A cooling device and a cooling system for wire

Through the cooling monomer of the liquid mist buffer chamber and the blowing channel structure, the problem of rapid cooling after wire coating is solved, and the surface quality of wire and the production efficiency are improved.

CN116118153BActive Publication Date: 2025-07-18DONGGUAN KOSHEN INSULATION MATERIAL CO LTD
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Patent Information

Application Number
CN202111348400.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-15
Publication Date
2025-07-18
Estimated Expiration
2041-11-15

AI Technical Summary

Technical Problem

In the prior art, wires fail to cool effectively and quickly after extrusion and coating, resulting in bad qualities on the surface such as pits, pits, patterns, stripes and corrugations, which affect production efficiency and product quality.

Method used

A cooling device is adopted, including cooling monomers, gases and liquid mist generation devices, through the liquid mist buffer chamber and blowing channel structure, the liquid mist sublimation phase change absorption and gas flow accelerates the heat exchange on the surface of the wire, combining laminar flow and turbulent gas purge to achieve rapid cooling.

Benefits of technology

Effectively avoid liquid mist drops affecting surface quality, quickly reduce the temperature of wire plastic wrap layer, and improve product surface quality and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of cooling devices, and particularly relates to a cooling device and a cooling system for wire rods. The cooling device includes a cooling monomer, and a through-channel is provided on the cooling monomer. The wire rod passes through the channel. The cooling monomer includes a heat exchange cavity and a liquid mist buffer cavity. Through-channels are provided in both the heat exchange cavity and the liquid mist buffer cavity. An inlet for mist is provided on the side wall of the liquid mist buffer cavity, and an outlet for mist is provided at a position of the liquid mist buffer cavity close to the channel. The outlet for mist is communicated with the heat exchange cavity, and a collection baffle is provided in the mist outlet direction of the outlet for mist. An air extraction port is provided on the heat exchange cavity. By providing the liquid mist buffer cavity, liquid mist is introduced into the heat exchange cavity. During the sublimation phase change process of the liquid mist from liquid to gas, a large amount of heat is absorbed, accelerating the heat exchange of the gas in contact with the surface of the wire rod plastic coating. The wire rod is directly cooled, making the surface quality of the wire rod plastic coating better.
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Description

Technical Field

[0001] The present invention relates to the technical field of cooling devices, and particularly to a cooling device and a cooling system for wire. Background Art

[0002] When performing outer extrusion coating on wire products, generally in the process, after the plastic material is plasticized by an extruder, it is coated around the required wire in a high-temperature molten state, and then cooled and crystallized to form a coating layer on the outer layer of the wire. At this time, the plasticizing and melting temperature of general plastics is above 200 degrees, and some even reach 350 degrees. If there is no good cooling means to quickly cool the surface of the wire coming out of the extrusion die orifice, it will inevitably affect the running length of the wire and the production speed, which is not conducive to the long-term operation of the production equipment and the effective improvement of production efficiency. At the same time, the too long cooling length and time also increase the jitter state of the non-crystalline state of the wire coating surface during dynamic operation, as well as the chance of contact with the surrounding abnormal environment, thereby resulting in a reduction in the quality of the wire coating.

[0003] Generally speaking, the generally effective cooling means is to transfer heat through a liquid cooling medium. However, since the surface temperature of the wire coming out of the extrusion die orifice is still around 200 degrees, if it directly contacts the liquid cooling medium at this time, it is extremely easy to cause poor quality on the surface of the plastic-coated wire due to the occurrence of liquid gasification and explosion in the local area where the wire surface contacts, such as pits, pockmarks, and patterns. In addition, at this time, the plastic-coated surface has not yet crystallized and solidified enough, and it is also extremely easy to pass through the liquid cooling medium, resulting in surface liquid damping marks, such as stripes and ripples, resulting in poor quality on the surface of the plastic-coated wire. Summary of the Invention

[0004] The purpose of the present invention is to provide a cooling device and a cooling system for wire to solve the problems in the above background art.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is to provide a cooling device for wire, including a cooling monomer. A through channel is provided on the cooling monomer, and the wire passes through the channel. The cooling monomer includes a heat exchange cavity and a liquid mist buffer cavity. The heat exchange cavity and the liquid mist buffer cavity are both provided with the through channel. An inlet for mist is provided on the side wall of the liquid mist buffer cavity, and an outlet for mist is provided at a position of the liquid mist buffer cavity close to the channel. The outlet for mist is communicated with the heat exchange cavity. A collection baffle is provided in the mist outlet direction of the outlet for mist, and an air extraction port is provided on the heat exchange cavity.

[0006] Furthermore, the cooling unit further includes an intake buffer cavity and a laminar flow pulsation cavity. The intake buffer cavity, the heat exchange cavity, the liquid mist buffer cavity, and the laminar flow pulsation cavity are arranged in sequence. The intake buffer cavity and the laminar flow pulsation cavity are both connected to the heat exchange cavity, and intake ports are provided on both the intake buffer cavity and the laminar flow pulsation cavity.

[0007] Furthermore, a baffle is provided between the intake buffer cavity and the heat exchange cavity, and through holes communicating the intake buffer cavity and the heat exchange cavity are provided on the baffle.

[0008] Furthermore, the through hole includes a first blowing channel, and the included angle between the extending direction of the first blowing channel and the wire direction is smaller than the included angle between the extending direction of the mist outlet and the wire.

[0009] Furthermore, the through hole further includes a second blowing channel. The second blowing channel is located on one side of the first blowing channel and is set away from the wire, and the extending direction of the second blowing channel is parallel to the wire direction.

[0010] Furthermore, the laminar flow pulsation cavity is connected to the heat exchange cavity through a laminar flow channel, and the extending direction of the laminar flow channel forms an angle of 5 - 10° with the wire direction.

[0011] Furthermore, the effective area of the channel of the air extraction port is larger than the sum of the channel areas of the intake port and the mist inlet.

[0012] Furthermore, a boss is provided at the head of the cooling unit, and a guiding port is provided at the tail. A plurality of the cooling units are connected end to end to form the cooling device.

[0013] Furthermore, the present application also provides a cooling system for a wire, which is characterized in that it includes:

[0014] The above-mentioned cooling device;

[0015] A gas generation device, including an air compressor pump, an air compressor tank, and a connecting pipeline connected to each other. The connecting pipeline includes a first branch and a second branch. The first branch is connected to the intake port of the intake buffer cavity through a first control valve, and the second branch is connected to the laminar flow pulsation cavity through a second control valve;

[0016] A mist liquid generation device, including a liquid tank, a liquid pump, and an atomizer connected in sequence. The atomizer is connected to the mist inlet.

[0017] Furthermore, the cooling system for a wire further includes a liquid recovery device. The liquid recovery device includes a condenser. An air extraction pump for accelerating gas flow is connected to the air extraction port. One end of the condenser is connected to the air extraction pump, and the other end is connected to the liquid tank.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The side wall of the liquid mist buffer cavity is provided with a mist inlet, and the position of the liquid mist buffer cavity close to the channel is provided with a mist outlet, and the mist outlet is communicated with the heat exchange cavity. By setting the liquid mist buffer cavity, the liquid mist is introduced into the heat exchange cavity. During the sublimation phase change process of the liquid mist from liquid to gas, a large amount of heat is absorbed, accelerating the heat exchange of the gas in contact with the surface of the wire coating. The wire is directly cooled, making the surface quality of the wire coating better. At the same time, a collection baffle is provided in the mist outlet direction of the mist outlet, which can preliminarily intercept and collect the liquid mist with larger particles to avoid it dripping onto the surface of the wire coating and affecting the surface quality of the wire.

[0020] 2. A baffle is provided between the air inlet buffer cavity and the heat exchange cavity, and a through hole communicating the air inlet buffer cavity and the heat exchange cavity is provided on the baffle. The through hole includes a first blowing channel, and the included angle between the extending direction of the first blowing channel and the wire direction is smaller than the included angle between the extending direction of the mist outlet and the wire. With the above structural setting, the gas blown out by the first blowing channel can be located below the mist, quickly lift and blow out the mist that has completed heat exchange, accelerate the gas flow, and is conducive to the rapid cooling of the wire coating surface.

[0021] 3. The through hole further includes a second blowing channel, the second blowing channel is located on one side of the first blowing channel and is arranged away from the wire, and the extending direction of the second blowing channel is parallel to the wire direction. With the above structural setting, the gas blown into by the second blowing channel just quickly blows the vaporized water mist, making it quickly discharged from the air extraction port.

[0022] 4. The laminar flow pulsation cavity is communicated with the heat exchange cavity through a laminar flow channel, and the extending direction of the laminar flow channel forms an angle of 5 - 10° with the wire direction. With the above structure, the gas can blow and cool close to the surface of the wire coating, and at the same time, it can effectively avoid directly blowing and impacting the surface of the wire coating, ensuring the quality of the wire coating surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a schematic three-dimensional structure diagram of the cooling device provided in Embodiment 1 of the present invention;

[0025] Figure 2Perspective view of the internal structure of the cooling device provided in Embodiment 1 of the present invention;

[0026] Figure 3 Schematic diagram of the internal structure of the cooling device provided in Embodiment 1 of the present invention, where the arrow indicates the gas flow direction;

[0027] Figure 4 Schematic three-dimensional structure diagram of the liquid mist buffer cavity used in the cooling device provided in Embodiment 1 of the present invention;

[0028] Figure 5 Schematic three-dimensional structure diagram of the heat exchange cavity used in the cooling device provided in Embodiment 1 of the present invention;

[0029] Figure 6 Schematic three-dimensional structure diagram of the plugging plate body used in the cooling device provided in Embodiment 1 of the present invention;

[0030] Figure 7 Schematic diagram of the overall structure of the cooling system provided in Embodiment 2 of the present invention.

[0031] Description of reference numerals:

[0032] 1. Cooling monomer; 11. Heat exchange cavity; 111. Air extraction port; 12. Liquid mist buffer cavity; 121. Mist inlet; 122. Mist outlet; 123. Collection baffle; 13. Air intake buffer cavity; 14. Laminar flow pulsation cavity; 141. Laminar flow channel; 142. Plugging plate body; 143. Guide sleeve; 15. Mounting plate; 151. Laminar flow blowing port; 152. Turbulent flow blowing port; 153. Gasification blowing port; 16. Boss; 17. Guide port; 18. Air inlet; 2. Gas generation device; 21. Air compressor pump; 22. Air compressor tank; 23. Connecting pipeline; 231. First branch; 232. Second branch; 233. First control valve; 234. Second control valve; 3. Mist liquid generation device; 31. Liquid tank; 32. Liquid pump; 33. Atomizer; 4. Exhaust pump; 5. Liquid recovery device; 51. Condenser; 6. Controller; 7. Wire. Detailed implementation manners

[0033] Next, the technical solutions of the present invention will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0036] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0037] Embodiment 1

[0038] As a cooling device for wire provided in an embodiment of the present invention, it includes a cooling monomer 1. A through channel is provided on the cooling monomer 1, and the wire 7 passes through the channel. The cooling monomer 1 includes a heat exchange cavity 11 and a liquid mist buffer cavity 12. Through channels are provided in both the heat exchange cavity 11 and the liquid mist buffer cavity 12. An inlet mist port 121 is provided on the side wall of the liquid mist buffer cavity 12, and an outlet mist port 122 is provided at a position of the liquid mist buffer cavity 12 close to the channel. The outlet mist port 122 is communicated with the heat exchange cavity 11. A collection baffle 123 is provided in the mist outlet direction of the outlet mist port 122, and an air extraction port 111 is provided on the heat exchange cavity 11. By providing the liquid mist buffer cavity 12 and introducing liquid mist into the heat exchange cavity to directly cool and lower the temperature of the wire 7, the surface quality of the wire 7 with plastic coating is made better. At the same time, a collection baffle 123 is provided in the mist outlet direction of the outlet mist port 122, which can preliminarily intercept and collect the liquid mist with larger particles to prevent it from dripping onto the surface of the wire 7 with plastic coating and affecting the surface quality of the wire 7.

[0039] Specifically, the cooling unit 1 further includes an intake buffer cavity 13 and a laminar flow pulsation cavity 14. The intake buffer cavity 13, the heat exchange cavity 11, the liquid mist buffer cavity 12, and the laminar flow pulsation cavity 14 are arranged in sequence. Both the intake buffer cavity 13 and the laminar flow pulsation cavity 14 are connected to the heat exchange cavity 11, and intake ports 18 are provided on both the intake buffer cavity 13 and the laminar flow pulsation cavity 14. A baffle is provided between the intake buffer cavity 13 and the heat exchange cavity 11, and a through hole communicating the intake buffer cavity 13 and the heat exchange cavity 11 is provided on the baffle. The through hole includes a first blowing channel, and the included angle between the extending direction of the first blowing channel and the running direction of the wire 7 is smaller than the included angle between the extending direction of the mist outlet 122 and the running direction of the wire 7. With the above structural arrangement, the gas blown out from the first blowing channel can be located below the mist, quickly lift and blow out the mist that has completed heat exchange, accelerate the gas flow, and is conducive to the rapid cooling of the plastic-coated surface of the wire 7. In this embodiment, the first blowing channel includes a laminar flow blowing port 151 and a turbulent flow blowing port 152, and the included angles between the extending directions of the laminar flow blowing port 151 and the turbulent flow blowing port 152 and the running direction of the wire 7 are the same. The through hole further includes a second blowing channel, which is located on one side of the first blowing channel and is set away from the wire 7, and the extending direction of the second blowing channel is parallel to the running direction of the wire 7. With the above structural arrangement, the gas blown into the second blowing channel can just quickly blow the vaporized water mist, so that it is quickly discharged from the air extraction port 111. In this embodiment, the second blowing channel is a vaporization blowing port 153. The laminar flow blowing port 151, the turbulent flow blowing port 152, and the vaporization blowing port 153 are arranged in sequence from the position close to the wire 7 to the position away from the wire 7. Through the laminar flow blowing port 151, the turbulent flow blowing port 152, and the vaporization blowing port 153, the mist that has completed heat exchange can be better lifted and blown out, accelerate the gas flow, and is conducive to the rapid cooling of the plastic-coated surface of the wire 7.

[0040] Further, the laminar flow pulsation cavity 14 is connected to the heat exchange cavity 11 through a laminar flow channel 141, and the extending direction of the laminar flow channel 141 forms an included angle of 5 - 10° with the running direction of the wire 7.

[0041] Specifically, a sealing plate body 142 is provided near the tail end of the laminar flow pulsation cavity 14. The sealing plate body 142 includes a mounting plate 15 and a guide sleeve 143 provided thereon. The guide sleeve 143 is arranged in a frustum shape, and the laminar flow channel 141 is formed between the outer side wall of the guide sleeve 143 and the support sleeve in the cavity. The extending direction of the laminar flow channel 141 forms an included angle of 5 - 10° with the running direction of the wire 7. With the above structure, the gas can blow on the plastic-coated surface of the wire 7 close to it for cooling, and at the same time, it can effectively avoid directly blowing and impacting the plastic-coated surface of the wire 7, and can ensure the quality of the plastic-coated surface of the wire 7.

[0042] Further, the air inlet 18 and the mist inlet 121 enter the cavity from the upper and lower sides, and the air extraction ports 111 are arranged on the upper, lower, left, and right sides. The effective area of the channels of the air extraction ports 111 is greater than the sum of the air inlet and the mist inlet, which is conducive to forming a negative pressure effect, accelerating the gasification of the liquid mist, and enhancing heat absorption.

[0043] Further, a boss 16 is provided at the head of the cooling unit 1, and a guiding port 17 is provided at the tail. A plurality of cooling units 1 are connected end to end to form a temperature reduction device. With the above structure, the cooling units 1 can be connected end to end for combined use. The provisions of the boss 16 and the guiding port 17 are conducive to axial alignment and the straight space of the channel, facilitating the wire 7 to pass through without collision.

[0044] In this embodiment, the outer diameter of the cooling unit 1 is 200 mm and the length is 370 mm, which can meet the temperature reduction of the wire 7 within a diameter of 35 mm, and the temperature reduction range is 80 - 230 degrees. The main structure of the cavity is made of a metal material with heat-resistant properties, generally aluminum or aluminum alloy, which is lightweight and easy to protect after anodization. The structure is a barrel-type butt joint, hierarchically closed, facilitating processing and assembly alignment. The seal between the barrels uses a silicone rubber gasket to meet the use within a long-term temperature of 230 degrees;

[0045] Embodiment 2

[0046] The embodiment of the present invention provides a temperature reduction system for a wire, including a gas generation device 2, a mist liquid generation device 3, and the temperature reduction device described in Embodiment 1. The gas generation device 2 includes an air compressor 21, an air compressor tank 22, and a connecting pipeline 23 connected to each other. The connecting pipeline 23 includes a first branch 231 and a second branch 232. The first branch 231 is connected to the air inlet 18 of the air intake buffer cavity 13 through a first control valve 233, and the second branch 232 is connected to the laminar flow pulsation cavity 14 through a second control valve 234; the mist liquid generation device 3 includes a liquid tank 31, a liquid pump 32, and an atomizer 33 connected in sequence, and the atomizer 33 is communicated with the mist inlet 121.

[0047] Specifically, the first control valve 233 is a manual valve, and the second control valve 234 is an electromagnetic pulse valve.

[0048] The air supply of the air intake buffer cavity and the laminar flow pulsation cavity are two channels on the same air source branch, but the air intake buffer cavity branch is adjusted by a manual valve body and remains fixed after debugging. The laminar flow pulsation cavity branch is an electromagnetic pulse valve. During operation, a signal is sent by the controller 6 to prompt the valve body to open and close periodically, so that the laminar flow pulsation cavity 14 blows air periodically to realize the fresh supply of the laminar flow exchange gas.

[0049] Furthermore, the cooling system further includes a liquid recovery device 5. The liquid recovery device 5 includes a condenser 51, and an air extraction port 111 is connected to an air extraction pump 4 for accelerating gas flow. One end of the condenser 51 is connected to the air extraction pump 4, and the other end is connected to a liquid tank 31. The condenser 51 can condense the water vapor extracted from the cooling monomer 1 and recover it into the liquid receiving tank 31 for recycling.

[0050] The embodiments of the specific implementation manners are all preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A cooling device for wire, characterized in that, It includes a cooling monomer (1) with a through-channel provided thereon, and a wire (7) passes through the channel. The cooling monomer (1) includes a heat exchange cavity (11) and a liquid mist buffer cavity (12). Both the heat exchange cavity (11) and the liquid mist buffer cavity (12) are provided with the through-channel. An inlet mist port (121) is provided on the side wall of the liquid mist buffer cavity (12), and an outlet mist port (122) is provided at a position of the liquid mist buffer cavity (12) close to the channel. The outlet mist port (122) is communicated with the heat exchange cavity (11), and a collection baffle (123) is provided in the mist outlet direction of the outlet mist port (122). An air extraction port (111) is provided on the heat exchange cavity (11). The cooling monomer (1) further includes an air inlet buffer cavity (13) and a laminar flow pulsation cavity (14). The air inlet buffer cavity (13), the heat exchange cavity (11), the liquid mist buffer cavity (12) and the laminar flow pulsation cavity (14) are arranged in sequence. Both the air inlet buffer cavity (13) and the laminar flow pulsation cavity (14) are communicated with the heat exchange cavity (11), and air inlet ports (18) are provided on both the air inlet buffer cavity (13) and the laminar flow pulsation cavity (14). The laminar flow pulsation cavity (14) is communicated with the heat exchange cavity (11) through a laminar flow channel (141), and the extending direction of the laminar flow channel (141) forms an angle of 5-10° with the running direction of the wire (7). The effective area of the channel of the air extraction port (111) is larger than the sum of the channel areas of the air inlet port (18) and the inlet mist port (121).

2. The cooling device for wire as described in claim 1, characterized in that, A baffle is provided between the air inlet buffer cavity (13) and the heat exchange cavity (11), and a through-hole communicating the air inlet buffer cavity (13) and the heat exchange cavity (11) is provided on the baffle.

3. The cooling device for wire as described in claim 2, characterized in that, The through-hole includes a first blowing channel, and the extending direction of the first blowing channel forms an angle with the running direction of the wire (7) that is smaller than the angle formed by the extending direction of the outlet mist port (122) and the wire (7).

4. The cooling device for wire according to claim 3, characterized in that, The through-hole further includes a second blowing channel, the second blowing channel is located on one side of the first blowing channel and is arranged away from the wire (7), and the extending direction of the second blowing channel is parallel to the running direction of the wire (7).

5. The cooling device for wire as described in claim 1, characterized in that, A boss (16) is provided at the head of the cooling monomer (1), and a guiding port (17) is provided at the tail. A plurality of the cooling monomers (1) are connected end to end to form the temperature reduction device.

6. A cooling system for wire rods, characterized in that, It includes: The temperature reduction device according to any one of claims 1-5; A gas generation device (2) includes an air compressor pump (21), an air compressor tank (22) and a connecting pipeline (23) connected to each other. The connecting pipeline (23) includes a first branch (231) and a second branch (232). The first branch (231) is connected to the air inlet port (18) of the air inlet buffer cavity (13) through a first control valve (233), and the second branch (232) is connected to the laminar flow pulsation cavity (14) through a second control valve (234). The mist generating device (3) includes a liquid tank (31), a liquid pump (32), and an atomizer (33) connected in sequence, and the atomizer (33) is communicated with the mist inlet (121).

7. The cooling system for wire as claimed in claim 6, wherein It further includes a liquid recovery device (5). The liquid recovery device (5) includes a condenser (51). An air extraction pump (4) for accelerating the gas flow is connected to the air extraction port (111). One end of the condenser (51) is connected to the air extraction pump (4), and the other end is connected to the liquid tank (31).

Citation Information

Patent Citations

  • Cooling device and cooling system for wire rod

    CN216230699U