AG cover plate and processing method

By setting up a complementary microstructure on the AG cover, the flash point and clarity problems caused by diffraction and scattering of the existing AG cover are solved, and the production efficiency of fit is improved.

CN116125564BActive Publication Date: 2025-02-18GUANGDONG XIAOTIANCAI TECH CO LTD
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Patent Information

Application Number
CN202111338909.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-12
Publication Date
2025-02-18
Estimated Expiration
2041-11-12

AI Technical Summary

Technical Problem

Due to the influence of the surface microstructure, existing AG covers will cause diffraction and scattering, resulting in poor flash points and clarity problems. At the same time, the periodic structure increases the process difficulty when laminating.

Method used

Using a complementary microstructure, by providing a non-periodic arrangement of pit structures on the first and second surfaces of the cover plate, pit An and pit Bn have a complementary correspondence relationship, and a complementary type is formed by laser beam processing. Microstructure to reduce light direction changes and achieve AG effect.

Benefits of technology

Effectively reduce or solve the problems of flash points and clarity, improve the AG effect, reduce the production difficulty of fitting, and improve production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to the technical field of cover plates, and in particular to an AG cover plate and a processing method, including a cover plate, wherein the first surface and the second surface of the cover plate are arranged opposite to each other and have microstructures A and B, respectively, wherein the microstructure A is composed of pits A1...An, and the microstructure B is composed of pits B1...Bn, wherein n is a natural number greater than 1; the pits An and the pits Bn are in a complementary corresponding relationship, and when n is the same, the pits An can be mirror-symmetrical with the pits Bn after proportional scaling; the pits A1...An are arranged non-periodically; the pits B1...Bn are arranged non-periodically. Such a setting will greatly reduce or solve the flash point problem and the clarity problem; when external light irradiates the cover plate, due to the complementary microstructures on the surface of the cover plate, the light will be scattered, thereby achieving the AG effect and solving the problems of moiré and fitting accuracy requirements.
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Description

Technical Field

[0001] The present application relates to the technical field of cover plates, and more specifically, to an AG cover plate and a processing method thereof. Background Art

[0002] AG (anti-glare) glass cover is a functional cover that can reduce the interference of ambient light, improve the viewing angle of the display screen, and reduce screen reflection. AG cover is generally processed on the surface, and the smooth surface is processed into a surface with microstructure and a certain degree of roughness. The original glass surface can be transformed from a mirror reflection to a matte diffuse reflection surface, achieving anti-glare effects such as anti-light shadow and anti-sunlight.

[0003] However, there are still some problems with the AG cover. For example, due to the influence of the surface microstructure, diffraction and scattering will occur, thereby changing the original light propagation path, causing flash points and clarity problems. If a periodic AG structure is used, although the flash point and clarity problems will be alleviated, moiré will also appear and the AG effect will be reduced. In addition, since there is a certain correspondence between the periodic structure and the pixels, when the AG cover is bonded to the display panel, precise alignment is required before bonding can be performed, which increases the difficulty of the process and reduces the production efficiency of bonding.

[0004] Therefore, how to solve the problem of diffraction and scattering of the existing AG cover, and the problems of flash points and poor clarity, is a key technical problem that technical personnel in this field need to solve. Summary of the invention

[0005] In order to overcome the problems existing in the related art to at least a certain extent, the purpose of this application is to provide an AG cover plate and a processing method, which can solve the problems of diffraction and scattering, flash points and poor clarity of the existing AG cover plate. The preferred technical solutions among the many technical solutions provided in this application can produce many technical effects as described below.

[0006] The present application provides an AG cover plate, comprising a cover plate, wherein a first surface and a second surface of the cover plate are oppositely arranged and respectively have a microstructure A and a microstructure B, wherein the microstructure A is composed of pits A1...An, and the microstructure B is composed of pits B1...Bn, wherein n is a natural number greater than 1;

[0007] The concave pit An and the concave pit Bn are in a complementary corresponding relationship. When n is the same, the concave pit An can be mirror-symmetrical with the concave pit Bn after being scaled in proportion;

[0008] The pits A1...An are arranged non-periodically;

[0009] The pits B1 . . . Bn are arranged non-periodically.

[0010] Preferably, the microstructures A are periodically arranged on the first surface;

[0011] The microstructures B are periodically arranged on the second surface.

[0012] Preferably, there is an arc transition between the pit An and the first surface, and between the pit Bn and the second surface.

[0013] Preferably, the microstructure B is close to the pre-bonded display panel relative to the microstructure A. When the light source of the display panel is a collimated light source, the size of the pit An is the same as the size of the pit Bn. When the light source of the display panel is a divergent light source, the size of the pit An is larger than the size of the pit Bn.

[0014] Preferably, the pit An is configured as an arc surface that gradually sinks toward the second surface along the direction from the edge to the middle;

[0015] The pit Bn is configured as an arc surface that gradually sinks toward the first surface along the direction from the edge to the middle.

[0016] Preferably, the value range of n is 100-1000.

[0017] Preferably, the size of the pit An and the pit Bn ranges from 0.1 to 100 microns.

[0018] The present application also provides a method for processing an AG cover plate, based on the AG cover plate as described in any one of the above, characterized by comprising:

[0019] Determine the focal depth of the laser beam according to the shape and size of the pit An and the pit Bn to be processed;

[0020] Using the focal depth area of ​​the laser beam to align with the area on the cover plate where the pit An and the pit Bn are to be processed for modification;

[0021] The modified areas of the pit An and the pit Bn to be processed are etched.

[0022] Preferably, it includes:

[0023] Determine the spot energy of the laser beam according to the shape and size of the pit An and the pit Bn to be processed;

[0024] The area between the pit An and the first surface of the cover plate and the area between the pit Bn and the second surface of the cover plate to be processed are modified by using the edge of the spot with gradually changing energy of the laser beam.

[0025] Preferably, it includes:

[0026] Determining the focal position of the laser beam according to the sizes of the pit An and the pit Bn to be processed;

[0027] If the size of the pit An is equal to the size of the pit Bn, the focus of the laser beam is equidistant from the first surface and the second surface of the cover plate;

[0028] If the size of the pit An is larger than the size of the pit Bn, the focus of the laser beam is close to the second surface of the cover plate.

[0029] Preferably, it includes:

[0030] Determining a processing drawing of a laser beam according to arrangement information of the pits An and the pits Bn;

[0031] According to the periodicity of the microstructure A and the microstructure B, the processing drawings of the laser beam are arranged periodically.

[0032] The technical solution provided by this application may have the following beneficial effects:

[0033] Since pits An and pits Bn are both sunken inside the cover plate, and pits An and pits Bn have a strict correspondence, so that the direction of the outgoing light from the display panel through the cover plate does not change or changes in a certain regularity, a complementary effect is achieved, which will greatly reduce or solve the flash point and clarity problems. Moreover, pits A1...An are arranged non-periodically, and pits B1...Bn are arranged non-periodically. The above non-periodic arrangement refers to the random arrangement of pits A1...An and pits B1...Bn without any regularity, and the shapes and sizes of the pits may also be different to achieve the AG effect.

[0034] With such a setting, a complementary microstructure is used to ensure that the direction of the light emitted from the display panel through the cover plate does not change or changes in a certain regularity, which will greatly reduce or solve the flash point problem and the clarity problem; at the same time, when external light shines on the cover plate, the non-periodic arrangement of pits An and pits Bn on the surface of the cover plate will cause scattering of the light, thereby achieving the AG effect and solving the problems of moiré patterns and fitting accuracy requirements.

[0035] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 is a structural diagram of the present AG cover according to some exemplary embodiments;

[0039] Figure 2 is a light path diagram of the present AG cover according to some exemplary embodiments;

[0040] Figure 3 It is a processing structure diagram of the present AG cover plate according to some exemplary embodiments.

[0041] In the figure: 1. cover plate; 2. pit An; 3. pit Bn; 4. laser beam; 5. galvanometer. DETAILED DESCRIPTION

[0042] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices or methods consistent with some aspects of the present application.

[0043] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0044] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the invention described in the claims. In addition, the entire contents of the configurations shown in the following embodiments are not limited to the solutions required as the invention described in the claims.

[0045] refer to Figure 1-3 This specific embodiment provides an AG cover plate, wherein the fighting surface and the second surface of the cover plate which are arranged opposite to each other have microstructure A and microstructure B respectively, wherein microstructure A is composed of pits A1...An, and microstructure B is composed of pits B1...Bn, wherein n is a natural number greater than 1.

[0046] The pit An and the pit Bn are in a complementary corresponding relationship, and when n is the same, the pit An can be mirror-symmetrical with the pit Bn after proportional scaling, so that the microstructure A and the microstructure B constitute complementary microstructures, thereby achieving a complementary effect. The proportional scaling here means that the length, width and height of the pit An are kept in a fixed original ratio, so as to achieve enlargement or reduction while keeping the shape unchanged.

[0047] Since pit An and pit Bn are both recessed inside the cover plate, and pit An and pit Bn have a strict corresponding relationship, the direction of the outgoing light from the display panel through the cover plate does not change or changes with a certain regularity, thereby achieving a complementary effect, which will greatly reduce or solve the flash point and clarity problems.

[0048] Moreover, the pits A1 ... An are arranged non-periodically, and the pits B1 ... Bn are arranged non-periodically. The above non-periodic arrangement means that the pits A1 ... An and the pits B1 ... Bn are arranged randomly without any arrangement rules, and the shapes and sizes of the pits may also be different to achieve the AG effect.

[0049] With such a setting, a complementary microstructure is used to ensure that the direction of the light emitted from the display panel through the cover plate does not change or changes in a certain regularity, which will greatly reduce or solve the flash point problem and the clarity problem; at the same time, when external light shines on the cover plate, the non-periodic arrangement of pits An and pits Bn on the surface of the cover plate will cause scattering of the light, thereby achieving the AG effect and solving the problems of moiré patterns and fitting accuracy requirements.

[0050] Furthermore, microstructure A is periodically arranged on the first surface; microstructure B is periodically arranged on the second surface, that is, the cover plate is periodically divided into multiple array areas, and each array area is roughened by microstructure A and microstructure B. In this way, the complementary microstructures can be modularly processed to facilitate processing and reduce flash points and moiré patterns.

[0051] Among them, microstructure A and microstructure B have a certain periodicity, which can improve clarity, reduce flash point, and make moiré less likely to occur. The specific periodicity size is also related to the pixel size, structure, and type of the display panel, and is not limited here.

[0052] The above-mentioned periodic arrangement means that the arrangement of the plurality of microstructures A and the plurality of microstructures B is consistent, so that the formed complementary microstructures are arranged in a matrix on the cover plate, ensuring that a large-scale periodic arrangement exists on the cover plate.

[0053] In addition, circular arc transition is required between the pit An and the first surface of the cover plate, and between the pit Bn and the second surface of the cover plate, so that there are certain curvature radius requirements between the pit An and the first surface, and between the pit Bn and the second surface on the cover plate.

[0054] Since the size of each pit An and pit Bn is in the micron level, its radius of curvature is also in the micron level, or at most in the millimeter level. However, the edge of the pit An and pit Bn, that is, the surface of the cover plate, is a flat glass with an infinite radius of curvature, so this position is set as a transitional curved surface. Since the curved surface has a gradual curvature radius, the micron or millimeter level radius of curvature changes continuously to infinity, rather than forming a sudden change in the radius of curvature, which can effectively reduce the occurrence of flash points.

[0055] The concave pit An is set as a curved surface that gradually sinks toward the second surface from the edge to the middle; the concave pit Bn is set as a curved surface that gradually sinks toward the first surface from the edge to the middle. This allows the curvature radius inside the concave pit An and the concave pit Bn to change gradually and continuously, avoiding sudden changes in the curvature radius and reducing the occurrence of flash points. Moreover, it is beneficial to achieve that the direction of the outgoing light from the display panel through the cover plate does not change or changes in a certain regularity.

[0056] In some embodiments, after the cover plate and the display panel are fitted and installed, the second groove is closer to the display panel than the first groove. Here, the size relationship between the first groove and the second groove is mainly related to the light source of the display panel. When the light source of the display panel is a collimated light source, the size of the first groove and the second groove is the same. When the light source of the display panel is a divergent light source, the size of the first groove is larger than the size of the second groove. This can effectively avoid flash points.

[0057] The structural shapes of the pit An and the pit Bn can be the same or different, and can be square, circular or any other shape. However, it is necessary to ensure that the projections of the pit An and the pit Bn on the cover plate surface can overlap after being enlarged or reduced in equal proportion.

[0058] In some preferred embodiments, the value of n ranges from 100 to 1000. Microstructure A and microstructure B are both composed of 100 to 1000 pits, which can ensure a good AG effect.

[0059] Since the size of pits An and Bn is generally smaller than the pixel size of the display panel, this is because if the pits are too small, the AG effect will decrease, and if the pit size is too large, it will cause crosstalk between pixels and reduce clarity. Therefore, according to the general pixel size, the size of pits An and Bn is set to 0.1-100 microns, so that the size of a single pit is smaller than the pixel size to ensure the appropriate AG effect and clarity. At the same time, the relationship between the minimum pit size and the pixel size is also related to different display panels and the combination of different pit sizes, which is not limited here.

[0060] It should be noted that the structures of the pits An and Bn are not limited to Figure 1 As shown in the figure, any structure that does not change the propagation direction of the original light after passing through the complementary microstructure or has a certain relationship with the propagation direction is a complementary microstructure formed in the present application. Moreover, the size, shape, and surface state of the pits are also universal and are not limited to Figure 1 The structure shown in .

[0061] The present application also provides a method for processing an AG cover plate, comprising:

[0062] Determine the focal depth of the laser beam according to the shape and size of the pit An and the pit Bn to be processed;

[0063] Among them, the laser beam has a certain focal depth when focusing, and the focal depth of the laser beam can be used to process the pits An and pits Bn on the two surfaces of the cover plate at the same time. By controlling the focus position and the focal depth size, the focal depth area of ​​the laser beam can be changed so that the formed focal depth area can correspond to the complementary microstructure to be processed. Moreover, according to the differences between the complementary microstructures, by controlling the position of the focal depth area of ​​the mechanism relative to the cover plate, it is possible to achieve differentiated processing of the pits An and pits Bn on the two surfaces of the cover plate, and change the size, depth, etc. of the pits An and pits Bn on the two surfaces of the cover plate. This is conducive to achieving different complementary effects.

[0064] The focal depth area of ​​the laser beam is used to modify the areas of the pit An and the pit Bn to be processed on the cover plate;

[0065] The areas of the pits An and Bn to be processed on the cover plate are irradiated through the focal depth area of ​​the laser beam, and the spot energy of the laser beam can cause chemical bonds in the area to break, so as to produce an etching effect in the subsequent etching process.

[0066] Specifically, ultrafast lasers can be used for processing, and the laser path can be controlled by galvanometer scanning. Single pulse processing can be used to improve production efficiency, or multi-pulse processing can be used to improve processing accuracy. The actual selection can be based on the requirements of the pits An and Bn.

[0067] It should be noted that the laser beam used can be an ultrafast laser or a continuous laser, and the specific processing method can also be achieved by laser or laser combined with other processes, as well as other processes to achieve the complementary optical structure.

[0068] The modified areas of the pits An and pits Bn to be processed are etched.

[0069] Among them, etching can be directly performed using a laser beam, mainly by adjusting the laser beam parameters to achieve the ablation effect in the modified area as above, so that the processing of pits An and pits Bn can be achieved. Here, unlike the modification process, the etching process cannot perform double-sided etching at the same time, and can only etch pits An and pits Bn on one side.

[0070] Of course, wet etching can also be used to achieve this, through acid etching and alkaline etching processes, for the modified area, mainly using the difference in chemical properties between the laser modified area and the unmodified area. Since a small amount of chemical bonds will be broken on the cover after modification, it is more conducive to chemical reactions. This method can achieve differential etching, thereby realizing the processing of pits An and pits Bn.

[0071] In this way, the complementary microstructure is modified by using a laser beam, especially an ultrafast laser beam, which has high pulse energy, fast processing speed, and easy-to-control energy density. When realizing the surface modification etching processing of the cover plate, it has the advantages of fast speed, high precision, and easy control. In addition, with the combination of wet etching and other processes, better effects can be achieved.

[0072] In this embodiment, the step of modifying the areas of the pit An and the pit Bn to be processed on the cover plate by using the focal depth area of ​​the laser beam includes:

[0073] Determine the spot energy of the laser beam according to the shape and size of the pit An and pit Bn to be processed;

[0074] The area between the pit An to be processed and the first surface of the cover plate, and the area between the pit Bn and the second surface of the cover plate are modified by using the edge of the spot with gradually changing energy of the laser beam.

[0075] Among them, the principle of using the energy of the edge of the laser beam spot for modification is: using the low and gradual energy of the edge of the laser beam spot, so that a continuously changing de-curvature area can be generated in the subsequent etching process, thereby achieving a smooth transition of the curvature radius of the area, so as to form an arc transition between the pit An and the first surface of the cover plate, and between the pit Bn and the second surface of the cover plate.

[0076] When determining the focal depth area of ​​a laser beam, also include:

[0077] Determine the focal position of the laser beam according to the size of the pit An and pit Bn to be processed;

[0078] If the size of the pit An is equal to the size of the pit Bn, the focal point of the laser beam is equidistant from the first surface and the second surface of the cover plate;

[0079] If the size of the pit An is larger than the size of the pit Bn, the focus of the laser beam is close to the second surface of the cover plate.

[0080] Since the focal position is located at the center of the depth of focus area, by controlling the distance between the focal position of the laser beam and the first surface and the second surface of the cover plate, the size of the pits An and pits Bn formed on the two surfaces of the cover plate after processing can be changed, thereby achieving differentiated processing of complementary microstructures A and microstructure B.

[0081] It should be noted that, based on the influence of other factors, it is also necessary to determine the parameter information of the laser beam, including: the laser beam spot size determines the size of the pits An and pits Bn processed by the laser beam; the laser beam repetition frequency determines the processing speed of the pits An and pits Bn; the laser beam spot energy will also affect the size of the pits An and pits Bn, the modification or etching range and depth, etc.; the laser beam spot energy arrangement determines the curvature arrangement of the pits An and pits Bn.

[0082] In order to optimize the processing flow, reduce the difficulty of processing drawing design, and also meet the requirements of removing moiré patterns and achieving the effect of AG structure arrangement, this processing method also includes:

[0083] Determine the processing drawing of the laser beam according to the arrangement information of the pits An and the pits Bn;

[0084] According to the periodicity of microstructure A and microstructure B, the processing drawings of the laser beam are arranged periodically.

[0085] In this way, a processing drawing of microstructure A and microstructure B is first determined, and then a modular matrix arrangement is performed to form an overall processing drawing, so that the complementary microstructures on the processed cover plate can satisfy both the disordered arrangement of small areas and the matrix arrangement of modules in a large area.

[0086] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. used herein to indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0087] In the description of this article, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0088] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

[0089] It is to be understood that the same or similar parts in the above embodiments can refer to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments. The multiple schemes provided in this application include their own basic schemes, which are independent of each other and do not restrict each other, but they can also be combined with each other without conflict to achieve multiple effects together.

[0090] Although the embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present application. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An AG cover plate, characterized in that: A cover plate is included, wherein a first surface and a second surface of the cover plate are oppositely arranged and respectively have a microstructure A and a microstructure B, wherein the microstructure A is composed of pits A1 ... An, and the microstructure B is composed of pits B1 ... Bn, wherein n is a natural number greater than 1; The concave pit An and the concave pit Bn are in a complementary corresponding relationship. When n is the same, the concave pit An can be mirror-symmetrical with the concave pit Bn after being scaled in proportion; The pits A1...An are arranged non-periodically; The pits B1...Bn are arranged non-periodically; The microstructures A are periodically arranged on the first surface; The microstructures B are periodically arranged on the second surface; The arrangement of the plurality of microstructures A and the plurality of microstructures B is consistent.

2. The AG cover plate according to claim 1, characterized in that: There is an arc transition between the pit An and the first surface, and between the pit Bn and the second surface.

3. The AG cover plate according to claim 1, characterized in that: The microstructure B is closer to the pre-laminated display panel relative to the microstructure A; When the light source of the display panel is a collimated light source, the size of the pit An is the same as that of the pit Bn; When the light source of the display panel is a divergent light source, the size of the pit An is greater than the size of the pit Bn.

4. The AG cover plate according to claim 1, characterized in that: The pit An is configured as an arc surface that gradually sinks toward the second surface along the direction from the edge to the middle; The pit Bn is configured as an arc surface that gradually sinks toward the first surface along a direction from the edge to the middle.

5. The AG cover plate according to claim 1, characterized in that: The value range of n is 100-1000.

6. The AG cover plate according to claim 1, characterized in that: The size of the pit An and the pit Bn ranges from 0.1 to 100 microns.

7. A method for processing an AG cover plate, based on the AG cover plate according to any one of claims 1 to 6, characterized in that: include: Determine the focal depth of the laser beam according to the shape and size of the pit An and the pit Bn to be processed; Using the focal depth area of ​​the laser beam to align with the area on the cover plate where the pit An and the pit Bn are to be processed for modification; The modified areas of the pit An and the pit Bn to be processed are etched.

8. The method for processing the AG cover plate according to claim 7, characterized in that: include: Determine the spot energy of the laser beam according to the shape and size of the pit An and the pit Bn to be processed; The area between the pit An and the first surface of the cover plate and the area between the pit Bn and the second surface of the cover plate to be processed are modified by using the edge of the spot with gradually changing energy of the laser beam.

9. The method for processing the AG cover plate according to claim 7, characterized in that: include: Determining the focal position of the laser beam according to the sizes of the pit An and the pit Bn to be processed; If the size of the pit An is equal to the size of the pit Bn, the focus of the laser beam is equidistant from the first surface and the second surface of the cover plate; If the size of the pit An is larger than the size of the pit Bn, the focus of the laser beam is close to the second surface of the cover plate.

10. The method for processing the AG cover plate according to claim 7, characterized in that: include: Determining a processing drawing of a laser beam according to arrangement information of the pits An and the pits Bn; According to the periodicity of the microstructure A and the microstructure B, the processing drawings of the laser beam are arranged periodically.

Citation Information

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