Apparatus and method for adhering

Abstract

This invention discloses an adhesive bonding device and method, belonging to the field of packaging technology. The adhesive bonding device includes a support carrier, an adsorption mechanism, and a pressure-holding mechanism. The support carrier includes a first carrier and a second carrier. The first carrier has a first positioning groove and a positioning hole. The second carrier slides in the positioning hole, and the second carrier and the hole wall of the positioning hole form a second positioning groove. The second carrier has a suction hole. The adsorption mechanism is connected to the bottom of the second carrier, and the adsorption port of the adsorption mechanism communicates with the suction hole. The pressure-holding mechanism includes an upper pressure-holding member and a lower pressure-holding member arranged opposite to each other in a preset direction. The positioning hole can be arranged opposite to the output end of the upper pressure-holding member in a preset direction, and the second carrier can be arranged opposite to the output end of the lower pressure-holding member in a preset direction. The output ends of the upper and lower pressure-holding members are close to each other in the preset direction, and the lower pressure-holding member can push the second carrier to slide in the positioning hole. This invention has high adhesive bonding efficiency and can reduce the labor intensity of employees.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and more particularly to an adhesive bonding device and method. Background Technology

[0002] Electronic products typically require packaging boxes, which are usually made of paper. Furthermore, for easy carrying or hanging, a hook is usually attached to one end of the box.

[0003] In existing technology, a hook-attaching mechanism is used to attach hooks to packaging boxes. The hook-attaching mechanism includes a carrier for positioning and supporting the packaging and a pressing component for pressing the hook. The pressing component has hook positions. When assembling the hook and packaging box, the user manually places the packaging box on the carrier and positions it. Then, the user manually places the hook on the pressing component. Finally, the user controls the pressing component to move closer to the carrier, aligning it with the desired attachment position on the packaging box and the hook. Afterward, the user presses down on the pressing component and the carrier to attach the hook to the packaging box.

[0004] However, after the user places the hook into the pressing part, it is usually stuck in the slot on the pressing part. When pressing the pressing part down in the subsequent process, the hook is more likely to fall off, which means that the hook needs to be re-fixed. This results in low pasting efficiency and high labor intensity for employees. Summary of the Invention

[0005] The purpose of this invention is to provide a pasting device and method that has high pasting efficiency and can reduce the labor intensity of employees.

[0006] Based on the above concept, the technical solution adopted by this invention is as follows:

[0007] Adhesive devices, including:

[0008] A support carrier includes a first carrier and a second carrier. The first carrier has a first positioning groove and a positioning hole. The second carrier is slidably disposed in the positioning hole, and the second carrier and the hole wall of the positioning hole form a second positioning groove. The second carrier also has a suction hole.

[0009] An adsorption mechanism is connected to the bottom of the second carrier, and the adsorption port of the adsorption mechanism is in communication with the suction hole;

[0010] A pressure-holding mechanism includes an upper pressure-holding member and a lower pressure-holding member arranged opposite to each other in a preset direction. The positioning hole is arranged opposite to the output end of the upper pressure-holding member in the preset direction. The second carrier is arranged opposite to the output end of the lower pressure-holding member in the preset direction. The output ends of the upper pressure-holding member and the lower pressure-holding member are close to each other in the preset direction. The lower pressure-holding member can push the second carrier to slide in the positioning hole.

[0011] Optionally, the bottom of the second carrier is provided with a receiving groove communicating with the suction hole, the adsorption mechanism is at least partially placed in the receiving groove, and a sealing gasket is provided between the adsorption mechanism and the bottom wall of the receiving groove.

[0012] Optionally, it also includes a support frame, the support carrier slides on the support frame in a direction perpendicular to the preset direction, the upper pressure holding member and the lower pressure holding member are respectively installed on the support frame, the support frame has a feeding position and a pressure holding position, the support carrier slides between the feeding position and the pressure holding position, the output end of the upper pressure holding member is located above the pressure holding position in the preset direction, and the output end of the lower pressure holding member is located below the pressure holding position in the preset direction.

[0013] Optionally, it also includes a driving component, the output end of which is fixedly connected to the support carrier and drives the support frame to slide between the loading position and the pressure holding position.

[0014] Optionally, the support frame includes a frame body, a support plate fixed on the frame body, and two baffles arranged opposite to each other along the sliding direction of the support carrier. Each baffle is provided with a limiting member, which is used to limit the sliding limit of the support carrier. The support carrier slides on the support plate, and the support plate has a sliding hole. The positioning hole and the sliding hole are arranged opposite to each other in the preset direction. The upper pressure member and the lower pressure member are respectively installed on the frame body.

[0015] Optionally, it also includes a linear bearing, through which the second carrier is slidably connected to the first carrier.

[0016] Optionally, the output end of the upper pressure member and the output end of the lower pressure member can approach each other in the preset direction, and the lower pressure member can push the second carrier to slide in the positioning hole.

[0017] Optionally, the output end of the upper pressure member is fixedly provided with a first elastic pressure block, and the output end of the lower pressure member is fixedly provided with a second elastic pressure block.

[0018] Optionally, the second carrier has a positioning block located within the second positioning slot.

[0019] The adhesive method, applied to the aforementioned adhesive device, includes the following steps:

[0020] Place the first object to be pasted into the second positioning groove;

[0021] The adsorption mechanism is activated and adsorbs the first object to be pasted in the second positioning groove through the suction hole;

[0022] Place the second object to be pasted into the first positioning groove;

[0023] Control the movement of the support carrier so that the positioning hole is positioned opposite to the output end of the upper pressure member in the preset direction, and the second carrier is positioned opposite to the output end of the lower pressure member in the preset direction;

[0024] Control the upper and lower pressure components to move and squeeze the first object to be pasted and the second object to be pasted, so that the first object to be pasted and the second object to be pasted are pasted together as a whole;

[0025] After a first preset time period, the adsorption mechanism is controlled to close.

[0026] After a second preset time period, the output ends of the upper pressure holding component and the lower pressure holding component are controlled to move away from each other.

[0027] Optionally, the pasting device further includes a support frame and a driving component, characterized in that, before placing the first object to be pasted into the second positioning groove, the pasting method further includes: driving the support carrier to slide to the loading position of the support frame via the driving component;

[0028] When the support carrier is moved under control, the drive unit drives the support carrier to slide from the loading position to the pressure holding position of the support frame;

[0029] After controlling the output ends of the upper pressure holding member and the lower pressure holding member to move away from each other, the pasting method further includes: the driving member driving the support carrier to slide from the pressure holding position to the loading position; and taking the finished product obtained after pasting the first object to be pasted and the second object to be pasted from the support carrier.

[0030] The beneficial effects of this invention are:

[0031] The pasting device and method provided by the present invention include a first carrier for supporting a second object to be pasted, a second carrier for supporting a first object to be pasted, and the first carrier having a positioning hole, the second carrier being able to slide within the positioning hole, and the second carrier having a suction hole. After the first object to be pasted is placed in the second positioning groove, the suction mechanism can adsorb and fix the first object to be pasted through the suction hole, thereby improving the reliability of fixing the first object to be pasted, reducing the probability of the first object to be pasted falling off, and thus improving the pasting efficiency and reducing the labor intensity of employees. Attached Figure Description

[0032] Figure 1 The three-dimensional adhesive device provided in the embodiments of the present invention Figure 1 ;

[0033] Figure 2The three-dimensional adhesive device provided in the embodiments of the present invention Figure 2 ;

[0034] Figure 3 This is an assembly diagram of the support carrier and adsorption mechanism provided in the embodiments of the present invention. Figure 1 ;

[0035] Figure 4 This is provided by the embodiments of the present invention. Figure 3 Deconstruction diagram of the structure shown Figure 1 ;

[0036] Figure 5 This is an assembly diagram of the support carrier and adsorption mechanism provided in the embodiments of the present invention. Figure 2 ;

[0037] Figure 6 This is provided by the embodiments of the present invention. Figure 3 Deconstruction diagram of the structure shown Figure 2 ;

[0038] Figure 7 This is a schematic diagram of the structure of a partial adhesive device provided in an embodiment of the present invention;

[0039] Figure 8 This is a front view of the pasting device provided in an embodiment of the present invention;

[0040] Figure 9 This is a usage status reference for the adhesive device provided in the embodiments of the present invention. Figure 1 ;

[0041] Figure 10 This is a usage status reference for the adhesive device provided in the embodiments of the present invention. Figure 2 ;

[0042] Figure 11 This is a flowchart of the pasting method provided in an embodiment of the present invention.

[0043] In the picture:

[0044] 1. Support carrier; 11. First carrier; 111. First positioning groove; 112. Positioning hole; 113. Clearance groove; 12. Second carrier; 121. Second positioning groove; 122. Suction hole; 123. Receiving groove; 124. Positioning block; 2. Adsorption mechanism; 3. Pressure holding mechanism; 31. Upper pressure holding component; 32. Lower pressure holding component; 33. First elastic pressure block; 34. Second elastic pressure block; 4. Sealing gasket; 5. Support frame; 51. Frame body; 52. Support plate; 521. Sliding hole; 53. Baffle; 54. Limiting component; 55. Stop block; 6. Driving component; 7. Linear bearing; 8. Displacement sensor; 9. Limiting bolt; 100. First object to be pasted; 200. Second object to be pasted. Detailed Implementation

[0045] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention. Furthermore, it should be noted that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings, not all of them.

[0046] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0047] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0048] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0049] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0050] Example 1

[0051] This embodiment provides an adhesive bonding device for bonding a first object to be bonded 100 and a second object to be bonded 200. The first object to be bonded 100 or the second object to be bonded 200 is less likely to fall off, improving bonding efficiency and reducing the labor intensity of employees. In some embodiments, the second object to be bonded 200 is a packaging box, and the first object to be bonded 100 is a hook.

[0052] like Figures 1 to 3 As shown, the adhesive device includes a support carrier 1, an adsorption mechanism 2, and a pressure holding mechanism 3.

[0053] The support carrier 1 includes a first carrier 11 and a second carrier 12. The first carrier 11 supports the second object to be pasted 200, and the second carrier 12 supports the first object to be pasted 100. Specifically, as shown... Figure 2 and Figure 4 As shown, the first carrier 11 has a first positioning groove 111 and a positioning hole 112. The first positioning groove 111 is used to place the second object to be pasted 200, and the groove wall of the first positioning groove 111 is used to limit the second object to be pasted 200. In this embodiment, the positioning hole 112 is formed at one end of the first positioning groove 111, and the positioning hole 112 penetrates the first carrier 11 along the thickness direction of the first carrier 11. The second carrier 12 is slidably disposed in the positioning hole 112. In some embodiments, the second carrier 12 can slide in the positioning hole 112 along a preset direction Z, thereby being able to approach the top of the positioning hole 112. It should be noted that the preset direction Z is the thickness direction of the first carrier 11. Figure 8 In this design, the preset direction Z is the up-down direction, which is the arrangement direction of the first object to be pasted 100 and the second object to be pasted 200. Furthermore, the second carrier 12 and the wall of the positioning hole 112 form a second positioning groove 121. The second positioning groove 121 is used to place the first object to be pasted 100. Specifically, the first object to be pasted 100 is placed on the second carrier 12, and the groove wall of the second positioning groove 121 is used to limit the first object to be pasted 100. The second carrier 12 has a suction hole 122. Specifically, the suction hole 122 penetrates the second carrier 12 along its thickness direction, which is parallel to the preset direction Z.

[0054] In this embodiment, the phase position relationship between the first positioning groove 111 and the second positioning groove 121 can be set as needed. In some embodiments, the first positioning groove 111 at least partially overlaps with the second positioning groove 121; in other embodiments, the first positioning groove 111 and the second positioning groove 121 are independent of each other and are arranged adjacently or at intervals.

[0055] like Figure 3As shown, the adsorption mechanism 2 is connected to the bottom of the second carrier 12, and the adsorption port of the adsorption mechanism 2 communicates with the suction hole 122, so that the adsorption mechanism 2 can adsorb the first object to be pasted 100 located on the second positioning groove 121 through the suction hole 122. In some embodiments, the adsorption mechanism 2 can be a vacuum suction cup, etc., which is not limited in this embodiment. Optionally, the adsorption mechanism 2 can be fixedly connected to the bottom of the second carrier 12 by bolts or other components.

[0056] The aforementioned pressure-holding mechanism 3 includes an upper pressure-holding member 31 and a lower pressure-holding member 32 arranged opposite to each other in a preset direction Z. The upper pressure-holding member 31 is located above the support carrier 1, and the lower pressure-holding member 32 is located below the support carrier 1. A first positioning groove 111 is arranged opposite to the output end of the upper pressure-holding member 31 in the preset direction Z, and a second carrier 12 is arranged opposite to the output end of the lower pressure-holding member 32 in the preset direction Z. The output ends of the upper pressure-holding member 31 and the lower pressure-holding member 32 are close to each other in the preset direction Z, and the lower pressure-holding member 32 can push the second carrier 12 to slide in the positioning hole 112, thereby causing the first object to be pasted 100 and the second object to be pasted 200 to be pasted together and pressurized. It should be noted that the lower pressure-holding member 32 can push the second carrier 12 to slide in the positioning hole 112 through the suction mechanism 2. In some embodiments, the upper pressure member 31 is exemplified as a cylinder, linear motor, or other component, and the lower pressure member 32 is exemplified as a cylinder, linear motor, or other component, to improve the automation of the bonding equipment. The upper pressure member 31 and the lower pressure member 32 also each have a pressure reducing valve to control the force of the upper pressure member 31 and the lower pressure member 32, thereby controlling the bonding force.

[0057] The pasting device provided in this embodiment has a first carrier 11 for supporting a second object to be pasted 200 and a second carrier 12 for supporting a first object to be pasted 100. The first carrier 11 has a positioning hole 112, and the second carrier 12 can slide in the positioning hole 112. The second carrier 12 also has a suction hole 122. After the first object to be pasted 100 is placed in the second positioning groove 121, the suction mechanism 2 can adsorb and fix the first object to be pasted 100 through the suction hole 122, which improves the reliability of fixing the first object to be pasted 100, reduces the probability of the first object to be pasted 100 falling off, thereby improving the pasting efficiency and reducing the labor intensity of employees.

[0058] Optionally, such as Figure 5 and Figure 6As shown, the bottom of the second carrier 12 is provided with a receiving groove 123 communicating with the suction hole 122. The adsorption mechanism 2 is at least partially placed in the receiving groove 123, and a sealing gasket 4 is provided between the adsorption mechanism 2 and the bottom wall of the receiving groove 123. The sealing gasket 4 is used to seal the gap between the adsorption mechanism 2 and the second carrier 12 to improve the adsorption effect of the adsorption mechanism 2 on the first object to be pasted 100. In some embodiments, the adsorption mechanism 2 has an adsorption port, and one or more suction holes 122 are provided. When there are multiple suction holes 122, the multiple suction holes 122 are spaced apart to adsorb different positions of the first object to be pasted 100, ensuring the adsorption effect. Furthermore, a cavity can be formed between the sealing gasket 4, the top surface of the adsorption mechanism 2, and the second carrier 12, so that the adsorption port can communicate with the multiple suction holes 122 through the cavity. It should be noted that the second carrier 12 has a connecting part located outside the positioning hole 112, and the receiving groove 123 is formed on the connecting part.

[0059] Optionally, please continue to see Figure 6 The bonding device also includes a linear bearing 7. The connecting part of the second carrier 12 is fixedly connected to the collar of the linear bearing 7. One end of the linear bearing 7 is fixedly connected to the first carrier 11. The second carrier 12 slides relative to the first carrier 11 via the linear bearing 7. The linear bearing 7 has good linear motion performance and small error, thereby ensuring the alignment of the first object to be bonded 100 and the second object to be bonded, and increasing the accuracy of movement and the smoothness of the motion. The number of linear bearings 7 can be set as needed; this embodiment does not limit this.

[0060] Furthermore, such as Figure 5 or Figure 6 As shown, a fixing bolt 9 connects the second carrier 12 and the first carrier 11. The nut of the fixing bolt 9 is located outside the bottom of the second carrier 12. The end of the stud of the fixing bolt 9 has a thread, and the fixing bolt 9 is screwed into the first carrier 11 through the thread. The second carrier 12 can slide on the stud. The fixing bolt 9 is used to limit the lower limit of movement of the second carrier 12. That is, the fixing bolt 9 supports the second carrier 12, and the second carrier 12 is slidably connected to the first carrier 11 through the fixing bolt 9.

[0061] In this embodiment, the second carrier 12 has a positioning block 124 located in the second positioning groove 121. The positioning block 124 is used for precise positioning of the first object to be pasted 100. For example, Figure 4 As shown, the positioning block 124 is semi-circular and matches the semi-circular notch of the first object to be pasted 100.

[0062] Optionally, such as Figure 3 or Figure 4As shown, the first carrier 11 also has a clearance groove 113 that communicates with the second positioning groove 121. The clearance groove 113 facilitates the placement of the first object to be pasted 100 in the second positioning groove 121 and also facilitates the removal of the finished product obtained after pasting the first object to be pasted 100 and the second object to be pasted 200 from the second positioning groove 121. In this embodiment, the clearance groove 113 is semi-circular.

[0063] Optionally, such as Figure 1 As shown, the adhesive bonding device also includes a support frame 5. The support carrier 1 slides on the support frame 5 in a direction perpendicular to the preset direction Z, and the upper pressure holding member 31 and the lower pressure holding member 32 are respectively installed on the support frame 5. In this embodiment, the support frame 5 can have multiple sets of support carriers 1, adsorption mechanisms 2, and pressure holding mechanisms 3, achieving high bonding efficiency. Figure 1 and Figure 2 As shown, the support frame 5 may have two sets of support carriers 1, adsorption mechanism 2 and pressure holding mechanism 3.

[0064] The support frame 5 has a feeding position and a pressure holding position, in Figure 1 In the diagram, the support carrier 1 on the left is in the pressure holding position, and the support carrier 1 on the right is in the loading position. The support carrier 1 slides between the loading position and the pressure holding position. The output end of the upper pressure holding member 31 is located above the pressure holding position in the preset direction Z, and the output end of the lower pressure holding member 32 is located below the pressure holding position in the preset direction Z. When the support carrier 1 is in the loading position, the first object to be pasted 100 is placed on the second positioning groove 121, and the second object to be pasted 200 is placed on the first positioning groove 111. Alternatively, the first object to be pasted 100 and the second object to be pasted 200 are pasted together, and then the product is removed from the support carrier 1, which facilitates loading and removal of the finished product and further improves pasting efficiency. When the support carrier 1 is in the pressure holding position, the first object to be pasted 100 and the second object to be pasted 200 are pasted and pressure is maintained by the upper pressure holding member 31 and the lower pressure holding member 32, realizing automatic pasting and pressure maintenance.

[0065] Optionally, such as Figure 7 As shown, the bonding device also includes a drive component 6. The output end of the drive component 6 is fixedly connected to the support carrier 1 and drives the support frame 5 to slide between the feeding position and the pressure holding position, further improving the automation of the bonding device, increasing bonding efficiency, and reducing manual labor intensity. In this embodiment, the drive component 6 is fixed on the support frame 5, and the drive component 6 is exemplified by components such as a cylinder or linear motor. It should be noted that each support carrier 1 corresponds to one drive component 6.

[0066] Please continue reading Figure 7The support frame 5 includes a frame body 51, a support plate 52 fixed to the frame body 51, and two baffles 53 arranged opposite each other along the sliding direction of the support carrier 1. Each baffle 53 is fixed with a limiting member 54, which limits the sliding limit of the support carrier 1 so that the support carrier 1 can be positioned at the loading position or the pressure holding position, thereby ensuring that the upper pressure holding member 31 can contact the second object to be pasted 200 and the lower pressure holding member 31 can be directly opposite the second carrier 12. Furthermore, at least one baffle 53 is also provided with a displacement sensor 8, which is used to monitor the displacement of the support carrier 1.

[0067] The support carrier 1 slides on the support plate 52. In some embodiments, the support plate 52 is provided with two blocks 53, and a slide rail is formed between the blocks 53 and the support plate 52. The two ends of the support carrier 1 are respectively limited in the two slide rails in a preset direction Z and can slide in the slide rails. Figure 2 As shown, the support plate 52 has a sliding hole 521, and the positioning hole 112 is arranged opposite to the sliding hole 521 in a preset direction Z. When the support carrier 1 slides, the second carrier 12 can slide in the sliding hole 521. The upper pressure member 31 and the lower pressure member 32 are respectively installed on the frame body 51. In some embodiments, the upper pressure member 31 is installed on the frame body 51 by a bracket, and the upper pressure member 31 is fitted with a dust cover.

[0068] Optionally, such as Figure 8 As shown, the output end of the upper pressure member 31 is fixedly provided with a first elastic pressure block 33. The first elastic pressure block 33 is used to contact the second object to be pasted 200. The first elastic pressure block 33 can have a certain elasticity to avoid crushing the second object to be pasted 200. The output end of the lower pressure member 32 is fixedly provided with a second elastic pressure block 34. The setting of the second elastic pressure block 34 can avoid hard contact between the lower pressure member 32 and the second carrier 12 or the adsorption mechanism 2.

[0069] In this embodiment, the actuators (adsorption mechanism 2, upper pressure holding member 31, lower pressure holding member 32, driving member, etc.) are all controlled by a controller. The specific control method will not be described in detail here.

[0070] The pasting equipment provided in this embodiment can improve the quality of the finished product; improve the stability of the pasting process; increase work efficiency and production capacity; reduce the labor intensity of employees; and is simpler than full automation, achieving the same purpose at a lower cost. It is suitable for various pasting operations in the 3C industry packaging field with small order volumes and low R&D funds.

[0071] Example 2

[0072] This embodiment provides a pasting method, applied to the pasting device in Embodiment 1, such as... Figure 11 As shown, the pasting method includes the following steps:

[0073] S1. Place the first object to be pasted 100 into the second positioning groove 121;

[0074] In step S1, as Figure 9 As shown, the first object to be pasted 100 can be manually placed in the second positioning groove 121. The second positioning groove 121 has a positioning block 124. The first object to be pasted 100 can be positioned by aligning the notch of the first object to be pasted 100 with the positioning block 124.

[0075] S2. Control the adsorption mechanism 2 to start, and adsorb the first object to be pasted 100 located in the second positioning groove 121 through the suction hole 122;

[0076] After the first object to be pasted 100 is positioned, in order to prevent the first object to be pasted 100 from moving again, the adsorption mechanism 2 can be activated to adsorb the first object to be pasted 100 in the second positioning groove 121 through multiple suction holes 122, so as to better fix the first object to be pasted 100 and prevent the first object to be pasted 100 from shifting.

[0077] S3. Place the second object to be pasted 200 into the first positioning groove 111;

[0078] After placing the first object to be pasted (100), as follows: Figure 10 As shown, the second object to be pasted 200 is placed in the first positioning groove 111. For example, the first positioning groove 111 is formed by a plurality of positioning blocks. It can be understood that it can also be formed by slotting. It should be noted that the first positioning groove 111 has an open structure at one end to accommodate the protruding part of the second object to be pasted 200, which is used to paste with the first object to be pasted 100.

[0079] S4. Control the movement of the supported carrier 1 so that the positioning hole 112 and the output end of the upper pressure member 31 are positioned opposite each other in the preset direction Z, and the second carrier 12 and the output end of the lower pressure member 32 are positioned opposite each other in the preset direction Z.

[0080] In step S4, the first positioning groove 111 and the output end of the upper pressure holding member 31 can be controlled to be aligned in a preset direction Z to ensure the pressing effect. In this embodiment, when the pasting device includes a support frame 5 and a driving member 6, the driving member 6 can drive the support carrier 1 to slide on the support frame 5, thereby driving the support carrier 1 to the pressure holding position, so that the first positioning groove 111 and the output end of the upper pressure holding member 31 are aligned in a preset direction Z. At the same time, the second carrier 12 and the output end of the lower pressure holding member 32 can be controlled to be aligned in a preset direction Z to ensure the pressing effect. In this embodiment, when the pasting device includes a support frame 5 and a driving member 6, the driving member 6 can drive the support carrier 1 to slide on the support frame 5, thereby driving the support carrier 1 to the pressure holding position, so that the second carrier 12 and the output end of the lower pressure holding member 32 are aligned in a preset direction Z.

[0081] S5. Control the upper pressure member 31 and the lower pressure member 32 to move and squeeze the first object to be pasted 100 and the second object to be pasted 200 to make the first object to be pasted 100 and the second object to be pasted 200 pasted into a whole.

[0082] In this embodiment, the output end of the upper pressure member 31 is controlled to move downward, so that the upper pressure member 31 contacts the second object to be pasted 200 through the first elastic pressure block 33. In this embodiment, in order to prevent the packaging box from deforming, the first elastic pressure block 33 can be controlled to only contact the second object to be pasted 200 and not move further. During the pasting process, the first elastic pressure block 33 serves as a support for the second object to be pasted 200, so that the second object to be pasted 200 will not move in the preset direction Z. At the same time, the output end of the lower pressure member 32 is controlled to move upward and contact the adsorption mechanism 2. The adsorption mechanism 2 pushes the second carrier 12 to slide relative to the first carrier 11, thereby causing the part of the second carrier 12 located in the positioning hole 112 to move upward, pushing the first object to be pasted 100 to move upward and contact the second object to be pasted 200 to be pasted into a whole.

[0083] S6. After the first preset time, control the adsorption mechanism 2 to close;

[0084] The adsorption mechanism 2 adsorbs the first object to be adhered 100 to prevent it from shifting before it is bonded to the second object to be adhered 200. If the adsorption mechanism 2 continues to adsorb the first object to be adhered 100 after it has bonded to the second object to be adhered 200, the first object to be adhered 100 will be subjected to a force away from the second object to be adhered 200, affecting the bonding effect between them. Therefore, after a first preset time, the adsorption mechanism 2 is closed. At this time, the second carrier 12 only provides support for the first object to be adhered 100, and the upper pressure member 31 and the lower pressure member 32 cooperate to maintain pressure on the bonded first object to be adhered 100 and second object to be adhered 200. In this embodiment, the first preset time can be 1 second, 1.5 seconds, etc., and this embodiment does not limit it.

[0085] S7. After the second preset time, control the output end of the upper pressure holding member 31 and the output end of the lower pressure holding member 32 to move away from each other.

[0086] After the adsorption mechanism 2 is closed for a second preset period of time, the first object to be pasted 100 and the second object to be pasted 200 are pasted more firmly, and the output end of the upper pressure member 31 and the output end of the lower pressure member 32 can be controlled to move away from each other. That is, the upper pressure member 31 and the lower pressure member are controlled to reset, and finally the pasted finished product is removed from the support carrier.

[0087] It should be noted that the sum of the first preset duration and the second preset duration can be considered as the pressure holding duration. It can be seen that the pasting device provided in this embodiment not only has a pasting function, but also a pressure holding function, realizing the multi-purpose use of one device.

[0088] The pasting method provided in this embodiment uses a first carrier 11 to support a second object to be pasted 200 and a second carrier 12 to support a first object to be pasted 100. The first carrier 11 has a positioning hole 112, and the second carrier 12 can slide in the positioning hole 112. The second carrier 12 also has a suction hole 122. After the first object to be pasted 100 is placed in the second positioning groove 121, the suction mechanism 2 can adsorb and fix the first object to be pasted 100 through the suction hole 122, which improves the reliability of fixing the first object to be pasted 100, reduces the probability of the first object to be pasted 100 falling off, and thus improves the pasting efficiency and reduces the labor intensity of employees.

[0089] Optionally, when the pasting device includes a support frame 5 and a driving component 6, before step S1, the pasting method further includes: driving the support carrier 1 to slide to the loading position of the support frame 5 via the driving component 6.

[0090] Furthermore, in step 4, the driving component 6 drives the support carrier 1 to slide from the upper material position to the pressure holding position of the support frame 5, so that the positioning hole 112 and the output end of the upper pressure holding component 31 are positioned opposite each other in the preset direction Z, and the second carrier 12 and the output end of the lower pressure holding component 32 are positioned opposite each other in the preset direction Z.

[0091] Following step S7, the pasting method also includes:

[0092] S8, the driving component 6 drives the support carrier 1 to slide from the pressure holding position to the loading position;

[0093] S9. The finished product obtained by pasting the first object to be pasted 100 and the second object to be pasted 200 is taken out from the support carrier 1.

[0094] The above embodiments merely illustrate the basic principles and characteristics of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

[0095] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A pasting device, characterized in that, include: The support carrier (1) includes a first carrier (11) and a second carrier (12). The first carrier (11) has a first positioning groove (111) and a positioning hole (112). The second carrier (12) is slidably disposed in the positioning hole (112), and the second carrier (12) and the hole wall of the positioning hole (112) form a second positioning groove (121). The second carrier (12) has a suction hole (122). The first positioning groove (111) is used to position a second object to be pasted (200), the second positioning groove (121) is used to position a first object to be pasted (100), and the suction hole (122) is used to absorb the first object to be pasted (100). The adsorption mechanism (2) is connected to the bottom of the second carrier (12), and the adsorption port of the adsorption mechanism (2) is connected to the suction hole (122); The pressure holding mechanism (3) includes an upper pressure holding member (31) and a lower pressure holding member (32) arranged opposite to each other in a preset direction. The positioning hole (112) can be arranged opposite to the output end of the upper pressure holding member (31) in the preset direction, and the second carrier (12) can be arranged opposite to the output end of the lower pressure holding member (32) in the preset direction. The support frame (5) has a support carrier (1) that slides on the support frame (5) in a direction perpendicular to the preset direction. The upper pressure holding member (31) and the lower pressure holding member (32) are respectively installed on the support frame (5). The support frame (5) has a feeding position and a pressure holding position. The support carrier (1) slides between the feeding position and the pressure holding position. The output end of the upper pressure member (31) and the output end of the lower pressure member (32) can approach each other in the preset direction, and the lower pressure member (32) can push the second carrier (12) to slide in the positioning hole (112), so that the first object to be pasted (100) and the second object to be pasted (200) are pasted and pressure is maintained; The second carrier (12) has a positioning block (124) located in the second positioning groove (121), the positioning block (124) cooperating with a semi-circular notch on the first object to be pasted (100) to position the first object to be pasted (100).

2. The adhesive device according to claim 1, characterized in that, The bottom of the second carrier (12) is provided with a receiving groove (123) that communicates with the suction hole (122). The adsorption mechanism (2) is at least partially placed in the receiving groove (123), and a sealing gasket (4) is provided between the adsorption mechanism (2) and the bottom wall of the receiving groove (123).

3. The adhesive applicator according to claim 1, characterized in that, The output end of the upper pressure holding member (31) is located above the pressure holding position in the preset direction, and the output end of the lower pressure holding member (32) is located below the pressure holding position in the preset direction.

4. The adhesive device according to claim 3, characterized in that, It also includes a drive unit (6), the output end of which is fixedly connected to the support carrier (1) and drives the support frame (5) to slide between the loading position and the pressure holding position.

5. The adhesive applicator according to claim 3, characterized in that, The support frame (5) includes a frame body (51), a support plate (52) fixed on the frame body (51), and two baffles (53) arranged opposite to each other along the sliding direction of the support carrier (1). Each baffle (53) is provided with a limiting member (54). The limiting member (54) is used to limit the sliding limit of the support carrier (1). The support carrier (1) slides on the support plate (52), and the support plate (52) has a sliding hole (521). The positioning hole (112) and the sliding hole (521) are arranged opposite to each other in the preset direction. The upper pressure member (31) and the lower pressure member (32) are respectively installed on the frame body (51).

6. The adhesive applicator according to any one of claims 1-4, characterized in that, It also includes a linear bearing (7), through which the second carrier (12) is slidably connected to the first carrier (11).

7. The adhesive applicator according to any one of claims 1-4, characterized in that, The output end of the upper pressure member (31) is fixedly provided with a first elastic pressure block (33), and the output end of the lower pressure member (32) is fixedly provided with a second elastic pressure block (34).

8. A pasting method, applied to the pasting device according to any one of claims 1-7, characterized in that, Includes the following steps: Place the first object to be pasted into the second positioning groove (121); The adsorption mechanism (2) is activated and adsorbs the first object to be pasted in the second positioning groove (121) through the suction hole (122); Place the second object to be pasted into the first positioning groove (111); Control the movement of the support carrier (1) so that the positioning hole (112) and the output end of the upper pressure member (31) are positioned opposite each other in the preset direction, and the output ends of the second carrier (12) and the lower pressure member (32) are positioned opposite each other in the preset direction; Control the upper pressure member (31) and the lower pressure member (32) to move and squeeze the first object to be pasted and the second object to be pasted, so that the first object to be pasted and the second object to be pasted are pasted into a whole; After a first preset time period, the adsorption mechanism (2) is controlled to close; After a second preset time period, the output ends of the upper pressure holding member (31) and the lower pressure holding member (32) are controlled to move away from each other.

9. The pasting method according to claim 8, wherein the pasting device further comprises a support frame (5) and a driving component (6), characterized in that, Before placing the first object to be pasted into the second positioning groove (121), the pasting method further includes: driving the support carrier (1) to slide to the loading position of the support frame (5) by the drive member (6); When the support carrier (1) is moved, the drive member (6) drives the support carrier (1) to slide from the loading position to the pressure holding position of the support frame (5); After the output ends of the upper pressure holding member (31) and the lower pressure holding member (32) are moved away from each other, the pasting method further includes: the driving member (6) drives the support carrier (1) to slide from the pressure holding position to the loading position; and the finished product obtained by pasting the first object to be pasted and the second object to be pasted is taken out from the support carrier (1).

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