Flexible hybrid electronic substrate and electronic fabric containing the same

Abstract

The present invention discloses a flexible hybrid electronic substrate and an electronic fabric comprising the same. The flexible hybrid electronic substrate comprises: a first region; and a second region, wherein the first region and the second region have a junction therebetween, wherein the first region and the second region each include at least one structural feature selected from the group consisting of a multilayer structural feature, an anisotropic structural feature, and a pre-strained structural feature.

Description

Technical Field

[0001] The present invention relates to an electronic substrate and an electronic fabric comprising the same, and in particular to a flexible hybrid electronic substrate and an electronic fabric comprising the same. Background Art

[0002] Flexible hybrid electronics (FHE) combines silicon-based semiconductors and flexible electronics and has the following advantages: (1) FHE costs less than silicon-based semiconductors; (2) FHE performance is superior to printed electronics; (3) FHE has better flexibility than both silicon-based semiconductors and flexible electronics. Therefore, FHE is suitable for integration into systems with different requirements; (4) FHE is compatible with continuous roll-to-roll manufacturing due to its flexible nature.

[0003] Due to the integration requirements of silicon-based semiconductors and flexible electronics, deformation or distortion of the FHE structure must be considered during movement to ensure reliable product performance when strain occurs. For example, circuits designed in high-strain areas of flexible hybrid electronics may cause the circuit between the flexible substrate and the rigid substrate to break easily due to the high stress generated. Summary of the Invention

[0004] The present invention aims to provide a flexible hybrid electronic substrate having special structural features according to different functionalities and comfort requirements.

[0005] The object of the present invention is to provide an electronic textile that can satisfy the functionality of various parts while taking into account comfort.

[0006] According to one embodiment of the present invention, a flexible hybrid electronic substrate is provided, comprising: a first region; and a second region, wherein the first region and the second region have a joint therebetween, wherein the first region and the second region each include at least one selected from the group consisting of the following structural features: a multilayer structural feature, an anisotropic structural feature, and a pre-strained structural feature.

[0007] According to another embodiment of the present invention, an electronic textile is provided, comprising: a textile; and a flexible electronic device disposed on the textile. The flexible electronic device comprises: a substrate; a contact structure disposed on the substrate; a component structure disposed on the substrate and electrically connected to the contact structure; and a circuit structure disposed on the substrate and electrically connecting the contact structure and the component structure. The substrate comprises a first region and a second region, the first region and the second region having a junction therebetween. The first region and the second region each comprise at least one structural feature selected from the group consisting of: a multilayer structural feature, an anisotropic structural feature, and a pre-strained structural feature.

[0008] Based on the above, the flexible hybrid electronic substrate of the electronic textile of the present invention comprises multiple zones designed through segmentation. Each zone can have specific structural features tailored to its functionality and comfort requirements. This allows for both functional and comfort-conscious users to achieve the desired results. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a perspective view of an electronic textile according to an embodiment of the present invention;

[0010] Figure 2 is a schematic diagram of a segmented design of a substrate 30 according to an embodiment of the present invention;

[0011] Figure 3 is a schematic diagram of a segmented design of a substrate 30a according to an embodiment of the present invention;

[0012] Figure 4 is a schematic diagram of a segmented design of a substrate 30b according to an embodiment of the present invention;

[0013] Figure 5A This is a schematic diagram of the smart knee brace according to Example 1 of the present invention;

[0014] Figure 5B Shown along Figure 5A A cross-sectional view of the smart knee brace according to embodiment 1 of the present invention is shown along line XX';

[0015] Figure 6 Schematic diagram of the smart knee brace of Comparative Example 1 of the present invention;

[0016] Figure 7 Schematic diagram of the smart knee brace of Comparative Example 2 of the present invention. DETAILED DESCRIPTION

[0017] Figure 1 FIG. 1 is a perspective view of an electronic textile according to an embodiment of the present invention.

[0018] Please refer to Figure 1 The electronic textile 100 includes a textile 10 and a flexible electronic device 20 disposed on the textile 10. In this embodiment, "textile" can be understood as a flexible material or product made entirely or partially of fibers. The fibers can be provided in the form of single fibers or bundled together into a multi-fiber configuration (e.g., yarn). In this embodiment, the textile 10 can be used as a covering for the head, torso, or limbs.

[0019] In one embodiment, the fabric 10 may be a fabric having a woven structure, a knitted structure, a non-woven structure, or a sandwich structure. In one embodiment, the material of the fabric 10 is, for example, polyurethane (PU), polyethylene (PE), polypropylene (PP), or thermoplastic polyurethane (TPU), but the present invention is not limited thereto. In one embodiment, the stiffness of the fabric 10 is, for example, between 1e3 g / s² (g / s²). 2 ) to 1e7 grams per second squared (g / s 2 In one embodiment, the bending stiffness of the fabric 10 is, for example, between 1e2 g×mm² / s²×radian (g×mm²). 2 / s 2 × rad) to 2e6 g × mm² / s² × radian (g × mm²) 2 / s 2 ×rad).

[0020] In one embodiment, the flexible electronic device 20 is a flexible electronic device having passive and / or active functions. The flexible electronic device 20 includes a substrate 30 and a circuit structure 40, a component structure 50, and a contact structure 60 located on the substrate 30. The substrate 30 is used to support the circuit structure 40, the component structure 50, and the contact structure 60 of the flexible electronic device 20. The substrate 30 is, for example, a flexible substrate. The substrate 30 can be a single layer or multiple layers. The substrate 30 can be composed of a single material or multiple materials. The thickness of the substrate 30 is, for example, 0.1 mm to 2 mm.

[0021] The substrate 30 includes a single layer or multilayer structure of an organic or inorganic material (or polymer). Organic materials include, for example, polyimide (PI), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethersulfone (PES), polyamide (PA), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate (PEN), polyethyleneimine (PEI), polyurethane (PU), polydimethylsiloxane (PDMS), acrylic, ether-containing polymers, and polyolefins, or a combination of two or more thereof; inorganic materials include, for example, copper foil, glass fiber, and carbon fiber, or a combination of two or more thereof, but the present invention is not limited thereto. In other words, the substrate 30 can be a single organic material, a mixture of two organic materials, or a mixture of multiple organic materials.

[0022] In other embodiments, substrate 30 is a composite material. Substrate 30 includes an organic material and an inorganic material. The inorganic material can be distributed within the organic material in a dotted, striped, meshed, three-dimensional meshed pattern, or a combination thereof. The organic material is as described above. The addition of the inorganic material can enhance the impact resistance of the impact-resistant and shock-absorbing structure. The inorganic material can be, but is not limited to, silica, aluminum oxide, titanium oxide, or a combination thereof.

[0023] The material of the substrate 30 may be the same as or different from that of the fabric 10. In one embodiment, the material of the substrate 30 is the same as that of the fabric 10. In other words, the fabric 10 itself may serve as the substrate 30. In this case, the substrate 30 and the fabric 10 may be integrally formed. In one embodiment, the stiffness of the substrate 30 is, for example, between 1e3 g / s² and 1e3 g / s². 2 )~1e7 grams per second squared (g / s 2 In one embodiment, the bending stiffness of the substrate 30 is, for example, between 1e2 g×m² / s²×radian (g×mm²). 2 / s 2 × rad) ~ 2e6 grams × square millimeter / second square × radian (g × mm 2 / s 2 ×rad).

[0024] One or more contact structures 60 are disposed on the substrate 30. The contact structures 60 are structures that connect material discontinuities within the flexible electronic device 20. In one embodiment, the contact structures 60 are located where the component structure 50 is disposed. The contact structures 60 are electrically connected to the component structure 50 and the circuit structure 40. In one embodiment, the material of the contact structures 60 is a material that has adhesive properties before drying. In one embodiment, the contact structures 60 may be solder paste or conductive adhesive.

[0025] In one embodiment, the contact structure 60 is, for example, a redistribution structure. The redistribution structure includes one or more insulating layers and one or more redistribution layers located therein, wherein portions of the redistribution layers form circuit contacts. The insulating layer is made of, for example, a polymer, a nitride, an oxide, or a combination thereof. Polymers are, for example, polybenzoxazole (PBO), polyimide, benzocyclobutene (BCB), or a combination thereof. Nitrides are, for example, silicon nitride. Oxides are, for example, silicon oxide, phospho-silicate glass (PSG), borosilicate glass (BSG), boro-phospho-silicate glass (BPSG), or a combination thereof. The redistribution layer is made of a conductor, for example, a metal or a metal alloy, such as Al, Cu, Sn, Ni, Au, Ag, or other suitable conductive materials. In one embodiment, the contact structure 60 can be formed on the substrate 30 by attaching, laminating, sputtering, printing, electroplating, chemical plating, chemical vapor deposition (CVD), or the like.

[0026] One or more component structures 50 may be disposed on the substrate 30. More specifically, the component structure 50 may be a die (bare chip). The die may be composed of a single or multiple active (active) and / or passive (passive) components. The die may be, for example, an application-specific integrated circuit (ASIC) chip, an analog chip, a sensor chip, a wireless and radiofrequency chip, a voltage regulator chip, or a memory chip. The component structure 50 may also be a stacked die, a package structure, a stacked package (PoP), a package-in-package (PiP), and a system-in-package (SiP). In one embodiment, the component structure 50 includes at least one integrated circuit and has a pin end.

[0027] In one embodiment, the component structure 50 can be bonded to the contact structure 60 using anisotropic conductive adhesive (ACA), anisotropic conductive film (ACF), anisotropic conductive paste (ACP), photosensitive photoresist, tape, solder paste, or a combination thereof. In one embodiment, the component structure 50 can be electrically connected to the circuit contacts of the contact structure 60.

[0028] In one embodiment, the component structure 50 may include component structures 50a, 50b, and 50c (eg, Figure 1(as shown), but not limited to this. Different component structures have different functions. In one embodiment, component structures 50a and 50b are various sensor components designed to meet the needs of various vehicles. They are used to detect events or changes in the environment and transmit this information to component structure 50c (such as a SiP processor).

[0029] In one embodiment, component structure 50 is a sensor chip (or FHE sensor chip). The sensor chip can be a gravity sensor chip, a temperature sensor chip, an electrocardiogram (ECG / EKG) sensor, a photoplethysmography (PPG) sensor, an electromyography (EMG) sensor, a blood pressure monitor, or other physiological data measurement sensor, or a combination of the above devices, but is not limited thereto. In one embodiment, the sensor chip can sense various physiological signals including at least heart rate, respiration, blood pressure, body temperature, and body fat percentage.

[0030] A circuit structure 40 is disposed on the substrate 30 . The circuit structure 40 is suitable for use in a flexible functional carrier and is used to electrically connect the contact structure 60 and the component structure 50 .

[0031] In one embodiment, the circuit structure 40 may be similar to the contact structure 60, which serves as a redistribution structure. In other words, the circuit structure 40 may include an insulating layer and a plurality of circuits (not shown). In one embodiment, the plurality of circuits are formed in the insulating layer. The insulating layer of the circuit structure 40 may be made of a material similar to that of the insulating layer of the contact structure 60. The plurality of circuits include a conductive material, which may be similar to that of the redistribution layer of the contact structure 60. The contact structure 60 and the circuit structure 40 may be formed simultaneously on the substrate 30. The circuit structure may electrically connect the contact structure 60 and the component structure 50 located at different locations.

[0032] In one embodiment, the circuit structure 40 is a long strip structure having a connection function (connecting the contact structure 60 and the component structure 50) and a bending function. In one embodiment, the circuit structure 40 is, for example, a wire. One end of the circuit structure 40 as a wire is electrically connected to the contact structure 60, and the other end is electrically connected to another contact structure 60. In one embodiment, the insulating layer of the circuit structure 40 can be formed simultaneously with the insulating layer of the contact structure. The multiple circuits of the circuit structure 40 are formed on the insulating layer of the circuit structure 40 after the contact structure is formed. The multiple circuits or wires of the circuit structure 40 can be formed on the substrate 30 by printing, plating or lamination. In one embodiment, the length of the circuit structure 40 is 1 mm to 2000 mm.

[0033] In the embodiment where the application field is a wearable device, when putting on and taking off the wearable device, the strain at the putting on and taking off part (such as the waist when putting on pants) is usually greater than 60%, which is much greater than the acceptable strain of the circuit (the acceptable strain of the circuit must be less than 15%), thus reducing the reliability of the component. In addition, the wiring of wearable devices with active functions (such as heating coils) must pass through high-activity parts (such as joints or knees), and the strain at high-activity parts is usually greater than 20%, which is also greater than the acceptable strain of the circuit, thus reducing the reliability of the component and reducing the feasibility of circuit wiring in this part. In addition, the strain caused by muscle expansion during exercise will also reduce the reliability of the component. Furthermore, the curvature radius of the component or circuit layout position will also reduce the reliability of the component.

[0034] Therefore, in this embodiment, the base plate 30 may have a segmented design to improve the functionality of various areas while also ensuring comfort. Specifically, the base plate 30 may include multiple zones, each with unique structural features tailored to the desired functionality and comfort. In one embodiment, the base plate 30 is segmented by lamination, stitching, snap fastening, zippers, or integrally woven fabric, but the present invention is not limited thereto. The segmented design of the base plate 30 is described in detail below.

[0035] Figure 2 This is a schematic diagram of a segmented design of a substrate 30 according to an embodiment of the present invention. Figure 2 In one embodiment, the substrate 30 includes a first region R1 and a second region R2, with a joint 102 formed between the first region R1 and the second region R2. The first region R1 and the second region R2 are joined by lamination, stitching, snapping, zipping, or integral weaving. In this embodiment, the first region R1 and the second region R2 each include at least one structural feature selected from the group consisting of a multilayer structure, an anisotropic structure, and a pre-strained structure.

[0036] In this embodiment, the multi-layer structural feature includes multi-layer stacking, increased thickness or patterning. In this embodiment, stacking a substrate (or another fabric) on a fabric (the fabric can be part of the substrate) is a "multi-layer stacking" feature. In this embodiment, the "increased thickness" feature means that the thickness of a specific area of ​​the substrate (or fabric) is greater than the thickness of other areas. In this embodiment, the "patterning" feature means that a specific area of ​​the substrate has holes so that the substrate in the specific area can be divided into an upper layer and a lower layer. In addition, the "patterning" feature can also mean that a specific area of ​​the substrate has a silicone dot filler with different distribution densities. In this embodiment, the strain of the area of ​​the substrate 30 having the multi-layer structural feature is less than 15%.

[0037] In one embodiment, the region of the base plate 30 having a multi-layer structure can be applied to a donning or doffing area or a high-activity area. In one embodiment, the region of the base plate 30 having a multi-layer structure can be applied to the waist, knees, elbows, or buttocks, but the present invention is not limited thereto.

[0038] In an embodiment of a wearable knee brace, with only a single layer of fabric in the knee area, strains on both the anterior and lateral sides of the knee exceed 20% when the knee is flexed to 100 degrees, compromising routing feasibility. However, replacing the single layer of fabric in the anterior knee area with a multi-layered structure (for example, by sewing a double-layer fabric area in the anterior knee area) effectively reduces strain in the anterior path while maintaining comfort (strain can be reduced to 10% and stress less than 0.52 kPa).

[0039] In one embodiment, anisotropic structural features can be achieved by varying the warp and weft density. In another embodiment, anisotropic structural features can be achieved through anisotropic alignment caused by weaving or stretching. For example, the warp and weft yarns can be oriented differently by weaving a fabric, or by stretching a substrate. Anisotropic materials can limit the amount of strain in a specific direction of motion. In one embodiment, the strain in the region of the substrate 30 with anisotropic structural features is less than 15%.

[0040] In one embodiment, the region of the base plate 30 having anisotropic structural features may be applied to a donning or doffing area or a high-activity area. In one embodiment, the region of the base plate 30 having anisotropic structural features may be applied to the waist, knees, elbows, or buttocks, but the present invention is not limited thereto.

[0041] In an embodiment where the application field is a wearable knee brace, changing the single layer of fabric in the forward direction of the knee to one with non-isotropic structural characteristics (for example, changing the warp yarn strength of the front knee brace to 4 times the original) can effectively reduce the strain in the forward path while maintaining comfort (the strain can be reduced to below 15%, and the stress is less than 0.52kPa).

[0042] In one embodiment, prestrain can be applied to a fabric serving as a substrate to achieve prestrained structural features. In another embodiment, prestrain can be applied to the fabric serving as the substrate, and then the prestrained fabric can be laminated to the substrate to achieve prestrained structural features. In this embodiment, the area of ​​the substrate with prestrained structural features can increase athletic comfort and reduce stress and strain in that area. For example, in the application field of cycling pants, prestrained cycling pants can reduce strain on the front thigh during cycling from 20% to approximately 5%.

[0043] In one embodiment, the area of ​​the substrate 30 with the pre-strained structural features can be applied to high-activity areas. In one embodiment, the area of ​​the substrate 30 with the pre-strained structural features can be applied to the waist, knees, elbows or buttocks, but the present invention is not limited thereto.

[0044] In an embodiment where the application field is a wearable knee brace, changing the knee fabric to have pre-strained structural characteristics (for example, sewing loosened fabric at the front of the knee) can effectively reduce the stress on the front path while maintaining comfort (the stress can be reduced from 100% to below 70%).

[0045] In this embodiment, the structural features of the first region R1 and the structural features of the second region R2 may be the same or different. In one embodiment, the first region R1 includes multi-layer structural features, and the second region R2 includes anisotropic structural features. In one embodiment, the first region R1 includes multi-layer structural features, and the second region R2 includes pre-strained structural features. In one embodiment, the first region R1 includes anisotropic structural features, and the second region R2 includes pre-strained structural features.

[0046] In one embodiment, both the first region R1 and the second region R2 include multilayer structural features, but the multilayer structural features of the first region R1 are different from the multilayer structural features of the second region R2. In one embodiment, the first region R1 has a multilayer structural feature of "multilayer stacking," and the second region R2 has a multilayer structural feature of "patterning." In one embodiment, the first region has a multilayer structural feature of "patterning," and the second region R2 has a multilayer structural feature of "increasing thickness." In another embodiment, both the first region R1 and the second region R2 include a multilayer structural feature of "multilayer stacking," but the stacked materials in the first region R1 and the second region R2 are different.

[0047] Figure 3 This is a schematic diagram of a segmented design of a substrate 30a according to an embodiment of the present invention. Figure 3 In one embodiment, substrate 30a includes a first region R1, a second region R2, and a third region R3. A junction 102 is defined between the first region R1 and the second region R2, and a junction 104 is defined between the second region R2 and the third region R3. In this embodiment, each of the first region R1, the second region R2, and the third region R3 includes at least one structural feature selected from the group consisting of a multilayer structure, an anisotropic structure, and a pre-strained structure. Each region may have specific structural features based on different functionalities and comfort requirements. Details similar to those in the previous embodiments are not repeated here.

[0048] In this embodiment, the structural features of the first region R1, the second region R2, and the third region R3 may be the same or different. Each region may have specific structural features according to different functionalities and comfort requirements.

[0049] Figure 4 This is a schematic diagram of a segmented design of a substrate 30b according to an embodiment of the present invention. Figure 4 In one embodiment, the substrate 30b includes a first region R1, a second region R2, and a third region R3, and a joint 102 is formed between the first region R1 and the second region R2, and a joint 106 is formed between the third region R3 and the first region R1 and the second region R2. In this embodiment, the first region R1, the second region R2, and the third region R3 each include at least one selected from the group consisting of the following structural features: a multilayer structural feature, an anisotropic structural feature, and a pre-strained structural feature. The structural features of the first region R1, the structural features of the second region R2, and the structural features of the third region R3 may be the same as or different from each other. Each region may have special structural features according to different functionalities and comfort requirements. Details similar to those of the previous embodiments will not be repeated here.

[0050] Figures 2 to 4 The segmented design of the substrate shown in the figure is for illustrative purposes only and is not intended to limit the present invention. In other embodiments, other bonding methods may be used or the number of regions with structural features may be changed as needed (e.g., a fourth region, a fifth region, etc.).

[0051] Below, the experimental examples of the present invention are listed to more specifically demonstrate the present invention. However, without departing from the spirit of the present invention, the materials, methods of use, etc. shown in the following experimental examples can be appropriately changed. Therefore, the scope of the present invention should not be limited to the experimental examples shown below.

[0052] Example 1

[0053] Figure 5A This is a schematic diagram of the smart knee brace according to Example 1 of the present invention. Figure 5B Shown along Figure 5A The cross-sectional view of the smart knee brace according to Example 1 of the present invention is shown along the line XX'.

[0054] In this embodiment, a smart knee brace is constructed using single-layer cloth, double-layer cloth, silicone dot cloth A, and silicone dot cloth B. In this embodiment, the double-layer cloth is made by stacking a single layer of cloth on top of another. The single-layer cloth is composed of 80% polyamide fiber and 20% elastane (polyurethane). The silicone dot cloth is cloth with silicone dots added. The silicone dots are two-dimensional hexagonal fillers with a spacing of 10 mm, a diameter of 5 mm, and a thickness of 0.8 mm, respectively. The difference between silicone dot cloth A and silicone dot cloth B is that the density of silicone dots on silicone dot cloth B is 50% of that on silicone dot cloth A. In this embodiment, the different sections are connected by sewing. In this embodiment, the components are primarily located in sections A and B, while the knee area and wiring are primarily located in section C.

[0055] In this embodiment, for example, Figure 3 The segmented design concept is used to make the smart knee brace of Example 1. Figure 5A and Figure 5B , Figure 5B The left section A and section B constitute the first region R1 mentioned above (for example Figure 3 The first zone R1 in Figure 5B The section C constitutes the second region R2 mentioned above (e.g. Figure 3 the second region R2 in ), and Figure 5B The right section A and section B constitute the third region R3 mentioned above (for example Figure 3 In the third zone R3, the interior of Section A of the smart knee brace is a multi-layer structure of a single-layer fabric and silicone dot fabric A. The interior of Section B of the smart knee brace is a multi-layer structure of a single-layer fabric and silicone dot fabric B. The interior of Section C of the smart knee brace is a double-layer fabric. The exteriors of Sections A, B, and C are all made of single-layer fabric.

[0056] Comparative Example 1

[0057] Figure 6 Schematic diagram of the smart knee brace of Comparative Example 1 of the present invention.

[0058] In this embodiment, a single layer of cloth and silicone dot cloth A are used to make a smart knee brace. Figure 6 The interior of section A of the smart knee brace is a multi-layer structure of a single layer of cloth and silicone dot cloth A. In this embodiment, the components, circuits, and knee position are mainly located in section A.

[0059] Comparative Example 2

[0060] Figure 7 Schematic diagram of the smart knee brace of Comparative Example 2 of the present invention. In this embodiment, only a single layer of fabric is used to make the smart knee brace.

[0061] The fabric parameters of the single-layer cloth, silicone dot cloth A, and silicone dot cloth B are shown in Table 1 below.

[0062] Table 1

[0063]

[0064]

[0065] Next, the stress and strain at 100 degrees bending of the smart knee braces of Example 1 and Comparative Examples 1-2 were tested. The results are shown in Table 2 below.

[0066] Table 2

[0067]

[0068] As shown in Table 2, the stress at 100° bending in the smart knee brace of Comparative Example 2 is as high as 0.62 kPa, exceeding the human knee's comfortable pressure (approximately 0.52 kPa). Therefore, the smart knee brace of Comparative Example 2 can cause discomfort. Furthermore, the strain at 100° bending in the smart knee brace of Comparative Example 2 is 22.1%, exceeding the acceptable strain threshold for circuits (15%). This could reduce component reliability and reduce the feasibility of wiring in this area.

[0069] Furthermore, because the smart knee brace of Comparative Example 1 has a multi-layered structural area, it can improve comfort. However, the strain at 100 degrees of bending of the smart knee brace of Comparative Example 1 is 18.2%, which is higher than the acceptable strain threshold for circuits, thus reducing component reliability and the feasibility of wiring in this area.

[0070] However, the smart knee brace of Example 1 of the present invention has a segmented design, which includes two areas with structural features. Therefore, the smart knee brace of Example 1 has a strain lower than 15% (14.5%) and a stress lower than 0.52 kPa (0.33 kPa), so it can meet the feasibility of line routing while taking comfort into account.

[0071] In summary, because the flexible hybrid electronic substrate using the electronic textile of the present invention comprises multiple zones designed through segmentation, each zone can have unique structural features tailored to its functionality and comfort requirements. This allows for both functional and comfort requirements to be met in each area.

[0072] Although the present invention has been disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined by the appended claims.

Claims

1. An electronic textile comprising: fabric; as well as A flexible electronic device is provided on the fabric, wherein the flexible electronic device comprises: substrate; a contact structure, disposed on the substrate; a component structure disposed on the substrate and electrically connected to the contact structure; and a circuit structure, disposed on the substrate and electrically connecting the contact structure and the component structure; The substrate includes a first area and a second area, and a junction is formed between the first area and the second area. The structural feature of the first region is a multi-layer stack, and the structural feature of the second region is an increased thickness, The component structure is located in the first area and the circuit structure is located in the second area, wherein the rigidity of the substrate is between 1e3 g / s² and 1e7 g / s². 2 . The electronic textile according to claim 1 , wherein the bending strength of the substrate is between 1e2 g×mm² / s²×rad and 2e6 g×mm² / s²×rad. The electronic textile according to claim 1 , wherein the textile itself serves as the substrate. The electronic textile according to claim 1 , wherein the stiffness of the textile is between 1e3 g / s² and 1e7 g / s². The electronic textile according to claim 1 , wherein the bending strength of the textile is between 1e2 g×mm² / s²×rad and 2e6 g×mm² / s²×rad. The electronic textile according to claim 1 , wherein the component structure comprises an integrated circuit. The electronic textile according to claim 1 , wherein the length of the circuit structure is 1 mm to 2000 mm.

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