High frequency module and communication device

Abstract

A high-frequency module (1) includes: a module substrate (91) having a main surface (91a); a first circuit component and a second circuit component disposed on the main surface (91a); a resin member (92) covering at least a portion of the main surface (91a), the first circuit component, and the second circuit component; a metal shielding layer (95) covering at least an upper surface (92a) of the resin member (92); and a metal shielding plate (70) disposed on the main surface (91a) and between the first circuit component and the second circuit component when the main surface (91a) is viewed in plan. The metal shielding plate (70) is in contact with the metal shielding layer (95). An engraved portion (80) showing given information is provided on the upper surface (92a) of the resin member (92). The engraved portion (80) does not overlap at least an upper end surface (70a) of the metal shielding plate (70) when the main surface (91a) is viewed in plan.

Description

TECHNICAL FIELD

[0001] The present application relates to a high-frequency module and a communication apparatus. BACKGROUND

[0002] In a mobile communication device such as a portable telephone, in particular, along with the development of multi-band, the configuration structure of circuit components constituting a high-frequency front-end circuit is complicated.

[0003] In Patent Literature 1, a circuit structure of a transceiver (transmit-receive circuit) is disclosed, which has a plurality of transmitters (transmission paths) and a plurality of receivers (reception paths), and a switch-type duplexer (antenna switch) disposed between the plurality of transmitters and the plurality of receivers and an antenna. The plurality of transmitters each have a transmission circuit, a PA (transmission power amplifier), and an output circuit. The plurality of receivers each have a reception circuit, an LNA (reception low-noise amplifier), and an input circuit. The output circuit includes a transmission filter, an impedance matching circuit, and a duplexer, etc. The input circuit includes a reception filter, an impedance matching circuit, and a duplexer, etc. According to the above structure, by the switching action of the switch-type duplexer, simultaneous transmission, simultaneous reception, or simultaneous transmission and reception can be performed.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: JP Laid-open Patent Publication No. 2014-522216 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, in the case where the transceiver (transmit-receive circuit) disclosed in Patent Literature 1 is constituted by a high-frequency module mounted on a mobile communication device, it is assumed that the plurality of circuit components respectively disposed in the transmission path, the reception path, and the transmission-reception path including the antenna switch are electromagnetically coupled. In this case, the harmonic components of the high-output transmission signal amplified by the PA (transmission power amplifier) are superimposed on the transmission signal, and sometimes the quality of the transmission signal is degraded. Further, due to the above electromagnetic coupling, the isolation between transmission and reception is degraded, and sometimes the above harmonic, or the intermodulation distortion of the transmission signal and other high-frequency signals, etc. flows into the reception path, and thus the reception sensitivity is deteriorated.

[0009] Further, in order to easily perform the recognition of the high-frequency module, an engraving indicating the model number or the like information is provided on the surface of the high-frequency module. Along with the development of the miniaturization of the high-frequency module, the engraving itself also becomes small, and it is required to maintain the visual recognition property thereof high.

[0010] Accordingly, an object of the present application is to provide a high-frequency module and a communication device that can suppress quality degradation of a transmission signal or a reception signal and have high visual recognition of an engraving.

[0011] Technical solution for solving the problem

[0012] One embodiment of the high-frequency module according to the present application includes a module substrate having a main surface; a first circuit component and a second circuit component disposed on the main surface; a resin member covering at least a portion of the main surface, the first circuit component, and the second circuit component; a metal shielding layer covering at least an upper surface of the resin member; and a metal shielding plate disposed on the main surface and between the first circuit component and the second circuit component when the main surface is viewed in plan view, the metal shielding plate being in contact with the metal shielding layer, an engraved portion showing given information being provided on the upper surface of the resin member, the engraved portion not overlapping at least an upper end surface of the metal shielding plate when the main surface is viewed in plan view.

[0013] One embodiment of the communication device according to the present application includes an RF signal processing circuit that processes a high-frequency signal transmitted and received by an antenna; and the high-frequency module according to one embodiment described above, which transmits the high-frequency signal between the antenna and the RF signal processing circuit.

[0014] Effects of the Invention

[0015] According to the present application, a high-frequency module and a communication device that can suppress quality degradation of a transmission signal or a reception signal and have high visual recognition of an engraving can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a circuit diagram of the high-frequency module and the communication device according to the embodiment.

[0017] Figure 2 is a plan view showing a component arrangement of the high-frequency module according to the embodiment.

[0018] Figure 3 is a sectional view of the high-frequency module according to the embodiment.

[0019] Figure 4 is a plan view showing an engraved portion of the high-frequency module according to the embodiment.

[0020] Figure 5 is a plan view showing an engraved portion of the high-frequency module according to the modification of the embodiment.

[0021] Figure 6A is an appearance perspective view of a first example of the metal shielding plate.

[0022] Figure 6B is an appearance perspective view of a second example of the metal shielding plate.

[0023] Figure 6C Fig. 6 is an appearance perspective view showing a fifth example of the metal shield plate.

[0024] Figure 6D Fig. 7 is an appearance perspective view showing a sixth example of the metal shield plate.

[0025] Figure 6E Fig. 8 is an appearance perspective view showing a seventh example of the metal shield plate.

[0026] Figure 6F Fig. 9 is an appearance perspective view showing an eighth example of the metal shield plate. DETAILED DESCRIPTION

[0027] Hereinafter, a high-frequency module and a communication apparatus according to an embodiment of the present application will be described in detail with reference to the drawings. Note that each of the embodiments described below shows one specific example of the present application. Therefore, numerical values, shapes, materials, constituent elements, configurations, and connection modes and the like shown in the following embodiments are one example, and the gist of the present application is not limited to them. Thus, as for the constituent elements not recited in the independent claims among the constituent elements in the following embodiments, they are described as arbitrary constituent elements.

[0028] Further, each of the drawings is a schematic view, and the illustration is not necessarily strict. Therefore, for example, the scale and the like are not necessarily consistent in each of the drawings. Further, in each of the drawings, the same reference numerals are attached to substantially the same structures, and repetitive description is omitted or simplified.

[0029] Further, in the present specification, terms indicating the relationship between elements such as parallel or perpendicular, and terms indicating the shape of an element such as rectangle or straight line, and numerical ranges are not expressions indicating only strict meanings, but expressions indicating substantially equivalent ranges, for example, ranges including a difference of several percent or the like.

[0030] Further, in the present specification, terms such as "upper" and "lower" are not terms indicating upward direction (plumb upward direction) and downward direction (plumb downward direction) in absolute spatial recognition, but are used as terms defined based on the stacking order in a stacked structure by a relative positional relationship. Therefore, for example, the "upper surface" of a component or a member can be not only a surface on the plumb upward direction side, but also a surface on the plumb downward direction side, or a surface orthogonal to the horizontal direction, and the like.

[0031] Furthermore, in this specification and accompanying drawings, the x-axis, y-axis, and z-axis represent the three axes of a three-dimensional orthogonal coordinate system. When the top view of the module substrate is rectangular, the x-axis and y-axis are parallel to the first side of the rectangle and the second side, which is orthogonal to the first side, respectively. The z-axis represents the thickness direction of the module substrate. Additionally, in this specification, the term "thickness direction" of the module substrate refers to the direction perpendicular to the main surface of the module substrate.

[0032] Furthermore, in this specification, the term "connection" includes not only direct connections via connection terminals and / or wiring conductors, but also electrical connections via other circuit elements. Additionally, the term "connection between A and B" means a connection between A and B, or a connection between both A and B.

[0033] Furthermore, in the component configuration of the present invention, the term "top view of the module substrate" means viewing the object by orthographic projection from the positive z-axis side onto the xy-plane. Furthermore, the term "component disposed on the substrate" includes, in addition to the component being disposed on the substrate in contact with the substrate, it also includes being disposed above the substrate without contact with the substrate (e.g., the component is stacked on top of other components disposed on the substrate), and being partially or entirely embedded within the substrate. Furthermore, the term "component disposed on the main surface of the substrate" includes, in addition to the component being disposed on the main surface of the substrate in contact with the main surface, it also includes being disposed above the main surface without contact with the main surface, and being partially embedded within the substrate from the main surface side. Furthermore, the term "A disposed between B and C" means that at least one of a plurality of line segments connecting any point in B and any point in C passes through A.

[0034] Furthermore, in this specification, ordinal numbers such as "the first" and "the second" do not imply the quantity or order of constituent elements unless otherwise specified, but are used for the purpose of avoiding confusion between similar constituent elements and for differentiation.

[0035] Furthermore, the term "transmit path" hereafter refers to a transmission line consisting of wiring for transmitting high-frequency transmitted signals, electrodes directly connected to the wiring, and terminals directly connected to the wiring or electrodes. Similarly, the term "receive path" refers to a transmission line consisting of wiring for transmitting high-frequency received signals, electrodes directly connected to the wiring, and terminals directly connected to the wiring or electrodes. Finally, the term "transmit-receive path" refers to a transmission line consisting of wiring for both transmitting and receiving high-frequency transmitted and received signals, electrodes directly connected to the wiring, and terminals directly connected to the wiring or electrodes.

[0036] (Implementation Method)

[0037] [1. Circuit structure of high-frequency module and communication device]

[0038] By using Figure 1 A circuit structure of a high-frequency module and a communication device according to an embodiment will be described. Figure 1 is a circuit structure diagram of a high-frequency module 1 and a communication device 5 according to an embodiment.

[0039] [1-1. Circuit structure of communication device]

[0040] The communication device 5 is a device used in a communication system, such as a smartphone and a tablet computer, and the like, which are portable terminals. As Figure 1 indicated, the communication device 5 is provided with a high-frequency module 1, an antenna 2, an RF signal processing circuit (RFIC) 3, and a baseband signal processing circuit (BBIC) 4.

[0041] The high-frequency module 1 transmits a high-frequency signal between the antenna 2 and the RFIC 3. The internal structure of the high-frequency module 1 will be described later.

[0042] The antenna 2 is connected to an antenna connection terminal 100 of the high-frequency module 1, transmits a high-frequency signal (transmission signal) output from the high-frequency module 1, and, in addition, receives a high-frequency signal (reception signal) from the outside and outputs it to the high-frequency module 1.

[0043] The RFIC 3 is an example of a signal processing circuit that processes a high-frequency signal that is transmitted and received by the antenna 2. Specifically, the RFIC 3 performs signal processing on a high-frequency reception signal that is input via a reception path of the high-frequency module 1 by frequency conversion or the like, and outputs a reception signal generated by the signal processing to the BBIC 4. In addition, the RFIC 3 performs signal processing on a transmission signal that is input from the BBIC 4 by frequency conversion or the like, and outputs a high-frequency transmission signal generated by the signal processing to a transmission path of the high-frequency module 1. In addition, the RFIC 3 has a control section that controls a switch and an amplifier or the like possessed by the high-frequency module 1. In addition, a part or all of the functions of the control section of the RFIC 3 can also be installed outside the RFIC 3, for example, in the BBIC 4 or the high-frequency module 1.

[0044] The BBIC 4 is a baseband signal processing circuit that performs signal processing using an intermediate frequency band that is lower than a high-frequency signal transmitted by the high-frequency module 1. The signal processed by the BBIC 4 can be, for example, an image signal used for image display, and / or a sound signal used for communication via a speaker.

[0045] In addition, in the communication device 5 according to the present embodiment, the antenna 2 and the BBIC 4 are not necessarily essential constituent elements.

[0046] [1-2. Circuit structure of high-frequency module]

[0047] Next, the circuit structure of high-frequency module 1 will be described.

[0048] like Figure 1 As shown, the high-frequency module 1 includes a power amplifier 10, a low-noise amplifier 20, and functional circuits 30 and 40. Furthermore, the high-frequency module 1 includes an antenna connection terminal 100, a transmit input terminal 110, and a receive output terminal 120 as external connection terminals.

[0049] Antenna connection terminal 100 is connected to antenna 2.

[0050] The transmit input terminal 110 is a terminal used to receive transmit signals from the outside of the high-frequency module 1 (specifically, RFIC 3).

[0051] The receive output terminal 120 is a terminal used to supply received signals to the outside of the high-frequency module 1 (specifically, RFIC 3).

[0052] The high-frequency module 1 is provided with a transmit path AT for transmitting transmitted signals and a receive path AR for transmitting received signals. The transmit path AT is the path connecting the transmit input terminal 110 and the antenna connection terminal 100. The receive path AR is the path connecting the receive output terminal 120 and the antenna connection terminal 100. Furthermore, a portion of both the transmit path AT and the receive path AR is shared. That is, the shared portion is the transceiver path used for transmitting and receiving signals.

[0053] Power amplifier 10 is an example of an amplifier that amplifies high-frequency signals. Power amplifier 10 is configured in the transmission path AT and is a transmission amplifier that amplifies transmission signals in one or more communication frequency bands.

[0054] The low-noise amplifier 20 is an example of an amplifier that amplifies high-frequency signals. The low-noise amplifier 20 is configured in the receiver path AR and is a receiver amplifier that amplifies received signals from one or more communication frequency bands.

[0055] Furthermore, the term "communication frequency band" refers to a frequency band predefined for a communication system by standardization organizations such as 3GPP (3rd Generation Partnership Project) and IEEE (Institute of Electrical and Electronics Engineers). A communication frequency band can be used in either Frequency Division Duplex (FDD) or Time Division Duplex (TDD) modes.

[0056] Here, the term "communication system" refers to a communication system built using Radio Access Technology (RAT). Examples of communication systems include, but are not limited to, 5G NR (5th Generation New Radio), LTE (Long Term Evolution), and WLAN (Wireless Local Area Network) systems.

[0057] Functional circuit 30 is configured in the transmission path AT and is a circuit that performs a given function. Specifically, functional circuit 30 includes a transmission filter having a passband that includes the communication frequency band of the transmitted signal. Alternatively, functional circuit 30 may also include impedance matching circuitry and / or switching circuitry. For example, functional circuit 30 includes inductors and / or capacitors.

[0058] exist Figure 1 In the example shown, functional circuit 30 is connected between power amplifier 10 and antenna connection terminal 100, but is not limited thereto. Functional circuit 30 can also be connected between power amplifier 10 and transmit input terminal 110. High-frequency module 1 may also have multiple functional circuits 30. Multiple functional circuits 30 may also be connected between power amplifier 10 and antenna connection terminal 100, and between power amplifier 10 and transmit input terminal 110, respectively.

[0059] Functional circuit 40 is configured in the receiving path AR and is a circuit that performs a given function. Specifically, functional circuit 40 includes a receive filter having a passband that includes the communication frequency band of the received signal. Alternatively, functional circuit 40 may also include impedance matching circuitry and / or switching circuitry. For example, functional circuit 40 includes inductors and / or capacitors.

[0060] exist Figure 1In the illustrated example, the functional circuit 40 is connected between the low-noise amplifier 20 and the antenna connection terminal 100, but is not limited thereto. The functional circuit 40 can also be connected between the low-noise amplifier 20 and the reception output terminal 120. The high-frequency module 1 can also be provided with a plurality of functional circuits 40. A plurality of functional circuits 40 can also be connected between the low-noise amplifier 20 and the antenna connection terminal 100, and between the low-noise amplifier 20 and the reception output terminal 120, respectively.

[0061] Further, the functional circuit 30 or 40 can also be provided in the transceiving path. The functional circuits 30 and 40 can also be duplexers or multiplexers including a transmission filter and a reception filter.

[0062] The high-frequency module 1 configured as above can also be capable of transceiving high-frequency signals of a plurality of communication bands. For example, the high-frequency module 1 can also be capable of performing at least any one of (1) transceiving of high-frequency signals of a communication band A, (2) transceiving of high-frequency signals of a communication band B, and (3) simultaneous transmission, simultaneous reception, or simultaneous transceiving of high-frequency signals of the communication band A and high-frequency signals of the communication band B.

[0063] In the high-frequency module 1, the transmission path AT and the reception path AR can also be separated. For example, the transmission path AT and the reception path AR can also be connected to the antenna 2 via different terminals, respectively. Further, the high-frequency module 1 can also have only any one of the transmission path AT and the reception path AR.

[0064] [2. Configuration of components of high-frequency module]

[0065] Next, the configuration of components of the high-frequency module 1 will be described. Figure 2 and Figure 3 The configuration of components of the high-frequency module 1 according to the present embodiment will be described.

[0066] Figure 2 is a plan view showing the configuration of components of the high-frequency module 1 according to the present embodiment. Figure 3 is a sectional view of the high-frequency module 1 according to the present embodiment. Figure 3 shows a section at the III-III line of Figure 2 . In Figure 3 , a grid showing the section is not labeled on the module substrate 91 in consideration of the ease of observation of the drawing. Further, in Figure 3 , a circuit symbol showing that the metal shielding layer 95 is set to ground is schematically shown.

[0067] As shown in Figure 2 and Figure 3 , the high-frequency module 1 is provided with the metal shielding plate 70 and the engraved portion 80 (see Figure 1 in addition to the circuit structure shown in Figure 4), a module substrate 91, a resin member 92, a metal shield layer 95, and an external connection terminal 150.

[0068] The module substrate 91 has a main surface 91a and a main surface 91b on the opposite side of the main surface 91a. The module substrate 91 has a rectangular shape in plan view, but the shape of the module substrate 91 is not limited thereto. As the module substrate 91, for example, a Low Temperature Co-fired Ceramics (LTCC) substrate having a stacked structure of a plurality of dielectric layers, a High Temperature Co-fired Ceramics (HTCC) substrate, an in-component substrate, a substrate having a Redistribution Layer (RDL), or a printed substrate, or the like can be used, but is not limited thereto.

[0069] The main surface 91a is sometimes referred to as an upper surface or a surface. As shown in Figure 2 , all components (except for the terminals) that constitute the circuit shown in Figure 1 are disposed on the main surface 91a. Specifically, the power amplifier 10, the semiconductor integrated circuit 50 including the low-noise amplifier 20, and the circuit components 31 and 41 are disposed on the main surface 91a.

[0070] The circuit component 31 is one example of a first circuit component disposed in the transmission path AT, and includes circuit elements included in the functional circuit 30 shown in Figure 1 . The circuit component 41 is one example of a second circuit component disposed in the reception path AR, and includes circuit elements included in the functional circuit 40 shown in Figure 1 . For example, the circuit components 31 and 41 include inductors. Specifically, the circuit components 31 and 41 are chip inductors, respectively. The chip inductors are, for example, part of an impedance matching circuit or a filter. Further, in Figure 2 , an example in which a duplexer (filter) and a switching circuit or the like are disposed on the main surface 91a is schematically illustrated, but these can not be disposed.

[0071] In addition, the semiconductor integrated circuit 50 is an electronic component having an electronic circuit formed on the surface and inside of a semiconductor chip (also referred to as a die). In the example shown in Figure 2 , the semiconductor integrated circuit 50 includes the low-noise amplifier 20 and a switching circuit. The semiconductor integrated circuit 50 is, for example, constituted by CMOS, and specifically can be constituted by an SOI process. Thus, the semiconductor integrated circuit 50 can be manufactured inexpensively. In addition, the semiconductor integrated circuit 50 can be constituted by at least one of GaAs, SiGe, and GaN. Thus, a high-quality semiconductor integrated circuit 50 can be realized.

[0072] The main surface 91b is sometimes referred to as the lower surface or the back surface. Multiple external connection terminals 150 are configured on the main surface 91b.

[0073] Multiple external connection terminals 150 Figure 1 In addition to the antenna connection terminal 100, transmit input terminal 110, and receive output terminal 120 shown, a ground terminal 150g is also included. Each of the plurality of external connection terminals 150 is connected to an input / output terminal and / or a ground terminal, etc., disposed on the mother substrate on the negative z-axis side of the high-frequency module 1. The plurality of external connection terminals 150 may be, for example, planar electrodes formed on the main surface 91b, but may also be bump electrodes. Alternatively, the plurality of external connection terminals 150 may also be pillar electrodes penetrating the resin member covering the main surface 91b.

[0074] The resin component 92 is disposed on and covers the main surface 91a of the module substrate 91. Specifically, the resin component 92 is configured to cover the side surfaces and top surfaces of each component disposed on the main surface 91a. For example, the resin component 92 covers the top surfaces and side surfaces of the power amplifier 10, circuit components 31 and 41, semiconductor integrated circuit 50, and other circuit components. In addition, the resin component 92 covers the side surfaces of the metal shielding plate 70.

[0075] A metal shielding layer 95 covers at least the upper surface 92a of the resin component 92. Specifically, the metal shielding layer 95 contacts and covers both the upper surface 92a and the side surface of the resin component 92. Furthermore, the metal shielding layer 95 contacts and covers the upper end face 70a of the metal shielding plate 70. The metal shielding layer 95 is, for example, a thin metal film formed by sputtering. The metal shielding layer 95 is set to a ground potential to suppress external noise from intruding into the circuit components constituting the high-frequency module 1.

[0076] The metal shielding plate 70 is a metal wall that is erected from the main surface 91a toward the upper surface 92a of the resin member 92. The metal shielding plate 70 is, for example, a flat plate with a given thickness. The metal shielding plate 70 is connected to the grounding electrode of the main surface 91a and the metal shielding layer 95. That is, the metal shielding plate 70 is connected to the ground at at least two points on the upper end surface 70a and the lower end surface 70b, thus enhancing the electromagnetic field shielding function (shielding function). Additionally, the metal shielding plate 70 can also be... Figure 2 At least one of the side end faces of the two ends in the y-axis direction shown is in contact with the metal shielding layer 95. For a detailed description of the metal shielding plate 70, please refer to... Figures 6A-6C To be described later.

[0077] When viewed from above, the metal shielding plate 70 divides the main surface 91a into region P and region Q. For example... Figure 2As shown, the power amplifier 10 and the circuit component 31 are arranged in a region P of the main surface 91a. The region P is mainly arranged with the circuit components arranged in the transmission path AT. Further, the low noise amplifier 20 and the circuit component 41 are arranged in a region Q of the main surface 91a. The region Q is mainly arranged with the circuit components arranged in the reception path AR.

[0078] Further, although not shown in FIG. 1, the circuit components 31 and 41 are arranged in the high frequency module 1. The circuit components 31 and 41 are arranged in the high frequency module 1 in a manner that the circuit components 31 and 41 are separated by the metal shield plate 70. Figure 2 Figure 1 The wirings of the transmission path AT and the reception path AR shown in FIG. 1 are formed in the inside of the module substrate 91, the main surfaces 91a and 91b. Further, the above-mentioned wirings can be bonding wires whose both ends are bonded to the main surfaces 91a and 91b and any of the circuit components included in the high frequency module 1, and further can be terminals, electrodes or wirings formed on the surfaces of the circuit components constituting the high frequency module 1.

[0079] The metal shield plate 70 is arranged between the circuit component 31 and the circuit component 41. By this, the circuit component 31 arranged in the transmission path AT and the circuit component 41 arranged in the reception path AR are arranged with the metal shield plate 70 set to the ground potential interposed therebetween, and thus the electromagnetic field coupling of the circuit component 31 and the circuit component 41 can be suppressed. In a case where the circuit component 31 arranged in the transmission path AT and the circuit component 41 arranged in the reception path AR are electromagnetically coupled, sometimes the high output transmission signal amplified by the power amplifier 10 and a harmonic component thereof flow into the reception path AR, and thus the reception sensitivity deteriorates. By suppressing the electromagnetic field coupling with the metal shield plate 70, the isolation between the transmission and the reception can be improved, and the deterioration of the reception sensitivity can be suppressed.

[0080] Further, the circuit components 31 and 41 arranged separately by the metal shield plate 70 can be components arranged in the transmission path AT and the reception path, respectively. In a case where the circuit component 31 arranged in the transmission path AT and the circuit component 41 arranged in the reception path are electromagnetically coupled, sometimes the harmonic component amplified by the power amplifier 10 is transmitted from the antenna 2 without being removed by a filter or the like, and the quality of the transmission signal deteriorates. By suppressing the electromagnetic field coupling with the metal shield plate 70, the deterioration of the quality of the transmission signal can be suppressed.

[0081] ​Further, the circuit components 31 and 41 which are arranged separately by the metal shield plate 70 can be components arranged in the reception path AR and the transceiving path, respectively. In a case where the circuit component 31 arranged in the reception path AR and the circuit component 41 arranged in the transceiving path are electromagnetically coupled, sometimes a high-output transmission signal amplified by the power amplifier 10 and a harmonic component thereof flow into the reception path AR, and thus reception sensitivity is deteriorated. By suppressing electromagnetic coupling by using the metal shield plate 70, it is possible to improve isolation between the transceiving paths, and it is possible to suppress deterioration of reception sensitivity.

[0082] After the high-frequency module 1 arranges the circuit components and the metal shield plate 70 on the main surface 91a of the module substrate 91, for example, the high-frequency module 1 molds the entire circuit components, the metal shield plate 70, and the main surface 91a with a liquid resin. At this time, the liquid resin can also cover the upper end surface 70a of the metal shield plate 70. After the liquid resin is cured, the cured resin is polished. At this time, the metal shield plate 70 can also be polished at the same time. Thus, the upper end surface 70a of the metal shield plate 70 and the upper surface 92a of the resin member 92 can be made flush.

[0083] Then, after the imprint portion 80 is formed on the upper surface 92a of the resin member 92, a metal film is formed by sputtering so as to cover the upper surface 92a and the side surface of the resin member 92. Thus, the metal shield layer 95 is formed. Since the upper end surface 70a of the metal shield plate 70 is exposed from the resin member 92, the metal shield layer 95 and the upper end surface 70a can be brought into contact with each other. Thus, the potential of the metal shield layer 95 and the potential of the metal shield plate 70 can be made the same.

[0084] [3. Imprint Portion]

[0085] Next, the imprint portion 80 provided in the high-frequency module 1 will be described. Figure 4 The imprint portion 80 provided in the high-frequency module 1 will be described.

[0086] Figure 4 is a plan view showing the imprint portion 80 of the high-frequency module 1 according to the present embodiment. Specifically, Figure 4 shows a cross section of the upper surface 92a of the resin member 92 and the metal shield layer 95 at the same position as the upper surface 92a in the z-axis direction. Further, in Figure 4 , the circuit components shown in Figure 3 are indicated by broken lines.

[0087] The imprint portion 80 shows given information about the high-frequency module 1. The given information is a model number of the high-frequency module 1, a lot number at the time of manufacture, and / or a manufacturer name, and the like. The imprint portion 80 includes a character, a figure, or a symbol. The character is a letter or a number, but can also be a hiragana, a katakana, or a Chinese character, and the like. In Figure 4In the illustrated example, the engraved portion 80 contains the six characters "ABCDEF".

[0088] The engraved portion 80 is formed by a groove and / or a recess provided in the upper surface 92a of the resin member 92. For example, the engraved portion 80 is a plurality of grooves formed along the lines of the characters. The engraved portion 80 is formed, for example, by shaving a portion of the resin member 92 by irradiating laser light to the upper surface 92a of the resin member 92. Alternatively, the engraved portion 80 can be characters (protrusions) that appear by shaving a portion other than the lines of the characters.

[0089] In the present embodiment, the metal shielding layer 95 is provided so as to cover the engraved portion 80. The depth of the groove and / or the recess that forms the engraved portion 80 is longer than the thickness of the metal shielding layer 95. The metal shielding layer 95 is formed in a uniform film thickness so as to follow the uneven shape of the engraved portion 80. Thus, an unevenness equivalent to that of the engraved portion 80 is formed in the surface (upper surface) of the metal shielding layer 95. Thereby, the engraved portion 80 can be visually recognized from the outside even though it is covered with the metal shielding layer 95.

[0090] The engraved portion 80 does not overlap at least the upper end surface 70a of the metal shielding plate 70 in the plan view of the main surface 91a. The engraved portion 80 is provided so as to avoid the metal shielding plate 70.

[0091] Specifically, as Figure 4 illustrated, the engraved portion 80 contains a first portion 81 and a second portion 82. The first portion 81 and the second portion 82 sandwich the metal shielding plate 70 in the plan view. The first portion 81 contains the three characters "ABC". The second portion 82 contains the three characters "DEF". By combining the first portion 81 and the second portion 82 together, one information (for example, a model number) is expressed.

[0092] Alternatively, at least one of the first portion 81 and the second portion 82 can not be characters, or can contain a figure or a symbol instead of characters.

[0093] In the case where the engraved portion 80 overlaps the metal shielding plate 70 in the plan view, the visual recognition of the engraved portion 80 deteriorates. This is mainly due to the difference in material between the metal shielding plate 70 and the resin member 92. Due to the difference in material, the depth of the groove and / or the recess formed by laser light is different between the metal shielding plate 70 and the resin member 92. Specifically, the groove and / or the recess formed in the metal shielding plate 70 is shallower than the groove and / or the recess formed in the resin member 92. Thus, the visual recognition of the groove and / or the recess formed in the metal shielding plate 70 deteriorates, and thus a situation where the correct characters cannot be grasped can occur.

[0094] In the high-frequency module 1 according to the embodiment, the engraved portion 80 is provided so as not to overlap the upper end surface 70a of the metal shield plate 70. Specifically, the entire engraved portion 80 is provided in the resin member 92, and thus the depth of the groove and / or the recess can be suppressed from being uneven, and the visibility of the engraved portion 80 can be improved.

[0095] In addition, the engraved portion 80 can include a two-dimensional code.

[0096] Figure 5 is a plan view of an engraved portion 80A of a high-frequency module 1A according to a modification of the embodiment. The engraved portion 80A can include a QR code (registered trademark) as one example of a two-dimensional code. The QR code indicates, for example, a URL (Uniform Resource Locator) or the like, and the URL shows a Web page that presents information related to the high-frequency module 1A.

[0097] The engraved portion 80A is provided in a region Q divided by the metal shield plate 70 so as not to overlap the upper end surface 70a of the metal shield plate 70 in a plan view. In addition, the engraved portion 80A can be provided in the region P.

[0098] [4. Configuration of metal shield plate]

[0099] Next, the configuration of the metal shield plate 70 of the high-frequency module 1 according to the embodiment will be described. Figures 6A-6F The configuration of the metal shield plate 70 of the high-frequency module 1 according to the embodiment will be described.

[0100] Figure 6A is an appearance perspective view of a metal shield plate 70A. The metal shield plate 70A is one example of the metal shield plate 70 according to the embodiment. The metal shield plate 70A is vertically erected from a main surface 91a (not shown) toward an upper surface 92a of a resin member 92 (not shown). In the metal shield plate 70A, a through-hole 72A that penetrates in a direction parallel to the main surface 91a is provided.

[0101] The through-hole 72A has a shape that is cut from a lower end surface 70b toward an upper end surface 70a of the metal shield plate 70A. In the metal shield plate 70A, a plurality of through-holes 72A are provided. The plurality of through-holes 72A are arranged at equal intervals along the y-axis direction, but the intervals can be arbitrary. The shapes and sizes of the plurality of through-holes 72A can be the same as or different from each other. In addition, in the metal shield plate 70A, only one through-hole 72A can be provided.

[0102] Further, the metal shield plate 70A has a main body portion 71A which is vertically erected from the main surface 91a toward the upper surface 92a of the resin member 92, and an extension portion 73A which is provided so as to extend in parallel with the main surface 91a from a lower end portion of the main body portion 71A. The extension portion 73A is engaged with a ground electrode (not shown) on the main surface 91a. The extension portion 73A is divided into a plurality of portions which are discretely arranged along the y-axis direction. In addition, the extension portion 73A can also be one flat portion which is a long strip shape continuously along the y-axis direction, as described later. Figure 6B The extension portion 73B is engaged with a ground electrode (not shown) on the main surface 91a.

[0103] According to the configuration of the metal shield plate 70A, since the through hole 72A is provided between the main body portion 71A and the main surface 91a, in the process of forming the resin member 92 on the main surface 91a, the flowability of the liquid resin at the vicinity of the lower end portion of the metal shield plate 70A can be ensured. Thus, in the vicinity of the lower end portion of the metal shield plate 70A, the resin can be spread to each corner, and thus the generation of a gap or the like in which the resin member 92 is not formed can be suppressed.

[0104] Figure 6B is an appearance perspective view of a metal shield plate 70B. The metal shield plate 70B is one example of the metal shield plate 70 to which the embodiment is directed. The metal shield plate 70B is vertically erected from a main surface 91a (not shown) toward an upper surface 92a of a resin member 92 (not shown). In the metal shield plate 70B, a through hole 72B which penetrates in a direction parallel with the main surface 91a is provided.

[0105] The through hole 72B has a shape which is cut out from an upper end surface 70a toward a lower end surface 70b of the metal shield plate 70B. In the metal shield plate 70B, a plurality of through holes 72B are provided. The plurality of through holes 72B are discretely arranged at equal intervals along the y-axis direction, but the intervals can be arbitrary. The shapes and sizes of the plurality of through holes 72B can be the same as or different from each other. Further, in the metal shield plate 70B, only one through hole 72B can be provided.

[0106] Further, the metal shield plate 70B has a main body portion 71B which is vertically erected from the main surface 91a toward the upper surface 92a of the resin member 92, and an extension portion 73B which is provided so as to extend in parallel with the main surface 91a from a lower end portion of the main body portion 71B. The extension portion 73B is engaged with a ground electrode (not shown) on the main surface 91a.

[0107] According to the configuration of the metal shield plate 70B, since the through-hole 72B is provided between the main body portion 71B and the metal shield layer 95, in the process of forming the resin member 92 on the main surface 91a, the flowability of the liquid resin at the vicinity of the upper end portion of the metal shield plate 70B can be ensured. Thus, in the vicinity of the upper end portion of the metal shield plate 70B, the resin can spread to each corner, and thus the generation of a gap or the like in which the resin member 92 is not formed can be suppressed. Further, in the metal shield plate 70B, since the through-hole is not formed at the lower end portion of the main body portion 71B, the isolation between the circuit components arranged on the main surface 91a with the metal shield plate 70B interposed therebetween is improved.

[0108] Figure 6C is an appearance perspective view of a metal shield plate 70C. The metal shield plate 70C is one example of the metal shield plate 70 according to the embodiment. The metal shield plate 70C is vertically erected from the main surface 91a (not shown) toward the upper surface 92a of the resin member 92 (not shown). The metal shield plate 70C is formed with a through-hole 72C that penetrates in a direction parallel to the main surface 91a.

[0109] The through-hole 72C has a shape cut out from the upper end surface 70a to the lower end surface 70b of the metal shield plate 70C. The metal shield plate 70C is provided with a plurality of through-holes 72C. The plurality of through-holes 72C are arranged at equal intervals along the y-axis direction, but the intervals can be arbitrary. The shapes and sizes of the plurality of through-holes 72C can be the same as or different from each other. In addition, the metal shield plate 70C can be provided with only one through-hole 72C.

[0110] In addition, the metal shield plate 70C has a main body portion 71C vertically erected from the main surface 91a toward the upper surface 92a of the resin member 92, and an extension portion 73C extending from the lower end portion of the main body portion 71C in parallel to the main surface 91a. The extension portion 73C is engaged with a ground electrode (not shown) on the main surface 91a. The main body portion 71C and the extension portion 73C are each divided into a plurality of portions arranged discretely along the y-axis direction. Alternatively, the extension portion 73C can be one flat portion in a long strip shape continuously along the y-axis direction, like the extension portion 73B shown in Figure 6B

[0111] According to the configuration of the metal shield plate 70C, since the through-hole 72C is provided continuously from the main surface 91a to the metal shield layer 95, in the process of forming the resin member 92 on the main surface 91a, the flowability of the liquid resin at the vicinity of the metal shield plate 70C can be ensured. Thus, in the vicinity of the metal shield plate 70C, the resin can spread to each corner, and thus the generation of a gap or the like in which the resin member 92 is not formed can be suppressed.

[0112] ​Figure 6D is an appearance perspective view of a metal shield plate 70D. The metal shield plate 70D shown in this drawing is one example of the metal shield plate 70 to which the embodiment relates. The metal shield plate 70D is erected from a main surface 91a (not shown) toward an upper surface 92a (in the z-axis direction) of a resin member 92 (not shown). A through-hole 72D that penetrates in the normal line direction (x-axis direction) of the metal shield plate 70D is formed between the metal shield plate 70D and the main surface 91a.

[0113] Further, the metal shield plate 70D has a flat plate-shaped main body portion 71D that is erected from the main surface 91a toward the upper surface 92a (in the z-axis direction) of the resin member 92 and that is engaged with a ground electrode (not shown) on the main surface 91a, and a flat plate-shaped main body end portion 77D that is disposed at an end portion of the main body portion 71D in a direction parallel to the main surface 91a and that is erected from the main surface 91a toward the upper surface 92a (in the z-axis direction) of the resin member 92. Here, the main body portion 71D and the main body end portion 77D are not parallel.

[0114] According to the configuration of the metal shield plate 70D, since the through-hole 72D is formed between the main body portion 71D and the main surface 91a, it is possible to ensure good flowability of the liquid resin at the vicinity of the metal shield plate 70D in the process of forming the resin member 92 on the main surface 91a. Thus, it is possible to suppress the generation of voids and the like in which the resin member 92 is not formed at the vicinity of the metal shield plate 70D. Further, since the main body portion 71D and the main body end portion 77D are not parallel, it is possible to ensure the self-standing property of the metal shield plate 70D on the main surface 91a. Further, since there are no extensionally disposed portions 73A to 73C as in the metal shield plates 70A to 70C, it is possible to reduce the disposition space of the metal shield plate 70D.

[0115] Figure 6E is an appearance perspective view of a metal shield plate 70E. The metal shield plate 70E shown in this drawing is one example of the metal shield plate 70 to which the embodiment relates. The metal shield plate 70E is erected from a main surface 91a (not shown) toward an upper surface 92a (in the z-axis direction) of a resin member 92 (not shown). A through-hole 72E that penetrates in the normal line direction (x-axis direction) of the metal shield plate 70E is formed between the metal shield plate 70E and the upper surface 92a of the resin member 92.

[0116] Further, the metal shield plate 70E has a flat plate-shaped main body portion 71E which is erected from the main surface 91a toward the upper surface 92a (in the z-axis direction) of the resin member 92 and which is joined to a ground electrode (not shown) on the main surface 91a, and a flat plate-shaped main body end portion 77E which is disposed at an end portion of the main body portion 71E in a direction parallel to the main surface 91a and which is erected from the main surface 91a toward the upper surface 92a (in the z-axis direction) of the resin member 92. Here, the main body portion 71E and the main body end portion 77E are not parallel.

[0117] According to the configuration of the metal shield plate 70E, since the through hole 72E is formed between the main body portion 71E and the upper surface 92a, in a process of forming the resin member 92 on the main surface 91a, it is possible to ensure good flowability of the liquid resin at the vicinity of the metal shield plate 70E. Thus, it is possible to suppress generation of voids and the like in which the resin member 92 is not formed at the vicinity of the metal shield plate 70E. Further, since the through hole 72E is not formed in a region which is in contact with the main surface 91a (a lower region of the main body portion 71E), isolation between circuit components disposed on the main surface 91a through the metal shield plate 70E is improved. Further, since the main body portion 71E and the main body end portion 77E are not parallel, it is possible to ensure self-standing of the metal shield plate 70E on the main surface 91a. Further, since the metal shield plate 70E does not have the extension portions 73A to 73C which the metal shield plates 70A to 70C have, it is possible to reduce the disposition space of the metal shield plate 70E.

[0118] Figure 6F is an external perspective view of the metal shield plate 70F. The metal shield plate 70F shown in this drawing is one example of the metal shield plate 70 to which the embodiment is directed. The metal shield plate 70F is erected from a main surface 91a (not shown) toward an upper surface 92a (in the z-axis direction) of a resin member 92 (not shown). A through hole 72F which penetrates in a normal direction (x-axis direction) of the metal shield plate 70F is formed between the main surface 91a and the upper surface 92a of the resin member 92.

[0119] Further, the metal shield plate 70F has a flat plate-shaped main body portion 71F which is erected from the main surface 91a toward the upper surface 92a (in the z-axis direction) of the resin member 92 and which is joined to a ground electrode (not shown) on the main surface 91a, and a flat plate-shaped main body end portion 77F which is disposed at an end portion of the main body portion 71F in a direction parallel to the main surface 91a and which is erected from the main surface 91a toward the upper surface 92a (in the z-axis direction) of the resin member 92. Here, the main body portion 71F and the main body end portion 77F are not parallel.

[0120] According to the configuration of the metal shield plate 70F, since the through-hole 72F is formed between the main surface 91a and the upper surface 92a, the flowability of the liquid resin at the vicinity of the metal shield plate 70F can be ensured in the process of forming the resin member 92 on the main surface 91a. Thus, the generation of a gap or the like in which the resin member 92 is not formed can be suppressed at the vicinity of the metal shield plate 70F. Further, since the body portion 71F and the body end portion 77F are not parallel, the self-standing property of the metal shield plate 70F on the main surface 91a can be ensured. Further, since the metal shield plate 70F does not have the extension portions 73A to 73C which the metal shield plates 70A to 70C have, the arrangement space of the metal shield plate 70F can be reduced.

[0121] Further, the configuration example of the metal shield plate 70 is not limited to the metal shield plates 70A to 70F described above. For example, the through-hole can also penetrate the center of the body portion, and not reach either of the upper end surface 70a and the lower end surface 70b. Further, a plurality of such through-holes can also be arranged from the upper end surface 70a to the lower end surface 70b. Further, the direction in which the extension portion is extended is not limited to the negative direction of the x-axis as shown in FIG. 10, but can also be the positive direction of the x-axis. The metal shield plate 70 can also have an extension portion which is extended to both sides of the negative direction and the positive direction of the x-axis. Further, the direction in which the body end portion is extended is not limited to the negative direction of the x-axis as shown in FIG. 10, but can also be the positive direction of the x-axis. Further, the metal shield plate 70 can also have a body end portion which is extended to the negative direction of the x-axis and a body end portion which is extended to the positive direction of the x-axis. Figures 6A-6C Figures 6D-6F Further, the direction in which the extension portion is extended is not limited to the negative direction of the x-axis as shown in FIG. 10, but can also be the positive direction of the x-axis. The metal shield plate 70 can also have an extension portion which is extended to both sides of the negative direction and the positive direction of the x-axis. Further, the direction in which the body end portion is extended is not limited to the negative direction of the x-axis as shown in FIG. 10, but can also be the positive direction of the x-axis. Further, the metal shield plate 70 can also have a body end portion which is extended to the negative direction of the x-axis and a body end portion which is extended to the positive direction of the x-axis.

[0122] [5. Effects and the like]

[0123] As described above, the high-frequency module 1 according to the present embodiment includes the module substrate 91 having the main surface 91a, the circuit components 31 and 41 arranged on the main surface 91a, the resin member 92 covering at least a part of the main surface 91a and the circuit components 31 and 41, the metal shield layer 95 covering at least the upper surface 92a of the resin member 92, and the metal shield plate 70 arranged on the main surface 91a and between the circuit component 31 and the circuit component 41 when viewed from the main surface 91a. The metal shield plate 70 is in contact with the metal shield layer 95. The imprint portion 80 showing given information is provided on the upper surface 92a of the resin member 92. The imprint portion 80 does not overlap at least the upper end surface 70a of the metal shield plate 70 when viewed from the main surface 91a.

[0124] Thus, the electromagnetic field coupling between the circuit component 31 and the circuit component 41 can be suppressed by the metal shield plate 70. Therefore, the winding of the transmission signal and the harmonic component thereof caused by the electromagnetic field coupling can be suppressed, and the degradation of the quality of the transmission signal or the reception signal can be suppressed. ​

[0125] Further, in a case where the engraved portion 80 overlaps the upper end surface 70a of the metal shield plate 70, the depth of the groove and / or the recess becomes shallow in the overlapped portion, and thus the visual recognition of the engraved portion 80 deteriorates. In contrast, in the high-frequency module 1, the engraved portion 80 does not overlap the upper end surface 70a of the metal shield plate 70, and thus the visual recognition of the engraved portion 80 can be improved.

[0126] As such, the high-frequency module 1 that can suppress deterioration of the quality of the transmission signal or the reception signal and has high visual recognition of the engraving can be realized.

[0127] Further, for example, the engraved portion 80 includes a character, a figure, a symbol, or a two-dimensional code.

[0128] Thus, a given information can be easily notified to a person by the character or the like. Further, by using the two-dimensional code, more information can be notified to the person.

[0129] Further, for example, the engraved portion 80 includes a first portion 81 and a second portion 82 that are arranged with the metal shield plate 70 interposed therebetween in a case where the main surface 91a is viewed in plan. The first portion 81 and the second portion 82 each include a character, a figure, a symbol, or a two-dimensional code.

[0130] As the high-frequency module 1 is downsized, the area in which the engraved portion 80 can be arranged becomes smaller. According to the high-frequency module 1 related to the present embodiment, by dividing the engraved portion 80 into two portions, it is possible to record necessary information in the high-frequency module 1 while ensuring visual recognition.

[0131] Further, for example, the circuit component 31 is arranged in any one of a transmission path AT that transmits a transmission signal, a reception path AR that transmits a reception signal, and a transceiving path that transmits the transmission signal and the reception signal, and the circuit component 41 is arranged in a path other than the path in which the circuit component 31 is arranged among the transmission path AT, the reception path AR, and the transceiving path.

[0132] Thus, the electromagnetic field coupling between the circuit component 31 and the circuit component 41 can be suppressed by the metal shield plate 70. Therefore, the winding of the transmission signal and a harmonic component thereof caused by the electromagnetic field coupling can be suppressed, and deterioration of the quality of the transmission signal or the reception signal can be suppressed. For example, in a case where the circuit component 31 is arranged in the transmission path AT and the circuit component 41 is arranged in the reception path AR, the isolation between the transmission and the reception can be improved.

[0133] Further, for example, the upper end surface 70a of the metal shield plate 70 is flush with the upper surface 92a of the resin member 92.

[0134] Thus, the metal shielding layer 95 can smoothly cover the upper end surface 70a of the metal shielding plate 70 and the upper surface 92a of the resin member 92 without steps. The metal shielding layer 95 can be formed with reduced irregularities, uniform film thickness, and high shielding effect.

[0135] Further, for example, the metal shielding plate 70 is provided with a through-hole 72A, 72B, or 72C that penetrates in a direction parallel to the main surface 91a.

[0136] Thus, the liquid resin can flow through the through-hole, and therefore the resin can spread to every corner in the vicinity of the metal shielding plate 70, and thus generation of gaps and the like in which the resin member 92 is not formed can be suppressed.

[0137] Further, for example, the through-hole 72A has a shape that is cut away from the lower end surface 70b of the metal shielding plate 70 toward the upper end surface 70a.

[0138] Thus, in the vicinity of the lower end of the metal shielding plate 70, the resin can spread to every corner, and thus generation of gaps and the like in which the resin member 92 is not formed can be suppressed.

[0139] Further, for example, the through-hole 72B has a shape that is cut away from the upper end surface 70a of the metal shielding plate 70 toward the lower end surface 70b.

[0140] Thus, in the vicinity of the upper end of the metal shielding plate 70, the resin can spread to every corner, and thus generation of gaps and the like in which the resin member 92 is not formed can be suppressed.

[0141] Further, for example, the metal shielding plate 70 can have a main body portion 71A, 71B, or 71C that is provided upright with respect to the main surface 91a, and an extension portion 73A, 73B, or 73C that is provided extending parallel to the main surface 91a from the lower end of the main body portion 71A, 71B, or 71C. The extension portion 73A, 73B, or 73C is engaged with the ground electrode provided on the main surface 91a.

[0142] Thus, the connection of the metal shielding plate 70 and the main surface 91a of the module substrate 91 can be stabilized. For example, when molding is performed using a liquid resin, the metal shielding plate 70 can be less likely to tilt. Further, the contact area with the ground electrode provided on the main surface 91a can be increased, and thus grounding of the metal shielding plate 70 can be strengthened. Thus, the shielding function of the metal shielding plate 70 can be improved.

[0143] Further, the metal shield plate 70 can also have a main body portion 71D, 71E, or 71F that engages with the ground electrode provided on the main surface 91a and is provided upright on the main surface 91a, and a flat plate-shaped main body end portion 77D, 77E, or 77F that is provided upright on an end portion of the main body portion 71D, 71E, or 71F in a direction parallel to the main surface 91a and from the main surface 91a toward the upper surface 92a of the resin member 92. The main body portion 71D, 71E, or 71F and the main body end portion 77D, 77E, or 77F can also not be parallel.

[0144] Thus, since the main body portion 71D, 71E, or 71F and the main body end portion 77D, 77E, or 77F are not parallel, the self-standing property of the metal shield plate 70 on the main surface 91a can be ensured. Further, since there are no extension portions 73A to 73C, the arrangement space of the metal shield plate 70 can be reduced.

[0145] Further, the communication device 5 according to the present embodiment has the RFIC 3 that processes high-frequency signals transmitted and received by the antenna 2, and the high-frequency module 1 that transmits high-frequency signals between the antenna 2 and the RFIC 3.

[0146] Thus, in the communication device 5, the same effects as the high-frequency module 1 can be obtained.

[0147] (Other)

[0148] The high-frequency module and the communication device according to the present application have been described above based on the above-described embodiments, but the present application is not limited to the above-described embodiments.

[0149] For example, in the high-frequency module according to the present embodiment, each circuit component that configures the high-frequency module is arranged on a single main surface 91a of the module substrate 91, but each circuit component can also be arranged separately on mutually opposing main surfaces 91a and 91b of the module substrate 91. That is, each circuit component that configures the high-frequency module 1 can be mounted on the module substrate 91 on one surface, and can also be mounted on the module substrate 91 on both surfaces.

[0150] Further, the engraved portion can also overlap with a portion other than the upper end surface of the metal shield plate in plan view. For example, the engraved portion can also overlap with the extension portion of the metal shield plate in plan view.

[0151] Further, for example, in the high-frequency module and the communication device according to the present embodiment, other circuit elements and wiring, etc. can also be inserted between paths that connect each circuit element and signal path disclosed in the drawings.

[0152] Besides, modes obtained by various modifications of the embodiments conceived by those skilled in the art, and modes realized by arbitrarily combining the constituent elements and functions in the embodiments within a range not departing from the gist of the present application are also included in the present application.

[0153] Industrial applicability

[0154] The present application can be widely used as a high frequency module provided in a front end section for coping with multiple frequency bands in a communication device such as a portable telephone.

[0155] Explanation of reference numerals

[0156] 1, 1A high frequency module

[0157] 2 antenna

[0158] 3 RFIC

[0159] 4 BBIC

[0160] 5 communication device

[0161] 10 power amplifier

[0162] 20 low noise amplifier

[0163] 30, 40 functional circuit

[0164] 31, 41 circuit component

[0165] 50 semiconductor integrated circuit

[0166] 70, 70A, 70B, 70C, 70D, 70E, 70F metal shield plate

[0167] 70a upper end surface

[0168] 70b lower end surface

[0169] 71A, 71B, 71C, 71D, 71E, 71F main body portion

[0170] 72A, 72B, 72C, 72D, 72E, 72F through hole

[0171] 73A, 73B, 73C extension setting portion

[0172] 77D, 77E, 77F main body end portion

[0173] 80, 80A engraved portion

[0174] 81 first portion

[0175] 82 second portion

[0176] 91 module substrate;

[0177] 91a, 91b main surface;

[0178] 92 resin member;

[0179] 92a upper surface;

[0180] 95 metal shield layer;

[0181] 100 antenna connection terminal;

[0182] 110 transmission input terminal;

[0183] 120 reception output terminal;

[0184] 150 external connection terminal;

[0185] 150g ground terminal.

Claims

1. A high-frequency module, comprising: The module substrate has a main surface; The first circuit component and the second circuit component are disposed on the main surface; A resin component covering at least a portion of the main surface, the first circuit component, and the second circuit component; A metal shielding layer covers at least the upper surface of the resin component; and A metal shielding plate is disposed on the main surface, and positioned between the first circuit component and the second circuit component when viewed from above the main surface. The metal shielding plate is in contact with the metal shielding layer. An engraving portion displaying given information is provided on the upper surface of the resin component. The etched portion is covered by the metal shielding layer, and the depth of the etched portion is greater than the thickness of the metal shielding layer. The engraved portion does not overlap with at least the upper surface of the metal shielding plate when viewed from above.

2. The high-frequency module according to claim 1, wherein, The engraved area includes text, graphics, symbols, or QR codes.

3. The high-frequency module according to claim 1 or 2, wherein, The engraving section includes a first part and a second part configured to sandwich the metal shielding plate in the middle when viewed from above the main surface. Each of the first and second parts contains text, graphics, symbols, or QR codes.

4. The high-frequency module according to claim 1 or 2, wherein, The first circuit component is configured in any of the transmission path for transmitting a signal, the reception path for transmitting a received signal, and the transmission and reception path for transmitting and receiving signals. The second circuit component is configured in any of the transmission path, the reception path, and the transceiver path, except for the path in which the first circuit component is configured.

5. The high-frequency module according to claim 1 or 2, wherein, The upper end face of the metal shielding plate is flush with the upper surface of the resin component.

6. The high-frequency module according to claim 1 or 2, wherein, The metal shielding plate is provided with a through hole that extends in a direction parallel to the main surface.

7. The high-frequency module according to claim 6, wherein, The through hole has a shape that is cut out from the lower end face of the metal shielding plate toward the upper end face.

8. The high-frequency module according to claim 6, wherein, The through hole has a shape that is cut out from the upper end face of the metal shielding plate toward the lower end face.

9. The high-frequency module according to claim 1 or 2, wherein, The metal shielding plate has the following characteristics: The main body is erected on the main surface; and The extension portion extends parallel to the main surface from the lower end of the main body portion. The extended portion engages with the grounding electrode disposed on the main surface.

10. The high-frequency module according to claim 1 or 2, wherein, The metal shielding plate has the following characteristics: The main body is connected to a grounding electrode disposed on the main surface and is erected on the main surface; and The flat, plate-shaped end portion is disposed at the end of the main body portion in a direction parallel to the main surface, and is erected from the main surface toward the upper surface of the resin member. The main body and the end of the main body are not parallel.

11. A communication device comprising: RF signal processing circuitry processes high-frequency signals transmitted and received by the antenna; and The high-frequency module according to any one of claims 1 to 10 transmits the high-frequency signal between the antenna and the RF signal processing circuit.

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