Display module and display device

Abstract

The present disclosure relates to a display module and a display device. The display module comprises a display panel, the display panel is provided with a binding structure, a flexible circuit board is bound to the binding pins, and an adhesive layer is arranged to bond the flexible circuit board and the binding structure together. The edge of the adhesive layer is closer to the display area than the edge of the flexible circuit board in a first direction. The distance between the edge of the flexible circuit board and the edge of the adhesive layer in the first direction is 0.05-0.125 times the size of the flexible circuit board in a second direction. The area of the adhesive layer covering the flexible circuit board and the binding structure can be increased, thereby enhancing the electrical connection reliability and mechanical connection strength between the flexible circuit board and the binding structure, and improving the reliability of the display module. The present disclosure also provides a display device comprising the display module.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular, to a display module and a display device. BACKGROUND

[0002] In the manufacturing process of the display module, the reliability of the electrical connection and the mechanical connection between the bonding structure of the display panel and the flexible printed circuit (FPC) has a decisive influence on the display effect.

[0003] After the flexible printed circuit and the bonding structure are connected, an adhesive layer is usually arranged between the bonding structure and the flexible printed circuit for adhesion and protection. However, the arrangement of the adhesive layer is not reasonable enough, resulting in poor reliability of the display module.

[0004] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0005] The purpose of the present disclosure is to solve the problem of poor reliability and stability of the display module due to the unreasonable arrangement of the adhesive layer, and to provide a display module and a display device.

[0006] According to one aspect of the present disclosure, a display module is provided, comprising a display panel, a flexible printed circuit and an adhesive layer, the display panel having a display area and a non-display area located outside the display area, the non-display area comprising a bonding area, the bonding area being provided with a bonding structure; the flexible printed circuit is bonded to the bonding structure; the adhesive layer is connected between the flexible printed circuit and the bonding structure, the edge of the adhesive layer is closer to the display area than the edge of the flexible printed circuit in a first direction, and the distance between the edge of the flexible printed circuit and the edge of the adhesive layer in the first direction is 0.05-0.125 times the size of the flexible printed circuit in a second direction, the second direction being perpendicular to the first direction.

[0007] In one embodiment of the present disclosure, the edge of the flexible printed circuit in the second direction is located between the edges of the adhesive layer in the second direction, and the distance between the edge of the flexible printed circuit and the edge of the adhesive layer in the second direction is 0.02-0.0625 times the size of the flexible printed circuit in the second direction.

[0008] In one embodiment of the present disclosure, the edge of the bonding structure is closer to the display area than the edge of the flexible printed circuit in the first direction, and the edge of the adhesive layer is closer to the display area than the edge of the bonding structure in the first direction; the edge of the bonding structure in the second direction is located outside the edge of the flexible printed circuit in the second direction and between the edges of the adhesive layer in the second direction.

[0009] In one embodiment of the present disclosure, the distance between the edge of the binding structure and the edge of the adhesive layer in the first direction is 0.025-0.04375 times the size of the flexible circuit board in the second direction.

[0010] In one embodiment of the present disclosure, the distance between the edge of the binding structure and the edge of the adhesive layer in the second direction is 0.01-0.0375 times the size of the flexible circuit board in the second direction.

[0011] In one embodiment of the present disclosure, the display module further comprises a cover plate arranged on the display side of the display panel, the orthographic projection of the cover plate on the display panel covers the display area and part of the non-display area, and exposes the binding area, and the adhesive layer extends to the edge of the cover plate along the first direction and is connected with the edge of the cover plate.

[0012] In one embodiment of the present disclosure, the side of the adhesive layer close to the cover plate is flush with the side of the cover plate away from the display panel, and the adhesive layer is made of lightproof glue material.

[0013] In one embodiment of the present disclosure, the non-display area comprises an alignment area, the alignment area is close to the side of the non-display area away from the display area along the first direction, and the orthographic projection of the adhesive layer on the display panel does not overlap with the alignment area.

[0014] In one embodiment of the present disclosure, the display panel comprises a driving back plate, a pixel layer, a driving back plate, a first encapsulation layer, a color film layer and a second encapsulation layer, the pixel layer is arranged on the driving side of the driving back plate; the first encapsulation layer is arranged on the side of the pixel layer away from the driving back plate; the color film layer is arranged on the side of the first encapsulation layer away from the driving back plate; and the second encapsulation layer is arranged on the side of the color film layer away from the driving back plate.

[0015] According to another aspect of the present disclosure, a display device is provided, comprising the display module according to one aspect of the present disclosure.

[0016] The display module of the present disclosure comprises a display panel, a binding structure is arranged on the display panel to bind the flexible circuit board to the binding pin, and an adhesive layer is arranged to bond the flexible circuit board and the binding structure together, the edge of the adhesive layer is closer to the display area than the edge of the flexible circuit board in the first direction, and the distance between the edge of the flexible circuit board and the edge of the adhesive layer in the first direction is 0.05-0.125 times the size of the flexible circuit board in the second direction, which can increase the area of the adhesive layer covering the flexible circuit board and the binding structure, thereby enhancing the electrical connection reliability and mechanical connection strength between the flexible circuit board and the binding structure, and improving the reliability of the display module.

[0017] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] Figure 1 This is a plan view of a display module according to an embodiment of the present disclosure.

[0020] Figure 2 This is a three-dimensional structural diagram of another display module according to an embodiment of this disclosure.

[0021] Figure 3 This is a plan view of another display module according to an embodiment of the present disclosure.

[0022] Figure 4 This is a plan view of another display module according to an embodiment of the present disclosure.

[0023] Figure 5 This is a cross-sectional schematic diagram of another display module according to an embodiment of this disclosure.

[0024] Figure 6 This is a cross-sectional schematic diagram of the display panel of another display module according to an embodiment of the present disclosure.

[0025] In the diagram: 100-Display panel, 101-Display area, 102-Non-display area, 1021-First sub-region, 1022-Second sub-region, 1023-Third sub-region, 1024-Fourth sub-region, 1025-Bonding structure, 1-Drive backplane, 10-Substrate, 11-Transistor, 111-Gate, 112-Active layer, 113-First electrode, 114-Second electrode, 115-Gate insulating layer, 12-First transistor, 13-Second transistor, 14-Contact hole, 15-Insulating layer, 151-Interlayer dielectric layer, 152-Protective layer, 153-Planarization Layers: 16-Third conductive layer, 18-Buffer layer, 19-Drive circuit layer, 2-Pixel layer, 21-First conductive layer, 22-Light-emitting unit layer, 23-Second conductive layer, 220-Sub-pixel, 2201-First sub-pixel, 2202-Second sub-pixel, 2203-Third sub-pixel, 221-First electrode, 222-Second electrode, 223-Light-emitting unit, 224-Pixel definition layer, 3-Color filter layer, 31-Black matrix, 32-Sub-filter unit, 4-Encapsulation layer group, 41-First encapsulation layer, 42-Second encapsulation layer, 5-Cover plate, 6-Adhesive layer, 7-Flexible circuit board. DETAILED DESCRIPTION

[0026] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings; however,

[0027] Although relative terms such as "upper", "lower", etc. are used herein to describe one component's relationship to another component of the icon, these terms are used herein for convenience only and are not necessarily limiting. It is to be understood that, if the icon were inverted, then the described "upper" component would become the "lower" component. When a structure is "on" another structure, it can mean that the structure is formed integrally with the other structure or that the structure is "directly" on the other structure or that the structure is "indirectly" on the other structure via another structure.

[0028] The terms "a", "an", "the" and "at least one" are used to mean one or more elements / components / etc.; the terms "comprises", "comprising", "includes", "including" and the like are used to mean open-ended including and do not exclude additional elements / components / etc.; the term "or" is used to mean, and is used in the same way as "and / or", the term "another" is used to mean at least a second or more; and the articles "a", "an" and "the" are used to refer to one or more, unless otherwise specified.

[0029] Micro-OLED micro display device uses single crystal silicon wafer as backplane, has the characteristics of self-luminescence, thin thickness, light weight, large viewing angle, short response time, high luminous efficiency, etc., and is easier to realize high pixel density (PPI), small volume, easy to carry, low power consumption and other excellent characteristics, and is widely used in near-eye display and virtual reality, augmented reality fields, especially in AR / VR head-mounted display devices.

[0030] AR / VR devices will appear in different environments, so the reliability of the display module is crucial. The reliability of the electrical connection and mechanical connection of the bonding structure of the display panel and the flexible printed circuit (FPC) has a decisive influence on the reliability. After the flexible circuit board is connected with the plurality of bonding pads, an adhesive layer is usually arranged between the bonding structure and the flexible circuit board for bonding, so as to ensure that the flexible circuit board can be fixed on the bonding structure and realize normal output of electrical signals. ​

[0031] As shown in Figure 1 the size of the flexible circuit board in the first direction is 8-10 mm. The size d1 of the adhesive layer 6 in the first direction is 1 mm, the size of the area in the first direction overlapping the flexible circuit board 7 is about 0.7-0.8 mm, and the width d2 of the area not overlapping the flexible circuit board 7 and close to the display area 101 is 0.2-0.3 mm, which is 0.02-0.0375 times the size of the flexible circuit board 7 in the second direction. The area of the display panel not overlapping the flexible circuit board 7 is partially exposed and has no protective film layer. The size of the adhesive layer 6 in the second direction is slightly larger than that of the flexible circuit board 7 between the edge of the flexible circuit board 7 in the second direction and the edge of the adhesive layer 6 in the second direction, and the second direction is perpendicular to the first direction.

[0032] It should be noted that the first direction is the direction perpendicular to the edge of the display area 101 and the edge of the flexible circuit board 7, i.e., the x direction shown in the figure. The second direction is the direction parallel to the edge of the display area 101 and the edge of the flexible circuit board 7, i.e., the y direction shown in the figure.

[0033] In addition, the edge of the adhesive layer 6 is closer to the display area 101 than the edge of the binding structure 1025 in the first direction, and the distance between the edge of the binding structure 1025 and the edge of the adhesive layer 6 in the first direction is 50-150 microns, which is 0.005-0.01875 times the size of the flexible circuit board 7 in the second direction. The edge of the adhesive layer 6 in the second direction is flush with the edge of the binding structure 1025 in the second direction.

[0034] It can be understood that the arrangement of the adhesive layer 6 is not reasonable, resulting in poor reliability of the display module.

[0035] Based on this, the display module provided by the embodiments of the present disclosure is provided. As shown in Figures 2 to 6 the display module includes a display panel 100, a flexible circuit board 7, and an adhesive layer 6. The display panel 100 has a display area 101 and a non-display area 102 located outside the display area 101. The non-display area 102 includes a binding area provided with a binding structure 1025. The flexible circuit board 7 is bound to the binding structure 1025. The adhesive layer 6 is connected between the flexible circuit board 7 and the binding structure 1025. The edge of the adhesive layer 6 is closer to the display area 101 than the edge of the flexible circuit board 7 in the first direction. The distance between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the first direction is 0.05-0.125 times the size of the flexible circuit board 7 in the second direction.

[0036] The flexible circuit board 7 and the binding structure 1025 are bonded together by the bonding layer 6, the edge of the bonding layer 6 is closer to the display area 101 than the edge of the flexible circuit board 7 in the first direction, the distance between the edge of the flexible circuit board 7 and the edge of the bonding layer 6 in the first direction is 0.05-0.125 times the size of the flexible circuit board 7 in the second direction, the area of the bonding layer 6 covering the flexible circuit board 7 and the binding structure 1025 can be increased, so as to enhance the electrical connection reliability and mechanical connection strength between the flexible circuit board 7 and the binding structure 1025, and improve the reliability of the display module.

[0037] The display module related to the display mode of the present disclosure will be described in detail below in combination with specific embodiments.

[0038] As shown in Figure 2 and Figure 3 , the display module is a silicon-based OLED display module, and can adopt a module structure of a flexible circuit board type. The display module includes a display panel 100 and a flexible circuit board 7, the display panel 100 has a display area 101 and a non-display area 102, the display panel 100 is integrated with a driving circuit, the display area 101 is provided with a plurality of sub-pixels 220 connected with the driving circuit, and the non-display area 102 includes a binding area provided with a plurality of binding structures 1025 connected with the driving circuit, the binding structure 1025 includes a plurality of pins, the binding pins are bound with the flexible circuit board 7, the flexible circuit board 7 can transmit external signals to the driving circuit through the binding pins, so as to drive different sub-pixels 220 to emit light and realize picture display.

[0039] In order to ensure the reliability of the display module, the display module further includes a bonding layer 6, the bonding layer 6 is connected between the flexible circuit board 7 and the binding structure 1025, the edge of the bonding layer 6 is closer to the display area 101 than the edge of the flexible circuit board 7 in the first direction, the distance d2 between the edge of the flexible circuit board 7 and the edge of the bonding layer 6 in the first direction is 0.05-0.125 times the size of the flexible circuit board 7 in the second direction. The edge of the flexible circuit board 7 in the second direction is located between the edges of the bonding layer 6 in the second direction, the distance d3 between the edge of the flexible circuit board 7 and the edge of the bonding layer 6 in the second direction is 0.02-0.0625 times the size of the flexible circuit board 7 in the second direction, and the second direction is perpendicular to the first direction.

[0040] When the flexible circuit board 7 has a dimension of 8-10 mm in the first direction, the dimension d1 of the adhesive layer in the first direction is 1.5 mm, the distance d2 between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the first direction is 0.5-1 mm, and the distance d3 between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the second direction is 0.2-0.5 mm. Comparing this embodiment with the positional relationship between the adhesive layer 6 and the flexible circuit board 7 in the figure, the coating size of the adhesive layer 6 in the first direction is increased by 0.03-0.0825 times, and the coating size in the second direction is increased by 0.02-0.0625 times, extending to both sides of the flexible circuit board 7. The increased contact area between the adhesive layer 6 and the flexible circuit board 7 can effectively improve the warping problem of the flexible circuit board 7 and increase the mechanical connection strength of the flexible circuit board 7, thereby improving the bonding reliability problem.

[0041] The edge of the bonding structure 1025 is closer to the display area 101 in the first direction than the edge of the flexible circuit board 7, and the edge of the adhesive layer 6 is closer to the display area 101 in the first direction than the edge of the bonding structure 1025; the edge of the bonding structure 1025 in the second direction is located outside the edge of the flexible circuit board 7 in the second direction, and is located between the edges of the adhesive layer 6 in the second direction.

[0042] In this embodiment, the distance d4 between the edge of the bonding structure 1025 and the edge of the adhesive layer 6 in the first direction is 0.025-0.04375 times the dimension of the flexible circuit board 7 in the second direction. The distance d5 between the edge of the bonding structure 1025 and the edge of the adhesive layer 6 in the second direction is 0.01-0.0375 times the dimension of the flexible circuit board 7 in the second direction. Specifically, the distance between the edge of the bonding structure 1025 and the edge of the adhesive layer 6 in the first direction is 0.25-0.35 mm, and the distance between the edge of the bonding structure 1025 and the edge of the adhesive layer 6 in the second direction is 0.1-0.3 mm.

[0043] This embodiment and Figure 1 Comparing the positional relationship between the adhesive layer 6 and the bonding structure 1025, the coating size of the adhesive layer 6 in the first direction is increased by 0.02-0.025 times, and the coating size in the second direction is increased by at least 0.01-0.0375 times, extending to both sides of the bonding structure 1025. This increases the area covered by the adhesive layer 6 on the bonding structure 1025, effectively protecting the area of ​​the display panel 100 that does not overlap with the flexible circuit board 7. This improves the driving circuit failure problem caused by scratches on the display panel 100 during manufacturing, extends the service life of the display module, and improves the yield of the display module.

[0044] The display module further comprises a cover plate 5, which is arranged on the side of the pixel layer away from the display panel 100. The cover plate 5 can realize light emission and protect the display panel. The area of the cover plate 5 is greater than the area of the display area 101 and less than the area of the display panel 100. That is, the orthographic projection of the cover plate 5 on the display panel covers the display area 101 and is located in the area of the display panel 100. As shown in Figure 1 The edge of the cover plate 5 and the display panel can be kept a certain distance apart to realize positioning and fixing of the display module and the shell.

[0045] As shown in Figure 4 To better protect the display panel, the coverage area of the cover plate 5 can be appropriately increased. The cover plate 5 can cover the display area 101 and part of the non-display area 102. Specifically, the non-display area 102 includes a first sub-area 1021 and a second sub-area 1022 located on both sides of the display area 101 along the first direction, and a third sub-area 1023 and a fourth sub-area 1024 located on both sides of the display area 101 along the second direction. The orthographic projection of the cover plate 5 on the display panel covers the first sub-area 1021, the third sub-area 1023, the fourth sub-area 1024, and part of the second sub-area 1022, and exposes part of the second sub-area 1022 as a binding area. The adhesive layer 6 extends to the edge of the cover plate 5 along the first direction and is connected to the edge of the cover plate 5. That is, the cover plate 5 completely covers the binding area.

[0046] It should be noted that the side of the adhesive layer 6 close to the cover plate 5 is flush with the side of the cover plate 5 away from the display panel. The adhesive layer 6 can be made of opaque glue material to prevent light leakage of the display panel. Specifically, UV glue can be used.

[0047] As shown in Figure 4 The non-display area can include an alignment area 1026. The alignment area 1026 is located on the side of the non-display area 102 away from the display area 101 along the first direction. The orthographic projection of the adhesive layer 6 on the display panel 100 does not overlap the alignment area 1026. It can be understood that the alignment area 1026 partially overlaps the binding area. The alignment area 1026 is arranged on both sides of the flexible circuit board 7 along the second direction. Taking the alignment area 1026 as a reference, the flexible circuit board 7 is bonded along the second direction to facilitate alignment with the adhesive layer 6.

[0048] Figure 5A schematic diagram of a display module provided by the present disclosure is shown. The display module includes a driving backboard 1, a pixel layer 2, a color film layer 3, an encapsulation layer group 4, and a cover plate 5. The pixel layer 2 is arranged on the driving side of the driving backboard 1. The color film layer 3 is arranged on the side of the pixel layer 2 away from the driving backboard 1. The encapsulation layer group 4 includes a first encapsulation layer 41 and a second encapsulation layer 42. The first encapsulation layer 41 and the second encapsulation layer 42 are respectively arranged on the opposite sides of the color film layer 3. The first encapsulation layer 41 is arranged on the side of the pixel layer 2 away from the driving backboard 1. The second encapsulation layer 42 is arranged on the side of the color film layer 3 away from the driving backboard 1. The first encapsulation layer 41 and the second encapsulation layer 42 encapsulate the display panel twice, effectively isolating water vapor and oxygen, preventing delamination between layers, and affecting the display effect. The cover plate 5 is arranged on the side of the second encapsulation layer 42 away from the driving backboard 1.

[0049] The pixel layer 2 can include a plurality of pixel units, Figure 5 The pixel unit can include a first sub-pixel 2201, a second sub-pixel 2202, and a third sub-pixel 2203. For example, the first sub-pixel 2201, the second sub-pixel 2202, and the third sub-pixel 2203 are respectively located in different sub-pixel regions, and two adjacent sub-pixels are separated by a pixel definition layer 224. The pixel unit in combination with the color film layer 3 can emit full-color light. The color film layer 3 includes three different color sub-filter units 32. The orthogonal projection of a sub-filter unit 32 on the pixel layer 2 covers a sub-pixel 220. Two adjacent sub-filter units 32 are separated by a black matrix 31. The orthogonal projection of the black matrix 31 on the pixel layer 2 overlaps with the pixel definition layer 224. The three different color sub-filter units 32 are respectively a red sub-filter unit, a green sub-filter unit, and a blue sub-filter unit. The three different color sub-filter units correspond to one sub-pixel 220 respectively.

[0050] As Figure 6 shown, the display panel includes a driving backboard 1 and a pixel layer. The driving backboard 1 includes a substrate 10 and a driving circuit layer 19. For the sake of clarity, only the first sub-pixel region and the second sub-pixel region adjacent to the pixel layer are shown in the figure, and for each sub-pixel region, only the sub-pixel and the transistor 11 directly connected to the sub-pixel in the driving circuit layer 19 are shown. For example, the transistor 11 can be a driving transistor configured to control the size of the current driving the sub-pixel to emit light. For example, the transistor 11 can also be a light-emitting control transistor for controlling whether the current driving the sub-pixel to emit light flows. Embodiments of the present disclosure do not limit this.

[0051] As Figure 6As shown, the display panel includes a substrate 10, a first conductive layer 21, a light emitting unit layer 22 and a second conductive layer 23 disposed on the substrate 10, the first conductive layer 21 includes first electrodes 221 of first sub-pixels 2201 and first electrodes 221 of second sub-pixels 2202 in the first sub-pixel region and the second sub-pixel region respectively, the first electrodes 221 of the first sub-pixels 2201 and the first electrodes 221 of the second sub-pixels 2202 are disconnected from each other. The second conductive layer 23 includes second electrodes 222 of the first sub-pixels 2201 and second electrodes 222 of the second sub-pixels 2202 in the first sub-pixel region and the second sub-pixel region respectively, the second electrodes 222 of the first sub-pixels 2201 and the second electrodes 222 of the second sub-pixels 2202 are connected to each other.

[0052] The first electrodes 221 of different pixel units 220 are disconnected and insulated from each other in the plane, and the first electrodes 221 of all pixel units 220 form the first conductive layer 21. The second electrodes 222 of different pixel units 220 are a unitary structure, that is, the second electrodes 222 of different pixel units 220 are a continuous and smooth structure formed by the same conductive material layer, and the second electrodes 222 of all pixel units 220 form the second conductive layer 23, and there is no interface between different regions in the second conductive layer 23. All light emitting units 223 form the light emitting unit layer 22, and the light emitting unit layer 22 is disposed between the first conductive layer 21 and the second conductive layer 23.

[0053] As shown, Figure 6 The display panel provided by the embodiment of the present disclosure adopts a silicon substrate as the substrate 10, and the driving circuit layer 19 can be integrated on the silicon substrate to form a driving backplane 1. In this case, the silicon circuit can achieve higher precision. The first sub-pixel and the second sub-pixel are formed on the driving backplane 1, and the driving backplane 1 includes the substrate 10 and the driving circuit layer 19 formed on the substrate 10. The silicon substrate is, for example, single crystal silicon or high-purity silicon.

[0054] The driving circuit layer 19 is formed on the substrate 10 by a semiconductor process, for example, an active layer 112 (i.e. a semiconductor layer), a first electrode 113 and a second electrode 114 of a transistor 11 are formed in the substrate 10 by a doping process, an insulating layer 15 is formed by a silicon oxidation process, and a plurality of third conductive layers 16 are formed by a sputtering process, etc. The semiconductor layer (such as the active layer) of the transistor 11 is located inside the substrate 10, or is part of the substrate 10. Figure 6

[0055] As shown, Figure 6 ​As shown, the first sub-pixel is electrically connected with the first transistor 12, and the second sub-pixel is electrically connected with the second transistor 13. Embodiments of the present disclosure do not limit the specific type of the first transistor 12 and the second transistor 13. The first transistor 12 is exemplarily described below, which is also applicable to the second transistor 13, and thus is not described again.

[0056] The first electrode 221 of the first sub-pixel is formed on the surface of the driving backplane 1 and is electrically connected with the first electrode 113 of the first transistor 12 through the contact hole 14 filled with a conductive material (for example, tungsten) and the plurality of conductive layers. Figure 6 Exemplarily, one insulating layer 15 and two third conductive layers 16 are shown, but embodiments of the present disclosure do not limit the number of insulating layers 15 and conductive layers.

[0057] For example, the first transistor 12 includes a gate 111, a gate insulating layer 115, an active layer 112, a first electrode 113 and a second electrode 114. Embodiments of the present disclosure do not limit the type, material and structure of the first transistor 12, for example, it can be a top-gate type, a bottom-gate type, etc., and the active layer 112 of the first transistor 12 can be an inorganic semiconductor material such as microcrystalline silicon, amorphous silicon, polycrystalline silicon (low-temperature polycrystalline silicon or high-temperature polycrystalline silicon), oxide semiconductor (for example, IGZO), etc., or can also be an organic material such as PBTTT, PDBT-co-TT, PDQT, PDVT-10, organic semiconductor material such as dinaphtho-naphthodithiophene (DNTT) or pentacene, etc. For example, the first transistor 12 can be N-type or P-type.

[0058] Some embodiments of the present disclosure are described by taking a field effect transistor (such as a MOS field effect transistor) formed in a silicon substrate as an example. In the example, the silicon substrate is doped (p-type doping or n-type doping) to form the active layer 112 of the transistor, that is, the active layer 112 of the transistor is located in the silicon substrate, or the active layer 112 of the transistor is part of the silicon substrate. The source and drain of the transistor used here can be symmetrical in structure, so they can be indistinguishable in structure. In embodiments of the present disclosure, in order to distinguish the two poles of the transistor other than the gate, for example, one pole is directly described as the first electrode 113, and the other pole is directly described as the second electrode 114.

[0059] The topmost conductive layer in the driving backplane 1 can have reflectivity, for example, a laminated structure of titanium / nitride titanium / aluminum. For example, the conductive layer includes a plurality of sub-layers arranged at intervals, which are respectively arranged one-to-one with the plurality of first electrodes 221 included in the first conductive layer 21. In a top emission structure, the conductive layer can be arranged as a reflective layer for reflecting light emitted by the light emitting element, improving light extraction efficiency. For example, the orthographic projection of each electrode in the first conductive layer 21 on the substrate 10 falls within the orthographic projection of the part of the conductive layer corresponding to the electrode on the substrate 10. In this case, the first conductive layer 21 can use a transparent conductive oxide material with a high work function, such as ITO, IZO, IGZO, AZO, etc.

[0060] The pixel layer includes a first sub-pixel 2201 and a second sub-pixel 2202 respectively located in the first sub-pixel region and the second sub-pixel region, and the first sub-pixel 2201 and the second sub-pixel 2202 are separated by a pixel definition layer 224. The first sub-pixel 2201 and the second sub-pixel 2202 each include a light emitting unit 223, and the light emitting unit 223 is opposite to the first electrode 221 and the second electrode 222. For example, the first sub-pixel 2201 and the second sub-pixel 2202 can be organic light emitting diodes (OLED) or quantum dot light emitting diodes (QLED), etc., and the type of light emitting element is not limited in the embodiments of the present disclosure. For example, the light emitting unit 223 can be a small-molecule organic material or a high-molecular organic material.

[0061] For example, the first sub-pixel 2201 and the second sub-pixel 2202 are in a top emission structure, and the first electrode 221 and the second electrode 222 have reflectivity. For example, the first electrode 221 includes a material with a high work function and a high reflectivity to serve as an anode, for example, a laminated structure of Ti / Al / Ti / Mo, in which titanium metal can serve as a buffer layer to improve the adhesion between layers, Al as a high-reflectivity material, and Mo as a high-work-function material directly contacting the organic functional layer to improve the carrier injection capability. Correspondingly, the second conductive layer 23 serves as a cathode, for example, the second conductive layer 23 can be a transparent conductive material or a laminated structure of a transparent conductive material and a metal material. For example, the second conductive layer 23 can be a transparent metal oxide conductive material, such as indium zinc oxide (IZO), indium tin oxide (ITO), indium gallium zinc oxide (IGZO), etc., and can also be a transparent nano-conductive material such as carbon nanotubes, graphene, nano-silver wires, etc.

[0062] It should be noted that the transistors 11 used in the embodiments of the present disclosure can all be thin film transistors, field effect transistors, or other switching devices with the same characteristics. When the transistor 11 is a thin film transistor, the driving circuit layer 19 can include a plurality of driving circuit units, and any one driving circuit unit can include a transistor 11 and a storage capacitor, and a plurality of driving circuit units constitute the driving circuit layer 19.

[0063] The display device according to any one of the display modules of the present disclosure can be provided. The specific structure and advantages of the display module have been described in detail above, and thus will not be described here.

[0064] It should be noted that the display device includes other necessary components and compositions in addition to the display module, such as a shell, a control circuit board, a power cord, and the like. Those skilled in the art can supplement accordingly according to the specific use requirements of the display device, and will not be described here.

[0065] When the display panel is of the structure in Figures 1 to 6 The display device can be a conventional electronic device, such as a mobile phone, a computer, a television, and a camcorder. The display device can also be an emerging wearable device, such as a virtual reality device and an augmented reality device, which will not be listed here.

[0066] Other embodiments of the present disclosure will be readily apparent to those skilled in the art upon considering the specification and practice of the disclosed application. The present application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common general knowledge or conventional technical practices in the art not specifically disclosed. The specification and examples are to be regarded as illustrative only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display module, characterized in that, include: A display panel has a display area and a non-display area located outside the display area, the non-display area including a binding area, the binding area being provided with a binding structure; A flexible circuit board is bonded to the bonding structure; An adhesive layer is connected between the flexible circuit board and the bonding structure. The edge of the adhesive layer is closer to the display area in a first direction than the edge of the flexible circuit board. The distance between the edge of the flexible circuit board and the edge of the adhesive layer in the first direction is 0.05-0.125 times the size of the flexible circuit board in a second direction. The second direction is perpendicular to the first direction. The edge of the bonding structure is closer to the display area in the first direction than the edge of the flexible circuit board, and the edge of the adhesive layer is closer to the display area in the first direction than the edge of the bonding structure; the edge of the bonding structure in the second direction is located outside the edge of the flexible circuit board in the second direction, and is located between the edges of the adhesive layer in the second direction.

2. The display module according to claim 1, characterized in that, The edge of the flexible circuit board in the second direction is located between the edges of the adhesive layer in the second direction, and the distance between the edge of the flexible circuit board and the edge of the adhesive layer in the second direction is 0.02-0.0625 times the size of the flexible circuit board in the second direction.

3. The display module according to claim 1, characterized in that, The distance between the edge of the bonding structure and the edge of the adhesive layer in the first direction is 0.025-0.04375 times the dimension of the flexible circuit board in the second direction.

4. The display module according to claim 1, characterized in that, The distance between the edge of the bonding structure and the edge of the adhesive layer in the second direction is 0.01-0.0375 times the dimension of the flexible circuit board in the second direction.

5. The display module according to claim 1, characterized in that, The display module further includes a cover plate disposed on the display side of the display panel. The orthographic projection of the cover plate on the display panel covers the display area and part of the non-display area, and exposes the bonding area. The adhesive layer extends along the first direction to the edge of the cover plate and connects with the edge of the cover plate.

6. The display module according to claim 5, characterized in that, The adhesive layer is flush with the side of the cover plate closest to it and the side of the cover plate furthest from the display panel, and the adhesive layer is made of an opaque adhesive material.

7. The display module according to claim 1, characterized in that, The non-display area includes an alignment area, which is located along the first direction near the side of the non-display area away from the display area, and the orthographic projection of the adhesive layer on the display panel does not overlap with the alignment area.

8. The display module according to claim 1, characterized in that, The display panel includes: Drive backplane; A pixel layer is disposed on the driving side of the driving backplate; A first encapsulation layer is disposed on the side of the pixel layer away from the driving backplane; A color filter layer is disposed on the side of the first encapsulation layer away from the driving backplate; The second encapsulation layer is disposed on the side of the color filter layer away from the drive backplate.

9. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 8.

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