Screen cutting method and cutting system

By using a liquid-guided laser cutting system, the problems of large heat-affected zone and excessive process angle during laser cutting of flexible screens have been solved, resulting in a smaller heat-affected zone and a narrower bezel, thus improving the cutting accuracy and product competitiveness of flexible screens.

CN116140819BActive Publication Date: 2026-02-06BEIJING XIAOMI MOBILE SOFTWARE CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202111387172.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-22
Publication Date
2026-02-06
Estimated Expiration
2041-11-22

AI Technical Summary

Technical Problem

When laser-cutting flexible screens, the heat-affected zone is large, resulting in low cutting precision, which may cause encapsulation failure and edge black spots. Excessive process angle increases the bezel width.

Method used

The cutting system employs a laser and a liquid device. It utilizes a liquid column to guide the laser beam for cutting. Scattering particles and lens components are added to the liquid to shape the laser beam, forming a uniform distribution, reducing the heat-affected zone and improving cutting accuracy.

Benefits of technology

This effectively reduces the heat-affected zone of flexible screens, decreases bezel width, improves cutting precision and product competitiveness, and lowers production costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116140819B_ABST
    Figure CN116140819B_ABST
Patent Text Reader

Abstract

The present disclosure discloses a screen cutting method and a cutting system, which belong to the technical field of electronic products. The screen cutting method cuts the screen to be cut by using the cutting system; the cutting system comprises a laser and a liquid device; the liquid in the liquid device is controlled to flow towards the screen to be cut to form a liquid column; the laser beam emitted by the laser is incident into the liquid column, so that the laser beam is conducted along the liquid column; and the screen to be cut is cut at the position where the liquid column contacts the screen to be cut by using the laser beam. The flexible screen cutting method of the present disclosure cuts the screen to be cut by using the cutting system; the laser beam emitted by the laser is incident into the liquid column and conducted along the liquid column; and the screen to be cut is cut at the position where the liquid column contacts the screen to be cut by the laser beam, which can effectively reduce the heat affected zone of the screen to be cut, has a small process angle, and is beneficial to reducing the frame width of the electronic equipment.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic products, in particular to a screen cutting method and a cutting system. BACKGROUND

[0002] Flexible screen (OLED flexible display), also known as flexible OLED, is widely used with the continuous development of personal intelligent terminals and other electronic devices due to its low power consumption and bendable characteristics.

[0003] In the production process of flexible screens, in order to adapt to the product demand of different sizes of electronic devices, the flexible screen needs to be cut and processed into various application sizes. In the related art, laser cutting technology is usually used, but the laser cutting energy is large and easy to damage the edge of the flexible screen. SUMMARY

[0004] The present disclosure provides a screen cutting method and a cutting system, which can solve the problem of large laser cutting energy and easy damage to the edge of the flexible screen.

[0005] The technical solution is as follows:

[0006] On the one hand, a screen cutting method is provided, which uses a cutting system to cut a to-be-cut screen; the cutting system includes a laser and a liquid device;

[0007] The liquid in the liquid device is controlled to flow towards the to-be-cut screen to form a liquid column;

[0008] The laser beam emitted by the laser is incident into the liquid column, so that the laser beam is conducted along the liquid column;

[0009] The to-be-cut screen is cut at the position where the liquid column and the to-be-cut screen are in contact by using the laser beam.

[0010] In some embodiments, the liquid composition in the liquid device includes isopropyl alcohol and ethanol.

[0011] In some embodiments, the mass ratio of isopropyl alcohol and ethanol is 2:8-4:6.

[0012] In some embodiments, scattering particles are provided in the liquid, and the material of the scattering particles includes polymethyl methacrylate particles, polycarbonate particles, and polystyrene particles.

[0013] In some embodiments, the diameter of the liquid column is D, and the particle size of the scattering particles is d, wherein the value range of d / D is 1 / 10-1 / 30.

[0014] In some embodiments, the volume percentage concentration of the scattering particles in the liquid is 0.35% to 1.5%.

[0015] In some embodiments, before the laser beam emitted by the laser is incident into the liquid column and conducted along the liquid column, the method further comprises:

[0016] controlling the laser beam emitted by the laser to pass through a lens assembly to shape the laser beam.

[0017] In some embodiments, the controlling the laser beam emitted by the laser to pass through a lens assembly to shape the laser beam comprises:

[0018] controlling the laser beam emitted by the laser to pass through a first lens to converge the laser beam;

[0019] controlling the converged laser beam to pass through a second lens to diverge the laser beam, the laser beam being uniformly distributed along the cross section of the liquid column.

[0020] In some embodiments, after the cutting the screen to be cut at the position where the liquid column contacts the screen to be cut by the laser beam, the method further comprises:

[0021] recovering and recycling the liquid flowing from the cutting position.

[0022] In some embodiments, the recovering and recycling the liquid flowing from the cutting position comprises:

[0023] collecting the liquid flowing from the cutting position;

[0024] filtering the liquid through a filtering device and then delivering the filtered liquid back into the liquid device by a recovery pump.

[0025] In another aspect, a cutting system is provided, which adopts any of the screen cutting methods described above; the cutting system comprises a laser and a liquid device.

[0026] The liquid device comprises a liquid storage tank and a liquid stored in the liquid storage tank, the liquid storage tank being provided with a liquid outlet hole on the side facing the screen to be cut, the liquid flowing along the liquid outlet hole to the screen to be cut to form a liquid column.

[0027] The laser is located above the liquid device, the laser facing the liquid storage tank, the laser beam emitted by the laser being capable of being incident into the liquid column and conducted along the liquid column to the screen to be cut to cut the position where the liquid column contacts the screen to be cut.

[0028] In some embodiments, the components of the liquid include, but are not limited to, isopropyl alcohol, ethanol.

[0029] In some embodiments, the mass ratio of the isopropyl alcohol and the ethanol is 2:8-4:6.

[0030] In some embodiments, scattering particles are arranged in the liquid, and the materials of the scattering particles include, but are not limited to, polymethyl methacrylate particles, polycarbonate particles, and polystyrene particles.

[0031] In some embodiments, the diameter of the liquid column is D, and the particle size of the scattering particles is d, wherein the value range of d / D is 1 / 10-1 / 30.

[0032] In some embodiments, the volume percentage concentration of the scattering particles in the liquid is 0.35%-1.5%.

[0033] In some embodiments, the cutting system further includes a lens assembly, and the lens assembly includes a first lens and a second lens.

[0034] The first lens is used for converging the laser beam, and the second lens is used for diverging the laser beam to uniformly distribute the laser beam along the cross section of the liquid column.

[0035] In some embodiments, the cutting system further includes a recycling assembly, and the recycling assembly includes a liquid collecting tank, a liquid return pipe, a recycling pump, and a filtering device.

[0036] The liquid collecting tank is located below the screen to be cut and is used for collecting the liquid flowing from the cutting position, the first end of the liquid return pipe is communicated with the liquid collecting tank, and the second end of the liquid return pipe is communicated with the liquid storage tank.

[0037] The recycling pump and the filtering device are located on the liquid return pipe.

[0038] The technical scheme provided by the present disclosure has at least the following beneficial effects:

[0039] The screen cutting method provided by the present disclosure adopts a cutting system to cut a screen to be cut, the cutting system includes a laser and a liquid device, the liquid in the liquid device flows towards the screen to be cut to form a liquid column, a laser beam emitted by the laser is incident into the liquid column and is conducted along the liquid column, and the laser beam cuts the screen to be cut at the position where the liquid column contacts the screen to be cut, thereby effectively reducing the heat affected zone of the screen to be cut, reducing the process angle, and being conducive to reducing the width of the frame of an electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0041] Figure 1 is a flowchart of the cutting method provided by the embodiments of the present disclosure;

[0042] Figure 2 is a flowchart of the cutting method provided by another embodiment of the present disclosure;

[0043] Figure 3 is a flowchart of the cutting method provided by another embodiment of the present disclosure;

[0044] Figure 4 is a structural schematic diagram of the cutting system provided by the embodiments of the present disclosure;

[0045] Figure 5 is a schematic diagram of the transmission of the laser beam in the liquid column in the embodiments of the present disclosure;

[0046] Figure 6 is a schematic diagram of the transmission of the laser beam in the liquid column in another embodiment of the present disclosure;

[0047] Figure 7 is a schematic diagram of the heat affected zone and process angle when the cutting method of the embodiments of the present disclosure is adopted;

[0048] Figure 8 is a schematic diagram of the thin film packaging structure of the flexible screen in the related art;

[0049] Figure 9 is a schematic diagram of the edge black spot after the packaging failure of the flexible screen in the related art;

[0050] Figure 10 is a schematic diagram of the heat affected zone and process angle when the flexible screen is cut in the related art.

[0051] The reference signs in the drawings represent the following respectively:

[0052] 10, cutting system; 20, screen to be cut; 30, heat affected zone;

[0053] 1, laser; 11, laser beam; 2, liquid device; 21, liquid; 22, liquid column; 23, scattering particle; 24, liquid storage tank; 241, liquid outlet hole; 3, lens assembly; 31, first lens; 32, second lens; 4, recycling assembly; 41, liquid collecting tank; 42, liquid return pipe; 43, recycling pump; 44, filtering device. DETAILED DESCRIPTION

[0054] The exemplary embodiments will be described in detail below with reference to the drawings. In the following description, unless otherwise indicated, like numbers in the different drawings represent similar or analogous elements. The implementations described in the following exemplary embodiments are not meant to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0055] It should be understood that the orientation terms such as "upper", "lower", "top", "bottom", "front", "back", "side", etc. in the embodiments of the present disclosure are based on the arrangement of the cutting system, in which the orientation of the laser is the top or upper, and the orientation of the screen to be cut is the bottom or lower, and the part between the top and the bottom is the side. The embodiments of the present disclosure use these orientation terms only to more clearly describe the structure and the relationship between the structures, and are not intended to describe absolute orientations, and therefore should not be construed as a limitation on the present disclosure.

[0056] Unless otherwise defined, all technical terms used in the embodiments of the present disclosure have the same meanings as commonly understood by one of ordinary skill in the art.

[0057] Flexible screen (OLED flexible display), also known as flexible OLED, will be widely used with the continuous penetration of personal smart terminals and other electronic devices due to its low power consumption and bendable characteristics.

[0058] In the production process of flexible screens, in order to meet the product demand of different sizes of electronic devices, etc., the flexible screen needs to be cut. Since the flexible screen uses a flexible polyimide (PI) substrate, it cannot be cut or polished with hard tools such as punches, cutters or knife wheels, as with hard screens (such as glass screens). In addition, the processing precision of flexible screens is generally required to be higher, and the process parameters required are more accurate. Therefore, in the related art, a high-precision and good-processing flexible screen is usually cut by laser cutting technology with high cost.

[0059] However, the use of laser cutting of flexible screens still has the following technical problems:

[0060] 1. Large cutting heat-affected zone. Due to the high laser energy, the temperature of the cutting area is high. During the cutting process, the affected area of the flexible screen body by the laser is wide, which is not conducive to the control of cutting precision. The impact of cutting the edge or hole position of the flexible screen may cause the encapsulation of the flexible screen to fail, causing edge black spots.

[0061] In particular, reference is made to Figure 8 , 9As shown, the thin-film encapsulation (TFE) of the flexible screen is generally three layers, the upper, middle and lower are the second chemical deposition layer (for example, CVD2 layer, material is SiOx), the physical deposition layer (for example, IJP layer, material is organic) and the first chemical deposition layer (CVD1 layer, material is SiNx). In the heat-affected zone of the laser, the two CVD layers and the IJP layer will have a certain probability of separation, resulting in the failure of the water and oxygen barrier function, and the flexible screen will appear black spots.

[0062] 2. The laser cutting process angle is too large. Referring to Figure 10 As shown, due to the vaporization or melting of the material of the to-be-cut screen 20' during the processing, this phenomenon will have a more serious trend of being closer to the upper surface (the direction of the laser beam 11' incidence). The heat-affected zone 30' is larger, the laser cutting surface is inverted V-shaped, so the process angle a' is relatively large, which increases the invalid area (process angle a' coverage range) of the edge of the flexible screen, and it is necessary to increase the frame width of the display module to cover and shield the invalid area. The display area ratio of the display module with the same size is small, thereby reducing the product competitiveness.

[0063] Therefore, the present disclosure provides a screen cutting method, which adopts a cutting system to cut the to-be-cut screen; the laser beam cuts the to-be-cut screen at the position where the liquid column contacts the to-be-cut screen, which can effectively reduce the heat-affected zone of the to-be-cut screen, and the process angle is small, which is beneficial to reducing the frame width of the electronic device.

[0064] In order to make the purpose, technical scheme and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in further detail below with reference to the drawings.

[0065] Figure 1 is a flowchart of the cutting method provided by the embodiment of the present disclosure; Figure 4 is a structural schematic diagram of the cutting system provided by the embodiment of the present disclosure.

[0066] On the one hand, combined with Figure 1 , 4 As shown, the present embodiment provides a screen cutting method, which adopts a cutting system to cut the to-be-cut screen; the cutting system 10 comprises a laser 1 and a liquid device 2;

[0067] S1 controls the liquid 21 in the liquid device 2 to flow towards the to-be-cut screen 20 to form a liquid column 22.

[0068] In some embodiments, the composition of the liquid 21 in the liquid device 2 includes, but is not limited to, isopropyl alcohol, ethanol. Among them, isopropyl alcohol is an organic compound, the molecular formula is C3H8O, which is an isomer of n-propanol, also known as dimethyl methyl alcohol, 2-propanol, and IPA in the industry, which is a colorless transparent liquid. Ethanol is an organic compound, the structural formula is CH3CH2OH or C2H5OH, the molecular formula is C2H6O, commonly known as alcohol.

[0069] The isopropyl alcohol, ethanol or mixed liquid of the two used in the embodiment has the advantages of good flowability, close viscosity to water, low price and low cost; it also has the characteristics of low boiling point, easy volatilization and easy cleaning, which is convenient for cleaning the to-be-cut screen after the cutting process. Compared with water, the mixed liquid of isopropyl alcohol and ethanol used in the embodiment can effectively prevent water and oxygen from corroding the organic light-emitting layer of the to-be-cut screen, and ensure the quality of the to-be-cut screen.

[0070] In some embodiments, the mass ratio of isopropyl alcohol and ethanol is 2:8-4:6. The mixed liquid meeting this mass ratio has the best effect.

[0071] It can be understood that the mass ratio of isopropyl alcohol and ethanol is, for example, 2:8, 2.5:7.5, 3:7, 3.5:6.5, 4:6, etc.

[0072] S3 makes the laser beam 11 emitted by the laser 1 incident into the liquid column 22, so that the laser beam 11 is conducted along the liquid column 22.

[0073] The refractive index of the liquid 21 to light is greater than 1, while the refractive index of air to light is very close to 1. According to the principle of total reflection, when the light ray enters from the medium with a higher refractive index (for example, the liquid column 22) to the medium with a lower refractive index (for example, the air outside the liquid column 22), if the incident angle is greater than a certain critical angle (the light ray is far away from the normal line), the refracted light ray will disappear, and all the incident light rays will be reflected without entering the medium with a lower refractive index. Thus, as shown in FIG. 2, the total reflection of the laser beam 11 in the liquid column 22 makes the laser beam 11 pass along the liquid column 22 and be limited within the cross-sectional range of the liquid column 22. The laser beam 11 can be accurately, locally and uniformly conducted to the cutting position of the to-be-cut screen 20 by the liquid column 22. Figure 5

[0074] In some embodiments, the liquid 21 is provided with scattering particles 23, and the material of the scattering particles 23 includes, but is not limited to, polymethyl methacrylate (PMMA) particles, polycarbonate (PC) particles and polystyrene (PS) particles.

[0075] ​The three kinds of material particles have the advantages of high transparency (for example, the light transmittance of PMMA particles is 90% to 92%, and the light transmittance of PS particles is 88% to 92%) and high refractive index (for example, the refractive index of PS particles is 1.59 to 1.60).

[0076] The cutting method of the embodiment can achieve uniform distribution in the cross-sectional direction of the liquid column 22, reduce the difficulty of the cutting process, and does not increase the scattering particles 23 because the laser beam 11 is totally reflected in the liquid column 22 (for reference Figure 5 ). After the scattering particles 23 are added to the liquid 21 of the liquid device 2, the scattering particles 23 can have optical effects such as reflection, refraction, and scattering on the laser beam 11, so that the laser beam 11 is also uniformly distributed in the flow direction of the liquid column 22, thereby achieving simultaneous uniform distribution of the laser beam 11 in both the flow direction of the liquid column 22 and the cross-sectional direction of the liquid column 22, further reducing the difficulty of the cutting process, and improving the process precision (for reference Figure 6 ).

[0077] In some embodiments, the diameter of the liquid column 22 is D, and the particle size of the scattering particles 23 is d, where the value of d / D is in the range of 1 / 10 to 1 / 30. When the particle size of the scattering particles 23 of the embodiment and the diameter of the liquid column 22 satisfy the above value range, the scattering particles 23 can achieve better scattering effect, and also ensure that the flowability of the liquid 21 is not affected.

[0078] For example, the value of d / D is 1 / 10, 1 / 15, 1 / 20, 1 / 10, 1 / 25, 1 / 30, etc.

[0079] In some embodiments, the volume percentage concentration of the scattering particles 23 in the liquid 21 is 0.35% to 1.5%. When the volume percentage concentration of the scattering particles 23 and the liquid 21 of the embodiment satisfies the above value range, the scattering particles 23 can achieve better scattering effect, and also ensure that the flowability of the liquid 21 is not affected.

[0080] For example, the value of the volume percentage concentration is 0.35%, 0.4%, 0.45%, 0.5%, 0.55%, 0.6%, 0.65%, 0.7%, 0.75%, 0.8%, 0.85%, 0.9%, 0.95%, 1.0%, 1.05%, 1.1%, 1.15%, 1.2%, 1.25%, 1.3%, 1.35%, 1.4%, 1.45%, 1.5%, etc.

[0081] S4 cuts the to-be-cut screen 20 at the position where the liquid column 22 contacts the to-be-cut screen 20 using the laser beam 11.

[0082] The laser beam 11 is confined within the liquid column 22, and the heat generated by the laser beam 11 is timely taken away by the liquid 21 in the liquid column 22, so as to prevent the heat from accumulating and adversely affecting the edge of the screen 20 to be cut, for example, encapsulation failure, large process angle, etc. Figure 7 As shown, the heat-affected zone 30 generated by the laser beam 11 is small, and the inclination angle of the edge of the screen 20 to be cut is small, that is, the process angle a is small, which is beneficial to reduce the thickness of the frame of the electronic device.

[0083] In combination Figure 2 As shown, in some embodiments, before the laser beam 11 emitted by the laser 1 is incident into the liquid column 22 and the laser beam 11 is conducted along the liquid column 22, the step S3 further includes:

[0084] S2 controls the laser beam 11 emitted by the laser 1 to pass through the lens assembly 3 to shape the laser beam 11.

[0085] Since the shape of the laser beam 11 after being emitted from the laser 1 may not meet the cutting process requirements, the lens assembly 3 can be used to shape the laser beam 11. On the one hand, the lens assembly 3 can adjust the shape of the laser beam 11 (for example, spot shape, spot diameter, etc.), and on the other hand, the lens assembly 3 can uniform the laser beam 11, so that the processing process is more efficient and accurate.

[0086] In some embodiments, the step S2 of controlling the laser beam 11 emitted by the laser 1 to pass through the lens assembly 3 to shape the laser beam 11 includes:

[0087] S21 controls the laser beam 11 emitted by the laser 1 to pass through the first lens 31 to converge the laser beam 11; for example, the first lens 31 is a convex mirror, and the convex mirror has a condensing effect.

[0088] S22 controls the converged laser beam 11 to pass through the second lens 32 to diverge the laser beam 11, and the laser beam 11 is uniformly distributed along the cross section of the liquid column 22. For example, the second lens 32 is a concave mirror, and the concave mirror has a diverging effect.

[0089] In the cutting method of the embodiment, the laser beam 11 emitted by the laser 1 is first converged by the first lens 31 to reduce the spot diameter of the laser beam 11, so that the laser beam 11 can pass through a smaller opening and be easily transmitted to the liquid column 22; the second lens 32 is used to diverge the laser beam 11, so that the laser beam 11 is uniformly distributed in the cross section of the liquid column 22, and the laser beam 11 can be incident into the liquid column 22 along the flow direction of the liquid column 22 in parallel, so that the laser beam 11 uniformly contacts the surface of the screen 20 to be cut, and the uniformity of the cutting process surface is ensured.

[0090] In other possible implementations, the first lens 31 converges the laser beam 11 directly into the liquid column 22. The focused laser beam 11 is directly incident into the liquid column 22 and is transmitted to the screen 20 to be cut by total reflection of the liquid column 22.

[0091] In combination Figure 3 As shown in some embodiments, after the step S4 cuts the screen 20 to be cut by the laser beam 11 at the position where the liquid column 22 contacts the screen 20 to be cut, the method further comprises:

[0092] The step S5 recycles the liquid 21 flowing from the cutting position.

[0093] During the cutting process, the liquid device 2 needs to continuously and stably output the liquid 21 to the screen 20 to be cut to form a stable liquid column 22, which consumes a large amount of liquid 21. In the cutting method of the present embodiment, the liquid 21 in the liquid column 22 after participating in the cutting process is recycled and reused, which is beneficial to save production resources and reduce production cost.

[0094] In some embodiments, the step S5 recycles and reuses the liquid 21 flowing from the cutting position, comprising:

[0095] The step S51 collects the liquid 21 flowing from the cutting position. For example, a liquid collecting groove 41 or other structure capable of collecting the liquid 21 is arranged below the screen 20 to be cut or the cutting position to collect the liquid 21.

[0096] The step S52 filters the liquid 21 through a filtering device 44 and then sends it back to the liquid device 2 through a recycling pump 43. Since the liquid 21 participating in the cutting process may contain debris and other impurities, it needs to be filtered before being sent back to the liquid device 2 for forming the liquid column 22 again.

[0097] In other possible implementations, the step S5 recycles and reuses the liquid 21 flowing from the cutting position, further comprising:

[0098] The step S53 cools the liquid 21 and then sends it back to the liquid device 2 through the recycling pump 43. Since most of the heat generated by the laser beam 11 is carried away by the liquid 21, this part of heat will cause the temperature of the liquid 21 to rise. If the temperature of the liquid 21 is too high, it will affect its cooling effect. Therefore, the liquid 21 is cooled and cooled during the recycling and reuse process. For example, the method of cooling and cooling the liquid 21 includes but is not limited to water cooling, air cooling, and liquid cooling.

[0099] The flexible screen cutting method of the present disclosure cuts the screen to be cut 20 by using a cutting system 10; the cutting system 10 comprises a laser 1 and a liquid device 2; the liquid 21 in the liquid device 2 flows towards the screen to be cut 20 to form a liquid column 22; the laser beam 11 emitted by the laser 1 is incident into the liquid column 22 and conducts along the liquid column 22; the laser beam 11 cuts the screen to be cut 20 at the position where the liquid column 22 contacts the screen to be cut 20, which can effectively reduce the heat-affected zone (see Figure 7 The process angle a is small, which is beneficial to reduce the frame width of the electronic device and improve the competitiveness of the product.

[0100] The liquid-guided laser cutting method of the present embodiment has the following advantages:

[0101] Due to the cooling effect of the liquid column 22, the cutting heat-affected zone is small, the thermal residual stress is small, and the micro-cracks are few. The liquid 21 flushing effect produces less burr due to the accumulation of molten products, which reduces the surface roughness of the processed surface. The laser beam 11 is in a cylindrical shape, which can be focused without considering the processing distance, and can guide the laser in the workpiece material or below the workpiece, which can cut complex surface materials and multi-layer materials, and the cutting seam has no taper. The traditional laser is in a conical shape, and the cutting seam has a taper. Most of the products generated by processing flow into the recycling device with the liquid 21, which causes little pollution to the environment, while the traditional laser uses auxiliary gas and generates a lot of gas during processing, which pollutes the environment. The present disclosure can also improve the laser energy distribution in the processing area, and the energy in the cross section of the liquid column 22 is uniformly distributed instead of Gaussian distribution, which can effectively improve the processing precision. The action area of the liquid column 22 is small, and the force acting on the screen to be cut 20 is small compared with the gas-assisted laser cutting, which avoids the deformation of the flexible screen under pressure and reduces the cutting quality. During traditional laser processing, the processing spark will often break the protective lens, but the laser beam 11 of the present embodiment is transmitted to a remote position through the liquid column 22, and there is no such problem.

[0102] The screen cutting method of the present embodiment is suitable for cutting the screen of a portable electronic device, such as a smart phone, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III), an MP4 player (Moving Picture Experts Group Audio Layer IV), a notebook computer or a desktop computer, etc.

[0103] The screen cutting method of the present embodiment is also suitable for other products, such as an electric shaver, an electric toothbrush, a point-of-service terminal, a wearable device, and automotive, medical and industrial products, etc.

[0104] In another aspect, in combination with Figure 4 As shown in the figure, the embodiment provides a cutting system 10, which adopts the screen cutting method of any one of the preceding embodiments; the cutting system 10 comprises a laser 1 and a liquid device 2; the liquid device 2 comprises a liquid storage tank 24 and a liquid 21 stored in the liquid storage tank 24, the liquid storage tank 24 is provided with a liquid outlet hole 241 on the side facing the screen to be cut 20, the liquid 21 flows along the liquid outlet hole 241 to the screen to be cut 20 to form a liquid column 22; the laser 1 is located above the liquid device 2, the laser 1 faces the liquid storage tank 24, and the laser beam 11 emitted by the laser 1 can be incident into the liquid column 22 and conducted along the liquid column 22 to the screen to be cut 20 to cut the position where the liquid column 22 contacts the screen to be cut 20.

[0105] The flexible screen cutting system 10 of the present disclosure can cut the screen to be cut 20; the cutting system 10 comprises a laser 1 and a liquid device 2; the liquid 21 in the liquid device 2 flows towards the screen to be cut 20 to form a liquid column 22; the laser beam 11 emitted by the laser 1 is incident into the liquid column 22 and conducted along the liquid column 22.

[0106] Therefore, the laser beam 11 cuts the screen to be cut 20 at the position where the liquid column 22 contacts the screen to be cut 20, which can effectively reduce the heat affected zone of the screen to be cut 20, prevent the thin film package of the flexible screen from failing, and cause the flexible screen to appear black spots.

[0107] In addition, because the liquid 21 is constantly flushed, it can carry away excess heat, the vaporization or melting phenomenon of the material during processing is small, the up-down direction of the cutting surface is basically perpendicular, the process angle is relatively small, the width of the frame of the display module does not need to be increased, the display area of the display module with the same external size accounts for a larger proportion, thereby improving the product competitiveness.

[0108] In some embodiments, the composition of the liquid 21 includes but is not limited to isopropyl alcohol and ethanol. The isopropyl alcohol, ethanol or mixed liquid of the two used in the embodiment has the advantages of good flowability, close viscosity to water, low price and low cost; in addition, it also has the characteristics of low boiling point, easy volatilization and easy cleaning, which is convenient for cleaning the screen to be cut 20 after the cutting process.

[0109] In some embodiments, the mass ratio of isopropyl alcohol and ethanol is 2:8-4:6. The mixed liquid 21 meeting this mass ratio has the best effect.

[0110] It can be understood that the mass ratio of isopropyl alcohol and ethanol is, for example, 2:8, 2.5:7.5, 3:7, 3.5:6.5, 4:6, etc.

[0111] In combination with Figure 4 , 6As shown, in some embodiments, the liquid 21 is provided with scattering particles 23, and the material of the scattering particles 23 includes but is not limited to polymethyl methacrylate particles, polycarbonate particles, polystyrene particles, etc.

[0112] The three kinds of material particles have the advantages of high transparency (for example, the light transmittance of PMMA particles is 90% to 92%, and the light transmittance of PS particles is 88% to 92%) and high refractive index (for example, the refractive index of PS particles is 1.59 to 1.60).

[0113] The cutting system of the present embodiment can reduce the difficulty of the cutting process when the scattering particles 23 are not added, because the laser beam 11 is uniformly distributed in the cross-sectional direction of the liquid column 22 due to total reflection in the liquid column 22. The addition of the scattering particles 23 in the liquid 21 of the liquid device 2 can also achieve uniform distribution of the laser beam 11 in the flow direction of the liquid column 22, so that the laser beam 11 is uniformly distributed in both the flow direction of the liquid column 22 and the cross-sectional direction of the liquid column 22, further reducing the difficulty of the cutting process and improving the process precision.

[0114] In some embodiments, the diameter of the liquid column 22 is D, and the particle size of the scattering particles 23 is d, where the value of d / D is in the range of 1 / 10 to 1 / 30. When the particle size of the scattering particles 23 of the present embodiment and the diameter of the liquid column 22 satisfy the above value range, the scattering particles 23 can achieve better scattering effect while ensuring the flowability of the liquid 21.

[0115] For example, the value of d / D is 1 / 10, 1 / 15, 1 / 20, 1 / 10, 1 / 25, 1 / 30, etc.

[0116] In some embodiments, the volume percentage concentration of the scattering particles 23 in the liquid 21 is 0.35% to 1.5%. When the volume percentage concentration of the scattering particles 23 and the liquid 21 of the present embodiment satisfies the above value range, the scattering particles 23 can achieve better scattering effect while ensuring the flowability of the liquid 21.

[0117] For example, the value of the volume percentage concentration is 0.35%, 0.4%, 0.45%, 0.5%, 0.55%, 0.6%, 0.65%, 0.7%, 0.75%, 0.8%, 0.85%, 0.9%, 0.95%, 1.0%, 1.05%, 1.1%, 1.15%, 1.2%, 1.25%, 1.3%, 1.35%, 1.4%, 1.45%, 1.5%, etc.

[0118] In combination with the above, the present embodiment can achieve the following effects. Figure 4As shown, in some embodiments, the cutting system 10 further comprises: a lens assembly 3; the lens assembly 3 comprises a first lens 31 and a second lens 32; the first lens 31 is used for converging the laser beam 11; the second lens 32 is used for diverging the laser beam 11, so that the laser beam 11 is uniformly distributed along the cross section of the liquid column 22.

[0119] In the cutting system 10 of the embodiment, the laser beam 11 emitted by the laser 1 is firstly converged by the first lens 31, so as to reduce the spot diameter of the laser beam 11, so that the laser beam 11 can pass through a smaller opening, and the laser beam 11 is conveniently transmitted to the liquid column 22; the second lens 32 is used for diverging the laser beam 11, so that the laser beam 11 is uniformly distributed along the cross section of the liquid column 22, the laser beam 11 can be parallelly incident into the liquid column 22 along the flow direction of the liquid column 22, so that the laser beam 11 uniformly contacts the surface of the screen 20 to be cut, and the uniformity of the cutting process surface is ensured.

[0120] In other possible implementation manners, the lens assembly 3 comprises at least one of the first lens 31 and the second lens 32. The lens assembly 3 performs beam shaping on the laser beam 11, and the beam shaping can be completed by only one of converging or diverging. For example, the lens assembly 3 only comprises the first lens 31, which can converge the laser beam 11, and the converged laser beam 11 is directly incident into the liquid column 22 and is conducted to the screen 20 to be cut by means of total reflection of the liquid column 22.

[0121] In the present document, “several”, “at least one” means one or more, “multiple”, “at least two” means two or more. “And / or” describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. The character “ / ” generally represents that the associated objects before and after are in an “or” relationship.

[0122] In addition, the terms “first”, “second” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with “first”, “second” can explicitly or implicitly include one or more features. In the description of the present disclosure, the meaning of “multiple” is two or more, unless otherwise specifically limited.

[0123] In combination with Figure 4As shown, in some embodiments, the cutting system 10 further comprises a recycling assembly 4; the recycling assembly 4 comprises a collecting tank 41, a return pipe 42, a recycling pump 43 and a filtering device 44; the collecting tank 41 is located below the screen 20 to be cut, and is used to collect the liquid 21 flowing down from the cutting position; the return pipe 42 is connected to the collecting tank 41 at a first end, and is connected to the liquid storage tank 24 at a second end; the recycling pump 43 and the filtering device 44 are located on the return pipe 42.

[0124] The cutting system 10 of the present embodiment considers that during the cutting process, the liquid device 2 needs to continuously and stably output the liquid 21 to the screen 20 to be cut, so as to form a stable liquid column 22, and this process needs to consume a large amount of liquid 21. Therefore, in the present embodiment, the liquid 21 in the liquid column 22 after participating in the cutting process is recycled and reused, which is beneficial to saving production resources and reducing production cost.

[0125] In another possible implementation manner, the recycling assembly 4 further comprises a cooling device; the cooling device is located on the return pipe 42, and is used to cool the recycled liquid 21. Since most of the heat generated by the laser beam 11 is taken away by the liquid 21, this part of heat will cause the temperature of the liquid 21 to rise. If the temperature of the liquid 21 is too high, the cooling effect will be affected, and therefore the liquid 21 is cooled during the recycling process. Exemplarily, the method for cooling the liquid 21 includes but is not limited to water cooling, air cooling and liquid cooling.

[0126] It should be noted that in the description of the present disclosure, it should be explained that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0127] It should be noted that in the present disclosure, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "above", "upper" and "upper surface" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "under" and "under" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0128] In the description of the present disclosure, the description of the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example" or "some examples" means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the present disclosure.

[0129] The above only is the embodiment of the present disclosure, and does not limit the present disclosure, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A screen cutting method characterized by, Cutting system (10) is used to cut the screen (20) to be cut; the cutting system (10) comprises a laser (1) and a liquid device (2); Control the liquid (21) in the liquid device (2) to flow towards the screen (20) to be cut to form a liquid column (22); The laser beam (11) emitted by the laser (1) is incident in the liquid column (22), and the laser beam (11) is conducted along the liquid column (22); The laser beam (11) is used to cut the screen (20) to be cut at the position where the liquid column (22) contacts the screen (20) to be cut; The liquid (21) is provided with scattering particles (23), and the scattering particles (23) are used to reflect, refract and scatter the laser beam (11) to uniformly distribute the laser beam (11) in the flow direction of the liquid column (22).

2. The screen cutting method of claim 1, wherein, The composition of the liquid (21) in the liquid device (2) comprises isopropyl alcohol and ethanol.

3. The screen cutting method of claim 2, wherein, The mass ratio of the isopropyl alcohol and the ethanol is 2:8~4:

6.

4. The screen cutting method of claim 1, wherein, The material of the scattering particles (23) comprises polymethyl methacrylate particles, polycarbonate particles and polystyrene particles.

5. The screen cutting method of claim 4, wherein, The diameter of the liquid column (22) is D, and the particle size of the scattering particles (23) is d, wherein the value range of d / D is 1 / 10~1 / 30.

6. The screen cutting method of claim 4, wherein, The volume percentage concentration of the scattering particles (23) in the liquid (21) is 0.35%~1.5%.

7. The screen cutting method of claim 1, wherein, Before the laser beam (11) emitted by the laser (1) is incident in the liquid column (22) to conduct the laser beam (11) along the liquid column (22), it further comprises: Control the laser beam (11) emitted by the laser (1) to pass through the lens assembly (3) to shape the laser beam (11).

8. The screen cutting method of claim 7, wherein, The control of the laser beam (11) emitted by the laser (1) to pass through the lens assembly (3) to shape the laser beam (11) comprises: Control the laser beam (11) emitted by the laser (1) to pass through the first lens (31) to converge the laser beam (11); Control the converged laser beam (11) to pass through the second lens (32) to diverge the laser beam (11), and the laser beam (11) is uniformly distributed along the cross section of the liquid column (22).

9. The screen cutting method according to any one of claims 1 to 8, characterized by, After the laser beam (11) is used to cut the screen (20) to be cut at the position where the liquid column (22) contacts the screen (20) to be cut, it further comprises: Recycle and recycle the liquid (21) flowing at the cutting position.

10. The screen cutting method of claim 9, wherein, The recycling and recycling of the liquid (21) flowing at the cutting position comprises: Collect the liquid (21) flowing at the cutting position; After the liquid (21) is filtered through the filtering device (44), it is delivered back to the liquid device (2) through the recovery pump (43).

11. A cutting system characterized by, The screen cutting method is adapted to any one of claims 1-10; the cutting system (10) comprises a laser (1) and a liquid device (2); The screen cutting method is adapted to any one of claims 1-10; the cutting system (10) comprises a laser (1) and a liquid device (2); The liquid device (2) comprises a liquid storage tank (24) and a liquid (21) stored in the liquid storage tank (24), the liquid storage tank (24) is provided with a liquid outlet hole (241) on the side facing the screen (20) to be cut, and the liquid (21) flows along the liquid outlet hole (241) to the screen (20) to be cut to form a liquid column (22); The laser (1) is located above the liquid device (2), the laser (1) faces the liquid storage tank (24), and the laser beam (11) emitted by the laser (1) can be incident into the liquid column (22) and conducted along the liquid column (22) to the screen (20) to be cut to cut the position where the liquid column (22) contacts the screen (20) to be cut; The liquid (21) is provided with scattering particles (23), and the scattering particles (23) are used for reflecting, refracting and scattering the laser beam (11) to uniformly distribute the laser beam (11) in the flow direction of the liquid column (22).

12. The cutting system of claim 11, wherein, The composition of the liquid (21) includes isopropyl alcohol and ethanol.

13. The cutting system of claim 12, wherein, The mass ratio of the isopropyl alcohol and the ethanol is 2:8~4:

6.

14. The cutting system of claim 11, wherein, The material of the scattering particles (23) includes polymethyl methacrylate particles, polycarbonate particles and polystyrene particles.

15. The cutting system of claim 14, wherein, The diameter of the liquid column (22) is D, and the particle size of the scattering particles (23) is d, wherein the value range of d / D is 1 / 10~1 / 30.

16. The cutting system of claim 14, wherein, The volume percentage concentration of the scattering particles (23) in the liquid (21) is 0.35%~1.5%.

17. The cutting system of claim 11, wherein, The cutting system (10) further comprises a lens assembly (3); the lens assembly (3) comprises a first lens (31) and a second lens (32); The first lens (31) is used for converging the laser beam (11), and the second lens (32) is used for diverging the laser beam (11) to uniformly distribute the laser beam (11) along the cross section of the liquid column (22).

18. The cutting system of claim 11, wherein, The cutting system (10) further comprises a recycling assembly (4); the recycling assembly (4) comprises a liquid collecting tank (41), a liquid return pipe (42), a recycling pump (43) and a filtering device (44); The liquid collecting tank (41) is located below the screen (20) to be cut and is used for collecting the liquid (21) flowing from the cutting position; the first end of the liquid return pipe (42) is communicated with the liquid collecting tank (41), and the second end is communicated to the liquid storage tank (24); The recycling pump (43) and the filtering device (44) are located on the liquid return pipe (42).

Citation Information

Patent Citations

  • Hydrophobing agent for mobile phone screens

    CN105110652A

  • Water guide laser cutting device and method

    CN105345282A

  • Method and apparatus for converting diverging light emitted by laser chip into uniform scattering lines

    CN105739103A