Probe, device, method and electronic equipment for defect detection

Abstract

The present application provides a probe, device, method, and electronic device for defect detection. The probe for defect detection may include: a substrate, a transmitting unit, and a receiving unit, the substrate having a first surface and a second surface opposite to each other, the transmitting unit being arranged on the first surface, at least a portion of the receiving unit being arranged on the second surface, the receiving unit being capable of receiving a magnetic field signal from the transmitting unit, the receiving unit including: a first receiving coil and a second receiving coil, at least a portion of the first receiving coil and at least a portion of the second receiving coil being respectively connected to the second surface, at least a portion of the first receiving coil extending along a first direction and at least a portion extending along a second direction perpendicular to the first direction, at least a portion of the second receiving coil extending along the first direction and at least a portion extending along the second direction, the first receiving coil and the second receiving coil being centrally symmetrically arranged on the second surface, and the first receiving coil and the second receiving coil being connected in a differential manner.

Description

Technical Field

[0001] The present application relates to the technical field of pipeline defect detection, and in particular to a probe, device, method and electronic equipment for defect detection. Background Art

[0002] Pipelines are one of the important means of transportation. For example, natural gas and oil are usually transported through pipelines.

[0003] During long-term operation, pipelines may be affected by geological disasters, corrosion, pressure and other factors, resulting in crack defects. If the defects are not detected and repaired in time, accidents such as pipeline leakage may occur.

[0004] Since pipeline defects are divided into axial defects and defects perpendicular to the axial direction, the detection of these two types of defects currently requires the use of probes corresponding to axial defect detection and probes corresponding to perpendicular axial defect detection, respectively, resulting in low efficiency and high cost of pipeline defect detection. Summary of the Invention

[0005] In view of this, the present application provides a probe and device for defect detection, which mainly solves the technical problem that pipeline defects are divided into axial defects and defects perpendicular to the axial direction. Currently, the detection of these two types of defects requires the use of probes corresponding to axial defect detection and probes corresponding to vertical axial defect detection, respectively, resulting in low efficiency and high cost of pipeline defect detection.

[0006] In a first aspect, an embodiment of the present application provides a probe for defect detection, which may include: a substrate, a transmitting unit, and a receiving unit, wherein the substrate has a first surface and a second surface opposite to each other, the transmitting unit is arranged on the first surface, and at least a portion of the receiving unit is arranged on the second surface, and the receiving unit is capable of receiving the magnetic field signal of the transmitting unit, and the receiving unit includes: a first receiving coil and a second receiving coil, at least a portion of the first receiving coil and at least a portion of the second receiving coil are respectively connected to the second surface, at least a portion of the first receiving coil extends along a first direction and at least a portion extends along a second direction perpendicular to the first direction, at least a portion of the second receiving coil extends along the first direction and at least a portion extends along the second direction, the first receiving coil and the second receiving coil are centrally symmetrically arranged on the second surface, and the first receiving coil and the second receiving coil are connected in a differential manner.

[0007] In some embodiments, the transmitting unit is flat on the first surface; and the receiving unit is flat on the second surface.

[0008] In some embodiments, the first receiving coil is L-shaped or U-shaped; the second receiving coil is L-shaped or U-shaped.

[0009] In some embodiments, the transmitting unit includes: a transmitting coil, wherein the outer contour of the transmitting coil is rectangular, and a portion of the first surface of the transmitting coil is exposed; wherein an end portion of the inner coil of the first receiving coil passes through the substrate and is exposed from the first portion of the first surface, and then passes back from the outer coil corresponding to the first receiving coil to the second surface side; an end portion of the inner coil of the second receiving coil passes through the substrate and is exposed from the second portion of the first surface, and then passes back from the outer coil corresponding to the second receiving coil to the second surface side.

[0010] In some embodiments, a first terminal and a second terminal are provided on a first edge of the first surface, a third terminal, a fourth terminal, and a fifth terminal are provided on a second edge of the second surface, and the second edge and the first edge are opposite to each other; wherein, two ends of the transmitting coil are connected to the first terminal and the second terminal, respectively, two ends of the first receiving coil are connected to the third terminal and the fourth terminal, respectively, and two ends of the second receiving coil are connected to the fourth terminal and the fifth terminal, respectively.

[0011] In some embodiments, an orthographic projection of an outer contour of the receiving unit onto the transmitting unit coincides with an outer contour of the transmitting unit.

[0012] In some embodiments, the substrate is a rectangular printed circuit board.

[0013] In the second aspect, the present application provides a device for defect detection, which may include: a fixed rod and any one of the above-mentioned probes for defect detection, wherein a plurality of positions on the axial direction of the fixed rod are respectively provided with fixed structures, and the fixed structure includes: a plurality of fixed parts, and the plurality of fixed parts are wrapped around the fixed rod; wherein each of the fixed parts is provided with the probe for defect detection, and in the probe for defect detection provided on the fixed part, the first surface of the substrate is located on the side of the substrate close to the fixed rod.

[0014] In some embodiments, the device for defect detection may further include: a circuit board, the circuit board being provided with a signal source, a power amplifier circuit, a receiving circuit, a phase-locked demodulation circuit and an amplification circuit, the signal source, the power amplifier circuit, the transmitting unit of the probe for defect detection, the receiving unit of the probe for defect detection, the receiving circuit, the phase-locked demodulation circuit and the amplification circuit being connected in sequence.

[0015] In some embodiments, two adjacent fixing structures are spaced apart from each other.

[0016] In some embodiments, the plurality of fixing structures are evenly distributed in the axial direction of the fixing rod.

[0017] In a third aspect, the present application provides a method for defect detection, which may include: connecting a transmitting unit to a signal source, connecting a receiving unit to a receiving circuit, placing any of the above-mentioned probes for defect detection on the surface of a pipeline to be tested or moving them parallel to the surface of the pipeline to be tested; or placing any of the above-mentioned devices for defect detection on the surface of a pipeline to be tested or moving them parallel to the surface of the pipeline to be tested; if the output value of the receiving circuit is zero, the pipeline to be tested has no defects; if the output value of the receiving circuit is not zero, the pipeline to be tested has defects.

[0018] In a fourth aspect, the present application provides an electronic device, which may include: a processor, a memory, and a bus; wherein the processor and the memory communicate with each other through the bus; and the processor is used to call program instructions in the memory to execute the method described above.

[0019] In a fifth aspect, the present application provides a computer-readable storage medium, which includes: a stored program; wherein, when the program is running, the device where the storage medium is located is controlled to execute any of the methods described above.

[0020] The present application provides a probe, apparatus, method, and electronic device for defect detection. A first receiving coil is provided with a portion extending in a first direction and a portion extending in a second direction, and a second receiving coil is provided with a portion extending in the first direction and a portion extending in the second direction. The first receiving coil and the second receiving coil are arranged symmetrically about their centers. This ensures that, regardless of whether the defect in the pipeline to be detected is axial or perpendicular to the axial direction, the induced electromotive forces of the first receiving coil and the second receiving coil do not satisfy an equal condition, and both have a differential electromotive force output. Therefore, the defect detection probe is sensitive to both axial and perpendicular defects. Consequently, defects in the pipeline in both the axial and perpendicular directions can be detected simultaneously using the defect detection probe. This reduces the cost of pipeline defect detection, improves detection efficiency, and provides ease of use.

[0021] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and to implement it in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 Schematic diagram of a probe for defect detection (first perspective) according to an embodiment of the present application;

[0024] Figure 2 Schematic diagram of a probe for defect detection (second perspective) according to an embodiment of the present application;

[0025] Figure 3 Schematic diagram of a probe for defect detection (third perspective) according to an embodiment of the present application;

[0026] Figure 4 Schematic diagram of the structure of a device for defect detection according to an embodiment of the present application;

[0027] Figure 5 A circuit diagram of a device for defect detection according to an embodiment of the present application;

[0028] Figure 6 This is a connection diagram of a device for defect detection according to an embodiment of the present application;

[0029] Figure 7 This is a flowchart of a method for defect detection according to an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 10. Probe for defect detection; 11. Substrate; 111. First surface; 1111. First terminal; 1112. Second terminal; 112. Second surface; 1121. Third terminal; 1122. Fourth terminal; 1123. Fifth terminal; 12. Transmitting unit; 121. Transmitting coil; 13. Receiving unit; 131. First receiving coil; 132. Second receiving coil;

[0032] 100. Device for defect detection; 20. Fixing rod; 21. Fixing structure; 211. Fixing portion. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for which protection is claimed, but merely represents selected embodiments of the present application.

[0034] In the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] When inspecting a pipeline, if the inspection process does not physically damage the pipeline, it is called non-destructive testing. Non-destructive testing includes ultrasonic testing, radiographic testing, magnetic field testing, guided wave testing, thermal imaging testing, and eddy current testing. Eddy current testing has received significant attention due to its low cost, high efficiency, and the fact that it does not require a magnetically conductive structure or coupling agent. This application utilizes eddy current testing to detect defects in pipelines.

[0036] First aspect

[0037] The present invention provides a probe 10 for defect detection. Figures 1 to 3 As shown, the probe 10 for defect detection includes: a substrate 11, a transmitting unit 12 and a receiving unit 13, the substrate 11 has a first surface 111 and a second surface 112 opposite to each other, the transmitting unit 12 is arranged on the first surface 111, and at least a portion of the receiving unit 13 is arranged on the second surface 112, and the receiving unit 13 is capable of receiving the magnetic field signal of the transmitting unit 12, and the receiving unit 13 includes: a first receiving coil 131 and a second receiving coil 132, at least a portion of the first receiving coil 131 and at least a portion of the second receiving coil 132 are respectively connected to the second surface 112, at least a portion of the first receiving coil 131 extends along the first direction and at least a portion extends along the second direction perpendicular to the first direction, at least a portion of the second receiving coil 132 extends along the first direction and at least a portion extends along the second direction, the first receiving coil 131 and the second receiving coil 132 are centrally symmetrically arranged, and the first receiving coil 131 and the second receiving coil 132 are connected in a differential manner.

[0038] Specifically, the substrate 11 is in the form of a flat plate, and its two opposite surfaces are respectively a first surface 111 and a second surface 112. The substrate 11 can be a rectangular flat plate or a flat plate of other shapes, for example: Figure 2 and Figure 3 As shown, the substrate 11 is a rectangular printed circuit board.

[0039] The transmitting unit 12 can generate a magnetic field. For example, the transmitting unit 12 includes a transmitting coil 121. The transmitting coil 121 can generate a magnetic field. The transmitting unit 12 can be printed on the first surface 111 of the substrate 11 through a printing process, or can be connected to the first surface 111 of the substrate 11 through other means.

[0040] The receiving unit 13 described above is capable of receiving the magnetic field signal from the transmitting unit 12. For example, both the first receiving coil 131 and the second receiving coil 132 of the receiving unit 13 are capable of receiving the magnetic field signal from the transmitting unit 12. The first receiving coil 131 described above extends at least partially along a first direction and at least partially along a second direction perpendicular to the first direction. That is, the first portion of the first receiving coil 131 extends along the first direction, and the second portion extends along the second direction. There may also be other portions in addition to the first and second portions, and the directions in which the other portions extend may be the same as, or may not be the same as, either the first or second directions. The second receiving coil 132 described above extends at least partially along the first direction and at least partially along the second direction. That is, the third portion of the second receiving coil 132 extends along the first direction, and the fourth portion extends along the second direction. There may also be other portions in addition to the third and fourth portions, and the directions in which the other portions extend may be the same as, or may not be the same as, either the first or second directions. The first receiving coil 131 and the second receiving coil 132 are arranged in a centrally symmetrical manner. That is, one receiving coil overlaps with the other receiving coil after rotating 180 degrees. It should be noted that the first direction corresponds to either the axial direction or a direction perpendicular to the axial direction of the pipeline being tested, and the second direction corresponds to the other direction. The receiving unit 13 described above can be printed on the second surface 112 of the substrate 11 or attached to the second surface 112 of the substrate 11 by other means.

[0041] In one embodiment, the substrate 11 is a rectangular printed circuit board, and the transmitting unit 12 and the receiving unit 13 are respectively arranged on the first surface 111 and the second surface 112 of the substrate 11 through a printing process. The transmitting unit 12 is connected to a signal source, and the receiving unit 13 is connected to a receiving circuit. Then, a sinusoidal excitation signal with a frequency of 500KHZ is sent to the transmitting unit 12 through the signal source. The sinusoidal excitation signal will generate a changing magnetic field near the transmitting unit 12. When the probe 10 for defect detection is placed on the surface of the pipeline to be tested or moved parallel to the surface of the pipeline to be tested, the pipeline to be tested will generate eddy currents in the changing electromagnetic field. The change in the electromagnetic field will form an induced electromotive force in the first receiving coil 131 and the second receiving coil 132 connected in a differential manner and received by the receiving circuit, which includes: the primary electromagnetic field of the transmitting unit 12, the reflected electromagnetic field formed by the eddy current, and the spatial interference electromagnetic field. The induced electromotive force formed by the primary electromagnetic field of the transmitting unit 12 in the first receiving coil 131 and the second receiving coil 132 is U respectively. A1 and U B1 , they have the same effect and can cancel each other out; the induced electromotive force generated by the reflected electromagnetic field formed by the eddy current is U AE and U BE ; The induced electromotive force generated by the space interference electromagnetic field is U AO and U BO , they have almost the same effect and can cancel each other out. The electromotive forces generated in the first receiving coil 131 and the second receiving coil 132 are:

[0042] U A =U A1 +U AE +U AO

[0043] U B =U B1 +U BE +U BO

[0044] After the two receiving coils are differentially connected, the differential electromotive force of the output is:

[0045] U=U A -U B

[0046] When U A1 and U B1 、U AO and U BO When the two receiving coils are almost offset, the differential electromotive force output after differential connection is:

[0047] U≈U AE -U BE

[0048] When the surface of the pipeline to be tested is free of defects, the eddy currents induced by the first receiving coil 131 and the second receiving coil 132 are the same, and the output differential electromotive force U is 0. However, when the surface of the pipeline to be tested has defects, the defects cause the eddy currents in the area to change, and the induced electromotive force of the receiving coil closer to the defect in the first receiving coil 131 and the second receiving coil 132 changes more significantly, thereby causing the output differential electromotive force U to change. As a result, the differential signal output by the first receiving coil 131 and the second receiving coil 132 is proportional to the equivalent size of the defect. Thus, the location of the defect can be determined based on the position of the probe 10 used for defect detection when U changes, and the size of the defect can be determined based on the size of U.

[0049] In this embodiment, a portion extending along the first direction and a portion extending along the second direction are provided on the first receiving coil 131, and a portion extending along the first direction and a portion extending along the second direction are provided on the second receiving coil 132, and the first receiving coil 131 and the second receiving coil 132 are centrally symmetrically arranged. Therefore, regardless of whether the defect of the pipeline to be detected is axial or perpendicular to the axial direction, the induced electromotive force of the first receiving coil 131 and the second receiving coil 132 does not meet the equality condition, and both have a differential electromotive force U output. Therefore, the probe 10 for defect detection is sensitive to both axial and perpendicular defects. Therefore, the probe 10 for defect detection can simultaneously detect defects in the axial and perpendicular directions of the pipeline, thereby reducing the cost of pipeline defect detection, improving detection efficiency, and being convenient to use.

[0050] In some embodiments, see Figures 1 to 3 As shown, the transmitting unit 12 is flat on the first surface 111, and the receiving unit 13 is flat on the second surface 112. Thus, the thickness of the probe 10 for defect detection is reduced.

[0051] In some embodiments, the first receiving coil 131 is L-shaped or U-shaped, and the second receiving coil 132 is L-shaped or U-shaped. In specific implementations, one configuration can be selected based on specific needs. For example, when both the first receiving coil 131 and the second receiving coil 132 are L-shaped, less material is used, and therefore, this configuration is preferred.

[0052] For example: see Figure 2 and Figure 3As shown, the first receiving coil 131 and the second receiving coil 132 are both L-shaped, and the first receiving coil 131 and the second receiving coil 132 are interlocked on the second surface 112 to form an antisymmetric structure. The antisymmetric structure formed by the interlocking of the first receiving coil 131 and the second receiving coil 132 with the L-shaped differential connection makes the probe 10 used for defect detection sensitive to both axial and perpendicular defects, thereby being able to simultaneously capture the eddy current changes caused by axial and perpendicular defects, which can effectively reduce the number of detection probes. At the same time, the differential connection of the first receiving coil 131 and the second receiving coil 132 effectively suppresses the primary electromagnetic field generated by the transmitting unit 12 and the spatial electromagnetic interference acting simultaneously on the first receiving coil 131 and the second receiving coil 132.

[0053] In some embodiments, see Figure 2 As shown, the transmitting unit 12 includes: a transmitting coil 121 having a rectangular outer contour, and a portion of the first surface 111 of the transmitting coil 121 is exposed; wherein, the end of the inner coil of the first receiving coil 131 passes through the substrate 11 and is exposed from the first portion of the first surface, and then passes back from the outer coil corresponding to the first receiving coil 131 to the second surface 112 side; the end of the inner coil of the second receiving coil 132 passes through the substrate 11 and is exposed from the second portion of the first surface, and then passes back from the outer coil corresponding to the second receiving coil 132 to the second surface 112 side.

[0054] Because the first receiving coil 131 is wound in turns from the inside out, one end of the inner coil of the first receiving coil 131 needs to cross the first receiving coil 131 when connecting to the receiving terminal on the second edge of the second surface 112 without passing through the substrate 11. This prevents the first receiving coil 131 on the second surface 112 from maintaining a flat shape. To achieve this, one end of the inner coil of the first receiving coil 131 passes through the substrate 11 and back through the position corresponding to the outer coil of the first receiving coil 131. This allows the first receiving coil 131 on the second surface 112 to maintain a flat shape. The portion of the coil that passes through the substrate 11 is exposed just above the first portion of the first surface 111 exposed from within the transmitting coil 121, thus maintaining the flat shape of the transmitting coil 121. The principle behind the second receiving coil 132 passing through the substrate 11 is the same as that behind the first receiving coil 131 and is not further explained here.

[0055] Similarly, to make the transmitting coil 121 on the first surface 111 flat, the end of the inner loop of the transmitting coil 121 passes through the substrate 11 and back through the portion of the first surface 111 corresponding to the outer loop of the transmitting coil 121. The portion passing through the substrate 11 does not have the first receiving coil 131 and the second receiving coil 132.

[0056] In some embodiments, see Figure 2 and Figure 3As shown, a first terminal 1111 and a second terminal 1112 are provided on a first edge of the first surface 111, and a third terminal 1121, a fourth terminal 1122, and a fifth terminal 1123 are provided on a second edge of the second surface 112, with the second edge and the first edge facing away from each other. Furthermore, two ends of the transmitting coil 121 are connected to the first terminal 1111 and the second terminal 1112, respectively. Two ends of the first receiving coil 131 are connected to the third terminal 1121 and the fourth terminal 1122, respectively. Two ends of the second receiving coil 132 are connected to the fourth terminal 1122 and the fifth terminal 1123, respectively.

[0057] For example, the first edge and the second edge are each provided with five corresponding terminals, with transmitter coil 121 connected to two of the terminals on the first edge, and first receiver coil 131 and second receiver coil 132 connected to three of the terminals on the second edge. In this way, the five terminals on first surface 111 and the five terminals on second surface 112 can be manufactured using the same manufacturing equipment, thereby reducing manufacturing costs.

[0058] In some embodiments, see Figure 2 and Figure 3 As shown, the orthographic projection of the outer contour of the receiving unit 13 onto the transmitting unit 12 coincides with the outer contour of the transmitting unit 12 .

[0059] Specifically, the orthographic projection of the outer contour of the receiving unit 13 onto the transmitting unit 12 coincides with the outer contour of the transmitting unit 12, that is, the outer dimensions of the receiving unit 13 are equivalent to the outer dimensions of the transmitting unit 12, for example: the outer dimensions of the receiving unit 13 are 44*32 (unit: mm) and the outer dimensions of the transmitting unit 12 are also 44*32 (unit: mm), and for another example: the outer dimensions of the receiving unit 13 are 52*42 (unit: mm) and the outer dimensions of the transmitting unit 12 are also 52*42 (unit: mm).

[0060] In this embodiment, by coinciding the outer contour of the receiving unit 13 with the outer contour of the transmitting unit 12, the orthographic projection of the receiving unit 13 onto the transmitting unit 12 is coincident with the outer contour of the transmitting unit 12, which not only ensures that the receiving unit 13 receives the magnetic field signal, but also improves the appearance and visual effect of the probe 10 used for defect detection.

[0061] In some embodiments, see Figures 1 to 3 As shown, the probe 10 for defect detection includes:

[0062] Substrate 11 is a rectangular printed circuit board made of polyimide. It has a first surface 111 and a second surface 112, facing each other. Five terminals are provided on a first edge of first surface 111, and five terminals are provided on a second edge of second surface 112. The second edge faces away from the first edge, and the five terminals on the second edge correspond one-to-one with the five terminals on the first edge.

[0063] Transmitter unit 12 is printed on first surface 111. Transmitter unit 12 includes a transmitting coil 121. Transmitter coil 121 has a rectangular outer contour, with the first and second portions of the first surface exposed. The ends of transmitting coil 121 are connected to two terminals on first surface 111. The inner end of transmitting coil 121 passes through substrate 11 and back through the portion of first surface 111 corresponding to the outer end of transmitting coil 121, where it connects to the terminals on the first edge. The portion passing through substrate 11 is not directly adjacent to first receiving coil 131 and second receiving coil 132.

[0064] The receiving unit 13 is at least partially printed on the second surface 112. The receiving unit 13 includes a first receiving coil 131 and a second receiving coil 132. Both the first and second receiving coils 131, 132 are L-shaped and centrally symmetrically arranged. The inner end of the first receiving coil 131 passes through the substrate 11 and emerges from the first surface of the first portion, then passes back through the outer end of the corresponding first receiving coil 131 to the second surface 112. The inner end of the second receiving coil 132 passes through the substrate 11 and emerges from the first surface of the second portion, then passes back through the outer end of the corresponding second receiving coil 132 to the second surface 112. The first and second receiving coils 131, 132 are differentially connected and connected to three terminals on the second surface 112. These three terminals do not correspond to the two terminals connected to the transmitting coil 121. The orthographic projection of the outer contour of the receiving unit 13 onto the transmitting unit 12 coincides with the outer contour of the transmitting unit 12 .

[0065] Connect the transmitting unit 12 to the signal source, and connect the receiving unit 13 to the receiving circuit, and then send a sinusoidal excitation signal with a frequency of 1 MHZ to the transmitting unit 12 through the signal source. The sinusoidal excitation signal will generate a changing magnetic field near the transmitting unit 12. When the probe 10 for defect detection is placed on the surface of the pipeline to be tested or moves parallel to the surface of the pipeline to be tested, the pipeline to be tested will generate eddy currents in the changing electromagnetic field. The change in the electromagnetic field will form an induced electromotive force in the first receiving coil 131 and the second receiving coil 132 connected in a differential manner and received by the receiving circuit, which includes: the primary electromagnetic field of the transmitting unit 12, the reflected electromagnetic field formed by the eddy current, and the spatial interference electromagnetic field. The induced electromotive force formed by the primary electromagnetic field of the transmitting unit 12 in the first receiving coil 131 and the second receiving coil 132 is U respectively. A1 and U B1 , they have the same effect and can cancel each other out; the induced electromotive force generated by the reflected electromagnetic field formed by the eddy current is U AE and U BE ; The induced electromotive force generated by the space interference electromagnetic field is U AO and U BO , they have almost the same effect and can cancel each other out. The electromotive forces generated in the first receiving coil 131 and the second receiving coil 132 are:

[0066] U A =U A1 +U AE +U AO

[0067] U B =U B1 +U BE +U BO

[0068] After the two receiving coils are differentially connected, the differential electromotive force of the output is:

[0069] U=U A -U B

[0070] When U A1 and U B1 、U AO and U BO When the two receiving coils are almost offset, the differential electromotive force output after differential connection is:

[0071] U≈U AE -U BE

[0072] When the surface of the pipeline to be tested is free of defects, the eddy currents induced by the first receiving coil 131 and the second receiving coil 132 are the same, and the output differential electromotive force U is 0. However, when the surface of the pipeline to be tested has defects, the defects cause the eddy currents in the area to change, and the induced electromotive force of the receiving coil closer to the defect in the first receiving coil 131 and the second receiving coil 132 changes more significantly, thereby causing the output differential electromotive force U to change. As a result, the differential signal output by the first receiving coil 131 and the second receiving coil 132 is proportional to the equivalent size of the defect. Thus, the location of the defect can be determined based on the position of the probe 10 used for defect detection when U changes, and the size of the defect can be determined based on the size of U.

[0073] Second aspect

[0074] This application provides a device 100 for defect detection, see Figures 4 to 6 As shown, the device 100 for defect detection may include: a fixed rod 20 and any one of the above-mentioned probes 10 for defect detection, and a fixing structure 21 is respectively provided at multiple positions in the axial direction of the fixed rod 20, and the fixing structure 21 includes: a plurality of fixing parts 211, and the plurality of fixing parts 211 are wrapped around the fixed rod 20; wherein, each fixing part 211 is provided with a probe 10 for defect detection, and in the probe 10 for defect detection provided on the fixing part 211, the first surface 111 of the substrate 11 is located on the side of the substrate 11 close to the fixed rod 20.

[0075] Specifically, two adjacent fixing structures 21 mentioned above may be spaced apart from each other, and the plurality of fixing structures 21 may be evenly distributed in the axial direction of the fixing rod 20 .

[0076] In this embodiment, the device 100 for defect detection is provided with multiple circles of probes 10 for defect detection, and each circle has multiple probes 10 for defect detection, thereby being able to more accurately determine the location of the defect.

[0077] In some embodiments, see Figures 4 to 6 As shown, the device 100 for defect detection may also include: a circuit board, the circuit board is provided with a signal source, a power amplifier circuit, a receiving circuit, a phase-locked demodulation circuit and an amplifier circuit, the signal source, the power amplifier circuit, the transmitting unit 12 of the probe 10 for defect detection, the receiving unit 13 of the probe 10 for defect detection, the receiving circuit, the phase-locked demodulation circuit and the amplifier circuit are connected in sequence.

[0078] Specifically, the signal source mentioned above can output a sine wave with adjustable frequency.

[0079] In one embodiment, see Figures 4 to 6As shown, a signal source and a power amplifier circuit are provided at the excitation port of a defect detection device 100, while a receiving circuit, a phase-locked demodulation circuit, and an amplifier circuit are provided at the receiving port of the defect detection device 100. A defect detection probe 10 is provided between the excitation port and the receiving port, with a transmitting unit 12 of the defect detection probe 10 connected to the excitation port and a receiving unit 13 connected to the receiving port. The signal source outputs a frequency-adjustable sine wave, which is applied to a transmitting coil 121 after passing through a power amplifier circuit. A stable sinusoidal excitation signal is applied to the transmitting coil 121. The differential signal formed by the first receiving coil 131 and the second receiving coil 132 of the defect detection probe 10 is amplified by the receiving circuit and then sent to a phase-locked demodulation circuit to obtain the signal's amplitude and phase. The signal is then further amplified by the amplifier circuit to ultimately obtain a demodulated output signal, which can be used for defect determination and analysis. When the defect detection device 100 is placed on the surface of the pipeline to be tested or moved parallel to the surface of the pipeline to be tested, if there is no defect, the impact of the pipeline on the first receiving coil 131 and the second receiving coil 132 is the same, and the output after signal differentiation is 0. When a defect is present, the eddy current signal caused by the defect changes the voltage of the adjacent receiving coil, causing the differential output signal of the first receiving coil 131 and the second receiving coil 132 to change in proportion to the equivalent size of the defect, thereby reflecting the defect information.

[0080] In this embodiment, the differential connection of the first and second receiving coils 131, 132, which are arranged symmetrically, and the phase-locked demodulation method for detecting eddy current signals can simultaneously detect axial defects and defects perpendicular to the axial direction on the surface of the pipeline to be tested, thereby improving detection efficiency. At the same time, the differential connection of the first and second receiving coils 131, 132, which are arranged symmetrically, can effectively suppress the primary electromagnetic field generated by the transmitting coil 121 of the transmitting unit 12 and the spatial electromagnetic interference acting simultaneously on the first and second receiving coils 131, 132. In addition, the phase-locked demodulation circuit can suppress electromagnetic interference at non-excitation frequencies, thereby enhancing the sensitivity of eddy current detection.

[0081] It should be noted that the defect detection probe in the defect detection apparatus provided in the embodiments of this application is similar to the description of the defect detection probe embodiment described above, and has similar beneficial effects as the above-mentioned defect detection probe embodiment. For technical details not disclosed in the defect detection apparatus embodiment of this application, please refer to the description of the defect detection probe embodiment in this application for understanding, and will not be repeated here.

[0082] The third aspect

[0083] This application provides a method for defect detection, see Figure 7 As shown, the method for defect detection may include:

[0084] S101: Connect the transmitting unit 12 to the signal source and the receiving unit 13 to the receiving circuit;

[0085] S102: placing the probe 10 for defect detection according to any one of the first aspects on the surface of the pipeline to be detected or moving it parallel to the surface of the pipeline to be detected; or placing the device 100 for defect detection according to any one of the second aspects on the surface of the pipeline to be detected or moving it parallel to the surface of the pipeline to be detected;

[0086] S103: If the output value of the receiving circuit is zero, the pipeline to be tested has no defects; if the output value of the receiving circuit is not zero, the pipeline to be tested has defects.

[0087] It should be noted that the defect detection probe and defect detection apparatus in the defect detection method provided in the embodiments of this application are similar to those described in the above-mentioned embodiments of the defect detection probe, and have similar beneficial effects as the above-mentioned embodiments of the defect detection probe. For technical details not disclosed in the embodiments of the defect detection method provided in this application, please refer to the description of the defect detection probe embodiment in this application for understanding, and will not be repeated here.

[0088] The fourth aspect

[0089] The present application provides an electronic device, which may include: a processor, a memory, and a bus; wherein the processor and the memory communicate with each other via the bus; the processor is used to call program instructions in the memory to execute the above-mentioned method.

[0090] It should be noted that the defect detection method in the electronic device provided in the embodiments of this application is similar to the description of the defect detection method embodiment described above, and has similar beneficial effects as the defect detection method embodiment described above. For technical details not disclosed in the electronic device embodiments of this application, please refer to the description of the defect detection method embodiment in this application for understanding, and will not be repeated here.

[0091] The fifth aspect

[0092] The present application provides a computer-readable storage medium, which includes: a stored program; wherein, when the program is running, the device where the storage medium is located is controlled to execute the above-mentioned method.

[0093] It should be noted that the defect detection method in the computer-readable storage medium provided in the embodiments of this application is similar to the description of the defect detection method embodiment described above, and has similar beneficial effects as the defect detection method embodiment described above. For technical details not disclosed in the computer-readable storage medium embodiments of this application, please refer to the description of the defect detection method embodiment in this application for understanding, and will not be repeated here.

[0094] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of such features.

[0095] In addition, in the description of the present application, it should be understood that the terms "longitudinal", "horizontal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0096] In addition, in this application, unless otherwise clearly specified and limited, the terms "connection", "connected", etc. should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection between two elements or the interaction relationship between two elements. Unless otherwise clearly specified, ordinary technicians in this field can understand the specific meanings of the above terms in this application according to specific circumstances.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A probe for defect detection, characterized in that: include: a substrate having a first surface and a second surface opposite to each other; an emitting unit, wherein the emitting unit is disposed on the first surface; and, A receiving unit, at least a portion of which is disposed on the second surface, the receiving unit being capable of receiving the magnetic field signal of the transmitting unit, the receiving unit comprising: a first receiving coil and a second receiving coil, at least a portion of the first receiving coil and at least a portion of the second receiving coil being respectively connected to the second surface, at least a portion of the first receiving coil extending along a first direction and at least a portion extending along a second direction perpendicular to the first direction, at least a portion of the second receiving coil extending along the first direction and at least a portion extending along the second direction, the first receiving coil and the second receiving coil being centrally symmetrically disposed on the second surface, and the first receiving coil and the second receiving coil being differentially connected.

2. The probe for defect detection according to claim 1, characterized in that: The emitting unit is flat on the first surface; The receiving unit is flat on the second surface.

3. The probe for defect detection according to claim 2, characterized in that: The first receiving coil is L-shaped or U-shaped; The second receiving coil is L-shaped or U-shaped.

4. The probe for defect detection according to claim 3, characterized in that: The transmitting unit includes: a transmitting coil, wherein the outer contour of the transmitting coil is rectangular, and a first portion of the first surface and a second portion of the first surface of the transmitting coil are exposed; The end of the inner circle of the first receiving coil passes through the substrate and is exposed from the first surface of the first portion, and then passes back from the outer circle corresponding to the first receiving coil to the second surface side; the end of the inner circle of the second receiving coil passes through the substrate and is exposed from the first surface of the second portion, and then passes back from the outer circle corresponding to the second receiving coil to the second surface side.

5. The probe for defect detection according to claim 4, characterized in that: A first terminal and a second terminal are provided on a first edge of the first surface, a third terminal, a fourth terminal and a fifth terminal are provided on a second edge of the second surface, and the second edge and the first edge are opposite to each other; The two ends of the transmitting coil are connected to the first terminal and the second terminal respectively, the two ends of the first receiving coil are connected to the third terminal and the fourth terminal respectively, and the two ends of the second receiving coil are connected to the fourth terminal and the fifth terminal respectively.

6. The probe for defect detection according to claim 1, characterized in that: The orthographic projection of the outer contour of the receiving unit onto the transmitting unit coincides with the outer contour of the transmitting unit.

7. A device for defect detection, characterized in that: include: A fixing rod, wherein a plurality of positions on the axial direction of the fixing rod are respectively provided with fixing structures, wherein the fixing structures include: a plurality of fixing parts, wherein the plurality of fixing parts surround the fixing rod; and The probe for defect detection according to any one of claims 1 to 6; Wherein, each fixing portion is provided with the probe for defect detection, and in the probe for defect detection provided on the fixing portion, the first surface of the substrate is located on a side of the substrate close to the fixing rod.

8. The device for defect detection according to claim 7, characterized in that: Also includes: A circuit board is provided with a signal source, a power amplifier circuit, a receiving circuit, a phase-locked demodulation circuit and an amplifier circuit, wherein the signal source, the power amplifier circuit, the transmitting unit of the probe for defect detection, the receiving unit of the probe for defect detection, the receiving circuit, the phase-locked demodulation circuit and the amplifier circuit are connected in sequence.

9. A method for defect detection, characterized in that: include: Connect the transmitting unit to the signal source and the receiving unit to the receiving circuit; The probe for defect detection according to any one of claims 1 to 6 is placed on the surface of the pipeline to be tested or is moved parallel to the surface of the pipeline to be tested; or the device for defect detection according to claim 7 or 8 is placed on the surface of the pipeline to be tested or is moved parallel to the surface of the pipeline to be tested; If the output value of the receiving circuit is zero, the pipeline to be tested has no defects; if the output value of the receiving circuit is not zero, the pipeline to be tested has defects.

10. An electronic device, characterized in that: include: Processor, memory, bus; The processor and the memory communicate with each other via the bus. The processor is configured to call program instructions in the memory to execute the method as claimed in claim 9.

Images