A thermal protection circuit for a solid state hard disk

Abstract

The invention relates to the technical field of computers and solid-state hard disks (SSDs), and discloses a solid-state hard disk thermal protection circuit. The circuit is completely replaced by hardware-controlled heat dissipation protection, so as to achieve ultimate protection for heat dissipation of a mainboard when a CPU fails and loses control. The circuit is composed of a capacitor C1; four resistors R1, R2, R3 and R4; two diodes D1 and D2; two relays K1 and K2; and two MOS tubes Q1 and Q2. The diodes and relays cooperate with each other to realize parallel and series connection of power supply circuits, and give the highest priority to the CPU high-temperature alarm circuit. For ordinary technicians in the field, without paying creative labor, they only need to replace the temperature sensor with other sensors, such as a voltage sensor and a current sensor, so as to realize the parallel and series connection of the control circuit. The relay used in the circuit is a type of switch device, and can be replaced with a MOS tube according to actual application needs to realize the same function.

Description

Technical Field

[0001] The invention relates to the technical field of computers and solid state hard disks (SSDs), and in particular to a thermal protection circuit for a solid state hard disk. Background Art

[0002] Computers, solid-state drives and other electronic products with more complex systems are usually composed of multiple components such as CPU, DDR and memory chips. Commonly used memory chips such as NAND, each component has its own temperature detection circuit, and its own temperature detection circuit will transmit the temperature information to the CPU in real time. The CPU will choose to reduce the frequency or increase the fan speed according to different temperature ranges to cool the system.

[0003] Since lowering the frequency or increasing the fan speed both require CPU control, there may be situations where the frequency cannot be lowered or the fan speed cannot be increased due to CPU failure, causing the entire system temperature to be too high. In severe cases, the motherboard may even burn out and the computer case may melt.

[0004] Some existing manufacturers also have underlying hardware heat dissipation control circuits, but they are unrelated and independent of each other and cannot achieve the effect of collaborative work.

[0005] Some computer manufacturers also have interconnected heat dissipation control circuits, but usually the temperature sensor alarm signals are transmitted to the embedded controller (EC controller) to achieve the interconnected temperature control. There is also a risk of EC failure, which will cause the heat dissipation control to fail.

[0006] To prevent the motherboard from burning due to temperature runaway, an independent temperature sensor is placed in the center area of ​​the reverse side of the PCB where the CPU, DDR and NAND are located, and a thermal protection circuit is designed. The temperature sensor transmits the temperature directly to the thermal protection circuit. This circuit is completely independent of the CPU and other components on the motherboard. Even if the CPU fails, this circuit can cut off the power supply in time to ensure that the motherboard will not burn due to high temperature. Summary of the invention

[0007] 1. Technical issues to be solved

[0008] In view of the deficiencies in the prior art, the present invention provides a solid state hard disk thermal protection circuit.

[0009] (II) Technical solution

[0010] To achieve the above object, the present invention provides the following technical solutions: a solid state hard disk thermal protection circuit, the circuit is completely replaced by hardware-controlled heat dissipation protection, and the ultimate protection of the mainboard heat dissipation is achieved when the CPU fails and loses control;

[0011] The circuit consists of 1 capacitor C1; 4 resistors R1, R2, R3 and R4; 2 diodes D1 and D2; 2 relays K1 and K2; and 2 MOS tubes Q1 and Q2.

[0012] Preferably, the basic thermal protection circuits of the CPU, DDR and NAND in the circuit are the same.

[0013] Preferably, when the CPU has no high temperature alarm, the temperature sensor outputs a low level signal, and due to the pull-down of the R4 resistor, the G level of the Q2MOS tube is at a low level, and the Q2MOS tube is turned off.

[0014] Preferably, since Q2 is turned off, there is no voltage difference across resistor R3, that is, the voltage difference between PIN pin 1 and PIN pin 8 of relay K2 is zero volt.

[0015] Preferably, the relay K2 is a normally closed relay, that is, when the voltage difference between the PIN pin 1 and the PIN pin 8 of K2 is zero volt, the PIN pin 6 and the PIN pin 7 of the relay K2 are turned on.

[0016] Preferably, when the CPU high temperature alarm occurs, the temperature sensor outputs a high level signal, the G level of the Q2MOS tube is high level, the Q2MOS tube is turned on, and since Q2 is turned on, the voltage difference across the R3 resistor is 12 volts.

[0017] Preferably, the specific implementation principle of the thermal protection circuit is as follows:

[0018] First, the circuit is composed of R3, R4, Q2 and K2, which connects the power input end of the CPU thermal protection circuit in series to the power output end of the DDR and NAND thermal protection circuits in parallel. As long as the CPU has a high temperature alarm, the back-end power supply will be cut off;

[0019] Second, the diode has a clamping function, that is, when the cathode of D1 and D2 in the circuit is at a low level, even if a high level is input to the positive electrode, the positive electrode will be clamped to below 0.5V by the diode. Only when both the positive and negative electrodes of the diode are at a high level, the positive electrode of the diode can normally output a high level;

[0020] In the third sequence, when the DDR high temperature alarm signal, the NAND high temperature alarm signal and the CPU fault signal have not all given an alarm, and the CPU has no high temperature alarm, the back-end power supply is not cut off.

[0021] Preferably, the thermal protections of the three components are interconnected and a thermal protection circuit sequence is set, and when the CPU thermal protection circuit alarms, the back-end power supply is immediately cut off.

[0022] Preferably, when the DDR and NAND high temperature alarms and the CPU fault signal also alarms at the same time, the back-end power supply is cut off.

[0023] Preferably, when the DDR high temperature alarm signal, the NAND high temperature alarm signal and the CPU fault signal do not alarm at the same time, the back-end power supply is not cut off because if the CPU fault signal does not alarm, it means that the CPU still has the ability to adjust the fan.

[0024] (III) Beneficial effects

[0025] Compared with the prior art, the present invention provides a solid state hard disk thermal protection circuit, which has the following beneficial effects:

[0026] 1. The thermal protection circuit of the solid state drive uses diodes and relays to cooperate with each other to realize the parallel and series connection of the power supply circuit, giving the CPU high temperature alarm circuit the highest priority.

[0027] 2. For ordinary technicians in this field, the thermal protection circuit of the solid state hard disk can realize parallel and series control of the circuits by simply replacing the temperature sensor with other sensors, such as voltage sensors and current sensors, without any creative work.

[0028] 3. The thermal protection circuit of the solid state drive uses a relay, which is a type of switching device. According to actual application needs, it can be replaced with a MOS tube to achieve the same function. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the process of the present invention;

[0030] Figure 2 It is a schematic diagram of the system of the present invention;

[0031] Figure 3 This is a complete schematic diagram of the present invention. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-3 , a thermal protection circuit for electronic products. This circuit is completely replaced by hardware-controlled heat dissipation protection, achieving the ultimate protection of motherboard heat dissipation when the CPU fails and loses control.

[0034] This circuit is composed of the following components: 1 capacitor C1, 4 resistors R1, R2, R3 and R4, 2 diodes D1 and D2, 2 relays K1 and K2, and 2 MOS tubes Q1 and Q2. The basic thermal protection circuits of CPU, DDR and NAND are the same. The following is a description of the CPU thermal protection circuit.

[0035] When the CPU has no high temperature alarm, the temperature sensor outputs a low level signal, and due to the pull-down of the R4 resistor, the G level of the Q2MOS tube is low level, the Q2MOS tube is turned off, and since Q2 is turned off, there is no voltage difference across the R3 resistor, that is, the voltage difference between the PIN pin 1 and the PIN pin 8 of the relay K2 is zero volt.

[0036] Relay K2 is a normally closed relay, that is, when the voltage difference between PIN pin 1 and PIN pin 8 of K2 is zero volt, PIN pin 6 and PIN pin 7 of relay K2 are turned on, and at this time 12V can normally power the back end.

[0037] When the CPU high temperature alarm sounds, the temperature sensor outputs a high-level signal, the G level of the Q2MOS tube is high, and the Q2MOS tube is turned on. Since Q2 is turned on, the voltage difference across the R3 resistor is 12 volts, that is, the voltage difference between the PIN pin 1 and the PIN pin 8 of the relay K2 is 12 volts. At this time, the relay PIN pin 6 and PIN pin 7 are disconnected, that is, the 12V is disconnected from the back-end power supply.

[0038] The innovation of this circuit lies in the need to relate the thermal protection of the three components to each other and to set the thermal protection circuit sequence.

[0039] First, when the CPU thermal protection circuit alarms, immediately cut off the back-end power supply. The reason is that when the CPU high temperature alarm sounds, the CPU may have failed and has no ability to reduce the frequency or speed up the fan, so the power supply needs to be cut off immediately.

[0040] The second order is, when the DDR and NAND high temperature alarms and the CPU fault signal also alarms at the same time, cut off the back-end power supply. The reason is that the CPU fault has been confirmed and the temperatures of the two main components alarm at the same time, so the back-end power supply needs to be cut off immediately.

[0041] The third sequence is that when the DDR high temperature alarm signal, NAND high temperature alarm signal and CPU fault signal do not alarm at the same time, the back-end power supply is not cut off. The reason is that if the CPU fault signal does not alarm, it means that the CPU still has the ability to adjust the fan, and there is no need to cut off the back-end power supply. If the CPU fault signal alarms, but only the DDR or NAND temperature alarms, it means that the motherboard does not have a large area of ​​high temperature, and there is no need to cut off the back-end power supply.

[0042] The specific implementation principle of the thermal protection circuit is as follows:

[0043] First, the circuit consists of R3, R4, Q2 and K2. The key point is to connect the power input end of the CPU thermal protection circuit in series to the power output end of the DDR and NAND thermal protection circuits in parallel. As long as the CPU has a high temperature alarm, the back-end power supply will be cut off, realizing the first priority of the CPU thermal protection circuit.

[0044] Second, the diode has a clamping function. That is, when the cathodes of D1 and D2 in the circuit are at a low level, even if a high level is input to the anode, the anode will be clamped to below 0.5V by the diode. Only when both the anode and cathode of the diode are at a high level, the anode of the diode can normally output a high level. By using the clamping function of the diode, the DDR high temperature alarm signal, the NAND high temperature alarm signal and the CPU fault signal can be connected in parallel, that is, only when the above three signals become high levels will the back-end power supply be cut off.

[0045] In the third order, when the DDR high temperature alarm signal, NAND high temperature alarm signal and CPU fault signal have not all alarmed, and the CPU has no high temperature alarm, the back-end power supply is not cut off, and the heat dissipation still relies on CPU frequency reduction and fan speed control.

[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A solid state hard disk thermal protection circuit, characterized in that: The circuit is completely changed to hardware-controlled heat dissipation protection, which provides ultimate protection for the motherboard heat dissipation when the CPU fails and loses control; The circuit consists of 1 capacitor C1; 4 resistors R1, R2, R3 and R4; 2 diodes D1 and D2; 2 relays K1 and K2; 2 MOS tubes Q1 and Q2; The DDR_high temperature alarm signal forms the first branch, the NAND_high temperature alarm signal is connected in series with the diode D1 to form the second branch, and the CPU_fault signal is connected in series with the diode D2 to form the third branch; the three branches are all connected to the G pole of the Q1MOS tube, and the G pole of the Q1MOS tube is grounded after being connected in series with the resistor R2; The D pole of Q1MOS tube is connected to PIN pin 1 of relay K1, PIN pin 8 of relay K1 is connected to 12V power supply, and PIN pin 7 of relay K1 is connected to 12V power supply; The D-pole of Q1MOS tube is connected in series with resistor R1 and then connected to a 12V power supply, and the two ends of capacitor C1 are connected to the 12V power supply and ground respectively; The CPU_high temperature alarm signal is connected to the G pole of the Q2MOS tube, the G pole of the Q2MOS tube is connected in series with a resistor R4 and then grounded, the D pole of the Q2MOS tube is connected in series with a resistor R3 and then connected to a 12V power supply; the D pole of the Q2MOS tube is connected to the PIN pin 1 of the relay K2, the PIN pin 8 of the relay K2 is connected to the 12V power supply, the PIN pin 6 of the relay K2 outputs a 12V_OUT signal; and the PIN pin 6 of the relay K1 is connected to the PIN pin 7 of the relay K2.

2. A solid state hard disk thermal protection circuit according to claim 1, characterized in that: The basic thermal protection circuits for the CPU, DDR and NAND in the circuit are the same.

3. A solid state hard disk thermal protection circuit according to claim 2, characterized in that: When the CPU has no high temperature alarm, the temperature sensor outputs a low level signal, and due to the pull-down of the R4 resistor, the G level of the Q2MOS tube is low level, and the Q2MOS tube is turned off.

4. A solid state hard disk thermal protection circuit according to claim 3, characterized in that: The voltage difference between PIN 1 and PIN 8 of relay K2 is zero volt.

5. The solid state hard disk thermal protection circuit according to claim 1, characterized in that: When the voltage difference between the PIN pin 1 and the PIN pin 8 of the relay K2 is zero volt, the PIN pin 6 and the PIN pin 7 of the relay K2 are turned on.

6. A solid state hard disk thermal protection circuit according to claim 1, characterized in that: When the CPU high temperature alarm sounds, the temperature sensor outputs a high-level signal, the G level of the Q2MOS tube is high, the Q2MOS tube is turned on, and since Q2 is turned on, the voltage difference across the R3 resistor is 12 volts.

7. A solid state hard disk thermal protection circuit according to claim 1, characterized in that: The specific implementation principle of the thermal protection circuit is as follows: First, the circuit is composed of R3, R4, Q2 and K2, which connects the power input end of the CPU thermal protection circuit in series to the power output end of the DDR and NAND thermal protection circuits in parallel. As long as the CPU has a high temperature alarm, the back-end power supply will be cut off; In the second order, when the cathodes of D1 and D2 in the circuit are at a low level, even if a high level is input to the anode, the anode will be clamped to below 0.5V by the diode. Only when both the anode and cathode of the diode are at a high level, the anode of the diode can output a high level normally. In the third sequence, when the DDR high temperature alarm signal, the NAND high temperature alarm signal and the CPU fault signal have not all given an alarm, and the CPU has no high temperature alarm, the back-end power supply is not cut off.

8. The solid state hard disk thermal protection circuit according to claim 1, characterized in that: The thermal protections of the three components are linked to each other and the thermal protection circuit sequence is set. When the CPU thermal protection circuit alarms, the back-end power supply is immediately cut off.

9. A solid state hard disk thermal protection circuit according to claim 1, characterized in that: When DDR and NAND high temperature alarms and CPU fault signals also alarm at the same time, the backend power supply is cut off.

10. The solid state hard disk thermal protection circuit according to claim 1, characterized in that: When the DDR high temperature alarm signal, the NAND high temperature alarm signal and the CPU fault signal do not alarm at the same time, the back-end power supply is not cut off because if the CPU fault signal does not alarm, it means that the CPU still has the ability to adjust the fan.

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