Display module and manufacturing method thereof, and display device

Abstract

The present disclosure provides a display module and a manufacturing method thereof, and a display device, which belong to the field of display technology. The display module includes a cover plate; a display panel, the display panel includes a non-bending area, a first bending area and a binding area connected in sequence, the non-bending area includes a central area and a peripheral area located outside the central area; a flexible circuit board, connected to the side of the binding area away from the cover plate, the flexible circuit board includes a third area, a second bending area and a fourth area connected in sequence, the fourth area is bent to the side of the third area away from the cover plate through the second bending area; a first support member, provided on the surface of the third area of ​​the flexible circuit board away from the cover plate; a protective layer, attached to the second area, at least part of the protective layer is located on the side of the flexible circuit board away from the cover plate, and the side wall of the first support member is attached to at least part of the side wall of the protective layer. The present disclosure helps to reduce the deformation of the display panel during injection molding or protect the display panel from deformation.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a manufacturing method thereof, and a display device. Background Art

[0002] In a display device, a display panel and the like are generally attached to a cover plate, and then the cover plate is connected to a middle frame, so that the middle frame supports the display module through the cover plate.

[0003] In the prior art, an injection molding process is usually used to form a hard resin ring on the back side (the side away from the light-emitting surface) of the display module, and the resin ring is connected to the middle frame. However, the mold used in the injection molding process is prone to deformation of the display panel.

[0004] The above information disclosed in the Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may include information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0005] The purpose of the present disclosure is to provide a display module and a manufacturing method thereof, and a display device, so as to improve the quality of the display module.

[0006] In order to achieve the above-mentioned invention object, the present invention adopts the following technical solutions:

[0007] According to a first aspect of the present disclosure, there is provided a display module, comprising:

[0008] A cover plate having a first area and a second area located outside the first area;

[0009] A display panel is provided on one side of the cover plate, wherein the orthographic projection of the display panel on the cover plate is located in the first area, wherein the display panel comprises a non-bending area, a first bending area and a binding area connected in sequence, wherein the binding area is bent through the first bending area to a side of the non-bending area away from the cover plate, and wherein the non-bending area comprises a central area and a peripheral area located outside the central area;

[0010] a flexible circuit board connected to a side of the binding area away from the cover plate, the flexible circuit board comprising a third area, a second bending area and a fourth area connected in sequence, the fourth area being bent through the second bending area to a side of the third area away from the cover plate, and in a direction parallel to the cover plate, a maximum distance between an edge of the third area and an edge of the display panel is less than a minimum distance between an edge of the second bending area and an edge of the display panel;

[0011] A first support member is provided on a surface of the third region of the flexible circuit board away from the cover plate, wherein an orthographic projection of the first support member on the cover plate is located within an orthographic projection of the peripheral region on the cover plate;

[0012] A protective layer is adhered to the second area, the height of the protective layer is not less than the distance from the flexible circuit board to the cover plate, at least a portion of the protective layer is located on the side of the flexible circuit board away from the cover plate, and the side wall of the first support member is adhered to at least a portion of the side wall of the protective layer.

[0013] In an exemplary embodiment of the present disclosure, the display module further includes:

[0014] A composite heat dissipation film, provided between the display panel and the flexible circuit board;

[0015] A second support member is arranged on a surface of the composite heat dissipation film away from the cover plate, the orthographic projection of the second support member on the cover plate does not overlap with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support member on the cover plate is located within the orthographic projection of the peripheral area on the cover plate.

[0016] In an exemplary embodiment of the present disclosure, the material of the first supporting member or the second supporting member includes closed-cell foam.

[0017] In an exemplary embodiment of the present disclosure, the orthographic projections of the first support member and the second support member on the cover plate are connected to form a non-closed ring structure surrounding the orthographic projection of the central area on the cover plate.

[0018] In an exemplary embodiment of the present disclosure, in the direction from the central area to the peripheral area, the width of the first support member is 1 mm-2 mm, and the width of the second support member is 1 mm-2 mm;

[0019] In a direction perpendicular to the cover plate, the thickness of the first support member is 0.2 mm-0.5 mm, and the thickness of the second support member is 0.2 mm-0.5 mm.

[0020] In an exemplary embodiment of the present disclosure, in a direction parallel to the cover plate, a distance between an edge of the third region and an edge of the display panel is 0 mm-0.1 mm.

[0021] In an exemplary embodiment of the present disclosure, the protection layer is formed by an injection molding process.

[0022] According to a second aspect of the present disclosure, a method for manufacturing a display module is provided, comprising:

[0023] A mold core is provided, wherein the mold core has a receiving cavity, the mold core comprises a first mold core and a second mold core, the second mold core is located on one side of the first mold core in a first direction, the second mold core and the first mold core abut to form the receiving cavity, and the second mold core is provided with an injection port that penetrates the receiving cavity;

[0024] Placing a display assembly in the accommodating cavity, the display assembly comprising a cover plate, a display panel, a flexible circuit board and a first support member, wherein the first direction is perpendicular to the plane where the cover plate is located;

[0025] The cover plate has a first area and a second area located outside the first area; the display panel is arranged on one side of the cover plate, and the orthographic projection of the display panel on the cover plate is located in the first area; the display panel includes a non-bending area, a first bending area and a binding area connected in sequence, and the binding area is bent to the side of the non-bending area away from the cover plate through the first bending area, and the non-bending area includes a central area and a peripheral area located outside the central area; a flexible circuit board is connected to the side of the binding area away from the cover plate, and the flexible circuit board includes a third area, a second bending area and a fourth area connected in sequence, and the fourth area is bent to the side of the third area away from the cover plate through the second bending area, and in a direction parallel to the cover plate, the maximum distance between the edge of the third area and the edge of the display panel is less than the minimum distance between the edge of the second bending area and the edge of the display panel; a first support member is arranged on the surface of the third area of ​​the flexible circuit board away from the cover plate, and the orthographic projection of the first support member on the cover plate is located within the orthographic projection of the peripheral area on the cover plate;

[0026] Injecting a molding material through the injection port of the second mold core to form a protective layer, wherein the protective layer is attached to the second region, the height of the protective layer is not less than the distance from the flexible circuit board to the cover plate, at least a portion of the protective layer is located on a side of the flexible circuit board away from the cover plate, and the side wall of the first support member is attached to at least a portion of the side wall of the protective layer;

[0027] Wherein, the side wall of the second mold core includes a first side wall and a second side wall located outside the first side wall, an injection cavity is formed between the first side wall and the second side wall, the second side wall abuts against the side wall of the first mold core, and at least part of the first side wall abuts against the first support member.

[0028] In an exemplary embodiment of the present disclosure, the display assembly further includes a composite heat dissipation film and a second support member, wherein the composite heat dissipation film is disposed between the display panel and the flexible circuit board; the second support member is disposed on a surface of the composite heat dissipation film away from the cover plate, the orthographic projection of the second support member on the cover plate does not overlap with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support member on the cover plate is located within the orthographic projection of the peripheral area on the cover plate;

[0029] The orthographic projection of the first side wall on the cover plate is located within the orthographic projection of the first support member and the second support member combined on the cover plate.

[0030] According to a third aspect of the present disclosure, a display device is provided, comprising the display module as described in the first aspect.

[0031] The display module provided by the present disclosure has a first support member disposed on the surface of the third region of the flexible circuit board away from the cover plate, and the orthographic projection of the first support member on the cover plate is located within the orthographic projection of the peripheral region of the display panel on the cover plate. In this structure, the flexible circuit board has a certain structural strength, which can provide a certain supporting force to the first support member, and the arrangement of the first support member provides a structural basis for forming the display module by the injection molding process, which helps to reduce the deformation of the display panel or protect the display panel from deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0033] Figure 1 is a schematic diagram of a cross-sectional structure of a display module in an exemplary embodiment of the present disclosure;

[0034] Figure 2 is a schematic diagram of the cover plate structure in an exemplary embodiment of the present disclosure;

[0035] Figure 3 is a schematic diagram of the structure of the non-bending area of ​​the display panel in an exemplary embodiment of the present disclosure;

[0036] Figure 4 is a schematic diagram of the unfolded structure of the flexible circuit board in the exemplary embodiment of the present disclosure;

[0037] Figure 5 is a schematic diagram of a planar structure of a display module in an exemplary embodiment of the present disclosure;

[0038] Figure 6 is another planar structural schematic diagram of a display module in an exemplary embodiment of the present disclosure;

[0039] Figure 7is a schematic structural diagram of a flexible circuit board in a display module when it is unfolded in an exemplary embodiment of the present disclosure;

[0040] Figure 8 is a schematic diagram of the mold core structure in an exemplary embodiment of the present disclosure;

[0041] Fig. 9 It is a schematic diagram of the structure of the protective layer formed by injection molding in an exemplary embodiment of the present disclosure.

[0042] The main components in the figure are described as follows:

[0043] 100-cover plate; 110-first area; 120-second area; 200-display panel; 210-non-bending area; 211-central area; 212-peripheral area; 220-first bending area; 230-binding area; 300-flexible circuit board; 301-third area; 302-second bending area; 303-fourth area; 401-first support member; 402-second support member; 500-protective layer; 600-composite heat dissipation film; 700-optical adhesive layer; 800-polarizing layer; 11-first mold core; 12-second mold core; 121-injection port; 122-first side wall; 123-second side wall; 124-injection cavity; 13-accommodating cavity; 01-first mold frame; 02-second mold frame. DETAILED DESCRIPTION

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the disclosure will be more comprehensive and complete and the concepts of the example embodiments are fully conveyed to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure.

[0045] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

[0046] The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, etc. may be adopted. In other cases, known structures, materials or operations are not shown or described in detail to avoid blurring the main technical ideas of the present disclosure.

[0047] When a structure is “on” another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is “directly” disposed on the other structure, or that the structure is “indirectly” disposed on the other structure via another structure.

[0048] The terms "a", "an", "the" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to indicate an open-ended inclusive meaning and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc. The terms "first" and "second" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0049] In the related art, when an injection molding process is used to form a hard resin ring on the back side of the display component (the side away from the light-emitting surface), the display component is usually placed in a receiving cavity formed by a lower mold core and an upper mold core. The display component includes a display panel, a flexible circuit board arranged on the backlight surface of the display panel, and a composite heat dissipation film arranged between the display panel and the flexible circuit board. The upper mold core is provided with an injection hole, and the injection material can enter the injection cavity through the injection hole to form a resin ring. In the related art, the upper mold core will abut against the composite heat dissipation film during injection molding, and the composite heat dissipation film is generally a multi-layer structure, including SCF layers and metal layers stacked in sequence in the direction away from the display panel. When the upper mold core abuts against the metal layer, the metal layer will be deformed, thereby causing the composite heat dissipation film to deform, and further causing the display panel and other structures to deform.

[0050] like Figures 1 to 6As shown, the present disclosure provides a display module, including a cover plate 100, a display panel 200, a flexible circuit board 300, a first support member 401 and a protective layer 500. The cover plate 100 has a first area 110 and a second area 120 located outside the first area 110. The display panel 200 is arranged on one side of the cover plate 100, and the orthographic projection of the display panel 200 on the cover plate 100 is located in the first area 110. The display panel 200 includes a non-bending area 210, a first bending area 220 and a binding area 230 connected in sequence. The binding area 230 is bent to the side of the non-bending area 210 away from the cover plate 100 through the first bending area 220. The non-bending area 210 includes a central area 211 and a peripheral area 212 located outside the central area 211. The flexible circuit board 300 is connected to the side of the binding area 230 away from the cover plate 100. The flexible circuit board 300 includes a third area 301, a second bending area 302 and a fourth area 303 connected in sequence. The fourth area 303 is bent through the second bending area 302 to the side of the third area 301 away from the cover plate 100. In the direction parallel to the cover plate 100, the maximum distance between the edge of the third area 301 and the edge of the display panel 200 is less than the minimum distance between the edge of the second bending area 302 and the edge of the display panel 200. The first support member 401 is provided on the surface of the third area 301 of the flexible circuit board 300 away from the cover plate 100, and the orthographic projection of the first support member 401 on the cover plate 100 is located within the orthographic projection of the peripheral area 212 on the cover plate 100. The protective layer 500 is adhered to the second area 120, the height of the protective layer 500 is not less than the distance from the flexible circuit board 300 to the cover plate 100, at least a portion of the protective layer 500 is located on the side of the flexible circuit board 300 away from the cover plate 100, and at least a portion of the side wall of the protective layer 500 is adhered to the first support member 401.

[0051] In the display module provided by the present disclosure, the first support member 401 is disposed on the surface of the third area 301 of the flexible circuit board 300 away from the cover plate 100, and the orthographic projection of the first support member 401 on the cover plate 100 is located within the orthographic projection of the peripheral area 212 of the display panel 200 on the cover plate 100. In this structure, the flexible circuit board 300 has a certain structural strength, which can provide a certain supporting force to the first support member 401, and the arrangement of the first support member 401 provides a structural basis for forming a display module by injection molding, which helps to reduce the deformation of the display panel 200 or protect the display panel 200 from deformation.

[0052] The specific structures of the components of the display module provided by the present disclosure will be described in detail below with reference to the accompanying drawings and specific embodiments:

[0053] like Figures 1 to 6As shown, the present disclosure provides a display module, including a cover plate 100 , a display panel 200 , a flexible circuit board 300 , a first support member 401 and a protective layer 500 .

[0054] like Figure 1 and Figure 2 As shown, the cover plate 100 may be a transparent cover plate 100, such as glass. The cover plate 100 has a first area 110 and a second area 120 located outside the first area 110. The display panel 200 is disposed on one side of the cover plate 100. The display panel 200 has a light emitting surface and a non-light emitting surface away from the light emitting surface. The cover plate 100 is located on one side of the light emitting surface of the display panel 200. The orthographic projection of the display panel 200 on the cover plate 100 is located in the first area 110. The display panel 200 may be a flexible display panel, such as an OLED (Organic Light-Emitting Diode) display panel.

[0055] The display panel 200 may include structures such as a substrate, a driving circuit layer and a light-emitting device layer. The driving circuit layer is arranged on one side of the substrate, and the light-emitting device layer is arranged on the side of the driving circuit layer away from the substrate. The light-emitting device layer includes a plurality of light-emitting devices. The driving circuit layer is used to drive the light-emitting device to emit light. Among them, the material of the substrate included in the display panel 200 may be polyimide (PI). The substrate may also be a composite of multiple layers of materials. For example, in one embodiment of the present disclosure, the substrate may include a bottom film layer (Bottom Film), a pressure-sensitive adhesive layer, a first polyimide layer and a second polyimide layer stacked in sequence.

[0056] like Figure 1 and Figure 3 As shown, the orthographic projection of the display panel 200 on the cover plate 100 is located in the first area 110, and the display panel 200 includes a non-bending area 210, a first bending area 220 and a binding area 230 connected in sequence, and the binding area 230 is bent to the side of the non-bending area 210 away from the cover plate 100 through the first bending area 220. The non-bending area 210 is used to display the picture. The first bending area 220 can be bent to form a side display area of ​​the electronic display device.

[0057] The non-bending area 210 includes a central area 211 and a peripheral area 212 located outside the central area 211. The shape of the non-bending area 210 can be roughly circular, rectangular, or regular polygonal, etc., which is not limited in the present disclosure. The peripheral area 212 can surround the central area 211, that is, surround the central area 211.

[0058] like Figure 1 , Figure 4 and Figure 5As shown, the flexible circuit board 300 is connected to the side of the binding area 230 away from the cover plate 100. The flexible circuit board 300 can be in various shapes, and the specific shape can be adjusted according to the shape of the non-bending area 210 of the display panel 200. The flexible circuit board 300 includes a third area 301, a second bending area 302 and a fourth area 303 connected in sequence, and the fourth area 303 is bent to the side of the third area 301 away from the cover plate 100 through the second bending area 302. In the direction parallel to the cover plate 100, the maximum distance between the edge of the third area 301 and the edge of the display panel 200 is less than the minimum distance between the edge of the second bending area and the edge of the display panel 200.

[0059] For example, the outer edge of the third area 301 of the flexible circuit board 300 is substantially flush with the edge of the display panel 200, and the edge of the second bending area 302 is retracted toward the center of the display panel 200 by a distance compared to the edge of the display panel 200. Specifically, the distance between the outer edge of the third area 301 of the flexible circuit board 300 and the edge of the display panel 200 can be 0mm-0.1mm, preferably 0mm-0.05mm, and specifically can be 0mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm or any other value between 0mm-0.05mm. Within this numerical range, the outer edge of the third area 301 of the flexible circuit board 300 is substantially flush with the edge of the display panel 200, which helps to provide a structural basis for the subsequent arrangement of the first support member 401. The distance between the edge of the second bending area 302 and the edge of the display panel 200 is relatively large, and the distance can be greater than 1mm, such as 1.5mm, 2mm, 3mm, 4mm or more. The fourth area 303 of the flexible circuit board 300 is bent to the side of the third area 301 away from the cover plate 100 through the second bending zone 302, and the orthographic projection of the fourth area 303 of the flexible circuit board 300 on the cover plate 100 is located within the orthographic projection of the third area 301 of the flexible circuit board 300 on the cover plate 100.

[0060] In some embodiments of the present disclosure, the flexible circuit board 300 is a multi-layer stacked structure. Specifically, the flexible circuit board 300 is formed by alternately stacking green oil protective layers and metal layers, and the material of the metal layer can be copper (Cu). The number of green oil protective layers and metal layers included in the flexible circuit board 300 is not limited. For example, in one embodiment, the flexible circuit board includes three layers of green oil protective layers and three layers of metal layers, wherein the outermost surface of the flexible circuit board 300 can be a green oil protective layer to protect the route in the metal layer.

[0061] like Figure 1 , Figure 3 , Figure 4 and Figure 5As shown, the first support member 401 is disposed on the surface of the third region 301 of the flexible circuit board 300 away from the cover plate 100, and the orthographic projection of the first support member 401 on the cover plate 100 is located within the orthographic projection of the peripheral area 212 on the cover plate 100, that is, the first support member 401 is located at the edge of the third region 301 of the flexible circuit board 300. The shape of the first support member 401 can be set according to the shape of the third region 301 of the flexible circuit board 300. For example, if the third region 301 of the flexible circuit board 300 is roughly semicircular or more semicircular, the shape of the orthographic projection of the first support member 401 on the cover plate 100 can be roughly a non-closed annular structure, such as an arc.

[0062] In some embodiments of the present disclosure, the first support member 401 is an elastic structure, for example, the material of the first support member 401 includes foam, preferably closed-cell foam. Compared with open-cell foam, closed-cell foam has better stability and rigidity while having a certain elasticity. In the direction from the central area 211 to the peripheral area 212, the width of the first support member 401 is 1mm-2mm, specifically 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, but not limited thereto. In a direction perpendicular to the cover plate 100, the thickness of the first support member 401 is 0.2 mm-0.5 mm, and can be 0.2 mm, 0.22 mm, 0.24 mm, 0.25 mm, 0.26 mm, 0.28 mm, 0.3 mm, 0.32 mm, 0.34 mm, 0.35 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.44 mm, 0.45 mm, 0.46 mm, 0.48 mm or 0.5 mm, but is not limited thereto. The first support member 401 can be connected to the flexible circuit board 300 through an adhesive layer.

[0063] like Figure 1 , Figure 5 and Figure 6As shown, the protective layer 500 is attached to the second area 120 of the cover plate 100, and the height of the protective layer 500 is not less than the distance from the flexible circuit board 300 to the cover plate 100. The protective layer 500 can be attached to the surface of the second area 120 of the cover plate 100 close to the display panel 200, and can further be attached to the side wall of the cover plate 100. The protective layer 500 can surround the display panel 200 to wrap the side wall of the display panel 200, and can further wrap the first bending area 220 of the display panel 200. At least part of the protective layer 500 is located on the side of the flexible circuit board 300 away from the cover plate 100, and the side wall of the first support member 401 is attached to at least part of the side wall of the protective layer 500. That is, the protective layer 500 wraps at least part of the display panel 200 and the flexible circuit board 300. The shape of the protective layer 500 can be adjusted according to the shape of the display panel 200. For example, if the orthographic projection of the display panel 200 on the cover plate 100 is approximately circular, then the orthographic projection of the protective layer 500 on the cover plate 100 is approximately a circular ring. If the orthographic projection of the display panel 200 on the cover plate 100 is approximately rectangular, then the orthographic projection of the protective layer 500 on the cover plate 100 is approximately a rectangular ring. The material of the protective layer 500 can be epoxy resin, polyurethane, silicone and other materials.

[0064] like Figures 1 to 5 As shown, in some embodiments of the present disclosure, the display module further includes a composite heat dissipation film 600 and a second support member 402, and the composite heat dissipation film 600 is disposed between the display panel 200 and the flexible circuit board 300. Specifically, the composite heat dissipation film 600 is located between the non-bending area 210 of the display panel 200 and the flexible circuit board 300. The composite heat dissipation film 600 includes a buffer layer and a reinforcement layer stacked, and the reinforcement layer is located on the side of the buffer layer away from the display panel 200. The buffer layer may be a SCF (Super Clean Foam, super clean foam) layer, and the reinforcement layer has a strong structural strength and mainly plays a fixing role. The reinforcement layer may be a metal layer, such as a copper layer.

[0065] The second support member 402 is disposed on the surface of the composite heat dissipation film 600 away from the cover plate 100, and the orthographic projection of the second support member 402 on the cover plate 100 does not overlap with the orthographic projection of the third area 301 on the cover plate 100, and the orthographic projection of the second support member 402 on the cover plate 100 is located within the orthographic projection of the peripheral area 212 on the cover plate 100. Further, as Figure 7 As shown, when the flexible circuit board 300 is in the unfolded state, that is, the fourth area 303 of the flexible circuit board 300 is not bent to the side of the third area 301 away from the cover plate 100 through the second bending zone 302, the fourth area 303, the second bending zone 302 and the third area 301 of the flexible circuit board 300 are roughly in the same plane, the orthographic projection of the second support member 402 on the cover plate 100 at least partially overlaps with the orthographic projection of the fourth area 303 of the flexible circuit board 300 on the cover plate 100.

[0066] The shape of the second support member 402 can be set according to the shape of the display panel 200. For example, if the display panel 200 is substantially circular, the shape of the orthographic projection of the second support member 402 on the cover plate 100 can be substantially a non-closed annular structure, such as an arc.

[0067] In some embodiments of the present disclosure, the second support member 402 is an elastic structure, for example, the material of the second support member 402 includes foam, preferably closed-cell foam. In the direction from the central area 211 to the peripheral area 212, the width of the second support member 402 is 1mm-2mm, specifically 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, but not limited thereto. In the direction perpendicular to the cover plate 100, the thickness of the second support member 402 is 0.2mm-0.5mm, specifically 0.2mm, 0.22mm, 0.24mm, 0.25mm, 0.26mm, 0.28mm, 0.3mm, 0.32mm, 0.34mm, 0.35mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.45mm, 0.46mm, 0.48mm or 0.5mm, but is not limited to this.

[0068] The second support member 402 can be connected to the composite heat dissipation film 600 through an adhesive layer. In practical applications, before the second support member 402 is attached to the composite heat dissipation film 600, the flexible circuit board 300 is in an unfolded state, and adhesive layers with different adhesive strengths can be respectively provided on the two side surfaces of the second support member 402, such as a strong adhesive with strong adhesive strength on one side surface and a weak adhesive with weak adhesive strength on the other side surface. The weak adhesive surface of the second support member 402 can be connected to the fourth area 303 of the flexible circuit board 300, and a certain bearing capacity is given to the second support member 402 through the fourth area 303 of the flexible circuit board 300, and then the strong adhesive surface of the second support member 402 is connected to the composite heat dissipation film 600, and the weak adhesive surface is separated from the flexible circuit board 300, so that the second support member 402 can be connected to the composite heat dissipation film 600.

[0069] like Figure 5 As shown, in some embodiments of the present disclosure, the orthographic projections of the first support member 401 and the second support member 402 on the cover plate 100 are connected to form a non-closed annular structure surrounding the orthographic projection of the central area 211 on the cover plate 100. It should be noted that the annular structure here does not specifically refer to a circular ring, and it can also be a ring of other shapes, such as a rectangular ring, a square ring or other polygonal rings.

[0070] like Figure 8 and Fig. 9As shown, in the present disclosure, the protective layer 500 can be formed by an injection molding process. Specifically, the following steps can be performed:

[0071] (1) A mold core is provided, wherein the mold core has a receiving cavity 13, and a second mold core 12 is located on one side of the first mold core 11 in the first direction. The second mold core 12 and the first mold core 11 are in contact with each other to form the receiving cavity 13, and the second mold core 12 is provided with an injection port 121 that is in communication with the receiving cavity 13. The first mold core 11 and the second mold core 12 can be fixed by a first mold frame 01 and a second mold frame 02.

[0072] (2) The display assembly is placed in the accommodating cavity 13, and the display assembly includes a cover plate 100, a display panel 200, a flexible circuit board 300 and a first support member 401. The first direction is perpendicular to the plane where the cover plate 100 is located. The structures of the cover plate 100, the display panel 200, the flexible circuit board 300 and the first support member 401 can refer to the above embodiment and are not described in detail here.

[0073] (3) The molding material is injected through the injection port 121 of the second mold core 12 to form the protective layer 500 .

[0074] The side wall of the second mold core 12 includes a first side wall 122 and a second side wall 123 located outside the first side wall 122. An injection cavity 124 is formed between the first side wall 122 and the second side wall 123. The injection cavity 124 is connected to the injection port 121. The second side wall 123 abuts against the side wall of the first mold core 11. At least part of the first side wall 122 abuts against the first support member 401. The injection material is injected into the injection cavity 124 through the injection port 121, and the injection material can form a protective layer 500. The first side wall 122 can be abutted against the first support member 401 by interference fit. In this way, the first support member 401 can absorb and buffer the impact force of the first side wall 122 of the second mold core 12 on the display panel 200, the composite heat dissipation film 600, etc., avoid forming a mold mark on the composite heat dissipation film 600 and other structures, thereby helping to prevent these structures from being deformed.

[0075] Further, the display assembly further includes a second support member 402, and the orthographic projection of the first side wall 122 on the cover plate 100 is located within the orthographic projection of the first support member 401 and the second support member 402 on the cover plate 100. Specifically, in a direction parallel to the cover plate 100, the width of the first side wall 122 is smaller than the width of the first support member 401 or the second support member 402, and the width of the first side wall 122 is 0.6 mm-0.8 mm.

[0076] like Figure 1As shown, in some embodiments of the present disclosure, the display module may further include an optical adhesive layer 700 and a polarizing layer 800. The optical adhesive layer 700 is disposed between the non-bending region 210 of the display panel 200 and the cover plate 100, and the polarizing layer 800 is disposed between the optical adhesive layer 700 and the non-bending region 210 of the display panel 200.

[0077] The polarizing layer 800 is used to solve the reflection problem of external light to meet the anti-reflection requirements of display products. In some embodiments, the polarizing layer 800 includes a phase difference layer and a polarizing layer. The phase difference layer and the polarizing layer can be connected by a pressure-sensitive adhesive layer. The phase difference layer is arranged on the side of the optical adhesive layer 700 away from the display panel 200; the polarizing layer is arranged on the side of the phase difference layer away from the display panel 200, and the orthographic projection of the polarizing layer on the display panel 200 at least partially overlaps with the orthographic projection of the phase difference layer on the display panel 200.

[0078] The phase difference layer can be a single layer or multiple layers, which can be a half-wave plate or a quarter-wave plate, or a combination thereof, and the polarization characteristics of photons are adjusted by the half-wave plate or the quarter-wave plate. The polarization layer can be an iodine-based polarization layer, which is obtained by dyeing with iodine dye and has polarization performance based on the optical dichroism of the crystal.

[0079] Furthermore, the display panel 200 further includes a third support member 403 , which is disposed between the binding area 230 of the display panel 200 and the composite heat dissipation film 600 to support the binding area 230 .

[0080] like Figures 1 to 6 , Figure 8 and Fig. 9 As shown, the present disclosure also provides a method for manufacturing a display module, comprising:

[0081] Step S100, providing a mold core, the mold core having a receiving cavity 13, the mold core comprising a first mold core 11 and a second mold core 12, the second mold core 12 is located on one side of the first mold core 11 in the first direction, the second mold core 12 and the first mold core 11 abut to form the receiving cavity 13, and the second mold core 12 is provided with an injection port 121 that penetrates the receiving cavity 13;

[0082] Step S200, placing the display assembly in the accommodating cavity 13, the display assembly comprising the cover plate 100, the display panel 200, the flexible circuit board 300 and the first support member 401, and the first direction is perpendicular to the plane where the cover plate 100 is located;

[0083] The cover plate 100 has a first area 110 and a second area 120 located outside the first area 110; the display panel 200 is arranged on one side of the cover plate 100, and the orthographic projection of the display panel 200 on the cover plate 100 is located in the first area 110; the display panel 200 includes a non-bending area 210, a first bending area 220 and a binding area 230 connected in sequence, the binding area 230 is bent to the side of the non-bending area 210 away from the cover plate 100 through the first bending area 220, and the non-bending area 210 includes a central area 211 and a peripheral area 212 located outside the central area 211; the flexible circuit board 300 is connected to the side of the binding area 230 away from the cover plate 100, and the flexible circuit board 300 is connected to the side of the binding area 230 away from the cover plate 100. The board 300 includes a third area 301, a second bending area 302 and a fourth area 303 connected in sequence, the fourth area 303 is bent to the side of the third area 301 away from the cover plate 100 through the second bending area 302, and in a direction parallel to the cover plate 100, the maximum distance between the edge of the third area 301 and the edge of the display panel 200 is less than the minimum distance between the edge of the second bending area 302 and the edge of the display panel 200; the first support member 401 is provided on the surface of the third area 301 of the flexible circuit board 300 away from the cover plate 100, and the orthographic projection of the first support member 401 on the cover plate 100 is located within the orthographic projection of the peripheral area 212 on the cover plate 100;

[0084] Step S300, injecting the injection material through the injection port 121 of the second mold core 12 to form a protective layer 500, the protective layer 500 is attached to the second area 120, the height of the protective layer 500 is not less than the distance from the flexible circuit board 300 to the cover plate 100, at least a portion of the protective layer 500 is located on the side of the flexible circuit board 300 away from the cover plate 100, and the side wall of the first support member 401 is attached to at least a portion of the side wall of the protective layer 500;

[0085] Among them, the side wall of the second mold core 12 includes a first side wall 122 and a second side wall 123 located outside the first side wall 122, an injection cavity 124 is formed between the first side wall 122 and the second side wall 123, the second side wall 123 abuts against the side wall of the first mold core 11, and at least part of the first side wall 122 abuts against the first support member 401.

[0086] In some embodiments of the present disclosure, the display component also includes a composite heat dissipation film 600 and a second support member 402, the composite heat dissipation film 600 is arranged between the display panel 200 and the flexible circuit board 300; the second support member 402 is arranged on the surface of the composite heat dissipation film 600 away from the cover plate 100, the orthographic projection of the second support member 402 on the cover plate 100 does not overlap with the orthographic projection of the third area 301 on the cover plate 100, and the orthographic projection of the second support member 402 on the cover plate 100 is located within the orthographic projection of the peripheral area 212 on the cover plate 100; wherein, the orthographic projection of the first side wall 122 on the cover plate 100 is located within the orthographic projection of the first support member 401 and the second support member 402 on the cover plate 100.

[0087] The present disclosure also provides a display device, including a display module, which can be a display module of any of the above embodiments, and its specific structure and beneficial effects can refer to the embodiments of the display module above, which will not be repeated here. The display device of the present disclosure can be an electronic device such as a mobile phone, a tablet computer, a television, etc., which will not be listed one by one here.

[0088] It should be noted that, although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in the specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc., which shall all be considered as part of the present disclosure.

[0089] It should be understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed in this specification. The present disclosure can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or the drawings. All these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A display module, characterized in that: include: A cover plate having a first area and a second area located outside the first area; A display panel is provided on one side of the cover plate, wherein the orthographic projection of the display panel on the cover plate is located in the first area, wherein the display panel comprises a non-bending area, a first bending area and a binding area connected in sequence, wherein the binding area is bent through the first bending area to a side of the non-bending area away from the cover plate, and wherein the non-bending area comprises a central area and a peripheral area located outside the central area; a flexible circuit board connected to a side of the binding area away from the cover plate, the flexible circuit board comprising a third area, a second bending area and a fourth area connected in sequence, the fourth area being bent through the second bending area to a side of the third area away from the cover plate, and in a direction parallel to the cover plate, a maximum distance between an edge of the third area and an edge of the display panel is less than a minimum distance between an edge of the second bending area and an edge of the display panel; A first support member is provided on a surface of the third region of the flexible circuit board away from the cover plate, wherein an orthographic projection of the first support member on the cover plate is located within an orthographic projection of the peripheral region on the cover plate; A protective layer is adhered to the second area, the height of the protective layer is not less than the distance from the flexible circuit board to the cover plate, at least a portion of the protective layer is located on the side of the flexible circuit board away from the cover plate, and the side wall of the first support member is adhered to at least a portion of the side wall of the protective layer.

2. The display module according to claim 1, characterized in that: The display module also includes: A composite heat dissipation film, provided between the display panel and the flexible circuit board; A second support member is arranged on a surface of the composite heat dissipation film away from the cover plate, the orthographic projection of the second support member on the cover plate does not overlap with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support member on the cover plate is located within the orthographic projection of the peripheral area on the cover plate.

3. The display module according to claim 2, characterized in that: The material of the first supporting member or the second supporting member includes closed-cell foam.

4. The display module according to claim 2, characterized in that: The orthographic projections of the first support member and the second support member on the cover plate are connected to form a non-closed ring structure surrounding the orthographic projection of the central area on the cover plate.

5. The display module according to claim 2, characterized in that: In the direction from the central area to the peripheral area, the width of the first support member is 1 mm-2 mm, and the width of the second support member is 1 mm-2 mm; In a direction perpendicular to the cover plate, the thickness of the first support member is 0.2 mm-0.5 mm, and the thickness of the second support member is 0.2 mm-0.5 mm.

6. The display module according to claim 1, characterized in that: In a direction parallel to the cover plate, a distance between an edge of the third region and an edge of the display panel is 0 mm-0.1 mm.

7. The display module according to claim 1, characterized in that: The protective layer is formed by an injection molding process.

8. A method for manufacturing a display module, characterized in that: include: A mold core is provided, wherein the mold core has a receiving cavity, the mold core comprises a first mold core and a second mold core, the second mold core is located on one side of the first mold core in a first direction, the second mold core and the first mold core abut to form the receiving cavity, and the second mold core is provided with an injection port that penetrates the receiving cavity; Placing a display assembly in the accommodating cavity, the display assembly comprising a cover plate, a display panel, a flexible circuit board and a first support member, wherein the first direction is perpendicular to the plane where the cover plate is located; The cover plate has a first area and a second area located outside the first area; the display panel is arranged on one side of the cover plate, and the orthographic projection of the display panel on the cover plate is located in the first area; the display panel includes a non-bending area, a first bending area and a binding area connected in sequence, and the binding area is bent to the side of the non-bending area away from the cover plate through the first bending area, and the non-bending area includes a central area and a peripheral area located outside the central area; a flexible circuit board is connected to the side of the binding area away from the cover plate, and the flexible circuit board includes a third area, a second bending area and a fourth area connected in sequence, and the fourth area is bent to the side of the third area away from the cover plate through the second bending area, and in a direction parallel to the cover plate, the maximum distance between the edge of the third area and the edge of the display panel is less than the minimum distance between the edge of the second bending area and the edge of the display panel; a first support member is arranged on the surface of the third area of ​​the flexible circuit board away from the cover plate, and the orthographic projection of the first support member on the cover plate is located within the orthographic projection of the peripheral area on the cover plate; Injecting a molding material through the injection port of the second mold core to form a protective layer, wherein the protective layer is attached to the second region, the height of the protective layer is not less than the distance from the flexible circuit board to the cover plate, at least a portion of the protective layer is located on a side of the flexible circuit board away from the cover plate, and the side wall of the first support member is attached to at least a portion of the side wall of the protective layer; Wherein, the side wall of the second mold core includes a first side wall and a second side wall located outside the first side wall, an injection cavity is formed between the first side wall and the second side wall, the second side wall abuts against the side wall of the first mold core, and at least part of the first side wall abuts against the first support member.

9. The method for manufacturing a display module according to claim 8, characterized in that: The display assembly further includes a composite heat dissipation film and a second support member, wherein the composite heat dissipation film is disposed between the display panel and the flexible circuit board; the second support member is disposed on a surface of the composite heat dissipation film away from the cover plate, the orthographic projection of the second support member on the cover plate does not overlap with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support member on the cover plate is located within the orthographic projection of the peripheral area on the cover plate; The orthographic projection of the first side wall on the cover plate is located within the orthographic projection of the first support member and the second support member combined on the cover plate.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-7.

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