Domain controller with condensation prevention structure

Abstract

The application provides a domain controller with condensation prevention structure, which comprises a shell, a chip arranged in the shell, a temperature sensor for monitoring the temperature of the chip, a temperature and humidity sensor for detecting the temperature and humidity of the inner wall of the shell, a heating body for heating the shell, and a processing module comprising a pre-stored enthalpy humidity chart, which is used for combining the data collected by the temperature sensor and the temperature and humidity sensor with the enthalpy humidity chart to obtain a dewing temperature, and judging whether the heating body needs to heat the shell according to the dewing temperature. The kernel temperature of the chip is detected by the temperature sensor, the temperature and humidity of the inner wall of the shell are detected by the temperature and humidity sensor, the dew point temperature of the shell is calculated by using the enthalpy humidity chart, and the temperature difference of the shell is calculated to judge whether the shell has the risk of condensation. The condensation phenomenon can be prevented by heating the local area by the heating body.

Description

Technical Field

[0001] This invention relates to the field of vehicle domain controller technology, and more specifically, to a domain controller with a condensation prevention structure. Background Technology

[0002] The autonomous driving domain controller is responsible for implementing and controlling the autonomous driving functions of a vehicle. It needs to have the ability to receive image information, process and judge image information, process and calculate data, navigate and plan routes, and judge and make decisions in real time. It needs to handle algorithms at the perception, decision and control levels, which places increasingly higher demands on the hardware of the domain controller.

[0003] With the development of Level 4 and above autonomous driving functions, autonomous driving domain controllers require SoC chips with higher computing power to meet the demands of autonomous driving. At the same time, since higher computing power SoCs also require higher power consumption, the thermal design of autonomous driving domain controllers has become a pressing issue for the industry.

[0004] Currently, in the industry, liquid cooling is commonly used to dissipate heat from domain controllers to ensure their sustained and stable operation. Since the SoC (System-on-a-Chip) is the primary heat source and its temperature is relatively high, while the coolant, to achieve effective cooling, has a relatively low temperature, two extreme temperatures exist within the autonomous driving domain controller. When the SoC temperature and the liquid cooling temperature reach a certain temperature difference, under certain ambient humidity conditions, condensation can easily form inside the autonomous driving domain controller. This poses a risk that condensation will accumulate, forming water droplets that fall onto the PCB and damage the components.

[0005] Based on the above-mentioned technical problems, the inventors proposed a domain controller with a condensation prevention structure to solve these problems. Summary of the Invention

[0006] The problem solved by this invention is that when the SoC temperature and the liquid cooling temperature reach a certain temperature difference, under certain ambient humidity, condensation is easily formed inside the autonomous driving domain controller, which poses a risk of condensation accumulating and forming water droplets that fall onto the PCB and burn out the device.

[0007] To address the aforementioned problems, this invention provides a domain controller with a condensation prevention structure. The domain controller includes: a housing; a chip disposed within the housing; a temperature sensor for monitoring the chip's temperature; a temperature and humidity sensor for detecting the temperature and humidity of the inner wall of the housing; a heating element for heating the housing; and a processing module including a pre-stored enthalpy-humidity diagram. The processing module combines the data collected by the temperature sensor and the temperature and humidity sensor with the enthalpy-humidity diagram to obtain the condensation temperature, and determines whether the heating element is needed to heat the housing based on the condensation temperature.

[0008] Compared with the prior art, the technical effects achieved by this solution are as follows: This application uses a temperature sensor to detect the core temperature of the chip, and uses a temperature and humidity sensor to detect the temperature and humidity of the inner wall of the casing. It also uses an enthalpy-humidity chart to calculate the dew point temperature of the casing and calculates the temperature difference with the casing to determine whether there is a risk of condensation on the casing. Condensation can be prevented by heating the local area with a heating element, thus solving the problems in the prior art.

[0009] In this embodiment, the water-cooling cavity includes: a water inlet cavity with a water inlet; a water outlet cavity with a water outlet; the water outlet cavity is connected to the water inlet cavity; and the outer wall of the water inlet cavity is provided with at least one chip heat dissipation surface.

[0010] The technical effect of adopting this technical solution is that the water flow can dissipate heat and cool down the chip inside the casing. By passing the cooling water through the water inlet cavity and through the water flow over the chip's heat dissipation surface, the heat in the chip is carried away by the water flow, so that the cooling water can dissipate heat from the chip.

[0011] In this embodiment, heat dissipation fins are provided on the inner side corresponding to the heat dissipation surface of the chip.

[0012] The technical effect of adopting this technical solution is that the heat dissipation fins can increase the heat dissipation area, and the coolant flows through the heat dissipation fins to carry away the heat on the heat dissipation fins and then flows out to the outside of the domain controller.

[0013] In this embodiment, the heating element is fixedly connected to the inner wall of the outer casing; a temperature and humidity sensor is attached to the heating element, the inner wall of the outer casing is provided with a groove for the installation of the temperature and humidity sensor, and multiple partition grooves are provided on the outer casing near the groove.

[0014] The technical effect of adopting this technical solution is that the heating element can be fixed to the inner wall of the shell by means of double-sided tape, etc. The temperature and humidity sensor on the heating element can monitor the temperature and humidity of the inner wall of the shell. The inner wall of the shell is provided with a groove for installing the temperature and humidity sensor to provide installation space for the temperature and humidity sensor. The setting of the partition groove isolates the heat generated by the heating element when heating the shell from being transferred to the surface of the groove, thereby affecting the temperature measurement of the inner wall surface of the shell by the temperature and humidity sensor.

[0015] In this embodiment, ventilation holes are provided around the temperature and humidity sensor to allow humid air to flow from the back of the temperature and humidity sensor to the front of the temperature and humidity sensor.

[0016] The technical effect of adopting this solution is that humid air can pass from the back of the temperature and humidity sensor to the front of the temperature and humidity sensor through the vent, ensuring the accuracy of the humidity detected by the temperature and humidity sensor.

[0017] In this embodiment, the chip includes: a PCB board; and a connector, wherein the PCB board is electrically connected to the connector.

[0018] The technical effect of adopting this technical solution is that the chip can be composed of a PCB board and a connector, and the chip can operate normally through the electrical connection between the connector and the PCB board.

[0019] In this embodiment, the flexible connecting segment extends from the side of the heating element, and the flexible connecting segment is electrically connected to the connector.

[0020] The technical effect of adopting this technical solution is that the heating element can be electrically connected to the connector through the wiring of the flexible connection section, so that the chip can control the heating element to heat up.

[0021] In this embodiment, the heating element is provided with a positive heating wire and a negative heating wire, which are made of metal foil or metal wire.

[0022] The technical effect of adopting this technical solution is that the heating element can be heated by the positive heating wire and the negative heating wire. The positive heating wire and the negative heating wire can be made of metal foil or metal wire. Metal wire has good heat conduction effect, which makes the heating effect better.

[0023] In this embodiment, the heating element includes one or more of PI heating film, PET heating sheet, and silicone heating sheet.

[0024] The technical effect of adopting this technical solution is that the heating element may include one or more of the following: heating film, PET heating sheet, and silicone heating sheet. The heating material can be heated by metal wire heating to prevent condensation.

[0025] In this embodiment, the heating element is fixedly connected to a flat area away from the heat dissipation surface of the chip and located in the outer casing, close to the water-cooling cavity.

[0026] The technical effect of adopting this solution is that the probability of condensation is relatively high in the flat area of ​​the outer shell that is close to the water-cooling cavity. Placing the heating element in this area can heat the area and reduce the condensation phenomenon in this area. Attached Figure Description

[0027] Figure 1 This is a partial view of a domain controller with a condensation prevention structure according to the present invention;

[0028] Figure 2 This is a partial 3D view of a domain controller with a condensation prevention structure according to the present invention;

[0029] Figure 3This is a partial cross-sectional view of a domain controller with a condensation prevention structure according to the present invention;

[0030] Figure 4 This is a cross-sectional view of the heating element and the flexible connecting section of the present invention;

[0031] Figure 5 This is a top view and a partial enlarged view of the temperature and humidity sensor of the present invention;

[0032] Figure 6 This is a partial view of the wiring of the temperature and humidity sensor and the heating element of the present invention;

[0033] Figure 7 This is an exploded view of a domain controller with a condensation prevention structure according to the present invention.

[0034] Explanation of reference numerals in the attached drawings: 110, outer casing; 111, water pipe connector; 112, water-cooling cavity; 113, chip heat dissipation surface; 114, inner wall of the outer casing; 115, groove; 116, partition groove; 121, temperature and humidity sensor; 122, heating element; 123, flexible connection section; 124, double-sided adhesive; 125, vent hole; 300, PCB board; 302, connector; 401, positive heating wire; 402, negative heating wire; 403, temperature and humidity sensor wiring; 500, domain controller; 1131, first chip heat dissipation surface; 1132, second chip heat dissipation surface; 1121, water inlet cavity; 1122, water outlet cavity. Detailed Implementation

[0035] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] To address the problems in the existing technology, the following three methods can mitigate these problems:

[0037] The first method involves coating the PCB of the chip with multiple layers of protective paint. These multiple layers of protective paint are equivalent to covering the PCB panel with a protective layer to isolate the PCB from external moisture and reduce condensation. However, because the protective paint has strong adhesive properties, it is difficult to remove after curing. If the PCB needs to be repaired, the repair operation cannot be performed.

[0038] The second method, based on the first, increases both the temperature and flow rate of the coolant. Increasing the coolant temperature ensures that the temperature difference between the coolant and the SoC chip temperature remains below the condensation temperature, thus controlling condensation. The SoC's heat dissipation efficiency is improved by increasing the coolant flow rate.

[0039] However, this approach still has the following problems: 1. Increasing the temperature of the water-cooled liquid will reduce the heat dissipation efficiency of the SoC chip, which is not in line with the promotion of higher power SoCs in the future.

[0040] 2. Similarly, increasing the water cooling flow rate raises the performance requirements for the water pump. Furthermore, water cooling systems consume more electricity, which contradicts the general trend towards energy conservation.

[0041] The third approach involves a sealed design for the autonomous driving domain controller. This is achieved through measures such as installing sealing rings, vent valves, using rugged external connectors, and evacuating the internal gas of the domain controller. This prevents condensation by isolating the domain controller from external humid air.

[0042] However, this approach still has the following problems: 1. The domain controller sealing design requires the addition of sealing rings, vent valves, and the use of rugged connectors, significantly increasing the overall cost. Furthermore, the variety of rugged connectors available in the automotive industry is limited, hindering large-scale adoption. 2. Domain controllers operate in harsh environments, including high temperature, high humidity, and vibration, increasing the risk of seal failure. 3. Components require high dimensional precision to meet the domain controller sealing design requirements, increasing the difficulty of component manufacturing and indirectly increasing production and testing costs.

[0043] [First Embodiment] A domain controller 500 with a condensation prevention structure, see attached... Figure 1-7 As shown, the domain controller 500 includes: a housing 110; a chip disposed within the housing 110; a temperature sensor for monitoring the temperature of the chip; a temperature and humidity sensor 121 for detecting the temperature and humidity of the inner wall of the housing 110; a heating element 122 for heating the housing 110; and a processing module including a pre-stored enthalpy-humidity map. The processing module combines the data collected by the temperature sensor and the temperature and humidity sensor 121 with the enthalpy-humidity map to obtain the condensation temperature, and determines whether the heating element 122 is needed to heat the housing 110 based on the condensation temperature.

[0044] Preferably, the housing 110 is made of aluminum alloy. In the prior art, the housing 110 is typically made of aluminum alloy, which has good heat transfer properties. The chip is a SoC chip, serving as the brain of the domain controller 500, responsible for implementing and controlling the vehicle's autonomous driving functions. The chip's processing and control of the vehicle's autonomous driving functions is prior art and will not be elaborated upon here.

[0045] A temperature sensor (not shown in the figure) can be placed near the chip and connected by a wire to detect the core temperature of the chip. This allows for real-time monitoring of the chip's temperature. In subsequent calculations, the chip's temperature can be combined with the temperature and humidity of the inner wall 114 of the casing to calculate the dew point temperature of the casing 110. The difference between the dew point temperature and the temperature of the inner wall 114 of the casing can be used to determine which areas are at risk of condensation.

[0046] Temperature and humidity sensor 121 is used to detect the temperature and humidity of the inner wall 114 of the housing, facilitating the subsequent calculation of the dew point temperature using an enthalpy-humidity chart. An enthalpy-humidity chart is a line graph showing the relationship between various air parameters. The dew point temperature is the temperature at which air reaches saturation when cooled, assuming a constant water vapor content and air pressure. The dew point temperature is calculated by detecting the temperature and humidity of the inner wall 114 of the housing and applying the enthalpy-humidity chart. Since condensation is prone to occur in areas where the temperature difference between the inner wall 114 and the chip core temperature exceeds this dew point temperature, the heating element 122 can locally heat this area to eliminate condensation.

[0047] The processing module is part of the chip and includes a pre-stored enthalpy-humidity map. The processing module is used to combine the data collected by the temperature sensor and the temperature and humidity sensor 121 with the enthalpy-humidity map to obtain the condensation temperature, and to determine whether the heating element 122 is needed to heat the outer shell 110 based on the condensation temperature.

[0048] Preferably, the water-cooling cavity 112 includes: a water inlet cavity 1121 with a water inlet; a water outlet cavity 1122 with a water outlet; the water outlet cavity 1122 is connected to the water inlet cavity 1121; and the outer wall of the water inlet cavity 1121 is provided with at least one chip heat dissipation surface.

[0049] like Figure 7The water-cooling cavity 112 is U-shaped overall. The water inlet cavity 1121 is the straight part of the U-shape, and the water inlet is located on the outer shell 110 to facilitate the flow of cooling water through the water inlet. The water outlet cavity 1122 is the straight part of the U-shape, and the water outlet is located on the outer shell 110 to facilitate the flow of cooling water through the water outlet to the outside of the outer shell 110. The water outlet and water inlet are located on the same side of the outer shell 110. Water pipe connectors 111 are provided on both the water inlet and the water outlet. Two chip heat dissipation surfaces are provided on the outer wall of the water inlet cavity 1121, including a first chip heat dissipation surface 1131 located near the water inlet and water outlet, and a second chip heat dissipation surface 1132 located away from the water inlet and water outlet and near the curved part of the U-shaped water-cooling cavity 112. Both chip heat dissipation surfaces are in contact with the outer wall surface of the water inlet cavity 1121. The heat from the chip can be carried away through the chip heat dissipation surfaces to ensure its heat dissipation effect. The most direct way to improve the heat dissipation capacity of the SoC chip's heat dissipation surface is to increase the flow rate and temperature of the coolant in the water-cooling cavity 112. The flow rate will not be significantly improved due to the performance of the water pump and the actual heat exchange efficiency, while adjusting the temperature of the coolant can effectively improve the heat dissipation efficiency of the SoC chip's heat dissipation surface.

[0050] The SoC chip's heat dissipation surface is the primary heat source on the aluminum alloy casing 110. When the temperature of the coolant in the water-cooling cavity 112 is reduced, the surface temperature of the aluminum alloy casing 110, which is far from the SoC chip's heat dissipation surface, also decreases. This exacerbates the temperature difference on the aluminum alloy casing 110. Under certain humidity conditions, cold areas with large temperature differences on the aluminum alloy casing 110 are prone to condensation below the condensation temperature. (Cold areas: 1. Areas far from the heat source, where heat is difficult to transfer; 2. The area around the flow channels of the low-temperature coolant in the water-cooling cavity 112, where the coolant temperature is typically lower than the average temperature of the aluminum alloy casing 110.)

[0051] Preferably, heat dissipation fins are provided on the inner side corresponding to the heat dissipation surface of the chip.

[0052] The inner sides of the two chip heat dissipation surfaces mentioned above are equipped with heat dissipation fins. The heat dissipation fins can effectively improve the heat dissipation efficiency of the chip heat dissipation surface and increase the heat dissipation effect.

[0053] Preferably, the heating element 122 is fixedly connected to the inner wall 114 of the outer casing; a temperature and humidity sensor 121 is attached to the heating element 122; the inner wall 114 of the outer casing is provided with a groove 115 for mounting the temperature and humidity sensor 121; and the outer casing 110 is provided with a plurality of partition grooves 116 near the groove 115.

[0054] The heating element 122 is fixed to the inner wall 114 of the outer casing. Preferably, the heating element 122 can be fixed to the inner wall 114 of the outer casing 110 using double-sided adhesive 124. This double-sided adhesive 124 is made of high-temperature and moisture-resistant foam adhesive or VHB adhesive material that bonds firmly to the surface of the aluminum alloy outer casing 110. Alternatively, fixing screws, fixing plates, and fixing brackets can be used instead of double-sided adhesive 124 to achieve the same purpose of fixing the heating element 122 to the inner wall 114 of the outer casing. A temperature and humidity sensor 121 is SMT-mounted on the heating element 122. The temperature and humidity sensor 121 can detect the temperature and humidity of the inner wall 114 of the outer casing. To provide installation space for the temperature and humidity sensor 121, a groove 115 is provided in the inner wall 114 of the outer casing, and the temperature and humidity sensor 121 is installed in the groove 115 to complete the installation. In addition, in order to ensure that the heating element 122 does not affect the measurement accuracy of the temperature and humidity sensor 121 when heating a local area of ​​the outer shell 110, multiple partition grooves 116 are provided around the groove 115. The partition grooves 116 isolate the heat generated by the heating element 122 when heating the aluminum alloy outer shell 110 from being transferred to the surface of the groove 115, thus preventing the temperature and humidity sensor 121 from measuring the surface temperature of the aluminum alloy outer shell 110 before heating.

[0055] Preferably, the temperature and humidity sensor 121 is provided with ventilation holes 125 around it to allow humid air to flow from the back of the temperature and humidity sensor 121 to the front of the temperature and humidity sensor 121.

[0056] To ensure accurate measurement of the humidity on the inner surface of the aluminum alloy housing 110, ventilation holes 125 are provided around the temperature and humidity sensor 121. The ventilation holes 125 allow humid air to flow from the back of the temperature and humidity sensor 121 to the front, thus enabling accurate measurement of the humidity on the surface of the aluminum alloy housing 110 and ensuring data accuracy.

[0057] Preferably, the chip includes: a PCB board 300; and a connector 302, wherein the PCB board 300 is electrically connected to the connector 302.

[0058] The chip can be composed of a PCB board 300 and a connector 302. The chip can operate normally through the electrical connection between the connector 302 and the PCB board 300. The connector 302 is used to connect wires so that the temperature and humidity sensor 121 can be electrically connected to the chip through the aforementioned wires. Wires are also connected between the connector 302 and the heating element for the electrical connection between the heating element and the chip.

[0059] Preferably, the flexible connecting segment 123 extends from the side of the heating element 122, and the flexible connecting segment 123 is electrically connected to the connector 302.

[0060] The heating element 122 has a flexible connecting section 123 extending from its side, or extending and bending. The flexible connecting section 123 is a flexible circuit board used for circuit routing, so that the heating element 122 can be electrically connected to the connector 302 through the aforementioned flexible circuit board. The temperature and humidity sensor wiring 403 also connects to the flexible connecting section 123 through the heating element 122 and transmits data to the connector 302. The flexible circuit board can be replaced with a flexible flat cable, and the corresponding flexible circuit connector 302 can be replaced with a flexible flat cable connector 302. In summary, the flexible connecting section 123 can be used for power supply to the heating element 122 and signal transmission to the temperature and humidity sensor 121.

[0061] Preferably, the heating element 122 is provided with a positive heating wire 401 and a negative heating wire 402, which are made of metal foil or metal wire.

[0062] Since the wiring of the temperature and humidity sensor 121 is also connected to the flexible connection section 123, a certain safety space is reserved between the temperature and humidity sensor 121 and the positive and negative heating wires 402 to prevent direct heat transfer from the heating wire to the temperature and humidity sensor 121, ensuring that the heating wire and the temperature and humidity sensor 121 do not interfere with each other. The positive heating wire 401 and negative heating wire 402 arranged on the heating element 122 are important heating areas, and the actual wiring can be adjusted according to the heating efficiency. The placement of the heating element 122 is based on the CAE condensation analysis data of the domain controller 500, and the heating element 122 is placed in a position with a high probability of condensation based on the CAE condensation analysis data. The current state of the heating element 122 is not a specific state; in specific implementation, the current state of the heating element 122 can be adjusted according to the area of ​​the condensation surface and the potential high-risk condensation points in the domain controller 500.

[0063] Preferably, the heating element 122 includes one or more of PI heating film, PET heating sheet, and silicone heating sheet.

[0064] Using the aforementioned heating material allows the heating element 122 to heat the casing when the chip controls the heating element 122 to reduce condensation.

[0065] Preferably, the heating element 122 is fixedly connected to the flat area of ​​the housing 110 that is far from the heat dissipation surface of the chip and close to the water cooling cavity 112.

[0066] The heat source 122 is typically located on a flat area of ​​the aluminum alloy casing 110, away from the heat dissipation surface of the SoC chip, and as close as possible to the water cooling cavity 112. Under atmospheric pressure and the heat generated by the PCB board 300, humid air usually tends to rise to the top. Therefore, the domain controller 500 is mounted as horizontally as possible, with the aluminum alloy casing 110 located on top of the domain controller 500.

[0067] The principle of the present invention is as follows: 1) Before the domain controller 500 leaves the factory, the enthalpy-humidity diagram, the normal operating temperature T of the SoC chip (chip temperature resistance temperature), and the calculation formula processed by the processing module are entered into the processing module on the PCB board 300.

[0068] 2) When the domain controller 500 is working normally, the temperature sensor is first used to detect the core temperature of the SoC chip, and the collected data is T (core temperature);

[0069] 3) Temperature and humidity sensor 121 detects the housing temperature (T_ho) and ambient humidity %RH on the surface of the aluminum alloy housing 110;

[0070] 4) Then, the collected T (core temperature), T (case temperature), and %RH (humidity) are transmitted in real time to the processing module on the PCB board 300.

[0071] 6) The processing unit on the PCB board 300 calculates the condensation temperature T of the aluminum alloy shell 110 based on the received T (shell temperature) and %RH (humidity) combined with the enthalpy-humidity diagram pre-stored in the processing module. Based on the calculated condensation temperature T, it determines whether the aluminum alloy shell 110 needs to be heated.

[0072] 7) When the environmental data meets the following conditions, the processing module issues control commands to provide corresponding countermeasures:

[0073] 8) When T (shell temperature) > T (condensation temperature), heating element 122 does not work;

[0074] 9) When T (case temperature) < T (condensation temperature) and T (core temperature) < T (chip temperature resistance), the heating element 122 operates;

[0075] 10) When T (shell temperature) < T (condensation temperature) and T (core temperature) ≥ T (chip temperature resistance), the heating element 122 adjusts the heating parameters to heat until T (core temperature) < T (chip temperature resistance) and then restarts.

[0076] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A domain controller with a condensation prevention structure, characterized in that, The domain controller includes: a housing (110); The chip is disposed within the housing (110); A temperature sensor is used to monitor the temperature of the chip; A temperature and humidity sensor (121) is used to detect the temperature and humidity of the inner wall of the housing (110); A heating element (122) is used to heat the outer casing (110); The processing module includes a pre-stored enthalpy-humidity diagram. The processing module is used to combine the data collected by the temperature sensor and the temperature and humidity sensor (121) with the enthalpy-humidity diagram to obtain the dew point temperature, and to determine whether the heating element (122) is needed to heat the outer shell (110) based on the dew point temperature. Water-cooled cavity (112), including: The water inlet chamber (1121) is equipped with a water inlet; The water outlet chamber (1122) is equipped with a water outlet; The water outlet chamber (1122) is connected to the water inlet chamber (1121); The outer wall of the water inlet cavity (1121) is provided with at least one chip heat dissipation surface (113); The heating element (122) is fixedly connected to a flat area away from the heat dissipation surface (113) of the chip and located in the outer shell (110) and close to the water cooling cavity (112); The chip includes: PCB board (300); Connector (302), the PCB board (300) is electrically connected to the connector (302).

2. The domain controller with a condensation prevention structure according to claim 1, characterized in that, The inner side of the chip heat dissipation surface (113) is provided with heat dissipation fins.

3. The domain controller with a condensation prevention structure according to claim 1, characterized in that, The heating element (122) is fixedly connected to the inner wall (114) of the outer shell; a temperature and humidity sensor (121) is attached to the heating element (122); the inner wall (114) of the outer shell is provided with a groove (115) for the installation of the temperature and humidity sensor (121); and a plurality of partition grooves (116) are provided on the outer shell (110) near the groove (115).

4. The domain controller with a condensation prevention structure according to claim 1, characterized in that, The temperature and humidity sensor (121) is surrounded by vents (125) for allowing humid air to flow from the back of the temperature and humidity sensor to the front of the temperature and humidity sensor (121).

5. The domain controller with a condensation prevention structure according to claim 1, characterized in that, The heating element (122) has a flexible connecting section (123) extending from its side, and the flexible connecting section (123) is electrically connected to the connector (302).

6. The domain controller with a condensation prevention structure according to claim 1, characterized in that, The heating element (122) is provided with a positive heating wire (401) and a negative heating wire (402), which are made of metal foil or metal wire.

7. The domain controller with a condensation prevention structure according to claim 5, characterized in that, The heating element (122) includes one or more of PI heating film, PET heating sheet, and silicone heating sheet.

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