of the focus position of the focused laser beam (3) return to the O1 point position; the driving device drives the PCD sintered diamond roller (1) to rotate by an angle M / R through the main shaft (2), wherein M is the distance between two cutting edges with positive rake angles on the same PCD abrasive (12), and R is the radius of the PCD sintered diamond roller (1), and the focused laser beam (3) reaches the O2 point position; The above-mentioned edge processing process is repeated at the O2 point. After the processing is completed, the XYZ coordinates of the focal position of the focused laser beam (3) return to the O1 point, completing the processing of a positive rake angle of a PCD abrasive grain (12); Then, the driving device drives the PCD sintered diamond roller (1) to rotate by an angle of 360° / n through the main shaft (2), wherein n is the number of PCD abrasive grains (12) evenly distributed on the circumferential surface of the PCD sintered diamond roller (1), and the focal position of the focused laser beam (3) reaches the O3 point position, and the above-mentioned positive rake angle processing process is repeated, and the positive rake angle processing steps are continuously performed in this way until the processing of 2n positive rake angle cutting edges of n PCD abrasive grains (12) is completed.

9. The method for preparing a PCD sintered diamond roller with positive and negative rake angles according to claim 7, characterized in that: In step 1, after the PCD sintered diamond roller (1) is mounted on the spindle (2), the position of the spindle (2) in the XY plane is adjusted, and the height of the precision slide (47) is adjusted at the same time, so that the focused laser beam (3) hits the upper edge of the PCD sintered diamond roller (1). The driving device drives the PCD sintered diamond roller (1) to rotate through the spindle (2), and moves the focal position of the focused laser beam (3) to the starting position of the PCD abrasive (12) processing.

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